JP2009076697A - 接合方法および接合体 - Google Patents

接合方法および接合体 Download PDF

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Publication number
JP2009076697A
JP2009076697A JP2007244519A JP2007244519A JP2009076697A JP 2009076697 A JP2009076697 A JP 2009076697A JP 2007244519 A JP2007244519 A JP 2007244519A JP 2007244519 A JP2007244519 A JP 2007244519A JP 2009076697 A JP2009076697 A JP 2009076697A
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JP
Japan
Prior art keywords
bonding film
bonding
adherend
film
leaving group
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Japanese (ja)
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JP2009076697A5 (enExample
Inventor
Takatomo Yamamoto
隆智 山本
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007244519A priority Critical patent/JP2009076697A/ja
Publication of JP2009076697A publication Critical patent/JP2009076697A/ja
Publication of JP2009076697A5 publication Critical patent/JP2009076697A5/ja
Withdrawn legal-status Critical Current

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JP2007244519A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009076697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244519A JP2009076697A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244519A JP2009076697A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

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JP2009076697A true JP2009076697A (ja) 2009-04-09
JP2009076697A5 JP2009076697A5 (enExample) 2010-09-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114080823A (zh) * 2019-05-28 2022-02-22 伯斯有限公司 用于硅树脂声学振动膜的表面处理

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114080823A (zh) * 2019-05-28 2022-02-22 伯斯有限公司 用于硅树脂声学振动膜的表面处理

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