JP2009099590A - Method of manufacturing led display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture an LED display which can eliminate the problem of variations in color resulting from wire bonding in conventional LED display, and to manufacture an LED display in an extremely short time regardless of natural sedimentation of resin. <P>SOLUTION: In the method of manufacturing LED display, recesses 2 and 2 leading from the front surface side to the back surface side of a light emitting diode body 1 are provided in the opposite side surfaces thereof, and insulating layers 3 and 3 are formed on the surface of the recesses 2 and 2. Rewiring circuits 4 and 4 and bumps 5 and 5 are then formed on the back surface of the light emitting diode body 1. Thereafter, electrodes 1a and 1a on the front surface side of a light emitting diode body 1 and the rewiring circuits 4 and 4 on the back surface side thereof are connected through conductors 6 and 6 formed in the recesses 2 and 2. Finally, a layer 7 of phosphor is formed on the surface of the light emitting diode body 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an LED display.

  2. Description of the Related Art LED displays that combine a light emitting diode and a phosphor having a color different from the light emitting color of the light emitting diode and mix the colors of the two to emit light in an appropriate color are used in various fields. As for the color to emit light, for example, when a yellow phosphor is arranged on a light emitting diode that outputs a blue emission color, a white mixed color is obtained, and a yellow phosphor is arranged on a light emitting diode that outputs a red emission color. When arranged, a desired mixed color is obtained by appropriately combining different colors such as an orange mixed color.

  Such a conventional LED display is configured as shown in FIG. That is, the LED display 100 is obtained by housing a lead frame 103 in which a light emitting diode 102 is wire-bonded at the bottom of a case 101 and injecting a resin 104 mixed with phosphor powder into the case 101 and solidifying it. It is. In the figure, reference numerals 102a and 102a denote bonding wires.

  In addition, it is well known to electrically connect a light emitting diode to a lead frame or a wiring pattern by wire bonding as disclosed in Patent Documents 1 and 2, for example.

JP 2007-234470 A Utility Model Registration No. 3114129

  However, in the case of such a conventional LED display 100, when the light emitting diode 102 emits light in actual use, there is a problem that color variation occurs due to the shadow of the wire for wire bonding. Further, the lead frame 103 to which the light emitting diode 102 is wire-bonded is accommodated, and the resin 104 mixed with the phosphor powder is injected into the case 101 and solidified. The resin 104 is naturally settled. Therefore, since it takes a considerable time, the manufacturing efficiency is poor, which makes the price of the LED display expensive.

  The present invention has been made in view of the above points, and is provided on the side surface of the light emitting diode main body without bonding by wire bonding to the wiring pattern of the mounting substrate of the light emitting diode as in the conventional LED display. The electrode formed on the front side of the light emitting diode body is connected to the rewiring circuit and the bump formed on the back side by a conductor formed in the recess, and the phosphor is formed on the surface of the light emitting diode body. The layer can be formed, so that the problems of the conventional LED display due to the presence of the bonding wire can be solved, and the resin can be manufactured in a very short time regardless of the natural sedimentation of the resin. An object of the present invention is to provide a method for manufacturing a novel LED display.

  Thus, in the method of manufacturing the LED display according to the present invention, the side surface of the light emitting diode body is provided with a concave portion that communicates from the front surface side to the back surface side, and an insulating layer is formed on the surface of the concave portion. A rewiring circuit and a bump are formed on the back surface, and then, the electrode on the front surface side of the light emitting diode body and the rewiring circuit on the back surface side are connected with a conductor formed in the recess, and finally the light emitting diode body The phosphor layer is formed on the surface.

  In the above manufacturing method, the recesses may be provided on opposite side surfaces of the light emitting diode body.

  Moreover, in the said manufacturing method, the fluorescent substance layer is obtained by superposing | polymerizing and sticking the transparent resin film on the upper and lower sides of the resin film which mixed the fluorescent substance or was apply | coated by printing, and sticking these on the surface of a light emitting diode main body. May be formed.

  Further, in the above manufacturing method, a resin mixed with phosphor powder is applied to the upper surface of the transparent resin film by printing, and a transparent resin film is polymerized and pasted on the upper surface of the resin mixed with the phosphor powder. The phosphor layer may be formed by sticking to the surface of the light emitting diode body.

  In the above manufacturing method, a transparent resin is applied to the surface of the light emitting diode body by printing, and then a resin mixed with phosphor powder is applied to the upper surface of the transparent resin by printing, and further a transparent resin is printed. The phosphor layer may be formed by applying to the upper surface of the resin mixed with the phosphor powder.

  Further, in the above manufacturing method, a transparent resin is applied to the surface of the light emitting diode body by printing, and then a phosphor powder is mixed, or a resin film applied by printing is polymerized and pasted on the upper surface of the transparent resin. Further, the phosphor layer may be formed by mixing the phosphor powder with a transparent resin by printing, or by applying it on the upper surface of the resin film applied by printing.

  Further, in the above production method, phosphor powder is mixed, or a transparent adhesive that is cured by irradiating ultraviolet rays is applied to the back surface of the resin film applied by printing, and the phosphor powder is further mixed, Alternatively, a transparent resin is applied by printing on the upper surface of the resin film applied by printing, or a transparent resin film is polymerized and pasted, and these are placed on the surface of the light-emitting diode body and irradiated with ultraviolet rays. The phosphor powder may be mixed by curing the agent, or a resin film applied by printing may be adhered to form a phosphor layer.

  According to the present invention, the bonding of the light emitting diode to the wiring pattern of the mounting substrate as in the conventional LED display is not performed by wire bonding, but by the conductor formed in the concave portion provided on the side surface of the light emitting diode body. The electrode on the front side of the light emitting diode body is connected to the rewiring circuit and the bump formed on the back side, and the phosphor layer is formed on the surface of the light emitting diode body. The problem of the conventional LED display due to the presence of the bonding wire can be solved, and furthermore, a new LED display can be manufactured in a very short time because it does not depend on the natural sedimentation of the resin. is there.

  In particular, in the manufacturing method of the present invention, the transparent resin formed on the surface of the light emitting diode body, the resin mixed with the phosphor powder, and the formation of the transparent resin on the surface side can all be performed on the wafer, Further, the concave portion provided on the side surface of the light emitting diode body can be easily formed by drilling a through hole in the dicing line of the wafer.

  The best mode for carrying out the LED display manufacturing method according to the present invention will be described below with reference to the drawings.

  FIG. 1 is an explanatory view of a manufacturing method of an LED display according to the first embodiment of the present invention, and FIG. 2 is a central longitudinal sectional front view showing an internal mechanism of a light emitting diode body of the LED display manufactured by the manufacturing method. is there.

  The LED display manufacturing method according to the present embodiment is provided with recesses 2, 2 that communicate from the front side to the back side on opposite sides of the light-emitting diode body 1, and insulating layers 3, 3 on the surfaces of the recesses 2, 2. Next, rewiring circuits 4 and 4 and bumps 5 and 5 are formed on the back surface of the light emitting diode body 1, and then the electrodes 1a and 1a on the front surface side of the light emitting diode body 1 and the rewiring on the back surface side are formed. Circuits 4 and 4 are connected with conductors 6 and 6 formed in the recesses 2 and 2 by plating or through-hole printing, and finally a phosphor layer 7 is formed on the surface of the light-emitting diode body 1. It is a feature. In this embodiment, a light emitting diode body that emits blue light is used, and the color of the phosphor layer 7 is yellow. Moreover, the recessed parts 4 and 4 provided in the side surface of the light emitting diode main body 1 can be formed, for example, by punching through holes in a wafer dicing line.

  In the above manufacturing method, the insulating layers 3 and 3 are thin films of resin such as polyimide by through-hole printing in this embodiment. The metal thin film may be formed by plating instead of through-hole printing. The rewiring circuits 4 and 4 and the bumps 5 and 5 are formed by screen printing.

  In this embodiment, phosphor powder, for example, yellow phosphor powder is mixed, or transparent resin films 9 and 10 are superposed on and under the resin film 8 applied by printing, and these are light-emitting diodes. The phosphor layer 7 is formed by sticking to the surface of the main body 1.

  Thus, the LED display manufactured according to the present embodiment emits white light by mixing the blue light emitted from the light-emitting diode body 1 and the yellow color of the phosphor layer 7. Since it is not used, the problem of color variation due to the shadow of the bonding wire does not occur at all.

Next, a second embodiment of the present invention shown in FIG. 3 will be described.
This embodiment is different from the first embodiment in the formation method of the phosphor layer 7. In this embodiment, the resin in which the phosphor powder is mixed by printing on the upper surface of the transparent resin film 11. 12 is applied, and a transparent resin film 13 is polymerized and adhered to the upper surface of the resin 12 mixed with the phosphor powder, and these are adhered to the surface of the light emitting diode body 1 to form the phosphor layer 7. is doing. Since the other points are the same as those of the first embodiment, the same members are denoted by the same reference numerals and detailed description thereof is omitted.

Next, a third embodiment of the present invention shown in FIG. 4 will be described.
This embodiment is different from the first embodiment in the method of forming the phosphor layer 7, and in this embodiment, a transparent resin 14 is applied to the surface of the light-emitting diode body 1 by printing, Next, the resin 15 mixed with the phosphor powder is applied to the upper surface of the transparent resin 14 by printing, and further the transparent resin 16 is applied to the upper surface of the resin 15 mixed with the phosphor powder by printing. The layer 7 is formed. Since the other points are the same as those of the first embodiment, the same members are denoted by the same reference numerals and detailed description thereof is omitted.

Next, a fourth embodiment of the present invention shown in FIG. 5 will be described.
This embodiment is different from the first embodiment in the method of forming the phosphor layer 7. In this embodiment, a transparent resin 17 is applied to the surface of the light emitting diode body 1 by printing, Next, the phosphor powder is mixed or the resin film 18 applied by printing is superposed on the upper surface of the transparent resin 17, and the transparent resin 19 is mixed with the phosphor powder by printing, or by printing. The phosphor layer 7 is formed by coating on the top surface of the coated resin film 18. Since the other points are the same as those of the first embodiment, the same members are denoted by the same reference numerals and detailed description thereof is omitted.

Next, a fifth embodiment of the present invention shown in FIG. 6 will be described.
This embodiment is different from the first embodiment in the method of forming the phosphor layer 7. In this embodiment, the back surface of the resin film 20 mixed with phosphor powder or coated by printing is used. In addition, a transparent adhesive 21 that is cured by irradiating ultraviolet rays is applied, and the phosphor powder is further mixed, or a transparent resin 22 is applied by printing on the upper surface of the resin film 20 applied by printing. Alternatively, a transparent resin film (not shown) is polymerized and pasted, placed on the surface of the light-emitting diode body 1, and irradiated with ultraviolet rays to cure the adhesive 21 and mix the phosphor powder. Alternatively, the resin film 20 applied by printing is adhered to form the phosphor layer 7. Since the other points are the same as those of the first embodiment, the same members are denoted by the same reference numerals and detailed description thereof is omitted.

  In addition, the LED display of the present invention forms a concave lens or convex lens layer on the surface side of the phosphor layer as necessary, and the formation method is printing with a transparent material such as silicon paste or glass paste, or What is necessary is just to stick by sticking this as a film which formed the lens layer which has a lens function by stamping etc., while resin is soft.

It is explanatory drawing of the manufacturing method of the LED display which concerns on 1st Embodiment of this invention. It is the center vertical front view which abbreviate | omitted and showed the internal mechanism of the light emitting diode main body of the LED display manufactured by the manufacturing method. It is a center vertical front view of the LED display manufactured by the manufacturing method of the LED display which concerns on 2nd Embodiment of this invention. It is a center vertical front view of the LED display manufactured by the manufacturing method of the LED display which concerns on 3rd Embodiment of this invention. It is a center vertical front view of the LED display manufactured by the manufacturing method of the LED display which concerns on 4th Embodiment of this invention. It is a center vertical front view of the LED display manufactured by the manufacturing method of the LED display which concerns on 5th Embodiment of this invention. It is explanatory drawing of the conventional LED display.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting diode main body 2, 2 Recessed part 3, 3 Insulating layer 4, 4 Redistribution circuit 5, 5 Bump 6, 6 Conductor 7 Phosphor layer 8 Resin film which mixed or apply | coated the phosphor powder 9, 10 Transparent resin Film 11 Transparent resin film 12 Resin mixed with phosphor powder 13 Transparent resin film 14 Transparent resin 15 Resin mixed with phosphor powder 16 Transparent resin 17 Transparent resin 18 Resin film mixed with or coated with phosphor powder DESCRIPTION OF SYMBOLS 19 Transparent resin 20 Resin film which mixed or apply | coated the phosphor powder 21 Transparent adhesive hardened | cured by irradiation of an ultraviolet-ray 22 Transparent resin

Claims (8)

  A recess is formed on the side surface of the light emitting diode body from the front surface side to the back surface side, and an insulating layer is formed on the surface of the recessed portion. Next, a rewiring circuit and a bump are formed on the back surface of the light emitting diode body, and then the light emission An LED comprising: a front surface electrode of a diode body and a rewiring circuit on a rear surface side connected by a conductor formed in the recess; and finally, a phosphor layer is formed on the surface of the light emitting diode body. Display manufacturing method.   Provided with recesses communicating from the front side to the back side on opposite side surfaces of the light emitting diode body and formed an insulating layer on the surface of the recess, and then formed a rewiring circuit and bumps on the back surface of the light emitting diode body, Next, the electrode on the front side of the light emitting diode body and the rewiring circuit on the back side were connected with the conductor formed in the recess, and finally the phosphor layer was formed on the surface of the light emitting diode body. A manufacturing method of a featured LED display.   2. A phosphor layer is formed by polymerizing and adhering transparent resin films on top and bottom of a resin film mixed with phosphor or coated by printing, and adhering them to the surface of a light emitting diode. Or the manufacturing method of LED display of 2.   A resin mixed with phosphor powder is applied to the upper surface of the transparent resin film by printing, and further a transparent resin film is polymerized and adhered to the upper surface of the resin mixed with the phosphor powder, and these are applied to the surface of the light emitting diode body. The manufacturing method of the LED display of Claim 1 or 2 formed by forming the layer of fluorescent substance by sticking.   A transparent resin is applied to the surface of the light-emitting diode body by printing, and then a resin mixed with phosphor powder is applied to the upper surface of the transparent resin by printing, and further, the phosphor powder is mixed by printing with a transparent resin. The method for producing an LED display according to claim 1 or 2, wherein a phosphor layer is formed by applying the resin on the upper surface of the resin.   A transparent resin is applied to the surface of the light-emitting diode body by printing, and then phosphor powder is mixed in, or a resin film applied by printing is polymerized and pasted on the upper surface of the transparent resin, and further a transparent resin is printed. The method for producing an LED display according to claim 1 or 2, wherein the phosphor layer is formed by mixing the phosphor powder or applying the phosphor powder on an upper surface of a resin film applied by printing.   A transparent adhesive is applied to the back surface of the resin film mixed with phosphor powder or applied by printing, and a transparent resin is printed on the upper surface of the resin film mixed with the phosphor powder or applied by printing. Apply or paste a transparent resin film, place them on the surface of the light emitting diode body, mix the phosphor powder with the adhesive or adhere the resin film applied by printing, and then the light emitting diode body The method for producing an LED display according to claim 1, wherein a phosphor layer is formed on the surface of the LED. A transparent adhesive that is cured by irradiating ultraviolet rays is applied to the back surface of the resin film mixed with phosphor powder or applied by printing, and further the upper surface of the resin film mixed with the phosphor powder or applied by printing In addition, a transparent resin is applied by printing or a transparent resin film is polymerized and pasted, and these are placed on the surface of the light emitting diode main body, and the adhesive is cured by irradiating with ultraviolet rays to form the phosphor powder. 3. The method of manufacturing an LED display according to claim 1, wherein a resin film mixed or printed is adhered to form a phosphor layer on the surface of the light emitting diode body.

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