JP2009124021A - Wiring board, and electric apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board by which its commonage by a number of applications is made possible and the inspection of the mounting sate of components on it can be simplified, and to provide an electrical component using the wiring board. <P>SOLUTION: The board 1 has a plurality of lands 2 and each printed conductive path 3 is connected with each land 2 in response to necessity. Each surface-mounted component 6 is so interposed mount-wise between the predetermined lands 2, 2 as to fasten both its end-side terminals 8 to the correspondent lands 2, 2 by solders. Identifying marks 9 are applied to the land 2 requiring no component to be fastened. After mounting necessary components on the board (before/after the fastenings of components to the lands, etc.), the necessity of fastening a component to a land can be determined by the identifying marks even though the board has the land whereto no component has been fastened until that time, when inspecting the mounting sate of components on the board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a wiring board in which an electrical component or the like is mounted on a board, and an electric device in which the wiring board is accommodated in a case body.

  Conventionally, in a wiring board on which electrical components are mounted on a board, whether or not a required electrical component is mounted at a predetermined location is visually checked against a parts table, a circuit diagram, or the like. It was common.

  On the other hand, the technique of patent document 1 is proposed as a technique aiming at the sharing of a board | substrate and the simplification of a visual inspection work. The technique of Patent Document 1 performs a plurality of types of circuit configurations using a common printed circuit board, and includes components mounted in common for each type and components mounted only for a certain type. Different identification marks are printed and displayed at each mounting position on the printed circuit board in order to distinguish these two types of components.

This identification visually identifies whether an unmounted component is a common mounted component or a selectively mounted component by an identification mark. In the case of a common mounting component, the component to be mounted is missing. On the other hand, in the case of a selective mounting component, it is necessary to refer to a circuit diagram or a component table, and no mounting is necessary. It is said that it is identified.
Japanese Utility Model Publication No. 5-8974

  Since the wiring board of Patent Document 1 prints and displays different identification marks for distinguishing components at each mounting position on the printed board, the printed board can be used in common, but its application range However, there is a problem that it is limited and cannot cope with a circuit change after print display.

  It is an object of the present invention to provide a wiring board that can share a board and that can simplify the inspection of the mounting state of components, and an electric device using the wiring board.

  The wiring board according to claim 1 is a substrate having a plurality of lands for fixing components; a component fixed to a predetermined land of the plurality of lands; a component of the plurality of lands And an identification mark formed on a land that does not require fixing.

  In the present invention and each of the following inventions, the definition or allowable range of each component is as follows unless otherwise specified.

  There are no particular limitations on the material, shape, use, etc. of the substrate, and any substrate is acceptable. The land is used to fix components, and is used to fix the terminals of components, and is sometimes referred to as an alias such as a pad. The fixing may be an electrical connection or a mechanical connection. As the fixing means, solder is generally used in terms of easy and low cost, but other means such as welding can also be used.

  The component may be any component such as a surface mount component called a chip component or a discrete component having a lead terminal.

  The identification mark is provided on the land, but a part of the identification mark may extend over the substrate. It is preferable for visual recognition that the identification mark is different from the color of the land to which the component needs to be fixed. Further, when solder is used as a component fixing means, it is preferable that the adhesion of the solder to the land is prevented and that the color differs from the color of the solder for the same reason. For example, when the land is a copper color, it is preferable that the land is clearly different, such as red, blue, and yellow. In addition, as a material for preventing adhesion of solder, an insulating paint, an adhesive, a sheet, or the like can be used.

  However, the mounting state may be inspected by other means such as using X-rays, ultraviolet rays, etc. regardless of human vision. In that case, a material that is sensitive to X-rays, ultraviolet rays, etc. is used. Is preferred.

  In any case, the identification mark may be provided before the production work of the wiring board, and its shape and application means are not limited.

  As an operation of the present invention, first, identification marks are applied to lands that do not require fixing of parts. After mounting the required components on the board (either before or after fixing the components, or both), when inspecting the mounting status, there are lands where the components are not fixed (or mounted before fixing) In addition, it can be easily determined by the identification mark whether or not the component needs to be fixed to the land.

  In addition, it is possible to apply an identification mark to the land at the initial stage of a series of component mounting operations on the board or as a preparation stage of the component mounting work. For this reason, an identification mark is printed on the board itself. Compared to what is to be done, it is possible to easily cope with the mounting change of the components accompanying the circuit change. Thereby, it is easy to expand the range of substrate commonality.

  The wiring board according to claim 2 is the invention according to claim 1, wherein at least a part of the component is a surface mounting component, and the identification mark attaches an adhesive for bonding the surface mounting component to the substrate to the land. It is formed by doing.

  Recently, an automated mounting device is used for mounting a surface mounting component on a board. This mounting device is first mounted on a surface of a board corresponding to a land on which a component is mounted by a preset mounting program. Adhesive is applied, and then the surface-mounted component is placed on the substrate and the component is temporarily fixed with the adhesive.

  Therefore, by previously programming a land that does not require the component to be fixed, an identification mark can be applied by adhering the adhesive on the land that does not require the component to be fixed when the adhesive is applied. In the present invention, the land to which the identification mark is applied may be either for a surface mount component or a discrete component.

  According to the present invention, as in the first aspect of the present invention, even when there is a land on which no component is mounted when the mounting state is inspected, whether or not the component needs to be mounted on the land is identified. Can be easily determined.

  Further, since the identification mark is formed by adhering the adhesive to the land, the identification mark prevents the solder from adhering to the specific land even when soldering to each land of the substrate by reflow. Therefore, it is possible to identify whether or not a component needs to be mounted on the land even after soldering.

  Furthermore, when an automated mounting device is used and an adhesive for temporarily mounting a surface mounting component is used, it is easy to apply the identification mark itself, and even if there is a change in the mounting component due to a circuit change By changing the program, it is easy to change the identification mark on the parts-unnecessary land.

  An electrical device according to a third aspect of the present invention includes a case body; and the wiring board according to the first or second aspect, which is formed into a case body.

  The electric device of the present invention may be anything such as a mobile phone that is operated by a user, or a device that is built in a device and acts as a drive device or a control device. Good.

  In the invention of claim 1, since the identification mark is given to the land that does not require the component to be fixed, even if there is a land where the component is not mounted when inspecting the mounting state after mounting the required component, It can be easily determined whether or not parts need to be mounted on the land.

  In addition, it is possible to easily cope with a mounting change of a component accompanying a circuit change, as compared with a case where an identification mark is printed on the substrate itself.

  The invention of claim 2 further forms the identification mark by adhering the adhesive to the land, so that the adhesion of solder to the specific land can be prevented by the identification mark, and the component can be mounted on the land after soldering. Whether it is necessary or not can be identified.

  Since the invention according to claim 3 uses the wiring board having the effect of the invention according to claim 1 or 2, it is possible to provide an electric device including the wiring board that is easy to manufacture and inexpensive.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a partially enlarged plan view showing a state in which an identification mark is provided on a pair of lands facing each other. FIG. 2 uses the same substrate as that in FIG. It is a partial expanded plan view which shows the state by which components are adhering to the land.

  In FIGS. 1 and 2, reference numeral 1 denotes a substrate having a plurality of lands 2. Each land 2 is connected to a conductive path 3 printed as necessary. The conductive path 3 is also provided with a resist layer 4 as necessary.

  Reference numeral 5 denotes an adhesive for temporarily fixing a component 6 to be described later on the substrate 1. In FIG. 2, two points are attached to the substrate 1 between the three pairs of lands 2 and 2, respectively. In FIG. 1, two points are attached on the substrate 1 between the two pairs of lands 2 and 2.

  The parts 6 are indicated by phantom lines to show the lands 2, the adhesive 5, and the like. The component 6 is temporarily fixed to the substrate 1 with the adhesive 5, but by arranging the component 6 along the frame 7 formed by silk printing, the terminal 8 of the component 6 is positioned on the corresponding land 2. Placed in. The terminals 8 and 8 on both ends are fixed to the corresponding lands 2 and 2 by solder (not shown).

  The identification mark 9 is formed on a pair of lands 2 and 2 facing each other in FIG. That is, it is formed by attaching a two-point adhesive on each of the pair of lands 2 and 2 that have been previously found to be not fixed. This adhesive is the same material as the temporary adhesive 5.

Next, the operation of the present embodiment will be described below together with work steps.
<Step 1>
Preparation of common substrate. In other words, when most of the entire circuit configuration is common, but some circuit parts are necessary or unnecessary for each model, all these circuit parts are mounted as a group. A substrate on which lands are formed is manufactured.
<Step 2>
Determination of circuit configuration. Selection of the circuit corresponding to the model to be manufactured.
<Step 3>
Mounting device programming. A program such as adhesion of adhesive for temporarily fixing parts, adhesion of identification marks, position and order of component mounting by the automatic component mounting apparatus is set to be adapted to the circuit selected in step 2.
<Step 4>
Adhesive for surface mounting component temporary fixing and identification mark adhesive by mounting device.
<Step 5>
Placement of surface-mount components on the board (temporary fixing).
<Step 6>
Drying the adhesive, and checking the mounting state as necessary. If there is a missing part, take additional measures.
<Step 7>
Reflow soldering.
<Step 8>
Inspection of mounting status. The inspection is performed in a state close to the final product. If there is a missing part, take measures such as excluding or correcting it as a defective product.

  In the above embodiment, only two usage states are shown for the three pairs of lands. However, the present invention is not limited to this, and the present invention can be implemented in the case of a large number of lands or a large number of combinations.

  FIG. 3 is a perspective view showing an embodiment and an example of use of the electric apparatus of the present invention. The electrical device 30 accommodates a wiring board (not shown) as shown in FIG. And the electric equipment 30 in this embodiment acts as a lighting device of a discharge lamp.

  That is, in FIG. 3, 32 is a lighting fixture, and the electric device 30 is disposed in the lighting fixture main body 33. A pair of sockets 34 is attached to the luminaire main body 33, and a fluorescent lamp 35 as a discharge lamp is attached to the socket 34.

The partial enlarged plan view which shows one Embodiment of the wiring board by this invention, and shows the state which has an identification mark in a pair of opposing land. FIG. 2 is a partially enlarged plan view showing a state in which the same substrate as that of FIG. 1 is used, a plurality of lands have no identification mark, and parts are fixed to all lands. The perspective view which shows the lighting fixture as one usage example of one Embodiment of the electric equipment by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Land 3 ... Conductive path 5 ... Adhesive 6 ... Component 9 ... Identification mark 30 ... Electric equipment

Claims (3)

A substrate having a plurality of lands for securing components;
A part fixed to a predetermined land among a plurality of lands;
An identification mark on a land that does not require fixing of a plurality of lands;
A wiring board comprising:   2. The wiring according to claim 1, wherein at least a part of the component is a surface mount component, and the identification mark is formed by adhering an adhesive for adhering the surface mount component to the substrate to the land. substrate. With a case body;
The wiring board according to claim 1 or 2 accommodated in a case body;
Electrical equipment characterized by comprising.

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