JP2009091200A - Molding die for optical element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding die for an optical element which can improve heating efficiency without performing complicated working treatment to the outer face thereof. <P>SOLUTION: Disclosed is a molding die 100 for an optical element composed of a pair of upper and lower dies 110, 120, and wherein, the upper and lower dies, and a molding stock arranged at a space between the upper and lower dies are heated by heat rays radiated from the circumferences thereof, and the molding stock is press-molded. In the molding die for an optical element, the outer circumferences of the upper and lower dies are provided with heat ray absorption members 130, 140, 150 expanding the outer circumferential faces of the upper and lower dies at least to either the upper part or the lower part. According to this constitution, heat rays which have been diffused at the upper part and the lower part of the outer circumferential faces in the upper and lower dies and have not directly contributed to the heating of the molding die in the conventional molding die can be absorbed. In this way, the absorption area of heat rays can be expanded without performing complicated working treatment such as cutting to the outer surface, and heating efficiency can be improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical element mold.

  In recent years, glass optical elements such as lenses, prisms, and optical communication parts that require high optical properties have been mass-produced by press molding. In press molding, molten glass is cooled in a mold to produce a molding material (preform), and the molding material is placed in a molding die having a highly accurate molding surface. And an optical element is shape | molded by pressing after heating a shaping | molding raw material to the temperature of the yield point vicinity of glass through a shaping | molding die, and transferring the shape of a shaping | molding surface to a shaping | molding raw material.

  When heating the molding material, in general, heat rays are radiated from the heat source arranged around the molding die to the outer peripheral surface (heat ray absorbing surface) of the molding die, and the molding die is heated by the radiant heat of the heating rays. The molding material is heated by heat transfer from the mold. Radiant heating by heat rays has higher thermal efficiency than other heating methods such as hot plate heating and high frequency induction heating, so that the heating rate can be improved and the molding process can be shortened.

  Furthermore, in order to improve the heating efficiency, the following Patent Document 1 discloses a molding die in which irregularities are provided on the outer surface of a barrel die surrounding the upper and lower dies. In this mold, the absorption area of the heat rays is expanded by integrally forming the concave stripes and the convex stripes on the outer surface of the mold. However, since the mold including the barrel mold is generally formed of a cemented carbide such as a tungsten alloy or a magnesium alloy having excellent heat resistance, in order to integrally form the concave and convex stripes. It is very difficult to perform complicated processing such as cutting on the outer surface.

JP 2004-91237 A

  The present invention has been made in view of the above problems, and its object is to provide a new and improved optical element mold capable of improving heating efficiency without subjecting the outer surface to complicated processing. It is to provide.

  In order to solve the above-described problems, according to a certain aspect of the present invention, a molding material comprising a pair of upper and lower molds and heated between the upper and lower molds and the upper and lower molds by heat rays radiated from the surroundings is subjected to press molding. There is provided a mold for an optical element used for the purpose. The present optical element mold is characterized in that a heat ray absorbing member is provided on the outer periphery of the upper and lower molds to extend the outer peripheral surface of the upper and lower molds to at least one of the upper and lower sides of the upper and lower molds.

  According to such a configuration, the outer periphery of the upper and lower molds is provided with the heat ray absorbing member that extends the outer peripheral surface of the upper and lower molds above and / or below the upper and lower molds. Heat rays that have diffused upward and downward and have not directly contributed to the heating of the mold can be absorbed. Thus, the heat ray absorption area can be expanded and the heating efficiency can be improved without subjecting the outer surface to complicated processing such as cutting.

  In addition, unevenness may be formed on the heat ray absorbing surface of the heat ray absorbing member. According to such a configuration, irregularities are formed on the heat ray absorbing surface of the heat ray absorbing member, so that it is possible to further expand the heat ray absorbing area and improve the heating efficiency.

  Moreover, the film which raises the absorptivity of a heat ray may be formed in the heat ray absorption surface of the said heat ray absorption member. According to such a configuration, since the coating that increases the heat ray absorption rate is formed on the heat ray absorption surface of the heat ray absorption member, the heat ray absorption rate on the heat ray absorption surface can be increased, and the heating efficiency can be improved. it can.

  Further, the heat ray absorbing member may be formed of a material having a smaller linear expansion coefficient than the upper and lower molds. According to such a configuration, since the heat ray absorbing member is formed of a material having a smaller linear expansion coefficient than the upper and lower molds, expansion of the heat ray absorbing member is smaller than that of the upper and lower molds during heating. Since it becomes difficult to produce a gap between the two, it is possible to ensure heat transfer to the mold.

  The upper and lower molds each include a mold plate for fixing a core mold on which an optical function transfer surface is formed and a mold mold surrounding the core mold to an optical element molding apparatus that press-molds a molding material. And the heat ray absorbing member may be provided on the mold plate. According to such a configuration, since the heat ray absorbing member is provided on the mold plate, the heat ray absorbing member is provided without covering the outer periphery of the mold die. Thereby, it becomes possible to absorb heat rays by the outer peripheral surface of the mold and the heat ray absorbing surface of the heat ray absorbing member, and the heating efficiency can be improved.

  The upper and lower molds are respectively fixed to the press shafts of an optical element molding apparatus for press-molding a molding material via heat insulating members, and the heat ray absorbing members are at least heat insulating members arranged above and below the upper and lower molds. You may provide so that the radiation of the heat ray with respect to either may be shielded. According to such a configuration, since the heat ray absorbing member is provided so as to shield the radiation of the heat ray with respect to the heat insulating member, the heat insulating effect by the heat insulating member between the mold and the molding apparatus can be improved.

  The upper and lower molds may each include a core mold on which an optical function transfer surface is formed, and the heat ray absorbing member may be provided so as to block radiation of heat rays to the optical function transfer surface. According to such a configuration, since the heat ray absorbing member is provided so as to block radiation of heat rays to the optical function transfer surface, excessive heating of the optical function transfer surface is suppressed, and the lifetime of the core mold can be improved. it can.

  ADVANTAGE OF THE INVENTION According to this invention, the shaping | molding die for optical elements which can improve heating efficiency can be provided, without giving a complicated process to an outer surface.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(Configuration of optical element molding apparatus)
FIG. 1 is an explanatory view showing a conventional optical element molding apparatus to which a molding die for optical elements according to an embodiment of the present invention can be applied. As shown in FIG. 1, the molding apparatus includes an upper mold 10, a lower mold 20, a fixed shaft 30, a moving shaft 40, a driving device 60, and a heating unit 70.

  The upper mold 10 is attached to a lower end surface of a fixed shaft 30 extending downward from the upper part of the frame 2 via a heat insulating cylinder 32. The upper mold 10 includes a core mold 12, a mold plate 14, and a mold (fixed) mold 16 that fixes the core mold 12 to the mold plate 14. The lower mold 20 is attached to the upper end surface of the moving shaft 40 extending upward from the lower part of the frame 2 so as to face the upper mold 10 via a heat insulating cylinder 42. The lower mold 20 includes a core mold 22, a mold plate 24, and a mold (moving) mold 26 that fixes the core mold 22 to the mold plate 24. The heat insulating cylinders 32 and 42 suppress heat transfer between the upper mold 10 and the lower mold 20, the fixed shaft 30, and the moving shaft 40.

  In the mold plate 14, a plurality of core molds 12 having a molding surface are arranged, for example, at substantially equal intervals in the circumferential direction, and the plurality of core molds 12 are formed on the mold plate 14 by the mold dies 16. It is fixed. In the mold plate 24, a plurality of core molds 22 having a molding surface facing the core mold 12 are arranged at substantially equal intervals in the circumferential direction, and the plurality of core molds 22 are molded by the mold mold 26. It is fixed to the mold plate 24.

  In order to restrict the positioning between the upper mold 10 and the lower mold 20 during press molding, combinations of positioning pins 17 and positioning holes 27 are provided on the surfaces of the mold dies 16, 26 facing each other. It has been.

  The fixed shaft 30 passes through an opening provided in the upper plate 34, and the upper plate 34 is driven in the vertical direction. The opening is sealed, and the upper plate 34 slides in the vertical direction while maintaining airtightness with the fixed shaft 30. The moving shaft 40 passes through an opening provided in the lower frame 4, and the lower plate 44 is fixed to the lower frame 4. The opening is sealed, and the moving shaft 40 slides in the vertical direction while maintaining airtightness with the lower frame 4.

  The upper mold 10, the lower mold 20, the heat insulating cylinders 32 and 42, the lower end of the fixed shaft 30 and the upper end of the moving shaft 40 are surrounded by an inner cylinder 52 formed of quartz or the like having heat transfer properties, so that airtightness is achieved. It is sealed so as to constitute a held molding chamber 50.

  The drive device 60 uses a motor 62 or the like as a drive source, is provided with a position sensor (not shown) that detects the amount of movement of the moving shaft 40, and is connected to the lower end of the moving shaft 40 via a load detector 64. . The driving device 60 moves the moving shaft 40 in the vertical direction while controlling the position, speed (change gradient of pressing force), and axial load (pressing force).

  The heating unit 70 is attached to an outer cylinder 54 disposed around the inner cylinder 52, and includes a lamp 72 that emits heat rays, such as an infrared lamp and a halogen lamp, and a reflection mirror 74, for example. The heating unit 70 is configured, for example, by stacking a plurality of annular lamps in the vertical direction. In the heating unit 70, the temperature and temperature change (temperature change gradient) due to the radiant heat of the hot wire are controlled through temperature measuring thermocouples (not shown) attached to the upper mold 10 and the lower mold 20, and the output of the lamp 72 is output. Is adjusted. The heating unit 70 radiates heat rays from the lamp 72 to the outer peripheral surfaces of the upper die 10 and the lower die 20, heats the upper die 10 and the lower die 20 by radiant heat of the heat rays, and from the heated upper die 10 and lower die 20 The molding material is heated by heat transfer.

  The heating unit 70, the inner cylinder 52, the outer cylinder 54, and their associated equipment are fixed to the lower side of the upper plate 34, and can be integrally pulled up by another driving device (not shown). Therefore, when the molding material is arranged with respect to the lower mold 20 and the molded optical element is taken out, the interior of the molding chamber 50 can be opened by retracting the heating unit 70, the inner cylinder 52 and the outer cylinder 54 upward. .

  The molding apparatus includes an air supply path from a gas storage tank (not shown) to the air supply port 33 provided in the heat insulation cylinder 32 via the fixed shaft 30, and a heat insulation cylinder 42 from the gas storage tank via the movement shaft 40. An air supply path to the air supply port 43 provided. Further, the molding apparatus was connected to an exhaust passage connected to the gas storage tank from an exhaust port 35 provided on the upper plate 34 and to a vacuum suction device (not shown) from an exhaust port 45 provided on the lower plate 44. And a discharge path.

  The air supply path supplies a predetermined gas (for example, an inert gas such as nitrogen gas) from the gas storage tank to the molding chamber 50 while controlling an air supply valve (not shown) provided on the path. . The exhaust path exhausts a predetermined gas from the molding chamber 50 to the gas storage tank while controlling an exhaust valve (not shown) provided on the path. The discharge path discharges the atmosphere in the molding chamber 50 to the outside by a vacuum suction device while controlling a discharge valve (not shown) provided on the path.

(Outline of press forming)
The press molding of the optical element is performed using a molding apparatus as described above. Here, an outline of press molding of the optical element will be described. In general, press molding consists of purging, heating (temperature rising, soaking), pressing, and cooling (slow cooling, rapid cooling).

  In press molding, first, a molding material is placed in the lower mold 20. In the purge process, the atmosphere in the molding chamber 50 is exhausted by the vacuum suction device, and nitrogen gas is supplied from the gas storage tank into the molding chamber 50 in a vacuum state, so that the atmosphere in the molding chamber 50 is replaced with nitrogen gas. (Purge). In the temperature raising step, the molding material is heated via the molding dies 10 and 20 by the heat rays emitted from the lamp 72 while controlling the heating unit 70 using a thermocouple or the like attached to the molding dies 10 and 20. The In the soaking step, the molding material heated in the temperature raising step is maintained at a predetermined press temperature while controlling the heating unit 70.

  In the pressing step, the lower mold 20 is raised to a predetermined position while controlling the pressing force / movement amount of the driving device 60 using the load detector 64 and the position sensor, and the upper mold 10 and the lower mold 20 form the molding material. Is pressed. In the slow cooling process, the molding material is gradually cooled to a predetermined temperature while controlling the temperature in the molding chamber 50 using cooling by supplying nitrogen gas and heating by the heating unit 70. Even in the rapid cooling process, the molding material is rapidly cooled to a predetermined temperature while controlling the temperature in the molding chamber 50. When the rapid cooling process is completed, the optical element is released from the molds 10 and 20 and taken out from the molding chamber 50.

  Here, paying attention to the heating process, in the heating process, a predetermined clearance is provided between the upper mold 10 and the lower mold 20 so that the molding material is disposed on the lower mold 20 and the upper mold 10 does not contact the molding material. While maintaining the above, heat rays are radiated to the outer peripheral surfaces of the upper mold 10 and the lower mold 20. The height of the clearance (region indicated by “A” in FIG. 1) maintained between the upper mold 10 and the lower mold 20 depends on various conditions such as the shape of the molding material. The total height of the side surfaces of the lower mold 20 (the mold plates 14 and 24 and the mold dies 16 and 26) is about 15 mm.

  Therefore, the heat rays radiated to the outer peripheral surfaces of the upper die 10 and the lower die 20 directly contribute to the heating of the upper and lower dies 10 and 20 through the outer peripheral surface functioning as the heat ray absorbing surface. The heat rays emitted to the upper and lower molds 10 and 20 and the molding material are hardly absorbed and pass between the upper and lower molds 10 and 20 and do not directly contribute to heating of the upper and lower molds 10 and 20. Further, the heat rays radiated above the upper die 10 (region indicated by “B” in FIG. 1) and below the lower die 20 (region indicated by “C” in FIG. 1) It diffuses above and below the lower mold 20 and heats the heat insulating cylinders 32 and 42 disposed above and below the upper and lower molds 10 and 20 without directly contributing to the heating of the upper and lower molds 10 and 20. .

  Thereby, the heating efficiency by the heating unit 70 decreases due to diffusion loss of heat rays, and the time required to heat the upper and lower molds 10 and 20 to a predetermined temperature cannot be shortened. In addition, heating of the heat insulating cylinders 32 and 42 causes the heat insulating effect of the heat insulating cylinders 32 and 42 to be reduced between the upper and lower molds 10 and 20 and the fixed shaft 30 and the moving shaft 40.

(Embodiment of mold)
FIG. 2 is an explanatory view showing an optical element molding apparatus to which a molding die according to an embodiment of the present invention is applied. FIG. 3 is an explanatory view showing a mold according to this embodiment. As shown in FIG. 3, heat ray absorbing members 130, 140, and 150 are provided on the outer peripheries of the upper and lower molds 110 and 120 to expand the outer peripheral surfaces of the upper and lower molds 110 and 120 upward and downward. In the example shown in FIG. 3, the heat ray absorbing member includes a first heat ray absorbing member 130 provided on the outer periphery of the upper die 110, and second and third heat ray absorbing members 140 provided on the outer periphery of the lower die 120, 150.

  The first heat ray absorbing member 130 extends substantially vertically upward from the side surface of the mold plate 114, and the upper end portion is bent toward the heating unit side 70. The second heat ray absorbing member 140 extends substantially vertically downward from the side surface of the mold plate 124, and a lower end portion thereof is bent toward the heating unit 70 side. Further, the third heat ray absorbing member 150 extends substantially vertically upward from the side surface of the mold 126 so as to overlap the clearance portion A between the upper mold 110 and the lower mold 120. The third heat ray absorbing member 150 is provided so as not to interfere with the upper mold 110 or the first heat ray absorbing member 130 during the pressing process.

  The heat ray absorbing members 130, 140, 150 are installed on the entire outer periphery of the upper and lower molds 110, 120. The heat ray absorbing members 130, 140, 150 are fixed in a state where they are securely in contact with the upper and lower molds 110, 120 in order to ensure heat transfer with respect to the upper and lower molds 110, 120, and further tightened if necessary. By doing so, it is installed on the outer periphery of the upper and lower molds 110, 120. In FIG. 3, between the mold plate 114 and the first heat ray absorbing member 130, between the mold plate 124 and the second heat ray absorbing member 140, the mold die 126 and the third heat ray absorbing member 150, The case where the engaging part which mutually engages between is provided is shown. In fixing the heat ray absorbing members 130, 140, and 150, various fixing means that can fix the heat ray absorbing members 130, 140, and 150 in a state where heat transfer properties can be ensured, such as placement, engagement, and connection. Can be used. Further, when fastening the heat ray absorbing members 130, 140, 150, various fastening means such as an annular fastener that surrounds the outer peripheries of the upper and lower molds 110, 120 can be used.

  Similarly to the upper and lower molds 110 and 120, the heat ray absorbing members 130, 140, and 150 may be formed of, for example, a cemented carbide such as tungsten alloy or magnesium alloy having excellent heat resistance, or heat resistance and heat transfer properties. It may be formed of other materials excellent in the above. In order to ensure that the heat ray absorbing members 130, 140, 150 are in contact with the upper and lower molds 110, 120, the heat ray absorbing members 130, 140, 150 are formed of a material having a smaller linear expansion coefficient than the upper and lower molds 110, 120. It is desirable. Thereby, in the heating process, the expansion of the heat ray absorbing members 130, 140, 150 is smaller than the expansion of the upper and lower molds 110, 120. Therefore, the upper and lower molds 110, 120 and the heat ray absorbing members 130, 140, 150 It is difficult to generate a gap between them, and reliable contact is maintained between the upper and lower molds 110, 120 and the heat ray absorbing members 130, 140, 150.

  By expanding the heat ray absorbing members 130 and 140 above and below the upper and lower molds 110 and 120, it is possible to absorb heat rays radiated to the upper and lower parts of the upper and lower molds 110 and 120. By bending the end portions of the heat ray absorbing members 130 and 140 toward the heating unit 70, the heat rays diffusing above and below the upper and lower molds 110 and 120 can be more reliably absorbed. By providing the heat ray absorbing members 130 and 140 on the side surfaces of the mold plates 114 and 124, the outer peripheral surface can be expanded without covering the outer peripheral surfaces of the mold dies 116 and 126, and heating efficiency is improved. Can be made. Further, by absorbing the heat rays diffusing above and below the upper and lower molds 110 and 120, the radiation of the heat rays to the heat insulating cylinders 32 and 42 provided above and below the upper and lower molds 110 and 120 is shielded, and the heat insulating cylinder 32. , 42 can be improved. Further, by providing the heat ray absorbing member 150 so as to overlap the clearance portion A between the upper die 110 and the lower die 120, the heat rays radiated to the clearance portion A can be efficiently absorbed. Furthermore, by providing the heat ray absorbing member 150 so as to block radiation of the heat ray to the optical function transfer surface provided on the molding surface of the core molds 12 and 22, excessive heating of the optical function transfer surface is suppressed, and the core The service life of the molds 12 and 22 can be improved.

  The heat ray absorbing members 130, 140, 150 may be provided on the outer periphery of the upper and lower molds 110, 120 in place of the entire outer periphery. Moreover, instead of providing all of them, only a part of the heat ray absorbing members 130, 140, 150 may be provided. The heat ray absorbing member 150 may be provided in the upper mold 110 instead of being provided in the lower mold 120. The heat ray absorbing member 150 may be formed integrally with the heat ray absorbing members 130 and 140.

  As described above, according to the mold 100 according to the embodiment of the present invention, the heat ray absorbing member 130 that extends the outer peripheral surfaces of the upper and lower molds 110 and 120 above and / or below the upper and lower molds 110 and 120, Since 140 and 150 are provided, in the conventional mold, the heat rays that diffused above and below the outer peripheral surface and did not directly contribute to the heating of the mold can be absorbed. Thus, the heat ray absorption area can be expanded and the heating efficiency can be improved without subjecting the outer surface to complicated processing such as cutting. And the heating efficiency of the shaping | molding die 100 can be improved, and the shortening of a heating process and the shortening of the whole shaping | molding process can be implement | achieved.

(Modification of mold)
FIG. 4 is an explanatory view showing a mold according to a modification of the embodiment. The heat ray absorbing members 130, 140, 150 shown in FIG. 4 are processed on the heat ray absorbing surfaces.

  Concavities and convexities 132, 142, and 152 are formed on the heat ray absorbing surfaces of the heat ray absorbing members 130, 140, and 150 shown in FIG. Here, the irregularities 132, 142, and 152 are formed, for example, as knurling, dimples, or wrinkles. These irregularities 132, 142, 152 are formed relatively easily with respect to the concave stripes, convex stripes and the like provided in the conventional mold. By forming the irregularities 132, 142, and 152 on the heat ray absorbing surface, the heat ray absorption area can be expanded and the heat ray absorption rate can be improved. FIG. 4A shows a case where irregularities 132, 142, 152 are formed on almost the front surface including the front and back surfaces of the heat ray absorbing members 130, 140, 150. , 140, 150 may be formed only on a part of the surface.

  Films 134, 144, and 154 that increase the absorption rate of the heat rays are formed on the heat ray absorbing surfaces of the heat ray absorbing members 130, 140, and 150 shown in FIG. Here, the coatings 134, 144, and 154 are formed of a material having excellent heat resistance and heat ray absorption. The film material is, for example, TiAlN (titanium nitride aluminum). TiAlN is excellent in heat resistance at an oxidation temperature of about 900 ° C., is a material used as an antioxidant film for a mold, and can form a bluish purple film, so that it has an excellent heat ray absorption rate. By forming the coatings 134, 144, and 154 that increase the heat ray absorption rate on the heat ray absorption surface, the absorption rate of the heat ray absorption surface can be improved. FIG. 4B shows the case where the coatings 134, 144, 154 are formed on almost the front surface including the front and back surfaces of the heat ray absorbing members 130, 140, 150. , 140, 150 may be formed on only a part of the surfaces 134, 144, 154.

  Moreover, the unevenness | corrugation 132,142,152 shown in FIG. 4 (A) is formed in the heat ray absorption surface of the heat ray absorbing member 130,140,150, and also FIG.4 (B) is formed in the surface of the unevenness | corrugation 132,142,152. ) May be formed. In this case, coatings 134, 144, and 154 having substantially uniform thicknesses are formed on the surfaces of the irregularities 132, 142, and 152. Thereby, the heat ray absorption area can be expanded by the unevenness 132, 142, 152, and further, the heat ray absorption rate at the heat ray absorption surface can be increased by the coatings 134, 144, 154. Further improvement can be achieved.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, this invention is not limited to the example which concerns. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, in the above embodiment, the molding die 100 in the case where a plurality of molding materials are arranged has been described. However, the present invention is similarly applicable to a mold when a single molding material is arranged.

It is explanatory drawing which shows the conventional optical element shaping | molding apparatus which can apply the shaping | molding die for optical elements which concerns on one Embodiment of this invention. It is explanatory drawing which shows the optical element shaping | molding apparatus to which the shaping | molding die for optical elements which concerns on one Embodiment of this invention was applied. It is explanatory drawing which shows the shaping | molding die concerning one Embodiment of this invention. It is explanatory drawing which shows the shaping | molding die which concerns on the modification of the said embodiment.

Explanation of symbols

100 Mold 100 Upper mold 120 Lower mold 112, 122 Core mold 114, 124 Mold plate 116, 126 Mold mold 130, 140, 150 Heat ray absorbing member

Claims (7)

A pair of upper and lower molds, heating the molding material arranged between the upper and lower molds and the upper and lower molds by heat rays radiated from the surroundings, in a molding die for optical elements used for press molding,
A mold for an optical element, characterized in that a heat ray absorbing member is provided on an outer periphery of the upper and lower molds to extend an outer peripheral surface of the upper and lower molds to at least one of an upper side and a lower side of the upper and lower molds.   The optical element molding die according to claim 1, wherein unevenness is formed on a heat ray absorbing surface of the heat ray absorbing member.   3. The optical element molding die according to claim 1, wherein a coating for increasing a heat ray absorption rate is formed on a heat ray absorbing surface of the heat ray absorbing member.   The optical element molding die according to claim 1, wherein the heat ray absorbing member is made of a material having a smaller linear expansion coefficient than the upper and lower molds. The upper and lower molds each have a mold plate for fixing a core mold on which an optical function transfer surface is formed and a mold mold surrounding the core mold to an optical element molding apparatus that press-molds a molding material. Including
The optical element molding die according to claim 1, wherein the heat ray absorbing member is provided on the mold plate. The upper and lower molds are fixed to each via a heat insulating member on a press shaft of an optical element molding apparatus that press-molds a molding material,
The heat ray absorbing member is provided so as to shield radiation of heat rays to at least one of the heat insulating members arranged above and below the upper and lower molds. The mold for optical elements described. The upper and lower molds each include a core mold on which an optical function transfer surface is formed,
The optical element molding die according to claim 1, wherein the heat ray absorbing member is provided to block radiation of heat rays to the optical function transfer surface.

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