JP2009099612A5 - - Google Patents

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Publication number
JP2009099612A5
JP2009099612A5 JP2007267025A JP2007267025A JP2009099612A5 JP 2009099612 A5 JP2009099612 A5 JP 2009099612A5 JP 2007267025 A JP2007267025 A JP 2007267025A JP 2007267025 A JP2007267025 A JP 2007267025A JP 2009099612 A5 JP2009099612 A5 JP 2009099612A5
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JP
Japan
Prior art keywords
substrate
processed
insertion groove
flow path
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007267025A
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Japanese (ja)
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JP2009099612A (en
JP5111999B2 (en
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Publication date
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Priority to JP2007267025A priority Critical patent/JP5111999B2/en
Priority claimed from JP2007267025A external-priority patent/JP5111999B2/en
Publication of JP2009099612A publication Critical patent/JP2009099612A/en
Publication of JP2009099612A5 publication Critical patent/JP2009099612A5/ja
Application granted granted Critical
Publication of JP5111999B2 publication Critical patent/JP5111999B2/en
Active legal-status Critical Current
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Claims (2)

被処理基板を保持してそれを回転させる回転部と、この回転部に保持された被処理基板の周縁部が進入する挿入溝を形成した処理部と、挿入溝とこの挿入溝に進入した上記周縁部とが相まって形成する流路と、上記処理部に設けた洗浄液の供給口と、処理部に設けるとともに供給口とは上記被処理基板の円周方向に離れた位置に設けた吸引口とを備え、吸引口からの吸引力で上記流路内を減圧し、処理部外の気体を吸引して上記流路内に高速気流を発生させるとともに、この高速気流とともに供給口から流出する洗浄液を上記流路に導き、さらにこの流路に導かれた気体および洗浄液を吸引口から吸引排出し、上記高速気流とともに流路を流れる洗浄液で被処理基板の周縁部を洗浄する構成にした基板処理装置。 A rotating part that holds the substrate to be processed and rotates it, a processing part that forms an insertion groove into which the peripheral edge of the substrate to be processed held by the rotating part enters, the insertion groove and the above-mentioned that has entered the insertion groove A flow path formed in combination with the peripheral edge, a cleaning liquid supply port provided in the processing unit, and a suction port provided in the processing unit and provided at a position separated from the processing substrate in the circumferential direction, The pressure in the flow path is reduced by the suction force from the suction port, the gas outside the processing unit is sucked to generate a high-speed air flow in the flow path, and the cleaning liquid flowing out from the supply port together with the high-speed air flow A substrate processing apparatus configured to be guided to the flow path, further to suck and discharge the gas and the cleaning liquid guided to the flow path from the suction port, and to clean the peripheral portion of the substrate to be processed with the cleaning liquid flowing in the flow path together with the high-speed air flow. . 上記処理部の挿入溝内に、そこに進入した被処理基板の外周縁と対向する挿入溝の面と、挿入溝に進入した被処理基板の外周縁と、の間に形成される間隔を狭くする構造物を設けた請求項1記載の基板処理装置 In the insertion groove of the processing section, the interval formed between the surface of the insertion groove facing the outer peripheral edge of the substrate to be processed that has entered the processing section and the outer peripheral edge of the substrate to be processed that has entered the insertion groove is narrowed. The substrate processing apparatus according to claim 1, further comprising a structure to be processed.
JP2007267025A 2007-10-12 2007-10-12 Substrate processing equipment Active JP5111999B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007267025A JP5111999B2 (en) 2007-10-12 2007-10-12 Substrate processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007267025A JP5111999B2 (en) 2007-10-12 2007-10-12 Substrate processing equipment

Publications (3)

Publication Number Publication Date
JP2009099612A JP2009099612A (en) 2009-05-07
JP2009099612A5 true JP2009099612A5 (en) 2010-07-01
JP5111999B2 JP5111999B2 (en) 2013-01-09

Family

ID=40702377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007267025A Active JP5111999B2 (en) 2007-10-12 2007-10-12 Substrate processing equipment

Country Status (1)

Country Link
JP (1) JP5111999B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013118205A (en) * 2010-03-23 2013-06-13 Jet Co Ltd Substrate processing apparatus
JP6053246B1 (en) * 2015-07-30 2016-12-27 バンドー化学株式会社 Electrode manufacturing method
KR20180021187A (en) * 2015-07-30 2018-02-28 반도 카가쿠 가부시키가이샤 Method of manufacturing electrode

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3954881B2 (en) * 2002-03-27 2007-08-08 大日本スクリーン製造株式会社 Substrate processing apparatus and plating apparatus having the same

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