JP2009152160A - Particle transfer die and manufacturing method thereof, manufacturing method of particle transfer film, and anisotropic conductive film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a particle transfer die which can transfer particles continuously, and to provide a manufacturing method of a particle transfer film using the die. <P>SOLUTION: The particle transfer die 10 has a lengthy polymer base material 12 and a polymer layer 14 laminated on one side of the polymer base material 12. On the surface of the polymer layer 14, numerous recesses 14a for introducing the particles are regularly aligned and formed. It is preferable that in the particle transfer die 10, substantially each particle is introduced to each recess. Moreover, it is preferable that the recess 14a is formed in such a depth that a part of the introduced particle can be exposed from a formed face of the recess 14a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a particle transfer mold and a method for manufacturing the same, a method for manufacturing a particle transfer film, and an anisotropic conductive film.

  In recent years, in various industrial fields, opportunities for regularly arranging and utilizing particles are increasing.

  For example, in the fields of electric and electronic devices, regularly arranged conductive particles are held in a film, and this is used as a skeleton of an anisotropic conductive film.

  An anisotropic conductive film is a film that exhibits conductivity in the film thickness direction and exhibits insulation in the film surface direction. For example, in the field of liquid crystal display (LCD), in order to electrically and mechanically connect a TAB (Tape Automated Bonding) electrode with a driving IC chip and an electrode of a liquid crystal panel, etc. Anisotropic conductive films are frequently used.

  Conventionally, a transfer technique is known as a technique for holding particles in a film. For example, Patent Document 1 discloses a technique in which a band-shaped magnetic recording region is formed on a magnetic medium, and then the conductive particles are captured in the magnetic recording region, and the conductive particles are transferred onto an adhesive substrate. Is disclosed.

  A technique using a transfer mold at the time of transfer is also known. The method using a transfer mold has an advantage that particles are easily transferred by arrangement.

  As a technique using a transfer mold, for example, there is a technique in which a concave portion is formed on a Si substrate using a microfabrication process such as a semiconductor manufacturing process, particles are introduced into the concave portion, and then transferred onto a substrate.

  In addition, for example, in Patent Document 2, a roll transfer mold having recesses is used, the surface of the roll transfer mold is immersed in a paste in which conductive particles are dispersed, and the conductive particles are captured in the recesses. After that, a technique for transferring onto a substrate is disclosed.

JP 2006-24551 A JP 2004-335663 A

  However, when transferring particles using a conventional transfer mold, there are the following problems.

  That is, for example, an anisotropic conductive film or the like is required to be a long object in consideration of its usage.

  However, in the semiconductor manufacturing process, only a relatively small area and batch type planar concave mold can be manufactured. Therefore, there is a problem that it is difficult to obtain a long particle transfer film unless the transfer of the particles is repeated a plurality of times. Therefore, there is a drawback that the productivity of the particle transfer film is deteriorated.

  In addition, in order to obtain a long particle transfer film, accurate alignment is required between the previous transfer position and the current transfer position. For this reason, the manufacture of the particle transfer film becomes an intermittent method, which also reduces the productivity.

  In particular, when it is desired to regularly arrange particles, alignment with higher accuracy is required. For this reason, it takes time to align the position and further deteriorates productivity. Further, if the alignment fails, it leads to defective production of the particle transfer film.

  In addition, since the surface of the roll transfer mold has a curved surface, it is considered difficult to introduce particles into the recesses.

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a particle transfer mold capable of continuously transferring particles and a method for producing a particle transfer film using the mold.

  In order to solve the above problems, a particle transfer mold according to the present invention has a long polymer base material and a polymer layer laminated on one surface of the polymer base material. The gist is that a large number of concave portions for introducing particles are regularly arranged on the surface.

  Here, the recess is preferably formed to a depth that allows a part of the introduced particles to be exposed from the recess forming surface.

  Moreover, it is preferable that the particle transfer mold is substantially one in which one particle is introduced per one recess.

  Moreover, it is preferable that the polymer which comprises the said polymer layer is 1 type, or 2 or more types selected from a thermoplastic resin, a photocurable resin, and a thermosetting resin.

  The method for producing a particle transfer mold according to the present invention comprises a step of laminating a polymer layer or a precursor layer thereof on one side of a long polymer substrate, and a surface of the polymer layer or a precursor layer thereof. And a step of regularly arranging a large number of concave portions for introducing particles.

  The formation of the concave portion is preferably performed by pressing a flat body, a roll body, or a belt body having a convex portion corresponding to the concave portion to be formed on the surface of the polymer layer or the precursor layer.

  Moreover, when the said precursor layer is laminated | stacked, it is preferable to convert a precursor layer into a polymer layer, forming the said recessed part.

  Another method for producing a particle transfer mold according to the present invention is a polymer layer or a precursor thereof in which a large number of concave portions for introducing particles are regularly arranged on one surface of a long polymer substrate. The gist is to include a step of transferring the body layer.

  The method for producing a particle transfer film according to the present invention includes a step of introducing particles into the concave portion of the particle transfer mold, and a step of transferring the particles introduced into the concave portion to the surface of the polymer film. To do.

  Here, it is preferable to introduce the particles substantially one by one for each of the concave portions.

  The film thickness of the polymer film is preferably in the range of 1/10 to 3/2 times the particle size of the particles.

  The particles are preferably conductive particles.

  The gist of the anisotropic conductive film according to the present invention is that a conductive particle is applied as the particle and the particle transfer film obtained by the method for manufacturing the particle transfer film is used.

  The particle transfer mold according to the present invention has a long polymer base material and a polymer layer laminated on one surface of the polymer base material. A large number of recesses are regularly arranged.

  Therefore, it is not necessary to repeatedly transfer the particles a plurality of times as in the case of using a batch-type planar concave mold, and the particles can be transferred continuously. Therefore, the productivity of a long particle transfer film is excellent. Further, since fine positioning of the transfer position is not necessary, this can also improve productivity.

  Moreover, since the particle transfer mold according to the present invention is formed of a polymer, it is rich in flexibility. Therefore, it can be slightly deformed by the transfer pressure, and there is an advantage that the particles introduced into the recesses are easily transferred. In addition, it is easy to wind or unwind or form in a belt shape, and can flexibly respond to the manufacturing process of the particle transfer film.

  In addition, since the polymer base material and the polymer layer forming the recess are separated, the range of material selection is expanded. Therefore, there is an advantage that various functions can be easily given to the mold by selecting the material according to the function to be emphasized, such as recess forming property, heat resistance, mold release property, wear resistance, durability, and chemical resistance. .

  Here, when the concave portion is formed to a depth at which a part of the introduced particle can be exposed from the concave portion forming surface, the transferability of the particle can be improved.

  In addition, when the particle transfer mold is substantially one in which one particle is introduced per one recess, the particle layer can be transferred with a thickness of one particle. Therefore, it is possible to contribute to obtaining an anisotropic conductive film with less inconvenience such as the flow of stacked particles and a decrease in anisotropic conductivity.

  When the polymer constituting the polymer layer is one or more selected from a thermoplastic resin, a photocurable resin, and a thermosetting resin, according to the required characteristics. There are advantages such as easy selection and fine adjustment of resin.

  The method for producing a particle transfer mold according to the present invention comprises a step of laminating a polymer layer or a precursor layer thereof on one side of a long polymer substrate, and a surface of the polymer layer or a precursor layer thereof. And a step of regularly arranging a large number of recesses for introducing particles.

  Therefore, the particle transfer mold having the above-described configuration can be manufactured.

  Here, when the formation of the concave portion is performed by pressing a flat body, a roll body, or a belt body having a convex portion corresponding to the concave portion to be formed on the surface of the polymer layer or the precursor layer. Can form a recess relatively easily.

  Once the particle transfer mold is manufactured, it can be used repeatedly thereafter. Therefore, the use of a batch-type planar convex mold during the production of the particle transfer mold or the alignment during the formation of the concave section does not particularly affect the productivity of the particle transfer film.

  Further, when the precursor layer is laminated, the precursor layer may be converted into a polymer layer either during the formation of the recess or before or after the formation of the recess. Preferably, the precursor layer may be converted into a polymer layer while forming a recess. It is because it becomes easy to form the recessed part which has a comparatively favorable shape by making it convert into a polymer, making a precursor follow along the convex part surface of a plane body or a roll body.

  Another method for producing a particle transfer film according to the present invention is a polymer layer in which a large number of concave portions for introducing particles are regularly arranged on one surface of a long polymer base material. A step of transferring the precursor layer. Therefore, the particle transfer mold having the above-described configuration can be manufactured.

  In this case as well, when the precursor layer is transferred, the precursor layer may be converted into a polymer layer either during transfer or before and after transfer. Preferably, the precursor layer is transferred to the polymer layer while being transferred.

  The method for producing a particle transfer film according to the present invention includes a step of introducing particles into the concave portion of the particle transfer mold and a step of transferring the particles introduced into the concave portion onto the surface of the polymer film.

  Therefore, the particles can be continuously transferred onto the surface of the polymer film, and the productivity of the particle transfer film is excellent.

  In addition, when the particles are introduced one by one for each recess, the particle layer can be transferred to the surface of the polymer film with a thickness of one particle. Therefore, for example, it can contribute to obtaining an anisotropic conductive film with less inconvenience such as anisotropic conductivity being lowered by the stacked particles.

  In addition, when the film thickness of the polymer film is in the range of 1/10 to 3/2 times the particle diameter of the particle, the strength of the polymer film is appropriate, so that the transfer is easy. When used for an anisotropic conductive film, there is an advantage that the resistance value tends to be appropriate.

  Further, when conductive particles are used as the particles, a particle transfer film that can be suitably used for an anisotropic conductive film can be obtained.

  Hereinafter, the particle transfer mold according to the present embodiment (hereinafter sometimes referred to as “the present transfer mold”) and the manufacturing method thereof (hereinafter also referred to as “the process of the present transfer mold”), and the present embodiment. A method for producing a particle transfer film (hereinafter sometimes referred to as “method for producing the present transfer film”) and an anisotropic conductive film (hereinafter also referred to as “present ACF”) according to the present embodiment will be described in detail. To do.

1. Main Transfer Mold FIGS. 1A and 1B show an example of a schematic cross-sectional view of the main transfer mold. The transfer mold 10 includes a polymer substrate 12 and a polymer layer 14 laminated on one surface of the polymer substrate 12.

  The polymer substrate 12 is formed long. The length and width of the polymer substrate 12 can be appropriately selected according to the use of the particle transfer film obtained using the present transfer mold 10.

  For example, the width of the polymer substrate may be the width of one particle transfer film or a width of a plurality of particles. When the width is set to a plurality of widths, the obtained particle transfer film, an anisotropic conductive film using the particle transfer film, and the like are divided along the longitudinal direction so that the long particle transfer film and the anisotropic conductive film are divided. A large number of films can be taken.

  The thickness of the polymer substrate 12 is selected in consideration of the durability, strength, flexibility, etc. desired to be imparted to the transfer mold 10 and the outer diameter of the roll when the transfer mold 10 is wound into a roll or the like. be able to.

  The thickness of the polymer substrate 12 is preferably in the range of 12 to 1000 μm, more preferably in the range of 50 to 500 μm, from the viewpoint of good handling properties during particle transfer.

  Examples of the main material of the polymer substrate 12 include various resins such as thermoplastic resins and various rubbers. These may be used alone or in combination. The polymer substrate 12 may be a laminate of a plurality of layers of the same or different materials.

  Specific examples of the polymer mainly constituting the polymer substrate 12 include polyesters such as polyethylene terephthalate; polyimides; polycarbonates; polyolefins such as polyethylene and polypropylene; polystyrenes; liquid crystal polymers and the like. .

  Preferably, polyester such as polyethylene terephthalate is preferable from the viewpoint of solvent resistance, ease of handling, availability, and cost.

  In the polymer substrate 12, one or more additives such as antioxidants, fibrous materials such as whiskers and fibers, fillers such as silica and titanium oxide, flame retardants, and the like are mixed. May be.

  The polymer substrate 12 may be a non-porous body or a porous body.

  The polymer layer 14 has a large number of recesses 14a on its surface. The recess 14a is for introducing particles 16 (see FIG. 2 and the like described later) to be transferred. Therefore, the shape of the recess 14a is not particularly limited as long as the particle 16 can be introduced.

  Examples of the shape of the recess 14a include various shapes such as a substantially cylindrical shape, a substantially polygonal column shape such as a quadrangular column and a hexagonal column, a substantially conical shape, and a substantially pyramid shape. One or more of these forms may be included. The form of the concave portion 14a is preferably a substantially cylindrical shape, a substantially polygonal column shape such as a quadrangular column, or the like from the viewpoints of particle introduction property, productivity of a convex shape for forming a recessed portion, and the like.

  In the present transfer mold 10, the recesses 14a are separated from each other, and the recesses 14a are regularly arranged.

  Specific examples of the regular array include an array such as a lattice, a staggered pattern, and a honeycomb, and an array in which these arrays are inclined. It can be selected according to the application of the particle transfer film obtained using the present transfer mold 10.

  The recess 14a may be a non-through hole that does not penetrate the polymer layer 14 as shown in FIG. 1A, or penetrates the polymer layer 14 as shown in FIG. 1B. It may be a through hole. When the concave portion 14a is a through hole, by selecting a porous body as the polymer base material 12, for example, it becomes possible to perform suction from the surface opposite to the laminated surface of the polymer layer 14, It can contribute to improvement of particle introduction property.

  FIG. 2 is a diagram schematically showing a case where particles are introduced into the concave portion of the present transfer mold. Note that the particles 16 may be made of an inorganic material or an organic material. Or you may consist of the composite_body | complex of an inorganic material and an organic material. It can be selected according to the use of the particle transfer film obtained using the present transfer mold 10.

  Specific examples of the particles 16 include, for example, one or more conductive layers on the surface of various resin particles (metals such as various metals such as gold, silver, white metal, nickel, and copper, and alloys thereof). Examples thereof include particles having a plating layer, a sputtered layer, etc .; various metal particles made of the above metals and alloys thereof; conductive particles such as carbon particles; various resin particles; insulating particles such as silica particles.

  Here, as shown in FIG. 2, the recess 14a is preferably formed to a depth that allows the top of the introduced particles 16 to be exposed from the recess forming surface 14b. This is because the transferability of the particles 16 can be improved, and the particles 16 are difficult to be introduced by being stacked in the depth direction.

  The upper limit of the ratio of the depth of the recesses 14a to the average particle diameter of the particles 16 (= depth of the recesses 14a / average particle diameter of the particles 16) is preferably less than 1 from the viewpoint of excellent transferability of the particles 16. More preferably, it is 0.95 or less, and further preferably 0.9 or less.

  On the other hand, the lower limit of the ratio of the depth of the recesses 14a to the average particle diameter of the particles 16 (= depth of the recesses 14a / average particle diameter of the particles 16) is from the viewpoint of ensuring particle retention and ease of particle introduction. Therefore, it is preferably 0.5 or more, more preferably 0.6 or more, and still more preferably 0.75 or more.

  However, since the transfer mold 10 is made of a polymer, it is highly flexible and can be slightly deformed by the transfer pressure. Therefore, there is an advantage that transfer is easy even if the tops of the particles 16 are not slightly exposed from the recess forming surface 14b.

  FIGS. 3A and 3B are diagrams showing an example of a state in which particles are introduced into one concave portion, in which FIG. 3A is a cross-sectional view and FIG. 3B is a plan view.

  As shown in FIG. 3, the transfer mold 10 is preferably such that one particle 16 is introduced for each recess 14a. The particle layer can be transferred with a thickness of one particle 16. For this reason, for example, when the obtained particle transfer film is used for an anisotropic conductive film, an anisotropic conductive film with less inconvenience such as flow of stacked particles and a decrease in anisotropic conductivity is obtained. It is because it can contribute.

  However, as shown in FIG. 4, the transfer mold 10 may be one in which a plurality of particles 16 are introduced per recess 14a. Further, the transfer mold 10 may be one in which the particles 16 are introduced in a state where the state of FIG. 3 and the state of FIG. 4 are combined.

  As shown in FIG. 3, the recess 14a preferably has an opening slightly larger than the particle diameter of the particles 16 to be introduced. This is because the particles 16 are easily introduced one by one for each recess 14a, and the ease of introduction of the particles 16 is easily secured.

  The upper limit of the ratio of the opening size of the recesses 14a to the average particle size of the particles 16 (= opening size of the recesses 14a / average particle size of the particles 16) is that one particle 16 is introduced per recess 14a. From the viewpoint of facilitating, it is preferably less than 2, more preferably 1.8 or less, and even more preferably 1.6 or less.

  On the other hand, the lower limit of the ratio of the size of the opening of the recess 14a to the average particle size of the particle 16 (= the size of the opening of the recess 14a / the average particle size of the particle 16) is preferable from the viewpoint of ensuring the particle introduction property. Is 1 or more, more preferably 1.05 or more, and even more preferably 1.1 or more.

  As a material mainly constituting the polymer layer 14, for example, various polymers corresponding to the recess forming property, heat resistance, mold release property, wear resistance, durability, chemical resistance and the like are considered. The material can be selected. Examples of the polymer material include various resins such as thermoplastic resins, photocurable resins, and thermosetting resins, and various rubbers. These may be used alone or in combination. Among these, a thermoplastic resin, a photocurable resin, or the like is preferable from the viewpoint of good workability when the polymer layer is peeled off from a convex mold described later.

  Specific examples of the thermoplastic resin include polyethylene, polypropylene, polycarbonate, polystyrene, acrylic resin, polyimide resin, polyamide resin, and fluororesin.

  Specific examples of the photocurable resin include acrylic resin, epoxy resin, silicon resin, and polyimide resin.

  Specifically as said thermosetting resin, an epoxy resin, an acrylic resin, a polyimide resin, a polyamideimide resin etc. can be illustrated, for example.

  Specific examples of the rubber include silicone rubber and fluororubber.

  In the polymer layer 14, various additives such as an antioxidant and an inorganic filler may be mixed alone or in combination.

  The thickness of the polymer layer 14 should be selected in consideration of durability, strength, flexibility, etc. desired to be imparted to the transfer mold 10 and the outer diameter of the roll when the transfer mold 10 is rolled up. Can do.

  The thickness of the polymer layer 14 is preferably in the range of 0.5 to 50 μm, more preferably in the range of 1 to 20 μm, from the viewpoints of securing the hole depth, handling properties, cost, and the like. .

  The transfer mold 10 can be used by being wound into a roll or formed into a belt. In the case of a roll shape, if the main transfer mold 10 is unwound from the mold roll, and after transferring the particles, the main transfer mold 10 is again wound into a roll shape, etc., it can be used repeatedly. When the belt is formed in a belt shape, the transfer mold 10 can be continuously used repeatedly by circulating the mold belt.

2. Manufacturing method of the present transfer mold The manufacturing method of the present transfer mold includes the following lamination process and recess forming process. Hereinafter, it demonstrates in order.

  A lamination process is a process of laminating a polymer layer or its precursor layer on one side of a long polymer substrate.

  The lamination of the polymer layer and the precursor layer is performed by using the above-described polymer itself, a polymer precursor such as a monomer or an oligomer that can be converted into the above-described polymer, or a liquid containing these using various coating methods. The coating can be carried out by coating the polymer base material with a predetermined thickness.

  Examples of the various coating methods include a die coating method, a spray coating method, a gravure coating method, a comma coating method, a kiss coating method, a reverse gravure coating method, a small diameter reverse gravure coating method, and a thermal extrusion manufacturing method.

  The concave portion forming step is a step of regularly arranging a large number of concave portions for introducing particles on the surface of the polymer layer or its precursor layer.

  In addition, when the precursor layer is laminated, the polymer precursor is applied to the polymer by heating or irradiating active energy rays such as ultraviolet rays before or after the formation of the concave portion or during the formation of the concave portion. Convert it. As the conversion method, an optimum method may be selected according to the type of the polymer precursor.

  Here, any method can be applied as the method for forming the recess as long as the method can form the recess having the above-described form.

  As the method for forming the concave portion, specifically, for example, a first preferred method is a method of pressing a planar body having a convex portion corresponding to the concave portion to be formed on the surface of the polymer layer or the precursor layer. It can be illustrated as.

  This method is relatively easy to manufacture and obtain a planar body having a convex portion. For this reason, there is a high degree of freedom in combining various forms of recesses, depth, arrangement, and the like. However, according to this method, a batch-type planar convex mold is used. For this reason, at the time of manufacturing the transfer mold, intermittent operation is required, or alignment between the previous recess formation position and the current recess formation position is required. However, once the transfer mold is manufactured, it can be used repeatedly thereafter, so that the productivity of the particle transfer film is not particularly affected.

  As a method for forming the concave portion, specifically, for example, a method in which a roll body having a convex portion corresponding to the concave portion to be formed is pressed against the surface of the polymer layer or the precursor layer is a second preferred method. It can be illustrated as.

  According to this method, the concave portion can be continuously formed. Further, it is not necessary to align the recess forming position. Therefore, the productivity of this transfer mold can be improved.

  As the method for forming the concave portion, specifically, for example, a method of pressing a belt body having a convex portion corresponding to the concave portion to be formed on the surface of the polymer layer or the precursor layer is a third preferred method. It can be illustrated as.

  According to this method, the concave portion can be continuously formed. Further, it is not necessary to align the recess forming position. Therefore, the productivity of this transfer mold can be improved.

  In the recess formation step, heating, pressurization, energy beam irradiation, and the like may be performed as necessary in consideration of the material of the polymer layer and the precursor layer laminated in the previous step when forming the recess. As for the irradiation conditions of heating, pressurization, and energy rays, an optimal range may be selected according to the above materials.

  For example, when a thermoplastic resin or the like is laminated, the resin is softened by heating, so that the concave portion is easily formed. In this case, when pressing is performed in addition to heating, it becomes easier to form the recess.

  Further, for example, when a thermosetting resin or the like is laminated, the uncured component is projected by heating, or when a photocurable resin or the like is laminated, the active energy ray is irradiated. It can be hardened along the part surface. Therefore, it becomes easy to form a recess having a relatively good shape.

  The production method of this transfer mold will be described more specifically with reference to the drawings. FIG. 5 is a view schematically showing an example of a method for producing the present transfer mold by pressing a flat body having convex portions on the surface thereof against the surface of the polymer layer.

  As shown in FIG. 5, the polymer base material 12 is intermittently fed out from the polymer base material supply roll 20, and a polymer material having a predetermined thickness is formed on one surface of the polymer base material 12 using a coating means 22. 24 are stacked.

  Next, the planar body 28 having convex portions is pressed against the surface of the polymer layer 14 while heating the polymer substrate 12 and the polymer layer 14 before forming the concave portions by the temperature control plate 26. In this case, the pressing operation is repeatedly performed while aligning the previous pressing position and the current pressing position. In addition to the temperature adjustment plate 26, the temperature of the planar body 28 having the convex portions may be adjusted, or both may be adjusted.

  Thereby, the elongate this transfer mold | type 10 can be manufactured, and if this is wound up in roll shape, the type | mold roll 30 can be obtained.

  FIG. 6 is a diagram schematically showing an example of a method for manufacturing the present transfer mold by pressing a roll body having convex portions on the surface thereof against the surface of the polymer layer.

  As shown in FIG. 6, the polymer substrate 12 is continuously fed out from the polymer substrate supply roll 20, and a polymer material having a predetermined thickness is formed on one surface of the polymer substrate 12 using a coating means 22. 24 are stacked.

  Next, while the polymer substrate 12 and the polymer layer 14 before forming the recesses are heated by the temperature control roll 32, the roll body 34 having the projections is pressed against the surface of the polymer layer 14 while rotating. Similarly to the above, in addition to the temperature control roll 32, the roll body 34 having a convex portion may be temperature controlled, or both may be temperature controlled.

  Thereby, the long main transfer mold 10 can be manufactured, and if this is wound up in a roll shape, the mold roll 30 can be obtained.

  As a modification of the above-described transfer mold manufacturing method, a polymer layer or a precursor layer thereof in which a large number of concave portions for introducing particles are regularly arranged on one surface of a long polymer substrate. The manufacturing method which has the process of transcribe | transferring can be mentioned.

  In this production method, for example, the polymer itself, or a polymer precursor such as a monomer or an oligomer that can be converted into the polymer, or a liquid containing the same has a convex portion by using various coating methods. Coating is carried out with a predetermined thickness on the surface of a roll body, a belt body, or a planar convex mold.

  Then, by transferring this coating layer onto the surface of the polymer substrate, basically, a polymer layer having a large number of recesses can be formed on the polymer substrate. However, when a polymer precursor is used, the polymer precursor may be converted into a polymer in the same manner as described above before or during transfer or during transfer.

3. Production method of the present transfer film The production method of the present transfer film is a method of producing a particle transfer film using the above-described present transfer mold. Specifically, the production method of the present transfer film includes a particle introduction step of introducing particles into the above-described particle transfer type recess, and a transfer step of transferring the particles introduced into the recess to the surface of the polymer film. ing.

  FIG. 7 is a view schematically showing an example of a method for producing a particle transfer film using the main transfer mold (mold roll) wound in a roll shape. FIG. 8 is a view schematically showing an example of a method for producing a particle transfer film using a main transfer mold (mold belt) formed in a belt shape.

  In FIG. 7, the main transfer mold 10 is unwound from the mold roll 30, and the particles 16 are introduced into the concave portions 14 a of the main transfer mold 10 by the particle introduction part 36. Next, the particles 16 introduced into the recesses 14a are transferred to the surface of the polymer film 40 fed from the polymer film supply roll 38, and the obtained particle transfer film 42 is wound up in a roll shape. On the other hand, the main transfer mold 10 after the transfer is wound up again to form a mold roll 30.

  In FIG. 8, the particles 16 are introduced into the recess 14 a of the circulating mold belt 44. Next, the particles 16 introduced into the recesses 14a are transferred to the surface of the polymer film 40 fed from the polymer film supply roll 38, and the obtained particle transfer film 42 is wound up in a roll shape. On the other hand, the transferred mold belt 44 is circulated to the particle introduction section 36 again.

  Here, in the production method of the present transfer type, the particle introduction method is not particularly limited, and various particle introduction methods can be applied. Particles may be introduced by either dry or wet methods.

  Specifically, as the particle introduction method, for example, a dried particle powder or a dispersion in which this is dispersed in a solvent is sprayed or applied on the concave surface of the transfer mold, and then a brush, a brush, a blade, etc. The method of putting particles in the recesses by applying the scraping means, the method of putting particles in the recesses by applying vibration or magnetic force from the outside after the above-mentioned spraying or coating, or sucking, etc., the suction type suction hole After the particles are sucked inside, the suction holes and the recesses are aligned, the particles sucked in the suction holes are moved into the recesses, the transfer mold is immersed in the dispersion, A method in which a plate-like member is arranged at a certain distance from the recess forming surface of the transfer mold, the dispersion liquid is introduced into the formed gap, and the transfer mold and / or the plate-like member is slid. Combination etc. It can Shimesuru.

  Among these, from the standpoint of easy introduction of particles one by one for each recess, a method in which the dried particle powder is sprayed on a mold and then scraped off with a brush, brush, blade or the like, and the particles are put in place.

  In addition, in the transfer type production method, the transfer of particles may basically be performed by bringing a polymer film into contact with the particle introduction surface of the transfer type.

  During the transfer, it is preferable to perform heating and / or pressurization from the viewpoint of improving transferability. The heating and pressurization can be performed using a roll 46 that is involved in the transfer as shown in FIG. 7 or FIG. 8, for example.

When heating is performed at the time of the transfer, the heating temperature is preferably the viscosity of the polymer constituting the polymer film (the one to be cured is the state before curing), preferably 2 × 10 ⁴ Pa · s or less. Is preferably 1.5 × 10 ⁴ Pa · s or less, and more preferably 1 × 10 ⁴ Pa · s or less. This is because the particles can easily bite into the polymer film surface and the transfer rate is improved.

  The viscosity can be measured by a stress control type rheometer (for example, “AR500”, marketed by T.A. Instruments Japan Co., Ltd.).

  Further, when pressure is applied during the transfer, the pressure is not particularly limited. The selection may be made in consideration of the transfer rate, the strength of the polymer film, and the like. Usually, it is about 0.01-1 MPa.

  In the case where the polymer film is made of an adhesive material, the transfer can be performed without particularly heating or pressing.

  Further, a cooling step or the like may be added before the polymer film is peeled off from the particle transfer mold. In particular, when heating is performed during transfer, there is an advantage that the polymer film can be easily peeled off from the particle transfer mold.

  Further, after the transfer of the particles, the obtained particle transfer film may be wound up in a roll shape while attaching a substrate having releasability to the particle transfer surface as necessary.

  Specifically, various thermosetting resins, thermoplastic resins, rubbers, and the like can be used as the material constituting the polymer film. It can be appropriately selected depending on the use of the particle transfer film.

  More specifically, for example, epoxy resins, melamine resins, phenol resins, diallyl phthalate resins, bismaleimide triazine resins, unsaturated polyester resins, polyurethane resins, phenoxy resins, polyamide resins, polyimides Thermosetting resins such as polyamide resins, polyamide resins, polyester resins, polycarbonate resins, polyphenylene oxide resins, polyurethane resins, polyacetal resins, polyvinyl acetal resins, polyethylene resins, polypropylene resins, polyvinyl resins Examples thereof include thermoplastic resins such as, rubbers and elastomers containing one or more functional groups such as hydroxyl group, carboxyl group, vinyl group, amino group, and epoxy group. These may be contained alone or in combination of two or more.

  In these materials, various additives such as a curing agent, a curing accelerator, a modifier, an antioxidant, and a filler may be added, if necessary, one or more.

  The film thickness of the polymer film is not particularly limited, but can be determined in consideration of the application of the particle transfer film, the particle diameter of the particle, the film strength of the polymer film, the manufacturability, and the like.

  For example, when using a particle transfer film for an anisotropic conductive film, the upper limit of the film thickness of the polymer film is easy to obtain an appropriate resistance value, from the viewpoint of the movement of particles during pressure bonding, etc. Preferably, it is not more than 3/2 times the particle size of the particles, more preferably not more than 1 time the particle size of the particles, and more preferably not more than 2/3 times the particle size of the particles.

  On the other hand, the lower limit of the film thickness of the polymer film is preferably 1/10 or more times the particle diameter of the particle, more preferably, from the viewpoint of particle transferability, particle movement during pressure bonding, and the like. The particle size is 1/5 times or more of the particle size, more preferably 1/3 times or more the particle size of the particles.

  The polymer film is prepared by applying a coating liquid prepared from the polymer material so as to have an appropriate solid content and viscosity on a substrate using a known coating means such as a coater. Accordingly, it can be prepared by a method of drying, a method of press-molding the polymer material into a flat film, and the like, and is not particularly limited.

4). This ACF
This ACF uses, as a part thereof, a particle transfer film obtained by the above-described method for manufacturing the transfer film. In this case, the particles basically have conductivity.

  FIG. 9 is a cross-sectional view schematically showing an example of the present ACF. As shown in FIG. 9, the present ACF 50 has a particle transfer film 42 (conductive particles 16, polymer film 40) and an adhesive layer 48.

  The present ACF can be manufactured, for example, as follows. In the particle transfer film, basically, the particles are transferred to one surface of the polymer film, and the transferred particles protrude from the film surface.

  The ACF can be manufactured by coating the transfer surface with an adhesive layer.

  In addition, from the viewpoint of preventing the transferred particles from dropping off, the transferred particles are securely held on the polymer film, and then an adhesive layer is formed on at least one surface of the film. Can be manufactured.

  Examples of the method for holding the transferred particles in the polymer film include (1) a method of pressurizing the particles, and (2) a method of heating and softening the polymer film and burying the particles in the film by the weight of the particles. Etc. can be illustrated. These methods may be performed in combination with each other.

  The method (1) is preferable from the viewpoint of easily holding the particles in the film. More preferably, in the method (1), the particles may be pressurized while heating the polymer film. Specifically, a laminating method or the like can be applied. In addition, the said pressurization can be performed through inclusions, such as a separator, on particle | grains arbitrarily.

  When the pressurization is performed, the applied pressure is not particularly limited. Selection may be made in consideration of film strength, mold strength, film thickness, particle strength, and the like. Usually, it is about 0.01-1 MPa.

  When performing the said heating, the heating temperature is not specifically limited. The heating temperature varies depending on the type of polymer to be used, heat resistance, and the like, but it is preferable to select a temperature of about 20 ° C. to + 40 ° C. of the polymer glass transition temperature. This is because it becomes easier to embed particles in the film.

  All of the particles may be embedded in the film, or a part of the particles may be exposed on at least one surface of the film surface.

  Note that the degree of embedding of the particles can be varied by appropriately adjusting the pressing force, pressurizing time, heating temperature, heating time, and the like.

  On the other hand, as the method for forming the adhesive layer, specifically, for example, a coating liquid prepared so that the adhesive layer material has an appropriate solid content and viscosity can be obtained using known coating means such as a coater. Examples thereof include a method of coating on the holding surface and drying as necessary, and a method of attaching a film-like adhesive layer prepared in advance by the above method.

  Specifically, various thermosetting resins, thermoplastic resins, rubbers, and the like can be used as the material constituting the adhesive layer.

  More specifically, for example, epoxy resins, melamine resins, phenol resins, diallyl phthalate resins, bismaleimide triazine resins, unsaturated polyester resins, polyurethane resins, phenoxy resins, polyamide resins, polyimides Resins, cyanate resins and other thermosetting resins, polyamide resins, polyester resins, polycarbonate resins, polyphenylene oxide resins, polyurethane resins, polyacetal resins, polyvinyl acetal resins, polyethylene resins, polypropylene resins Examples thereof include thermoplastic resins such as polyvinyl resins, rubbers and elastomers containing one or more functional groups such as hydroxyl group, carboxyl group, vinyl group, amino group and epoxy group. These may be contained alone or in combination of two or more.

  In these materials, one or more kinds of additives such as a curing agent, a curing accelerator, a modifier, an antioxidant, and a filler may be added as necessary.

  The material constituting the adhesive layer preferably contains a thermosetting resin mainly from the viewpoint of excellent adhesion to an object to be connected. Of the thermosetting resins, an epoxy resin is preferable.

  In addition, when using a thermosetting resin, the said thermosetting resin may be semi-hardened and made into the prepreg.

  The thickness of the adhesive layer takes into account the height of the conductor (IC chip bump, etc.) of the connected object to be bonded to the adhesive layer, and the amount of gap generated between the connected objects (IC chip and wiring board, etc.). Can be determined.

  The upper limit of the thickness of the adhesive layer is preferably 3 times or less, more preferably 2 times or less, and even more preferably 1.75 times or less the height of the conductor of the connected object to be bonded to the adhesive layer. Good to have.

  The lower limit of the thickness of the adhesive layer is preferably 1 time or more, more preferably 1.2 times or more, and even more preferably 1.3 times the height of the conductor of the connected object to be bonded to the adhesive layer. It is good to be above.

  Hereinafter, the present invention will be described in detail using examples.

1. Production of particle transfer mold (preparation of long polymer substrate)
As a long polymer substrate, a long polyethylene terephthalate film (manufactured by Toray Industries, Inc., “Lumirror T60”, width: 250 mm, thickness: 250 μm) (hereinafter referred to as “PET film”) was prepared.

(Preparation of polymer layer forming composition <1>)
Polycarbonate (manufactured by Aldrich) was diluted with toluene so that the solid content was 50% by mass, and a polymer layer forming composition <1> was prepared.

(Preparation of polymer layer forming composition <2>)
An acrylic monomer (“PAK-02” manufactured by Toyo Gosei Co., Ltd.) was diluted with N-vinyl-pyrrolidone so that the solid content was 50% by mass, and a polymer layer forming composition <2> was prepared. .

(Preparation of flat convex type)
Using a dry etching method, a substantially cylindrical concave portion (cross section: substantially circular shape with a diameter of 5 μm, concave depth: 3.5 μm, tilted at about 8 ° and regularly arranged in a staggered manner on the silicon wafer surface. (Pitch: 9 μm) was formed to produce a Si type.

  Next, this Si mold is used as a base mold, and by using an electroforming method, a substantially cylindrical convex portion (cross section: a substantially circular shape having a diameter of 5 μm, a convex height) that is inclined at about 8 ° and regularly arranged in a staggered manner. A planar convex mold (length: 100 mm, width: 100 mm, thickness: 500 μm) made of Ni having a thickness of 3.5 μm and a pitch of 9 μm was prepared.

(Preparation of roll convex type)
A roll body (diameter: 150 mm) having a Cr plating layer (thickness: 50 μm) on the surface was prepared, and the Cr plating layer was cut with a cutting tool so that it was regularly arranged in a staggered manner at an angle of about 8 °. Protrusions having a substantially prismatic shape (cross section: rhombus shape with a side of 6 μm, convex height: 3.5 μm, pitch: 9 μm) were formed. Thereby, a roll convex mold was prepared.

(Production of particle transfer mold according to Example 1)
Using a die coater, the polymer layer forming composition <1> was applied to one side of a continuously supplied PET film. Then, this coating layer was dried at 100 ° C. for 60 seconds. Thereby, a polycarbonate layer (thickness 10 μm) was laminated on one surface of the long PET film. In addition, this laminated body was wound up in roll shape.

  Next, a convex surface having a flat convex shape (heating temperature of 160 ° C.) and a SUS flat plate (heating temperature of 160 ° C.) were arranged to face each other. Thereafter, the laminate unwound from the roll was supplied between the two, and a flat convex surface was pressed against the surface of the polycarbonate layer (pressing force: 0.5 MPa, pressing time: 5 seconds).

  In addition, unwinding of the laminated body was performed by the step & repeat method. In addition, the above pressing operation was repeated using the optical microscope while aligning the previous pressing position and the current pressing position.

  As a result, a polycarbonate layer is laminated on one surface of the long PET film, and a substantially cylindrical recess (inclined and arranged in a staggered manner at an angle of about 8 ° on the surface of the polycarbonate layer ( A particle transfer mold according to Example 1 having a cross section: a substantially circular shape with a diameter of 5 μm, a concave depth: 3.5 μm, and a pitch: 9 μm was obtained. The obtained particle transfer mold was wound into a roll.

(Production of particle transfer mold according to Example 2)
In the production of the particle transfer mold according to Example 1, a rubber roll (outer diameter 150 mm, heating temperature 160 ° C.) was used instead of a SUS flat plate as a flat convex opposing member, and the film was pressed at 5 mm / mm while pressing. A particle transfer mold according to Example 2 was produced in the same manner except that the run was performed in seconds.

  In the particle transfer mold according to Example 2, as in the particle transfer mold according to Example 1, a polycarbonate layer is laminated on one side of a long PET film, and about 8 on the surface of this polycarbonate layer. It has substantially cylindrical recesses (cross-section: approximately circular shape with a diameter of 5 μm, recess depth: 3.5 μm, pitch: 9 μm) that are regularly arranged in a zigzag pattern with an inclination of °.

(Production of particle transfer mold according to Example 3)
In the production of the particle transfer mold according to Example 1, a roll convex mold (heating temperature 160 ° C.) was used instead of the flat convex mold, and a rubber roll (outer diameter 150 mm, heating temperature) was used as an opposing member of the roll convex mold. 160 ° C), the laminate unwound from the roll is continuously supplied straight between the roll convex mold and the rubber roll, and the roll convex convex surface is not aligned with the surface of the polycarbonate layer. A particle transfer mold according to Example 3 was produced in the same manner except that the point was continuously pressed (pressing force: 0.5 MPa, the film was run at 5 mm / second).

  In the particle transfer mold according to Example 3, a polycarbonate layer is laminated on one surface of a long PET film, and the polycarbonate layer is regularly arranged in a zigzag pattern inclined at about 8 °. It has a substantially prismatic concave portion (cross section: rhombus shape with a side of 6 μm, convex height: 3.5 μm, pitch: 9 μm).

(Production of particle transfer mold according to Example 4)
Using a die coater, the polymer layer forming composition <2> was applied to one surface of a continuously supplied PET film. Then, this coating layer was dried at 70 ° C. for 60 seconds. Thus, an acrylic monomer layer (thickness 10 μm) was laminated on one side of the long PET film. In addition, this laminated body was wound up in roll shape, bonding a separator (A polyethylene terephthalate film, "PET5011" by Lintec Co., Ltd., width: 250 mm, thickness: 50 micrometers) on the acrylic monomer layer. The separator is for preventing ultraviolet curing from being impaired by oxygen in the atmosphere.

  Subsequently, the convex surface of the roll convex type (not heated) and the rubber roll (outer diameter 150 mm, not heated) were arranged to face each other. Thereafter, the laminate unwound from the roll was continuously supplied while being rolled along the roll convex surface, and the convex surface of the roll convex was pressed against the surface of the acrylic monomer layer (pressure: 0. 5 MPa).

At the time of this pressing, the acrylic monomer layer is UV-cured by irradiating ultraviolet rays (10 mJ / cm ² ) from the PET film surface side using an ultraviolet irradiator (high pressure mercury lamp, electrodeless). A polymer layer was obtained.

  As a result, an acrylic polymer layer is laminated on one side of a long PET film, and the surface of the acrylic polymer layer is inclined approximately 8 ° and is arranged in a regular pattern in a staggered manner. A particle transfer mold according to Example 4 having columnar concave portions (cross section: rhombus shape with a side of 6 μm, convex height: 3.5 μm, pitch: 9 μm) was obtained. The obtained particle transfer mold was wound into a roll.

(Production of particle transfer mold according to Example 5)
The convex surface of the roll convex type (not heated) and the rubber roll (outer diameter 150 mm, not heated) were arranged to face each other. Thereafter, the polymer layer forming composition <2> is directly applied to the roll convex surface, and the PET film unwound from the PET film roll is continuously applied along the rubber roll surface and the roll convex surface. By supplying, the acrylic monomer layer was transferred to the surface of the PET film.

At the time of this transfer, the acrylic monomer layer is UV-cured by irradiating ultraviolet rays (10 mJ / cm ² ) from the PET film surface side using an ultraviolet irradiator (high pressure mercury lamp, electrodeless). Layered.

  As a result, an acrylic polymer layer is laminated on one side of a long PET film, and the surface of the acrylic polymer layer is inclined approximately 8 ° and is arranged in a regular pattern in a staggered manner. A particle transfer mold according to Example 5 having columnar concave portions (cross section: rhombus shape with a side of 6 μm, convex height: 3.5 μm, pitch: 9 μm) was obtained. The obtained particle transfer mold was wound into a roll.

2. Production of particle transfer film (preparation of polymer film)
23.39 parts by mass of an alcohol-soluble polyamide resin, 25.16 parts by mass of a phenoxy resin (manufactured by Toto Kasei Co., Ltd., “EFR-0010M30”), and an epoxy resin (manufactured by Toto Kasei Co., Ltd., “FX289EK75 ) 4.9 parts by mass, 2.67 parts by mass of an epoxy resin (manufactured by Toto Kasei Co., Ltd., “FX305EK70”), and a melamine resin (manufactured by Sanwa Chemical Co., Ltd., “Nicarac MX-750”) 1.37 parts by mass, 0.38 parts by mass of a curing agent (manufactured by Shikoku Kasei Co., Ltd., “C11Z”) and 0.57 parts by mass of a curing agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., “F-TMA”) Then, 24.26 parts by mass of methanol, 48.05 parts by mass of toluene, and 69.2 parts by mass of methyl cellosolve were mixed to prepare a polymer solution.

  Next, using a comma coater, coat the above polymer solution on the release surface of a continuously supplied support film (polyethylene terephthalate film, “PET50X” manufactured by Lintec Corporation, width: 250 mm, thickness: 50 μm) did.

  Next, this coating layer was dried at 160 ° C. for 90 seconds to form a flat polymer film (thickness 1.5 μm) made of a resin mainly composed of a polyamide-based resin and a phenoxy-based resin. Thereafter, a release surface of a separator (polyethylene terephthalate film, manufactured by Lintec Corporation, “PET5011”, thickness 50 μm) was attached to the surface of the polymer film, and wound into a roll.

  As a result, a long polymer film mainly comprising a polyamide resin and a phenoxy resin was prepared.

(Preparation of Particle Transfer Film According to Example 1T)
The particle transfer mold according to Example 1 wound in a roll is continuously unwound, and resin plating particles (Sekisui Chemical Co., Ltd. “Micropearl AU-204”) are formed on the concave surface of the traveling particle transfer mold. , Average particle size: 4 μm).

  Then, with a permanent magnet (manufactured by Seiko Sangyo Co., Ltd., ferrite magnet, 1000 gauss) installed on the opposite side of the concave surface, the resin plating particles are attracted to the mold, and the surface is scraped off with a brush. Plated particles were introduced one by one.

  Resin plating particles adhering to the mold surface where no recesses are formed, or resin plating particles adhering to resin plating particles introduced into the recesses due to electrostatic force, etc., are scraped on the surface and are extremely finely adhered. The film was removed by pressing a film (tape having an adhesive strength measured in accordance with JIS Z 0237 of 0.1 N / 25 mm or less, here, using “Viewful EP50LS” manufactured by Kimoto Co., Ltd.).

  Next, the surface of the polymer film unwound from the roll while peeling the separator and the introduction surface of the particle transfer type resin plating particles were overlapped, and this was sandwiched between a pair of heating / pressure rolls and thermally laminated. . At this time, the heating temperature was 120 ° C., the applied pressure was 0.5 MPa, and the line running speed was 5 mm / second.

  Next, the bonded film was gradually cooled by passing between a pair of cooling rolls. Thereafter, the polymer film was peeled off from the particle transfer mold, and the particles were transferred to the surface of the polymer film to obtain a particle transfer film according to Example 1T. The obtained particle transfer film was wound up in a roll shape with a separator (“PET5011” manufactured by Lintec Corporation, width: 250 mm, thickness: 50 μm) attached to the particle transfer surface. Further, the particle transfer mold separated from the polymer film was again wound into a roll shape.

(Preparation of Particle Transfer Film According to Example 2T)
In the production of the particle transfer film according to Example 1T, the particle transfer film according to Example 2T is similarly manufactured except that the particle transfer mold according to Example 2 is used instead of the particle transfer mold according to Example 1. Was made.

(Preparation of Particle Transfer Film According to Example 3T)
In the production of the particle transfer film according to Example 1T, the particle transfer film according to Example 3T is similarly manufactured except that the particle transfer mold according to Example 3 is used instead of the particle transfer mold according to Example 1. Was made.

(Preparation of Particle Transfer Film According to Example 4T)
In the production of the particle transfer film according to Example 1T, the particle transfer film according to Example 4T is similarly manufactured except that the particle transfer mold according to Example 4 is used instead of the particle transfer mold according to Example 1. Was made.

(Preparation of Particle Transfer Film According to Example 5T)
In the production of the particle transfer film according to Example 1T, the particle transfer film according to Example 5T is similarly manufactured except that the particle transfer mold according to Example 5 is used instead of the particle transfer mold according to Example 1. Was made.

3. Production of anisotropic conductive film (preparation of adhesive layer)
1,1,2,2-tetrakis (hydroxyphenylethane) type epoxy resin 22.5 parts by mass, cyclopentadiene type epoxy resin 67.5 parts by mass, carboxyl group-containing nitrile rubber 10 parts by mass, and potential 55.2 parts by mass of a curing agent, 4.5 parts by mass of 1-cyanoethyl-2-undecylimidazole, and 31.1 parts by mass of true spherical silica were added to toluene / ethyl acetate (solid content of 42%). = 75/25 weight ratio) to prepare an adhesive solution.

  Next, the above adhesive solution was applied to a release surface of a continuously supplied support film (polyethylene terephthalate film, “PET50C” manufactured by Lintec Corporation, thickness: 50 μm) using a comma coater.

  Subsequently, this coating layer was dried at 110 ° C. for 90 seconds to form an adhesive layer (thickness: 26 μm). Thereafter, the release surface of a separator (polyethylene terephthalate film, manufactured by Lintec Corporation, “PET5011”, thickness 50 μm) was bonded to the surface of the adhesive layer in a roll shape.

  Thereby, a long adhesive layer was prepared.

(Preparation of anisotropic conductive film according to Example 1A)
The particle transfer film according to Example 1T unwound from the roll with the separator attached is sandwiched between a pair of heating / pressure rolls, and a part of the transferred resin plating particles are embedded in the polymer film to ensure Held. At this time, the heating temperature was 130 ° C., the applied pressure was 0.5 MPa, and the line running speed was 0.5 m / min.

  Next, the separator was peeled off, and the transfer surface of the particle transfer film according to Example 1T was superposed on the surface of the adhesive layer that was unwound from the roll while the separator was peeled off.

  Then, the anisotropic conductive film which concerns on Example 1A was produced by winding up this bonded film in roll shape, cut | judging in multiple to a longitudinal direction.

(Preparation of anisotropic conductive film according to Example 2A)
In the production of the anisotropic conductive film according to Example 1A, the difference according to Example 2A was made in the same manner except that the particle transfer film according to Example 2T was used instead of the particle transfer film according to Example 1T. A isotropic conductive film was produced.

(Preparation of anisotropic conductive film according to Example 3A)
In the production of the anisotropic conductive film according to Example 1A, the difference according to Example 3A was made in the same manner except that the particle transfer film according to Example 3T was used instead of the particle transfer film according to Example 1T. A isotropic conductive film was produced.

(Production of Anisotropic Conductive Film According to Example 4A)
In the production of the anisotropic conductive film according to Example 1A, the difference according to Example 4A was made in the same manner except that the particle transfer film according to Example 4T was used instead of the particle transfer film according to Example 1T. A isotropic conductive film was produced.

(Production of Anisotropic Conductive Film According to Example 5A)
In the production of the anisotropic conductive film according to Example 1A, the difference according to Example 5A was made in the same manner except that the particle transfer film according to Example 5T was used instead of the particle transfer film according to Example 1T. A isotropic conductive film was produced.

  Although one embodiment and one example of the present invention have been described above, the present invention is not limited to the above embodiment and example, and various modifications can be made without departing from the spirit of the present invention. is there.

It is an example of typical sectional drawing of the particle transfer type concerning this embodiment, (a) shows the case where a crevice is a non-through hole, and (b) shows the case where a crevice is a through hole. It is the figure which showed typically the case where a particle | grain is introduce | transduced into the recessed part of the particle transfer type | mold which concerns on this embodiment. It is the figure which showed an example of the state in which particle | grains were introduced into the recessed part paying attention to one certain recessed part, (a) is sectional drawing, (b) is a top view. It is the figure which showed another example of the state in which particle | grains were introduced into the recessed part paying attention to one certain recessed part, (a) is sectional drawing, (b) is a top view. It is the figure which showed typically an example of the method of pressing the plane body which has a convex part on the surface against the surface of a polymer layer, and manufacturing a particle transfer type | mold. It is the figure which showed typically an example of the method of pressing the roll body which has a convex part on the surface against the surface of a polymer layer, and manufacturing a particle transfer type | mold. It is the figure which showed typically an example of the method of manufacturing a particle transfer film | membrane using the particle | grain transfer type | mold (die roll) wound by roll shape. It is the figure which showed typically an example of the method of manufacturing a particle transfer film | membrane using the particle transfer type | mold (die belt) formed in the shape of a belt. It is sectional drawing which showed typically an example of the anisotropic electrically conductive film which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Particle transfer type 12 Polymer base material 14 Polymer layer 14a Concave part 14b Concave formation surface 16 Particle 20 Polymer base material supply roll 22 Coating means 24 Polymer material 26 Temperature control plate 28 Flat body 30 with convex part Mold roll 32 Temperature control roll 34 Roll body 36 having projections Particle introduction part 38 Polymer film supply roll 40 Polymer film 42 Particle transfer film 44 Mold belt 46 Roll 48 involved in transfer Adhesive layer 50 Anisotropic conductive film

Claims (13)

A long polymer base material, and a polymer layer laminated on one surface of the polymer base material,
On the surface of the polymer layer,
A particle transfer mold characterized in that a large number of concave portions for introducing particles are regularly arranged.   2. The particle transfer mold according to claim 1, wherein the concave portion is formed to a depth that allows a part of the introduced particles to be exposed from the concave surface.   3. The particle transfer mold according to claim 1, wherein substantially one particle is introduced per one recess. 4.   4. The polymer according to claim 1, wherein the polymer constituting the polymer layer is one or more selected from a thermoplastic resin, a photocurable resin, and a thermosetting resin. The particle transfer type according to any one of the above. A step of laminating a polymer layer or a precursor layer thereof on one surface of a long polymer substrate;
A step of regularly arranging a plurality of concave portions for introducing particles on the surface of the polymer layer or a precursor layer thereof;
A method for producing a particle transfer mold, comprising: The formation of the recess is as follows:
6. The particle transfer according to claim 5, wherein a flat body, a roll body or a belt body having convex portions corresponding to the concave portions to be formed are pressed against the surface of the polymer layer or precursor layer. Mold manufacturing method.   The method for producing a particle transfer type according to claim 5 or 6, wherein when the precursor layer is laminated, the precursor layer is converted into a polymer layer while forming the concave portion.   Particles characterized by having a step of transferring a polymer layer or a precursor layer thereof, in which a large number of recesses for introducing particles are regularly arranged on one surface of a long polymer substrate. A method for producing a transfer mold. A step of introducing particles into the concave portion of the particle transfer mold according to claim 1;
Transferring the particles introduced into the recesses to the surface of the polymer film;
A method for producing a particle transfer film, comprising:   10. The method for producing a particle transfer film according to claim 9, wherein the particles are substantially introduced one by one for each of the recesses.   The method for producing a particle transfer film according to claim 9 or 10, wherein the film thickness of the polymer film is in a range of 1/10 to 3/2 times the particle diameter of the particles.   The method for producing a particle transfer film according to claim 9, wherein the particles are conductive particles.   An anisotropic conductive film using a particle transfer film obtained by the method for producing a particle transfer film according to claim 12.

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