JP2009123057A - Non-contact type ic tag and production method for non-contact type ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact type IC (Integrated Circuit) tag or the like allowing a change of performance of a communication distance (a long distance/close distance) by folding it. <P>SOLUTION: This non-contact type IC tag 1 has: an inlet 10 formed by a loop antenna 4 disposed on a base film 2 and an IC chip 3 connected to the loop antenna 4; and a secondary antenna 5 disposed in a non-matching position apart at a prescribed distance, and disposed in a position close to the loop antenna 4 by folding it in a folding position 8. In the non-contact type IC tag (in a non-folded state) 1a, the secondary antenna 5 does not function, and read/write from the close distance is performed. In the non-contact type IC tag (in a folded state) 1b, the secondary antenna 5 is disposed in the position close to the loop antenna 4 by the folding, and read/write from the long distance is performed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a non-contact IC (Integrated Circuit) tag that performs non-contact information communication, and more particularly to a non-contact IC tag formed from a loop antenna and a secondary antenna, and a manufacturing method thereof.

  In recent years, non-contact type IC tags used for information storage and display in contact with reader / writers in process management, logistics management, distribution fields, etc. in factories such as manufacturing have become IC tag labels, packages, and cases. It is used for a wide range of purposes as tags to be attached.

In recent years, in addition to the conventional 13.56 MHz band or microwave band (2.45 GHz) non-contact IC tag, it has become possible to use the UHF band (952 M to 955 MHz) in Japan due to the revision of the law. UHF band non-contact IC tags are being put to practical use.
The UHF band IC tag can be collectively read from a long distance (3 to 5 meters) as compared to the electromagnetic induction type 13.56 MHz band non-contact IC tag. Further, the microwave band IC tag can communicate at a distance of 1 to 1.5 meters, and is expected to be widely used in applications that take advantage of these features in the future.

By the way, in recent years, non-contact type IC tags used for management of merchandise and information display in which data is transmitted and received with an external reader / writer by wireless communication are widely used.
For example, in a product store of a store such as a department store, a supermarket, or a convenience store, a marketing system for investigating which product a shopper has picked up from the products displayed on the product shelf, and delivery and inventory of the product There are many inventory management systems that perform management (see, for example, Patent Document 1).

  In such a conventional marketing system and inventory management system, generally, in the investigation of the products displayed on the product shelves and the inventory management of the products in the warehouse, IC tags of a plurality of products are collectively collected using a stationary reader. When reading, it is preferable that the communication distance of the IC tag is long to some extent (several meters). Further, when reading an IC tag on a price tag of a product with a cashier counter when purchasing the product, it may be read from a distance of about several centimeters using a handy reader. That is, it has been desired that the performance of the communication distance of the IC tag can be switched according to the intended use.

  As a method to solve such problems, it operates with a relatively wide antenna area before cutting, suitable for batch reading at the gate, and operates as a small half-wave dipole antenna after cutting, and is used as a handy for price tags, etc. There is a non-contact type IC tag suitable for reading with a type reader (see Patent Document 2).

JP 2005-92376 A Japanese Patent Application No. 2006-354240

  Furthermore, according to the use of the non-contact type IC tag, reading / writing can be performed at a relatively small communication distance using a handy reader / writer on a tag attached to an object such as a product, a package, or a package. In the next step, there is a case where a plurality of objects are collectively read by a long distance communication with a stationary reader. Conversely, at a store or the like, when a product is purchased by a consumer by reading the IC tags of the price tags of a plurality of products displayed on the product shelf at a distance by long-distance communication, a handy reader at the register counter In some cases, the IC tag is read using. As described above, various uses are assumed in a series of operations, and it is desired to switch the performance of the communication distance according to the application.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a non-contact type IC tag or the like that can change the performance of the communication distance (long distance / close distance) by folding. And

  In order to achieve the above-mentioned object, the first invention includes a loop antenna disposed on a base film substrate, an inlet formed by an IC chip connected to the loop antenna, and the loop antenna. A non-contact type IC tag provided with a secondary antenna disposed at a predetermined distance away, and reading / writing from a close distance when the non-contact type IC tag is not folded, The non-contact type IC tag is characterized by extending the communication distance by folding the non-contact type IC tag to bring the secondary antenna close to the loop antenna.

Further, it is desirable that the folding position is provided so that the secondary antenna is arranged in parallel to a position close to the loop antenna by folding at the folding position.
Moreover, as for the secondary antenna, it is desirable that the part juxtaposed with the inlet has a linear shape.
Moreover, it is desirable that the secondary antenna is disposed on the surface of the loop antenna side or the opposite side of the loop antenna, in parallel with one side of the loop antenna.

The “IC chip” includes a control unit, a memory unit for storing information, a non-contact type IC wireless communication unit, and the like.
The “inlet” is a primary processed member before the exterior base material is disposed.
“Matching” is impedance matching, and the received power is maximized by matching the impedance of the IC chip connected to the loop antenna with the impedance of the secondary antenna.

  A non-contact type IC tag according to a first aspect of the present invention is an inlet formed by a loop antenna disposed on a base film substrate and an IC chip connected to the loop antenna, and a predetermined distance away from the loop antenna. A non-contact type IC tag having a secondary antenna disposed at a predetermined position. When the non-contact type IC tag is not folded, reading / writing from a close distance is performed, and the non-contact type IC tag is By folding, the secondary antenna is brought close to the loop antenna and the communication distance is extended.

In the first invention, when the IC tag is provided with a folding position and folded from the folding position, the loop antenna and the secondary antenna are arranged close to each other, and impedance matching between the secondary antenna and the IC chip is obtained. The gain of the loop antenna is improved and the communication distance can be extended. In the unfolded state, a loop antenna and a secondary antenna arranged at a predetermined distance away from each other so as not to be aligned are arranged, and the IC tag can be easily read / written from a close distance.
Further, it is possible to record product management items common to the IC chip recording contents on the paper substrate.
In addition, since the folding position is formed at a position where the base material does not overlap when the base material is folded in two, there is an effect that the base material can be easily and accurately folded.

  The second invention includes a step (a) of forming an inlet formed by the loop antenna disposed on a base film substrate and an IC chip connected to the loop antenna; and the base film base A step (b) of disposing the secondary antenna at a predetermined distance away from the inlet on the material, a step (c) of providing a surface protection base material around, and folding on the surface protection base material And a step (d) of printing a folding position at which the secondary antenna is brought close to the loop antenna, thereby producing a non-contact type IC tag.

  The second invention is an invention relating to a method of manufacturing a non-contact type IC tag according to the first invention.

  The present invention has been made in view of the above points, and can provide a non-contact IC tag and the like that can change the performance of the communication distance (long distance / close distance) by folding.

  Hereinafter, preferred embodiments of a non-contact type IC tag according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

  FIG. 1 is a diagram showing a non-contact type IC tag 1 according to the first embodiment, and FIG. 1 (a) shows a non-contact type IC tag (unfolded) 1a according to the present embodiment. FIG. 1B is a plan view of a non-contact type IC tag (folded state) 1b. 2A is a plan view of the non-contact type IC tag (unfolded state) 1a, and FIG. 2B is a non-contact type IC tag viewed from the X1-X2 side in FIG. FIG. 2 is a schematic cross-sectional view of the unfolded state 1a.

  FIG. 1 shows an example of a non-contact type IC tag 1. As shown in FIG. 1A, the non-contact type IC tag 1 includes a base film 2, an IC chip 3, a loop antenna 4, a secondary antenna 5, Folding position 8 etc. are provided.

  The non-contact type IC tag 1 includes a loop antenna 4 that is wound in a substantially square shape on a base film 2 and a non-contact type IC tag 3 that is electrically connected to the loop antenna 4. The inlet 10 of the tag 1 is formed. A secondary antenna 5 having a linear shape in a portion juxtaposed with the inlet 10 is disposed at a position away from the loop antenna 4 on the upper surface of the inlet 10 by a predetermined distance. The secondary antenna 5 is further folded via a folding position 8 at a position (3 mm or more) that is not aligned with any one side of the outer periphery of the loop antenna 4, thereby allowing the secondary antenna 5 to be loop antenna 4. It arrange | positions so that it may arrange | position in parallel to the position (1 mm-3 mm) which adjoins.

  For example, as shown in FIG. 2A, the non-contact type IC tag (not folded) 1a has a length from the outer periphery of the loop antenna 4 to the folding position 8 and a length from the folding position 8 to the secondary antenna 5. A folding position 8 and a secondary antenna 5 are provided at equal (Amm) positions. By folding, the secondary antenna 5 is placed on the back surface of the inlet 10, and the thickness of the base film 2 (1 mm The secondary antenna 5 is arranged at a position (0 mm to 2 mm) close to the loop antenna 4.

  As shown in FIG. 2 (b), the non-contact type IC tag 1a includes an inlet 10, a secondary antenna 5, an adhesive layer 6, and a surface protective film formed of a base film 2, an IC chip 3, a loop antenna 4, and the like. It has a layer configuration of 7 etc. The secondary antenna 5 is located at a predetermined distance away from one of the outer circumferences of the outer surface of the base film 2 side of the base film 2 of the inlet 10 formed by the base film 2, the IC chip 3, the loop antenna 4, and the like. And is covered with a surface protective film 7 made of a white film / paper substrate through an adhesive layer 6.

  The non-contact IC tag (unfolded state) 1a performs reading / writing from a close distance without the secondary antenna 5 functioning. When the non-contact type IC tag (folded state) 1b is folded, the secondary antenna 5 is arranged at a position (0 mm to 2 mm) close to the loop antenna 4, and the impedance between the secondary antenna 5 and the IC chip 3 is reduced. Align and read / write from long distances.

Next, a manufacturing method of the non-contact type IC tag 1 of the present embodiment will be described with reference to FIGS.
FIG. 3 is a flowchart showing a method for manufacturing the non-contact type IC tag 1.
4 is a cross-sectional view of the manufacturing process of the non-contact type IC tag 1, FIG. 4 (a) is a cross-sectional view of the inlet 10 of the non-contact type IC tag 1, and FIG. 4 (b) is a non-contact type. FIG. 4C is a cross-sectional view of the non-contact type IC tag 1 after the surface protective film is laminated, after the secondary antenna 5 is disposed in the inlet 10 of the type IC tag 1. FIG. 4D is a cross-sectional view of the non-contact type IC tag 1 on which visual information is printed on the surface base material.

  First, as shown in FIG. 4A, the loop antenna 4 is disposed on the base film 2 and the inlet 10 of the non-contact IC tag 1 is formed from the IC chip 3 electrically connected to the loop antenna 4. (Step S301).

  Next, as shown in FIG. 4B, in parallel with a position (3 mm or more) away from one side of the loop antenna 4 on the base film 2 in consideration of the folding position 8. In the folded state, the secondary antenna 5 does not intersect with the loop antenna 4 but is disposed at a close position (1 mm to 3 mm) (step S302).

  Next, as shown in FIG.4 (c), the surface protection film 7 which consists of a white film / paper base material is formed in the whole upper surface by the side of the IC chip 3 of the inlet 10 formed through the adhesive layer 7 which consists of an adhesive agent. Lamination is performed (step S303).

  Next, as shown in FIG. 4D, the visual protection information 13 (for example, merchandise management information) and the folding line 12 corresponding to the folding position 8 are displayed on the display protective film 7 made of a white film / paper substrate by a label printer or the like. The printing layer 9 is formed by printing on the surface (step S304).

  FIG. 5A is a plan view of a non-contact type IC tag (not folded) 1a on which visual information 13 is printed on the surface protective film 7, and FIG. It is a top view of the non-contact type IC tag (folded state) 1b on which the visual information 13 is printed.

  As shown in FIG. 5 (a), the non-contact type IC tag (unfolded) 1a on which the visual information 13 is printed on the surface protective film 7 is a white color covering the formed inlet 10 and secondary antenna 5. The folding line 12 is printed on the surface of the surface protective film 7 such as a film or paper substrate, and visual information 13, 13 'is printed on both sides thereof. The visual information 13, 13 ′ is printed with information that is at least partially in common with the content recorded in the memory of the IC chip 3. For example, it is product management information, such as product number, product name, manufacturer name, size, shape, price, and other information on the effect.

  As shown in FIG. 5B, the non-contact IC tag 1b in a folded state brings the secondary antenna 5 close to the IC chip 3 and uses a handy reader / writer to read / write at a relatively small communication distance. Write. The visual information 13 ′ printed on one side of the fold line 12 on the surface protective film 7 is folded on the back surface.

  The base film 2 that is the base material of the inlet 10 includes PET (polyethylene terephthalate), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), PP (polypropylene), PE (polyethylene), and PC (polycarbonate). ), PA (polyamide), PPS (polyphenylene sulfide), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylate, polyethylene, polyurethane, etc. Is used.

  The loop antenna 4 and the secondary antenna 5 are conductor wires, and materials such as aluminum and silver paste are used.

  Moreover, as the surface protective film 7, a white film, a paper base material, etc. are used. As the white film, those mentioned in the above base film 2 can be used, and as the paper base material, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex, melamine-impregnated paper, and the like can be used.

  Next, as an operation mode using the non-contact type IC tag 1, an example of a merchandise management system 60 in a store and a home delivery management system 70 in a delivery center will be described.

FIG. 6 is a diagram illustrating a schematic configuration of a product management system 60 using the non-contact type IC tag 1.
As shown in FIG. 6, the product management system 60 manages a trend from when the product 31 is displayed on the product shelf 33 until it is sold, and performs a settlement process for the product 31 to be purchased.
A plurality of products 31 are displayed on each product shelf 33 in the store 37, and a non-contact IC tag (folded state) 1b storing the product information is attached to each product 31 as a price tag. An installation type tag reader 32 is installed in each product shelf 33. Using the stationary tag reader 32 provided for each product shelf 33, the non-contact type IC tag 1b attached to the plurality of products 31 on the product shelf 33 is collectively read from a long distance (step S61), and the computer (Not shown) receives the read product information and manages the displayed product 31.
At the time of product purchase, the non-contact IC tag (folded state) 1b attached to the purchased product 31 is opened at the register counter, and the non-contact IC tag (unfolded state) 1a is opened to the POS terminal 35. Using the handy tag reader 34 connected to, reading from the proximity distance is performed (step S62), and settlement processing of the product 31 is performed based on the read product information.

FIG. 7 is a diagram showing a schematic configuration of a home delivery management system 70 using the non-contact type IC tag 1.
As shown in FIG. 7, the home delivery management system 70 writes the home delivery slip information such as the input shipper information and the destination information to the non-contact type IC tag 11 and attaches it to the package 41, and the delivery center processing To manage the delivery and collection of goods. The computer 43 of the delivery reception center 49 inputs and acquires slip information for the delivery reception, and prints the slip information acquired on the surface of the delivery label by using the tag printer 44 (or tag reader / writer), as well as a non-delivery label. Writing from the close distance to the contact type IC tag (not folded) 11a is performed (step S71). The written non-contact type IC tag 11a is folded via the fold line 12, and is attached to the package 41 for delivering the non-contact type IC tag (folded state) 11b. The pasted package 41 is sent to the delivery center 48.
For a plurality of packages 41 placed on the delivery center 48, a non-contact type IC tag (folded state) 11b attached to the plurality of packages 41 is collectively collected from a long distance by using a stationary tag reader 32. Reading is performed (step S72), and delivery management is performed based on the read slip information.

  As described above, according to the embodiment of the present invention, the non-contact type IC tag 1 is formed by the loop antenna 4 disposed on the base film 2 and the IC chip 3 connected to the loop antenna 4. And the secondary antenna 5 disposed at a position separated by a predetermined distance. The secondary antenna 5 is disposed at a position that is not aligned with any one side of the outer periphery of the loop antenna 4, and is further folded at the folding position 8 so that the secondary antenna 5 is close to the loop antenna 4. To do. The non-contact IC tag (unfolded state) 1a performs reading / writing from a close distance without the secondary antenna 5 functioning. When the non-contact type IC tag (folded state) 1b is folded, the secondary antenna 5 is arranged at a position close to the loop antenna 4 and performs reading / writing from a long distance.

As a result, when the IC tag is provided with a folding position and folded from the folding position, the loop antenna and the secondary antenna are arranged close to each other, and impedance matching between the secondary antenna and the IC chip is obtained. The gain can be improved and the communication distance can be extended. In the unfolded state, the loop antenna and the secondary antenna disposed at a predetermined distance so as not to be matched are disposed, and the IC tag is easy to read / write from a close distance.
Further, it is possible to record product management items common to the IC chip recording contents on the paper substrate.
In addition, since the folding position is formed at a position where the base material does not overlap when the base material is folded in two, there is an effect that the base material can be easily and accurately folded.
In the present embodiment, the embodiment in which the non-contact type IC tag 1 is used for a price tag attached to a product or a home delivery slip to be attached to a package has been described. However, the present invention is not limited to this example. The performance of the communication distance may be changed by attaching the type IC tag 1 and folding it according to the intended use.

Next, the non-contact type IC tag 21 according to the second embodiment will be described.
FIG. 6 is a diagram showing a non-contact type IC tag 21 according to the second embodiment. FIG. 6A is a plan view showing a non-contact IC tag (unfolded state) 21a according to the present embodiment, and FIG. 6B is a view of the non-contact IC tag (folded state) 21b. It is a top view.

In the following description, parts that perform the same functions as those of the first embodiment described above are denoted by the same reference numerals, and redundant descriptions are omitted as appropriate. The non-contact type IC tag 21 (the unfolded state) 21 a includes a main body portion 14, a folded portion 15, and a lid portion 16. The inlet 10 is formed in the main body 14, and the secondary antenna 5 is disposed on the lid 16 via the folding position 8. As shown in FIG. 6B, the non-contact type IC tag 21 enables the lid portion 16 to be folded via the folding position 8 and is locked to the folded portion 14. Similar to the non-contact type IC tag 1 of the first embodiment, the non-contact type IC tag (unfolded state) 21a performs reading / writing from a close distance without the secondary antenna 5 functioning. When the contact IC tag (folded state) 21b is folded, the secondary antenna 5 is disposed at a position close to the loop antenna 4 and performs reading / writing from a long distance.
Therefore, the lid 10 is folded and locked to the folded portion 14 to protect the inlet 10 and the secondary antenna 5.

  The preferred embodiments of the non-contact type IC tags 1, 11, and 21 according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

The figure which shows the non-contact-type IC tag 1 which concerns on 1st Embodiment The figure which shows non-contact type IC tag (state which is not folded) 1a Flow chart showing a method for manufacturing the non-contact type IC tag 1 Sectional view of manufacturing process of non-contact type IC tag 1 The figure which shows the non-contact-type IC tag 1 by which the visual information 13 was printed on the surface protection film 7 The figure which shows schematic structure of the merchandise management system 60 using the contact-type IC tag 1. The figure which shows schematic structure of the home delivery management system 70 using the non-contact-type IC tag 1. The figure which shows the non-contact-type IC tag 21 which concerns on 2nd Embodiment.

Explanation of symbols

1, 11, 21 ......... Non-contact IC tag 1a, 11a, 21a ......... Non-contact IC tag (unfolded state)
1b, 11b, 21b ......... Non-contact IC tag (folded state)
2 ... Base film 3 ... IC chip 4 ... Loop antenna 5 ... Secondary antenna 6 ... Adhesive layer 7 ... Surface protective film 8 ... Folding position 9 ... Printing layer 10 ......... Inlet 12 ......... Folding line 13, 13 '......... Visual information 14 ......... Main body 15 ......... Folding part 16 ......... Cover 31 ......... Product 32 ......... Tag reader 33 ... …… Product shelf 34 ……… Handy tag reader 35 ……… POS terminal 36 ……… Registry counter 41 ……… Luggage 42 ……… Tag reader 43 ……… Computer 44 ……… Tag printer 48 ……… Delivery center 49 ......... Delivery reception center 60 ......... Product management system 70 ......... Home delivery management system

Claims (8)

An inlet formed by a loop antenna disposed on a base film substrate and an IC chip connected to the loop antenna;
A non-contact type IC tag comprising the loop antenna and a secondary antenna disposed at a predetermined distance away from the matching antenna,
Reading / writing from a close distance while the non-contact IC tag is not folded, and folding the non-contact IC tag to bring the secondary antenna close to the loop antenna and extend the communication distance. A non-contact type IC tag characterized by The non-contact type IC tag according to claim 1, wherein the folding position is provided so that the secondary antenna is arranged in parallel to a position close to the loop antenna by folding at the folding position. The contactless IC tag according to claim 1 or 2, wherein the secondary antenna has a linear shape at a portion juxtaposed with the inlet. The said secondary antenna is arrange | positioned in parallel with either one side of the said loop antenna in the surface of the said loop antenna side or the said loop antenna opposite side, The Claim 1 thru | or 3 characterized by the above-mentioned. Non-contact IC tag. A step (a) of forming an inlet formed by the loop antenna disposed on a base film substrate and an IC chip connected to the loop antenna;
A step (b) of disposing the secondary antenna at a predetermined distance away from the inlet on the base film substrate;
A step (c) of providing a surface protective substrate around,
A step (d) of printing a folding position for bringing the secondary antenna close to the loop antenna by folding on the surface protective substrate;
A method for producing a non-contact type IC tag, comprising: The step (d)
6. The method of manufacturing a non-contact type IC tag according to claim 5, wherein information that is at least partially in common with the content recorded in the memory of the IC chip is further printed on the surface protection substrate. . 7. The method of manufacturing a non-contact type IC tag according to claim 5, wherein a portion of the secondary antenna juxtaposed with the inlet has a linear shape. The said secondary antenna is arrange | positioned in the surface on the said loop antenna side, or the surface on the opposite side of the said loop antenna in parallel with any one side of the said loop antenna. The manufacturing method of the non-contact-type IC tag of description.

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