JP2009130162A - Method of bonding electronic component and bonded structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem in a method of bonding and a bonded structure using a conventional material of a metal nano paste, that a porous bonded structure is formed by voids generated in a bonded part with heating and the bonded strength becomes low, consequently giving low credibility, associated with the breakage of a bonded part caused by thermal stress or the like. <P>SOLUTION: The bonded strength is increased by disposing a lamination of a bonding material formed by a metal nano paste material on an electrode of a circuit forming body, preliminary disposing a resin for assisting the reinforcement of bonding strength between electrodes of an electronic component or the circuit forming body, and constituting the bonded structure by integrally heating so that the resin can penetrate into voids generated inside the lamination body of the bonding material while melting and curing the resin all over the surface of the electronic component. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a joining structure in which an electronic component is mounted on an electrode on a circuit forming body such as ceramic or polyimide, and a joining method of the joining structure.

  As a method for mounting electronic components such as semiconductor elements on a substrate such as a ceramic or polyimide substrate, in recent years, instead of the conventional direct bonding method using solder bonding or protruding electrodes, metal nanoparticles are used as a bonding material for heating and firing. Thus, the method of joining is attracting attention.

  In this technique, metal fine particles such as Au, Ag, and Cu having an average particle diameter of 100 nm or less (hereinafter referred to as metal nanoparticles) are coated with an organic compound for the purpose of preventing particle aggregation around the metal nanoparticles. The dispersed agent and a paste material in which metal nanoparticles are dispersed in a solvent (hereinafter referred to as a metal nanopaste material) are bonded to each other by heating and firing through a joint between two members.

  The metal nanoparticles have a higher surface activity and a lower melting point than the bulk material due to the miniaturization of the material, and therefore, bonding between metals at a low temperature is possible. When the size is further increased by bonding, it has a property of having a high melting point equivalent to that of the bulk material. Accordingly, in the future, application to a wide range of products that are required to reduce thermal stress during mounting of electronic components and to improve the heat-resistant temperature after mounting (for example, the melting point of Au material is about 1300 ° C.) is expected.

  FIG. 8 shows a conventional electronic component mounting method using metal nanoparticles and metal nanopaste materials as bonding materials. 8 (a1), FIG. 8 (b1), and FIG. 8 (c1) are plan views of the substrate, and FIG. 8 (a2), FIG. 8 (b2), and FIG. 8 (c2) are FIG. 8 (a1), FIG. It is sectional drawing corresponding to FIG.8 (b1) and FIG.8 (c1). An example of the entire surface is the CC plane shown in FIG.

  First, a substrate on which electrodes are formed is prepared (FIGS. 8A1 and 8A2), and then a metal nanopaste material containing metal nanoparticles is used at positions corresponding to the electrodes on the electronic component. Then, the bonding material laminate 9 is formed (FIG. 8 (b1) and FIG. 8 (b2)). Next, the electronic component 3 is mounted so as to face the bonding material laminate 9 on the substrate, By applying energy such as heat, the dispersant for coating the periphery of the metal nanoparticles and the solvent for forming the metal nano paste material are decomposed and volatilized to bond the bonding material laminate 9 containing the metal nanoparticles. Curing is performed to join the electrode on the electronic component 3 and the electrode on the substrate (FIG. 8 (c1) and FIG. 8 (c2)).

  Further, as shown in FIG. 8 (c2), the joint structure of the joint structure of the conventional electronic component 3 is connected and configured in the order of the electrode on the electronic component, the joining member, and the electrode on the substrate. .

As a technique relating to a bonding method using the metal nanoparticles and the metal nanopaste material, for example, a technique disclosed in Patent Document 1 is known.
JP 2005-136399 A

  However, the conventional electronic component mounting method has the following problems specific to the metal nanopaste material.

  9A to 9D show changes in the heat treatment of the metal nanopaste material. In the metal nanopaste material, metal nanoparticles 6, a solvent 8, and a dispersant 7 are present.

  Heat treatment proceeds from FIG. 9A to FIG. 9D. In the first stage of FIG. 9A, the dispersant 7 is firmly attached to the metal nanoparticles 6. In the second stage of FIG. 9B, some of the dispersant 7 is separated from the metal nanoparticles 6. In the third stage of FIG. 9C, the dispersant 7 is completely separated from the metal particles, the metal nanoparticles 6 are in contact with each other, and are melted. In the fourth stage of FIG. 9D, the metal bond is completed.

  Here, when the metal nano paste material 5 is heated and baked to bond the metal particles, the aggregate (joining material) of the aggregate (bonding material) is decomposed and volatilized by the dispersant 7 and the solvent 8 contained in the metal nano paste material 5. Voids (voids) 10 are generated inside and on the outer peripheral surface (FIG. 9 (d), FIG. 8 (C2)) and finally exist in the joint, leading to a decrease in bonding strength and reliability. FIG. 10 shows a cross section of an actual mounting structure. The voids 10 are continuous, resulting in poor connection.

  Furthermore, in the conventional metal bonding using a bulk metal (projection electrode), a method in which an electronic component is reinforced by sealing resin after mounting after mounting is employed. However, in the bonding method using the metal nanopaste material 5, the metal nanoparticle 6 itself is a fine particle, so that the thickness of the bonding material itself in which the metal nanoparticles 6 are laminated is lower than that of the prior art. Since the gap between the three parts becomes narrow, there is a problem that it is difficult to uniformly seal the inside and outside of the electronic component 3 with a resin added later.

  FIG. 11 shows a cross-sectional structure when the electronic component 3 and the circuit forming body 1 are connected when a conventional nanopaste is used. Since the nanopaste material is porous, the viscosity is low, and the metal nanopaste material that is a bonding material is spread when an electronic component is mounted, thereby causing a problem that a short circuit is easily generated between the electrodes.

  Further, in the conventional electronic component bonding structure, the electrodes on the electronic component, the bonding member, and the electrodes on the circuit forming body are connected in the order of layers, and in particular, the thermal expansion between the electronic component 3 and the circuit forming body 1. When the coefficients are different, there is a problem that the joint is broken due to thermal stress in the product environment, and disconnection is likely to occur.

  In order to solve the above problems, the present invention is configured as follows.

As the invention according to claim 1 of the present invention, a circuit formed body having a plurality of electrodes,
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
A bonding material for connecting the circuit forming body and the electronic component;
In a bonded structure comprising:
A bonding structure characterized by having a bonding strength reinforcing resin in a bonding material disposed between electrodes connecting the circuit forming body and the electronic component.

  As invention of Claim 2 in this invention, in the invention of Claim 1, the said resin for joint strength reinforcement is mixed in the clearance gap part of the electrode which is a junction part, and the space | gap part inside the said joining material. A junction structure is used.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the bonding strength reinforcing resin is a bonding structure formed of a resin having non-conductive properties.

  As a fourth aspect of the present invention, in the first to third aspects of the present invention, the bonding strength reinforcing resin is a bonding structure made of a resin having thermosetting or thermoplastic properties. .

As invention of Claim 5 in this invention, in invention of Claims 1 thru | or 4,
The thickness of the bonding strength reinforcing resin is a bonding structure having a structure thinner than the total thickness of the plurality of electrodes of the circuit forming body and the bonding material.

As invention of Claim 6 in this invention, in invention of Claim 1 thru | or 5,
The bonding material has a structure in which ultrafine particles made of a metal having an average diameter of 100 nm or less are coated with a dispersing agent made of an organic compound and laminated using a metal nanopaste material dispersed in a solvent. Use the body.

  As an invention described in claim 7 of the present invention, in the invention of claim 1, a bonding structure is used in which the metal nanopaste material is laminated with a thickness of 10 μm or less in the bonding material.

A circuit forming body having a plurality of electrodes as an invention according to claim 8 of the present invention,
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
A bonding material for connecting the circuit formed body and the electronic component;
In the joining method of the joint structure of an electronic component comprising:
Preparing the circuit forming body having a plurality of electrodes;
A laminate as a bonding material is formed on the plurality of electrodes of the circuit forming body using a metal nanopaste material containing ultrafine particles made of a metal having an average diameter of 100 nm or less,
The bonding reinforcing resin is formed lower than the height of the bonding material between the electrodes of the circuit forming body or between the electrodes on the electronic component that opposes the plurality of electrodes of the circuit forming body. ,
The electronic component is faced to the circuit forming body so that the laminated body does not flow out,
When the laminate is cured by heating, pressurization, or a combination thereof, the bonding reinforcing resin is melted in the voids of the laminate that are generated when the dispersant contained in the metal nanopaste material volatilizes. Uses a bonding structure bonding method characterized in that the electronic components are mounted together while being cured and mixed.

A circuit forming body having a plurality of electrodes as the invention according to claim 9 in the present invention,
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
In a bonding method of a bonded structure of an electronic component comprising a bonding material for connecting the circuit formed body and the electronic component, the circuit formed body having a plurality of electrodes is prepared, and a plurality of the circuit formed body A laminate as a bonding material is formed on the electrodes using a metal nanopaste material containing ultrafine particles made of a metal having an average diameter of 100 nm or less, and between the electrodes of the circuit forming bodies or the circuit forming bodies In the circuit formation body, the resin for bonding reinforcement is formed lower than the height of the bonding material between the electrodes on the electronic component that oppose the plurality of electrodes, so that the laminated body does not flow out. The electronic parts face each other, the laminate is cured by heating, pressing, or a combination thereof, and the bonding reinforcing resin is melted and cured to be disposed in the gap portion of the bonding portion. Joining method of joining structure characterized by performing collectively implementation.

  According to the bonding structure and the bonding method according to the present invention, in the bonding method using the metal nanopaste material, the reduction in the bonding strength of the bonding structure due to voids (voids) generated during bonding and the thermal stress of the product environment A bonding structure and a bonding method for bonding electronic components with high reliability and capable of preventing short-circuiting between electrodes due to metal nanoparticles caused by spreading of the bonding material when bonding electronic components can do. Moreover, the stable reinforcement structure in the joining structure body which becomes low simultaneously can be comprised. These effects can improve the reliability of the bonded structure.

  Before continuing the description of the present invention, the same parts are denoted by the same reference numerals in the accompanying drawings.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
The configuration of the joint structure 18 according to the first embodiment of the present invention will be described with reference to FIGS. 1 (a) and 1 (b). FIG. 1A is a cross-sectional view, and FIG. 1B is a cross-sectional view along the BB ′ plane.

  The joint structure 18 according to the first embodiment is configured as follows. A circuit forming body 1 serving as a base material; a plurality of electrodes 2 formed on the circuit forming body 1; and a plurality of electrodes arranged to face the plurality of electrodes 2 formed on the circuit forming body. The electronic component 3 is bonded to both the electrode 2 on the circuit formed body 1 and the electrode 4 on the electronic component. A bonding material laminate 9 formed by laminating metal nano-paste material containing metal nanoparticles coated with a dispersant composed of an organic compound and a solvent for making the bonding material into a paste or ink, and bonding And a resin 11 for reinforcing joint strength filled in the joint portion constituted by the material laminate 9 and a space other than the joint portion.

  The circuit formed body 1 is composed of a ceramic or polyimide substrate, and the plurality of electrodes disposed on the circuit formed body 1 are, for example, electrodes having a thickness of about 2 to 3 μm (for example, Ni / Au = 1 μm / 1 μm electrode configuration). It consists of

  The plurality of electrodes arranged on the electronic component 3 are configured by electrodes having a thickness of about 2 to 3 μm (for example, electrode configuration of Ni / Au = 1 μm / 1 μm), for example.

  For example, the bonding material laminate 9 is configured by laminating metal nanopaste materials containing metal nanoparticles 6 of 100 nm or less, and the thickness thereof is, for example, 5 μm or less. The electrical connection is made through this.

  Regarding the metal nanopaste material, the metal nanoparticle material is formed of at least one metal material selected from the group consisting of silver, copper, gold, nickel, zinc and bismuth, and has an average particle diameter of 1 to 1 It is composed of metal nanoparticles selected in the range of 100 nm. Further, the metal surface of the metal nanoparticle is formed as ultrafine particles provided with a surface coating layer (dispersant) made of an organic compound such as an amine compound in order to prevent the particles from aggregating when the material is supplied. .

  Furthermore, in order to supply the metal nanoparticles with an ink jet device or the like, and when heated, a dispersion comprising one or more organic solvents having a high boiling point capable of elution and separation of coating molecules such as amine compounds. By uniformly dispersing in the solvent, one or more amine compounds are contained in the range of 0.1 to 60 parts by mass as the total.

  Furthermore, the content of the metal nanoparticles having the surface coating (dispersing agent) when making a paste with a solvent was about 5 wt%. About this content, the weight ratio changes with what is disperse | distributed.

  The bonding strength reinforcing resin 11 has a non-conductive property, is disposed between the electronic component 3 and the circuit forming body 1, and further has voids (voids) present inside the bonding material laminate 9. ) 10 is present.

  The resin 11 having non-conductive properties is made of, for example, a thermosetting resin or a thermoplastic resin such as an acrylic resin or an epoxy resin, and has adhesiveness, insulation, thermal conductivity, low linear expansion, low elasticity, It is desirable that the resin is functionally excellent in terms of migration resistance and heat resistance.

  More specifically, for example, when an epoxy thermosetting resin is taken as an example, a liquid epoxy resin is a main component, a curing agent that cures the resin, an ion exchanger that suppresses the occurrence of ion migration, a coupling, and the like. Agents, etc. In some cases, an inorganic filler made of silica or alumina material may be added to adjust the viscosity of the material or take measures to improve thermal conductivity.

  According to the joining structure 18 according to the first embodiment of the present invention, as shown in FIG. 1A, the joining material laminate 9 disposed between the electrodes that connect the circuit forming body 1 and the electronic component 3. A resin 11 for reinforcing the bonding strength is provided therebetween.

  Here, as a first configuration of the resin 11 for reinforcing the bonding strength, as shown in FIG. 2, the bonding material laminate 9 is interposed between the electrode 2 on the circuit forming body 1 and the electrode 4 on the electronic component 3. Located in.

  Therefore, according to the structure of the present invention, it is possible to reinforce the adhesion strength between the mounted electronic component 3 and the circuit forming body 1 to improve the joint strength, and to insert even if thermal stress due to the product environment occurs in the joint portion. The resin 11 can relieve stress and prevent disconnection due to destruction of the joint.

  Further, since the resin 11 is present between the bonding material laminates 9, the metal nano paste material 5 containing the metal nanoparticles 6 spreads when the electronic component 3 is mounted on the circuit forming body 1, and the adjacent electrode Short circuit between each other can be prevented. In this way, the bonding reliability between the electrodes can be improved.

  Furthermore, in the case of the structure in which the resin layer is formed in the joining region, the heat conductivity of the resin is larger than that of the air layer in which nothing is present, so that there is an effect that heat dissipation can be improved. Further, although not shown in the figure, the heat dissipation can be further enhanced by allowing insulating fine particles having high thermal conductivity such as silica and alumina to be present inside the resin.

  Next, the second configuration of the resin 11 for reinforcing the bonding strength will be described. As shown in FIG. 3, voids (voids) existing inside the bonding material laminate 9 composed of a laminate of metal nanoparticles 6 between the electrode 2 on the circuit forming body and the electrode 4 on the electronic component 3. The resin 10 for reinforcing the bonding strength is also located in the portion 10.

  According to the structure of the present invention, when the electronic component 3 is mounted on the circuit formed body 1 and heated, fired and pressurized, the dispersant 7 coated on the metal nanoparticles 6 included in the metal nanopaste material 5 and By infiltrating the resin 11 for reinforcing the bonding strength into the voids (voids) 10 generated by the decomposition and volatilization of the solvent 8, the bonding strength of the bonding portion is made stronger and the heat generated by the product environment Even if stress is generated in the bonding material laminate 9, the stress can be relieved by the inserted resin 11, and disconnection due to destruction of the bonded portion can be prevented.

  For example, when the void 10 is 30 to 50% of the bonding strength in the Au bulk state, the bonding strength is about 1/3 to 1/2. However, in the structure described in the present invention, the void ( The bonding strength can be improved by about 10 to 30% by allowing the resin 11 for reinforcing the bonding strength to permeate into the porous bonding material laminate 9 with the gap 10). Further, since the resin 11 for reinforcing the bonding strength is also filled between the electronic component 3 other than the bonding material laminate 9 and the circuit forming body 1 (first configuration of the present invention), the bonding structure 18 is further provided. The joint strength can be improved.

  In general, the heat generated from the electronic component 3 releases heat from the joint and its surroundings. However, the influence of the circuit forming body 1 through the electrode 4 and the joint on the electronic component is higher. As shown in FIG. 10 in the conventional example, when a void (gap) 10 exists in the joint portion that is a direct heat path that escapes to the electrode side, the thermal resistance is increased, and thus an efficient heat dissipation structure It is not. According to the structure of the present invention, in the case of a structure in which a resin layer penetrates and mixes in 10 parts of voids (voids) of the joint part, there is an effect that heat dissipation can be improved. Further, although not shown in the figure, the heat dissipation can be further improved by allowing insulating fine particles having high thermal conductivity such as silica and alumina to exist in the resin without affecting the electrical conductivity. .

  In the above description, the materials and dimensions of each member and the joining process have been described by way of example. However, the present invention is not limited to this, and can be modified in various ways.

  Next, an electrode bonding method for the bonded structure 18 according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 4A to FIG. 4F are cross-sectional views showing the procedure of the electrode joining method for the joined structure 18 according to the first embodiment of the present invention. FIG. 5 is a flowchart of the electrode bonding method for the bonding structure 18 according to the first embodiment of the present invention.

  First, a circuit forming body 1 such as a ceramic substrate or a polyimide substrate is prepared (FIG. 4A, step S1 in FIG. 5), and then a metal having an average particle diameter of 100 nm or less is formed on the electrode 2 on the circuit forming body 1. A metal nano paste material 5 containing nanoparticles 6 (for example, the metal composition is Au) is filled and laminated (step S2-1 in FIG. 5). Subsequently, the metal nanopaste material 5 is dried to volatilize most of the solvent 8 (FIG. 4B, step S2-2 in FIG. 5). Here, the metal nanopaste material 5 is composed of metal nanoparticles 6 made of Au having an average particle diameter of about 100 nm, and is dispersed in the solvent 8 in a state where the outer periphery of the particles is coated with a dispersant 7 (organic protective film). Pasted material. By heating this, the dispersant 7 (organic protective film) and the solvent 8 are decomposed and volatilized at a certain temperature, and the surface of the Au metal nanoparticles 6 appears and is bonded using the principle of sintering each other. It was made to function as a material.

  As for the method of filling and laminating the metal nanopaste material 5, for example, if the inkjet device 12 is used, a small amount of paste can be supplied in a non-contact manner with the position corrected on the electrode 2 on the circuit formed body. And by repeating this process several times, the bonding material laminate 9 according to the present invention can be formed. The thickness is 3-5 micrometers, for example. Here, although an example of the laminating method by the ink jet method has been described, other various methods can be utilized by adjusting the viscosity of the paste. Therefore, the present invention is not limited to this, and in various aspects. Deformation is possible.

  On the other hand, the step of supplying the resin 11 for reinforcing the bonding strength is as follows.

  First, the electronic component 3 is prepared (step S3 in FIG. 4 (c) and FIG. 5), and then a thermosetting or thermoplastic property that can be put in between the adjacent electrodes 4 on the electronic component 3. Is supplied (step S4 in FIG. 4D and FIG. 5). The supply method is preferably the inkjet device 12 as in the nanopaste.

  Moreover, although it is the height of the resin 11 to supply, it is preferable that it is lower than the thickness which added the electrode 2 on the circuit formation body 1 and the joining material laminated body 9 together. If the thickness is too low, the resin may not reach the inside sufficiently, and the strength may be insufficient. Conversely, if the thickness is too thick, the electrodes may not be in contact with each other when the electronic component 3 is mounted. This is because there is a possibility of causing a position shift when mounting parts.

  Further, the type of the resin 11 is described here by taking an example in which a thermoplastic resin is applied as an example. In the case of a thermoplastic resin, since it has a property of once applying heat to melt the resin 11 and curing at room temperature in FIG. 4D, it is easy to control the shape creation and the electronic component 3 is easily mounted. . When a thermosetting resin is used, it is inferior to a thermoplastic resin in terms of controlling shape creation, but the process is simple because it is not necessary to apply heat once. In other words, although the process of the joining method is changed, the final joined structure 18 is not changed. Therefore, here, an example using a thermoplastic resin will be described below as an example.

  Next, the members of the circuit forming body 1 and the electronic component 3 prepared in FIGS. 4A to 4D are aligned so that the respective electrodes face each other by inverting the electronic component 3. The electronic component 3 is mounted on the body 1 (step S5 in FIG. 4 (e) and FIG. 5).

  Next, it is possible to bond the electrode 2 on the circuit formed body and the opposing electrodes on the electronic component 3 by baking and curing the bonding member laminate by energy such as heat and electromagnetic waves (FIG. 4 (f ), Step S6 of FIG.

  According to the bonding method of the bonding structure 18 according to the first embodiment of the present invention, the bonding strength is strengthened between the circuit forming body 1 and the bonding material laminate 9 arranged between the electrodes connecting the electronic component 3. 4 by controlling the heating and baking in a lump so that the resin melts at almost the same timing as the dispersant 7 coated with the Au nanopaste decomposes and volatilizes through the resin 11 for use in FIG. As shown in (f) and FIG. 2, it is formed between the electrode 2 on the circuit forming body and the electrode 4 on the electronic component inside the electronic component 3 via a bonding material composed of a laminate of metal nanoparticles 6. It is possible to improve the bonding strength by forming a state of being arranged in a gap portion that becomes a space layer other than the bonding portion, and to reinforce the adhesion strength between the mounted electronic component 3 and the circuit forming body 1 and to improve the product environment. Even if thermal stress occurs due to Insertion resin relieve stress, it is possible to prevent the disconnection due to breakage of the joint portion.

  Moreover, since resin exists between joining parts, when the electronic component 3 is mounted on the circuit formation body 1, or when the metal nano paste material 5 spreads out during heating and baking, adjacent electrodes Can prevent short circuit. In this way, the bonding reliability between the electrodes can be improved.

  Furthermore, in the case of the structure in which the resin layer is formed in the joining region, the heat conductivity of the resin is larger than that of the air layer in which nothing is present, so that there is an effect that heat dissipation can be improved. Further, although not shown in the figure, the heat dissipation can be further enhanced by allowing insulating fine particles having high thermal conductivity such as silica and alumina to be present inside the resin.

  Further, as a second configuration of the resin 11 for reinforcing the bonding strength, as shown in FIG. 3, it is configured by a laminate of metal nanoparticles 6 between the electrode 2 on the circuit forming body and the electrode 4 on the electronic component. By controlling the heating and firing so as to be mixed and formed in the gap 10 inside the joint formed inside the electronic component 3 through the bonded material laminate 9, the electronic component is formed on the circuit formed body 1. 3, when heated, baked and pressurized, the void 7 inside the joint is generated by the decomposition and volatilization of the dispersant 7 and the solvent 8 coated on the metal nanoparticles 6 included in the metal nanopaste material 5. 10, the resin 11 for reinforcing the joint strength is infiltrated to make the joint strength stronger, and even if thermal stress due to the product environment occurs in the joint, the stress is alleviated by the inserted resin, Prevents disconnection due to joint breakage It is possible.

  In general, the heat generated from the electronic component 3 releases heat from the joint and its surroundings. However, the influence of the circuit forming body 1 through the electrode 4 and the joint on the electronic component is higher. In the case where the gap 10 exists in the joint portion that is a direct heat path that escapes to the electrode side, the thermal resistance is increased, so that the heat dissipation structure is not efficient. According to the electrode bonding structure according to the bonding method of the present invention, in the case of the structure in which the resin layer penetrates and mixes in the gap portion 10 of the bonding portion, there is an effect that heat dissipation can be improved. Further, although not shown in the figure, heat dissipation can be further enhanced by allowing insulating fine particles having high thermal conductivity such as silica and alumina to exist in the resin within a range that does not affect the electrical conductivity.

  Specifically, the bulk state thermal conductivity λ when an Au material is used as the bonding material is 293 (W / (m · K)), but the void portion 10 exists in the bonding material laminate 9. In this case, the thermal conductivity λ decreases. When the gap 10 is an air layer, the thermal conductivity λ is 0.025 (W / (m · K)). However, if the resin 11 enters the gap 10, the thermal conductivity λ is 0. 2 to 0.3 (W / (m · K)), which is one digit higher in thermal conductivity, and the thermal conductivity of the entire bonding material laminate 9 is improved. Thus, the heat of the electronic component 3 can be released to the circuit forming body 1.

  In addition, due to the presence of the gap portion 10, the electrical resistivity of the bonding material laminate 9 is high, and it becomes easy for heat to be generated in the bonding material laminate 9 itself by passing an electric current. However, due to the presence of the resin 11 in the gap portion 10. , More heat can be released.

  Furthermore, according to the joining method of the joining structure 18 according to the first embodiment of the present invention, the metal nanopaste is obtained by previously introducing and melting the resin between the electrodes of the electronic component 3 or the circuit forming body 1. Manufacturing of a reinforcing structure to a joint portion having a very narrow joint gap, which can be a unique joint structure 18 when the material 5 is used, can be easily realized.

  By applying such a joining method, the effect is great as a joining and reinforcing method of the joining structure 18 whose upper surface side of the electronic component 3 is a light emitting portion like the LED element 15 and whose height is reduced.

  As described above, according to the bonding method of the bonding structure 18 according to the first embodiment of the present invention, which is a problem specific to the bonding method when the metal nanopaste material 5 is used, Since it is possible to solve a decrease in bonding strength due to the generation of the void 10 and a decrease in reliability associated therewith, it is possible to simultaneously realize a reinforcing structure when the bonding structure 18 is lowered by using the metal nanopaste material 5. The effect is great.

(Second Embodiment)
Next, a specific example to which the embodiment of the present invention is applied will be described by taking the mounting of an LED element as an example. Here, description will be made with reference to FIGS. 6 (a) and 6 (b).

  6A is a cross-sectional view of the bonding structure 18 using the LED element 15, and FIG. 6B is a cross-sectional view taken along the line BB ′ shown in FIG. 6A.

  First, a specific configuration of each component will be described. 6A and 6B, the LED element 15 includes a light emitting element portion formed by laminating a light emitting crystal including a light emitting layer, and a P electrode 16 and an N electrode 17 for electrical connection. It is composed of polar electrodes. The light emitting element portion is a thinned element having a thickness of 200 μm or less. Regarding the electrode configuration, an underlayer of 1 μm or less is formed on the side of the LED element 15 close to the light emitting element portion, and then an electrode (joined portion) with a thickness of 2 μm made of Au material is formed.

  On the other hand, for the circuit-formed body, the base material is the ceramic substrate 13 and the electrode on which the LED elements 15 are mounted is formed with a Ni layer of 1 μm and an Au electrode layer of 1 μm (bonding) in order after forming a foundation layer of 1 μm or less. The total thickness of the substrate is 300 μm.

  In mounting the LED element 15, since only two electrodes exist as described above, there is no need for narrow pitch bonding, and the bonding material can be arranged in a relatively wide area. Therefore, when forming the joining material laminated body 9 with the metal nanopaste material 5, it is preferable to arrange it in a geometrically regular dod shape. By doing so, the heat generated from the light emitting portion can be efficiently radiated to the substrate side.

  Next, the joining method will be described with reference to FIGS. 7 (a) to 7 (f). As shown in FIGS. 7A to 7F (for details, refer to the description of the bonding method using FIGS. 4 and 5), first, an average particle diameter of 10 nm is formed on the electrode 14 on the ceramic substrate. The Au nanopaste obtained by coating the Au nanoparticle with the dispersant 7 and mixing it with the solvent 8 into a paste form is geometrically regularly formed into a dod shape using the inkjet device 12 as described above. Deploy. The thickness was set to 5 μm by repeating the supply of Au nanopaste a plurality of times. Further, for the purpose of volatilizing the solvent 8 in the Au nanopaste to stabilize the shape, it was allowed to stand at room temperature for about 1 hour and dried (FIGS. 7A and 7B).

  Next, the thermosetting resin for reinforcing the bonding strength was supplied and arranged using the inkjet device 12 at a position avoiding the position where the Au nano paste arranged on the ceramic substrate 13 side was arranged on the electrode of the LED element 15. . Moreover, the thickness was made into the thickness below the sum total of the electrode thickness of the ceramic substrate 13, and Au nanopaste laminated body thickness (FIG.7 (c)-(d)).

  Next, the position of the LED element 15 is corrected by a mounter (mounting machine) capable of mounting a semiconductor element, and the Au nanopaste and the LED element 15 on an appropriate position on the ceramic substrate 13 and on the electrodes of the ceramic substrate 13 are implemented. The LED element 15 is mounted so that the thermosetting resin on the other electrode does not interfere (FIG. 7E).

  Next, the bonded ceramic substrate 13 and LED element 15 are gradually heated using a heat supply device such as a vacuum curing furnace (for example, the Au nanoparticle sintering temperature is 200 ° C.).

  Here, the heating process according to the present invention will be described. First, the timing at which the dispersant 7 composed of an organic compound coated with Au nanoparticles is decomposed and volatilized is adjusted to be the same as the temperature at which the thermosetting resin is softened and melted (for example, 130 ° C.). Keep it.

  Usually, in the heating stage, when the above-mentioned certain temperature is reached, the dispersant 7 coated on the outer periphery of the Au nanoparticles is decomposed and volatilized. When heated by heat in this way, the volume of the joint shrinks and at the same time, gas is generated as much as it volatilizes. Therefore, voids, that is, voids 10 are generated inside the bonding material laminate 9 composed of Au nanoparticles. Will be. The void 10 causes the inside of the joining member to be in a porous state, resulting in a decrease in joining strength after joining. Therefore, as described in the present invention, the thermosetting resin for reinforcing the bonding strength is softened and melted at substantially the same timing as when the dispersal / volatilization of the dispersant 7 is started, so that the bonding material laminate on the porous body It is possible to prevent a decrease in the bonding strength by penetrating into the inside (FIG. 3).

  At the same time, since the thermosetting resin can be interposed between the glass substrate 13 and the LED element 15 in a portion (air layer) where nothing other than the bonding material laminate 9 is interposed, The bonding strength can be improved with respect to the bonding surface (FIG. 2).

  Further, as the temperature rises, curing of the thermosetting resin is started (for example, 180 ° C.), and finally the joining is completed when the Au nanoparticle sintering temperature is reached (FIG. 7F). ).

  Further, in this joining method, compared to the conventional method of injecting and hardening the resin 11 for reinforcing the joining strength after the joining, the joining portion is baked and bonded together and the reinforcing resin is cured. Since it can be implemented, the number of steps can be reduced. In addition, since the reinforcing resin is disposed inside in advance, the bonding strength variation due to uneven coating can be suppressed as compared with the method of supplying and infiltrating the resin from one direction as in the case of the last insertion method. In particular, when it is necessary to suppress the creeping of the reinforcing resin with respect to the light emitting surface on the upper surface of the component such as the LED element 15 as compared with the conventional application supply method from the electronic component 3 side, the height is reduced. It is an effective means.

  Furthermore, compared to the bonding structure 18 of the LED element 15 in the case where the reinforcing resin 11 is not configured, a resin whose thermal conductivity is several times to several tens of times higher than the air layer inside the bonding portion is included, so that the LED element. Heat generated from 15 can be efficiently radiated to the ceramic substrate 13 side.

  By the joining method as described above, in the joining using the metal nano paste material 5, the joining reliability of the joining structure 18 can be improved and the various effects described above can be obtained.

  In the above embodiment, the case where each electrode formed of Au nanopaste is bonded by a heating process has been described, but the bonding method is not limited to such a case. Instead of such a case, for example, by applying a pressurizing step at the same time as the heating step and pressing each electrode, deforming the shape and bringing the Au nano paste and the electrode into contact with each other, bonding can be performed. It may be the case where it performs, and the joining method which applied the ultrasonic joining which provides ultrasonic vibration may be sufficient.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  According to the bonding structure and the bonding method according to the present invention, the mounting of LED elements and the mounting of a system LSI that require improved bonding reliability of the bonding structure due to a narrow pitch and a reduction in thickness and height of the bonding portion. It can be applied to a wide range of semiconductor products.

(A) Sectional drawing of the junction structure of a circuit formation body and an electronic component in this invention, (b) is BB 'top view in (a) Sectional drawing which showed the structure around the junction part in the junction structure of a circuit formation body and an electronic component in this invention Sectional drawing which showed the structure inside the junction part in the junction structure of a circuit formation body and an electronic component in this invention Sectional drawing which shows the procedure of the joining method in the joining structure body of a circuit formation body and an electronic component in this invention The flowchart of the joining method in the junction structure of a circuit formation object and an electronic component in the present invention (A) In the present invention, a cross-sectional view (b) of a bonded structure of a ceramic substrate and an LED element is a BB ′ plan view in (a). (A)-(f) is sectional drawing which shows the procedure of the joining method in the joining structure body of a ceramic substrate and an LED element in this invention. (A1) to (c1) Plan views showing a conventional method of joining a circuit structure and an electronic component joining structure, (a2) to (c2) are cross-sectional views of (a1) to (c1), respectively. (A)-(d) is a figure which shows the mechanism of metal nanopaste material coupling | bonding and void generation | occurrence | production. Sectional drawing which shows the example of the void which exists in a junction part in the junction structure of the conventional circuit formation body and an electronic component Sectional drawing which shows the example of a short circuit between junction parts in the conventional junction structure of a circuit formation body and an electronic component

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit formation body 2 Electrode 3 Electronic component 4 Electrode 5 Metal nano paste material 6 Metal nano particle 7 Dispersant 8 Solvent 9 Joining material laminated body 10 Void (void)
DESCRIPTION OF SYMBOLS 11 Resin 12 Inkjet apparatus 13 Ceramic substrate 14 Electrode 15 LED element 16 P electrode 17 N electrode 18 Joining structure

Claims (9)

A circuit formed body having a plurality of electrodes;
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
A bonding material for connecting the circuit forming body and the electronic component;
In a bonded structure comprising:
A bonding structure characterized in that a bonding strength reinforcing resin is included in a bonding material disposed between electrodes connecting the circuit forming body and the electronic component. The bonding structure according to claim 1, wherein the bonding strength reinforcing resin is mixed between the electrodes as the bonding portions and in the voids inside the bonding material. The bonding structure according to claim 1, wherein the bonding strength reinforcing resin is made of a resin having non-conductive properties. The joint structure according to claim 1, wherein the resin for reinforcing the joint strength is made of a resin having a thermosetting property or a thermoplastic property. The thickness of the resin for reinforcing the bonding strength has a structure thinner than the total thickness of the plurality of electrodes of the circuit forming body and the bonding material. 5. A bonded structure according to 4. The bonding material has a structure in which ultrafine particles made of a metal having an average diameter of 100 nm or less are coated with a dispersant made of an organic compound and laminated using a metal nanopaste material dispersed in a solvent. The bonded structure according to claim 1, wherein the bonded structure is characterized in that: The joining structure according to claim 1, wherein the joining material has a thickness of 10 μm or less in which the metal nano paste material is laminated. A circuit formed body having a plurality of electrodes;
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
A bonding material for connecting the circuit formed body and the electronic component;
In the joining method of the joint structure of an electronic component comprising:
Preparing the circuit forming body having a plurality of electrodes;
A laminate as a bonding material is formed on the plurality of electrodes of the circuit forming body using a metal nanopaste material containing ultrafine particles made of a metal having an average diameter of 100 nm or less,
The bonding reinforcing resin is formed lower than the height of the bonding material between the electrodes of the circuit forming body or between the electrodes on the electronic component that opposes the plurality of electrodes of the circuit forming body. ,
The electronic component is faced to the circuit forming body so that the laminated body does not flow out,
When the laminate is cured by heating, pressurization, or a combination thereof, the bonding reinforcing resin is melted in the voids of the laminate that are generated when the dispersant contained in the metal nanopaste material volatilizes. A bonding structure bonding method characterized in that electronic components are mounted together while being cured and mixed. A circuit formed body having a plurality of electrodes;
An electronic component having a plurality of electrodes disposed to face the plurality of electrodes of the circuit forming body,
A bonding material for connecting the circuit formed body and the electronic component;
In the joining method of the joint structure of an electronic component comprising:
Preparing the circuit forming body having a plurality of electrodes;
A laminate as a bonding material is formed on the plurality of electrodes of the circuit forming body using a metal nanopaste material containing ultrafine particles made of a metal having an average diameter of 100 nm or less,
The bonding reinforcing resin is formed lower than the height of the bonding material between the electrodes of the circuit forming body or between the electrodes on the electronic component that opposes the plurality of electrodes of the circuit forming body. ,
The electronic component is faced to the circuit forming body so that the laminated body does not flow out,
While curing the laminate by heating, pressing or a combination thereof,
A bonding structure bonding method characterized by melting and curing the bonding reinforcing resin and collectively mounting electronic components while disposing the resin in a gap portion of the bonding portion.

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