JP2009111272A - Mounting device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount a plate member, such as a wafer, to a contact body in a closely adhered manner. <P>SOLUTION: A supporting means 11 is configured by comprising a contact body 20 comprising viscosity for supporting a semiconductor wafer W in plane-contact therewith, a base 21 that supports this body, a contact area adjusting means that adjusts the contact area of the contact body 20 with the wafer W, and a pressure adjusting means capable of reducing the pressure in a space C2 between the wafer W and the contact body 20. A mounting device 10 is configured by comprising a holding means 12 capable of holding the supporting means 11. The holding means 12 includes a through-hole 33A that can be connected to the contact area adjusting means and through which suction is possible and a through-hole 32A that can be connected to the pressure adjusting means and through which suction is possible. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method, and particularly supports a semiconductor wafer stably when grinding a plate-like member such as a semiconductor wafer to an extremely thin thickness or transporting a semiconductor wafer ground to an extremely thin thickness. The present invention relates to a mounting apparatus and a mounting method capable of mounting a supporting means that can be mounted.

  As an apparatus for processing a semiconductor wafer (hereinafter, simply referred to as “wafer”), for example, a device disclosed in Patent Document 1 is known. In the apparatus of the same document, the wafer is transferred to the next process via the transfer device after the back surface is ground with the protective sheet attached to the front surface.

JP 2002-343756 A

  However, due to the recent increase in diameter of wafers and ultra-thin grinding to a thickness of several tens of μm, the wafer may be bent or deformed during the transfer of the wafer, causing damage such as cracks. There is a disadvantage that the wafer cannot be transferred. Here, although the wafer can be reinforced to some extent by attaching a protective sheet, it is difficult to sufficiently avoid the above disadvantages in the current situation where the technology for increasing the size and reducing the thickness is improved.

  By the way, the present applicant has proposed Japanese Patent Application No. 2007-208264 in order to avoid the inconvenience. In this application, the wafer is transported by using a support body having a viscosity that supports the wafer in surface contact with the support and a base that supports the contact body. Specifically, after a contact body is placed on the wafer and brought into surface contact, the interface is evacuated and the support means supports the wafer. However, when the wafer is supported in this way, the area to be evacuated is only around the suction port, so there is a demand for further improving the adhesion between the wafer and the contact body.

[Object of invention]
The present invention has been devised in response to the request while paying attention to the inconvenience, and an object thereof is to mount the contact body and the plate-like member in close contact with each other and to integrate them well. It is to provide a mounting method.

In order to achieve the above-mentioned object, the present invention provides a contact body having a viscosity to be brought into surface contact with and supported by a plate-like member, a base for supporting the contact member, and a contact area for adjusting the contact area of the contact body with the plate-like member. A mounting device for supporting means comprising adjusting means, and pressure adjusting means capable of depressurizing the space between the plate-like member and the contact body,
The first suction part connectable to the contact area adjusting means and the second suction part connectable to the pressure adjusting means are employed.

  In the present invention, it is also preferable to employ a configuration further comprising holding means provided so as to be able to hold the support means and moving means for moving the holding means.

  In addition, the transport method of the present invention includes a contact body having a viscosity that is in surface contact with and supported by the plate-like member, a base that supports the contact body, and a contact area adjusting unit that adjusts the contact area of the contact body with the plate-like member. And a mounting method of a support means comprising a pressure adjusting means capable of depressurizing the space between the plate-like member and the contact body, wherein the contact body is partially depressed by the contact area adjusting means, The step of bringing the partially depressed contact body into contact with the plate-like member and partially contacting the plate-like member; the step of reducing the space between the plate-like member and the contact body by a pressure adjusting means; and the contact area The method includes: a step of changing from partial contact to total contact by an adjustment unit; and a step of releasing pressure reduction by the pressure adjustment unit and integrating the support unit and the plate-like member. Yes.

According to the present invention, the contact body and the plate-like member can be controlled to be in partial contact or overall contact by suction by the first suction part, so that their adhesion is further improved. Can do. And since the space between a plate-shaped member and a contact body is pressure-reduced by a 2nd suction part, it becomes possible to improve adhesiveness further.
Further, by providing the holding means and the moving means, the plate-like member and the supporting means can be conveyed in an integrated state.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of the mounting device according to the embodiment, and FIG. 2 is an enlarged cross-sectional view of the main part of FIG. In these drawings, the mounting apparatus 10 mounts the supporting means 11 accommodated in the right cassette CA in FIG. 1 on a wafer W as a plate-like member placed on the lower table T in FIG. Is provided. The mounting apparatus 10 includes a holding unit 12 provided so as to be able to hold the support unit 11 from the side of a base 21 described later, and a robot 13 as a moving unit that moves the holding unit 12. The table T includes a suction surface for sucking and supporting the wafer W from below.

  The support means 11 includes a contact body 20 having a contact surface 20 </ b> A having a viscosity for supporting the wafer W in surface contact and a base 21 for supporting the contact body 20. The contact body 20 has a sheet shape made of a silicone-based, urethane-based, acrylic-based, or fluorine-based elastomer having excellent adhesiveness, flexibility, heat resistance, elasticity, etc., and is substantially the same plane as the wafer W. Those having a shape are preferably employed. A hole 20 </ b> B is formed in the in-plane center of the contact body 20. The contact body 20 disclosed in Japanese Patent Application No. 2006-304366 filed by the present applicant and substantially the same as that disclosed as the adhesion layer can be used.

  Although the said base 21 is not specifically limited, as FIG. 3 shows, it is provided in the plate shape which makes a planar view substantially circular shape. As shown in FIG. 2, the base 21 protrudes downward from the flat portion 24, a substantially ring-shaped peripheral wall 25 in plan view located on the outer periphery of the flat portion 24, and the lower surface side of the flat portion 24. The lower end position is composed of a plurality of protrusions 26 having a height located substantially on the same plane as the lower end position of the peripheral wall 25. The contact body 20 is fixed to the lower end surface of the peripheral wall 25, and in this state, the contact body 20 abuts on each lower end of the protrusion 26, thereby forming a space C <b> 1 between the base 21 and the contact body 20. Will be. As shown in FIG. 2, the space C <b> 1 communicates with a first through hole 28 formed in at least one place of the plane portion 24, and the plane portion 24, the peripheral wall 25, the projection 26, and the first The through hole 28 constitutes a contact area adjusting means for adjusting the contact area of the contact body 20A with the wafer W. Further, the central protrusion 26A located in the center of the plane of the plane portion 24 is provided in a planar shape larger than the other protrusions, and a second through hole 29 penetrating vertically and communicating with the hole 20B is formed. These holes 20B and the second through holes 29 constitute a pressure adjusting means capable of depressurizing the space between the wafer W and the contact body.

  As shown in FIG. 4, the holding means 12 includes a frame plate 31 that is connected to the robot 13 and has a substantially circular shape in plan view, a recess 32 formed in the center of the lower surface of the frame plate 31, a frame An annular inner groove 33 and an annular outer groove 34 are provided on the lower surface of the plate 31 along the concentric circles of the frame plate. The recess 32 can communicate with the second through hole 29, while the inner groove 33 can communicate with the first through hole 28. First to third hoses 37 to 39 are connected to the upper surface side of the frame plate 31, and the first hose 37 communicates with a through hole 32 </ b> A as a second suction portion formed in the recess 32. The second hose 38 communicates with a through hole 33A as a first suction portion formed in the inner groove 33, and the third hose 39 communicates with a through hole 34A formed in the outer groove 34. Moreover, the 1st thru | or 3rd hose 37-39 is each connected to the pressure reduction pump P via the electromagnetic valves V1-V3. Accordingly, the decompression pump P, the through hole 32A, the recess 32, the second through hole 29, and the hole 20B are communicated with each other through the first hose 37, while the decompression pump P and the through hole 33A are communicated with the second hose 38. The inner groove 33, the first through hole 28, and the space C1 communicate with each other. Further, the decompression pump P, the through hole 34A, and the outer groove 34 communicate with each other via the third hose 39, so that the support means 11 can be sucked and held.

  The robot 13 is a known robot having a multi-joint structure, and a wafer on which the support means 11 is placed on the table T from the cassette CA via the holding means 12 provided at the tip along a preset trajectory. It is provided on W so as to be transportable.

  Next, a method for mounting the support means 11 on the wafer W in this embodiment will be described. Here, as shown in FIG. 2, the first to third hoses 37 to 39 are connected to the decompression pump P, and the decompression is controlled by electromagnetic valves V <b> 1 to V <b> 3 provided on the way.

  First, the robot 13 is operated to move the holding means 12 onto the support means 11 in the cassette CA, and then the electromagnetic valve V3 is operated to hold one support means 11 (see FIG. 5). Remove from cassette CA by operation. Next, before the contact body 20 is brought into contact with the wafer W on the table T, the electromagnetic valve V2 is operated to depressurize the space C1 through the through hole 33A, so that the contact body 20 is inverted and recessed into the space C1. Transform to sink. As a result, the area of the contact surface 20A that can come into contact with the wafer W in the contact body 20 is reduced by an area that is depressed in a concave shape (see FIG. 6). Thereafter, as shown in FIG. 7, the contact surface 20 </ b> A is brought into surface contact with the upper surface of the wafer W. At this time, the contact surface 20 </ b> A partially contacts the wafer W, and a space C <b> 2 is formed between the wafer W and the contact body 20. In this state, the electromagnetic valve V1 operates and the inside of the space C2 is depressurized through the through hole 32A. In this state, when the electromagnetic valve V2 is operated to release the pressure reduction, the contact body 20 comes into contact with the wafer W as a whole and the adhesion is improved, and the contact body 20 and the wafer W are well integrated. (See FIG. 8). Then, after the predetermined time has elapsed, the operation of the electromagnetic valve V1 releases the decompression in the space C2 (which has actually disappeared). The wafer W integrated with the support means 11 is returned to the cassette CA by the robot 13 or transferred to the next process. At the transport destination, the electromagnetic valve V3 is operated to release the pressure reduction of the support means 11 and can be detached.

  Therefore, according to such an embodiment, after the contact body 20 is depressed in the space C1, the inside of the space C2 between the wafer W and the contact body 20 is depressurized. Adhesion can be improved, and the support means 11 and the wafer W can be satisfactorily integrated.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the mounting object in the present invention is not limited to a semiconductor wafer, and can be a glass plate, a steel plate, or another adherend such as a resin plate. It may be a wafer or a compound wafer.

  The robot 13 constituting the moving means is not particularly limited as long as it can be driven and controlled, and may be constituted by an air cylinder or the like.

The schematic plan view of the mounting apparatus which concerns on embodiment. The principal part expanded sectional view of FIG. The bottom view of a base. The bottom view of a holding means. The principal part expanded sectional view of FIG. Sectional drawing similar to FIG. 5 which shows the state which reduced the contact area of the contact body. Sectional drawing similar to FIG. 5 which shows the state which the contact body and the wafer contacted partially. Sectional drawing similar to FIG. 5 which shows the state which the contact body and the wafer contacted entirely.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mounting apparatus 11 Support means 12 Holding means 13 Robot (moving means)
20 contact body 20A contact surface 20B hole (pressure adjusting means)
21 Base 24 Flat part (contact area adjustment means)
25 Perimeter wall (contact area adjustment means)
26 Protrusion (contact area adjustment means)
28 1st through-hole (contact area adjustment means)
29 Second through hole (pressure adjusting means)
32A Through hole (second suction part)
33A Through hole (first suction part)
C1 space C2 space W Semiconductor wafer (plate-like member)

Claims (3)

A contact body having a viscosity to be supported in surface contact with the plate member, a base for supporting the contact body, contact area adjusting means for adjusting a contact area of the contact body with the plate member, a plate member and the contact body A mounting means for supporting means comprising pressure adjusting means capable of depressurizing the space between
A mounting apparatus comprising: a first suction part connectable to the contact area adjusting means; and a second suction part connectable to the pressure adjusting means.   The mounting apparatus according to claim 1, further comprising holding means provided so as to be able to hold the support means, and moving means for moving the holding means. A contact body having a viscosity to be supported in surface contact with the plate member, a base for supporting the contact body, contact area adjusting means for adjusting a contact area of the contact body with the plate member, a plate member and the contact body A support means comprising pressure adjusting means capable of depressurizing the space between
Partially sinking the contact body with a contact area adjusting means;
Bringing the partially depressed contact body into contact with the plate-like member and partially contacting it;
Reducing the space between the plate-like member and the contact body by a pressure adjusting means;
A step of changing from the partial contact to the total contact by the contact area adjusting means;
And a step of releasing the pressure reduction by the pressure adjusting means and integrating the support means and the plate-like member.

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