JP2009115664A - Self-alignment mechanism in contact between electronic component and probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a self-alignment mechanism in contact between an electronic component and a probe card which properly overcomes a contact failure caused by an inclination between an electrode group in the electronic component and a contact group in the probe card i.e. an inclination between the electronic component and the probe card, and secures the reliability of the contact between the electrode group and the contact group if the probe card is applied as a contact means between the electronic component and an inspection apparatus. <P>SOLUTION: In the self-alignment mechanism in the contact between the electronic component and the probe card, a supporting/pressing member 7 is disposed so as to maintain pressing contact on a back face 6b of a pressing member 6, a spherical body 8 is interposed between the supporting/pressing member 7 and the pressing member 6, the pressing member 6 freely adjusts movement through the spherical body 8, and the pressing contact is obtained between the contact group 4 and the electrode group 2 if a back face 3b of the probe card 3 is plane-pressed by a front face 6a of the pressing member 6, and the contact group 4 disposed on a front face 3a of the probe card 3 is pressed to and contacts with the electrode group 2 in the electronic component 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a contact mechanism between a probe card and an electronic component used for inspecting an electronic component such as an IC package or IC wafer having a ball-shaped electrode, a thin foil electrode, or a bonding electrode, or an electronic component such as a flat display panel. In particular, the present invention relates to a self-alignment mechanism in the contact mechanism.

  In the inspection of the electronic component, a probe card having a contact group corresponding to the electrode group is used, and the contact group is pressed and contacted with each electrode group to perform input / output inspection.

  Conventionally, a flexible probe card or a glass probe card has been used as an electrical contact means serving as a connection medium between the flat display panel and the inspection apparatus.

  Thus, the probe card has a large number of leads extending in parallel at a fine pitch along the surface of a flexible insulating sheet material made of synthetic resin or the surface of a glass sheet material, and a contact group ( Bump group) is formed and the probe card tip is pressed to bring the contact group into pressure contact with the electrode group of the display panel.

  On the other hand, as an electrical contact means serving as a connection medium between the IC package and the inspection apparatus, a connector having a contact pin group is used as a representative example, and each of the contact pin groups is arranged on the back surface of the IC package. A structure is adopted in which a pressure contact is obtained by the elasticity of the contact pin.

  However, a uniform pressure contact between the contact group of the probe card or the connector arranged at a minute pitch and the electrode group of the electronic component is required. As in the present invention, the pressure spring is used as a contact means with the electronic component. In the case of using a probe card having no contact point, a slight inclination tends to occur between the probe card and the electronic parts placed on the inspection stage, and the contact cannot be obtained due to the inclination, and the contact group and the electrode This leads to problems that impair the reliability of contact with the group.

  The present invention provides a contact mechanism between an electronic component and a probe card, to which a probe card is applied as a contact means between the electronic component of the IC package or flat display panel and the inspection device. An object of the present invention is to provide a self-alignment mechanism that effectively improves poor contact due to inclination.

  As a means for achieving the above object, when the contact group placed on the surface of the card by pressing the back surface of the probe card with the surface of the pressing member is brought into pressure contact with each of the electrode groups of the electronic component, A support member that holds the pressure contact is disposed on the back surface side of the presser member, and a spherical body is interposed between the support member and the presser member, and the presser member passes through the spherical surface of the spherical body. Alternatively, a pressure contact between the contact group and the electrode group can be obtained while freely adjusting through a fixed point rotation of the spherical body.

  Preferably, the spherical body is arranged on a line perpendicular to the approximate center of the arrangement area of the electrode group of the electronic component, the electrode group and the contact group contact each other in parallel, and the pressure applied by the pressing member is applied to the electrode group and the contact group. To be applied uniformly to each of them.

  The pressing member and the supporting member are elastically held by a spring in the approaching direction, and the pressing member and the supporting member are elastically coupled through a spherical body, and the pressing member is annularly pressed against the spherical surface of the spherical body to press the holding member. The member and the probe card are adapted to obtain the above-mentioned free adjustment according to the elasticity of the spring.

  In addition, the pin protruding from one of the holding member and the supporting member is loosely engaged with the other hole to determine the relative position of both, and the free clearance of the holding member through the spherical body is allowed by the loose gap. To do. Alternatively, the amount of free adjustment is limited by a loose gap.

  In addition, a gap is set between the pressing member and the pressure-bearing member by interposing the spherical body, and the pressing member is allowed to adjust by the gap. The gap and the above-mentioned pin play can be used in combination.

  According to the present invention, when the probe card is applied as a contact means between the electronic component and the inspection device, the inclination between the electrode group of the electronic component and the contact group of the probe card, that is, the contact caused by the inclination of the electronic component and the probe card. Defects can be appropriately eliminated, and the reliability of contact between the electrode group and the contact group can be ensured.

  As shown in FIG. 1, an IC package 1 called a BGA type IC package has a large number of ball-shaped electrodes 2 on the back side 1b, and the back side of the IC package 1 also called a flat type IC package or the like. 1b has a number of thin foil electrodes or bonding electrodes 2.

  On the other hand, a flat display panel 1 such as a liquid crystal panel display, a plasma display panel, an EL display panel or the like has a large number of thin foil electrodes 2 on the surface of the opposite edge as shown in FIG.

  As described above, the present invention is a contact mechanism between the electronic component 1 and the probe card 3 in which the probe card 3 is applied as a contact means between the electronic component 1 of the IC package 1 or the flat display panel and the inspection device. An object of the present invention is to provide a self-alignment mechanism that effectively improves the contact failure caused by the inclination between the electrode 2 group and the contact 4 group of the probe card 3.

  Hereinafter, the BGA type IC package 1 having two ball-shaped electrodes 2 will be illustrated as a representative example of an inspection object, and the best mode for carrying out the present invention will be described.

  A group of electrodes 2 of a BGA type IC package 1 (hereinafter referred to as an electronic component 1) to be inspected is balanced in a single row or a double row on the left or right or left and right sides of the back surface 1b of the square IC package 1, or electronic A balanced arrangement is provided on the entire back surface 1 b of the component 1. A shows the arrangement area of these two groups of electrodes.

  On the other hand, as shown in FIG. 3, the probe card 3 has a group of leads 5 (wiring path group) made of a large number of conductive foils, and a large number of groups of contacts 4 corresponding to the electrodes 2 (at the tips of the leads 5). And an arrangement area A ′ corresponding to the arrangement area A of the electrode 2 group.

  The contact 4 group and the lead 5 group of the probe card 3 are arranged on the surface 3 a of the card 3. Alternatively, the contact 4 group is arranged on the front surface 3 a of the probe card 3, and the lead 5 group is arranged on the back surface 3 b of the card 3 or inside the card 3.

  The probe card 3 includes the lead 5 group or the electrode 2 group on a substrate made of an insulating material such as glass, ceramics, or synthetic resin.

  As shown in FIGS. 4 and 5, the electrode 2 group and the contact 4 group face each other vertically so as to have a one-to-one correspondence (the arrangement areas A and A ′ face each other in parallel), that is, a probe card. The front surface 3a on which the three contact 4 groups are arranged and the back surface 1b on which the electrode 2 groups of the electronic component 1 are arranged face each other in parallel.

  On the back surface 3b side of the probe card 3, a pressing member 6 made of metal or synthetic resin having a front surface 6a contacting the back surface 3b in parallel with the top and bottom is arranged.

  The probe card 3 has its back surface 3b overlaid on the front surface 6a of the pressing member 6, and is fixed to the pressing member 6 with an arbitrary fixing means, for example, a screw 10, so as to always maintain the superimposed state.

  The back surface 3b of the probe card 3 is pressed by the front surface 6a of the holding member 6, and each of the contacts 4 arranged on the front surface 3a of the card 3 is added to each of the electrodes 2 of the electronic component 1 by the surface pressing. Make pressure contact.

  The pressing member 6 directly presses the probe card 3 or a backup plate 11 made of an elastic material such as rubber or a metal plate that contacts the back surface 3b and the front surface 6a in parallel between the probe card 3 and the pressing member 6. And indirectly pressing. The backup plate 11 is attached to the holding member 6 by fixing means such as the screw 10 and holds the overlapping state of the probe card 3, the backup plate 11 and the holding member 6.

  Further, a support member 7 that holds the pressure contact is disposed on the back surface 6b side of the presser member 6, and a spherical body 8 is interposed between the support member 7 and the presser member 6, and the presser member 6 is A configuration in which pressure contact between the contact group 4 and the electrode group 2 is obtained while freely (non-directionally) adjusting through the following movement of the spherical body 8 with respect to the spherical surface 8a or through a fixed point rotation of the spherical body 8. And

  As an example, the spherical body 8 is fixed to the bearing member 7 side, and is interposed so as to be able to freely slide (swiftly follow) with respect to the pressing member 6, and to absorb inclination through the following motion. To do. That is, the pressing member 6 is configured to freely adjust via the spherical body 8 to absorb the inclination.

  As a specific example, as shown in FIG. 6, the upper spherical surface of the spherical body 8 is fixed in a recess 12 provided in the bearing member 7 so as not to be able to escape and rotate by press fitting or bonding, and the lower portion. A spherical surface is projected from the surface of the bearing member 7, and the lower spherical surface is slid so as to freely rotate in a recess 13 provided on the back surface 6 b of the pressing member 6, and is formed at the opening edge of the recess 13. The annular sliding portion 13a is annularly brought into contact with the lower spherical surface.

  In the holding member 6, the annular sliding portion 13a follows the lower spherical surface of the spherical body 8, and freely swings through the following movement, so that the backup plate 11 and the probe card 3 can freely swing. By free swinging, the front surface 3a of the probe card 3 and the back surface 1b of the electronic component 1 are made to face each other in parallel while eliminating the inclination of the probe card 3 and the electronic component 1, thereby obtaining a parallel contact between the contact 4 group and the electrode 2 group.

  As another example, the spherical body 8 is fixed to the holding member 6 side, and is interposed so as to be freely slidable (freely slidable) with respect to the support member 7, and the inclination is absorbed through the swaying. To do. That is, the pressing member 6 is configured to freely adjust via the spherical body 8 to absorb the inclination.

  As a specific example, as shown in FIG. 7, the lower spherical surface of the spherical body 8 is fixed in a recess 13 provided in the pressing member 6 so as not to be able to escape and rotate by press-fitting or bonding and the upper spherical surface. Is protruded from the back surface 6 b of the pressing member 6, and the upper spherical surface is slid so as to freely rotate into a recess 12 provided on the surface of the pressure supporting member 7, and is formed at the opening edge of the recess 12. The annular sliding portion 12a is brought into annular contact with the lower spherical surface.

  The spherical body 8 freely follows the annular sliding portion 12a while being in contact with the annular sliding portion 12a, and the pressing member 6 freely swings through the following movement to freely swing the backup plate 11 and the probe card 3. By free swinging, the front surface 3a of the probe card 3 and the back surface 1b of the electronic component 1 are made to face each other in parallel while eliminating the inclination of the probe card 3 and the electronic component 1, thereby obtaining a parallel contact between the contact 4 group and the electrode 2 group.

  Furthermore, as another example, the spherical body 8 is interposed so as to be freely rotatable with respect to both the pressing member 6 and the supporting member 7, and the pressing member 6 is freely oscillated through the free rotation of the spherical body 8. It is configured to move and absorb the tilt. That is, the pressing member 6 is configured to freely adjust via the spherical body 8 to absorb the inclination.

  As a specific example, the spherical body 8 is slidably fitted into the recesses 12 and 13 of FIGS.

  As another example, the spherical body 8 is held against the pressing member 6 and the elasticity is applied to the probe card 3 and the electronic component 1 to complement the pressure contact between the contact 4 group and the electrode 2 group, The pressure is absorbed to prevent the probe card 3 from being damaged (particularly when the probe card 3 is made of glass).

  As a specific example, as shown in FIG. 8, the lower spherical surface of the spherical body 8 is slid so as to freely rotate in a recess 13 provided in the pressing member 6, and at the same time, the upper spherical surface is supported by the supporting member 7. It slides in the provided recess 12 so that it can freely rotate, and the spherical surface 8a of the spherical body 8 is brought into annular contact with the annular sliding portions 12a, 13a formed at the opening edges of the recesses 12, 13, respectively. The body 8 is allowed to freely rotate at a fixed point.

  A spring 14 such as a coil spring is housed in the recess 12, the upper end of the spring 14 is supported on the bottom surface of the recess 12, and the lower end is brought into pressure contact with the spherical surface 8 a of the spherical body 8.

  The spherical body 8 freely rotates at a fixed point while making annular contact with the annular sliding portions 12a and 13a, and the presser member 6 freely swings through the fixed point rotation, so that the backup plate 11 and the probe card 3 can freely move. Swing. By free swinging, the front surface 3a of the probe card 3 and the back surface 1b of the electronic component 1 are made to face each other in parallel while eliminating the inclination of the probe card 3 and the electronic component 1, thereby obtaining a parallel contact between the contact 4 group and the electrode 2 group. That is, the pressing member 6 is configured to freely adjust via the spherical body 8 to absorb the inclination.

  Preferably, the spherical body 8 is arranged on a line X perpendicular to the approximate center of the arrangement area A, A ′ of the electrode 2 group of the electronic component 1, and each of the electrode 2 group and the contact 4 group contacts in parallel. The pressing force by the pressing member 6 is applied uniformly to each of the electrode 2 group and the contact 4 group.

  When the spherical body 8 is arranged on the vertical line X, the recesses 12 and 13 and the spring 14 are all arranged on the vertical line X.

  The pressing member 6 and the supporting member 7 are elastically held by a spring 15 in the approaching direction, and the pressing member 6 and the supporting member 7 are elastically coupled via the spherical body 8, and the pressing member 6 is connected to the spherical surface of the spherical body 8. The annular sliding portions 12a and 13a of the pressing member 6 and the supporting member 7 are annularly brought into pressure contact with the spherical surface 8a of the spherical body 8 so that the pressing member 6 and the probe card 3 are in contact with the spring. According to the elasticity of 15, the above-mentioned free tuning is obtained.

  As a specific example, the pin 16 projecting from one of the pressing member 6 and the supporting member 7 is loosely engaged with the other hole 17 to determine the relative position of the both 6 and 7, and the spherical gap is defined by the loosening gap 18. The free adjustment of the presser member 6 through 8 is allowed. Alternatively, the amount of free adjustment is limited by the loose gap 18.

  Further, a gap 19 is set between the opposing surfaces of the pressing member 6 and the pressure bearing member 7 by the spherical body 8, and the adjustment of the pressing member 6 is allowed by the gap 19. The gap 19 and the gap 18 due to the loose coupling of the pins 16 can be used together.

  FIG. 9 shows another specific example configured based on FIGS. 1 to 8 and the description thereof. As shown in the figure, a spring receiving seat 20 is provided integrally with the pressure bearing member 7 so as to face the surface 6a of the pressing member 6, and a spring 15 'is stored between the spring receiving seat 20 and the pressing member 6 to store elasticity. The spring 15 ′ is arranged so as to press and hold the left and right and / or front and rear of the pressing member 6 evenly in the separating direction.

  The pressing member 6 is provided with a pressing portion 6 ′ for directly pressing the probe card 3 through the spring receiving seat 20 or indirectly pressing the probe card 3 through the backup plate 11.

  The spherical body 8 shown in FIGS. 5 to 9 can use a partial spherical body such as a hemispherical body in addition to a true spherical body. These spherical bodies 8 are either solid or hollow.

A is a rear view of an electronic component typified by a BGA type IC package, and B is a side view thereof. A is a surface view of an electronic component typified by a flat display panel, and B is a side view thereof. The surface view of a probe card. The top view which shows the superimposition state with the probe card which contacts an electronic component. Sectional drawing which shows the self-alignment mechanism in the contact of an electronic component and a probe card. The principal part sectional drawing which shows the example of an interposition structure of the spherical body which freely adjusts a holding member. The principal part sectional drawing which shows the other example of an interposition structure of the spherical body which freely adjusts a pressing member. The principal part sectional drawing which shows the further other example of an interposition structure of the spherical body which freely adjusts a pressing member. Sectional drawing which shows the other specific example of the self-alignment mechanism in the contact of an electronic component and a probe card.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component (IC package and flat display panel), 1a ... Surface of electronic component, 1b ... Same back surface, 2 ... Electrode, 3 ... Probe card, 3a ... Front surface of probe card, 3b ... Same back surface, 4 ... Contact, DESCRIPTION OF SYMBOLS 5 ... Lead, 6 ... Pressing member, 6a ... The surface of a pressing member, 6b ... The back surface, 6 '... Pressing part, 7 ... Supporting member, 8 ... Spherical body, 8a ... Spherical surface, 10 ... Screw, 11 ... Backup plate 12, 13 ... recess, 12a, 13a ... annular sliding portion, 14 ... spring, 15, 15 '... spring, 16 ... pin, 17 ... hole, 18 ... loose gap, 19 ... gap, 20 ... spring seat , A, A '... arrangement area, X ... vertical line.

Claims (5)

When pressing the back surface of the probe card with the surface of the holding member to bring each contact group placed on the surface of the card into pressure contact with each of the electrode groups of the electronic component, the additional pressure is applied to the back surface side of the holding member. A support member that holds the pressure contact, and a spherical body is interposed between the support member and the presser member, and the contact group and the electrode group are adjusted while the presser member freely adjusts via the spherical body. A self-alignment mechanism in contact between an electronic component and a probe card, wherein the pressure contact is obtained. 2. The self-alignment mechanism in contact between an electronic component and a probe card according to claim 1, wherein the spherical body is arranged on a line perpendicular to the approximate center of the electrode group arrangement area of the electronic component. 2. The self-alignment mechanism in contact between an electronic component and a probe card according to claim 1, wherein the pressing member and the supporting pressure member are held in the approaching direction. 2. The self-alignment mechanism in contact between an electronic component and a probe card according to claim 1, wherein a pin protruding from one of the pressing member and the supporting member is loosely engaged with the other hole. 2. A self-alignment mechanism in contact between an electronic component and a probe card according to claim 1, wherein a gap allowing adjustment of the presser member is set between the presser member and the pressure support member by interposing the spherical body.

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