JP2009103919A - Method for manufacturing electrophoretic apparatus , and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the crack at an end of a substrate when manufacturing an electrophoretic apparatus having a structure comprising laminating a wiring board to the back. <P>SOLUTION: The method for manufacturing the electrophoretic apparatus equipped with a first substrate (110), a second substrate, an electrophoretic layer arranged between the first substrate and the second substrate, and a third layer (116) laminated to the first substrate includes: a step of arranging the electrophoretic layer and the second substrate on one face side of the first substrate; a step of arranging the third substrate via an adhesive layer on the other face side of the first substrate; and a step of laminating the third substrate and the first substrate by pressurizing the electrophoretic layer and the third substrate from both of the second substrate side and the third substrate side. The third substrate is previously provided with a plurality of projecting parts (44) each having a thickness approximately equal to the level difference produced by wiring films in the prescribed positions of one surface and in the second step, the plurality of the projecting parts are arranged in the positions overlapping on at least part of the outer edge of the first substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electrophoresis apparatus and an electronic apparatus including the same.

  The applicant of the present application sandwiches an electrophoretic layer (for example, a microcapsule layer) between a circuit board in which a semiconductor circuit is formed on the surface of a glass substrate or the like and a counter substrate on which a counter electrode is formed. Has developed an electrophoretic device having a structure in which a wiring board (for example, a glass epoxy wiring board or a polyimide wiring board) for connecting an external circuit or the like to a semiconductor circuit of a circuit board is bonded to the back side of the substrate. . When manufacturing such an electrophoretic device, for example, an electrophoretic layer and a counter substrate are arranged on a circuit board, a wiring board is arranged on the back surface of the circuit board, and pressure treatment is performed on each of them. The process of pasting together. However, in the manufacturing method that undergoes such a process, when the pressure treatment is performed, the circuit board may be cracked by applying more pressure to the end portions (particularly, the four corners) of the circuit board. For this reason, improvement of a manufacturing process is desired. In addition, as a prior art relevant to this application, Unexamined-Japanese-Patent No. 5-158062 (patent document 1) is mentioned, for example. This document discloses a liquid crystal display device having a glass epoxy substrate on the back surface.

JP-A-5-158062

  A specific aspect of the present invention has an object of preventing cracks at the end of a substrate when manufacturing an electrophoresis apparatus having a structure in which a wiring substrate is bonded to the back surface.

  The method for manufacturing an electrophoretic device according to the present invention includes a rectangular first substrate, a second substrate, an electrophoretic layer disposed between one surface of the first substrate and one surface of the second substrate, and at least And a third substrate bonded to the other surface of the first substrate, wherein: (a) the electrophoresis is performed on one surface side of the first substrate. A first step of disposing a layer and the second substrate; (b) a second step of disposing the third substrate on the other surface side of the first substrate via an adhesive layer; and (c) the first substrate. The third substrate and the first substrate are bonded to each other by pressurizing the second substrate, the electrophoretic layer, and the third substrate from both the second substrate side and the third substrate side. And the third substrate is formed by the wiring film at a predetermined position on the one surface. A plurality of protrusions having a thickness substantially equal to a step (a step generated due to the wiring film) is provided in advance, and in the second step, each of the plurality of protrusions is an outer edge portion of the first substrate. Is disposed at a position overlapping at least a part of.

  According to the above manufacturing method, the first substrate, the electrophoretic layer, the second substrate, and the third substrate are formed by the presence of the plurality of convex portions arranged at positions overlapping at least a part of the outer edge portion of the first substrate. Even when pressure is applied during bonding, the outer edge portion of the first substrate is supported by each convex portion, so that almost no gap is generated between the third substrate and the third substrate. Therefore, it is possible to prevent cracking of the first substrate due to more pressure applied to the outer edge portion of the first substrate.

  In the electrophoresis apparatus, preferably, the third substrate includes a plurality of dummy wiring films provided on the one surface, and the plurality of dummy wiring films are used as the plurality of convex portions. Here, the dummy wiring film refers to a wiring film that is provided separately from the original use. For example, the dummy wiring film is formed in a state of being electrically separated from the wiring film.

  Thereby, since it becomes possible to form each dummy wiring film together with the formation of the wiring film on the third substrate, the formation of the plurality of convex portions becomes easier.

  In the electrophoretic device, the third substrate may include a protective film that covers the wiring film and the plurality of dummy wiring films. The level difference in this case is a height difference generated between a portion of the protective film that overlaps the wiring film and a portion that does not overlap the wiring film. Each of the plurality of convex portions includes one of the plurality of dummy wiring films and the protective film.

  According to this, the manufacturing method according to the present invention can also be applied to the third substrate having the protective film.

  Preferably, the plurality of convex portions are arranged at each of the four corners of the first substrate. The plurality of convex portions may be disposed along each of a first side and a second side that are substantially parallel to each other of the first substrate.

  According to such an arrangement mode of the respective convex portions, the outer edge portion of the first substrate can be more effectively supported, and cracking of the first substrate can be prevented.

  The electrophoresis apparatus may further include a fourth substrate bonded to the other surface of the second substrate. In this case, the manufacturing method further includes: (d) a fourth step of disposing the fourth substrate on the other surface of the second substrate via an adhesive layer; (e) the first substrate; By pressing the second substrate, the electrophoretic layer, the third substrate, and the fourth substrate from both the fourth substrate side and the third substrate side, the second substrate, the fourth substrate, It is preferable to include the 5th process which bonds together.

  Thereby, also when bonding a 4th board | substrate, it becomes possible to prevent the crack of a 1st board | substrate by pressurization.

  An electronic apparatus according to the present invention includes an electrophoretic device manufactured by the above-described manufacturing method as a display unit. Here, the “electronic device” includes all devices including a display unit that uses display by an electrophoretic layer, and includes a display device, a television device, an electronic paper, a clock, a calculator, a mobile phone, a portable information terminal, and the like. Including. Further, the concept of “equipment” in the present invention includes, for example, flexible paper / film-like objects, those belonging to real estate such as wall surfaces to which these objects are attached, vehicles, flying objects, ships, etc. Including those belonging to the moving body.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic cross-sectional view showing the structure of the electrophoresis apparatus according to this embodiment. FIG. 2 is an enlarged schematic cross-sectional view showing a part of the electrophoresis apparatus shown in FIG. The electrophoretic device 1 of the present embodiment shown in each drawing includes a circuit board 10, an electrophoretic layer 12, a counter substrate 14, a wiring substrate 16, a cover substrate 18, and a sealing member 20.

  The circuit substrate 10 is a substrate in which a driving circuit unit 22 including a plurality of individual electrodes (pixel electrodes), wiring films (scanning lines, signal lines, etc.), thin film transistors (TFTs), etc. is provided on the surface of a glass substrate or the like. .

  The electrophoretic layer 12 is a layer containing electrophoretic particles, and is disposed on the drive circuit unit 22 of the circuit board 10. The electrophoretic layer 12 includes, for example, a plurality of microcapsules. Each microcapsule includes, for example, a plurality of positively charged black particles and a plurality of negatively charged white particles. In addition, the form of the electrophoretic layer 12 that can be adopted is not limited to the microcapsule type. Furthermore, the color tone applied to each particle is not limited to the combination of black and white, and the charged state of each particle is not limited to the above.

  The counter substrate 14 is disposed to face the circuit substrate 10 with the electrophoretic layer 12 interposed therebetween. As this counter substrate 14, a glass substrate, a plastic substrate (a sheet-like thing is included) etc. are used, for example. A common electrode facing each of the individual electrodes is formed on the surface of the counter substrate 14. By controlling the voltage applied between each individual electrode and the common electrode, the distribution state of each electrophoretic particle contained in the electrophoretic layer 12 can be changed. Thereby, image display is realized.

  The wiring board 16 is for connecting an external circuit or the like (not shown) and the drive circuit unit 22 of the circuit board 10, and the core material 30 and at least one of the front surface and the back surface of the core material 30 (in the illustrated example, And a protective film 34 and 36 covering the wiring film 32. As this wiring board 16, what is called a glass epoxy wiring board or a polyimide wiring board can be used, for example. The wiring film 32 is obtained by shaping a conductor such as copper into a predetermined pattern. The protective films 34 and 36 are insulator films, such as a resist film, for example. As shown in FIG. 2, the wiring board 16 is bonded to the back side of the circuit board 10 via an adhesive layer 24.

  The cover substrate 18 is disposed to face the circuit board 10 with the electrophoretic layer 12 and the counter substrate 14 interposed therebetween. For example, a glass substrate is used as the cover substrate 18. As shown in FIG. 2, the cover substrate 18 is bonded to the other surface of the counter substrate 14 via the adhesive layer 26.

  The sealing member (blocking layer) 20 is made of an epoxy or acrylic resin material, and is disposed between the circuit board 10 and the wiring board 16 so as to surround the electrophoretic layer 12 and the counter substrate 14. The sealing member 20 has moisture resistance and suppresses entry of foreign matters such as moisture into the electrophoretic layer 12.

  The electrophoresis apparatus 1 according to the present embodiment has such a configuration, and the manufacturing method thereof will be described in detail next. In the present embodiment, a method for manufacturing a plurality of electrophoresis apparatuses 1 at once will be described.

  FIG. 3 is a schematic perspective view for explaining the method for manufacturing the electrophoresis apparatus. The general flow of the method for manufacturing the electrophoresis apparatus according to this embodiment will be described below with reference to FIG. Details of the manufacturing method will be described with reference to FIGS.

  As shown in FIG. 3A, the surface (first surface) of the first substrate 110, which is the base material of each of the plurality of circuit boards 10, more specifically, on the side where each drive circuit unit 22 is provided. An electrophoretic sheet 28 formed by integrating the electrophoretic layer 12 and the counter substrate (second substrate) 14 is bonded to the surface (active surface) corresponding to each drive circuit unit 22. In the present embodiment, as shown in FIG. 3B, one electrophoretic sheet 28 is attached to each of the plurality of drive circuit units 22.

  Further, as shown in FIG. 3C, each of the plurality of wiring boards 16 is formed on the back surface (second surface) of the first substrate 110 in parallel with or before and after the attachment of the electrophoretic sheet 28 described above. A third substrate 116 to be a base material is attached. FIG. 4 is a schematic perspective view showing this process in more detail. As shown in FIG. 4, a plurality of convex portions 44 are provided on the surface of the third substrate 116 at positions overlapping the outer edge portion of the first substrate 110. FIG. 5 is a schematic plan view illustrating a configuration aspect of each convex portion. For example, in FIG. 5A, there are four convex portions 44 provided at positions that overlap at least one surface (front surface) of the third substrate 116 and four corners that are part of the outer edge portion of the first substrate 110. It is shown. In FIG. 5A, each convex portion 44 has a triangular shape, but the shape is not particularly limited thereto. It may be a polygon such as a rectangle (rectangle), or may be a circle or an ellipse. In FIG. 5B, as a deformation mode of the convex portion, two sides (first sides substantially parallel to each other) which are surfaces of the third substrate 116 and are part of the outer edge portion of the first substrate 110 are shown. In addition, two linear protrusions 44a provided along the second side) are shown. In FIG. 5C, as a deformation mode of the convex portion, two sides (first sides substantially parallel to each other) which are surfaces of the third substrate 116 and are part of the outer edge portion of the first substrate 110 are shown. And the some convex part 44b provided intermittently along 2nd edge | side) is shown. As described above, as long as the convex portion is provided on at least a part (more preferably, a part including the four corners) of the outer edge portion of the first substrate 110, various constituent aspects can be adopted. Each convex portion is preferably a position that does not overlap with the wiring portion connected to the electrode terminal 42 of the third substrate 116 even if it overlaps with the outer edge portion of the first substrate 110. The condition is realized in any of the configuration modes shown in FIG.

  FIG. 6 is a schematic cross-sectional view for explaining the process shown in FIG. 3C in more detail. The components common to those in FIG. 2 described above are denoted by the same reference numerals, and detailed description thereof is omitted. As shown in FIG. 6, in the present embodiment, the protrusion 44 (or the protrusions 44 a and 44 b) is separated from the third substrate 116 without being electrically connected to the other wiring films 32. A dummy wiring film) 38 and a protective film (film) 34 covering the dummy wiring film 38 are included. In the embodiment shown in FIG. 6, the convex portion 45 configured to include the dummy wiring film 38 and the protective film (film) 36 is also provided on the back surface side of the third substrate 116. The convex portion 44 is formed with the same thickness as the step formed on the surface of the third substrate 116 by the wiring film 32 and the protective film 34. Specifically, the “step” here is a difference in height generated between a portion of the protective film 34 that overlaps the wiring film 32 and a portion that does not overlap, and the “thickness” is the thickness of the protective film 34. Among them, the difference in height generated between the portion overlapping with the dummy wiring film 38 and the portion not overlapping. Similarly, the convex portion 45 is formed with the same thickness as the step formed on the back surface of the third substrate 116 by the wiring film 32 and the protective film 36. Specifically, the “step” here is a height difference generated between a portion of the protective film 36 that overlaps the wiring film 32 and a portion that does not overlap, and the “thickness” is the thickness of the protective film 36. Among them, the difference in height generated between the portion overlapping with the dummy wiring film 38 and the portion not overlapping. Due to the presence of the convex portions 44 and the convex portions 45, the outer edge of the first substrate 110 can be applied even when pressure is applied when the first substrate 110 is bonded to the electrophoretic layer 12, the counter substrate 14, and the third substrate 116. The portion 110 a is supported by the convex portion 44 and the convex portion 45. Accordingly, it is possible to prevent the first substrate 110 from cracking due to more pressure gathering at the outer edge portion 110a. Further, the step may be relaxed by thickening the adhesive layer 24 to some extent. This makes it possible to more reliably prevent the first substrate 110 from cracking even when there is a step that cannot be alleviated by the convex portions 44 or the convex portions 45 alone. As the adhesive layer 24, for example, a double-sided tape or a fluid double-sided tape can be used.

  Next, as shown in FIG. 3D, a wire is provided between the electrode terminal (electrode pad) 40 of each drive circuit section 22 of the first substrate 110 and each electrode terminal (electrode pad) 42 of the third circuit 116. Electrical connection by bonding.

  Next, as shown in FIG. 3E, a fourth substrate 118 that is a base material of each of the plurality of cover substrates 18 is bonded onto the first substrate 110, more specifically, the electrophoretic sheet 28. In the present embodiment, two fourth substrates 118 are bonded together. In this step, the first substrate 110 and the fourth substrate 118 are bonded together by applying pressure with a roll laminator or a vacuum laminator. The conditions for vacuum lamination can be, for example, a pressure of 0.1 to 0.9 MPa and a temperature of 50 ° C to 150 ° C.

  FIG. 7 is a schematic cross-sectional view for explaining the process shown in FIG. 3E in more detail. As in the case of bonding the third substrate 116 and the like (see FIG. 6), the step between the first substrate 110 and the third substrate 116 is relaxed by the convex portion 44 or the convex portion 45, so that the fourth substrate Even when 118 is bonded, cracking of the outer edge portion 110a of the first substrate 110 can be prevented.

  Next, as shown in FIG. 3F, a sealing member 120 serving as a base material of each of the sealing members 20 is formed in and around the gap between the first substrate 110 and the fourth substrate 118. . For example, the sealing member 120 can be formed by applying a thermosetting resin or an ultraviolet curable resin with a dispenser or a syringe and then performing a heat treatment or an ultraviolet irradiation treatment.

  Thereafter, for example, since the electrophoretic device 1 of the present embodiment is assumed to be used as a display panel of a wristwatch, as shown in FIG. 3G, needle holes 50 penetrating through the first substrates 110 and the like are provided. Form. Further, as shown in FIG. 3H, the first substrates 110 and the like are cut from each other. Thereby, a plurality of electrophoretic devices 1 (eight electrophoretic devices 1 in the illustrated example) are obtained.

  Next, an example of an electronic apparatus including the electrophoresis device according to the above-described embodiment as a display unit will be described. FIG. 8 is a perspective view illustrating a specific example of an electronic apparatus to which the electrophoresis apparatus is applied. FIG. 8A is a perspective view illustrating an electronic book which is an example of the electronic apparatus. The electronic book 1000 includes a book-shaped frame 1001, a cover 1002 provided to be rotatable (openable and closable) with respect to the frame 1001, an operation unit 1003, and the electrophoresis apparatus according to the present embodiment. The display unit 1004 is provided. FIG. 8B is a perspective view illustrating a wrist watch that is an example of an electronic apparatus. The wrist watch 1100 includes a display unit 1101 configured by the electrophoresis apparatus according to the present embodiment. The range of electronic devices to which the electrophoretic device can be applied is not limited to this, and includes a wide range of devices that utilize changes in visual color tone accompanying the movement of charged particles.

  The scope of application of the present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, in the above-described embodiment, the case where a plurality of electrophoresis apparatuses 1 are manufactured collectively has been described. However, the present invention can also be applied to the case where one electrophoresis apparatus is manufactured. In that case, in the above-described embodiment, one drive circuit is provided on the first substrate, one electrophoresis layer and one second substrate are provided, one fourth substrate is provided, and FIG. It will be apparent to those skilled in the art that steps such as (G) and FIG. 3 (H) may be omitted. In the above-described embodiment, each convex portion is formed using the dummy wiring film, but each convex portion may be formed without using the wiring film.

It is a schematic cross section which shows the structure of the electrophoresis apparatus which concerns on this embodiment. It is the schematic cross section which expanded and showed a part of electrophoresis apparatus shown in FIG. It is a model perspective view for demonstrating the manufacturing method of an electrophoresis apparatus. It is the model perspective view which showed the process of FIG.3 (C) in detail. It is a schematic top view explaining the structural aspect of each convex part. It is a schematic cross section for demonstrating in detail the process shown in FIG.3 (C). It is a schematic cross section for explaining the process shown in FIG. It is a perspective view explaining the specific example of the electronic device to which the electrophoresis apparatus is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Circuit board, 12 ... Electrophoresis layer, 14 ... Opposite board | substrate (2nd board | substrate), 16 ... Wiring board, 18 ... Cover board | substrate, 20 ... Sealing member, 22 ... Drive circuit part, 24 ... Adhesive layer, 26 ... Adhesion layer, 28 ... electrophoresis sheet, 30 ... core material, 32 ... wiring film, 34 ... protective film, 36 ... protective film, 38 ... dummy wiring film, 42 ... electrode terminal, 44, 44a, 44b ... convex part, 50 ... Needle hole, 110a ... outer edge part, 110 ... first substrate, 116 ... third substrate, 118 ... fourth substrate, 120 ... sealing member

Claims (7)

A first substrate having a rectangular shape; a second substrate; an electrophoretic layer disposed between one surface of the first substrate and one surface of the second substrate; and a wiring film on at least one surface; A third substrate bonded to the other surface of the electrophoretic device, comprising:
A first step of disposing the electrophoretic layer and the second substrate on one side of the first substrate;
A second step of disposing the third substrate via an adhesive layer on the other surface side of the first substrate;
By pressing the first substrate, the second substrate, the electrophoretic layer, and the third substrate from both the second substrate side and the third substrate side, the third substrate and the first substrate are pressed. A third step of bonding the substrate;
Including
The third substrate is provided in advance with a plurality of convex portions having a thickness substantially equal to a step generated by the wiring film at a predetermined position on the one surface. In the second step, each of the plurality of convex portions is provided. Is disposed at a position overlapping at least a part of the outer edge of the first substrate,
A method for manufacturing an electrophoresis apparatus. The third substrate includes a plurality of dummy wiring films provided on the one surface, and the plurality of dummy wiring films are used as the plurality of convex portions.
The manufacturing method of the electrophoresis apparatus of Claim 1. The third substrate includes a protective film that covers the wiring film and the plurality of dummy wiring films,
The step is a height difference generated between a portion of the protective film that overlaps the wiring film and a portion that does not overlap the wiring film,
Each of the plurality of convex portions includes one of the plurality of dummy wiring films and the protective film.
The manufacturing method of the electrophoresis apparatus of Claim 1. The plurality of convex portions are respectively disposed at four corners of the first substrate.
The manufacturing method of the electrophoresis apparatus of Claim 1. The plurality of convex portions are disposed along each of a first side and a second side that are substantially parallel to each other of the first substrate.
The manufacturing method of the electrophoresis apparatus of Claim 1. The electrophoresis apparatus further includes a fourth substrate bonded to the other surface of the second substrate,
A fourth step of disposing the fourth substrate on the other surface of the second substrate via an adhesive layer;
By pressing the first substrate, the second substrate, the electrophoretic layer, the third substrate, and the fourth substrate from both the fourth substrate side and the third substrate side, the second substrate And a fifth step of bonding the fourth substrate to the fourth substrate;
The method for producing an electrophoretic device according to claim 1, further comprising:   An electronic apparatus comprising an electrophoresis device manufactured by the manufacturing method according to claim 1.

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