JP2009151852A - Optical pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical pickup device capable of adjusting the output of a laser light source safely and reliably even with a configuration where a manufacturing process is simplified and costs are low. <P>SOLUTION: The adjust screw HFRb of a half-fixed resistor HFR for adjusting the output of a semiconductor laser is disposed to be adjustable from the backside of the mounting surface of a one-side mounting substrate CB. Thus, the adjust screw HFRb of the half-fixed resistor HFR is reliably rotated to increase the accuracy and freedom of the output adjustment of the semiconductor laser while monitoring the reproduced signal of a power meter or an optical disk disposed oppositely to an objective lens OBJ, thereby enabling efficient short-time adjustment. A worker makes adjustment on a surface of the side opposed to the direction for emitting a luminous flux, and hence safety of the worker is ensured. The substrate CB is a one-side mounting substrate for attaching the half-fixed resistor HFR, and hence the method of manufacturing the optical pickup device is simplified, and costs are reduced as compared with the case of using a both-side mounting substrate or a flexible wiring board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical pickup device, and in particular, can record and / or reproduce information with respect to an optical disc, detect the intensity of a light beam emitted from a laser light source, and use an adjustment element to The present invention relates to an optical pickup device capable of adjusting an output.

  A semiconductor laser mainly used as a laser light source of an optical pickup has an emission power that fluctuates due to temperature fluctuations or aging. However, if this is left unattended, there is a risk that appropriate information recording and / or reproduction cannot be performed. Therefore, in a general optical pickup device, output control is performed by APC (Auto Power Control) driving to stabilize the intensity of a light beam irradiated to an information recording medium such as an optical disk. Yes. In normal APC control, a part of the light beam emitted from the light emitting end face of the semiconductor laser is monitored by a light receiving element, and the output of the monitored light beam is fed back to the drive circuit of the semiconductor laser to keep the laser beam emission power constant. Controlled to keep on.

  By the way, since semiconductor lasers have output variations due to individual differences, it is necessary to adjust the output intensity within a predetermined range for each semiconductor laser when assembled in an optical pickup device. Such adjustment includes a method in which the output intensity of the semiconductor laser assembled in the optical pickup device is measured using a power meter, and the reflected light of the light beam applied to the optical disk is received by the actual optical pickup device. There is a method of adjusting while monitoring the information reproduction signal output from the photodetector, but in either case, the operator uses a semi-fixed resistor provided between the semiconductor laser drive circuit and the semiconductor laser to set the adjustment jig. Adjustment is performed by using and operating. Adjustment using a power meter is performed while a power monitor is installed facing the exit surface of the objective lens, which is an output optical component, and the intensity of the laser light emitted from the objective lens is detected by the power monitor.

Patent Document 1 discloses an optical pickup device in which a semi-fixed resistor used for output adjustment of a semiconductor laser is mounted. More specifically, in the example shown in FIG. 2 of Patent Document 1, the semi-fixed resistor is arranged on a flexible printed wiring board extended to the side surface of the slide base. In the example shown in FIG. 4 of Patent Document 1, the semi-fixed resistor is attached to a flexible printed circuit board that is in close contact so as to close the hole of the slide base, and is arranged so as to be inserted into the hole. The adjustment surface is directed to the side opposite to the side from which the laser light from the objective lens is emitted.
JP-A-11-110784

  In order to explain more specifically, FIG. 13 shows a configuration corresponding to FIG. 2 of the patent document, and FIG. 14 shows a configuration corresponding to FIG. 4 of the patent document. Here, in the prior art shown in FIG. 13, the flexible printed wiring board FPC is attached from the top surface to the side surface of the slide base SB that supports the optical pickup device PU, and the semi-fixed resistor HFR is flexible on the side surface of the slide base SB. It is attached to the printed wiring board FPC and provided so as to protrude. However, in such a configuration, it is necessary to provide a space for attaching the semi-fixed resistor HFR in the slide base SB, and further, there is a problem that the flexible printed wiring board FPC bent along the side surface of the slide base SB is easily peeled off. .

  On the other hand, in the prior art shown in FIG. 14, as shown in FIG. 14 (b), which is a cross-sectional view taken along the line BB in FIG. 14 (a) and viewed in the direction of the arrow, the semi-fixed resistor HFR has a sliding base SB. Is attached to a flexible printed wiring board FPC that is in close contact so as to close the hole AP, and is disposed so as to be inserted into the hole AP, and its adjustment surface HFRb is from the objective lens OBJ (FIG. 14A). It is directed to the side opposite to the side from which the laser beam is emitted (downward in FIG. 14B). However, in such a configuration, a flexible printed wiring board FPC is required in addition to a normal substrate, which increases the number of parts and labor for mounting, resulting in an increase in cost, resulting in an increase in cost.

  On the other hand, it is possible to reduce the cost by mounting the semi-fixed resistor on the single-sided mounting board. However, when mounting a single-sided mounting board to an optical pickup device, in order to avoid a short circuit caused by a carrier that is a housing to which the single-sided mounting board is mounted, the side on which the electronic component is mounted is mounted so that it faces the exit surface side of the objective lens. become. As a result, when the semi-fixed resistor is mounted on the single-sided mounting substrate, the semi-fixed resistor is arranged on the side where the laser light from the objective lens is emitted. However, as shown in FIG. 15, in the adjustment of the semi-fixed resistance using the power meter PM, as described above, the power monitor PM is installed facing the emission surface of the objective lens OBJ of the optical pickup device PU. When adjusting the semi-fixed resistance, the operator WM must insert the adjustment jig J using a slight gap between the single-sided mounting board CB and the power monitor PM, which takes time for adjustment. This leads to an increase in man-hours. In addition, it is generally necessary to pay close attention so that the laser beam LB does not enter the human body, particularly the eyes. In such adjustment, the worker WM looks at the adjustment surface of the semi-fixed resistance. The laser light LB is located on the side from which the laser beam LB is emitted and looks into the space between the single-sided mounting board CB and the power meter PM, and the eyes of the worker WM are emitted from the objective lens OBJ in a closed space. Since it is close to the LB, it is also a problem from the viewpoint of ensuring the safety of the worker WM. On the other hand, in the adjustment of the semi-fixed resistance using the reproduction signal of the optical disk, it is necessary to insert an adjustment jig using a narrower gap between the single-sided mounting board and the optical disk. Connected.

  On the other hand, it is possible to mount a semi-fixed resistor on the opposite side of the output surface of the objective lens of the double-sided mounting board using a double-sided mounting board. There is a problem that labor and man-hours increase, and as a result, the manufacturing cost of the optical pickup device increases.

  The present invention has been made in view of such problems, and provides an optical pickup device capable of adjusting the output of a laser light source safely and reliably while having a low-cost configuration with a simplified manufacturing process. The purpose is to do.

The optical pickup device according to claim 1,
A housing;
A laser light source provided in the housing;
An outgoing optical component provided in the housing;
An optical system provided in the housing for guiding light from the laser light source to the emission optical component;
A single-sided mounting board provided in the housing, having a hole or notch, and mounting an electronic component only on a first surface facing the emission optical component side;
An adjustment element connected to the first surface of the single-sided mounting substrate, having an adjustment surface, and adjusting an output of the laser light source;
The adjustment surface of the adjustment element is arranged to be adjustable from the second surface side which is the back side with respect to the first surface of the one-side mounting substrate through the hole or notch.

  According to the present invention, the adjustment surface of the adjustment element for adjusting the output of the laser light source is disposed so as to be adjustable from the second surface side which is the back side with respect to the first surface of the one-side mounting substrate. Therefore, it is possible to reliably operate the adjustment surface of the adjustment element while monitoring the output of the power meter arranged opposite to the emission surface of the emission optical component or the reproduction signal of the optical disk, The accuracy and flexibility of output adjustment increase, and adjustment can be performed efficiently in a short time. Furthermore, since the adjustment surface of the adjustment element for adjusting the output of the laser light source is arranged so as to be adjustable from the second surface side which is the back side with respect to the first surface of the one-side mounting substrate, Since the worker can make adjustments on the surface opposite to the direction in which the light is emitted, the safety of the worker can be ensured. Further, since the substrate to which the adjustment element is attached is a single-sided mounting substrate, the manufacturing process of the optical pickup device is simplified, and the cost can be reduced as compared with the case where a double-sided mounting substrate, a flexible printed wiring board, or the like is used. Note that “arranged so as to be adjustable from the second surface side” means that the operator can directly operate the hand from the second surface side by accessing the adjustment surface with a bare hand or an adjustment jig. It does not include remote adjustment such as electrical and magnetic.

  According to a second aspect of the present invention, in the optical pickup device according to the first aspect, the housing and the second surface of the single-sided mounting substrate are in contact with each other.

  According to a third aspect of the present invention, there is provided the optical pickup device according to the second aspect, wherein the housing has a hole or a notch, and the adjustment surface of the adjustment element passes through the hole or the notch of the housing. It arrange | positions so that adjustment is possible from the surface side of 2. According to such a configuration, the adjustment can be performed by inserting an adjustment jig through the hole or notch of the housing, and the adjustment can be performed even when the optical pickup device is incorporated in the drive.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the emission optical component is preferably an objective lens.

  According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, when the adjustment element is a semi-fixed resistor, the electric pickup device can be electrically turned by turning a screw or the like provided on the adjustment surface. This is preferable because the mechanical resistance changes.

  An optical pickup device according to a sixth aspect of the invention according to any one of the first to fifth aspects, wherein a plurality of the laser light sources are provided, and a plurality of the adjusting elements are arranged according to the laser light sources, The present invention can be applied to an optical pickup device capable of recording and / or reproducing information in a compatible manner with different types of optical disks.

  According to a seventh aspect of the present invention, in the optical pickup device according to the sixth aspect of the present invention, the adjustment surfaces of the plurality of adjustment elements are the second surface through holes or notches of the single single-sided mounting substrate. It is arranged to be adjustable from the side.

  ADVANTAGE OF THE INVENTION According to this invention, the optical pick-up apparatus which can adjust the output of a laser light source safely and reliably can be provided, although it is the low-cost structure by which the process for preparation was simplified.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. FIG. 1 is a diagram of the optical pickup device according to the present embodiment as viewed from the side where the objective lens is disposed, and FIG. 2 is a diagram of the optical pickup device according to the present embodiment as viewed from the side opposite to the objective lens. It is a figure.

  In FIG. 1, a carrier CY, which is a metal housing, is movable in the left-right direction in the figure while being guided by parallel guide shafts G1 and G2. A substrate CB made of epoxy resin is fixed to one surface of the carrier CY. The substrate CB is a so-called one-side mounting substrate, and in order to avoid a circuit short circuit due to the carrier CY, the first surface on the side shown in FIG. 1 (herein referred to as a mounting surface, the surface in contact with the carrier CY on the opposite side is the first surface). A large number of electronic components (not shown) and connectors CT are mounted only on the second surface. The objective lens OBJ is held movably with respect to the carrier CY by an actuator ACT for a focusing operation and a tracking operation.

  As shown in FIG. 2, a hole CYa is formed in the carrier CY, and a hole CBa is formed in the substrate CB so as to overlap therewith (see FIG. 1). In the hole CBa, two semi-fixed resistors HFR that are adjustment elements are arranged. Here, one semi-fixed resistor HFR is for blue-violet semiconductor laser control, and the other semi-fixed resistor HFR is for red semiconductor laser control.

  FIG. 3 is a perspective view of the semi-fixed resistor HFR disposed in the holes CYA and CBa, and shows the holes CYA and CBa by cutting them. In FIG. 3, the semi-fixed resistor HFR has three metal legs HFRa that also serve as wiring. The end of each metal leg HFRa is soldered to a terminal TL on the mounting surface of the substrate CB, and is connected to an electronic component (not shown in FIG. 3) mounted on the mounting surface of the substrate CB. It constitutes a part of a laser drive circuit. Since the rigidity of the metal legs HFRa is high, the semi-fixed resistor HFR is arranged so as to be suspended in the holes CYA and CBa with the three metal legs HFRa.

  The lower surface side of the semi-fixed resistor HFR in FIG. 3 is an adjustment surface, and an adjustment screw HFRb in which a cross hole (not shown) is formed is disposed on the lower surface side. The holes CYa and CBa have a size through which the adjustment jig J can pass so that the adjustment screw HFRb can be accessed from the lower surface side in FIG. 3, that is, the adjustment surface can be seen from the lower surface side.

  The adjusting screw HFRb is connected to a variable resistor (not shown) arranged in the housing of the semi-fixed resistor HFR, and is rotated using an adjusting jig J in which the adjusting screw HFRb is engaged with the cross hole. By doing so, the resistance between the terminals TL can be changed. The semi-fixed resistor HFR may be a one-turn adjustment type or a multi-turn adjustment type. The internal structure of the semi-fixed resistor HFR is publicly known and is described in, for example, Japanese Patent Application Laid-Open No. 7-29710.

  FIG. 4 is a schematic side view of the optical pickup device PU of the present embodiment, and FIG. 5 is a cross-sectional view of the configuration of FIG. 4 cut along a plane including the VV line and viewed in the arrow direction. The optical pickup device according to the present embodiment can reproduce information on two types of optical disks, BD (Blu-ray Disc) and DVD. A diffraction grating or the like that generates a tracking beam is used. By adding, it is possible to record information. It is preferable that information can be recorded / reproduced on at least one type (for example, three or more types) of optical disks. Here, the objective lens BJ constitutes an outgoing optical component, and a system comprising a blue-violet polarizing beam splitter 6, a rising mirror 4, a collimating lens 3, and a λ / 4 wavelength plate 9, a diffraction grating 6, and a polarizing beam splitter 11. , The blue-violet polarizing beam splitter 6, the rising mirror 4, the collimating lens 3, and the λ / 4 wavelength plate 9 constitute an optical system.

  Next, the operation of the optical pickup device according to this embodiment will be described. 4 and 5, when information is reproduced from the BD, when the first semiconductor laser 5 that is a laser light source is caused to emit light, a laser beam having a wavelength of about 405 nm emitted from the first semiconductor laser 5 is emitted from the blue-violet polarizing beam splitter 6. As shown in FIG. 4, the light is reflected and reflected by the rising mirror 4, but part of the light passes through the rising mirror 4 and is detected by the power monitor 7. A signal from the power monitor 7 is input to the drive circuit APC and used to control the first semiconductor laser 5. On the other hand, the light beam reflected by the rising mirror 4 passes through the collimating lens 3 and the λ / 4 wavelength plate 9 and is condensed on the information recording surface of the BD via the objective lens OBJ.

  The light beam reflected from the information recording surface of the BD passes through the objective lens OBJ, the λ / 4 wavelength plate 9 and the collimator lens 3 and is reflected by the rising mirror 4, and passes through the blue-violet polarizing beam splitter 6 and the polarizing beam splitter 11. Since it passes through and enters the photodetector 13 via the servo lens 12, information can be reproduced from the BD using the output signal.

  Here, a change in the shape of the light spot and a change in the intensity distribution on the photodetector 13 are detected to perform focus detection and track detection. Based on this detection, the actuator ACT can focus and track the objective lens OBJ integrally with the bobbin so that the light beam from the first semiconductor laser 5 is imaged on the information recording surface of the BD. Yes.

  When reproducing information from a DVD, when the second semiconductor laser 15 that is a laser light source emits light, a laser beam having a wavelength of about 660 nm emitted from the second laser beam passes through the diffraction grating 16 and is reflected by the polarization beam splitter 11. Then, the light passes through the blue-violet polarizing beam splitter 6 and is further reflected by the rising mirror 4, but part of the light passes through the rising mirror 4 and is detected by the power monitor 7. A signal from the power monitor 7 is input to the drive circuit APC and used to control the second semiconductor laser 15. On the other hand, the light beam reflected by the rising mirror 4 passes through the collimating lens 3 and the λ / 4 wavelength plate 9 and is condensed on the information recording surface of the DVD via the objective lens OBJ.

  The light beam reflected from the information recording surface of the DVD passes through the objective lens OBJ, the λ / 4 wave plate 9 and the collimator lens 3 and is reflected by the rising mirror 4 to pass through the blue-violet polarizing beam splitter 6 and the polarizing beam splitter 11. Since it passes through and enters the photodetector 13 through the servo lens 12, information can be reproduced from the DVD using the output signal.

  Here, a change in the shape of the light spot and a change in the intensity distribution on the photodetector 13 are detected to perform focus detection and track detection. Based on this detection, the actuator ACT can focus and track the objective lens OBJ integrally with the bobbin so that the light beam from the second semiconductor laser 15 is imaged on the information recording surface of the DVD. Yes.

  Next, a semiconductor laser drive circuit in the optical pickup device according to the present embodiment will be described. FIG. 6 is a circuit diagram showing a semiconductor laser drive circuit APC using the semi-fixed resistor HFR according to the present invention, and shows a circuit for driving the first semiconductor laser 5. The same applies to the second semiconductor laser 15. is there. In FIG. 6, the drive circuit APC inputs the reference voltage from the power source E to one input terminal of the comparator CP, and inputs the output of the comparator CP to the base of the switching transistor ST. The supply voltage to the semiconductor laser 5 is controlled.

  The laser light emitted from the semiconductor laser 5 is received by the power monitor 7, and the output signal of the power monitor 7 is input to the other input terminal of the comparator CP, and via the semi-fixed resistor HFR for power adjustment. Connect to the ground. With this configuration, the output of the semiconductor laser 5 can be controlled according to the amount of light received by the power monitor 7. Note that all the electronic components constituting the drive circuit APC are mounted on the mounting surface of the substrate CB (FIG. 1).

  At the time of assembling the optical pickup device, a power meter or an optical disk (not shown) is arranged facing the objective lens OBJ which is an outgoing optical component, and while watching the output of the power meter or the magnitude of the reproduction signal from the photodetector, As shown in FIG. 3, the operator can adjust the semiconductor laser by rotating the adjustment jig J engaged with the cross hole of the adjustment screw HFRb. The adjustment screw HFb of the semi-fixed resistor HFR can be turned in order to balance the emitted light amount and the received light. If the optical pickup device is arranged so that the top and bottom are reversed with respect to the state shown in FIG. 3 or the axis of the hole is horizontal, the adjustment becomes easier.

  According to the present embodiment, referring to FIGS. 1 and 2, the adjusting screw HFRb of the semi-fixed resistor HFR for adjusting the output of the semiconductor lasers 5 and 15 is mounted on the mounting surface of the one-side mounting board CB (in FIG. 3). Since the upper surface is arranged so that it can be seen from the back side (the lower surface in FIG. 3), the reproduction signal of the power meter or optical disk (not shown) arranged opposite to the objective lens OBJ is monitored securely. Thus, the adjustment screw HFRb of the semi-fixed resistor HFR can be turned to increase the accuracy and flexibility of output adjustment of the semiconductor lasers 5 and 15, and the adjustment can be performed efficiently in a short time. Further, as shown in FIG. 12, by setting the optical pickup device on the measurement base with the objective lens OBJ directed downward, a semi-fixed resistor HFR for adjusting the outputs of the semiconductor lasers 5 and 15 is provided. The adjustment surface is arranged so as to be adjustable from the mounting surface of the one-side mounting board CB (the first surface that is the lower surface in FIG. 12) from the back surface (the second surface that is the upper surface in FIG. 12). Therefore, on the side opposite to the direction in which the laser beam LB is emitted from the objective lens OBJ, the operator WM from above through the hole CBa of the one-side mounting board CB and the hole CYa of the carrier CY (see FIG. 3) Is inserted, and the adjustment screw HFRb (see FIG. 3) of the semi-fixed resistor HFR is reliably accessed for adjustment, so that the safety of the worker WM can be ensured. Further, since the substrate CB to which the semi-fixed resistor HFR is attached is a single-sided mounting substrate, the manufacturing process of the optical pickup device PU is simplified, and the cost can be reduced as compared with the case of using a double-sided mounting substrate or a flexible printed wiring board. .

  FIG. 7 is a view similar to FIG. 3 according to a modification of the present embodiment. In FIG. 7, instead of the hole, the carrier CY is formed with a notch CYa ', and the substrate CB is also formed with a notch CBa' so as to overlap therewith. The notches CYa ′ and CBa ′ have a size through which an adjustment jig (not shown) can pass so that the adjustment screw HFRb of the semi-fixed resistance HFR can be accessed from the lower surface side in FIG. You can see through. In the above embodiment, if the hole CBa or the notch CBa ′ can be seen in the state in which the substrate CB is assembled to the carrier CY, it is necessary to form the hole Cya or the notch Cya ′ in the carrier. Absent.

  9 to 11 are views showing the relationship between the carrier CY as a housing and the one-side mounting board CB. FIG. 9 corresponds to this embodiment, and FIGS. 10 and 11 correspond to the modified examples. ) Is a cross-sectional view, and (b) is a perspective view. In the form of FIG. 9, the entire lower surface (second surface) of the one-side mounting substrate CB is bonded to the upper surface of the carrier CY, and the electronic component EM and the upper surface (first surface) of the one-side mounting substrate CB, A semi-fixed resistor HFR is attached. Although not shown, it is assumed that a laser beam is emitted upward from the upper surface side of the carrier CY in FIG. The adjustment surface HFRb on the lower surface of the semi-fixed resistor HFR can be adjusted by accessing a jig (not shown) from below the carrier CY via the hole CYa of the carrier CY and the hole CBa of the one-side mounting board CB.

  In the modification of FIG. 10, a part of the lower surface (second surface) of the one-side mounting substrate CB is bonded to the upper surface of the carrier CY, and the electronic component is attached to the upper surface (first surface) of the one-side mounting substrate CB. EM and semi-fixed resistor HFR are attached. Although not shown, it is assumed that a laser beam is emitted upward from the upper surface side of the carrier CY in FIG. The adjustment surface HFRb on the lower surface of the semi-fixed resistor HFR can be adjusted by accessing a jig (not shown) from below the carrier CY through the hole CBa of the one-side mounting board CB protruding sideways from the carrier CY. .

  In the modified example of FIG. 11, a part of the upper surface (first surface) of the one-side mounting substrate CB is bonded to the lower surface of the carrier CY, and the electronic component EM and the upper surface of the one-side mounting substrate CB that are not bonded to each other. A semi-fixed resistor HFR is attached. Although not shown, it is assumed that a laser beam is emitted upward from the upper surface side of the carrier CY in FIG. The adjustment surface HFRb on the lower surface of the semi-fixed resistor HFR accesses a jig (not shown) from the lower side (second surface side) of the carrier CY through the hole CBa of the one-side mounting board CB projecting laterally from the carrier CY. Can be adjusted.

  FIG. 8 is a view similar to FIG. 3 according to a modification of the present embodiment. In FIG. 8, the thermistor TT is used as the adjusting element. The thermistor TT is connected to the mounting surface (upper surface in FIG. 8) of the one-side mounting substrate CB, and has an adjustment surface TTa for sensing the external temperature. The adjustment surface TTa is provided on the lower surface side in FIG. 8, and can be seen from the lower surface side in FIG. 8 through the hole CBa of the one-side mounting substrate CB. The resistance is adjusted by bringing a heater, which is an adjustment jig (not shown), close to the lower surface of the hole CBa and adjusting the adjustment surface TTa of the thermistor TT to a predetermined temperature using heat conducted through the hole CBa. Since other configurations are the same as those in the above-described embodiment, the description thereof is omitted.

  The present invention has been described above with reference to the embodiments. However, the present invention should not be construed as being limited to the above-described embodiments, and can be modified or improved as appropriate. For example, a notch may be formed in the carrier and a hole may be formed in the substrate, or a hole may be formed in the carrier and a notch may be formed in the substrate. Furthermore, the number of holes or notches may be the same as the number of semi-fixed resistors.

It is the figure which looked at the optical pick-up apparatus concerning this Embodiment from the side by which the objective lens is arrange | positioned. It is the figure which looked at the optical pick-up apparatus concerning this Embodiment from the opposite side to the objective lens. It is a perspective view of semi-fixed resistance HFR arrange | positioned in hole CYa and CBa. It is a schematic side view of optical pick-up apparatus PU of this Embodiment. It is sectional drawing which cut | disconnected the structure of FIG. 4 by the surface containing a VV line, and looked at the arrow direction. It is a circuit diagram which shows the drive circuit APC of the semiconductor laser using the semi-fixed resistance HFR by this invention. It is a figure similar to FIG. 3 concerning the modification of this Embodiment. It is a figure similar to FIG. 3 concerning the modification of this Embodiment. It is a figure which shows the relationship between the carrier CY which is a housing, and the one-side mounting board | substrate CB. It is a figure which shows the relationship between the carrier CY which is a housing, and the one-side mounting board | substrate CB. It is a figure which shows the relationship between the carrier CY which is a housing, and the one-side mounting board | substrate CB. It is a figure which shows the positional relationship with the operator at the time of adjusting the semi-fixed resistance in this Embodiment. It is a figure which shows the attachment position of the semi-fixed resistance in the optical pick-up apparatus of a prior art. It is a figure which shows the attachment position of the semi-fixed resistance in the optical pick-up apparatus of a prior art. It is a figure which shows the positional relationship with the operator at the time of adjusting the semi-fixed resistance in a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Collimating lens 4 Mirror 5 Blue-violet semiconductor laser 6 Blue-violet polarizing beam splitter 7 Power monitor 9 λ / 4 wavelength plate 11 Polarizing beam splitter 12 Servo lens 13 Photo detector 15 Infrared semiconductor laser ACT Actuator APC Drive circuit CB Substrate CBa 'notch CBa hole CP comparator CT connector CY carrier CYa' notch CYa hole E power supply G1, G2 guide shaft HFR semi-fixed resistor HFRa metal leg HFRb adjustment screw J adjustment jig OBJ objective lens PU optical pickup device ST switching transistor TL terminal TT thermistor

Claims (7)

A housing;
A laser light source provided in the housing;
An outgoing optical component provided in the housing;
An optical system provided in the housing for guiding light from the laser light source to the emission optical component;
A single-sided mounting board provided in the housing, having a hole or notch, and mounting an electronic component only on a first surface facing the emission optical component side;
An adjustment element connected to the first surface of the single-sided mounting substrate, having an adjustment surface, and adjusting an output of the laser light source;
The optical pickup is characterized in that the adjustment surface of the adjustment element is arranged so as to be adjustable from the second surface side which is the back side with respect to the first surface of the one-side mounting substrate through the hole or notch. apparatus.   2. The optical pickup device according to claim 1, wherein the housing and the second surface of the single-sided mounting substrate are in contact with each other.   3. The housing according to claim 2, wherein the housing has a hole or notch, and the adjustment surface of the adjustment element is arranged to be adjustable from the second surface side through the hole or notch of the housing. The optical pickup device described in 1.   4. The optical pickup device according to claim 1, wherein the emission optical component is an objective lens.   The optical pickup device according to claim 1, wherein the adjustment element is a semi-fixed resistor.   6. The optical pickup device according to claim 1, wherein a plurality of the laser light sources are provided, and a plurality of the adjustment elements are arranged according to the laser light sources.   The adjustment surfaces of the plurality of adjustment elements are arranged so as to be adjustable from the second surface side through holes or notches of a single single-sided mounting board. Optical pickup device.