JP2009080972A - Connection structure, wiring board connector, wiring board module, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of narrow pitch and low profile, capable of coping with reduction in thickness and size. <P>SOLUTION: The connection structure includes a housing 20 in which a wired board is mounted, and an actuator which pressurizes a connected wiring board. The housing 20 includes an upper surface side first electrode 21a (upper surface side conductive layer) connected to a first wiring of the connected wiring board, and an upper surface side second electrode 21b (upper surface side conductive layer) connected to a second wiring of the connected wiring board. The upper surface side first electrode 21a and the upper surface side second electrode 21b are arranged in zigzag when viewed from above. The upper surface side first electrode 21a is connected to a lower surface side first electrode 22a by way of a through hole conductive layer 23, and the upper surface side second electrode 21b is connected to a lower surface side second electrode 22b by way of a side surface conductive layer 24. The lower surface side first and second electrodes 22a and 22b are respectively connected to wirings of a base board. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a connection structure, a wiring board connector, a wiring board module, and an electronic device for connecting wirings.

  2. Description of the Related Art Conventionally, film-shaped wiring bodies, so-called flexible wiring boards, are often arranged particularly in small and light electrical devices such as mobile phones. In recent years, flexible wiring boards have been used more frequently because they are very convenient for electrical connection in devices having an opening / closing mechanism and a rotating mechanism such as a mobile phone. A flexible wiring board is rich in flexibility, but unlike a hard wiring board having a rigid structure, it is difficult to increase the insertion force when it is inserted into the insertion port of the connector. Therefore, a non-insertion force connector (ZIF) is widely used as a connection structure (connector) for connecting a flexible wiring board to another wiring board (see Patent Document 1).

  FIG. 12 is a perspective view showing the structure of the ZIF connector disclosed in FIG. The connector is constructed by incorporating an actuator 105 and a plurality of contact pins 106-1, 106-i, 106-n, 107-1, 107-i and 107-n in the housing 100. The actuator 105 is attached with a rotating shaft 105a extending from both ends thereof and supported by the reinforcing metal fitting 108. The reinforcing metal fitting 108 is fixed to the housing base portion 101a by inserting a protrusion into a hollow hole portion 101a formed in the housing base portion 101. A similar notch 102a having a substantially U-shape opening forward is formed on the side surfaces of the restriction plates 102-1, 102-2, and a similar notch is also formed on the side surface of the reinforcing metal fitting 108. Yes.

  The plurality of contact pins 106-1, 106-i, 106-n function as leaf springs, the front ends thereof are contact portions with the wiring, and the rear end portions extend below the housing base portion 101. . Further, the plurality of contact pins 107-1, 107-i, 107-n function as leaf springs, the protrusions near the tips serve as contact portions with the wiring, and the rear ends are below the housing base portion 101. It extends to. The rear ends of the contact pins 106-1, 106-i, 106-n, 107-1, 107-i, and 107-n are on the hard printed wiring board on which the connector 100 is mounted. It is connected to the wiring pattern of the board by solder.

  The contact portions of the contact pins 106-1, 106-i, 106-n, 107-1, 107-i, 107-n are arranged in a staggered manner, and are staggered at the tip of a flexible printed wiring board (not shown). It is provided so as to correspond to the wiring pad portion arranged in (1).

When connecting the hard printed wiring board to the connector, the flexible printed wiring board is placed between the regulating plates 102-1 and 102-2 with the surface of the flexible printed wiring board provided with the wiring pattern on the lower side. After inserting and engaging the engaging portions with the notches 102a of the regulating plates 102-1 and 102-2, the actuator 105 is rotated to press the flexible printed wiring board. And the contact part of each contact pin 106-1,106-i, 106-n, 107-1,107-i, 107-n and the wiring pad part of a flexible printed wiring board are mutually pressed by a spring force. That electrical connection is ensured.
JP 2007-194017 A

  However, in the conventional ZIF connector, a large number of contact pins 106-1, 106-i, 106-n, 107-1, 107-i, 107-n arranged at a narrow pitch are inserted into the grooves of the housing 100. In order to ensure mechanical strength, there is a limit to the reduction in height and thickness dimension. Therefore, with the conventional ZIF connector structure, it has been difficult to reduce the height in response to the narrow pitch of the wiring and the thinning of the mounted device.

  An object of the present invention is to provide a connection structure that is advantageous in reducing the height and height of a sandwiched pitch that can be reduced in thickness and size, and a wiring board connection body using the connection structure.

In the connection structure of the present invention, a conductive material is deposited on the upper surface side where the connected wiring is inserted, and an upper surface side conductive layer is provided on the housing for mounting the connected wiring, and the lower surface side facing the upper surface A conductive material is deposited on the lower surface side conductive layer, and the upper surface side conductive layer and the lower surface side conductive layer are connected by a through-hole conductive layer or a side surface conductive layer formed by depositing the conductive material. It is.
Methods for depositing the conductive material include printing, coating, spraying, plating (including electroless plating), CVD, and the like, and any of them may be used.

  Thus, when the housing of the connection structure is mounted on the mother board, the connected wiring and the mother board are simply connected directly to the wiring of the mother board on the lower surface side conductive layer provided on the lower surface side of the housing. Can be electrically connected. Even if the wiring is provided at a narrow pitch, electrical connection is made through a wiring pattern formed in a continuous housing, not a separated member like a connector pin, so that the housing is thinned. However, mechanical strength can be ensured. Therefore, it is possible to realize a connection structure with a narrow pitch and a low profile that can cope with a reduction in size and thickness of the electronic device to be mounted.

  In the connection structure, in each of the plurality of upper surface side conductive layers and lower surface side conductive layers, a staggered first electrode and a second electrode are provided, and the upper surface side conductive layer and the first electrode of the lower surface side conductive layer are provided. By electrically connecting at least one of the second electrode and the second electrode through the through-hole conductive layer, a space for forming a conductive layer for connection in the housing can be saved. In addition, reliability is improved by reducing the number of portions where the conductive layer for connection is exposed.

  Therefore, it is more preferable to electrically connect both the first electrode and the second electrode of the upper surface side conductive layer and the lower surface side conductive layer via the through-hole conductive layer.

  Since the surface of the upper surface side conductive layer has a concavo-convex pattern, the electrical connection between the upper surface side conductive layer and the wiring of the connected wiring board becomes more reliable, and the reliability is improved.

  The wiring board connector of the present invention includes a mother board on which a plurality of wirings are formed, a connected wiring board on which a plurality of wirings are formed, and the connection structure of the present invention. It is possible to provide a wiring board connecting body suitable for downsizing and thinning of a device in which the board connecting body is incorporated.

  The wiring board module of the present invention is obtained by mounting an electronic component on at least one of a mother board and a connected wiring board, and the electronic device of the present invention includes this wiring board module. Also in these, it is possible to provide a wiring board module and an electronic device suitable for downsizing and thinning.

  According to the connection structure, wiring board connection body, wiring board module, or electronic device of the present invention, each part can be reduced in size and thickness through a narrow pitch and a low height of the connection structure.

-Structure of connection structure-
FIG. 1 is a perspective view showing a structure of wiring board connector A according to the present embodiment as viewed from the upper surface side. FIG. 2 is a perspective view showing a structure of the connection structure B and the FPC 50 as viewed from the lower surface side. FIG. 3 is a perspective view showing a structure of the housing 20 of the connection structure B as viewed from the upper surface side. As shown in FIG. 1, the wiring board connector A of the present embodiment includes a hard printed wiring board (hereinafter abbreviated as PCB) 10 as a mother board and a flexible printed wiring board (hereinafter referred to as a connected wiring board). , Abbreviated as FPC) 50 and a wiring board connector B for connecting the two.

  As shown in FIGS. 1 and 2, the FPC 50 includes a base film 52, a first wiring 51a provided on the lower surface side of the base film 52, a lower surface side coverlay 54 that covers the first wiring 51a, and a base film. 52 is provided with a second wiring 51b provided on the upper surface side of 52, and a second coverlay 53 covering the second wiring 51b. Here, the first wiring 51a and the second wiring 51b are alternately arranged at a pitch of about 0.2 mm when viewed in a plan view, and are staggered when viewed from the front end surface. The total thickness of the FPC 50 is approximately 0.12 mm, and the width of the entire FPC 50 is approximately 3 mm to 25 mm, although it varies depending on the number of terminals and the pitch. In FIG. 1 and FIG. 2, only 10 pieces of the first wiring 51a and the second wiring 51b are displayed for easy viewing, but 20 pieces are arranged in this embodiment.

  As shown in FIGS. 1 to 3, the connection structure B includes a housing 20 (housing) into which the FPC 50 is inserted, and an actuator 40 that is a pressing member that presses the FPC 50 inserted into the housing 20. . A wiring 11 is formed on the PCB 10, and the connection structure B is configured by arranging members for electrically connecting the first wiring 51 a and the second wiring 51 b of the FPC 50 and the wiring 11 of the PCB 10. Has been.

  The housing 20 of the connection structure B has an upper surface 20a on which the FPC 50 is mounted and a lower surface 20b opposite to the upper surface 20a in a main body portion 26 between both frame portions 25 into which the actuator 40 is fitted. The upper surface 20a includes a mounting surface 20a1 on which the FPC 50 is mounted, and a blocking surface 20a2 provided on the front end side of the mounting surface 20a1 with a predetermined level difference from the mounting surface 20a1, for blocking the FPC 50. have. The placement surface 20a1 is provided with the upper surface side first electrode 21a connected to the first wiring 51a of the FPC 50, and the upper surface side second electrode connected to the second wiring 51b of the FPC 50 is provided on the stop surface 20a2. An electrode 21b is provided. Each of the upper surface side first electrode 21a and the upper surface side second electrode 21b is an upper surface side provided by depositing a conductive material by printing, coating, spraying, plating (including electroless plating), CVD, or the like. It is a conductive layer. The upper surface side first electrodes 21a and the upper surface side second electrodes 21b are alternately arranged in a staggered manner with a pitch of 0.2 mm as viewed in a plane, that is, with a pitch of 0.4 mm independently.

  The lower surface 20b facing the upper surface 20a of the housing 20 has a lower surface side first electrode 22a provided at a position corresponding to the upper surface side first electrode 21a and a lower surface provided at a position corresponding to the upper surface side second electrode 21b. The side second electrodes 22b are staggered. The lower surface side first electrode 22a and the lower surface side second electrode 22b are all provided by depositing a conductive material by printing, coating, spraying, plating (including electroless plating), CVD, or the like. It is a conductive layer. The upper surface side first electrode 21a and the lower surface side first electrode 22a are connected via a through-hole conductive layer (not shown), and the upper surface side second electrode 21b and the lower surface side second electrode 22b are side surface conductive layers. 24 is connected.

  On the other hand, the actuator 40 of the connection structure B includes a first pressing terminal 41 a and a second pressing terminal 41 b arranged in a staggered manner in the opening of the holding frame 45. On the distal end side of the holding frame 45 of the actuator 40, a fixing portion 46 for engaging with the distal end of the housing 20 and fixing the actuator 40 is provided. Details of the structure of the actuator 40 will be described later.

-Housing manufacturing method and cross-sectional structure-
4A to 4F are cross-sectional views illustrating the manufacturing process of the housing 20. However, FIGS. 4A to 4F show cross-sectional structures that pass through both the upper surface side first electrode 21a and the upper surface side second electrode 21b.
As shown in FIG. 4A, the main body portion 26 of the housing 20 is provided with a through hole 27 and an insertion port 28 into which the FPC 50 is inserted.

  First, in the step shown in FIG. 4A, the catalyst layer 30 is deposited on the entire surface of the housing 20 including the main body portion 26 made of synthetic resin, the both frame portions 25, the through holes 27, and the inner surfaces of the insertion ports 28. At that time, the housing 20 is conditioned, washed with water, and pre-dipped. Then, the catalyst is applied and immersed in a catalyst solution containing Pd (for example, a tin chloride-palladium chloride colloid solution), and a colloid composed of a Pd compound is formed on the surface of the housing 20. The particles are attached to form a catalyst layer 30 to which the colloidal particles are attached.

  Next, in the step shown in FIG. 4B, a resist layer 31 is formed on the entire surface of the housing 20 including the main body portion 26, both frame portions 25, the through hole 27, and the insertion port 28. As the resist material, for example, a thermoplastic polyamide obtained by melt-mixing polyamide and polyamidoamine and performing an amide exchange reaction is used.

  Next, in the step shown in FIG. 4C, by etching, regions in the resist layer 31 where the electrodes 21a, 21b, 22a, and 22b, through-hole conductive layers and side conductive layers are to be formed are removed. To do. At this time, a portion of the resist layer 31 covering the inner surface of the through hole 27 and a portion covering a part of the tip surface are also removed.

  Next, in the step shown in FIG. 4D, electroless plating is performed, and a copper sulfate solution or the like is obtained by electroless Cu plating using a solution containing copper ions such as copper sulfate and a reducing agent such as formaldehyde. Cu is deposited around the catalyst particles to form a Cu layer on the catalyst layer 30 excluding the region covered with the resist layer 31. Thereafter, the Ni alloy layer 33 is deposited on the Cu layer by electroless Ni plating using a solution containing Ni ions such as nickel sulfate and a reducing agent containing phosphinate ions. Then, it is washed with water.

  Next, in the step shown in FIG. 4E, the Au layer 34 is formed by displacement gold plating. At that time, when an electrochemically base metal (Ni) is immersed in a solution containing electrochemically noble metal (Au) ions, noble metal ions are released by electrons released by dissolution of the base metal. The noble metal (Au) coating is deposited on the base metal (Ni) surface. Note that the Au layer 34 may be formed by autocatalytic electroless plating after displacement plating. Then, the electroless plating process is completed by drying through water washing and alcohol substitution.

  Next, in the step shown in FIG. 4F, the catalyst layer 30 and the resist layer 31 except for the region covered with the Au layer 34 are removed. Thereby, the upper surface side first electrode 21a and the upper surface side second electrode 21b (upper surface side conductive layer) composed of the catalyst layer 30, the Ni alloy layer 33 and the Au layer 34, the lower surface side first electrode 22a and the lower surface side second electrode. 22b (lower surface side conductive layer), through-hole conductive layer 23 and side surface conductive layer 24 are formed.

  In the present embodiment, the upper surface side conductive layer and the lower surface side conductive layer, the through-hole conductive layer 23 and the side surface conductive layer 24 are formed using electroless plating, but printing, coating, spraying, CVD, etc. Each conductive layer may be formed. However, the conductive layer formed by electroless plating has better adhesion to the base and the accuracy for forming a fine pattern compared to the conductive layer formed by printing, coating, spraying, CVD, etc. It has an excellent characteristic that it can be maintained. That is, by forming each conductive layer by electroless plating, it is possible to greatly advance the pitch and height reduction.

  As will be described later, when the connection structure B including the housing 20 is mounted on the PCB 10 that is the mother board, the wirings 51a and 51b of the FPC 50 that is the connected wiring board and the wiring 11 on the PCB 10 (see FIG. 1). ) Can be electrically connected. At that time, in the housing 20 of the present embodiment, each electrode 21a, 21b, 22a, 22b formed by depositing a conductive material on the surface of the housing 20, the through-hole conductive layer 23, the side conductive layer 24, Therefore, even if the thickness of the main body portion 26 of the housing 20 is reduced, the overall mechanical strength can be ensured. That is, as in Patent Document 1, it is not necessary to increase the thickness of the housing in order to maintain the strength of each part of the housing that is divided by the connector pins as in the structure of connecting to the mother board via individual connector pins. It is.

In particular, by connecting the upper surface side first electrode 21a and the lower surface side first electrode 22a through the through-hole conductive layer 23, a space for routing the conductive layer for connection on the main body 26 is omitted. Can do. That is, by adopting this structure, when the upper surface side first electrode 21a and the upper surface side second electrode 21b are staggered, the conductive layer for connecting the upper surface side first electrode 21a (through-hole conductive layer 23). Does not need to pass through between the upper surface side second electrodes 21b. Therefore, it is possible to reduce the pitch between the electrodes 21a, 21b, 22a, and 22b while maintaining the minimum electrode width determined for manufacturing restrictions and ensuring reliability.
As a result, the housing 20 of the present embodiment has a width of about 9.4 mm, a depth of about 3.1 mm, and a height of 0.55 mm, and can achieve both a narrow pitch and a low profile. it can.

  In the above embodiment, the rigid substrate serving as the base material of the PCB 10 is not limited to a glass epoxy plate, but a paper phenol plate, a paper epoxy plate, a fluororesin plate, an alumina plate, or the like is used. As a material for the wiring 11, a copper alloy is generally used, but is not limited thereto. As a base film of FPC50, not only a polyimide film but a polyester film (low temperature use), a glass epoxy laminated board (thin board), a liquid crystal polymer, PEEK (polyether ether ketone), etc. are used. As a material constituting the cover lays 53 and 54 of the FPC 50, polyimide film, polyester film, and screen printing ink (epoxy, etc.) are used, and polyimide, acrylic, and epoxy resin are used as the photosensitive cover lay. As a material for each of the wirings 11, 51a, 51b, a copper alloy is generally used, but is not limited thereto. Although both the frame part 25 and the main-body part 26 of the housing 20 are comprised by engineering plastic etc., it is not limited to this, You may comprise by another resin, an inorganic material, etc.

-Modification-
FIGS. 5A and 5B are a perspective view showing a structure of a housing according to a modification of the above embodiment as viewed from the upper surface side and a perspective view of the structure as viewed from the lower surface side, respectively. 5 (a) and 5 (b), portions common to the structures shown in FIGS. 2 and 3 are denoted by the same reference numerals, description thereof is omitted, and only different portions are described.

In this modification, not only between the upper surface side first electrode 21a and the lower surface side second electrode 22a, but also between the upper surface side second electrode 21b and the lower surface side second electrode 22b by the through-hole conductive layer 23, Electrically connected. Thereby, since the conductive layer for connecting the electrodes is not exposed on the surface of the housing 20, there is a risk of being damaged by contact with other members or causing an electrical short circuit between the electrodes on the surface. Less and improves reliability.
In addition, as shown in the enlarged cross-sectional view, an uneven pattern may be formed in a portion of the main body portion 26 corresponding to the base of the upper surface side first electrode 21a. Thereby, the 1st wiring 51a of FPC50 and upper surface side 1st electrode 21a will contact more reliably.

-Actuator structure and manufacturing method-
6A and 6B are a perspective view showing the structure of the actuator 40 according to the present embodiment as viewed from the upper surface side and a perspective view of the structure as viewed from the lower surface side, respectively.
As shown in FIGS. 6A and 6B, the holding frame 45 of the actuator 40 of the connection structure B is provided in a lattice shape, and exists in the gap between the plurality of vertical and horizontal lattice portions 45a and the lattice portion 45a. And an engaging portion 45c that engages with the front end portion of the FPC 50. And the 1st press terminal 41a and the 2nd press terminal 41b are arrange | positioned at the opening part 45b of the holding frame 45 in zigzag form. In addition, a fixing portion 46 that is bent downward at a substantially right angle from the holding frame 45 is provided on the distal end side of the holding frame 45 of the actuator 40. The fixing portion 46 is a member for engaging the distal end portion of the housing 20 and fixing the actuator 40. Further, at the base end portion of the holding frame 45, a projecting portion 47 for switching contact between a body frame of the actuator 40 described later and a core portion of the housing 20, and the actuator 40 are rotated with respect to the housing 20. A rotating shaft 48 is provided.

  The first pressing terminal 41a has an intermediate portion bent in a curved shape downward from both ends embedded in the lattice portion 45a (so-called bellows shape), and, as will be described later, the spring portion of the FPC 50 A portion of the upper surface facing the first wiring 51a is pressed. On the other hand, the second pressing terminal 41b has a first partial terminal 41b1 and a second partial terminal 41b2 that are embedded in the lattice part 45a at both ends and bent downward in a curved shape at the intermediate part ( So-called bellows shape). As will be described later, the first spring portion 41b1 which is one spring portion of the second pressing terminal 41b contacts the second wiring 51b of the FPC 50, while the second spring portion 41b2 which is the other spring portion is the upper surface of the housing 20. By making contact with the second side electrode 21b, the second wiring 51b of the FPC 50 and the upper surface side second electrode 21b of the housing 20 are electrically connected to each other by the second pressing terminal 41b.

7A and 7B are perspective views schematically showing a manufacturing procedure of the actuator 40. FIG.
First, as shown in FIG. 7A, a metal frame C including a core and a pressing terminal is formed by punching and bending Cu or a Cu alloy with a press. In the present embodiment, Cu or Cu alloy is used as the metal frame C, but is not limited to this.

  The metal frame C has a main body frame C1 connected to the first pressing terminal 41a and a tip frame C2 connected to the second pressing terminal 41b. The tip frame C2 further has a bellows part C2-1 and a reinforcing part C2-2. In the metal frame C, the main body frame C1 and the tip frame C2 are connected.

Next, the metal frame C is set in a molding die, and the metal frame C and the resin portion are integrally molded with resin. At this time, as the resin, PBT (polybutylene terephthalate), LCP (liquid crystal polymer), or a thermoplastic polyamide resin obtained by melt-mixing polyamide and polyamidoamine and performing amide exchange is used.
Then, the connection part of the main body frame C1 of the metal frame C and the front-end | tip frame C2 is cut | disconnected, and the 1st press terminal 41a and the 2nd press terminal 41b are electrically cut | disconnected. As a result, the actuator 40 as described in FIGS. 6A and 6B is formed.

-Assembly structure of connection structure-
FIG. 8 is a perspective view showing a part of the connection structure B by breaking it. As shown in the figure, a reinforcing core 29 made of metal is embedded in a portion of the housing 20 located above the insertion port 28. As shown in FIG. 8, when the actuator 40 is closed (a state in which the FPC 50 is pressed), the core 29 of the housing 20 and the protruding portion 47 of the actuator 40 are in contact with each other, and are grounded as a whole. It can function as a part. On the other hand, when the actuator 40 is opened (a state in which the FPC 50 is opened), the core 29 of the housing 20 and the protruding portion 47 of the actuator 40 are separated from each other, and both are electrically disconnected.

  By configuring the reinforcing core 29 so as to function also as a ground, the first pressing terminal 47 of the actuator 40 is brought into contact with the upper surface of the FPC 50 when the FPC 50 is inserted. A grounding portion having a large electric capacity can be configured.

  FIG. 9 is a perspective view showing a cross section passing through the upper surface side first electrode and the lower surface side first electrode. FIG. 10 is a perspective view showing a cross section passing through the upper surface side second electrode and the lower surface side second electrode. 9 and 10, the illustration of the PCB 10 is omitted.

  When the FPC 50 is inserted into the housing, the actuator 40 is rotated so as to be closed, and the actuator 40 is closed while the fixing portion 46 of the actuator 40 is engaged with the distal end portion of the housing 20. Then, as shown in FIGS. 9 and 10, the actuator 40 is completely closed.

  At this time, as shown in the enlarged sectional view of FIG. 9, the first pressing terminal 41 a of the actuator 40 is in the upper surface side coverlay 53 of the FPC 50 in the cross section passing through the upper surface side first electrode 21 a and the lower surface side first electrode 22 a. Since the site | part located in the back side of the 1st wiring 51a is pressed, the contact with the 1st wiring 51a of FPC50 and the 1st electrode 21a of the housing 20 is ensured. Further, the upper surface side first electrode 21a and the lower surface side first electrode 22a of the housing 20 are electrically connected through the through-hole conductive layer 23, and the lower surface side first electrode 22a and the wiring 11 of the PCB 10 are in contact with each other. ing. Therefore, the first wiring 51 a of the FPC 50 and the wiring 11 of the FPC 10 (mother substrate) are electrically connected via the connection structure B.

  On the other hand, as shown in FIG. 10, in the cross section passing through the upper surface side second electrode 21b and the lower surface side second electrode 22b, the lower end portion of the first spring portion 41b1 of the second pressing terminal 41b is connected to the second wiring 51b of the FPC 50. The second spring part 41b2 is in contact with the upper surface side second electrode 21b of the housing 20. The upper surface side second electrode 21b is connected to the lower surface side second conductive layer 22b via the side surface conductive layer 24, and the lower surface side second conductive layer 22b is in contact with the wiring 11 of the PCB 10 (mother substrate). . Therefore, the second wiring 51b of the FPC 50 and the wiring 11 of the FPC 10 (mother substrate) are electrically connected via the connection structure B.

  According to the actuator 40 of the present embodiment, both ends (a part) are embedded in the resin frame J, and the intermediate part (the other part) comes into contact with the FPC 50 (connected wiring board) and the spring presses the FPC 50. Since the first pressing terminal 41a and the second pressing terminal 41b are provided, the pressing terminals 41a and 41b are within the thickness range of the resin frame J (see FIGS. 9 and 10). Further, the housing 20 does not need to be provided with a spring mechanism for pressing. Therefore, the thickness of the actuator 40 can be reduced compared to a structure in which the frame and the pressing spring mechanism are provided separately, and the connection structure B can be reduced in height.

  In particular, as in the present embodiment, the resin frame J has a lattice portion 45a that individually surrounds the plurality of openings 45b, and both end portions of each of the pressing terminals 41a and 41b are embedded in the lattice portion 45a. By adopting a structure in which the portion is arranged in the opening 45b, the strength of the resin frame J is kept high by the structure connected vertically and horizontally while arranging a large number of pressing terminals 41a and 41b in a narrow area at a high density. Can do. Therefore, it is possible to cope with the narrow pitch of the wiring (connected wiring) on the FPC 50 or PCB (mother board). In the present embodiment, corresponding to the first and second wirings 51 a and 51 b arranged in a staggered manner on both surfaces of the FPC 50 and the upper surface side first and second electrodes 21 a and 21 b arranged in a staggered manner on the upper surface side of the housing 20. The first and second pressing terminals 41a and 41b are arranged in a staggered manner to cope with a narrow pitch.

  Further, in the connection structure B, the second pressing terminal 41b is also used as a signal connection terminal that comes into contact with the second wiring 41b of the FPC 50 (connected wiring board), thereby eliminating the need for a separate signal connection member. Therefore, it is possible to reduce the manufacturing cost and further reduce the size.

  In particular, the second pressing terminal 41b is provided with a first partial terminal 41b1 that comes into contact with the wiring of the connected wiring board and a second partial terminal 41b2 that comes into contact with the second electrode 21b on the upper surface side of the housing 20. Signal connection between the second wiring 51b of the FPC 50 (connected wiring board) and the second electrode 21b on the upper surface side of the housing 20 of the connection structure B is facilitated via the pressing terminal 41b.

  In addition, since the core made of metal is embedded in the lattice portion 45a of the resin frame J, the strength of the resin frame is further increased.

  Furthermore, by forming the metal frame C including the core body and the pressing terminals 41a and 41b and the resin frame J by integral molding, the actuator 40 having a complex shape and high strength can be easily manufactured. be able to.

-Modification of wiring board connector-
FIG. 13 is a perspective view illustrating a state before the connection wiring of the wiring structure E according to the modification of the above embodiment is connected. FIG. 14 is a perspective view showing a state where the connected wiring of the wiring structure E is connected.
As shown in FIG. 13, the wiring structure E of the present modification includes a multi-core micro coaxial line 55 instead of an FPC as a connected wiring.

  As shown in FIGS. 13 and 14, a multi-core micro coaxial line 55 according to this modification is formed by connecting a plurality of micro coaxial lines 56 in parallel. Each micro coaxial line 56 includes a center conductor 56a having a substantially circular cross section, and an outer conductor 56b formed around the center conductor 56a via an intermediate insulator and serving as a ground. In addition, the outer skin | cover which coat | covers these whole members is also provided. The front end portion 56 c of each center conductor 56 a is fixed by the insulator frame 59 and exposed at the opening of the insulator frame 59. In addition, a ground member 57 (ground bar) that connects the exposed portions of the outer conductors 56b of the multi-core micro coaxial line 55 in common is provided. In FIG. 13, illustration is omitted for easy viewing, but the grounding member 57 is also provided on the upper side of the micro coaxial line 56.

  Further, the connection structure D in the present modification includes a housing 20 and an actuator 40 as in the above embodiment. Also in this modified example, the housing 20 is configured such that the multi-core micro coaxial wire 55 is mounted on the main body portion 26 between the two frame portions 25. On the side, a mounting surface on which the multi-core micro coaxial line 55 is mounted and a stop surface for blocking the multi-core micro coaxial line are provided in a stepped structure similar to the above embodiment. Although not shown, a lower surface side electrode which is a lower surface side conductive layer is provided on the lower surface side of the housing 20, and the lower surface side electrode and the upper surface side electrode are the through-hole conductive layer 23 in the above embodiment. Alternatively, they are connected by a conductive layer similar to the side conductive layer 24.

  In the actuator 40, the holding frame 45 includes openings 45b and lattice portions 45a arranged in only one row, and the pressing terminals 41 are also arranged in only one row. Further, the upper portion of the insertion port 28 is surrounded by a metal ceiling member 36.

  When the multi-core micro coaxial wire 55 is mounted on the housing 20 of the connection structure D, the insulator frame 59 is inserted from the insertion port 28. Then, the distal end portion 56 c of the central conductor 56 a exposed at the opening of the insulator frame 59 is pressed by the pressing terminal 41. Thereby, the front-end | tip part 56c of the center conductor 56a contacts the upper surface side electrode (not shown) of the housing 20, and the center conductor 56a and the wiring 11 of PCB10 are electrically connected. The ground member 57 contacts the ceiling member 36 of the housing 20 and is grounded to the ground portion on the PCB 10 via a ground line connected to the ceiling member 36.

  Also in this modified example, the same effect as in the above embodiment can be exhibited when the connected wiring board is the multi-core micro coaxial line 55.

—Structure of Wiring Board Module and Electronic Device— FIG. 11 is a perspective view showing a connection relationship between various wiring board modules built in the electronic device functioning as a mobile phone and the wiring board module.
The wiring board module built in the electronic device of the present embodiment includes a main display 61 that displays a screen of a mobile phone equipped with the LED 90, a first sub PCB 62 and a main PCB 63 that are responsible for main control in the electronic device, An integrated sub-display 64 for displaying secondary information of a mobile phone, a second sub-PCB 65, an in-camera control PCB 66 for controlling the in-camera 91, and an attached circuit PCB 67 connected by FPC. It is a module. In the first sub PCB 62 and the main PCB 63, a built-in memory, a baseband LSI, a power supply control IC, a sound source IC, an RF reception LSI, an RF transmission LSI, a power amplifier, a switch IC, and the like are allocated and arranged.
Although not included in the integrated module, an out camera 93 and a control circuit 94 for controlling the out camera 93 are also arranged in the electronic device.

  The first sub PCB 62 and the main PCB 63 are connected by a micro coaxial line 83 or FPC, and a connector for the micro coaxial line 73 is provided at a connection portion between the micro coaxial line 83 and the first sub PCB 62. As shown in an exploded view at the connection portion between the micro coaxial line 83 and the main PCB 63, the micro coaxial cable connector 73 includes a micro coaxial cable harness 77a including an insulator frame for fixing a ground bar and a center conductor of the micro coaxial cable, It is comprised by the coaxial line connection part 77b by the side of a board | substrate. At this time, the connection structure D shown in FIGS. 13 and 14 can be used as the coaxial line connecting portion 77b.

  The main display 61 and the first sub PCB 62 are electrically connected by two FPCs 81a and 81b. The two FPCs 81 a and 81 b are divided into a liquid crystal panel side and an LED 90 side in the main display 61, but are connected to a common connector 71 on the first sub PCB 62. The connector 71 employs the connection structure according to the present embodiment.

  The first sub PCB 62 and the sub display 64 are connected by the FPC 82 via the connector 72 having the same structure as the connection structure B of the present embodiment. The first sub PCB 62 and the in-camera control PCB 66 are connected by the FPC 84 via the connector 74 having the same configuration as the connection structure B of the present embodiment. The first sub PCB 62 and the attached circuit PCB 67 are connected by the FPC 85 via the connectors 75 and 76 having the configuration of the connection structure B of the present embodiment. The main PCB 63 and the antenna 65 are connected by the FPC 86 via the connector 78 having the configuration of the connection structure B of the present embodiment.

As described above, the connection structure B according to the present embodiment is incorporated into a wiring board module that is an integrated module, and by extension, an electronic device including the wiring board module, thereby realizing a downsized and thin module and an electronic device. can do. In particular, by using it as a mobile phone as an electronic device, it is possible to reduce the size and thickness.
Electronic devices include mobile phones, cameras such as digital cameras and video cameras, portable audio players, portable DVD players, and portable notebook computers.

  The wiring board mounted on the connection structure of the present invention is not limited to a flexible printed wiring board (FPC) or a micro coaxial line, and may be a hard printed wiring board (PCB). When a flexible printed wiring board is used, the tip may be bent and mounted on the housing.

  The structure of the embodiment of the present invention disclosed above is merely an example, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The present invention can be used for electronic devices such as mobile phones, cameras such as digital cameras and video cameras, portable audio players, portable DVD players, and portable notebook computers.

It is a perspective view which shows the structure which looked at the wiring board connector which concerns on embodiment from the upper surface side. It is a perspective view which shows the structure which looked at the connection structure and FPC which concern on embodiment from the lower surface side. It is a perspective view which shows the structure which looked at the housing of the connection structure which concerns on embodiment from the upper surface side. (A)-(f) is sectional drawing which shows the manufacturing process of the housing 20. FIG. (A), (b) is a perspective view which shows the structure which looked at the housing which concerns on the modification of embodiment from the upper surface side in order, and the perspective view which shows the structure seen from the lower surface side. (A), (b) is a perspective view which shows the structure which looked at the actuator which concerns on this Embodiment from the upper surface side in order, and the perspective view which shows the structure seen from the lower surface side. (A), (b) is a perspective view which shows the manufacturing procedure of an actuator roughly. It is a perspective view which fractures | ruptures and shows a part of connection structure. It is a perspective view which shows the cross section which passes an upper surface side 1st electrode and a lower surface side 1st electrode. It is a perspective view which shows the cross section which passes an upper surface side 2nd electrode and a lower surface side 2nd electrode. It is a perspective view which shows the connection relation of the various wiring board modules built in the electronic device which functions as a mobile telephone, and a wiring board module. FIG. 10 is a perspective view showing a structure of a ZIF structure connector described in Patent Document 1. It is a perspective view which shows the state before connecting the to-be-connected wiring of the wiring structure E which concerns on the modification of embodiment. It is a perspective view which shows the state which connected the to-be-connected wiring of the wiring structure E which concerns on the modification of embodiment.

Explanation of symbols

A wiring board connection body B connection structure C metal frame C1 base frame C2 tip frame C2-1 bellows part c2-2 core body D connection structure E wiring connection body J resin frame 10 rigid printed circuit board (PCB)
11 Wiring 20 Housing (housing)
20a Upper surface 20a1 Mounting surface 20a2 Stopping surface 21a Upper surface side first electrode 21b Upper surface side second electrode 22a Lower surface side first electrode 22b Lower surface side second electrode 23 Through-hole conductive layer 24 Side surface conductive layer 25 Both frame portions 26 Main body portion 27 through-hole 28 insertion slot 30 catalyst layer 31 resist layer 33 Ni alloy layer 34 Au layer 36 ceiling member 40 actuator 41a first pressing terminal 41b second pressing terminal 41b1 first spring part 41b2 second spring part 45 holding frame 45a grid part 45b Opening 46 Fixed part 47 Protruding part 48 Rotating shaft 50 Flexible printed circuit board (FPC)
51a 1st wiring 51b 2nd wiring 52 Base film 53 Upper surface side coverlay 54 Lower surface side coverlay 55 Multi-core micro coaxial line 56 Micro coaxial line 56a Center conductor 56b Outer conductor 56c Tip part 57 Grounding member 59 Insulator frame

Claims (7)

A connection structure including a housing on which a connected wiring board is mounted, and a pressing member for pressing the connected wiring board to the housing,
The housing is
A plurality of upper surface side conductive layers provided by depositing a conductive material on the upper surface side on which the connected wiring board is mounted;
A plurality of lower surface side conductive layers provided by depositing a conductive material on the lower surface side facing the upper surface side;
A plurality of through-hole conductive layers or surface conductive layers provided by depositing a conductive material and electrically connecting the plurality of upper surface side conductive layers and the plurality of lower surface side conductive layers to each other;
A connecting structure. The connection structure according to claim 1,
Each of the plurality of upper surface side conductive layers and lower surface side conductive layers has a first electrode and a second electrode arranged in a staggered manner,
A connection structure in which at least one of the first electrodes and the second electrodes of the upper surface side conductive layer and the lower surface side conductive layer is electrically connected via a through-hole conductive layer. The connection structure according to claim 2,
The connection structure body in which the first electrodes and the second electrodes of the upper surface side conductive layer and the lower surface side conductive layer are both electrically connected via the through-hole conductive layer. In the connection structure according to any one of claims 1 to 3,
A connection structure in which a surface of the upper surface side conductive layer has an uneven pattern. A mother board on which a plurality of wirings are formed;
A connected wiring board in which a plurality of wirings are formed;
A connection structure provided on the mother board,
The said connection structure is a wiring board connection body which is a connection structure as described in any one of Claims 1-4. The wiring board connector according to claim 5,
An electronic component mounted on at least one of the mother board and the connected wiring board;
Wiring board module equipped with.   An electronic device comprising the wiring board module according to claim 6.

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