JP2009076697A5 - - Google Patents
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- JP2009076697A5 JP2009076697A5 JP2007244519A JP2007244519A JP2009076697A5 JP 2009076697 A5 JP2009076697 A5 JP 2009076697A5 JP 2007244519 A JP2007244519 A JP 2007244519A JP 2007244519 A JP2007244519 A JP 2007244519A JP 2009076697 A5 JP2009076697 A5 JP 2009076697A5
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- JP
- Japan
- Prior art keywords
- bonding film
- adherend
- bonding
- metal atom
- leaving group
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- 125000004429 atom Chemical group 0.000 claims 20
- 239000002184 metal Substances 0.000 claims 20
- 239000000758 substrate Substances 0.000 claims 16
- 125000004430 oxygen atom Chemical group O* 0.000 claims 12
- 238000000034 method Methods 0.000 claims 7
- 239000000463 material Substances 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 1
Claims (11)
前記第１の接合膜および前記第２の接合膜に対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記金属原子および前記酸素原子の少なくとも一方から脱離させることにより、前記各接合膜に接着性を発現させる工程と、
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを貼り合わせることにより、これらが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first bonding film including a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom in a predetermined region on the substrate; A first adherend comprising: a second adherend comprising a second bonding film having the same function as the first bonding film on the entire surface of the substrate facing the first bonding film; A process of preparing
Energy is imparted to each of the first bonding film and the second bonding film, and the leaving group existing near the surface of each bonding film is desorbed from at least one of the metal atom and the oxygen atom. A step of developing adhesiveness in each bonding film by separating,
The first adherend and the second adherend are bonded together so that the first bonding film and the second bonding film are in close contact with each other, so that they are partially in the predetermined region. And a step of obtaining a joined body joined to the substrate.
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第
２の被着体とを重ね合わせて、仮接合体を得る工程と、
前記第１の接合膜および前記第２の接合膜に対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記金属原子および前記酸素原子の少なくとも一方から脱離させることにより、前記各接合膜に接着性を発現させ、前記第１の被着体と前記第２の被着体とが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first bonding film including a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom in a predetermined region on the substrate; A first adherend comprising: a second adherend comprising a second bonding film having the same function as the first bonding film on the entire surface of the substrate facing the first bonding film; A process of preparing
A step of superimposing the first adherend and the second adherend to obtain a temporary joined body so that the first bonding film and the second bonding film are in close contact with each other;
Energy is imparted to each of the first bonding film and the second bonding film, and the leaving group existing near the surface of each bonding film is desorbed from at least one of the metal atom and the oxygen atom. Separating each of the bonding films, thereby obtaining a bonded body in which the first adherend and the second adherend are partially bonded in the predetermined region. The joining method characterized by the above-mentioned.
前記第１の接合膜の一部の所定領域と前記第２の接合膜の全面とに対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記金属原子および前記酸素原子の少なくとも一方から脱離させることにより、前記各接合膜に接着性を発現させる工程と、
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを貼り合わせることにより、これらが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first deposition comprising a first bonding film comprising a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom on a substrate. Preparing a body and a second adherend including a second bonding film having the same function as the first bonding film on the substrate;
Energy is imparted to each of a predetermined region of the first bonding film and the entire surface of the second bonding film, and the leaving group present near the surface of each bonding film is converted to the metal atom. And desorbing from at least one of the oxygen atoms to develop adhesiveness in each bonding film;
The first adherend and the second adherend are bonded together so that the first bonding film and the second bonding film are in close contact with each other, so that they are partially in the predetermined region. And a step of obtaining a joined body joined to the substrate.
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを重ね合わせて、仮接合体を得る工程と、
前記第１の接合膜および前記第２の接合膜の一部の所定領域に対してエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記金属原子および前記酸素原子の少なくとも一方から脱離させることにより、前記各接合膜の前記所定領域に接着性を発現させ、前記第１の被着体と前記第２の被着体とが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first deposition comprising a first bonding film comprising a metal atom, an oxygen atom bonded to the metal atom, and a leaving group bonded to at least one of the metal atom and the oxygen atom on a substrate. Preparing a body and a second adherend including a second bonding film having the same function as the first bonding film on the substrate;
A step of superimposing the first adherend and the second adherend to obtain a temporary joined body so that the first bonding film and the second bonding film are in close contact with each other;
Energy is imparted to a predetermined region of a part of the first bonding film and the second bonding film, and the leaving group existing near the surface of each bonding film is converted into the metal atom and the oxygen atom. By desorbing from at least one of the bonding films, the predetermined regions of the bonding films exhibit adhesiveness, and the first adherend and the second adherend are partially bonded in the predetermined regions. And a step of obtaining a bonded body.
前記第１の接合膜および前記第２の接合膜に対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記各接合膜から脱離させることにより、前記各接合膜に接着性を発現させる工程と、
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを貼り合わせることにより、これらが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first adherend including a first bonding film including a metal atom and a leaving group composed of an organic component in a predetermined region on the substrate, and the first bonding of the substrate. Preparing a second adherend including a second bonding film having the same function as the first bonding film over the entire surface facing the film;
Energy is imparted to each of the first bonding film and the second bonding film, and the leaving group present in the vicinity of the surface of each bonding film is desorbed from each bonding film, thereby A step of developing adhesiveness in each bonding film;
The first adherend and the second adherend are bonded together so that the first bonding film and the second bonding film are in close contact with each other, so that they are partially in the predetermined region. And a step of obtaining a joined body joined to the substrate.
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを重ね合わせて、仮接合体を得る工程と、
前記第１の接合膜および前記第２の接合膜に対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記各接合膜から脱離させることにより、前記各接合膜に接着性を発現させ、前記第１の被着体と前記第２の被着体とが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first adherend including a first bonding film including a metal atom and a leaving group composed of an organic component in a predetermined region on the substrate, and the first bonding of the substrate. Preparing a second adherend including a second bonding film having the same function as the first bonding film over the entire surface facing the film;
A step of superimposing the first adherend and the second adherend to obtain a temporary joined body so that the first bonding film and the second bonding film are in close contact with each other;
Energy is imparted to each of the first bonding film and the second bonding film, and the leaving group present in the vicinity of the surface of each bonding film is desorbed from each bonding film, thereby And bonding each of the bonding films to obtain a bonded body in which the first adherend and the second adherend are partially bonded in the predetermined region. Method.
前記第１の接合膜の一部の所定領域と前記第２の接合膜の全面とに対してそれぞれエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記各接合膜から脱離させることにより、前記各接合膜に接着性を発現させる工程と、
前記第１の接合膜と前記第２の接合膜が密着するように、前記第１の被着体と前記第２の被着体とを貼り合わせることにより、これらが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first adherend including a first bonding film including a metal atom and a leaving group composed of an organic component on a base material, and the same function as the first bonding film on the base material Preparing a second adherend comprising the second bonding film having:
Energy is applied to each of a predetermined region of the first bonding film and the entire surface of the second bonding film, and the leaving group present in the vicinity of the surface of each bonding film is transferred to each bonding film. Debonding from the membrane to develop adhesiveness in each of the bonding films;
By bonding the first adherend and the second adherend so that the first bonding film and the second bonding film are in close contact with each other, they are partially in the predetermined region. And a step of obtaining a joined joined body.
前記第１の接合膜と前記第２の接合膜とが密着するように、前記第１の被着体と前記第２の被着体とを重ね合わせて、仮接合体を得る工程と、
前記第１の接合膜および前記第２の接合膜の一部の所定領域に対してエネルギーを付与し、前記各接合膜の表面付近に存在する前記脱離基を、前記各接合膜から脱離させることにより、前記各接合膜の前記所定領域に接着性を発現させ、前記第１の被着体と前記第２の被着体とが前記所定領域において部分的に接合した接合体を得る工程とを有することを特徴とする接合方法。 A first adherend including a first bonding film including a metal atom and a leaving group composed of an organic component on a base material, and the same function as the first bonding film on the base material Preparing a second adherend comprising a second bonding film having:
A step of superimposing the first adherend and the second adherend to obtain a temporary joined body so that the first bonding film and the second bonding film are in close contact with each other;
Energy is applied to a predetermined region of a part of the first bonding film and the second bonding film, and the leaving group existing near the surface of each bonding film is released from each bonding film. A step of obtaining adhesiveness in the predetermined region of each bonding film, and obtaining a bonded body in which the first adherend and the second adherend are partially bonded in the predetermined region. And a bonding method characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007244519A JP2009076697A (en) | 2007-09-20 | 2007-09-20 | Bonding method and bonded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007244519A JP2009076697A (en) | 2007-09-20 | 2007-09-20 | Bonding method and bonded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009076697A JP2009076697A (en) | 2009-04-09 |
| JP2009076697A5 true JP2009076697A5 (en) | 2010-09-02 |
Family
ID=40611391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007244519A Withdrawn JP2009076697A (en) | 2007-09-20 | 2007-09-20 | Bonding method and bonded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009076697A (en) |
-
2007
- 2007-09-20 JP JP2007244519A patent/JP2009076697A/en not_active Withdrawn
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