JP2009129506A - Mold structure and imprint method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold structure having stain resistance, excellent vibration resistance, less surface defects, and temporal stability, and to provide an imprint method for maintaining its transfer precision even after a predetermined period by using this mold structure. <P>SOLUTION: This mold structure has a disk shaped substrate, an irregular pattern formed by making many projections on one surface of the substrate, and an adhesive layer formed at least on this surface. This adhesive layer is 0.5 to 15 μm thick and its adhesive power is 0.39 N/20 mm to 3.0 N/20 mm against silicon. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mold structure and an imprint method using the mold structure.

In recent years, hard disk drives excellent in high-speed reading and writing and cost performance have begun to be installed in portable devices such as mobile phones, small audio devices, and video cameras as mainstay storage devices.
As the market share of recording devices mounted on portable devices expands, it is necessary to meet the demand for further miniaturization and larger capacity, and a technique for improving recording density is required.
In order to increase the recording density of the hard disk drive, methods of narrowing the data track interval in the magnetic recording medium and narrowing the width of the magnetic head have been conventionally used.
However, by narrowing the data track interval, the influence of magnetism (crosstalk) between adjacent tracks and the influence of thermal fluctuation cannot be ignored, and the recording density is limited. On the other hand, there is a limit in improving the surface recording density by reducing the width of the magnetic head.

Therefore, a magnetic recording medium called a discrete track medium has been proposed as means for solving the noise caused by the crosstalk. The discrete track media has a discrete structure in which a nonmagnetic guard band region is provided between adjacent tracks to magnetically separate individual tracks, thereby reducing magnetic interference between adjacent tracks ( (See Patent Documents 1 and 2).
Further, as means for solving the demagnetization due to the thermal fluctuation, a magnetic recording medium called a patterned medium in which individual bits for signal recording are provided in a predetermined shape pattern has been proposed (Patent Document 3). reference).

When manufacturing the discrete track media or the patterned media, a resist pattern forming mold structure (hereinafter sometimes referred to as “mold”) is used to form a resist layer formed on the surface of the magnetic recording medium. An imprinting method (imprint process) for transferring a desired pattern is used (see Patent Document 4).
Specifically, this imprinting method applies a thermoplastic resin or a photocurable resin as an imprint resist on a substrate to be processed, and a desired resin is applied to the applied resin. The mold processed into a shape is adhered and pressed, the resin is cured by heating or light irradiation, and the mold is peeled off to form a pattern corresponding to the pattern formed in the mold. This is a method of obtaining a desired magnetic recording medium by performing patterning by dry or wet etching using a pattern as a mask.

  By the way, since the mold is manufactured in a process different from the manufacturing process of the magnetic recording medium, if foreign matter adheres to the surface of the mold (the surface on which the concavo-convex pattern is formed), the mold is brought into close contact with the resist. When the imprint process is performed, the adhesion between the mold and the resist cannot be ensured up to the peripheral area centering on the adhered part of the foreign matter, and the transfer of the pattern of the predetermined signal level is not appropriate. Decreases. That is, there is a problem that the reliability of the magnetic recording medium produced by patterning the magnetic layer formed on the substrate of the magnetic recording medium using the resist as a mask is lowered. In particular, when the recorded signal is a servo signal, there is a problem that the tracking function is not sufficiently obtained and the reliability is lowered.

  In the magnetic transfer master carrier, in order to solve the problem caused by such foreign matter, a protective film is provided on the surface of the master carrier in the transport process before the magnetic transfer process, and after the protective film is removed, the master carrier is brought into close contact with the slave medium. A technique for magnetic transfer is disclosed (see Patent Document 5).

However, the mold used when producing discrete media and patterned media by the above process has a concavo-convex pattern formed on the surface with a line width of 30 nm, so a protective film for protecting the surface of the conventional master carrier is not provided. Even if it is applied as it is, if the ultra-fine concavo-convex pattern cannot be properly protected as described above, it is necessary to form the concavo-convex pattern again, resulting in a significant reduction in mold production yield. Therefore, in order not to bring about such a result, there has been a demand for a mold having an adhesive layer that protects the shape of the concavo-convex pattern formed extremely finely.
In addition, the magnetic transfer master has only a servo pattern and no pattern in the data area, whereas the DTM mold has an extremely fine groove formed in the data portion, and the pattern exists almost on the front surface of the disk. ) Is becoming more serious and is currently being resolved.

Japanese Patent Laid-Open No. 56-119934 JP-A-2-201730 JP-A-3-22211 JP 2004-221465 A JP 2004-110905 A

  This invention is made | formed in view of this present condition, and makes it a subject to solve the said various problems in the past and to achieve the following objectives. That is, the present invention provides a mold structure having low contamination, surface defects, and excellent temporal stability, and an imprint method that maintains transfer accuracy even after a predetermined period of time by using the mold structure. The purpose is to provide.

  As a result of intensive studies, the present inventors have obtained the following knowledge. That is, an adhesive layer having a thickness of 0.5 μm to 15 μm and an adhesive strength of 0.39 N / 20 mm to 3.0 N / 20 mm with respect to silicon is provided on the surface of the mold on the concave / convex pattern forming side, thereby It is the knowledge that the problem is solved.

The present invention is based on the above findings by the present inventors, and means for solving the above problems are as follows. That is,
<1> having a disc-shaped substrate, a concavo-convex pattern in which a plurality of convex portions are formed on one surface of the substrate with reference to the surface, and an adhesive layer on at least the one surface Become
The adhesive layer is a mold structure having a thickness of 0.5 μm to 15 μm and an adhesive strength of 0.39 N / 20 mm to 3.0 N / 20 mm with respect to silicon.
<2> The mold structure according to <1>, wherein the adhesive layer is formed so as to cover substantially the entire surface.
<3> The mold structure according to any one of <1> to <2>, wherein a release layer is formed between the one surface and the adhesive layer.
<4> The mold structure according to any one of <1> to <3>, wherein a support is provided on a surface opposite to the one surface of the adhesive layer.
<5> The mold structure according to any one of <1> to <4>, which is sealed with a sealing layer.
<6> The mold structure according to any one of <1> to <5>, wherein the material of the adhesive layer is a (meth) acrylic acid alkyl ester polymer.
<7> The pressure-sensitive adhesive layer of the mold structure according to any one of <1> to <6> is peeled off and pressed against the imprint resist layer formed of the imprint resist composition formed on the substrate of the magnetic recording medium. The imprint method includes at least a transfer step of transferring the uneven pattern formed on the mold structure.
<8> The imprint method according to <7>, wherein the imprint resist composition has a viscosity of 1 mPa · s to 200 mPa · s.
<9> The pressure-sensitive adhesive layer of the mold structure according to any one of <1> to <6> is peeled off and pressed against the imprint resist layer formed of the imprint resist composition formed on the substrate of the magnetic recording medium. And a transfer process for transferring the concavo-convex pattern,
Using the imprint resist layer to which the concavo-convex pattern is transferred as a mask, the magnetic layer formed on the surface of the substrate of the magnetic recording medium is etched to form the concavo-convex pattern shape of the data area formed on the mold structure A magnetic pattern portion forming step of forming a magnetic pattern portion of the data region based on the magnetic pattern portion of the servo region based on the shape of the uneven pattern of the servo region on the magnetic layer;
A non-magnetic pattern part forming step of embedding a non-magnetic material in the recess formed on the magnetic layer;
A method for manufacturing a magnetic recording medium, comprising:
<10> The method for producing a magnetic recording medium according to <9>, wherein the imprint resist composition has a viscosity of 1 mPa · s to 200 mPa · s.
<11> A magnetic recording medium manufactured using the method for manufacturing a magnetic recording medium according to any one of <9> to <10>.

  In the mold structure of the present invention, as the adhesive layer, a material having a thickness of 0.5 μm to 15 μm and an adhesive strength of 0.39 N / 20 mm to 3.0 N / 20 mm with respect to silicon is employed. It is possible to provide a mold structure that is free from an increase in defects due to the adhesive layer material on the mold surface due to the formation and peeling of the adhesive layer, is less susceptible to environmental influences, has low contamination, and has excellent temporal stability.

  According to the present invention, various problems in the prior art can be solved, a mold structure with low contamination, surface defects, and excellent stability over time, and transfer even after a predetermined period of time by using the mold structure. An imprint method that maintains accuracy can be provided.

Hereinafter, the mold structure of the present invention will be described with reference to the drawings.
(Mold structure)
FIG. 1 is a partial perspective view showing the configuration of the mold structure of the present invention. As shown in FIG. 1, the mold structure 1 presses an object to be processed (for example, an imprint resist layer 25 in FIG. 9 described later), and one surface 2 a (hereinafter, referred to as a disk-shaped substrate 2). A plurality of convex portions formed on the reference surface 2a) and at least an adhesive layer formed so as to cover at least the convex portions 3, and, if necessary, other members. Prepare.

<Board>
There is no restriction | limiting in particular as a material of the board | substrate 2, Although it selects suitably according to the objective, For example, nickel, a silicon | silicone, quartz, glass, aluminum, ceramics, a synthetic resin etc. are mentioned.
As thickness of the board | substrate 2, 100 micrometers-1000 micrometers are preferable, and 200 micrometers-750 micrometers are more preferable.

<< Convex section >>
The convex part 3 has a concave / convex pattern in the data area together with the concave parts 4a formed between the convex parts 3a by arranging the convex parts 3a concentrically at predetermined intervals in the radial direction of the substrate 2. A plurality of convex portions 3b are arranged radially at a predetermined interval in the circumferential direction of the substrate 2 to form a concave / convex pattern in the servo area together with the concave portions 4b formed between the plurality of convex portions 3b. is doing. On the substrate 2, a plurality of the servo areas are formed at substantially equal intervals in the circumferential direction so as to divide the data area.

The servo area is divided into a preamble part, an address part, and a burst part.
The preamble portion is an area in which information for synchronizing the clock of the reproduction signal is recorded.
The address portion is a region where a servo signal recognition code called a servo mark, sector information, cylinder information, and the like are formed by a Manchester code at the same pitch as the pitch in the circumferential direction of the preamble portion. The cylinder information has a pattern in which the information changes for each servo track. For this reason, in order to reduce the influence of an address interpretation error during the head seek operation, code conversion is performed so as to minimize the change from an adjacent track called a gray code, and then the Manchester code is recorded.
The burst portion is an off-track detection area for detecting the off-track amount from the on-track state of the cylinder address, and is a mark having a pattern phase shifted in four radial directions called A, B, C, and D bursts Is formed. In each burst, a plurality of marks are arranged in the circumferential direction at the same pitch cycle as the preamble portion, and the radial cycle is provided in proportion to the change cycle of the address pattern, in other words, in the cycle proportional to the servo track cycle. It has been. In this embodiment, each burst is formed for 10 cycles in the circumferential direction, and has a pattern that repeats in the radial direction at a cycle twice as long as the servo track cycle.

The cross-sectional shape of the convex portion 3 is not particularly limited and is appropriately selected depending on the purpose, and an arbitrary shape can be selected by controlling an etching process described later. For example, a rectangular shape is preferable, A taper shape is more preferable.
Here, in the convex part 3a which forms the uneven | corrugated pattern of a data area, the said cross-sectional shape is a cross-sectional shape in the surface containing the radial direction of the board | substrate 2, and the convex part which forms the uneven | corrugated pattern of a servo area | region In 3b, it is the cross-sectional shape in the surface containing the circumferential direction of the board | substrate 2. As shown in FIG.

<Adhesive layer>
The adhesive layer is a layer provided so as to cover at least the surface 2a side of the substrate 2 (the side on which the concave / convex pattern including the convex portions 3 is formed).
The said adhesion layer is formed by apply | coating an adhesive coating liquid on the uneven | corrugated pattern of a board | substrate, and drying.
The pressure-sensitive adhesive coating solution is a solution containing a pressure-sensitive adhesive polymer as a basic component thereof, and a cross-linking agent having two or more cross-linking reactive functional groups in one molecule for increasing cohesive force or adjusting pressure-sensitive adhesive force. It is an emulsion. In order to adjust the adhesive property, a tackifier such as rosin or terpene resin may be added as appropriate. When the pressure-sensitive adhesive polymer is an emulsion liquid, a film-forming aid such as diethylene glycol monoalkyl ether may be added.

Examples of the pressure-sensitive adhesive polymer constituting the pressure-sensitive adhesive layer include various synthetic rubber polymers having a functional group capable of undergoing a crosslinking reaction with a crosslinking agent. Among these, in consideration of control of adhesive physical properties, reproducibility, etc., alkyl acrylate ester polymers, methacrylic acid alkyl ester polymers, butadiene polymers, isopropylene polymers, styrene butadiene polymers and the like can be mentioned. Among these, acrylic acid alkyl ester polymers and methacrylic acid alkyl ester polymers are preferred. The liquid containing the pressure-sensitive adhesive polymer may be either a solution or an emulsion liquid.
When the pressure-sensitive adhesive polymer is an acrylic acid alkyl ester polymer or a methacrylic acid alkyl ester polymer, the main monomers constituting the pressure-sensitive adhesive polymer are methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, acrylic Examples include methyl acrylate, butyl methacrylate, acrylic acid-2-ethylhexyl, acrylic acid alkyl esters such as methacrylic acid-2-ethylhexyl, and methacrylic acid alkyl esters. These may be used singly or in combination of two or more. It is preferable that the usage amount of the main monomer is usually contained in the range of 60% by mass to 99% by mass in the total amount of all monomers used as the raw material for the pressure-sensitive adhesive polymer.

Examples of comonomers having a functional group capable of reacting with a crosslinking agent to be copolymerized with the main monomer include, for example, acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, itaconic acid monoalkyl ester, maleic acid. Examples include acid monoalkyl esters, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, tertiary-butylaminoethyl acrylate, and tertiary-butylaminoethyl methacrylate. One of these may be copolymerized with the main monomer, or two or more may be copolymerized. The amount of the comonomer having a functional group capable of reacting with the above-mentioned crosslinking agent is usually contained in the range of 1% by mass to 40% by mass in the total amount of all monomers used as the raw material for the pressure-sensitive adhesive polymer. preferable.
Here, in addition to the main monomer constituting the pressure-sensitive adhesive polymer and the comonomer having a functional group capable of reacting with the crosslinking agent, a specific comonomer having a property as a surfactant (hereinafter referred to as a polymerizable surfactant) is used. It may be copolymerized. The polymerizable surfactant has a property of copolymerizing with the main monomer and the comonomer, and also has an action as an emulsifier when emulsion polymerization is performed.

The thickness of the adhesive layer is 0.5 μm to 15 μm, preferably 5 μm to 15 μm, and more preferably 10 μm to 15 μm.
The thickness of the adhesive layer can be measured by using a spectroscopic ellipsometer (MARY-102, manufactured by Five Lab) after obtaining an approximate value by measurement with a Digimatic indicator (ID-CG, manufactured by Mitutoyo Corporation). .
The adhesive strength of the adhesive layer is 0.39 N / 20 mm to 3.0 N / 20 mm with respect to silicon, preferably 1.8 N / 20 mm to 3.0 N / 20 mm, and more preferably 1.8 N / 20 mm. The adhesive strength can be measured by forming a sample on a silicon wafer by spin coating, drying, backing with a PET film, and then measuring a 180 ° peel force at a tensile speed of 300 mm / min.

<< Other parts >>
The other members are not particularly limited as long as they do not impair the effects of the present invention, and can be appropriately selected according to the purpose. For example, the other members are formed in layers on the surface 2a side of the substrate 2, and are adhesive layers. A peeling layer having a peeling function, a support (layer) provided on the surface opposite to the one surface 2a in the adhesive layer, a sealing layer for sealing so as to cover the periphery of the mold 1, etc. Is mentioned.

2A to 2E are cross-sectional views showing the configurations of the adhesive layer, the release layer, and other members in the mold structure of the present invention.
2A is a cross-sectional view of the mold structure shown in FIG. As shown in FIG. 2A, the adhesive layer 5 is formed in a layer on the surface on the surface 2a side, and thus there is an effect of protecting the pattern.
FIG. 2B is a cross-sectional view of the mold structure sealed with the adhesive layer so that the adhesive layer covers substantially the entire surface of the mold structure. As shown in FIG. 2B, the adhesive layer 5 is formed so as to cover substantially the entire surface of the mold structure, and therefore, there is an effect that it is possible to avoid defects from adhering to the mold end surface and the back surface.
FIG. 2C is a cross-sectional view of a mold structure in which a release layer is formed between one surface (a surface on which an uneven pattern is formed) and an adhesive layer. As shown in FIG. 2C, the formation of the release layer 8 has an effect that the release of the adhesive layer is facilitated.
FIG. 2D is a cross-sectional view of a mold structure in which a support is provided on the surface of the adhesive layer opposite to the one surface. As shown in FIG. 2D, the handling property of the pressure-sensitive adhesive is improved by providing the support 6. In addition, there is an effect that environmental influences such as moisture permeating the adhesive can be reduced.
FIG. 2E is a cross-sectional view of a mold structure that is provided with an adhesive layer and a support, and is further sealed with the sealing layer so that the sealing layer covers substantially the entire surface of the mold structure. is there. As shown in FIG. 2E, the formation of the sealing layer 7 has an effect that it is less susceptible to environmental influences such as moisture that permeates through the gap of the adhesive layer.
FIG. 2F is a cross-sectional view of the mold structure sealed to the sealing layer so that the adhesive layer and the support are not provided and the sealing layer covers almost the entire surface of the mold structure. . As shown in FIG. 2F, the formation of the sealing layer 7 has the effect that it is less susceptible to environmental influences such as moisture that permeates through the gap of the adhesive layer, and the adhesive layer forming process can be simplified. is there.

[Peeling layer]
The material of the release layer is not particularly limited as long as it is a water-repellent material that enables smooth release from the imprint resist, and is appropriately selected according to the purpose. For example, methyl nonafluoroisobutyl ether and methyl Examples thereof include a solution composed of nonafluorobutyl ether and a fluorine polymer, or a solution of a perhydropolyoxyalkane dihydrooxypropaneoxymethyl derivative and a fluorine polymer. Specifically, as a commercially available product, EGC-1720 manufactured by 3M Corporation is preferably used.
The viscosity of the release layer material is preferably 3 mPa · s or less, more preferably 1 mPa · s or less, and particularly preferably 0.6 mPa · s or less.
The viscosity of the material of the release layer can be measured using, for example, a viscosity / viscoelasticity measuring apparatus (manufactured by Eiko Seiki Co., Ltd., Rheostress RS600).
The thickness of the release layer is preferably 50 nm or less, more preferably 25 nm or less, and particularly preferably 10 nm or less.
The thickness of the release layer can be measured using, for example, a spectroscopic ellipsometer (manufactured by Five Lab, MARY-102).

[Support]
The said support body functions as an adhesive sheet by integrating with the said adhesion layer.
The material of the support is not particularly limited as long as it is a resin sheet having low dust generation, moderate flexibility, and high adhesion to the pressure-sensitive adhesive, and is appropriately selected according to the purpose. , For example, ethylene vinyl acetate copolymer, polyolefin, polyester, ethylene methacrylic acid copolymer, polybutadiene, soft vinyl chloride resin, polyamide, ionomer resin, and their copolymer elastomers, diene series, nitrile series, silicone And synthetic rubber films such as acrylic and acrylic. Among these, an ethylene vinyl acetate copolymer or polyolefin is preferable, and an ethylene vinyl acetate copolymer is particularly preferable.
The thickness of the support is preferably 70 μm to 200 μm, more preferably 120 μm to 150 μm, and particularly preferably 135 μm.
The thickness of the said adhesion layer can be measured, for example using a Digimatic indicator (the Mitutoyo Corporation make, ID-CG).

[Sealing layer]
The material of the sealing layer is not particularly limited as long as it is an elastic body with little dust generation, and is appropriately selected according to the purpose. Examples thereof include silicone rubber.
The thickness of the material of the sealing layer is preferably 100 μm to 500 μm, and more preferably 300 μm. In addition, the thickness of the said sealing layer can be measured using a Digimatic indicator (Mitutoyo Co., Ltd. make, ID-CG), for example.

<< imprint resist layer >>
The imprint resist layer is a layer formed by applying an imprint resist composition (hereinafter also referred to as “imprint resist solution”) to a substrate of a magnetic recording medium.
There is no restriction | limiting in particular as the imprint resist layer 25, Although it can select suitably from well-known things according to the objective, For example, the imprint containing at least any one of a thermoplastic resin and a photocurable resin is used. It is a layer formed by applying a resist composition (hereinafter also referred to as “imprint resist solution”) to the substrate 40 of the magnetic recording medium. Moreover, as the imprint resist composition for forming the imprint resist layer 13, for example, a novolac resin, an epoxy resin, an acrylic resin, an organic glass resin, an inorganic glass resin, or the like is used.
The thickness of the imprint resist layer 13 is preferably 5% or more and less than 200% with respect to the height of the convex portion formed on the surface 2a of the mold structure 1. If the thickness is less than 5%, the resist amount may be insufficient and a desired resist pattern may not be formed.
The thickness of the imprint resist layer 13 is determined by, for example, partially peeling the imprint resist layer 13 from the substrate on which the imprint resist layer 13 is formed, and measuring the step (height) after the peeling with an AFM apparatus (Dimension 5000, Japan). (Manufactured by Bico Co., Ltd.).

[Viscosity of imprint resist composition]
The viscosity of the imprint resist composition can be measured using, for example, an ultrasonic viscometer. The viscosity of the imprint resist composition is preferably 1 mPa · s to 200 mPa · s at 25 ° C., and more preferably 1 mPa · s to 100 mPa · s.

<Method for producing mold structure>
Hereinafter, an example of a method for producing a mold structure of the present invention will be described with reference to the drawings. The mold structure of the present invention may be produced by a production method other than the production method described below.

[First Embodiment]
FIG. 3 is a cross-sectional view illustrating a method for producing a mold structure according to the first embodiment. As shown in FIG. 3, first, a photoresist solution such as a novolac resin or an acrylic resin is applied on a Si (silicon) substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated, and a predetermined pattern, for example, each track extends linearly from the center of rotation to each track. A pattern corresponding to the servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, the pattern of the removed photoresist layer 21 is used as a mask, selective etching is performed by RIE (Reactive Ion Etching), etc. A mold structure 1 having a pattern is obtained.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having the concavo-convex pattern becomes a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

[Second Embodiment]
4A and 4B are cross-sectional views illustrating a method for producing a mold structure according to the second embodiment.
―Making master disc―
As shown in FIG. 4A, first, a photoresist solution such as a novolac resin or an acrylic resin is applied on a Si (silicon) substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated, and a predetermined pattern, for example, each track extends linearly from the center of rotation to each track. A pattern corresponding to the servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the photoresist pattern as a mask to obtain a master 11 having a concavo-convex shape.

As a method for producing a mold for producing a mold from the master 11, for example, a plating method or a nanoimprint method can be used.
The mold production method by the plating method is as follows.

As shown in FIG. 4B, a conductive film 22 is formed on the surface of the master 11 by sputtering or electroless plating based on the uneven pattern on the surface. Thereafter, the conductive film 22 is formed to a predetermined thickness by plating or the like on the conductive film 22 to produce a substrate 23 having a positive concavo-convex pattern and peeled from the master 11. In this way, the mold structure 1 is obtained.
When forming the substrate 23 by forming the conductive film 22 to a predetermined thickness, the cross-sectional shape of the concave portion of the substrate 23 becomes a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG. To be done.

  As a method of forming the conductive film 22 on the concave / convex pattern of the master 11, a magnetic material is formed by a vacuum film forming means such as a vacuum deposition method, a sputtering method, an ion plating method, a plating method (electroless plating and electroforming), or the like. A method of forming a film is preferred.

  As the material of the conductive film, a metal or alloy containing at least one element among Ni, Cr, W, Ta, Fe, and Co can be used. Among these, Ni, Co, FeCo alloy, etc. Is preferred. Further, a non-metallic material such as TiO showing conductivity can also be used as the conductive film.

Moreover, the range of the convex part height (depth of an uneven | corrugated pattern) H of a board | substrate is preferable in the range of 30 nm-800 nm, and 50 nm-300 nm are more preferable.
Further, when this uneven pattern is a servo burst signal, a rectangular convex portion that is longer in the radial direction than in the circumferential direction is formed. Specifically, the length in the radial direction is preferably 0.05 μm to 20 μm, and the circumferential direction is preferably 0.05 μm to 1 μm. The value of the servo signal is to select a value having a longer shape in the radial direction within this range. It is preferable as a pattern for supporting.

[Third Embodiment]
FIG. 5 is a cross-sectional view showing a method for producing a mold structure according to the third embodiment. As shown in FIG. 5, first, a photoresist solution such as a novolac resin or an acrylic resin is applied on the quartz substrate 30 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the quartz substrate 30, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having the concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIGS. 2A to 2B.

[Fourth Embodiment]
6A to 6B are cross-sectional views illustrating a method for producing a mold structure according to the fourth embodiment. As shown in FIG. 6A, first, a photoresist solution such as a novolak resin or an acrylic resin is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

Next, as shown in FIG. 6B, the master 31 is pressed against the quartz substrate 30 on which the imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin is formed. The pattern of the convex portions formed on the top is transferred to the imprint resist layer 24.
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like, and selective etching is performed by RIE or the like using the pattern as a mask to obtain the mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

[Fifth Embodiment]
7A to 7B are cross-sectional views illustrating a method for producing a mold structure according to the fifth embodiment. As shown in FIG. 7A, first, a photoresist solution such as a novolac resin or an acrylic resin is applied on the Si substrate 10 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the Si substrate 10, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated to form a predetermined pattern on the entire surface of the photoresist, for example, each track linearly from the rotation center to the radial direction. A pattern corresponding to the extended servo signal is exposed to a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain the master 11 having an uneven shape.

Next, as shown in FIG. 7B, the master 11 is pressed against the quartz substrate 30 on which the imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin is formed. The pattern of the convex portions formed on the top is transferred to the imprint resist layer 24.
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like, and selective etching is performed by RIE or the like using the pattern as a mask to obtain the mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

[Sixth Embodiment]
8A to 8B are cross-sectional views illustrating a method for producing a mold structure according to the sixth embodiment. As shown in FIG. 8A, first, a photoresist solution such as a novolac resin or an acrylic resin is applied on the quartz substrate 30 by spin coating or the like to form a photoresist layer 21.
Thereafter, while rotating the quartz substrate 30, a laser beam (or electron beam) modulated in accordance with the servo signal is irradiated, and a predetermined pattern is applied to the entire surface of the photoresist layer 21, for example, each track in the radial direction from the rotation center. A pattern corresponding to a linearly extending servo signal is exposed at a portion corresponding to each frame on the circumference.
Thereafter, the photoresist layer 21 is developed, the exposed portion is removed, and selective etching is performed by RIE or the like using the pattern of the removed photoresist layer 21 as a mask to obtain a master 31 having an uneven shape.

Next, as shown in FIG. 8B, the master 31 is pressed against the quartz substrate 30 on which the imprint resist layer 24 formed by applying an imprint resist solution containing a photocurable resin is formed. The pattern of the convex portions formed on the top is transferred to the imprint resist layer 24.
Thereafter, the transferred pattern is cured by irradiating the imprint resist layer 24 with ultraviolet rays or the like, and selective etching is performed by RIE or the like using the pattern as a mask to obtain the mold structure 1 having an uneven shape.
The selective etching is performed so that the cross-sectional shape of the concave portion of the mold structure 1 having a concavo-convex shape is a cross-sectional shape obtained by transferring the cross-sectional shape of the convex portion 3 shown in FIG.

  In the first to sixth embodiments, exposure and development are performed using a positive type photoresist, but a mold having a pattern symmetrical to the present embodiment is obtained by using the resist solution as a negative type. A structure can also be manufactured. Therefore, the application of the photoresist in the present embodiment is not particularly limited, and either a negative photoresist or a positive photoresist is appropriately selected according to the purpose.

  Alternatively, the master may be plated to produce a second master, and the second master may be used for plating to produce a substrate having a negative uneven pattern. Further, even if the second master is plated or the resin liquid is pressed and cured to produce a third master, the third master is plated, and a substrate having a positive uneven pattern is produced. Good.

Furthermore, in the said 4th-6th embodiment, although the imprint resist liquid containing a photocurable resin was apply | coated on a board | substrate and embodiment formed to form the imprint resist layer 24, photocurable resin was demonstrated. Instead of or in addition to the photocurable resin, a thermoplastic resin may be included in the imprint resist solution.
When the thermoplastic resin is contained in the imprint resist liquid, the pattern of the convex portion is transferred to the imprint resist layer 24 while being maintained near the glass transition temperature (Tg) of the thermoplastic resin, and then the imprint resist layer 24. The transferred pattern is cured by lowering the glass transition temperature below the glass transition temperature of the thermoplastic resin, and selective etching is performed by RIE using the pattern as a mask to obtain a mold structure 1 having an uneven shape. .

Here, the material of the substrate 30 is not particularly limited and may be appropriately selected according to the purpose as long as it is a material having optical transparency and functioning as the mold structure 1. SiO ₂ ) and organic resins (PET, PEN, polycarbonate, low melting point fluororesin) and the like.
The “having light transmittance” specifically means that light is incident from the other surface of the substrate 30 so as to be emitted from one surface where the imprint resist layer 24 is formed on the substrate 30. In this case, it means that the imprint resist solution is sufficiently cured, and at least means that the light transmittance of light having a wavelength of 200 nm or more from the other surface to the one surface is 50% or more. .
The “strength functioning as a mold structure” means that the imprint resist layer 24 formed on the substrate 30 is pressed against the imprint resist layer 24 under the condition that the average surface pressure is 1 kgf / cm ² or more. Also means strength that does not break in a peelable manner.

<Method for producing magnetic recording medium>
Hereinafter, a method for manufacturing a magnetic recording medium such as a discrete track medium and a patterned medium manufactured using the mold structure of the present invention will be described with reference to the drawings. However, the magnetic recording medium according to the present invention may be manufactured by a manufacturing method other than the following manufacturing method as long as it is manufactured using the mold structure according to the present invention.

  As shown in FIG. 9, the mold structure 1 is pressed against a substrate 40 of a magnetic recording medium in which a magnetic layer 50 and an imprint resist layer 25 formed by applying an imprint resist solution are formed in this order. By applying pressure, the uneven pattern of the data area and the uneven pattern of the servo area formed on the mold structure 1 are transferred to the imprint resist layer 25.

Here, as the imprint resist layer 25 in the production of the magnetic recording medium, the same imprint resist composition as the imprint resist layer 24 in the production of the mold structure may be employed.
Hereinafter, unless otherwise specified, the imprint resist layer and the imprint resist composition refer to the imprint resist layer 25 in the production of the magnetic recording medium and the imprint resist composition that forms the imprint resist layer 25. And

Thereafter, the imprint resist layer 25 to which the concave / convex pattern in the data area and the concave / convex pattern in the servo area are transferred is used as a mask to perform an etching process to form the concave / convex pattern formed on the mold structure 1 on the magnetic layer 50. Then, after embedding a nonmagnetic material in the recess to form the nonmagnetic layer 70 and planarizing the surface, other steps such as forming a protective film are performed as necessary to obtain the magnetic recording medium 100.
The etching step is a step of forming a concavo-convex shape based on the resist concavo-convex pattern shape formed in the imprint resist layer 25 in the data region on the magnetic layer 50 in the data region.
As the method for forming the uneven shape, for example, techniques such as ion beam etching, reactive chemical etching, and wet etching can be used.
Ar can be used as a process gas in ion beam etching, and CO + NH ₃ , chlorine gas, or the like can be used as an etchant in reactive chemical etching.
As the other steps, if necessary, the recesses of the magnetic layer are filled with SiO ₂ , carbon, alumina; a polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS); a nonmagnetic material such as lubricating oil. Examples thereof include a step, a step of flattening the surface, a step of forming a protective film with DLC (diamond-like carbon) or the like on the flattened surface, and finally a step of applying a lubricant.

  Examples of the present invention will be described below, but the present invention is not limited to the following examples.

Example 1
<Production of mold structure>
-Production of master-
An electron beam resist was applied to a thickness of 100 nm on a disk-like Si substrate having a diameter of 8 inches by using a spin coating method.
By exposing and developing a desired pattern with a rotary electron beam exposure apparatus, the electron beam resist having a concavo-convex pattern was formed on a Si substrate.
Using the electron beam resist having a concavo-convex pattern as a mask, a reactive ion etching process is performed on the Si substrate to form a concavo-convex shape on the Si substrate.
The remaining electron beam resist was removed by washing with a soluble solvent and dried to obtain a master.

Here, as the concavo-convex pattern in the data region, the width of the convex portion was 120 nm, and the width of the concave portion was 30 nm (track pitch = 150 nm).
The uneven pattern in the servo area has a reference signal length of 80 nm, a total number of sectors of 120, a preamble portion (45 bits), a SAM portion (10 bits), a SectorCode portion (8 bits), a CylinderCode portion (32 bits), and a burst portion. Was made up of.
The SAM portion is “0000101011”, and the uneven pattern in the SectorCode portion is formed by using the binary conversion, and the uneven pattern in the cylinder code portion is formed by using the Gray conversion, and finally by using the Manchester conversion. To be formed.
The uneven pattern in the burst portion was a general phase burst signal (16 bits).

-Electroforming process-
A Ni (nickel) conductive film having a thickness of 20 nm was formed on the master by sputtering. The master after forming the conductive film was immersed in a sulfamic acid Ni bath kept at 55 ° C., and an Ni film having a thickness of 200 μm was formed by electrolytic plating. Then, it was immersed in the pure water in the peeling tank kept at 55 degreeC, and Ni film | membrane was peeled from the original disk. Thus, a Ni mold structure 1 was produced.

<Formation of adhesive layer>
Spin coating method while controlling the number of revolutions of the adhesive layer material (acrylic resin) on the surface of the mold structure 1 produced as described above on which the concave / convex pattern is formed, so that the thickness is 15 μm. Formed by. Thus, a mold structure of Example 1 was produced.

<Preparation of magnetic recording medium>
Each layer was formed on a 2.5-inch glass substrate by the following procedure to produce a magnetic recording medium.
The produced magnetic recording medium has a soft magnetic layer, a first nonmagnetic alignment layer, a second nonmagnetic alignment layer, a magnetic layer (sometimes referred to as a “magnetic recording layer”), a protective layer, and a lubricant layer in this order. Is formed.
The soft magnetic film, the first nonmagnetic alignment layer, the second nonmagnetic alignment layer, the magnetic recording layer, and the protective layer were formed by a sputtering method, and the lubricant layer was formed by a dip method.

<Formation of soft magnetic layer>
As the soft magnetic layer, a layer made of CoZrNb was formed with a thickness of 100 nm.
Specifically, the glass substrate was placed facing the CoZrNb target, Ar gas was introduced to a pressure of 0.6 Pa, and a film was formed at DC 1,500 W.

<Formation of first nonmagnetic alignment layer>
A Ti layer having a thickness of 5 nm was formed as the first nonmagnetic alignment layer.
Specifically, the first nonmagnetic alignment layer is placed opposite to the Ti target, Ar gas is flowed to a pressure of 0.5 Pa, discharge is performed at DC 1,000 W, and the thickness is 5 nm. A Ti seed layer was formed.

<Formation of Second Nonmagnetic Orientation Layer>
Thereafter, a Ru layer having a thickness of 10 nm was formed as a second nonmagnetic alignment layer.
After the first nonmagnetic alignment layer is formed, it is placed facing the Ru target, Ar gas is introduced to a pressure of 0.5 Pa, discharge is performed at DC 1,000 W, and the thickness is 10 nm. A Ru layer was formed as the second nonmagnetic alignment layer.

<Formation of magnetic recording layer>
Thereafter, a CoCrPtO layer having a thickness of 15 nm was formed as a magnetic recording layer.
Specifically, it was placed facing the CoPtCr target, Ar gas containing 0.04% O ₂ was introduced at a pressure of 18 Pa, and discharged at DC 290 W to form a magnetic recording layer.

<Formation of protective layer>
After the magnetic layer was formed, it was placed facing the C target, Ar gas was flowed in so that the pressure became 0.5 Pa, discharged at DC 1,000 W, and the C protective layer was formed with a thickness of 4 nm.
The coercive force of the magnetic recording medium was 334 kA / m (4.2 kOe).
In addition, the first nonmagnetic material of the magnetic recording medium in this example is PtO.

<Formation of imprint resist layer>
On the protective layer, an imprint resist layer was formed by spin coating (3,600 rpm) so that an acrylic resist (PAK-01-500, manufactured by Toyo Gosei Co., Ltd.) had a thickness of 200 nm.

<Transfer process>
The substrate on which the imprint resist layer is formed by separating the adhesive layer of the mold and placing the imprint resist layer on the surface on which the uneven pattern of the mold is opposed to the substrate. Was adhered for 10 seconds at a pressure of 3 MPa, and ultraviolet rays were irradiated at 10 mJ / cm ² .
After completing the above steps, the mold was peeled from the substrate on which the imprint resist layer was formed.
Thereafter, by transferring the uneven pattern of the mold to the imprint resist layer, the imprint resist layer remaining in the recesses of the uneven pattern formed on the imprint resist layer is subjected to O ₂ reactive chemical etching. Removed. This O ₂ reactive chemical etching is performed so that the magnetic layer is exposed in the recess.

<Magnetic pattern part formation process>
After removing the imprint resist layer remaining in the concave portion, the concave and convex shape of the magnetic layer was processed.
As the processing of the magnetic layer, an ion beam etching method was used.
Specifically, Ar gas was used, the ion acceleration energy was 500 eV, and an ion beam was incident on the magnetic layer from the vertical direction.
After processing the magnetic layer in this way, the resist remaining on the magnetic layer (unprocessed portion) is removed by O ₂ reactive chemical etching.
Thereafter, a PFPE lubricant was applied to a thickness of 2 nm by a dip method.

<Nonmagnetic pattern part formation process>
After processing the magnetic layer, a SiO ₂ layer is formed by sputtering so that the layer containing the magnetic material has a thickness of 50 nm, and the magnetic layer and the nonmagnetic layer are surfaced by ion beam etching. The SiO ₂ layer was removed to be unity.

(Examples 2-14 and Comparative Examples 1-4)
In Example 1, as shown in Table 1, except that the adhesive layer material and the adhesive layer thickness, the presence or absence of the support, the presence or absence of the release layer, and the presence or absence of the sealing layer were changed, Mold structures of Examples 2 to 14 and Comparative Examples 1 to 4 were produced.
In the case of no support, the pressure-sensitive adhesive layer material was formed by spin coating while controlling the number of rotations so as to have a desired thickness.
On the other hand, in the case with a support, the adhesive layer material was applied on the support (ethylene vinyl acetate copolymer; thickness 135 μm) to a desired thickness, dried, and then attached to a mold. .
The release layer was formed by dip coating using EGC-1720 manufactured by Sumitomo 3M Limited, followed by heat treatment at 150 ° C. for 1 hour, and rinsing using HFE-7100 manufactured by Sumitomo 3M Limited.
As the sealing layer, a silicone rubber (thickness 500 μm) 40 mm larger than the diameter of the mold is used, and the mold structure with the adhesive layer already formed is sandwiched from both sides and vacuumed to ensure sealing performance. Formed to go.
Thereafter, a magnetic recording medium was produced in the same manner as in Example 1 using the produced mold structure.

<Thickness of adhesive layer>
The thickness of the adhesive layer was determined using a spectroscopic ellipsometer (MARY-102, manufactured by Five Lab) after obtaining an approximate value by measurement using a digimatic indicator (ID-CG, manufactured by Mitutoyo Corporation). The results are shown in Table 1.

<Adhesive strength of adhesive layer>
The adhesive strength of the adhesive layer was measured by forming a sample on a silicon wafer by spin coating, drying, backing with a PET film, and then measuring 180 ° peel force at a tensile speed of 300 mm / min. The results are shown in Table 1.

<Evaluation of contamination>
About each produced mold structure, the amount of C on the mold surface before forming the adhesive layer and the adhesive layer were formed using a fluorescent X-ray analyzer (manufactured by Shimadzu Corporation, XRF-1700), and 24 hours later. The difference from the amount C of the mold surface after removing the adhesive layer was determined as an increase, and the increase was determined to be less than 5% by mass as contamination, and 5% by mass as contamination x. The results are shown in Table 2.

<Evaluation of vibration resistance>
For each mold structure produced, the amount of increase in the amount of C on the mold surface after peeling of the adhesive layer after maintaining the state of ultrasonic vibration at 45 kHz for 24 hours was determined in the same manner as in the evaluation of the contamination, and the amount of increase Of less than 5% by mass was judged as contamination, and 5% by mass or more was judged as contamination. The results are shown in Table 2.

<Evaluation of storage stability>
For each mold structure produced, the increase in the amount of C on the mold surface after the adhesive layer was peeled off after being left in a constant temperature and humidity environment of 60 ° C. and 80% RH for 24 hours was the same as the evaluation of the contamination property. When the increase was less than 5% by mass, the storage stability was evaluated as ○, and when 5% by mass or more was determined as contamination x. The results are shown in Table 2.

＊アクリル樹脂系：（メタ）アクリル酸アルキルエステル系ポリマー
＊ビニルレジン：塩化ビニル／酢酸ビニルコポリマー

* Acrylic resin: (Meth) acrylic acid alkyl ester polymer * Vinyl resin: Vinyl chloride / vinyl acetate copolymer

  From the results of Tables 1 and 2, the thickness of the mold structure on the side where the concave / convex pattern is formed is 0.5 μm to 15 μm and the adhesive strength is 0.39 N / 20 mm to 3.0 N with respect to silicon. Examples 1 to 14 provided with a pressure-sensitive adhesive layer of / 20 mm have low contamination, excellent vibration resistance, surface defects, and stability over time, as compared with Comparative Examples 1 to 4 that do not satisfy the conditions of the pressure-sensitive adhesive layer. A mold structure can be provided.

  The mold structure of the present invention has low contamination, excellent vibration resistance, surface defects, and stability over time, and transfer accuracy is maintained even after a predetermined period of time. It is suitable for production of a media.

FIG. 1 is a perspective view showing a configuration of a mold structure of the present invention. FIG. 2A is a cross-sectional view showing a configuration of an adhesive layer in the mold structure of the present invention. FIG. 2B is a cross-sectional view showing the configuration of the adhesive layer in the mold structure of the present invention. FIG. 2C is a cross-sectional view showing the configuration of the adhesive layer in the mold structure of the present invention. FIG. 2D is a cross-sectional view showing the configuration of the adhesive layer in the mold structure of the present invention. FIG. 2E is a cross-sectional view showing the configuration of the adhesive layer in the mold structure of the present invention. FIG. 2F is a cross-sectional view showing the configuration of the adhesive layer in the mold structure of the present invention. FIG. 3 is a cross-sectional view showing a method for manufacturing a mold structure according to the first embodiment of the present invention. FIG. 4A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a second embodiment of the present invention. FIG. 4B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the second embodiment of the present invention. FIG. 5 is a cross-sectional view showing a method for manufacturing a mold structure according to the third embodiment of the present invention. FIG. 6A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a fourth embodiment of the present invention. FIG. 6B is a cross-sectional view showing a method for manufacturing a mold structure in the fourth embodiment of the present invention. FIG. 7A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a fifth embodiment of the present invention. FIG. 7B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the fifth embodiment of the present invention. FIG. 8A is a cross-sectional view illustrating a method for manufacturing a mold structure according to a sixth embodiment of the present invention. FIG. 8B is a cross-sectional view illustrating the method for manufacturing the mold structure according to the sixth embodiment of the present invention. FIG. 9 is a cross-sectional view showing a manufacturing method for manufacturing a magnetic recording medium using the mold structure of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mold structure 2 Substrate 2a Surface 3 Convex part 4 Concave part 5 Adhesive layer 6 Support body 7 Sealing layer 8 Release layer 10 Si substrate 11 Si master 21 Photoresist layer 22 Conductive film 23 Ni substrate 24 Imprint resist layer 25 Imprint Resist layer 40 Magnetic recording medium substrate 50 Magnetic layer 70 Nonmagnetic layer 100 Magnetic recording medium

Claims (8)

A disc-shaped substrate, a concavo-convex pattern in which a plurality of convex portions are formed on one surface of the substrate, and an adhesive layer on at least the one surface;
A mold structure characterized in that the adhesive layer has a thickness of 0.5 μm to 15 μm and an adhesive strength of 0.39 N / 20 mm to 3.0 N / 20 mm with respect to silicon.   The mold structure according to claim 1, wherein the adhesive layer is formed so as to cover substantially the entire surface.   The mold structure according to claim 1, wherein a release layer is formed between the one surface and the adhesive layer.   The mold structure according to any one of claims 1 to 3, wherein a support is provided on a surface opposite to the one surface of the adhesive layer.   The mold structure according to claim 1, which is sealed with a sealing layer.   The mold structure according to any one of claims 1 to 5, wherein the material of the adhesive layer is a (meth) acrylic acid alkyl ester-based polymer.   The pressure-sensitive adhesive layer of the mold structure according to any one of claims 1 to 6 is peeled off and pressed against an imprint resist layer made of an imprint resist composition formed on a substrate of a magnetic recording medium, to thereby form the mold structure. An imprint method comprising at least a transfer step of transferring an uneven pattern formed thereon.   The imprint method according to claim 7, wherein the imprint resist composition has a viscosity of 1 mPa · s to 200 mPa · s.

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