JP2009076696A - 接合方法および接合体 - Google Patents

接合方法および接合体 Download PDF

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Publication number
JP2009076696A
JP2009076696A JP2007244518A JP2007244518A JP2009076696A JP 2009076696 A JP2009076696 A JP 2009076696A JP 2007244518 A JP2007244518 A JP 2007244518A JP 2007244518 A JP2007244518 A JP 2007244518A JP 2009076696 A JP2009076696 A JP 2009076696A
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Japan
Prior art keywords
bonding film
bonding
adherend
film
bonded
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JP2007244518A
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English (en)
Japanese (ja)
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JP2009076696A5 (enExample
Inventor
Yoshifumi Ito
佳史 伊藤
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2007244518A priority Critical patent/JP2009076696A/ja
Publication of JP2009076696A publication Critical patent/JP2009076696A/ja
Publication of JP2009076696A5 publication Critical patent/JP2009076696A5/ja
Withdrawn legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)
JP2007244518A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009076696A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244518A JP2009076696A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244518A JP2009076696A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

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JP2009076696A true JP2009076696A (ja) 2009-04-09
JP2009076696A5 JP2009076696A5 (enExample) 2010-09-02

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ID=40611390

Family Applications (1)

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JP2007244518A Withdrawn JP2009076696A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

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JP (1) JP2009076696A (enExample)

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