JP2009152327A - Inkjet coating device for resist film formation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide, at a low cost, a device for resist film formation replacing an expensive resist coater device. <P>SOLUTION: In the inkjet coating device for forming the thin film of resist on a substrate, resist liquid is used as ink. The device includes a stage driving system which drives a stage mounted with the substrate and a control unit which separately controls an inkjet coating control system for inkjet coating. For example, a dxf file format (1) is employed and passed to a DXF data conversion module 2-1 in a converter 2 to convert a coating shape into a bit map file. Bit map file data 3 for IJ generated thereby are transferred to an IJ device 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inkjet coating apparatus for forming a resist film on a printed circuit board or the like used for industrial equipment, home appliances, and the like.

As an application field of ink jet (hereinafter sometimes abbreviated as IJ) technology, for example, in the electronics field,
-Organic EL display-Liquid crystal display-Solar cell-Plasma display-Color filter-Printed circuit board-Semiconductor manufacturing "Photolithography process"
In the industrial equipment field,
・ Construction materials decoration equipment ・ Semiconductor marker ・ Cardboard printing ・ Advertising
In the biotechnology field,
-DNA chip manufacturing related, immunological analysis related, etc.

For example, in the printed circuit board manufacturing process, a thin resist layer is applied and formed so as to cover the substrate. Recently, a photosensitive composition (photoresist) is applied, and pattern exposure and development are used to provide the necessary portions. The method of leaving only has become mainstream. As an advantage of resist thin film formation by such inkjet coating,
・ It is possible to form a very thin film (film thickness 10nm to 1μm) ・ Any pattern can be formed without a mask ・ Material consumption is insignificant compared to other thin film formation methods ・ Banks, grooves, or protrusions It is possible to form a film that does not depend on the surface shape of the substrate, etc. ・ Because non-contact coating, droplet landing accuracy is high, suitable for fine coating, etc.
・ Applicable solution materials have significant physical properties limitations (material viscosity, surface tension, material solubility, etc.)
-Very thin films (thickness 10 μm ~) are not good at forming, and there are troublesome maintenance before and after the film formation process and during the formation.

  In view of the above-described points, the present invention provides an inexpensive resist film forming apparatus that replaces an expensive resist coater apparatus. For example, in a display-related technology, a stepper used in photolithography and, of course, a reticle is unnecessary. It is an object of the present invention to form a fine circuit pattern at low cost.

  Among the ink jet coating apparatuses for forming a resist film according to the present invention, an apparatus according to claim 1 is an ink jet coating apparatus for forming a resist thin film on a substrate, and is characterized by using a resist solution as ink.

  A resist film forming inkjet coating apparatus according to a second aspect of the present invention is the resist film forming inkjet coating apparatus according to the first aspect, wherein a stage driving system for driving a stage on which the substrate is mounted and an inkjet coating apparatus are provided. And a control device that controls the ink jet coating control system separately.

  The present invention is advantageous in that a resist thin film can be formed at low cost, and an expensive resist coater apparatus, a stepper, a reticle, and the like used in photolithography are unnecessary.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a system diagram showing an example of creating an IJ bitmap file in the above-described IJ material design example.
First, create a desired application shape (the shape itself is an arbitrary one on the user side) with the CAD system used on the user side, for example, a dxf file format (1), and convert this to DXF data in the converter 2 The data is transferred to the module 2-1, and the application shape is converted into a bitmap file. It is desirable to be able to support as many dxf file formats as possible.

The setting items here are
・ Reduction / enlargement: Reduction / enlargement of the original drawing ・ Resolution setting:
・ Horizontal direction: Corresponds to nozzle pitch of IJ head ・ Vertical (feed direction): Corresponds to application pitch ・ Pixel size setting:
-It corresponds to the size of the bitmap file. Next, the data is passed to the Bitmap post-processing module 2-2.
・ Change of fill pattern ・ Bitmap correction of connection points etc. ・ Smoothing etc. The IJ bitmap file data 3 created thereby is transferred to the IJ device 4.

  FIG. 2 is a conceptual perspective view for explaining the IJ coating apparatus and its control. The basic idea of the manufacturing apparatus according to this embodiment is that the IJ coating control system is separated in order to realize high-speed coating. In the figure, 10 is a mechanical system, 11 is a coating control system, and 12 is a stage drive system. The mechanical system 10 includes an IJ head 13, an actuator 14, a linear encoder 15 and the like. The head drive substrate 17 is provided, and the stage drive system 12 is provided with a personal computer (PC) 18 and a sequencer (MD) 19. The IJ head 13 is held by a holding mechanism (not shown) and is movable in the vertical direction. In the case of a single head type IJ coating apparatus, the apparatus can be configured without the sequencer 19. The configuration of each part may be a known one as shown in the figure, and detailed description thereof is omitted.

In addition, as a design factor of device design,
・ Which head or table, which is the main driving body, is moved ・ How many times the application is completed ・ Is there a restriction on the footprint of the device ・ The number of axes of the actuator, which is the main driving body ・ IJ How many heads are used? • What is the allowable complexity of the control method and injection data creation? • What is the budget? Of course, about the materials and processes to be used ・ Types, compositions, and solubility of materials to be applied to IJ
・ Viscosity and surface tension values of materials used, solvents for adjusting them ・ Types and sizes of substrates used (length, width, thickness, weight)
・ Will film formation be done in air or special atmosphere ・ Target film thickness variation and allowable film thickness variation of the thin film to be formed ・ Shape tolerance limit (peripheral boundary region, linearity, etc.) of the thin film to be formed
Need to know.
For manufacturing equipment,
・ Device size (for example, footprint size and height restrictions)
-Whether there are weight restrictions-Equipment installation environment and cleanliness level (dust generation, etc.)
-It is necessary to know whether the control device is connected to the Internet or is standalone.

  In addition, as a resist to apply, product name TARF-P6111 manufactured by Tokyo Ohka Kogyo Co., Ltd., product name Sumiresto PAR-811 series manufactured by Sumitomo Chemical Co., Ltd. (for example, trade name: Sumiresist PFM-300A / 300A9 / 300B2 [chemical name or general name: novolak resin and 2-heptanone solution of photosensitive component]), Shin-Etsu Chemical Co., Ltd. product name Shin-Etsu Excimer Resist SAIL-G24C, and the like. However, the present invention is not limited to these, and various materials can be used in consideration of the above-described factors.

System diagram showing an example of creating an IJ bitmap file in an IJ material design example Conceptual perspective view for explaining the IJ coating device and its control

Explanation of symbols

10: Mechanical system of IJ coating apparatus 11: Same coating control system 12: Same stage drive system 13: IJ head 14: Actuator 15: Linear encoder 16: Memory board 17: Head drive board 18: Personal computer (PC)
19: Sequencer (MD)

Claims (2)

An inkjet coating apparatus for forming a resist thin film on a substrate,
An ink jet coating apparatus for forming a resist film, wherein a resist liquid is used as ink. 2. The ink jet coating apparatus for forming a resist film according to claim 1, further comprising a control device for separately controlling a stage driving system for driving a stage on which the substrate is mounted and an ink jet coating control system for ink jet coating. An inkjet coating apparatus for forming a resist film.