JP2009152326A - Heat dissipating mechanism of electronic apparatus, and air transmission member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipating mechanism of an electronic apparatus, which can suppress the generation of noise while improving heat dissipation efficiency. <P>SOLUTION: The heat dissipating mechanism of the electronic apparatus has an inlet 110, an exhaust vent 130, and a fan 140, and discharges heat generated in a casing 100 to the outside of the casing. The heat dissipating mechanism further includes an air transmission member 150 having a first opening in communication with the discharge opening of the fan provided in the casing and a second opening in communication with the exhaust vent to transmit air in the casing which is discharged from the fan to the outside of the casing through the first opening and the second opening. A thin film 152, which permeates no air and permeates air vibration generated in a space in the air transmission member to a space outside the air transmission member, is provided on the wall surface of the air transmission member. Accordingly, since acoustic transmission characteristics of the space in the air transmission member varies by permeation (transmission) of air vibration due to the thin film, noise originated from a resonance phenomenon generated in the air transmission member and generated around the exhaust vent can be suppressed without causing deterioration of heat dissipation efficiency. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation mechanism and an air transmission member of an electronic device.

  As electronic devices become more sophisticated and smaller, heat dissipation measures for electronic devices become a problem. In particular, in a portable electronic device in which components such as a highly exothermic circuit and an electric motor are housed in a casing, measures for heat dissipation become a big problem. Increased power consumption of components due to higher performance of electronic devices increases heat generated from the components. Also, downsizing of electronic devices increases mounting density of components and reduces the surface area of the housing. As a result, heat generated from the components is easily trapped in the housing. As a result, the normal temperature of the parts is hindered due to the temperature rise in the housing, and in some cases, the user may suffer low temperature burns.

  Conventionally, a heat dissipation mechanism including an air inlet, an air outlet, and a fan is known as a heat dissipation measure for electronic devices. In this heat dissipation mechanism, generally, a fan is provided around the exhaust port, and the air inside the casing discharged from the fan is discharged out of the casing. In this heat dissipation mechanism, an air flow is generated between the intake and exhaust ports by a fan provided in the case, and the interior of the case is warmed by heat generated from components arranged between the intake and exhaust ports. By discharging the air out of the housing, heat dissipation from the electronic device is promoted. When higher heat dissipation efficiency is required, the efficiency of the heat dissipation mechanism can be improved by taking measures such as increasing the size of the heat dissipation mechanism having the intake port, the exhaust port, and the fan and improving the rotational speed of the fan. However, countermeasures by increasing the size of the heat dissipation mechanism are difficult to adopt because they hinder downsizing of electronic equipment, and as a result, countermeasures by improving the rotational speed of the fan are adopted.

  However, in the conventional heat dissipation mechanism, there are restrictions on the parts arrangement, such as arranging parts with high exothermicity around the exhaust port, and if such parts arrangement is not adopted, parts with high exothermicity There is a problem that heat dissipation from the air becomes difficult to be promoted and heat dissipation efficiency is lowered. On the other hand, improving the rotational speed of the fan improves the heat dissipation characteristics by increasing the air flow generated in the housing, but has a problem of generating a large noise around the exhaust port.

  The present invention has been made in view of the above problems, and a purpose of the present invention is to provide a new and improved heat dissipation mechanism and air transmission member for an electronic device that can suppress noise generation while improving heat dissipation efficiency. It is to provide.

  In order to solve the above problems, according to a first aspect of the present invention, in a heat dissipation mechanism of an electronic device that has an air inlet, an air outlet, and a fan and releases heat generated inside the housing to the outside, The first opening that communicates with the discharge port of the fan provided in the housing and the second opening that communicates with the exhaust port, and the air in the housing discharged from the fan passes through the first and second openings. An air transmission member that transmits to the outside of the housing is provided, and a wall surface of the air transmission member is provided with a thin film that does not transmit air but transmits air vibration generated in the space inside the air transmission member to the space outside the air transmission member. An electronic device heat dissipation mechanism is provided.

  According to such a configuration, air in the housing discharged from the fan is transmitted to the outside of the housing through the air transmission member, so that there is no restriction on the component arrangement, and the air transmission member is around the highly heat-generating component. By providing the first opening and the fan, the heat dissipation efficiency is improved. In addition, since a thin film that does not transmit air to the outside and transmits air vibration generated in the space inside the air transmission member to the space outside the air transmission member is provided, the air transmission member is transmitted (transmitted) by the thin film. By changing the acoustic transmission characteristics of the inner space, it is possible to suppress noise generated around the exhaust port due to a resonance phenomenon generated in the air transmission member without lowering the heat radiation efficiency. Thereby, generation | occurrence | production of noise can be suppressed in the thermal radiation mechanism of an electronic device, improving the thermal radiation efficiency.

  The air transmission member may be provided in a semi-enclosed space in the housing. According to such a configuration, the acoustic transmission characteristics in the semi-enclosed space surrounding the air transmission member change due to the permeation of air vibrations by the thin film, so that noise generated from the electronic device due to a resonance phenomenon occurring in the semi-enclosed space is reduced. Can be suppressed.

  Further, the thin film may be provided on the wall surface of the air transmission member so as to face the discharge port of the fan. According to this configuration, the thin film is disposed near the noise sound source, and the acoustic transmission characteristics of the space in the air transmission member can be greatly changed.

  The thin film may be formed of polyethylene terephthalate.

  The electronic apparatus may be an imaging device.

  In order to solve the above problems, according to a second aspect of the present invention, in order to release the heat generated in the housing to the outside of the housing, the heat dissipation mechanism of the electronic device having an air inlet, an air outlet, and a fan is provided. The applied air transmission member has a first opening that can communicate with the discharge port of the fan provided in the housing, and a second opening that can communicate with the exhaust port, and the first opening is a discharge of the fan. In communication with the outlet, with the second opening communicating with the exhaust port, the air in the housing discharged from the fan is transmitted to the outside of the housing through the first and second openings, and does not transmit air. An air transmission member is provided in which a wall surface is provided with a thin film that transmits air vibration generated in a space inside the air transmission member to a space outside the air transmission member.

  According to such a configuration, air in the housing discharged from the fan is transmitted to the outside of the housing through the air transmission member, so that there is no restriction on the component arrangement in the electronic device, and around the highly heat-generating component. By providing the first opening of the air transmission member and the fan, the heat dissipation efficiency in the electronic device is improved. In addition, since a thin film that does not transmit air to the outside and transmits air vibration generated in the space inside the air transmission member to the space outside the air transmission member is provided on the wall surface of the air transmission member, transmission of air vibration by the thin film ( The acoustic transmission characteristics of the space in the air transmission member change due to transmission, and the noise generated around the exhaust port due to the resonance phenomenon that occurs in the air transmission member is suppressed without reducing the heat dissipation efficiency. Can do. Thereby, generation | occurrence | production of a noise can be suppressed, improving the thermal radiation efficiency in the thermal radiation mechanism of the electronic device to which the air transmission member was applied.

  According to the present invention, it is possible to provide a heat dissipation mechanism and an air transmission member of an electronic device that can suppress generation of noise while improving heat dissipation efficiency.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is an explanatory diagram illustrating an electronic device including a heat dissipation mechanism according to an embodiment of the present invention. Hereinafter, a video camera 10 will be described as an example of an electronic device including the heat dissipation mechanism according to the present embodiment. However, the heat dissipation mechanism according to the present embodiment is not limited to the video camera 10 and can be similarly applied to other electronic devices that are required to improve heat dissipation efficiency and suppress noise generation.

  As shown in FIG. 1, the video camera 10 drives the camera body 12, the CCD camera 13, and the microphone 14 with the power supplied from the battery 11, and the video data of the video material photographed by the CCD camera 13 and the microphone. 14 is recorded on a recording medium such as the optical disk 15.

  FIG. 2 is a block diagram showing a system configuration of the video camera 10. As shown in FIG. 2, the video camera 10 includes a user interface (IF) 20, a system control unit 30, a system control bus 35, various memories 40, 42, 44, 46, a video / audio IF 50, a compression / decompression encoder / decoder 60. , A data control unit 70, a drive control unit 80, and a disk drive device 90.

  The user IF 20 performs processing such as user input using operation keys and switches, and user output using light emitting elements and acoustic elements.

  The system control unit 30 includes a system control bus 35 and a program memory 40 and controls the entire system 10. The program memory 40 functions as a program storage memory for storing a program executed by the system control unit 30 and a working memory, and a file system or the like is mounted thereon.

  The video / audio IF 50 is a video input, audio input, video output via a camera 52 (corresponding to the CCD camera 13), a microphone 54 (corresponding to the microphone 14), an LCD 56, a speaker 58 and the like attached to the system. , Process audio output, etc. In connection with video output, a screen memory 42 for outputting character graphics such as icons to be output to the user may be provided.

  The compression / decompression encoder / decoder 60 performs high-compression signal processing in accordance with a compression / decompression format for moving images and still images, such as MPEG, for example, in order to compress / decompress the video / audio signal. The compression / decompression encoder / decoder 60 is provided with an encoder / decoder memory 44 for storing differential signal compressed data between frames or fields of a moving image signal.

  The data control unit 70 is arranged between the compression / decompression encoder / decoder 60 and the drive control unit 80, and performs continuous stream transfer of data required for compression / decompression and data transfer according to the handshake protocol of the disk drive device 90. In between, buffer processing by FIFO is performed. The data control unit 70 is provided with a data memory 46 for use as a data buffer area during buffer processing.

  The drive control unit 80 performs handshaking with the data memory 46 via the data control unit 70, and processes data transfer with the disk drive device 90 according to a discontinuous handshake protocol.

  FIG. 3 is an explanatory diagram showing the side panel 102 of the video camera 10.

  The side panel 102 is, for example, a resin molded product that forms one side surface of the housing 100 of the video camera 10, and as shown in FIG. 3, the first air inlet 110, the air outlet 130, and a connector connection An opening such as opening 108 is provided. The first air inlet 110 and the air outlet 130 are provided as slit-like openings in the side panel 102.

  FIG. 4 is an explanatory diagram showing a heat dissipation mechanism of the video camera 10. 4 is a perspective view showing the internal structure of the video camera 10 using a cross section taken along the line 4-4 ′ shown in FIG. 1, and a side surface constituting a part of the chassis 172, the motherboard 175, and the housing 100. FIG. The inner surface and bottom surface of panel 102 are partially shown.

  As shown in FIG. 4, heat sources such as various electronic circuit boards 174 are arranged in the housing 100 of the video camera 10. It should be noted that a CCD block 176 (see FIG. 5) is provided on the front surface of the housing 100, and a disk drive storage area 178 on the side surface of the housing 100 is a disk drive (not shown). High parts are placed.

  As shown in FIG. 4, the heat dissipation mechanism includes a first intake port 110 and an exhaust port 130 provided on the side surface of the housing 100, a motor fan 140 provided in the housing 100, and the motor fan 140 and the exhaust port 130. And a duct member 150 provided therebetween. Further, the heat dissipation mechanism is provided adjacent to the second air inlet 120 provided as an opening on the bottom surface of the housing 100, the first separator 162 provided in the vicinity of the first air inlet 110, and the disk drive storage area 178. Second separator 164 formed. The first and second separators 162 and 164 have a ventilation path extending from the first and second intake ports 110 and 120 to the motor fan 140, a first ventilation path 166 mainly intended for heat dissipation from the disk drive, and a CCD block. 176 and circuit board 174 are divided into second air passages 168 mainly intended for heat dissipation. The first air passage 166 also functions as a heat insulating layer that thermally isolates the circuit board 174 and the disk drive storage area 178.

  In the heat dissipation mechanism, when the motor fan 140 rotates, a pressure difference is generated between the suction port and the discharge port of the motor fan 140, so that air outside the housing 100 passes through the first and second air intake ports 110 and 120. The air in the housing 100 is taken in, and the air in the housing 100 is discharged out of the housing 100 through the motor fan 140, the duct member 150, and the exhaust port 130. As a result, an air flow from the first and second intake ports 110 and 120 toward the exhaust port 130 is generated in the housing 100.

  As indicated by arrows in FIG. 4, the air sucked into the housing 100 through the first air inlet 110 is diverted into the first air passage 166 and the second air passage 168 by the first separator 162. The air diverted to the first ventilation path 166 is vented along the second separator 164 and the disk drive storage area 178, and is sucked into the motor fan 140 after the disk drive is cooled. On the other hand, the air diverted to the second air passage 168 merges with the air taken into the housing 100 through the second air inlet 120, and after first cooling the CCD block 176, the second separator 164 and the plurality of circuits. The air is drawn along the board 174, and the circuit board 174 is cooled and sucked into the motor fan 140. The air sucked into the motor fan 140 is discharged to the duct member 150, changes the ventilation direction in the duct member 150, and is discharged from the exhaust port 130 to the outside of the housing 100.

  5-7 is explanatory drawing which shows the heat dissipation mechanism shown in FIG. 4 in three dimensions. 5 is a perspective view of the casing 100 as seen from the front side, FIG. 6 is a perspective view of the casing 100 as seen from the rear side, and FIG. 7 is a perspective view of the casing 100 from the rear. FIG.

  As shown in FIG. 5, heat source components such as a CCD block 176 provided on the front surface, a disk drive (not shown) provided on the side surface, and various circuit boards 174 are disposed in the housing 100. Is done. A first air inlet 110 and an air outlet 130 are provided on the side surface of the housing 100, and a second air inlet 120 is provided on the bottom surface of the housing 100. In addition, a motor fan 140 is provided in the housing 100 between the first and second air intake ports 110 and 120 and the heat source and the exhaust port 130, and between the discharge port and the exhaust port 130 of the motor fan 140. A duct member 150 is provided.

  In the casing 100, the rotation of the motor fan 140 generates an air flow from the first and second intake ports 110 and 120 toward the exhaust port 130 through the first and second air passages 166 and 168 and the duct member 150. The air in the casing 100 warmed by the heat generated from the heat source is sucked into the motor fan 140 and discharged to the duct member 150, and is discharged from the exhaust port 130 through the duct member 150 to the outside of the casing 100.

  Here, since the air in the housing 100 is discharged to the outside of the housing 100 through the motor fan 140 and the duct member 150, the motor fan 140 is provided on the downstream side of the heat source, so that it is warmed by the heat generated from the heat source. Air is exhausted from the exhaust port 130 to the outside of the housing 100 through the duct member 150. As a result, it is possible to reduce the restrictions on the arrangement of components that have occurred in the past, such as arranging components that serve as heat sources around the motor fan 140 and the exhaust port 130. In addition, since the air in the housing 100 is collected by the motor fan 140 and is discharged to the outside of the housing 100 through the duct member 150, the heat diffusion within the housing 100 is suppressed, so that the heat dissipation efficiency is improved.

  FIG. 8 is an explanatory view showing the heat dissipation characteristics of the heat dissipation mechanism. FIG. 8A shows the temperature characteristics (when power consumption is 37 W) of a video camera having a conventional heat dissipation mechanism, and FIG. 8B shows a video camera having the heat dissipation mechanism according to the present embodiment described above. 10 temperature characteristics (when the power consumption is 53 W) are shown. In FIG. 8, the level of temperature is represented by shades of hatching.

  Here, in the conventional heat dissipation mechanism, an exhaust port and a motor fan are provided in the base b of the handle. 8 shows the temperature characteristics of one side surface provided with the intake port and the exhaust port, and the lower side of FIG. 8 shows temperature characteristics of the other side surface.

  As shown in FIG. 8, the conventional heat dissipation mechanism and the heat dissipation mechanism according to the present embodiment are common in that a temperature rise is recognized around the LCD panel c. However, even if the difference in power consumption is taken into consideration, in the conventional heat dissipation mechanism, thermal diffusion over a wide area around the base b of the handle and the LCD panel c is recognized. On the other hand, in the heat dissipation mechanism according to the present embodiment, a significant temperature increase is recognized in the peripheral region a of the exhaust port 130, but it is recognized that the entire heat diffusion region is limited. Therefore, the improvement effect of the heat dissipation efficiency by the heat dissipation mechanism according to the present embodiment can be confirmed from FIG.

  On the other hand, since the air in the housing 100 is collected and discharged to the outside of the housing 100 through the duct member 150, if the amount of air blown by the motor fan 140 increases, the rotation sound of the motor fan 140 and the airflow sound in the duct member 150 Due to the resonance phenomenon in the duct member 150, the resonance phenomenon around the duct member 150, and the like, there may be a case where a large noise is generated around the exhaust port 130.

  FIG. 9 is an explanatory view showing the duct member 150. 9 shows a longitudinal section along the exhaust path from the suction port of the motor fan 140 to the exhaust port 130 provided in the side panel 102, including the duct member 150, in the chassis 172 disposed around the duct member 150. It is shown together with other parts such as 173.

  The duct member 150 has a first opening communicating with the discharge port of the motor fan 140 provided in the casing 100 and a second opening communicating with the exhaust port 130, and the casing 100 discharged from the motor fan 140. It functions as an air transmission member that transmits the inside air to the outside of the housing 100 through the first and second openings.

  The duct member 150 is disposed in a semi-enclosed space between the chassis 172 and the disk drive storage area 178 to which the motor fan 140 is attached and the chassis back wall 173 behind the housing 100. The duct member 150 is formed as a molded product made of, for example, a resin having a large internal space. Therefore, a plurality of members are combined from the viewpoint of manufacturability and component arrangement.

  The duct member 150 is provided with a thin film 152 on the surface facing the discharge surface of the motor fan 140 as shown in FIGS. 6 and 7 in order to reduce noise generated around the exhaust port 130. The thin film 152 is formed of a flexible material such as a polyethylene terephthalate (PET) film.

  Since the thin film 152 does not transmit air, the function of the duct member 150 as an air transmission member is not deteriorated. Further, the thin film 152 vibrates due to the air vibration generated in the space in the duct member 150, and transmits the air vibration in the duct member 150 to the space outside the duct member 150 through its own vibration. A part of is made acoustically open. Then, the vibration of the thin film 152 causes the air vibration in the duct member 150 to be transmitted (transmitted) to the space outside the duct member 150, thereby changing the acoustic transmission characteristics of the space in the duct member 150.

  Here, the thin film 152 is a sound such as a rotation sound of the motor fan 140, an airflow sound in the duct member 150, a sound due to a resonance phenomenon, an air vibration recognized as a sound, and an airflow discharged from the motor fan 140. Vibrates due to unrecognized air vibration.

  FIG. 10 is a graph showing measurement results for expressing the noise reduction effect by the thin film 152. FIG. 10A shows the measurement result when the thin film 152 is not formed on the duct member 150, and FIG. 10B shows the measurement result when the thin film 152 is formed. The measurement result shown in FIG. 10 shows the sound pressure measured by the peripheral sound microphone arranged at a position 30 cm from the side panel 102 on the extension line of the rotation axis of the disk drive for each frequency band. Note that the sound pressure value is measured in a state where video and audio are recorded by the video camera 10 and represents noise generated from the entire video camera 10 including operation sound of a disk drive.

  FIG. 10 shows the sound pressure at the noise level (grade NR-25, NR-30) referred to as the design standard, the sound pressure of the background noise at the time of measurement, and the sound pressure (8V, 13V) for each drive voltage of the motor fan 140. )It is shown. FIG. 10 shows the measurement results when a 25 μm PET film is formed in the entire region of the surface facing the discharge port of the motor fan 140. As shown in FIG. 10, although the sound pressure of the background noise is slightly different depending on the measurement date and time, it is recognized that the sound pressure in the frequency band of 1 to 2 kHz is particularly reduced by the formation of the thin film 152.

  Further, the applicants, etc., use the area (all regions, 1/2 region), position (other than the surface facing the discharge port and the surface facing the discharge port), and the film thickness (25 μm, 50 μm) of the thin film 152 as parameters. The noise reduction effect by the thin film 152 was verified. As a result, it has been confirmed that by increasing the area of the thin film 152, a high noise reduction effect is expected, and by reducing the thickness of the thin film 152, a high noise reduction effect is expected. Note that it has been confirmed that a noise reduction effect can be expected even when the area is a ½ region, when the position is other than the surface facing the discharge port, and when the film thickness 152 is 50 μm.

  Furthermore, the applicants verified the noise reduction effect when a urethane film was used as the thin film 152 instead of the PET film. As a result, it has been confirmed that a high noise reduction effect is expected when a PET film is used rather than a urethane film. This is presumably due to the fact that when the same vibration is applied, the vibration attenuation rate of the PET film is lower than that of the urethane film, that is, the vibration duration time is long. However, it has been confirmed that even when a urethane film is used as the thin film 152, a noise reduction effect is expected. For this reason, a flexible thin film 152 that does not transmit air and can transmit air vibration generated in the space inside the duct member 150 to the space outside the duct member 150 can be applied to other than the PET film.

  FIG. 11 is a graph showing a numerical analysis result for representing the noise reduction effect by the thin film 152. In FIG. 11, a waveform a indicates an analysis result when the thin film 152 is not formed on the duct member 150, and a waveform b indicates an analysis result when the thin film 152 is formed. The numerical analysis result shown in FIG. 11 shows a change in acoustic characteristics due to the shape of the duct member 150 and represents the occurrence of a resonance phenomenon in the duct member 150.

  As shown in FIG. 11, when the thin film 150 is not formed, the peak value of the sound pressure is recognized at 0.8 kHz, 2.6 kHz, 3.5 kHz, and 4.4 kHz. These peak values represent the resonance modes of the duct member 150 as a vibrating body. On the other hand, when the thin film 152 is formed, the peak values of 0.8 kHz and 2.6 kz recognized when the thin film 152 is not formed disappear. In addition, an average reduction in sound pressure is recognized over the entire frequency band of 0 to 5 kHz. Therefore, it is recognized that the resonance mode of the duct member 150 is changed by the permeation of air vibrations by the thin film 152, and the acoustic transmission characteristics in the space in the duct member 150 are changed.

  As shown in FIGS. 10 and 11, it has been confirmed that the acoustic transmission characteristics of the space in the duct member 150 are changed by the permeation of air vibrations by the thin film 152. The mechanism is estimated as follows.

  The air vibration transmitted through the space in the duct member 150 is partially transmitted to the space surrounding the duct member 150 via the vibration of the thin film 152, so that the air vibration transmitted through the space in the duct member 150 is reduced. This is presumed from the fact that, as shown in FIGS. In addition, when the thin film 152 is disposed so as to face the discharge port of the motor fan 140, it is estimated that a relatively large decrease in sound pressure is recognized.

  Further, the permeation of air vibrations by the thin film 152 changes the natural frequency of the duct member 150 as a vibrating body, and the resonance mode of the duct member 150 changes, so that a resonance phenomenon occurs in the duct member 150. It is suppressed. This is presumed from the fact that, as shown in FIG. 11, the change of the resonance mode and the suppression of the occurrence of the resonance phenomenon were recognized by the formation of the thin film 152.

  Furthermore, it has been confirmed that the transmission of air vibrations by the thin film 152 affects not only the acoustic transmission characteristics of the space in the duct member 150 but also the acoustic transmission characteristics in the semi-enclosed space surrounding the duct member 150. This is because the duct member 150 is arranged in a semi-enclosed space provided at the rear of the casing 100, so that a resonance phenomenon occurs in the semi-enclosed space at the rear of the casing 100 as well as the space in the duct member 150. It is presumed that the resonance mode changes due to the permeation of air vibrations by the thin film 152.

  As described above, according to the heat dissipation mechanism according to the present embodiment, the air in the casing 100 discharged from the motor fan 140 is transmitted to the outside of the casing 100 through the duct member 150, so that there are restrictions on the component arrangement In addition, by providing the first opening of the duct member 150 and the motor fan 140 around the highly exothermic component, the heat dissipation efficiency is improved. Further, since a thin film 152 that does not transmit air to the outside and transmits air vibration generated in the space inside the duct member 150 to the space outside the duct member 150 is provided on the wall surface of the duct member 150, The transmission (transmission) changes the acoustic transmission characteristics of the space in the duct member 150, and the noise generated around the exhaust port 130 due to the resonance phenomenon generated in the duct member 150 without lowering the heat radiation efficiency. Can be suppressed. Thereby, in the heat dissipation mechanism of the video camera 10, it is possible to suppress the generation of noise while improving the heat dissipation efficiency.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to the example which concerns. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, in the above embodiment, the case where the heat dissipation mechanism according to the embodiment of the present invention is applied to the video camera 10 has been described. However, the heat dissipating mechanism according to the present invention has an air inlet, an air outlet, and a fan, and releases heat generated inside the housing to the outside of the housing, particularly an improvement in heat radiation efficiency and noise reduction. The present invention can be similarly applied to an electronic device that is required to suppress generation.

  In the above embodiment, the case where the duct member 150 is provided as the air transmission member has been described. However, the air transmission member is not limited to the duct member 150 but has a first opening communicating with the discharge port of the fan provided in the housing and a second opening communicating with the exhaust port, and is discharged from the fan. It is also possible to substitute other members that transmit the air inside the casing to the outside through the first and second openings.

It is explanatory drawing which shows the electronic device provided with the thermal radiation mechanism which concerns on one Embodiment of this invention. It is a block diagram which shows the system configuration | structure of a video camera. It is explanatory drawing which shows the side panel of a video camera. It is explanatory drawing which shows the thermal radiation mechanism of a video camera. It is explanatory drawing which shows the heat dissipation mechanism shown in FIG. 4 in three dimensions. It is explanatory drawing which shows the heat dissipation mechanism shown in FIG. 4 in three dimensions. It is explanatory drawing which shows the heat dissipation mechanism shown in FIG. 4 in three dimensions. It is explanatory drawing which shows the thermal radiation characteristic by a thermal radiation mechanism. It is explanatory drawing which shows a duct member. It is a graph which shows the measurement result showing the noise reduction effect by a thin film. It is a graph which shows the numerical analysis result showing the noise reduction effect by a thin film.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Housing | casing 110 1st inlet port 120 2nd inlet port 130 Exhaust port 140 Motor fan 150 Duct member (air transmission member)
152 thin film

Claims (6)

In the heat dissipation mechanism of an electronic device that has an air inlet, an air outlet, and a fan and releases heat generated inside the housing to the outside of the housing,
A first opening communicating with the discharge port of the fan provided in the casing and a second opening communicating with the exhaust port, and air in the casing discharged from the fan is the first opening. And an air transmission member that transmits to the outside of the housing through the second opening,
The wall surface of the air transmission member is provided with a thin film that does not transmit air but transmits air vibration generated in a space inside the air transmission member to a space outside the air transmission member. Equipment heat dissipation mechanism.   The heat dissipation mechanism for an electronic device according to claim 1, wherein the air transmission member is provided in a semi-enclosed space in the housing.   The heat dissipation mechanism for an electronic device according to claim 1, wherein the thin film is provided on a wall surface of the air transmission member so as to face a discharge port of the fan.   The heat dissipation mechanism for an electronic device according to claim 1, wherein the thin film is formed of polyethylene terephthalate.   The heat dissipation mechanism for an electronic device according to claim 1, wherein the electronic device is an imaging device. In an air transmission member applied to a heat dissipation mechanism of an electronic device having an air inlet, an air outlet, and a fan in order to release heat generated in the housing to the outside of the housing,
There is a first opening that can communicate with the discharge port of the fan and a second opening that can communicate with the exhaust port, and the first opening communicates with the discharge port of the fan. In the state where the second opening communicates with the exhaust port, the air in the casing discharged from the fan is transmitted to the outside of the casing through the first and second openings, and the air is transmitted. An air transmission member characterized in that a thin film is provided on a wall surface to transmit air vibration generated in a space inside the air transmission member to a space outside the air transmission member.

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