JP2009104930A5 - - Google Patents

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Publication number
JP2009104930A5
JP2009104930A5 JP2007276422A JP2007276422A JP2009104930A5 JP 2009104930 A5 JP2009104930 A5 JP 2009104930A5 JP 2007276422 A JP2007276422 A JP 2007276422A JP 2007276422 A JP2007276422 A JP 2007276422A JP 2009104930 A5 JP2009104930 A5 JP 2009104930A5
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JP
Japan
Prior art keywords
melting
organic compound
low
conductive paste
paste according
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JP2007276422A
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Japanese (ja)
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JP4976257B2 (en
JP2009104930A (en
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Priority to JP2007276422A priority Critical patent/JP4976257B2/en
Priority claimed from JP2007276422A external-priority patent/JP4976257B2/en
Publication of JP2009104930A publication Critical patent/JP2009104930A/en
Publication of JP2009104930A5 publication Critical patent/JP2009104930A5/ja
Application granted granted Critical
Publication of JP4976257B2 publication Critical patent/JP4976257B2/en
Expired - Fee Related legal-status Critical Current
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Claims (10)

絶縁性樹脂１００重量部に対して、０．１〜２０重量部の低融点有機化合物と、４０〜１２００重量部の金属粒子と、１〜１００重量部の硬化剤と、０．１〜２０重量部の還元剤とを含み、
前記低融点有機化合物が、常温で固体であり、かつ、炭素数４〜１８の不飽和脂肪酸の誘導体であり、
前記低融点有機化合物の融点が、前記絶縁性樹脂と前記硬化剤との硬化開始温度および前記金属粒子の融点よりも低い、導電性ペースト。 0.1 to 20 parts by weight of low melting point organic compound, 40 to 1200 parts by weight of metal particles, 1 to 100 parts by weight of curing agent, and 0.1 to 20 parts by weight with respect to 100 parts by weight of insulating resin Part of the reducing agent,
The low melting point organic compound is a solid at normal temperature and a derivative of an unsaturated fatty acid having 4 to 18 carbon atoms;
A conductive paste in which the melting point of the low-melting organic compound is lower than the curing start temperature of the insulating resin and the curing agent and the melting point of the metal particles. 前記不飽和脂肪酸が、ヒマシ油またはリシノール酸である、請求項１記載の導電性ペースト。The conductive paste according to claim 1, wherein the unsaturated fatty acid is castor oil or ricinoleic acid. 前記低融点有機化合物が、カルボキシル基に含まれる水酸基以外に、少なくとも１つの水酸基を有する、請求項１または２記載の導電性ペースト。 The conductive paste according to claim 1 or 2 , wherein the low-melting-point organic compound has at least one hydroxyl group in addition to the hydroxyl group contained in the carboxyl group. 前記低融点有機化合物が、１２−ヒドロキシステアリン酸、２−ヒドロキシイソ酪酸、１１−ヒドロキシウンデカン酸、８−ヒドロキシオクタン酸および１６−ヒドロキシヘキサデカン酸からなる群より選択される少なくとも１種を含む、請求項１または３記載の導電性ペースト。 The low-melting-point organic compound includes at least one selected from the group consisting of 12-hydroxystearic acid, 2-hydroxyisobutyric acid, 11-hydroxyundecanoic acid, 8-hydroxyoctanoic acid and 16-hydroxyhexadecanoic acid. Item 4. The conductive paste according to Item 1 or 3 . 前記低融点有機化合物が、ヒマシ油のグリセリン付加物である、請求項１〜３のいずれか１項に記載の導電性ペースト。The conductive paste according to any one of claims 1 to 3, wherein the low-melting-point organic compound is a glycerine adduct of castor oil. 前記低融点有機化合物の融点が５０℃よりも高い、請求項１〜３のいずれか１項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 3, wherein a melting point of the low-melting-point organic compound is higher than 50 ° C. 前記絶縁性樹脂、前記硬化剤および前記還元剤に対して、前記低融点有機化合物が化学的に安定である、請求項１〜６のいずれか１項に記載の導電性ペースト。 The conductive paste according to any one of claims 1 to 6 , wherein the low-melting-point organic compound is chemically stable with respect to the insulating resin, the curing agent, and the reducing agent. 前記低融点有機化合物の融点が、７０℃以上、９８℃以下である、請求項１〜７のいずれか１項に記載の導電性ペースト。 The melting point of the low-melting organic compound, 70 ° C. or higher, 98 ° C. or less, according to claim 1 to 7 any one in the conductive paste according to. プリント配線基板と、電子部品と、これらの間に配される接着層とを含み、前記接着層が、請求項１〜８のいずれか１項に記載の導電性ペーストを含む、実装体。 It includes a printed circuit board, an electronic component, and an adhesive layer disposed therebetween, wherein the adhesive layer comprises a conductive paste according to any one of claims 1-8, mounting body. 前記接着層において、前記低融点有機化合物が分散している、請求項９記載の実装体。 The mounting body according to claim 9 , wherein the low-melting-point organic compound is dispersed in the adhesive layer.
JP2007276422A 2007-10-24 2007-10-24 Conductive paste and mounting body using the same Expired - Fee Related JP4976257B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007276422A JP4976257B2 (en) 2007-10-24 2007-10-24 Conductive paste and mounting body using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007276422A JP4976257B2 (en) 2007-10-24 2007-10-24 Conductive paste and mounting body using the same

Publications (3)

Publication Number Publication Date
JP2009104930A JP2009104930A (en) 2009-05-14
JP2009104930A5 true JP2009104930A5 (en) 2010-10-14
JP4976257B2 JP4976257B2 (en) 2012-07-18

Family

ID=40706398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007276422A Expired - Fee Related JP4976257B2 (en) 2007-10-24 2007-10-24 Conductive paste and mounting body using the same

Country Status (1)

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JP (1) JP4976257B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5728636B2 (en) * 2010-09-29 2015-06-03 パナソニックＩｐマネジメント株式会社 Conductive adhesive, circuit board using the same, and electronic component module
WO2014057846A1 (en) * 2012-10-11 2014-04-17 株式会社ダイセル Solvent composition for manufacturing electric device
CN104934098A (en) * 2015-01-05 2015-09-23 深圳市思迈科新材料有限公司 Low temperature curing laser silver paste and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3146888B2 (en) * 1994-10-31 2001-03-19 松下電器産業株式会社 Bond for temporary fixing of electronic components
JPH10249577A (en) * 1997-03-10 1998-09-22 Nippon Superia Shiya:Kk Soldering cream
JP2000212531A (en) * 1999-01-20 2000-08-02 Nippon Handa Kk Conductive adhesive

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