JP2009155551A - Composite material composition and light reflection member - Google Patents
Composite material composition and light reflection member Download PDFInfo
- Publication number
- JP2009155551A JP2009155551A JP2007337508A JP2007337508A JP2009155551A JP 2009155551 A JP2009155551 A JP 2009155551A JP 2007337508 A JP2007337508 A JP 2007337508A JP 2007337508 A JP2007337508 A JP 2007337508A JP 2009155551 A JP2009155551 A JP 2009155551A
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- material composition
- light
- polyamide resin
- aromatic polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、発光素子が発する光を反射するための反射壁を有する光反射部材に用いられる複合材料組成物及びその複合材料組成物を成形してなる光反射部材に関するものである。 The present invention relates to a composite material composition used for a light reflecting member having a reflecting wall for reflecting light emitted from a light emitting element, and a light reflecting member formed by molding the composite material composition.
発光ダイオード等の発光素子が発する光を反射するための反射壁を有する光反射部材には、光反射性、エポキシ等の封止剤との密着性及び耐熱性（特に加工時）等が求められている。光反射部材に用いられる樹脂組成物としては、約３０〜９９質量％（実施例等は、６０〜７０質量％）の芳香族ポリアミド樹脂と無機充填剤（ガラス繊維、酸化チタン等）とを混合したもの（特許文献１、２）や、公知技術ではないが、５０〜７０質量％（実施例等は、６０〜７７質量％）の部分芳香族ポリアミド樹脂とチタン酸カリウムと酸化チタンとを混合したもの（特許文献３）が提案されている。 A light reflecting member having a reflecting wall for reflecting light emitted from a light emitting element such as a light emitting diode is required to have light reflectivity, adhesion with a sealing agent such as epoxy, and heat resistance (particularly during processing). ing. As a resin composition used for a light reflecting member, about 30 to 99% by mass (in the examples, 60 to 70% by mass) of an aromatic polyamide resin and an inorganic filler (glass fiber, titanium oxide, etc.) are mixed. (Patent Documents 1 and 2) or a known technique, but 50 to 70% by mass (examples are 60 to 77% by mass) of partially aromatic polyamide resin, potassium titanate, and titanium oxide (Patent Document 3) has been proposed.
しかし、樹脂成分（ポリアミド樹脂）は、経時劣化により黄変することから、上記の樹脂組成物のように樹脂成分の配合が多いものは、永年使用により光反射率を大きく低下させてしまうおそれがあった。
そこで、本発明は、経時劣化による光反射率の低下が小さい光反射部材用の複合材料組成物、及びその複合材料組成物を成形してなる光反射部材を提供することを目的とする。 Therefore, an object of the present invention is to provide a composite material composition for a light reflecting member in which a decrease in light reflectance due to deterioration with time is small, and a light reflecting member formed by molding the composite material composition.
上記目的を達成するために、本発明の複合材料組成物は、粉状の白色無機顔料と芳香族ポリアミド樹脂とを混合してなり、発光素子が発する光を反射するための反射壁を有する光反射部材に用いられる複合材料組成物において、前記白色無機顔料の含有率が６７質量％以上であり、前記白色無機顔料と前記芳香族ポリアミド樹脂との質量比が９５／５〜７０／３０であり、耐熱安定剤を含有することを特徴としている。 In order to achieve the above object, the composite material composition of the present invention is a mixture of a powdery white inorganic pigment and an aromatic polyamide resin, and has a reflection wall for reflecting the light emitted from the light emitting element. In the composite material composition used for the reflecting member, the content of the white inorganic pigment is 67% by mass or more, and the mass ratio of the white inorganic pigment to the aromatic polyamide resin is 95/5 to 70/30. It is characterized by containing a heat-resistant stabilizer.
本発明における各要素の態様を以下に例示する。 The aspect of each element in the present invention is exemplified below.
１．白色無機顔料
白色無機顔料としては、特に限定はされないが、酸化チタン、焼成クレイ、酸化マグネシウム、酸化亜鉛、アルミナ、硫化亜鉛、硫酸亜鉛、硫酸バリウム、鉛白、炭酸カルシウム等が例示でき、これらを単独又は二種以上を併用してもよい。
また、屈折率が高いことから、酸化チタン、酸化マグネシウムが好ましい。
また、粉状の白色無機顔料の粒径としては、特に限定はされないが、平均粒径で０．０１〜１０μｍであることが好ましい。
複合材料組成物中における白色無機顔料の質量割合である含有率が６７質量％以上となることで、経時劣化による反射率の低下が小さくなる。好ましくは、６９質量％以上である。
1. Examples of white inorganic pigments include, but are not limited to, titanium oxide, calcined clay, magnesium oxide, zinc oxide, alumina, zinc sulfide, zinc sulfate, barium sulfate, lead white, and calcium carbonate. You may use individually or in combination of 2 or more types.
Moreover, since a refractive index is high, a titanium oxide and a magnesium oxide are preferable.
The particle diameter of the powdery white inorganic pigment is not particularly limited, but is preferably 0.01 to 10 μm in average particle diameter.
When the content ratio, which is the mass ratio of the white inorganic pigment in the composite material composition, is 67% by mass or more, the decrease in reflectance due to deterioration with time is reduced. Preferably, it is 69 mass% or more.
２．芳香族ポリアミド樹脂
発光素子を実装する時の半田付け等の熱による影響（変形）が小さく、且つ封止剤との密着性が良好であることから、高融点のポリアミド樹脂である芳香族ポリアミド樹脂が用いられる。芳香族ポリアミド樹脂としては、特に限定はされないが、ポリアミド６Ｔ樹脂、ポリアミド６Ｉ樹脂、ポリアミド９Ｔ樹脂等が例示でき、これらの一種であってもよいし、二種以上を混合したものであってもよい。
また、芳香族ポリアミド樹脂の３００℃２０Ｎにおけるメルトフローレート（ＭＦＲ）としては、特に限定はされないが、成形時の流動性がよくなることから、１〜２０ｇ／１０分であることが好ましい。
2. Aromatic polyamide resin Aromatic polyamide resin which is a polyamide resin with a high melting point because it has a small influence (deformation) due to heat, such as soldering, when mounting a light-emitting element and has good adhesion to a sealing agent. Is used. Although it does not specifically limit as an aromatic polyamide resin, A polyamide 6T resin, a polyamide 6I resin, a polyamide 9T resin etc. can be illustrated, These may be 1 type, or even what mixed 2 or more types may be sufficient as it. Good.
The melt flow rate (MFR) of the aromatic polyamide resin at 300 ° C. and 20 N is not particularly limited, but is preferably 1 to 20 g / 10 minutes because the fluidity during molding is improved.
白色無機顔料と芳香族ポリアミド樹脂との質量比（白色無機顔料／芳香族ポリアミド樹脂）が、９５／５より白色無機顔料の割合が大きくなると成形性が悪くなり、７０／３０より芳香族ポリアミド樹脂の割合が大きくなると経時劣化等による反射率の低下が大きくなる。 When the mass ratio of the white inorganic pigment to the aromatic polyamide resin (white inorganic pigment / aromatic polyamide resin) is greater than 95/5, the moldability deteriorates, and the aromatic polyamide resin from 70/30. As the ratio increases, the reflectance decreases due to deterioration over time.
３．発光素子
発光素子としては、特に限定はされないが、発光ダイオード（ＬＥＤ）、半導体レーザー等が例示できる。
発光ダイオードとしては、特に限定はされないが、青色等に発光する窒化ガリウム（ＧａＮ）系、赤色等に発光するヒ化ガリウム（ＧａＡｓ）系、黄色等に発光するリン化ガリウム（ＧａＰ）系等が例示できる。発光素子の発光としては、特に限定はされないが、赤色、黄色、緑色、青色、紫色等の可視光であってもよいし、紫外線であってもよい。また、発光素子は、一種類の発光体からなるもの（単色光が得られる）であってもよいし、二種以上の発光体を組合わせたもの（白色等の間色光が得られる）であってもよい。
3. Light emitting element Although it does not specifically limit as a light emitting element, A light emitting diode (LED), a semiconductor laser, etc. can be illustrated.
The light emitting diode is not particularly limited, but includes a gallium nitride (GaN) system that emits blue light, a gallium arsenide (GaAs) system that emits red light, a gallium phosphide (GaP) system that emits yellow light, and the like. It can be illustrated. The light emission of the light emitting element is not particularly limited, but may be visible light such as red, yellow, green, blue, purple, or ultraviolet light. The light-emitting element may be a single type of light emitter (monochromatic light can be obtained), or a combination of two or more light emitters (between white light and the like can be obtained). There may be.
４．耐熱安定剤
加工時の熱や永年使用等から生じる樹脂成分の酸化劣化を防止するために添加される耐熱安定剤としては、特に限定はされないが、フェノール系安定剤、リン系安定剤、アミン系安定剤、硫黄系安定剤等が例示でき、これらの一種であってもよいし、二種以上の混合であってもよい。
また、フェノール系安定剤、リン系安定剤が好ましく、少なくともフェノール系安定剤を含んでいることがより好ましい。
また、含有量としては、特に限定はされないが、芳香族ポリアミド樹脂と白色無機顔料との合計量１００質量部に対し、０．１〜２．０質量部であることが好ましい。含有量が０．１質量部未満では、十分な耐熱安定性が得られず、２．０質量部を超えるとブリードし外観不良となるからである。
4). Heat-resistant stabilizer The heat-resistant stabilizer added to prevent oxidative deterioration of the resin component resulting from heat during processing or long-term use is not particularly limited, but it is a phenol-based stabilizer, phosphorus-based stabilizer, amine-based stabilizer. A stabilizer, a sulfur-type stabilizer, etc. can be illustrated, 1 type of these may be sufficient and 2 or more types of mixtures may be sufficient.
Moreover, a phenol stabilizer and a phosphorus stabilizer are preferable, and it is more preferable that at least a phenol stabilizer is included.
Moreover, as content, although it does not specifically limit, It is preferable that it is 0.1-2.0 mass parts with respect to 100 mass parts of total amounts of an aromatic polyamide resin and a white inorganic pigment. When the content is less than 0.1 parts by mass, sufficient heat stability cannot be obtained, and when the content exceeds 2.0 parts by mass, bleeding occurs, resulting in poor appearance.
４−１．フェノール系安定剤
フェノール系安定剤としては、特に限定はされないが、樹脂等に添加されるフェノール系安定剤（フェノール系酸化防止剤）を用いることができ、具体的には、２，６−ｔ−ブチル−Ｐ−クレゾール、４，４’−ブチリデンビス−（６−ｔ−ブチル−３−メチルフェノール）、ｎ−オクタデシル−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、テトラキス［メチレン−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］メタン、トリエチレングリコールビス［３−（３−ｔ−ブチル−４−ヒドロキシ−５−メチルフェニル）プロピオネート］、トリス（３，５−ジ−ｔ−ブチル−４−ヒドロキシベンジル）イソシアヌレイト、Ｎ，Ｎ’−（ヘキサン−１，６−ジイル）ビス（３，５−ジ−ｔ−ブチル−４−ヒドロキシベンゼンプロパンアミド）等が例示できる。
4-1. Phenol-based stabilizer The phenol-based stabilizer is not particularly limited, but a phenol-based stabilizer (phenol-based antioxidant) added to a resin or the like can be used. Specifically, 2,6-t -Butyl-P-cresol, 4,4'-butylidenebis- (6-tert-butyl-3-methylphenol), n-octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate Tetrakis [methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, triethylene glycol bis [3- (3-t-butyl-4-hydroxy-5-methylphenyl) Propionate], tris (3,5-di-t-butyl-4-hydroxybenzyl) isocyanurate, N, N ′-(hexane-1,6-diyl) Bis (3,5-di -t- butyl-4-hydroxy-benzenepropanamide) and the like.
４−２．リン系安定剤
リン系安定剤としては、特に限定はされないが、樹脂等に添加されるリン系安定剤（リン系酸化防止剤）を用いることができ、具体的には、トリオクチルホスファイト、トリラウリルホスファイト、トリデシルホスファイト、（オクチル）ジフェニルホスファイト、トリス（２，４−ジ−ｔ−ブチルフェニル）ホスファイト、トリフェニルホスファイト、トリス（ブトキシエチル）ホスファイト、トリス（ノニルフェニル）ホスファイト、ジステアリルペンタエリスリトールジホスファイト、ビス（２，６−ジ−ｔ−ブチル−４−メチルフェニル）ペンタエリスリトールジホスファイト等のホスファイト（亜リン酸エステル）系安定剤が例示できる。
4-2. Phosphorus stabilizer The phosphorous stabilizer is not particularly limited, but a phosphorus stabilizer (phosphorus antioxidant) added to a resin or the like can be used. Specifically, trioctyl phosphite, Trilauryl phosphite, tridecyl phosphite, (octyl) diphenyl phosphite, tris (2,4-di-t-butylphenyl) phosphite, triphenyl phosphite, tris (butoxyethyl) phosphite, tris (nonylphenyl) ) Phosphite (phosphite) stabilizers such as phosphite, distearyl pentaerythritol diphosphite, bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite .
５．光反射率
ＪＩＳ Ｋ０１１５に準拠し、波長４６０ｎｍで測定した、厚さ（肉厚）０．２ｍｍのときの光反射率は、８５％以上が好ましく、より好ましくは、９０％以上である。
5. Light Reflectance Based on JIS K0115, the light reflectance measured at a wavelength of 460 nm and having a thickness (thickness) of 0.2 mm is preferably 85% or more, and more preferably 90% or more.
６．保持率
１５０℃において６時間静置する条件での熱劣化の熱劣化前（静置前）の光反射率（Ｒ１）に対する熱劣化後（静置後）の光反射率（Ｒ２）の割合である保持率（Ｒ２／Ｒ１）は、９０％以上が好ましく、より好ましくは、９４％以上である。
6). Retention rate The ratio of the light reflectance (R2) after thermal degradation (after standing) to the light reflectance (R1) before thermal degradation (before standing) under the conditions of standing at 150 ° C. for 6 hours. A certain holding ratio (R2 / R1) is preferably 90% or more, and more preferably 94% or more.
７．混練方法
各原料成分を混合するための混練方法としては、特に限定はされないが、バンバリーミキサー等を用いて混練するバッチ式であってもよいし、二軸押出機等を用いて混練する連続式であってもよい。
また、混練時の過熱による熱劣化を小さくできることから、芳香族ポリアミド樹脂の融点より５０℃高い温度未満で加工（混練）することが好ましく、芳香族ポリアミド樹脂の融点より２０℃高い温度以下がより好ましい。
7). Kneading method The kneading method for mixing each raw material component is not particularly limited, but may be a batch type kneading using a Banbury mixer or the like, or a continuous type kneading using a twin screw extruder or the like. It may be.
In addition, since thermal deterioration due to overheating during kneading can be reduced, it is preferable to process (knead) at a temperature lower than 50 ° C. higher than the melting point of the aromatic polyamide resin, and more preferably 20 ° C. or lower than the melting point of the aromatic polyamide resin. preferable.
８．成形方法
上記複合材料組成物からなる光反射部材の成形方法としては、特に限定はされないが、射出成形、プレス成形、ブロー成形、押出し成形等の樹脂等の成形に用いる方法が例示できる。
8). Molding method The method for molding the light reflecting member comprising the composite material composition is not particularly limited, and examples thereof include methods used for molding resins such as injection molding, press molding, blow molding, and extrusion molding.
９．光反射部材
光反射部材としては、特に限定はされないが、少なくとも一部に発光素子が発する光を反射するための反射壁を有するものであり、具体的には、発光ダイオード用ケース等が例示できる。
9. Light Reflecting Member The light reflecting member is not particularly limited, but has a reflecting wall for reflecting the light emitted from the light emitting element at least in part. Specifically, a light emitting diode case and the like can be exemplified. .
本発明によれば、経時劣化による光反射率の低下が小さい光反射部材用の複合材料組成物、及びその複合材料組成物を成形してなる光反射部材を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the light reflection member formed by shape | molding the composite material composition for light reflection members with the small fall of the light reflectivity by deterioration with time, and the composite material composition can be provided.
粉状の酸化チタンと芳香族ポリアミド樹脂とを混合してなり、発光素子が発する光を反射するための反射壁を有する光反射部材に用いられる複合材料組成物において、
酸化チタンの含有率が６７質量％以上であり、
酸化チタンと芳香族ポリアミド樹脂との質量比が９５／５〜７０／３０であり、
耐熱安定剤として少なくともフェノール系安定剤を含有することを特徴とする複合材料組成物。
In a composite material composition used for a light reflecting member having a reflecting wall for reflecting light emitted from a light emitting element, which is obtained by mixing powdered titanium oxide and an aromatic polyamide resin.
The content of titanium oxide is 67% by mass or more,
The mass ratio of titanium oxide and aromatic polyamide resin is 95/5 to 70/30,
A composite material composition comprising at least a phenol-based stabilizer as a heat-resistant stabilizer.
本発明の実施例の光反射部材は、図１に示すように、発光ダイオードランプ（図１（ａ）はサイドビュータイプ、図１（ｂ）はトップビュータイプ）に用いられ、側壁等が発光ダイオードが発する光を反射するための反射壁となっている有底筒状のカップ１０、２０である。カップ１０、２０は、次の表１に示す複合材料組成物を射出成形機を用いて成形したものである。
As shown in FIG. 1, the light reflecting member of the embodiment of the present invention is used for a light emitting diode lamp (FIG. 1 (a) is a side view type and FIG. 1 (b) is a top view type). The bottomed
次の表１、２は、本発明の実施例の複合材料組成物（７種類、表１）と比較例の複合材料組成物（５種類、表２）の配合と評価等を示す。
配合欄における単位は質量部である。
The following Tables 1 and 2 show the composition and evaluation of the composite material compositions (7 types, Table 1) of Examples of the present invention and the composite material compositions (5 types, Table 2) of Comparative Examples.
The unit in the blending column is parts by mass.
各原料成分のうち、白色無機顔料として、平均粒径が０．２μｍの酸化チタンを用いた。芳香族ポリアミド樹脂として、３００℃２０Ｎにおけるメルトフローレート（ＭＦＲ）が７ｇ／１０分のポリアミド６Ｔ樹脂（融点：２９０℃）と、同メルトフローレート（ＭＦＲ）が６ｇ／１０分のポリアミド９Ｔ樹脂（融点：２９５℃）とを用いた。耐熱安定剤として、分子量が約１２００、融点が約１２０℃のフェノール系安定剤であるフェノール系安定剤ａと、分子量が約６４０、融点が約１６０℃のフェノール系安定剤であるフェノール系安定剤ｂと、分子量が約６３０、融点が約２３７℃のリン系安定剤とを用いた。 Among the raw material components, titanium oxide having an average particle size of 0.2 μm was used as the white inorganic pigment. As an aromatic polyamide resin, a polyamide 6T resin (melting point: 290 ° C.) having a melt flow rate (MFR) of 7 g / 10 min at 300 ° C. and 20 N, and a polyamide 9T resin having a melt flow rate (MFR) of 6 g / 10 min ( Melting point: 295 ° C.). As a heat-resistant stabilizer, a phenolic stabilizer a which is a phenolic stabilizer having a molecular weight of about 1200 and a melting point of about 120 ° C., and a phenolic stabilizer which is a phenolic stabilizer having a molecular weight of about 640 and a melting point of about 160 ° C. b and a phosphorus stabilizer having a molecular weight of about 630 and a melting point of about 237 ° C. were used.
各試料は、樹脂温度が３００℃となる条件で原料成分を二軸押出機を用いて、混練した。 Each sample knead | mixed the raw material component using the twin-screw extruder on the conditions used as resin temperature of 300 degreeC.
各試料の測定及び評価を次のようにして行った。 Measurement and evaluation of each sample were performed as follows.
（１）プレス成形性の評価
厚さ０．２ｍｍのシートを、設定温度３００℃、圧力２０ＭＰａの条件においてプレス成形したときの良否を評価した。
○は良好であり、×は不良である。
(1) Evaluation of press formability The quality when press-molding a sheet having a thickness of 0.2 mm under the conditions of a set temperature of 300 ° C. and a pressure of 20 MPa was evaluated.
○ is good and × is bad.
（２）射出成形性の評価
８０ｔ射出成形機を用いて、シリンダー設定温度３００℃、金型温度１４０℃の条件において射出成形したときの良否を評価した。
○は、滞留安定性、流動性等の問題がなく成形できた場合であり、×は、流動不足、計量不良等の問題が成形時にあった場合である。
(2) Evaluation of injection moldability Using an 80t injection molding machine, the quality when injection molding was performed under conditions of a cylinder set temperature of 300 ° C and a mold temperature of 140 ° C was evaluated.
○ indicates a case where molding can be performed without problems such as residence stability and fluidity, and x indicates a case where problems such as insufficient flow and poor measurement occur during molding.
（３）透過率・反射率の測定
上記プレス成形により作成した厚さ０．２ｍｍのシート（試験体）を用い、ＪＩＳ Ｋ０１１５に準拠して、波長４６０ｎｍの透過率と反射率とを測定した。
また、１５０℃の雰囲気中に６時間静置の条件で熱劣化させたものについても同条件で透過率と反射率とを測定した。
そして、熱劣化後の反射率（Ｒ２）を熱劣化前の反射率（Ｒ１）で割って、保持率を求めた。
(3) Measurement of transmittance / reflectance The transmittance and reflectance at a wavelength of 460 nm were measured according to JIS K0115, using a sheet (test body) having a thickness of 0.2 mm prepared by the above press molding.
Moreover, the transmittance | permeability and the reflectance were measured on the same conditions also about what was thermally deteriorated on the conditions of leaving still in a 150 degreeC atmosphere for 6 hours.
Then, the reflectance after thermal degradation (R2) was divided by the reflectance before thermal degradation (R1) to obtain the retention rate.
屈折率が高く、耐熱性が高い白色無機顔料である酸化チタンの含有率が低い（６５質量％未満）比較例３、４、５と違い、酸化チタンの含有率が６９質量％以上である実施例１〜７は、厚さ０．２ｍｍの薄肉でも熱劣化前も熱劣化後も透過率が０％であった。また、熱劣化前の反射率が８８％以上と高く、熱劣化後の反射率も８７％以上と高かった。さらに、保持率は９８％以上であった。 Unlike Comparative Examples 3, 4 and 5, the content of titanium oxide, which is a white inorganic pigment having a high refractive index and high heat resistance, is low (less than 65% by mass). The content of titanium oxide is 69% by mass or more. In Examples 1 to 7, even though the thickness was 0.2 mm, the transmittance was 0% before and after thermal degradation. Moreover, the reflectance before heat deterioration was as high as 88% or more, and the reflectance after heat deterioration was as high as 87% or more. Furthermore, the retention rate was 98% or more.
白色無機顔料である酸化チタンと芳香族ポリアミド樹脂との質量比が９８／２と酸化チタンの割合が大きい比較例１と違い、同比が９５／５以下である（芳香族ポリアミド樹脂の割合が大きい）実施例１〜７は、芳香族ポリアミド樹脂で酸化チタンがコーティングされるため、プレス成形性及び射出成形性共に良好であった。
耐熱安定剤を含まない比較例２は、熱劣化前の反射率が８０％であり、保持率が８１％と共に低かった。
Unlike Comparative Example 1, in which the mass ratio of titanium oxide, which is a white inorganic pigment, and aromatic polyamide resin is 98/2 and the ratio of titanium oxide is large, the ratio is 95/5 or less (the ratio of aromatic polyamide resin is large). ) Since Examples 1-7 were coated with titanium oxide with an aromatic polyamide resin, both press moldability and injection moldability were good.
In Comparative Example 2 not containing the heat stabilizer, the reflectance before heat deterioration was 80%, and the retention rate was low with 81%.
次の表３は、実施例２と同じ配合で樹脂温度が３４０℃となる条件で原料成分を二軸押出機を用いて、混練したもの（実施例８）の評価等である。なお、測定及び評価は、上記と同じようにして行った。 The following Table 3 shows the evaluation and the like (Example 8) in which the raw material components were kneaded using a twin screw extruder under the same composition as Example 2 and the resin temperature being 340 ° C. Measurement and evaluation were performed in the same manner as described above.
ポリアミド６Ｔ樹脂の融点（２９０℃）より５０℃高い３４０℃で混練を行うことにより、混練時にポリアミド６Ｔ樹脂の黄変があり、熱劣化前の反射率が低くなってしまった。 By kneading at 340 ° C., which is 50 ° C. higher than the melting point (290 ° C.) of the polyamide 6T resin, there was yellowing of the polyamide 6T resin at the time of kneading, and the reflectance before heat deterioration was lowered.
本実施例によれば、次の（ａ）〜（ｄ）の効果が得られる。
（ａ）耐熱性が高い白色無機顔料を多く含有していることにより、経時劣化による光反射率の低下が小さい複合材料組成物及び光反射部材が得られる。
（ｂ）屈折率が高い白色無機顔料を多く含有していることにより、薄肉にしても透過率が低い複合材料組成物及び光反射部材が得られる。
（ｃ）芳香族ポリアミド樹脂により白色無機顔料がコーティングされることにより、射出成形等の樹脂の成形に用いられる方法で、光反射部材を成形することができる。
（ｄ）屈折率の高い白色無機顔料を多く含有し、芳香族ポリアミド樹脂の融点より１０℃高い温度以下で混練されることにより、光反射率の高い複合材料組成物及び光反射部材が得られる（実施例８は除く）。
According to the present embodiment, the following effects (a) to (d) can be obtained.
(A) By containing many white inorganic pigments with high heat resistance, the composite material composition and light reflection member with a small fall of the light reflectivity by deterioration with time are obtained.
(B) By containing a large amount of white inorganic pigment having a high refractive index, a composite material composition and a light reflecting member having low transmittance can be obtained even when thin.
(C) By coating a white inorganic pigment with an aromatic polyamide resin, the light reflecting member can be molded by a method used for molding a resin such as injection molding.
(D) It contains a large amount of white inorganic pigment having a high refractive index and is kneaded at a temperature not higher than 10 ° C. above the melting point of the aromatic polyamide resin, whereby a composite material composition and a light reflecting member having a high light reflectance can be obtained. (Excluding Example 8).
なお、本発明は前記実施例に限定されるものではなく、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。 In addition, this invention is not limited to the said Example, In the range which does not deviate from the meaning of invention, it can change suitably and can be actualized.
１０ 発光ダイオード用カップ
２０ 発光ダイオード用カップ
10 Light-Emitting
Claims (7)
前記白色無機顔料の含有率が６７質量％以上であり、
前記白色無機顔料と前記芳香族ポリアミド樹脂との質量比が９５／５〜７０／３０であり、
耐熱安定剤を含有することを特徴とする複合材料組成物。 In the composite material composition used for the light reflecting member having a reflecting wall for reflecting the light emitted from the light emitting element, which is obtained by mixing a powdery white inorganic pigment and an aromatic polyamide resin.
The white inorganic pigment content is 67% by mass or more,
The mass ratio of the white inorganic pigment and the aromatic polyamide resin is 95/5 to 70/30,
A composite material composition comprising a heat-resistant stabilizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007337508A JP5163114B2 (en) | 2007-12-27 | 2007-12-27 | Composite material composition and light reflecting member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007337508A JP5163114B2 (en) | 2007-12-27 | 2007-12-27 | Composite material composition and light reflecting member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009155551A true JP2009155551A (en) | 2009-07-16 |
| JP5163114B2 JP5163114B2 (en) | 2013-03-13 |
Family
ID=40959899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007337508A Expired - Fee Related JP5163114B2 (en) | 2007-12-27 | 2007-12-27 | Composite material composition and light reflecting member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5163114B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6072931B2 (en) * | 2013-10-02 | 2017-02-01 | Ykk株式会社 | Resin slider for slide fastener and slide fastener having the same |
| WO2024004933A1 (en) * | 2022-06-30 | 2024-01-04 | 大塚化学株式会社 | Polyamide resin composition for reflective plate, and reflective plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194513A (en) * | 2003-12-09 | 2005-07-21 | Mitsui Chemicals Inc | Resin composition for reflector, and reflector |
| JP2006257314A (en) * | 2005-03-18 | 2006-09-28 | Kuraray Co Ltd | Polyamide resin composition for molding led reflector and led reflector |
| JP2007218980A (en) * | 2006-02-14 | 2007-08-30 | Idemitsu Kosan Co Ltd | Reflector and its manufacturing method |
| JP2007231076A (en) * | 2006-02-28 | 2007-09-13 | Unitika Ltd | Polyamide resin composition for light-reflective molded product |
-
2007
- 2007-12-27 JP JP2007337508A patent/JP5163114B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194513A (en) * | 2003-12-09 | 2005-07-21 | Mitsui Chemicals Inc | Resin composition for reflector, and reflector |
| JP2006257314A (en) * | 2005-03-18 | 2006-09-28 | Kuraray Co Ltd | Polyamide resin composition for molding led reflector and led reflector |
| JP2007218980A (en) * | 2006-02-14 | 2007-08-30 | Idemitsu Kosan Co Ltd | Reflector and its manufacturing method |
| JP2007231076A (en) * | 2006-02-28 | 2007-09-13 | Unitika Ltd | Polyamide resin composition for light-reflective molded product |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6072931B2 (en) * | 2013-10-02 | 2017-02-01 | Ykk株式会社 | Resin slider for slide fastener and slide fastener having the same |
| US9687051B2 (en) | 2013-10-02 | 2017-06-27 | Ykk Corporation | Resin slider for slide fasteners and slide fastener provided therewith |
| WO2024004933A1 (en) * | 2022-06-30 | 2024-01-04 | 大塚化学株式会社 | Polyamide resin composition for reflective plate, and reflective plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5163114B2 (en) | 2013-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100996377B1 (en) | Polysulfone compositions exhibiting very low color and high light transmittance properties and articles made therefrom | |
| TWI438242B (en) | Method for manufacturing polyarylene sulfide resin composition | |
| KR20150104185A (en) | Compositions for an led reflector and articles thereof | |
| WO2015199062A1 (en) | Resin composition and molded article thereof | |
| TWI583738B (en) | Semiaromatic polyamide resin composition | |
| KR102421217B1 (en) | Polyamide composition for led reflection plate, led reflection plate, and light-emitting device including reflection plate | |
| JP5163114B2 (en) | Composite material composition and light reflecting member | |
| JP6024142B2 (en) | Polyamide resin composition and molded article | |
| JP6233228B2 (en) | Thermosetting epoxy resin composition for optical semiconductor element sealing and semiconductor device using the same | |
| KR102175710B1 (en) | Polyarylene sulfide resin composition | |
| JP3993149B2 (en) | Epoxy resin composition for light emitting device sealing material | |
| EP2723815B1 (en) | Anti-yellowing polyamide composition | |
| TW201710380A (en) | Polyamide composition for led reflection plate, led reflection plate, and light-emitting device including reflection plate | |
| JP2008543992A (en) | Manufactured articles suitable for LED reflector applications, manufactured from polyamide resin | |
| JP2019085448A (en) | Thermoplastic resin composition and molded body obtained by molding the same | |
| JP7260399B2 (en) | Semi-aromatic polyamide resin composition and molded article thereof | |
| JP2019094374A (en) | Thermoplastic resin composition and molded body using the same | |
| JP5983943B2 (en) | Diallyl phthalate resin composition | |
| KR20210038118A (en) | Polyamide resin compositions for reserve tank and product prepared by the same | |
| KR20240075448A (en) | Polypropylene Resin Composition with Excellent Light-shielding and Reflectance Properties and Article Molded Therefrom | |
| CN116462941A (en) | Polyester composition and preparation method and application thereof | |
| KR20220063458A (en) | Polyamide resin compositions for reserve tank and product prepared by the same | |
| JP2020200431A (en) | Fiber-reinforced semi-aromatic polyamide resin composition and its molded product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100129 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120626 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120810 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121120 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121203 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151228 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |