JP2009079249A - Film deposition system and film deposition method for substrate, and optical element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition system for a substrate where ultraviolet rays can be emitted from an ultraviolet emission lamp from a position close to each substrate, the substrate can be efficiently and uniformly cleaned, and the ultraviolet emission lamp does not interfere with a passage from a vapor deposition source to the substrate. <P>SOLUTION: Inside of a chamber 1 constituting a vacuum deposition system, a dome 4 mounted with a prescribed number of substrates 10 to be film-deposited is disposed, and a vapor deposition source unit 5 is installed in the lower position of the dome 4. The lamp unit 22 constituted of an ultraviolet emission lamp 20 and a lamp house 21 can be displaced in a reciprocative manner between an ultraviolet emission position approaching the dome 4 and a retreating position separated from the dome 4. The ultraviolet emission lamp 20 has a line shape, its length dimensions are longer than the arrangement width dimensions of each substrate mounting hole 7 to be mounted with each substrate 10, and it faces each substrate 10 with a slight gap at the ultraviolet emission position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming apparatus and a film forming method for forming a film on the surface of a substrate such as an optical glass substrate or a semiconductor wafer, and an optical film on the surface of the optical glass substrate by using the film forming apparatus. The present invention relates to an optical element manufactured by forming a thin film having a functional function.

  For example, a thin film made of one or a plurality of dielectric films or metal films is laminated on the surface of an optical glass substrate to cause a phase difference in transmitted light or reflected light, or to have wavelength selectivity, Various optical elements having a desired optical function such as functioning as a mirror are manufactured. On the other hand, when manufacturing a semiconductor wafer, for example, a thin film made of an insulator film and a conductive film is sequentially formed on a silicon substrate. These thin films are generally formed by vacuum deposition, sputtering, ion plating, or the like. That is, the film is formed by providing the substrate in a vacuum chamber and attaching or colliding the film material with the substrate surface in the vacuum chamber.

  Here, whether it is vacuum deposition or sputtering or ion plating, when a film is deposited on a predetermined substrate, if the deposition surface of the substrate is fouled, the adhesion of the film formed on this substrate surface Will drop. In particular, when organic fouling substances adhere to the surface of the substrate, the wettability decreases, resulting in poor film adhesion to the substrate during film formation, and stable film formation is performed. There will be no. Therefore, the substrate is cleaned as a pre-treatment for film formation on the substrate, but the substrate surface is re-stained, for example, organic substances floating in the atmosphere adhere while the substrate is placed in the air after cleaning. There is a risk. In view of the above, it is desirable that the substrate can be cleaned after being introduced into a chamber to be evacuated, such as a vacuum deposition apparatus, and immediately before film formation.

After the introduction into the chamber, the substrate cannot be cleaned with the cleaning liquid, and thus dry cleaning without using the cleaning liquid is performed. In general, dry cleaning of a substrate is performed by irradiating ultraviolet rays. For example, Patent Document 1 discloses a technique for performing dry cleaning using an ultraviolet irradiation lamp in a vacuum chamber. According to Patent Document 1, as a pretreatment for forming a film by vacuum deposition on a substrate introduced into a vacuum chamber, and even during film formation, the substrate surface is irradiated with ultraviolet rays from an ultraviolet irradiation lamp. The adhering organic matter is decomposed and removed.
JP 63-223158 A

  By the way, in the chamber where vacuum deposition is performed, the substrate is disposed so as to face the deposition source, and in order to securely deposit the deposition material from this deposition source on the substrate, the flow path of this deposition material. Therefore, an open space is provided between the deposition source and the substrate. Therefore, the ultraviolet irradiation lamp cannot be disposed in the vicinity of the substrate, and the ultraviolet irradiation lamp is necessarily fixedly provided at a position away from the substrate. The ultraviolet rays emitted from the ultraviolet irradiation lamp are attenuated as the distance to the substrate becomes longer, and the irradiation energy of the ultraviolet irradiation lamp cannot be used effectively. In addition, the irradiation energy has a maximum distribution at the center of the optical axis of the ultraviolet irradiation lamp and the irradiation energy decreases as it goes toward the periphery, so the amount of irradiation energy varies depending on the part of the substrate. For this reason, there is a problem that uneven cleaning occurs on the substrate.

  The present invention has been made in view of the above points, and an object of the present invention is to irradiate an ultraviolet irradiation lamp from a position close to the substrate, and to clean the substrate efficiently and evenly. It is to prevent the ultraviolet irradiation lamp from interfering with the path from the vapor deposition source to the substrate.

  In order to achieve the above-described object, the present invention provides a rotating shaft facing a sealed chamber, and a support member that supports the substrate is detachably connected to the rotating shaft, and is deposited on the surface of the substrate by vapor deposition. A film forming apparatus for forming a film, wherein the entire surface of the substrate is irradiated with ultraviolet rays while the support member that is disposed in the chamber and supports the substrate by rotating the rotation shaft is rotated. An ultraviolet irradiation lamp, and a lamp displacing means for displacing the ultraviolet irradiation lamp to an ultraviolet irradiation position where the ultraviolet irradiation lamp faces the film forming surface of the substrate and a retreat position which opens a space between the substrate and the evaporation source. It is characterized by having a configuration.

  Further, the invention relating to the film forming method of the substrate forms a film on the surface of the substrate by vapor deposition while the inside of the sealed chamber is evacuated and the support member that is disposed in the chamber and holds the substrate is rotated. After each substrate is mounted on the support member and before film formation on the substrate, an ultraviolet irradiation lamp is made to face the substrate mounted on the support member, While rotating the support member, dry cleaning is performed by irradiating the surface of each substrate with ultraviolet rays from the ultraviolet irradiation lamp, and after the dry cleaning, the ultraviolet irradiation lamp is separated from the support member, The space between the support member and the vapor deposition source is opened, and film formation by vapor deposition is performed on the surface of each substrate.

  As the ultraviolet irradiation lamp, particularly when the substrate is an optical glass substrate, for example, a low-pressure mercury lamp that emits ultraviolet rays having a wavelength of 185 nm and a wavelength of 254 nm, an excimer lamp that emits ultraviolet rays having a wavelength of 180 nm or less, etc. Preferably used. This ultraviolet irradiation lamp is configured to be displaceable between an ultraviolet irradiation position and a retracted position by lamp displacement means. In the ultraviolet irradiation position, ultraviolet rays are irradiated from a position as close as possible to the substrate from the ultraviolet irradiation lamp. On the other hand, when the ultraviolet irradiation lamp is displaced to the retracted position, the space between the evaporation source and the substrate is opened.

  The substrate is supported by a support member, and a support member corresponding to the size of the substrate is used. For example, in the case of a large-sized substrate, only one sheet can be supported, and a support member that can support two to four substrates can also be used. Furthermore, a large number of small-sized substrates can be supported simultaneously. Usually, in a chamber, a board | substrate will be arrange | positioned in an upper position and a vapor deposition source will be arrange | positioned in the lower part. Therefore, the substrate is held in a substantially horizontal state with its film formation surface facing downward. In addition, the support member is connected to a rotation shaft, and the rotation shaft is rotated to perform film formation while the substrate is driven to rotate. In particular, when a film is formed on a small-sized substrate, a substantially conical support member is used in order to support a larger number of small substrates with a compact size. This is a so-called dome method. Here, the conical surface constituting the dome may have a linear slope, and the slope may have a slightly curved shape.

  The ultraviolet irradiation lamp is displaced between the ultraviolet irradiation position and the retracted position by the lamp displacing means. At the ultraviolet irradiation position, when the substrate is horizontally arranged by the support member, the ultraviolet irradiation lamp is In the case of the dome system, the ultraviolet lamp is made to coincide with the inclination angle of the dome. In any case, dry cleaning is performed with the ultraviolet irradiation lamp in a state substantially parallel to the substrate on which the film is formed. Then, it is desirable that the ultraviolet irradiation lamp be as close to the substrate as possible, provided that it does not interfere with the substrate and the support member during rotation.

  All the mechanisms constituting the lamp displacing means may be arranged in the chamber. However, since the inside of the chamber is evacuated, it is desirable to provide at least the driving means outside the chamber. For example, the lamp displacing means comprises a rotating arm connected to the ultraviolet irradiation lamp and a driving means such as a cylinder or a motor for rotating the rotating arm, and the rotating arm is disposed in the chamber. The driving means can be arranged outside the chamber to apply a rotational force to the rotating arm from the outside. Further, it is desirable to provide a protection means for protecting the vapor deposition material from adhering to the ultraviolet irradiation lamp from the vapor deposition source. The protection means can be constituted by a partition plate provided at a position close to the vapor deposition source, and this partition plate is configured to be movable so as to be displaced to the operating position when the ultraviolet irradiation lamp is at the retracted position, for example. Alternatively, the partition plate itself may be fixedly held so that the vapor deposition material does not fly toward the ultraviolet irradiation lamp when the ultraviolet irradiation lamp is displaced to the retracted position.

  Irradiation with ultraviolet rays can be performed at a stage before the inside of the chamber is evacuated. In this state, air exists in the chamber, and when ultraviolet rays are radiated to oxygen in the air, it becomes chemically active active oxygen, and organic substances adhering to the substrate surface are decomposed by the action of ultraviolet rays. When this is done, this decomposition product undergoes an oxidation reaction in the presence of active oxygen to form COx, NOx and other low molecular weight compounds that are gasified and released from the substrate surface. Further, in order to make active oxygen more abundant, ozone may be supplied to the substrate surface simultaneously with ultraviolet irradiation. Furthermore, after the inside of the chamber is evacuated, dry cleaning by ultraviolet irradiation may be performed while the chamber is evacuated. In this case, the organic matter that has been decomposed by irradiation with ultraviolet rays and has lost its stability in the bonded state is detached from the substrate surface by the action of the suction force by the vacuum and exhausted.

  The film is formed by the above-described film forming apparatus and by the film forming method, that is, in the chamber, and after performing dry cleaning by ultraviolet irradiation at a stage immediately before film formation. Since the entire surface of the substrate has a very high cleanliness and good wettability, the thickness of the thin film formed on the substrate should be uniform and the adhesion of the thin film to the substrate surface should be increased. Can do. In particular, as a pretreatment of a film forming process in which one or more thin films such as a dielectric film or a metal film are laminated on an optical glass substrate as a substrate, dry cleaning by ultraviolet irradiation is performed, so that almost from the surface of the optical glass substrate Organic substances can be completely removed, and a high-quality optical element that exhibits a desired optical function can be formed.

  Ultraviolet rays can be irradiated from a position close to the substrate, and the entire surface of the substrate can be efficiently irradiated by the rotation of the support member that supports the substrate, so that there is no uneven cleaning of the substrate. During film formation, the ultraviolet irradiation lamp does not interfere with the path of the vapor deposition material from the vapor deposition source to the substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment described below, the substrate is an optical glass substrate, and the film is formed on the surface of the optical glass substrate by vacuum deposition. However, the substrate may be a semiconductor wafer or the like, and the film formation method is not limited to vacuum deposition, and can be applied to various film formation methods such as sputtering and ion plating.

  First, FIG. 1 shows the overall configuration of the vacuum vapor deposition apparatus. In the figure, reference numeral 1 denotes a chamber, the inside of the chamber 1 is a sealed space, and an exhaust pipe 3 provided with a vacuum pump 2 is connected thereto. Inside the chamber 1, a dome 4 as a support member is provided at a position on the upper side, and a vapor deposition source unit 5 is installed below the dome 4. The dome 4 is detachably connected to the lower end portion of the rotating shaft 6, and the rotating shaft 6 extends through the canopy portion 1 a of the chamber 1 and is a rotation driving means (not shown) including a motor or the like. ).

  As shown in FIG. 2, the dome 4 is configured by forming a large number of substrate mounting holes 7 in a main body portion 4 a having a slope portion having a conical shape (or a polygonal pyramid shape) that expands downward. Has been. As shown in FIG. 3, a substrate 10 on which film formation is performed is mounted in each substrate mounting hole 7. And the vertex part in the dome 4 becomes the connection part 4b connected with the rotating shaft 6 so that attachment or detachment is possible. As a result, the substrate 10 is fixed to the dome 4 by the holder 11 in each substrate mounting hole 7, introduced into the chamber 1, and connected to the rotating shaft 6. Further, when the film is formed on the substrate 10, the dome 4 is separated from the rotating shaft 6 and carried out of the chamber 1.

  Here, the substrate 10 to be formed is an optical glass substrate, and a dielectric multilayer film is laminated on the substrate 10. The dielectric multilayer film includes a low refractive index film and a high refractive index film. Assume that they are stacked alternately. For this purpose, as the vapor deposition source unit 5, two kinds of vapor deposition materials 12A and 12B are installed. The vapor deposition source unit 5 has a crucible 13 on which are provided hearths 14A and 14B on which vapor deposition materials 12A and 12B are respectively installed. Therefore, by heating the hearths 14A and 14B with an electron beam, the vapor deposition material is melted and evaporated toward the dome 4, and vapor is deposited on the surface of each substrate 10 attached to the dome 4. However, vapor deposition is performed alternately with the vapor deposition materials 12A and 12B, and for this purpose, a cover 15 is provided which opens one upper part of the hearths 14A and 14B and covers the other upper part. Therefore, by rotating the hearths 14A and 14B, it is controlled so that any one of the hearths is transferred to the part where the upper part is opened. In order to control the start and end of vapor deposition, a shutter 17 is provided, and this shutter 17 is in a vapor deposition stop state (shown in FIG. 1) covering the upper portion of the position where the hearths 14A and 14B are disposed in the crucible 13. State) and a vapor deposition operation state in which this part is opened.

  As for the optical glass substrate as the board | substrate 10 formed into a film in a vacuum evaporation apparatus, the surface formed into a film in the board | substrate 10 is wash | cleaned in the step before performing vacuum evaporation. This cleaning is for removing organic fouling substances adhering to the substrate 10 and improving the wettability on the surface, that is, for reducing the contact angle, and is a dry cleaning performed by irradiating with ultraviolet rays. .

  As apparent from FIGS. 3 to 5, as the ultraviolet irradiation lamp 20, for example, a low-pressure mercury lamp that emits ultraviolet rays having wavelengths of 185 nm and 254 nm, an excimer lamp that emits ultraviolet rays having a wavelength of 180 nm or less, and the like are used. The ultraviolet irradiation lamp 20 is provided in a lamp house 21, and the ultraviolet irradiation lamp 20 and the lamp house 21 constitute a lamp unit 22. One side of the lamp house 21 is open, and the other side is an arc-shaped reflecting surface 21 a, whereby ultraviolet rays are emitted intensively from the opening side of the lamp house 21.

  The lamp unit 22 is separated from the dome 4 as shown by the solid line in FIG. 1 and the ultraviolet irradiation position close to the dome 4, and as shown by the phantom line in FIG. It is possible to reciprocate between the retreat position that opens the vapor deposition region by the vapor deposition materials 12A and 12B. For this reason, as is apparent from FIG. 5, the lamp unit 22 is attached to the rotating arm 23. The base end portion of the rotation arm 23 is a boss portion 23a, and this boss portion 23a is rotatably connected to a rotation shaft 25 provided on a bracket 24 attached to the wall portion 1b of the chamber 1. An operating finger piece 26 is connected to the boss portion 23a.

  A driving means 27 is provided at a position above the chamber 1, and a rod 27 a of the driving means 27 extends through the wall 1 b into the chamber 1, and its tip is attached to the operating finger 26. It is possible to contact and separate. Here, the driving means 27 is constituted by a cylinder according to the shape of the dome 4, that is, when the same dome is always used, but a different conical dome is used, and the horizontal support member is the rotating shaft 6. For example, the angle of the lamp unit 22 at the ultraviolet irradiation position differs depending on the angle of the substrate 10 when supported by the support member. It is desirable to do. The rotating arm 23, the rotating shaft 25, the operating finger piece 26 and the driving means 27 constitute a lamp displacing means. The driving means 27 is separable from the rotating arm 23 and the operating finger piece 26, which makes maintenance convenient. However, the driving means 27 does not necessarily need to be separable.

  When the rod 27a of the driving means 27 is raised, the lamp unit 22 is disposed at the retracted position. When the rod 27a is lowered, the tip of the rod 27a pushes the operating finger 26, and the rotating arm 23 is moved. The rotary shaft 25 is rotated upward about the rotary shaft 25. When the lowering stroke end position of the driving means 27 is reached, the lamp unit 22 comes closest to the dome 4. The ultraviolet irradiation lamp 20 has a line shape, and its length dimension is longer than the arrangement width dimension of the substrate mounting holes 7 indicated by the width D in FIG. Moreover, as shown in FIGS. 3 and 4, the open side portion of the lamp house 21 is at an ultraviolet irradiation position where the dome 4 and the substrate 10 attached to the substrate mounting hole 7 face each other through a slight gap. Displace. Further, when the driving means 27 is raised and the lamp unit 22 is displaced to the retracted position, the space between the vapor deposition source unit 5 and the dome 4 is opened, but at this time, it floats in the chamber 1. In order to prevent the vapor deposition material to adhere to the lamp unit 22, the partition plate 16 is provided in the vapor deposition source unit 5.

  The vacuum deposition apparatus is configured as described above. Next, a method for forming a film on the substrate 10 using the vacuum deposition apparatus will be described. Here, the dome 4 is detachably connected to a rotary shaft 6 extending into the chamber 1. Outside the chamber 1, a substrate 10 mounted on a holder 11 is mounted in each substrate mounting hole 7 outside the chamber 1, and the dome 4 is carried into the chamber 1 and attached to the rotating shaft 6. When the dome 4 is introduced, the lamp unit 22 is disposed at the retracted position. Further, vapor deposition materials 12A and 12B are installed in the hearths 14A and 14B in the vapor deposition source unit 5, respectively.

  The inside of the chamber 1 is hermetically sealed, and the vacuum pump 2 provided in the exhaust pipe 3 is operated to bring the inside of the chamber 1 into a vacuum state. Then, at least before vapor deposition is started by heating at least the vapor deposition materials 12A and 12B, that is, after the inside of the chamber 1 is sealed, before the vacuum pump 2 is operated, the vacuum pump 2 is operated, and the chamber 1 The substrate 10 is dry-cleaned while the interior of the chamber is evacuated or after the interior of the chamber 1 is evacuated.

  That is, by actuating the driving means 27 constituting the lamp displacing means and lowering the rod 27a, the operating finger piece 26 connected to the rotating arm 23 is pushed down. As a result, the lamp unit 22 provided at the tip of the rotating arm 23 is displaced from the retracted position to the ultraviolet irradiation position. In this state, the substrate 10 is dry cleaned by irradiating the dome 4 with ultraviolet rays from the ultraviolet irradiation lamp 20 provided in the lamp unit 22 and rotating the dome 4 in the direction indicated by the arrow in FIG. Done.

  As described above, when the lamp unit 22 is disposed at the ultraviolet irradiation position, the ultraviolet irradiation lamp 20 and the substrate 10 mounted on the dome 4 are positioned very close to each other as indicated by a gap G in FIG. Even if the dome 4 rotates, the lamp unit 22 and the dome 4, the substrate 10, and the holder 11 do not interfere with each other. The ultraviolet irradiation lamp 20 is in a line shape and is longer than the entire length of the array width of the substrate mounting holes 7 in the dome 4. Therefore, by rotating the dome 4, ultraviolet rays are irradiated almost uniformly over the entire surface of all the substrates 10 mounted in the substrate mounting holes 7 of the dome 4, and there is no unevenness in the amount of light. . Further, since the ultraviolet irradiation lamp 20 is close to the substrate 10, it is possible to efficiently irradiate the substrate 10 with ultraviolet rays, the attenuation of the ultraviolet rays is suppressed, and the maximum ultraviolet irradiation energy is applied to the surface of the substrate 10. Thus, the organic substances and the like attached to the substrate 10 are removed.

  Here, air is present inside the chamber 1 after the inside of the chamber 1 is sealed and before the vacuum pump 2 is operated. Therefore, when the dome 4 is rotated and the substrate 10 is irradiated with ultraviolet rays from the ultraviolet irradiation lamp 20 and dry cleaning is performed before vacuuming, it adheres to the substrate 10 by the action of the irradiated ultraviolet rays. As the organic matter is decomposed, the oxygen present in the space of the surface portion of the substrate 10 is changed to active oxygen by the action of the energy of ultraviolet rays. By changing to a molecular gas, reattachment to the substrate 10 is prevented. Note that an ozone supply member is provided in the lamp unit 22 so that ozone can be supplied when the above-described dry cleaning is performed.

  Further, after the inside of the chamber 1 is evacuated, the dome 4 is rotated, and ultraviolet rays are irradiated from the ultraviolet irradiation lamp 20 toward the substrate 10 to perform dry cleaning. In this way, since there is almost no gas that absorbs or attenuates ultraviolet rays, the substrate 10 can be effectively irradiated with ultraviolet rays. Moreover, the organic matter decomposed by the irradiation of the ultraviolet rays is released from the surface of the substrate 10 and is sucked into the exhaust pipe 3.

  Further, dry cleaning can be performed while the vacuum pump 2 is being driven. Thus, the process efficiency can be improved by overlapping the vacuuming in the chamber 1 and the dry cleaning. Therefore, the dry cleaning time can be extended without extending the overall processing time.

  When dry cleaning is performed on the substrate 10 by any of the above, organic contaminants are almost completely removed from the surface of the substrate 10 and the entire surface is cleaned, so that wettability during vapor deposition is achieved. Will improve. Moreover, since the substrate 10 is cleaned after being introduced into the chamber 1, the surface of the substrate 10 is not re-stained before vapor deposition.

  When the dry cleaning described above is completed, the driving means 27 is driven to raise the rod 27a. As a result, the turning arm 23 with the lamp unit 22 mounted at the tip is turned downward by its own weight, and stops at the retracted position in the vertical state. Then, while the chamber 1 is maintained at a predetermined vacuum pressure, the hearths 14A and 14B are heated by the crucible 13 in the vapor deposition source unit 5 while rotating the dome 4 to generate vapors of the vapor deposition materials 12A and 12B. By doing so, vacuum deposition on the substrate 10 is started.

  Here, the hearths 14 </ b> A and 14 </ b> B are alternately closed by the covers 15, and vapor deposition films made of different vapor deposition materials 12 </ b> A or vapor deposition materials 12 </ b> B are alternately formed on the surface of the substrate 10. As described above, the surface of the substrate 10 maintains an extremely high degree of cleanliness, so that the adhesion of the deposited film is increased. Moreover, in order to efficiently perform the cleaning by the ultraviolet irradiation, the ultraviolet irradiation lamp 20 is irradiated from a position very close to the substrate 10, but at the time of vacuum vapor deposition, between the vapor deposition source unit 5 and the dome 4. The space is completely open, the vapor is not prevented from adhering to the substrate 10, and a uniform and highly accurate vapor deposition film is formed on all the substrates 10 mounted on the dome 4. Quality optical elements such as optical elements such as wave plates and wavelength selection members can be manufactured.

  Further, when the ultraviolet irradiation lamp 20 is disposed at the retracted position, vapor is generated in the space from the vapor deposition source unit 5 to the dome 4 in the chamber 1. The lamp unit 22 including the lamp housing 21 and the lamp house 21 and the rotation arm 23 and the rotation shaft 25 which are driving means thereof are not attached.

  In the above-described embodiment, a number of substrates 10 are mounted on the dome 4 as a support member, and after these substrates 10 are dry-cleaned, film formation is performed. For example, FIG. As shown in FIG. 5, when the substrate 100 is large, only one substrate 100 is mounted on the support member 101. The support member 101 is detachably connected to the rotating shaft 6.

  In this case, the substrate 100 is supported in a horizontal state with the film formation surface facing downward. The ultraviolet irradiation lamp 103 constituting the lamp unit 102 has a length corresponding to the distance from the rotation center position of the substrate 100 consisting of the rotation center axis C of the rotation shaft 6 to the corner corner, and lamp displacement means Therefore, the lamp unit lamp 102 is in a vertical state at the retracted position as in the first embodiment, and the lamp unit 102 is moved at the ultraviolet irradiation position. A horizontal state parallel to the substrate 100 is assumed. At this time, one end of the ultraviolet irradiation lamp 103 faces the rotational center position of the substrate 100, and the other end has a length that can face the corner of the substrate 100. When dry cleaning is performed, while the support member 101 is rotationally driven by the rotating shaft 6, ultraviolet rays from the ultraviolet irradiation lamp 103 facing the support member 101 are irradiated onto the film formation surface of the substrate 100.

It is a whole block diagram of a vacuum evaporation system. It is sectional drawing of the dome used for the vacuum evaporation system of FIG. It is sectional drawing of the lamp unit shown in the state facing the dome. FIG. 4 is a partially cut end view showing the dome cut in the circumferential direction at the XX position in FIG. 3. It is an external appearance perspective view which shows the structure of a lamp displacement means. It is sectional drawing of the lamp unit shown in the state facing the support member in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chamber 2 Vacuum pump 3 Exhaust pipe 4 Dome 5 Deposition source unit 6 Rotating shaft 7 Substrate mounting hole 10,100 Substrate 11 Holder 16 Partition plate 20,103 Ultraviolet irradiation lamp 21 Lamp house 22, 102 Lamp unit 23 Rotating arm 25 times Driving shaft 26 Actuating finger piece 27 Driving means 101 Support member

Claims (9)

In a film forming apparatus for forming a film by vapor deposition on the surface of the substrate by providing a rotating shaft facing in a sealed chamber and detachably connecting a support member supporting the substrate to the rotating shaft.
An ultraviolet irradiation lamp disposed in the chamber and configured to irradiate the entire surface of the substrate with ultraviolet rays while rotating a support member that supports the substrate by rotating the rotation shaft;
The ultraviolet irradiation lamp is configured to include an ultraviolet irradiation position for facing the film-forming surface of the substrate and a lamp displacing means for displacing the ultraviolet irradiation position to a retracted position for opening a space between the substrate and the evaporation source. A substrate deposition apparatus that is characterized. The support member includes a dome on which a plurality of the substrates can be mounted, and the ultraviolet irradiation lamp irradiates line-shaped ultraviolet rays toward the full length of the arrangement width of the substrates during rotation of the dome at the ultraviolet irradiation position. The substrate deposition apparatus according to claim 1, wherein the substrate deposition apparatus is configured as described above. The lamp displacing means comprises a rotating arm provided in the chamber and connected to the ultraviolet irradiation lamp, and a driving means provided outside the chamber for rotating the rotating arm. The substrate film-forming apparatus according to claim 1 or 2. 2. The apparatus according to claim 1, further comprising a protective unit that protects the vapor deposition material from adhering to the ultraviolet irradiation lamp when the ultraviolet irradiation lamp is displaced to the retracted position by the lamp displacing unit. 4. The film forming apparatus for a substrate according to any one of 3 above. A method of forming a film by vapor deposition on the surface of a substrate while rotating the supporting member disposed in the chamber and holding the substrate while the sealed chamber is in a vacuum state,
After the substrate is mounted on the support member and before film formation on the substrate, an ultraviolet irradiation lamp is made to face the substrate mounted on the support member, and the support member is driven to rotate. In the meantime, dry cleaning is performed by irradiating the surface of each substrate with ultraviolet rays from the ultraviolet irradiation lamp,
After the dry cleaning, the ultraviolet irradiation lamp is separated from the support member to open a space between the support member and the vapor deposition source, and film formation by vapor deposition is performed on the surface of each substrate. A method for forming a film on a substrate. The support member is a dome on which a plurality of substrates can be mounted, and the ultraviolet irradiation lamp has a length extending over the entire array width of the substrates mounted on the dome. The method for forming a substrate according to claim 5. 7. The substrate film forming method according to claim 5, wherein the dry cleaning of the substrate is performed before the chamber is evacuated. 7. The method for forming a substrate according to claim 5, wherein the dry cleaning of the substrate is performed after the inside of the chamber is evacuated. The substrate formed by the apparatus according to any one of claims 1 to 4 or by the method according to any one of claims 5 to 8 is an optical glass substrate, and the optical glass substrate An optical element formed by forming a thin film of one or more layers having an optical function on the surface.

Images