JP2009137599A - Package body with non-contact ic tag, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package with a non-contact IC tag which is capable of being applied even to a package on which the IC tag cannot be provided since it has a narrow width seal, and easily collecting the IC tags. <P>SOLUTION: The non-contact IC tag 10 is inserted between packaging films 2 being superposed on each other, and sealed parts 9 and 12 for sealing the superposed packaging films 2 at least around the non-contact IC tag 10 are formed. A cutting part 11 for taking out the non-contact IC tag 10 is provided in the sealed parts 9 and 12 formed around the non-contact IC tag 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a package with a non-contact IC tag provided with a non-contact IC tag capable of reading and writing information data in a non-contact manner and a method for manufacturing the same.

  In general, there is a tag that applies technology for reading and writing information from and to an IC chip using radio waves. This uses an IC chip with a built-in memory and can read and write information in the tag by wireless communication from a reader / writer. Generally, a wireless tag, a wireless IC tag, RFID (Radio Frequency Identification) Recently, there are UHF tags that are called tags, electronic tags, etc., and have a more secure communication distance. Hereinafter, these are collectively referred to as an IC tag.

  Examples of the medium using the IC tag include a non-contact IC card, an ETC (Electronic toll Collection System), and an operation example for traceability of food, and mounting on a package is one example (Patent Document 1). reference).

  As described above, the advantage of attaching the IC tag to the package is not only the management of inventory, but also the scanning time of the barcode at convenience stores and supermarkets can be greatly shortened in terms of identification, that is, Product information can be read instantly, and the troublesomeness of operations such as scanning is reduced.

  In general, there are many non-contact communication IC tags that are attached to the surface of the package via a seal substrate, etc., in this case, the IC tag is attached to the surface of the package. Therefore, there is a problem that communication reliability is lowered due to damage and peeling.

In order to avoid this problem, there is one in which an IC tag is built in the surface of the package as in the invention disclosed in Patent Document 2. In the present invention, as a method for collecting the IC tag built in the package, the IC tag can be easily collected by incorporating the IC tag in a portion passing on the cutting line of the package.
JP 2003-155062 A JP 2006-69560 A

  However, in the invention disclosed in Patent Document 2, when the spout for extracting the contents is a pouch with a narrow seal, there is a limit to the range in which the IC tag can be attached due to the bag shape.

  Moreover, since the invention disclosed in Patent Document 2 incorporates an IC tag in a portion that passes on the cutting line of the package, the IC tag falls into the package when cut along the cutting line. In this case, there is a problem that it is difficult to collect only the IC tag.

  The present invention has been made in consideration of the above circumstances, and the object of the present invention is applicable to a package that cannot be provided with an IC tag with a narrow seal, and the IC tag can be easily formed. An object of the present invention is to provide a recoverable package with a non-contact IC tag and a method for manufacturing the same.

  In order to solve the above problems, the present invention employs the following configuration. In order to facilitate understanding of the present invention, reference numerals in the accompanying drawings are appended in parentheses, but the present invention is not limited to the illustrated embodiments.

  That is, the invention according to claim 1 includes a non-contact IC tag (10) interposed between the non-contact IC tags (10) at least around the non-contact IC tag (10). A sealing portion (9, 12) for sealing the non-contact IC tag (10) is formed in the seal portion (9, 12) formed around the non-contact IC tag (10). 11) is provided.

  According to a second aspect of the present invention, in the package (1) with a non-contact IC tag according to the first aspect, the cutting portion (11) extends from the seal portion (12) to the non-contact IC tag (10). It is characterized by being a line.

  The invention according to claim 3 is the package (1) with a non-contact IC tag according to claim 1, wherein the cutting part (11) connects the seal part (12) and the non-contact IC tag (10). It is a notch part formed in the edge part of the seal part (12) on a line, It is characterized by the above-mentioned.

  The invention according to claim 4 is the IC tag mounting step of inserting the non-contact IC tag (10) between the packaging films (2) superimposed on each other, and at least the periphery of the non-contact IC tag (10). A seal portion forming step for forming a seal portion (9, 12) for sealing the packaging film (2), and a non-contact IC tag (9, 12) formed on the seal portion (9, 12) formed around the non-contact IC tag (10). And 10) a cutting part forming step for providing a cutting part (11) for taking out the material.

  The invention according to claim 5 is the method for manufacturing a package with a non-contact IC tag according to claim 4, wherein the cutting part forming step is performed before the IC tag mounting step.

  According to the packaging body (1) with a non-contact IC tag according to the present invention, the non-contact IC tag (10) is inserted between the packaging films (2) stacked on each other, and at least around the non-contact IC tag (10). A seal portion (9, 12) for sealing the packaging film (2) superimposed on the non-contact IC tag (10) is formed, and the non-contact IC tag (10) is formed on the seal portion (9, 12) formed around the non-contact IC tag (10). ) Is provided, the non-contact IC tag (10) can be mounted even on a package that cannot be provided with an IC tag with a narrow seal. The selectivity of the mounting location of the IC tag (10) can be improved.

  Further, according to the package (1) with the non-contact IC tag of the present invention, the non-contact IC tag 10 is not provided on the opening cutting line for taking out the contents, so that the opening cutting line is broken. At this time, the non-contact IC tag (10) does not fall into the package (1), and the non-contact IC tag (10) can be easily collected.

  According to the method for manufacturing a package (1) with a non-contact IC tag according to the present invention, an IC tag mounting step of inserting the non-contact IC tag (10) between the packaging films (2) superimposed on each other, and at least A seal part forming step for forming a seal part (9, 12) for sealing the packaging film (2) superimposed around the non-contact IC tag (10), and a non-contact IC tag (10) formed around the non-contact IC tag (10) And a cutting part forming step of providing a cutting part (11) for taking out the non-contact IC tag (10) on the seal part (9, 12), so that the packaging body (1) is not inlined under the in-line of the bag making machine. A contact IC tag (10) can be built in, reducing the risk of peeling due to external damage or deterioration of the seal under the surface of a conventional package, and a non-contact IC tag with high communication reliability Package with a built-in (10) it is possible to provide a (1), it is possible to establish a bag designed to easily recover the non-contact IC tag (10) incorporated in the package (1).

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is a front view showing an embodiment of a package with a non-contact IC tag according to the present invention, and FIG. 2 is an explanatory view showing a state in which the non-contact IC tag of FIG. 1 is collected. In addition, this embodiment is embodiment at the time of applying this invention with respect to a self-supporting package.

  As shown in FIG. 1, the packaging body 1 which is a packaging body with a non-contact IC tag includes a front film 2 of a substantially rectangular soft packaging film and a rear film (not shown) which are overlapped by folding in two or two. A bottom fold film folded in half is provided on the inner surface side of the opposite lower end, and the mouth, upper end, lower end, and both side edges of the front film 2 and the rear film facing each other are heat-sealed, respectively. A portion 3, an upper end seal portion 4, a lower end seal portion 5, and both side end seal portions 6 and 7 are formed. In addition, punch holes 8 and 8 are formed in advance on both side ends of the bottom folded film folded in half. Here, a notch portion (cut portion) 3a is formed at one end of the mouth seal portion 3, and the contents sealed in the package 1 are taken out by breaking the mouth seal portion 3 from the notch portion 3a. be able to.

  The top seal 4 is heat-sealed after filling the contents from the top opening, while the folded bottom film (the bottom folded inner surface is unsealed) is folded in half. By opening it, the area of the bottom of the package is expanded so that it can stand on its own.

  Further, an IC tag mounting seal portion 9 is formed in a substantially "<" shape at the corners of the upper end seal portion 4 and the side end seal portion 7, and the IC tag mounting seal portion 9 and the upper end seal portion are formed. 4 and the non-contact IC tag 10 for electronic information recording / reading are inserted in the inner surface between the front film 2 and the rear film (not shown) surrounded by the side end seal portion 7.

  A recovery cutting line 11 that is broken when the non-contact IC tag 10 is recovered is formed from the side end seal portion 7 to a portion where the non-contact IC tag 10 is mounted. The side end seal portion 7 inside becomes the IC tag protection seal portion 12. That is, two cutting lines 11 extend horizontally from the side end seal portion 7 to the vicinity of the non-contact IC tag 10 and are formed so as to be connected through the non-contact IC tag 10. Here, instead of the cutting line 11, even if a cut portion is formed at the edge of the side end seal portion 7 on the line connecting the side end seal portion 7 and the non-contact IC tag 10, If the side end seal portion 7 is broken, the non-contact IC tag 10 can be easily taken out.

  In the non-contact IC tag 10, for example, product information related to a product or a product to be packaged can be recorded as information data in addition to distribution management information and inventory management information, and only product information may be recorded. The recording of information on the non-contact IC tag 10 may be performed before or after the non-contact IC tag 10 is attached.

  The product information related to the product recorded on the non-contact IC tag 10 includes, for example, product information such as product name, manufacturer, seller, address, telephone number, manufacturing lot, manufacturing date, manufacturing machine, manufacturing person in charge, etc. Cooking recipes, calories, expiration dates, news information, campaign information such as missed prizes and application information, store information, raw material names, raw material producer names, place of origin names, disposal information, etc. are recorded. It is not limited to the information.

  When the non-contact IC tag 10 is collected, the front film 2 and the front film 2 are not illustrated by breaking along the cutting line 11 of the IC tag protection seal portion 12 in the side end seal portion 7 as shown in FIG. The non-contact IC tag 10 can be easily collected by taking out the non-contact IC tag 10 inserted between the rear film.

  As described above, according to the package with the non-contact IC tag according to the present embodiment, the IC tag mounting seal portion 9 and the IC for sealing the front film 2 and the rear film (not shown) superimposed on at least the periphery of the non-contact IC tag 10. By forming the tag protection seal portion 12 and providing the cutting line 11 for taking out the non-contact IC tag 10 in the IC tag protection seal portion 12 formed around the non-contact IC tag 10, a narrow seal Thus, the non-contact IC tag 10 can be mounted even on a package that cannot be provided with an IC tag, and the selectivity of the mounting position of the non-contact IC tag 10 can be enhanced.

  Further, according to the package with the non-contact IC tag of the present embodiment, the non-contact IC tag 10 is not provided on the opening cutting line for taking out the contents, so that when the opening cutting line is broken The non-contact IC tag 10 does not fall into the package 1 and the non-contact IC tag 10 can be easily collected.

  Next, the manufacturing apparatus of the packaging body with a non-contact IC tag of this embodiment and its manufacturing method will be described.

  FIG. 3 is a schematic configuration diagram showing a general bag making machine for producing a package with a non-contact IC tag according to this embodiment, and FIG. 4 shows a process for producing the package with a non-contact IC tag according to this embodiment. It is process drawing.

  As shown in FIG. 3, the general bag making machine is an original fabric mounting unit 21 that feeds and feeds out a plastic film raw material having at least a sealant layer from the upstream side of the manufacturing process, and the plastic film raw material front and back sides. A slit unit 22 that slits (or folds) the film and a heat seal unit 23 that superimposes the plastic film originals on each other and heat-seal (film welds) them with a hot plate arranged on the top and bottom are continuously conveyed. It is roughly divided into a bag cutting unit 24 for punching and cutting a plastic film to complete the packaging bag 1.

  By the way, in this embodiment, for manufacturing the packaging bag 1 which has the IC tag mounting unit 25 which mounts the non-contact IC tag 10 which has a non-contact communication function, and the non-contact IC tag 10 is easily collectable in the market. The IC tag easy recovery manufacturing unit 26 is installed at least upstream of the above-described heat seal unit 23 in the manufacturing process.

  Here, the present embodiment includes a bag making machine in which a plurality of original fabrics wound with plastic films are set on the original fabric attachment unit 21 and the slit unit 22 is removed by superimposing them. Moreover, you may make it use the bag making machine by the gusset-shaped folding method without a slit. Further, the heat seal unit 23 may be any heating medium other than the heated hot plate unit, such as ultrasonic heating or high frequency induction heating. And in the heat seal unit 23 of this embodiment, the temperature fall process of the film in a heat seal part shall also be included by the cooling plate arrange | positioned up and down the plastic film.

(Configuration of IC tag mounting unit)
Next, the configuration of the IC tag mounting unit 25 in the present embodiment will be described.

  The IC tag mounting unit 25 is a unit that sticks the non-contact IC tag 10 to the sealant surface of the plastic film for each package pitch. As a result, the IC chip and the metal antenna, which are components of the non-contact IC tag 10, are sealed by the front and back packaging materials to form an inlet-shaped package.

  The non-contact IC tag 10 may be one in which an IC chip and a metal antenna pattern are electrically connected and previously sealed with another film or the like, but in this embodiment, on the bag making machine, The IC chip and the antenna pattern are handled and joined, respectively.

  In this embodiment, the non-contact IC tag 10 is not directly attached to the sealant layer of the packaging material in order to incorporate the non-contact IC tag 10 in the packaging body film, but the IC is applied to a substrate such as PET (polyethylene terephthalate) or PEF (polyethylene film). A method of stacking a chip and an antenna (including conduction) is adopted. By the way, the reason for not sticking directly to the sealant layer of the packaging material is to prevent the non-contact IC tag 10 from being easily recovered from the package and being damaged.

  As an antenna pattern material, a general metal film such as aluminum or copper is used. In order to laminate this antenna pattern on a plastic film having a melting point different from that of the package (hereinafter referred to as a laminated base material), a metal film lower layer serving as an antenna pattern material is coated with a thermoplastic adhesive in advance. After punching out the antenna pattern, the antenna pattern is mounted on the laminated base material surface by partial heat sealing with a hot plate or the like.

  Here, as a modified example, a film in which an antenna pattern material is previously laminated on a laminated base material such as PET is peeled and removed from a portion that does not become an antenna pattern by half-cut, and an antenna pattern is formed on the laminated base material. It is also possible to use a method of forming Further, although a hot plate is used as a method for mounting the antenna pattern, a diffusion bonding method using ultrasonic waves may be used. Here, the antenna pattern material which becomes extra by the punching is collected using a dust collector.

  Next, a method of stacking IC chips after the antenna pattern is mounted on the above-described stacked base material will be described.

  First, a conductive adhesive is applied on the antenna pattern, and an IC chip is attached and attached to the application portion by a robot arm or the like. The mounted IC chip immediately conducts with the antenna pattern by diffusion bonding, and the non-contact IC tag 10 is formed.

  Subsequently, the non-contact IC tag 10 is continuously formed on the continuous laminated base material by the above method. Hereinafter, the non-contact IC tag 10 continuously formed on the laminated base material is referred to as an IC tag tape. This IC tag tape is cut at a constant pitch, and is loaded and mounted on the inner surface of the film to be a package.

  Here, as a method of loading a single-wafer IC tag, it may be loaded by a robot arm as in the case of handling an IC chip. Alternatively, a method may be used in which the IC tag tape is intermittently conveyed in parallel with the film of the package and cut and mounted at a fixed position.

  As a method of mounting the non-contact IC tag 10, the non-contact IC tag 10 is separated from the package 1 in the market. A method of mounting on the inner surface of the body 1 or a method of immediately welding the periphery of the non-contact IC tag 10 by the heat seal unit 23 when the non-contact IC tag 10 is inserted into the packaging body film is preferable. . That is, first, the upstream side and the downstream side of the non-contact IC tag 10 to be inserted are sealed by a seal unit (side seal unit 23a) perpendicular to the film transport direction to prevent movement due to intermittency.

  At least during this operation, the non-contact IC tag 10 is still handled by the robot arm and follows the intermittent motion. As soon as the seal at the side seal position is completed, the non-contact IC tag 10 and the robot arm are separated.

  Next, the non-contact IC tag 10 temporarily placed between the side seals is heat-sealed in the width direction of the IC tag by a seal unit (vertical seal unit) 23b that is horizontal with respect to the film conveyance direction. The periphery of the IC tag is sealed. In the bag making machine shown in FIG. 3, although the vertical seal unit 23b is disposed on the upstream side of the manufacturing process, this order may be reversed as described above.

  The reason why the periphery of the non-contact IC tag 10 is welded is to prevent the non-contact IC tag 10 from being damaged by direct hot pressing, and heat sealing is performed around the non-contact IC tag 10. The contents of the package 1 serve as a boundary seal surface that protects both liquid and solid matter.

  In order to provide a sufficient non-contact IC tag boundary layer as described above, a reliable seal boundary layer can be obtained by adding a non-contact IC tag dedicated heat seal unit or adding a non-contact IC tag cooling unit. Can be obtained.

  The seal unit dedicated to the non-contact IC tag may be an ultrasonic bonding method without using a hot plate. Furthermore, if the non-contact IC tag 10 is provided in the vicinity of the seal location forming the conventional bag, it can be simultaneously processed as one seal unit by changing the shape of the hot plate. Therefore, the non-contact IC tag 10 mounted on the plastic film that becomes the sealant layer in the bag making machine in-line is in a vertically sealed state.

(Configuration of IC tag easy recovery manufacturing unit)
Next, although the non-contact IC tag 10 is attached for each bag pitch, in order to separate and collect the non-contact IC tag 10 from the packaging body 1 in the market, it is necessary to provide an easy recovery part in a part of the packaging body 1. . In order to form the IC tag easy recovery part, the configuration of the IC tag easy recovery manufacturing unit 26 will be described below.

  Synchronization is performed so that the non-contact IC tag 10 is located at the same place as the place where the non-contact IC tag 10 is attached to a part of the package 1 to form a cutting line 11 for IC tag collection (cutting part forming step).

  At this time, it is desirable that the cutting line 11 of the non-contact IC tag 10 is located at a position directly above the non-contact IC tag 10 built in the package 1. The cutting line 11 is used to process a film on the front and back of the package 1.

  Here, as a processing method of the cutting line for collecting the IC tag, a cutting processing technique provided in a conventional well-known bag making technique such as an ultrasonic cutter, an I-shaped notch blade, or a laser cut can be used.

  However, when cutting (half-cut or the like) processing is performed on the upper layer portion to which the non-contact IC tag 10 is attached, there is a possibility that the non-contact IC tag 10 may be damaged. Processing should be avoided.

  In order to form the cutting line 11, it is necessary to provide at least before the IC tag mounting unit 25 in the manufacturing process.

  In addition, as a mechanism for controlling the transport direction position of the film currently existing on the bag making machine, the non-contact IC tag 10 built in the package 1 is prevented from peeling off from the antenna pattern by the curved dancer roller unit. It is desirable that the dancer roller unit and the nip roller portion are not directly pressed by a grooved roller.

  Therefore, the front and back films of the built-in non-contact IC tag 10 are provided with a cutting line 11 with easy-recoverability of the IC tag, and a heat seal process is performed around the non-contact IC tag 10 so that the package 1 The built-in non-contact IC tag 10 is manufactured.

  Thereby, it is possible to incorporate the non-contact IC tag 10 in the package 1 in-line of the bag making machine, which may cause peeling due to external damage or deterioration of the seal under the surface of the conventional package. It is possible to provide a package 1 that includes a non-contact IC tag 10 with reduced communication reliability.

  Furthermore, while establishing the bag design which collect | recovers the non-contact IC tags 10 incorporated in the package 1 easily, it is possible to provide the package 1.

  Therefore, the present invention is a method of attaching the non-contact IC tag 10 to the package 1 in-line with the bag making machine, and the package is subjected to easy recovery processing in order to improve the market recovery of the IC tag. is there.

  In addition, as a modification of this embodiment, it is applicable also when performing the said process to the location used as the base material of the packaging body 1 which has self-supporting property like a stand pouch, and it restrict | limits to the plastic film used as a trunk | drum. It is not what was done.

  Further, according to the present embodiment, the IC tag can be built in a free position without being limited to the bag shape, the conventional opening cutting line position, and the cutting line width, and can be easily collected. Can do.

  In addition, as a modification of the package 1 incorporating the non-contact IC tag 10 according to the present embodiment, the aluminum layer is not suitable for a film that hinders communication reliability of the non-contact IC tag 10 such as an aluminum layer. In the metal vapor deposition film with the same oxygen / hydrogen permeation level, it was proved that the multilayered package has sufficient communication reliability.

It is a front view which shows one Embodiment of the package body with a non-contact IC tag which concerns on this invention. It is explanatory drawing which shows the state which collect | recovers the non-contact IC tags of FIG. It is a schematic block diagram which shows the general bag making machine for manufacturing the package body with a non-contact IC tag of this embodiment. It is process drawing which shows the process of manufacturing the package body with a non-contact IC tag of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Packaging 2 ... Front film 3 ... Mouth seal part 4 ... Upper end seal part 5 ... Lower end seal part 6 ... Side end seal part 7 ... Side end seal part 8 ... Punch hole 9 ... Seal part for IC tag attachment 10 ... Non Contact IC tag 11 ... Cutting line 12 ... IC tag protection seal part 21 ... Original fabric mounting unit 22 ... Slit unit 23 ... Heat seal unit 24 ... Bag cutting unit 25 ... IC tag mounting unit 26 ... IC tag easy recovery manufacturing unit

Claims (5)

  A non-contact IC tag is inserted between the packaging films stacked on each other, and a seal portion for sealing the stacked packaging film is formed at least around the non-contact IC tag, and is formed around the non-contact IC tag. A package with a non-contact IC tag, wherein a cutting part for taking out the non-contact IC tag is provided in the sealed part. In the package with a non-contact IC tag according to claim 1,
The package with a non-contact IC tag, wherein the cutting part is a cutting line extending from the seal part to a portion where the non-contact IC tag is inserted. In the package with a non-contact IC tag according to claim 1,
The packaging body with a non-contact IC tag, wherein the cutting portion is a cut portion formed at an edge of the seal portion on a line connecting the seal portion and the non-contact IC tag.   An IC tag mounting step of inserting a non-contact IC tag between the stacked packaging films, and a seal portion forming step of forming a seal portion for sealing the stacked packaging film at least around the non-contact IC tag; And a cutting part forming step of providing a cutting part for taking out the non-contact IC tag in a seal part formed around the non-contact IC tag. . In the manufacturing method of the package with a non-contact IC tag according to claim 4,
The method for producing a package with a non-contact IC tag, wherein the cutting part forming step is performed before the IC tag mounting step.

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