JP2009071077A - Lead frame and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame used for a sensor or the like capable of identifying fluid accurately by preventing the precision of the sensor from being deteriorated due to the transfer of heat obtained by the heat generation of a thin-film chip to the inner lead or the like, the lowering and the amount of heat radiation to the fluid to be identified, to provide an electronic device having the lead frame, to provide a manufacturing method of the lead frame, and to provide a manufacturing method of the electronic device having the lead frame manufactured by the manufacturing method of the lead frame. <P>SOLUTION: The lead frame comprises an outer lead, an inner lead, and an electronic component packaging section for packaging an electronic component. In the lead frame, the inner lead is arranged separate from the electronic component packaging section. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides, for example, a sensor for performing fluid identification, a lead frame used in an electronic device such as a semiconductor device, and an electronic device including the lead frame, a lead frame manufacturing method, and a lead frame manufacturing method. The present invention relates to a method for manufacturing an electronic device including a manufactured lead frame.

  Conventionally, for example, hydrocarbon liquids such as gasoline, naphtha, kerosene, light oil, and heavy oil, alcohol liquids such as ethanol and methanol, urea aqueous solution liquids, gases, granular materials, etc., use the thermal properties of the fluid. Patent Document 1 discloses a thermal sensor used in a fluid identification device that performs identification such as fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid level identification, etc. (Japanese Patent Laid-Open No. 11-153561), Japanese Patent Laid-Open No. 2006-29956, Japanese Patent Laid-Open No. 2005-337969, etc. have already been proposed.

  As shown in FIGS. 22 to 23, these thermal sensors 100 include a sensor main body 104 constituted by a mold resin 102, and the sensor main body 104 includes a substantially elliptical flange portion 106, and A back surface protruding portion 108 protruding from the back surface of the flange portion 106 and a detecting portion 110 protruding from the surface of the flange portion 106 are provided.

  The detection unit 110 includes a pair of fluid identification detection units 112 and a fluid temperature detection unit 114 having two rectangular flat plates that are spaced apart from each other by a predetermined distance. The fluid identification detection unit 112 and the fluid temperature detection unit 114 basically have the same structure, and include a heating element and a temperature sensing element. The fluid temperature detection unit 114 includes a heating element. Only the temperature sensor is allowed to act without acting.

  As shown in FIGS. 22-23, in these detection parts 112 and 114, the heat transfer member arrange | positioned in the sensor main body 104 so that the one part may be exposed to the opening part 116 which the mold resin 102 lacked. A metal die pad portion 118 functioning as A thin film chip 122 is mounted on the mounting surface 120 of the die pad 118 opposite to the opening 116.

  Further, in the sensor body 104, the die pads 118 are arranged at regular intervals so as to face the die pads 118, and a plurality of inner leads 124 are arranged at regular intervals. Yes. An external connection terminal portion 126 extends from these inner leads 124 in the direction of the rear surface protruding portion 108, and an outer lead 128 is formed at the distal end portion of the external connection terminal portion 126.

The electrode of the thin film chip 122 and the electrode 124a of the inner lead 124 are electrically connected by a bonding wire 130 made of Au.
In the thermal sensor 100 configured as described above, the heating element is heated by energization, the temperature sensing element is heated by this heating, and the heat transfer from the heating element to the temperature sensing element is thermally performed by the identified fluid. It is configured to perform the fluid identification as described above for the fluid to be identified based on the electrical output that affects and corresponds to the electrical resistance of the temperature sensing element.
JP-A-11-153561 JP 2006-29956 A JP 2005-337969 A

By the way, such a conventional thermal sensor 100 is manufactured through the following manufacturing process as shown in FIG.
That is, the die pad portion 118, the inner lead 124, the external connection terminal portion 126, and the outer lead 128 are not shown, but are integrally formed using Cu, carbon steel, aluminum alloy, aluminum, or the like as a lead frame in the manufacturing process. Is formed.

  In such an integrated lead frame, first, in the frame plating process of step S101, the entire surface of the lead frame, for example, precious metal Pd plating, Au plating, solder Ni plating, Sn plating, Sn-Pb plating is used. Sn-Bi plating, Ag plating, Ag-Cu plating, In plating, etc. are applied. In this case, the type of plating is not particularly limited as long as it is a plating metal used for soldering with a noble metal. .

  After the entire lead frame is plated in the frame plating process of step S101, the thin film chip 122 is attached (bonded) to the die pad portion 118 via the bonding material 101 such as an adhesive in the die bonding process of step S102. ing.

  Next, in the wire bonding process of step S103, the electrode of the thin film chip 122 and the electrode 124a of the inner lead 124 are electrically connected by the bonding wire 130 made of Au.

  Then, in this state, the lead frame is arranged in the mold, and in the molding process of step S104, for example, a predetermined portion of the lead frame is configured with the mold resin 102 by injection molding in which an epoxy resin is injected. A sensor body 104 is formed.

  After that, after the lead frame is separated into a predetermined size in the diver cutting process in step S105, the mold resin deburring process in step S106 is immersed in an acid or alkali solution to thereby remove excess mold resin 102 of the sensor body 104. The so-called “burrs” that are the resin parts are removed.

  Next, in the exterior plating (terminal part plating) step of step S107, in order to improve solderability when soldering an external lead wire or the like to the outer lead 128 at the distal end portion of the external connection terminal part 126, for example, Precious metal Pd plating, Au plating, solder Ni plating, Sn plating, Sn-Pb plating, Sn-Bi plating, Ag plating, Ag-Cu plating, In plating, etc. are performed. In this case, the type of plating is not particularly limited as long as it is a plating metal used for soldering with a noble metal.

  Then, in the marking process of step S108, after marking the identifiable portion for product operation management, in the mold separating process of step S109, unnecessary portions of the lead frame are cut and removed from the sensor 100, After adjusting the shape of the outer lead 128, the sensor 100 which is a finished product is obtained.

  In the thermal sensor 100 manufactured as described above, the thin film chip 122 mounted on the die pad portion 118 is heated by energization, the temperature sensing body is heated by this heat generation, and heat is transferred from the heating element to the temperature sensing body. On the other hand, the fluid to be identified is subjected to thermal influence, and the fluid to be identified is identified based on the electrical output corresponding to the electric resistance of the temperature sensing element.

  However, in such a thermal sensor 100, when the heat obtained by the heat generation of the thin film chip 122 is transferred to the die pad portion 118, the inner lead 124, and the like, the heat dissipation amount to the fluid to be identified decreases, This was the cause of the decrease in sensor accuracy.

  In the present invention, in view of such a current situation, the heat obtained by the heat generation of the thin film chip 122 is transmitted to the inner lead 124 or the like as in the prior art, and the amount of heat released to the fluid to be identified is reduced. Lead frames used in sensors that can accurately identify fluid without degrading accuracy, and electronic devices including the lead frames, as well as lead frame manufacturing methods and leads manufactured by the lead frame manufacturing methods A method for manufacturing an electronic device including a frame is provided.

The present invention has been invented to achieve the above-described problems and objects in the prior art, and the lead frame of the present invention is for mounting an outer lead portion, an inner lead portion, and an electronic component. A lead frame having an electronic component mounting portion,
The inner lead portion and the electronic component mounting portion are spaced apart from each other.

The lead frame manufacturing method of the present invention is a lead frame manufacturing method including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The inner lead portion and the electronic component mounting portion are formed apart from each other.

  By configuring in this way, it is possible to suppress the heat generated by the electronic component from being transmitted to the inner lead part. For example, even when it is adopted as a lead frame of a thermal sensor that performs fluid identification, Since heat generated by the thin film sensor mounted on the component mounting portion is not transmitted to the inner lead portion and can be efficiently radiated to the fluid to be identified, accurate fluid identification can be performed.

The lead frame of the present invention is a lead frame including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The electronic component mounting portion includes a support lead portion for supporting the electronic component mounting portion,
The support lead portion extends from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more.

The lead frame manufacturing method of the present invention is a lead frame manufacturing method including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
A support lead portion for supporting the electronic component mounting portion is formed on the electronic component mounting portion so as to extend from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more. Features.

  With this configuration, the electronic component mounting part can maintain a sufficient distance from the inner lead part, prevent heat from being transmitted from the electronic component mounting part to the inner lead part, and efficiently dissipate heat to the identified fluid. Therefore, accurate fluid identification can be performed.

The lead frame of the present invention is a lead frame including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The electronic component mounting portion includes a support lead portion for supporting the electronic component mounting portion,
The inner lead portion and the electronic component mounting portion are arranged apart from each other,
The support lead portion extends from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more.

The lead frame manufacturing method of the present invention is a lead frame manufacturing method including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
While forming the inner lead part and the electronic component mounting part apart,
A support lead portion for supporting the electronic component mounting portion is formed on the electronic component mounting portion so as to extend from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more. Features.

  By configuring in this way, the electronic component mounting part can maintain a sufficient distance from the inner lead part, preventing heat from being transmitted from the electronic component mounting part to the inner lead part, for example, causing the electronic component to generate heat. The heat thus obtained is not transmitted to the inner lead portion and can be efficiently radiated to the fluid to be identified, so that accurate fluid identification can be performed.

  In the present invention, the end of the inner lead portion and the end of the electronic component mounted on the electronic component mounting portion facing the end of the inner lead portion are spaced apart by 1.6 mm or more. It is characterized by.

  As described above, the end portion of the inner lead portion and the end portion of the electronic component mounted on the electronic component mounting portion are arranged at a distance of 1.6 mm or more, so that the heat generated by the electronic component is transferred to the inner lead portion. For example, even when it is used as a lead frame for a thermal sensor for fluid identification, the heat generated by the thin film sensor mounted on the electronic component mounting part is applied to the inner lead part. Since heat can be efficiently radiated to the fluid to be identified without being transmitted, accurate fluid identification can be performed.

Further, the present invention is characterized in that the predetermined linear distance is 2.0 mm.
In this way, by extending the support lead portion by 2.0 mm or more from the corner portion of the electronic component mounted on the electronic component mounting portion, the electronic component mounting portion can maintain a sufficient distance from the inner lead portion. It is possible to prevent heat from being transferred from the electronic component mounting part to the inner lead part, for example, heat generated by heating the electronic component is not transferred to the inner lead part and efficiently dissipated to the fluid to be identified. Therefore, accurate fluid identification can be performed.

Further, the present invention is characterized in that the inner lead portion and the electronic component mounted on the electronic component mounting portion are electrically connected.
By configuring in this way, an electronic component such as a thin film chip or IC is mounted on the electronic component mounting portion, and the inner lead portion and the electronic component mounted on the electronic component mounting portion are connected to, for example, a wire. It can be electrically connected by bonding or the like, and can be used as, for example, a sensor or a semiconductor device.

The present invention is characterized in that the inner lead portion and the electronic component mounted on the electronic component mounting portion are hermetically sealed or resin-sealed.
Further, the present invention is characterized in that the support lead portion is hermetically sealed or resin-sealed.

  By configuring in this way, the inner lead part, the electronic component mounted on the electronic component mounting part, and the support lead part are sealed with, for example, ceramic, metal and hermetically sealed with an inert gas, Or, since the resin is sealed by resin molding (resin mold), the fluid to be identified enters and electronic parts such as thin film chips do not function, or the inner leads, bonding wires, etc. corrode and function as sensors. For example, accurate fluid identification can be performed without deterioration in quality.

An electronic device according to the present invention includes any one of the lead frames described above.
Moreover, the electronic device of the present invention is a sensor for performing fluid identification.

  In the electronic device of the present invention, the fluid identification is at least one of fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid leakage identification, and fluid level identification. It is characterized by being.

  By configuring in this way, for example, hydrocarbon liquids such as gasoline, naphtha, kerosene, light oil, and heavy oil, alcohol liquids such as ethanol and methanol, urea aqueous solution liquids, gases, powders, etc. The physical properties of the fluid, for example, the thermal properties of the fluid, are used to identify the fluid to be identified, such as fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid level identification, etc. be able to.

  Further, when performing such fluid identification, the lead frame sealed with the resin mold is not exposed to the fluid in the exposed portion exposed to the fluid. The fluid to be identified does not enter and electronic components such as thin film chips do not function, and the inner leads, bonding wires, etc. corrode and the quality of the sensor does not deteriorate. Can do.

  According to the present invention, since the inner lead portion and the electronic component mounting portion are spaced apart from each other, the heat obtained by the heat generation of the electronic component such as a thin film chip mounted on the electronic component mounting portion is the inner lead. Since the heat is transmitted to the inner lead part like a conventional thermal sensor, the amount of heat released to the fluid to be identified is reduced and the accuracy as a sensor is reduced. Nothing will happen.

  In addition, according to the present invention, since the support lead portion that supports the electronic component mounting portion is extended from the corner portion of the electronic component by a predetermined linear distance or more, the electronic component mounting portion has a sufficient distance from the inner lead portion. Since it is possible to prevent heat from being transmitted from the electronic component mounting part to the inner lead part, the amount of heat released to the fluid to be identified is reduced and the accuracy as a sensor is not reduced. .

Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a top view of a multi-piece lead frame of the present invention, FIG. 2 is a partially enlarged top view of the lead frame of FIG. 1, and FIG. 3 is a manufacturing process of a thermal sensor using the lead frame of FIG. FIG. 4 is a partially enlarged top view of the lead frame in FIG. 1 for explaining the manufacturing process of the thermal sensor using the lead frame in FIG. 1, and FIG. 5 uses the lead frame in FIG. 6 is a longitudinal sectional view of the thermal sensor of FIG. 5, FIG. 7 is a longitudinal sectional view of the thermal sensor of FIG. 6, taken along line AA, and FIG. 8 is a molding process. FIG.

In FIG. 1, reference numeral 1 indicates a lead frame body having the lead frame of the present invention as a whole.
The lead frame body 1 in FIG. 1 is a so-called multi-cavity type, and shows an embodiment applied to manufacture a thermal sensor.

  In other words, the lead frame body 1 includes a plurality of lead frames 2 arranged in parallel, and the lead frame 2 includes an outer frame body 4 having a substantially rectangular flat plate shape. A total of four positioning holes 3 for positioning when placed inside are formed.

  In addition, two sets of four outer leads 8 spaced apart from each other by a predetermined distance are extended from the lower frame 6 of the outer frame 4. External connection terminal portions 10 are formed above these outer leads 8, and in the external connection terminal portions 10, horizontal support portions 16 that extend left and right to the left frame body 12 and the right frame body 14 of the outer frame body 4. It is supported. Note that two left central support portions 18 and a right central support portion 20 are extended from the central portion of the lower frame body 6 and are connected to the horizontal support portion 16, respectively.

  Furthermore, an inner lead 22 extending so as to incline toward the center is formed above the external connection terminal portion 10 so as to be spaced apart from each other by a predetermined distance. An inner lead tip 24 is disposed.

  Further, the left suspension lead 26 constituting the support lead portion is spaced apart from the inner lead 22 by a predetermined distance from the left frame 12 and the right frame 14 of the outer frame 4 so as to correspond to the shape of the inner lead 22. The right suspension lead 28 is extended. On the other hand, a left center suspension lead 30 and a right center suspension lead 32 constituting the support lead portion are extended from the left center support portion 18 and the right center support portion 20, respectively.

  The left suspension lead 26 and the left central suspension lead 30 extend upward from the inner lead distal end portion 24 of the inner lead 22, and are spaced apart from each other by a predetermined interval so as to face the inner lead distal end portion 24. A substantially rectangular die pad portion 34 constituting the arranged electronic component mounting portion is formed.

  Similarly, the right suspension lead 28 and the right center suspension lead 32 extend upward from the inner lead distal end portion 24 of the inner lead 22, and are spaced apart from each other at a certain interval so as to face the inner lead distal end portion 24. A substantially rectangular die pad portion 34 that constitutes the electronic component mounting portion arranged in the above manner is formed.

  As described later, the inner lead tip 24 and the die pad 34 are spaced apart from each other, as described later, when the thin film chip 40 attached to the die pad 34 generates heat for sensing. However, since heat transfer to the inner lead 22 can be suppressed and heat radiation to the fluid to be identified can be sufficiently performed, the quality of the sensor does not deteriorate.

  Further, as described later, a support projecting portion 36 for supporting the die pad portion 34 is projected from the upper end portion of these die pad portions 34 in the die bonding step of step S5 and the wire bonding step of step S6. Yes. The support projecting portion 36 also has an anchor effect at the time of injection molding of the mold resin and a support effect in the mold in the molding step of Step S7.

A method of manufacturing a thermal sensor using the lead frame 2 configured as described above will be described below.
First, as shown in the process schematic diagram of FIG. 3, in the resist printing / exposure process of step S1, after printing and exposing a resist so as to have a predetermined pattern, in the black filled portion of FIG. The inner lead tip 24, the outer lead 8, and the external connection terminal portion 10 of the inner lead 22 shown are exposed.

  Next, in the Ni plating (partial) step of step S2, Ni plating as base plating is applied to the inner lead tip 24, the outer lead 8, and the external connection terminal 10 of the inner lead 22 which are exposed portions. Then, in the peeling process in step S3, the resist is removed with an alkaline solution.

  Thereafter, in the Au plating (partial) process of step S4, the inner lead 22 of the inner lead 22, the outer lead 8, and the external connection terminal portion 10 are plated with Au on the upper surface of the Ni plating as the base plating to form a frame. To manufacture.

Next, as shown in FIG. 4, in the die bonding step of step S <b> 5, the thin film chip 40 is attached (bonded) to the die pad portion 34 via a bonding material 38 such as an adhesive.
Then, in the wire bonding process of step S6, the electrode (not shown) of the thin film chip 40 and the electrode part 24a of the inner lead tip 24 of the inner lead 22 are electrically connected by a bonding wire 42 made of Au. To do.

  In this state, the lead frame 2 is arranged in the mold, and in the molding process of step S7, for example, by injection molding in which an epoxy resin is injected, a predetermined portion of the lead frame 2 is shown in FIG. Thus, the sensor main body 54 constituted by the mold resin 44 is formed.

Thereafter, in the diver cutting process of step S8, the lead frame 2 is separated into a predetermined size.
Then, in the marking process of step S9, for product operation management, after marking the identifiable part, for example, the side surface of the flange portion 56, in the mold separating process of step S10, the unnecessary part of the lead frame 2 is removed. After cutting and removing from the sensor 50 and adjusting the shape of the outer lead 8, the sensor 50, which is a finished product shown in FIGS. 5 to 7, is obtained.

  In this case, in the above embodiment, the inner lead tip 24, the outer lead 8 and the external connection terminal portion 10 of the inner lead 22 are plated. However, the portion of the partial plating can be selected as appropriate. It is possible to apply plating to at least a part of at least one of the lead part and the inner lead part.

  As a result, there is no need to plate the entire lead frame as in the conventional case, so there is no need to perform a two-step plating process as in the conventional case, the process is simple, the cost is low, and partial Therefore, a large amount of waste liquid such as a plating solution is not generated and there is no influence on the environment.

  Also, since the outer lead part and the inner lead part are plated together, it is only necessary to perform a single plating process, and there is no need to perform a two-step plating process as in the prior art, and the process is simple. In addition, since the cost is low and the plating process is partial, a large amount of waste liquid such as a plating process liquid is not generated, and the environment is not affected.

  Further, the plating is preferably composed of at least one kind of plated metal selected from Au, Ag, Pd, Ni, Sn, Cu, Bi, Sn-Bi, Sn-Ag, and Sn-Ag-Pb. Thus, migration does not occur in the outer lead portion at the tip of the external connection terminal portion as in the prior art, and the soldering joint strength does not decrease.

  In addition, it is desirable that the lead frame is made of a corrosion-resistant metal, which may cause the lead frame to be corroded and immersed in an acid or alkaline solution during the plating process, thereby reducing the mechanical strength of the lead frame. Absent.

  Further, it is desirable that the lead frame is made of a hard metal (metal having rigidity (spring property)) having a material hardness of Hv135 or more, preferably 180 or more, and more preferably 220 or more. Since the die pad portion supported in a so-called cantilever state on the lead frame is not deformed by the resin pressure of the mold resin, the quality as a sensor does not deteriorate and, for example, accurate fluid identification can be performed.

  In addition, it is desirable that the lead frame is made of at least one metal selected from stainless steel, for example, an Fe-Ni alloy such as 42 alloy, so that the lead frame is immersed in an acid or alkali solution in the plating process. The lead frame is not corroded and the mechanical strength of the lead frame is not lowered, and the die pad portion supported by the lead frame in a so-called cantilever state by the resin pressure of the molding resin at the time of injection molding Since it does not deform | transform, the quality as a sensor does not fall, for example, accurate fluid identification can be performed.

  By configuring in this way, for example, hydrocarbon liquids such as gasoline, naphtha, kerosene, light oil, and heavy oil, alcohol liquids such as ethanol and methanol, urea aqueous solution liquids, gases, powders, etc. The physical properties of the fluid, for example, the thermal properties of the fluid, are used to identify the fluid to be identified, such as fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid level identification, etc. be able to.

  In this case, in the molding process of step S8, the sensor main body 54 composed of the mold resin 44 is formed in a predetermined portion of the lead frame 2 by, for example, injection molding in which an epoxy resin is injected. At this time, as shown in FIGS. 4 and 6, the lead frame 2 of the present invention has a suspension structure from one side by the suspension leads 26, 28, 30, 32. Due to the resin flow in the molding process, the position of the die pad portion 34 which is an electronic component mounting portion is difficult to stabilize. Therefore, by using a hard metal (a metal having rigidity (spring property)) as the lead frame 2, the stability of the electronic component mounting portion can be ensured.

  As shown in FIGS. 5 to 7, the sensor 50 configured as described above includes a sensor main body 54 formed of a mold resin 44. The sensor main body 54 includes a substantially elliptical flange portion 56 and a sensor body 54. The rear surface protruding portion 58 protruding from the rear surface of the flange portion 56 and the detecting portion 60 protruding from the surface of the flange portion 56 are provided.

  The detection unit 60 includes a pair of fluid identification detection units 62 having a rectangular plate shape and a fluid temperature detection unit 64 that are spaced apart from each other by a predetermined distance. The fluid identification detection unit 62 and the fluid temperature detection unit 64 basically have the same structure, and include a heating element and a temperature sensing element. The fluid temperature detection unit 64 includes a heating element. Only the temperature sensor is allowed to act without acting.

  As shown in FIGS. 5 to 7, these detection units 62 and 64 include a metal die pad portion 34 that functions as a heat transfer member disposed in the sensor main body 54 sealed with the mold resin 44. ing. A thin film chip 40 is mounted on the mounting surface of the die pad portion 34 via a bonding material 38.

  Further, in the sensor main body 54, a plurality of inner leads 22 are disposed so as to be opposed to the die pad portions 34 by being spaced apart from the die pad portions 34 by a certain distance and being spaced apart from each other by a certain distance. Yes. The external connection terminal portion 10 extends from these inner leads 22 in the direction of the rear surface protruding portion 58, and the outer lead 8 is formed at the tip portion of the external connection terminal portion 10.

And between the electrode part 24a of the inner lead front-end | tip part 24 with the electrode of the thin film chip | tip 40, it is electrically connected by the bonding wire 42 which consists of Au.
In the thermal sensor 50 configured as described above, as shown in FIGS. 1, 2, and 6, the inner lead 22 and the die pad portion 34 are arranged at a predetermined interval, and the suspension lead 26, Reference numerals 28, 30, and 32 extend from the corner portion 40a of the thin film sensor 40 attached to the die pad portion 34 for a predetermined linear distance or more.

  FIG. 9A is a graph showing the relationship between the distance from the end 34a of the die pad 34 to the inner lead tip 24 and the temperature of the inner lead tip 24 when the thin film chip 40 is heated. (B) shows the length of the suspension leads 26, 28, 30, 32 and the suspension leads 26, 28 with the corner portion 40 a of the thin film chip 40 mounted on the die pad portion 34 as a base when the thin film chip 40 is heated. , 30 and 32 are graphs showing the relationship of the temperatures of the tip portions.

  As shown in FIG. 9A, the temperature of the inner lead distal end portion 24 decreases as the temperature of the inner lead distal end portion 24 increases away from the die pad portion 34. However, when the distance from the die pad 34 is 1.6 mm or more, the temperature of the inner lead tip 24 hardly changes.

  Accordingly, by disposing the inner lead distal end portion 24 and the die pad portion 34 at least 1.6 mm apart, heat transfer to the inner lead 22 can be sufficiently suppressed, and sufficient heat dissipation to the identified fluid is achieved. For example, accurate fluid identification can be performed without deteriorating the quality of the sensor.

  Further, as shown in FIG. 9B, the temperature of the tip of the suspension leads 26, 28, 30, 32 decreases as the length of the suspension leads increases, that is, as the distance from the thin film sensor 40 increases. Become. However, when the length of the suspension leads 26, 28, 30, and 32 is 2.0 mm or more, the temperature of the tip of the suspension leads 26, 28, 30, and 32 hardly changes.

  Therefore, by setting the length of the suspension leads 26, 28, 30, and 32 to at least 2.0 mm or more, the electronic component mounting portion can maintain a sufficient distance from the inner lead portion. Since heat can be prevented from being transmitted to the part and heat can be sufficiently radiated to the fluid to be identified, the quality of the sensor does not deteriorate, and for example, accurate fluid identification can be performed.

The thermal sensor 50 configured as described above is configured to perform fluid identification based on a method disclosed in Japanese Patent Application Laid-Open No. 2005-337969.
10 is an exploded perspective view showing an embodiment in which the sensor 50 according to the present invention is applied to a fluid identification apparatus, FIG. 11 is a partially omitted sectional view of FIG. 10, and FIG. 12 is a diagram of the fluid identification apparatus according to the present invention. It is a figure which shows the attachment state to a tank.

As shown in FIGS. 10 to 12, an opening 68 is provided in the upper portion of the tank 66, and a fluid identification device 70 according to the present invention is attached to this opening.
The tank 66 is provided with an inlet pipe 72 through which fluid is injected and an outlet pipe 74 through which fluid is taken out. The outlet pipe 74 is connected to the tank at a height position close to the bottom of the tank 66, and is connected to a fluid use device (not shown) via the pump 76.

  The fluid identification device 70 includes a fluid identification sensor unit 78 and a support unit 80. A fluid identification sensor unit 78 is attached to one end (lower end) of the support 80, and an attachment for attaching to the tank opening 68 at the other end (upper end) of the support 80. 82 is provided.

The fluid identification sensor unit 78 includes a fluid identification detection unit 62 including a heating element and a temperature sensing body, and a fluid temperature detection unit 64 that measures the temperature of the fluid.
In the fluid identification device 70 configured as described above, the heating element is heated by energization based on the method disclosed in Patent Document 3 (Japanese Patent Laid-Open No. 2005-337969), and the temperature sensing element is heated by this heating. The heat transfer from the heating element to the temperature sensing element is thermally affected by the fluid to be identified, and based on the electrical output corresponding to the electrical resistance of the temperature sensing body, the fluid to be identified is as described above. It is configured to perform accurate fluid identification.

Hereinafter, liquid type identification will be described as an example of fluid identification. In the present embodiment, the portion surrounded by the alternate long and short dash line in FIG.
In FIG. 13, for the sake of simplicity, the switch 86 is described as simply opening and closing, but when creating the custom IC 84, a plurality of voltage application paths capable of applying different voltages to each other are formed. Alternatively, any voltage application path may be selected during heater control. By doing so, the range of selection of the characteristics of the heating element 62a4 of the fluid identification detection unit 62 is greatly expanded. In other words, it is possible to apply an optimum voltage for identification according to the characteristics of the heating element 62a4. In addition, since a plurality of different voltages can be applied during heater control, the types of identification target liquids can be expanded.

  In FIG. 13, for the sake of simplicity, the resistors 88 and 90 are described as having a constant resistance value. However, when the resistors 88 and 90 are built in the custom IC 84, the resistance values of the resistors 88 and 90 are variable. For example, the resistance values of the resistors 88 and 90 may be appropriately changed for identification. Similarly, the characteristics of the differential amplifier 92 and the liquid temperature detection amplifier 94 may be adjusted when being built in the custom IC 84, and the amplifier characteristics may be changed as appropriate for identification.

  In this way, it becomes easy to set the characteristics of the liquid type detection circuit to an optimum one, and individual variations in manufacturing of the fluid identification detection unit 62 and the fluid temperature detection unit 64 and the manufacturing of the custom IC 84 are facilitated. Variations in identification characteristics that occur based on individual variations can be reduced, and manufacturing yield is improved.

Hereinafter, the liquid type identification operation in the present embodiment will be described.
When the liquid to be measured US is stored in the tank 66, the aqueous solution US to be measured is also filled in the liquid to be measured introduction path 96 formed by the cover member 98 that covers the fluid identification sensor unit 78. The liquid to be measured US in the tank 66 including the liquid to be measured introduction path 96 does not substantially flow.

  By closing the switch 86 for a predetermined time (for example, 8 seconds) by a heater control signal output from the microcomputer 91 to the switch 86, a single pulse having a predetermined height (for example, 10V) with respect to the heating element 62a4. A voltage P is applied to cause the heating element to generate heat. At this time, the output voltage (sensor output) Q of the differential amplifier 92 gradually increases during voltage application to the heating element 62a4 and gradually decreases after the voltage application to the heating element 62a4 is completed, as shown in FIG. To do.

  In the microcomputer 91, as shown in FIG. 14, the sensor output is sampled a predetermined number of times (for example, 256 times) for a predetermined time (for example, 0.1 second) before the voltage application to the heating element 62a4 is started. An operation for obtaining an average value is performed to obtain an average initial voltage value V1. This average initial voltage value V1 corresponds to the initial temperature of the temperature sensing element 62a2.

  Further, as shown in FIG. 14, the first time which is a relatively short time from the start of voltage application to the heating element (for example, 0.5 or less of the application time of a single pulse and 0.5 ~ 3 seconds; 2 seconds in FIG. 14 (specifically immediately before the passage of the first time), the sensor output is sampled a predetermined number of times (for example, 256 times), and an operation is performed to obtain the average value. An average first voltage value V2 is obtained. This average first voltage value V2 corresponds to the first temperature when the first time elapses from the start of the single pulse application of the temperature sensing element 62a2. Then, a difference V01 (= V2−V1) between the average initial voltage value V1 and the average first voltage value V2 is obtained as the liquid type corresponding first voltage value.

  Further, as shown in FIG. 14, when a second time (for example, the application time of a single pulse; 8 seconds in FIG. 14), which is a relatively long time from the start of voltage application to the heating element has elapsed (specifically Specifically, the sensor output is sampled a predetermined number of times (for example, 256 times) just before the second time elapses, and an operation for obtaining the average value is performed to obtain the average second voltage value V3. This average second voltage value V3 corresponds to the second temperature when the second time has elapsed from the start of the single pulse application of the temperature sensing element 62a2. Then, a difference V02 (= V3−V1) between the average initial voltage value V1 and the average second voltage value V3 is obtained as the liquid type-corresponding second voltage value.

  By the way, a part of the heat generated in the heating element 62a4 based on the voltage application of the single pulse as described above is transmitted to the temperature sensing element 62a2 through the liquid to be measured. There are mainly two forms of this heat transfer that differ depending on the time from the start of pulse application. That is, in the first stage within a relatively short time (for example, 3 seconds, particularly 2 seconds) from the start of pulse application, the heat transfer is mainly dominated by conduction (for this reason, the first voltage value V01 corresponding to the liquid type is mainly liquid. Affected by the thermal conductivity of

  On the other hand, in the second stage after the first stage, heat transfer is mainly dominated by natural convection (for this reason, the liquid type-corresponding second voltage value V02 is mainly influenced by the kinematic viscosity of the liquid). This is because in the second stage, natural convection occurs due to the liquid to be measured heated in the first stage, and the ratio of heat transfer due to this increases.

  As described above, the optimum concentration (weight percent: the same applies hereinafter) of the urea aqueous solution used in the exhaust gas purification system is 32.5%. Accordingly, the allowable range of the urea concentration of the urea aqueous solution to be accommodated in the urea aqueous solution tank 66 can be set to 32.5% ± 5%, for example. The width ± 5% of the allowable range can be appropriately changed as desired. That is, in this embodiment, a urea aqueous solution having a urea concentration in the range of 32.5% ± 5% is determined as the predetermined liquid.

  The liquid type corresponding first voltage value V01 and the liquid type corresponding second voltage value V02 change as the urea concentration of the urea aqueous solution changes. Accordingly, the range (predetermined range) of the liquid type-corresponding first voltage value V01 and the range (predetermined range) of the liquid type-corresponding second voltage value V02 corresponding to the urea aqueous solution within the urea concentration range of 32.5% ± 5% are obtained. Exists.

  By the way, even if it is liquid other than urea aqueous solution, depending on the density | concentration, the output in the predetermined range of said liquid type corresponding | compatible 1st voltage value V01 and the predetermined range of liquid type corresponding | compatible 2nd voltage value V02 is obtained. There is. That is, even if the liquid type corresponding first voltage value V01 or the liquid type corresponding second voltage value V02 is within the predetermined range, the liquid is not necessarily a predetermined urea aqueous solution. For example, as shown in FIG. 15, the urea concentration is within the range of the first voltage value V01 corresponding to the liquid type obtained with the urea aqueous solution having a predetermined range of 32.5% ± 5% (that is, the sensor display concentration value). Within the range of 32.5% ± 5% in terms of conversion, there is a first voltage value corresponding to the liquid type of the sugar aqueous solution having a sugar concentration of about 25% ± 3%.

  However, the value of the liquid type corresponding second voltage value V02 obtained from the sugar aqueous solution within the sugar concentration range is far from the range of the liquid type corresponding second voltage value V02 obtained with the urea aqueous solution within the predetermined urea concentration range. It will be. That is, as shown in FIG. 16, in the sugar aqueous solution within the sugar concentration range of 15% to 35% including the sugar concentration range of about 25% ± 3%, the liquid type corresponding first voltage value V01 is predetermined. However, the liquid type-corresponding second voltage value V02 is significantly different from the urea aqueous solution within the predetermined urea concentration range.

  In FIG. 16, both the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 are shown as relative values with 1.000 being a urea aqueous solution having a urea concentration of 30%. As described above, by determining that both the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 are within the respective predetermined ranges, it is determined whether or not the liquid is a predetermined liquid. It can be reliably identified that the aqueous sugar solution is not a predetermined liquid.

  In addition, the liquid type corresponding second voltage value V02 may overlap with that of the predetermined liquid. However, in this case, since the liquid type-corresponding first voltage value V01 is different from that of the predetermined liquid, it is possible to reliably identify that the liquid is not the predetermined one based on the determination criterion.

  In the present invention, the liquid type is identified by utilizing the fact that the relationship between the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 varies depending on the type of solution as described above. That is, the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 are affected by different physical properties of the liquid, that is, thermal conductivity and kinematic viscosity, and their relationship differs depending on the type of solution. Thus, liquid type identification as described above becomes possible. By narrowing the predetermined range of the urea concentration, the identification accuracy can be further increased.

  That is, in the embodiment of the present invention, the first calibration curve indicating the relationship between the temperature and the liquid type corresponding first voltage value V01 and the temperature and the liquid type correspondence for some urea aqueous solutions (reference urea aqueous solution) having a known urea concentration. A second calibration curve indicating the relationship with the second voltage value V02 is obtained in advance, and these calibration curves are stored in the storage means of the microcomputer 91. Examples of the first and second calibration curves are shown in FIGS. 17 and 18, respectively. In these examples, calibration curves are created for reference urea aqueous solutions having urea concentrations c1 (for example, 27.5%) and c2 (for example, 37.5%).

  As shown in FIGS. 17 and 18, since the liquid type corresponding first voltage value V01 and the liquid type corresponding second voltage value V02 depend on the temperature, the liquid to be measured is identified using these calibration curves. In this case, the liquid temperature corresponding output value T input from the temperature sensing body 64a2 of the fluid temperature detecting unit 64 via the liquid temperature detecting amplifier 94 is also used. An example of the liquid temperature corresponding output value T is shown in FIG. Such a calibration curve is also stored in the storage means of the microcomputer 91.

  In measuring the liquid type-corresponding first voltage value V01, first, a temperature value is obtained from the liquid temperature-corresponding output value T obtained for the liquid to be measured, using the calibration curve of FIG. Assuming that the obtained temperature value is t, then, in the first calibration curve of FIG. 17, the liquid type corresponding first voltage values V01 (c1; t), V01 (c2; c) of each calibration curve corresponding to the temperature value t. t).

Then, cx of the liquid type corresponding first voltage value V01 (cx; t) obtained for the liquid to be measured to be measured is used as the liquid type corresponding first voltage value V01 (c1; t), V01 (c2; c) of each calibration curve. Determine by performing a proportional operation using t). That is, cx is based on V01 (cx; t), V01 (c1; t), V01 (c2; t), and the following formula (1)
cx = c1 +
(C2-c1) [V01 (cx; t) -V01 (c1; t)]
/ [V01 (c2; t) -V01 (c1; t)] (1)
Ask from.

  Similarly, when measuring the liquid type corresponding second voltage value V02, the liquid type of each calibration curve corresponding to the temperature value t obtained for the liquid to be measured in the second calibration curve of FIG. Corresponding second voltage values V02 (c1; t), V02 (c2; t) are obtained. Then, the cy of the liquid type corresponding second voltage value V02 (cy; t) obtained for the liquid to be measured is set as the liquid type corresponding second voltage value V02 (c1; t), V02 (c2; t) of each calibration curve. Determine by performing the proportional calculation used.

That is, cy is based on V01 (cy; t), V01 (c1; t), V01 (c2; t), and the following formula (2)
cy = c1 +
(C2-c1) [V02 (cy; t) -V02 (c1; t)]
/ [V02 (c2; t) -V02 (c1; t)] (2)
Ask from.

  In addition, by adopting the first and second calibration curves in FIGS. 17 and 18 that use the liquid temperature corresponding output value T instead of the temperature, the calibration curve in FIG. 19 is stored and converted using this. Can be omitted.

  As described above, for each of the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02, a predetermined range that varies depending on the temperature can be set. By setting c1 to 27.5% and c2 to 37.5% as described above, the region surrounded by the two calibration curves in each of FIGS. 17 and 18 is a predetermined liquid (that is, urea concentration). 32.5% ± 5% urea aqueous solution).

  FIG. 20 is a graph schematically showing that a predetermined liquid identification criterion based on the combination of the liquid type corresponding first voltage value V01 and the liquid type corresponding second voltage value V02 changes according to the temperature. As the temperature rises to t1, t2, and t3, the areas AR (t1), AR (t2), and AR (t3) that are determined as the predetermined liquid move.

FIG. 21 is a flowchart showing a liquid type identification process in the microcomputer 91.
First, before applying the pulse voltage to the heating element 62a4 by the heater control, N = 1 is stored in the microcomputer (S1), and then the sensor output is sampled to obtain the average initial voltage value V1 (S2). Next, the heater control is executed, and the sensor output is sampled when the first time has elapsed from the start of voltage application to the heating element 62a4 to obtain the average first voltage value V2 (S3).
Next, the calculation of V2-V1 is performed to obtain a liquid type corresponding first voltage value V01 (S4). Next, the sensor output is sampled when the second time has elapsed from the start of voltage application to the heating element 62a4 to obtain an average second voltage value V3 (S5). Next, calculation of V3-V1 is performed to obtain a liquid type corresponding second voltage value V02 (S6).

  Next, referring to the temperature value t obtained for the liquid to be measured, the liquid type-corresponding first voltage value V01 is within a predetermined range at the temperature and the liquid type-corresponding second voltage value V02 is a predetermined value at the temperature. It is determined whether or not the condition of being within the range is satisfied (S7). If it is determined in S7 that at least one of the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 is not within the predetermined range (NO), the stored value N is 3. It is determined whether or not there is (S8). If it is determined in S8 that N is not 3 [that is, the current measurement routine is not the third time (specifically, the first or second time)] (NO), then the stored value N is set to 1 only. Increase (S9) and return to S2.

On the other hand, if it is determined in S8 that N is 3 [that is, the current measurement routine is the third time] (YES), it is determined that the fluid to be measured is not a predetermined one (S10).
On the other hand, if it is determined in S7 that both the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 are within the respective predetermined ranges (YES), the fluid to be measured is the predetermined one. It is determined that there is (S11).

  In this embodiment, following S11, the urea concentration of the urea aqueous solution is calculated (S12). This concentration calculation is based on the output of the fluid temperature detector 64, that is, the temperature value t obtained for the liquid to be measured, the liquid type-corresponding first voltage value V01, and the first calibration curve in FIG. ) Can be used. Alternatively, the concentration is calculated based on the output of the fluid temperature detector 64, that is, the temperature value t obtained for the liquid to be measured, the liquid type-corresponding second voltage value V02, and the second calibration curve in FIG. 2).

  As described above, the liquid type can be identified accurately and quickly. This liquid type identification routine can be appropriately executed when the engine of the automobile is started, periodically, when requested by the driver or the automobile (an ECU described later), or when the automobile key is turned off. In a desired manner, it is possible to monitor whether the liquid in the urea tank is a urea aqueous solution having a predetermined urea concentration.

  A signal indicating whether or not the liquid type is obtained in this way (whether or not it is a predetermined one, and further, a signal indicating the urea concentration in the case of a predetermined one [urea aqueous solution having a predetermined urea concentration]) is not shown. Is output to the output buffer circuit 93 shown in FIG. 13 from here, and the combustion of an automobile engine (not shown) as an analog output through the terminal pin, the power supply circuit board and the waterproof wiring from here. It is output to a main computer (ECU) that performs control and the like. The analog output voltage value corresponding to the liquid temperature is also output to the main computer (ECU) through a similar route. On the other hand, a signal indicating the liquid type can be taken out as a digital output as necessary, and can be input to a device that performs a display, an alarm, and other operations through a similar route.

  Further, based on the liquid temperature corresponding output value T input from the fluid temperature detector 64, a warning is issued when it is detected that the temperature of the urea aqueous solution has dropped to near the temperature (about −13 ° C.). can do.

  Note that the above liquid type identification uses natural convection and uses the principle that the kinematic viscosity of the liquid to be measured such as urea aqueous solution and the sensor output have a correlation. In order to improve the accuracy of such liquid type identification, the liquid to be measured around the container body 20A where heat is transferred between the fluid identification detection unit 62 and the fluid temperature detection unit 64 and the liquid to be measured can be as much as possible. It is preferable to prevent the forced flow based on external factors from occurring. From this point, it is preferable to use the cover member 98, in particular, one that forms the liquid to be measured in the vertical direction. The cover member 98 also functions as a protective member that prevents foreign matter from contacting.

  In the embodiments described above, a urea aqueous solution having a predetermined urea concentration is used as the predetermined fluid. However, in the present invention, the predetermined liquid may be an aqueous solution or other liquid using a substance other than urea as a solute.

  In the above embodiment, the liquid to be measured is used as the fluid to be identified. However, as described later, for example, hydrocarbon liquids such as gasoline, naphtha, kerosene, light oil, and heavy oil, alcohols such as ethanol and methanol For fluids such as system liquids, urea aqueous solution liquids, gases, and granular materials, the physical properties of the fluid, for example, the thermal properties of the fluid, are used to identify the fluid type, the concentration, and the presence of fluid. Identification such as identification, fluid temperature identification, flow rate identification, fluid leakage identification, fluid level identification, and ammonia generation amount can be performed.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to this. For example, the above embodiment shows an embodiment applied to manufacture a thermal sensor. However, in addition to the sensor for performing fluid identification, various modifications can be made without departing from the object of the present invention, such as use in various sensors and electronic devices such as semiconductor devices.

FIG. 1 is a top view of a multiple lead frame of the present invention. FIG. 2 is a partially enlarged top view of the lead frame of FIG. FIG. 3 is a process schematic diagram illustrating the manufacturing process of the thermal sensor using the lead frame of FIG. FIG. 4 is a partially enlarged top view of the lead frame of FIG. 1 for explaining a manufacturing process of a thermal sensor using the lead frame of FIG. FIG. 5 is a perspective view of a thermal sensor using the lead frame of FIG. FIG. 6 is a longitudinal sectional view of the thermal sensor of FIG. FIG. 7 is a longitudinal sectional view taken along line AA of the thermal sensor of FIG. FIG. 8 is a schematic diagram illustrating a molding process. FIG. 9A is a graph showing the relationship between the distance from the end 34a of the die pad 34 to the inner lead tip 24 and the temperature of the inner lead tip 24 when the thin film chip 40 is heated. (B) shows the length of the suspension leads 26, 28, 30, 32 and the suspension leads 26, 28 with the corner portion 40 a of the thin film chip 40 mounted on the die pad portion 34 as a base when the thin film chip 40 is heated. , 30 and 32 are graphs showing the relationship of the temperatures of the tip portions. FIG. 10 is an exploded perspective view showing an embodiment in which the sensor 50 according to the present invention is applied to a fluid identification device. 11 is a partially omitted cross-sectional view of FIG. FIG. 12 is a diagram showing a state in which the fluid identification device according to the present invention is attached to the tank. FIG. 13 is a configuration diagram of a circuit for identifying a liquid type. FIG. 14 is a diagram showing the relationship between the single pulse voltage P applied to the heating element and the sensor output Q. FIG. 15 shows that the liquid type corresponding first voltage value of the sugar aqueous solution within a certain sugar concentration range exists within the range of the liquid type corresponding first voltage value V01 obtained with the urea aqueous solution having the urea concentration within the predetermined range. FIG. FIG. 16 shows a relative value in which the liquid type-corresponding first voltage value V01 and the liquid type-corresponding second voltage value V02 for the urea aqueous solution, the sugar aqueous solution, and water are 1.000 for a urea aqueous solution having a urea concentration of 30%. FIG. FIG. 17 is a diagram illustrating an example of a first calibration curve. FIG. 18 is a diagram illustrating an example of the second calibration curve. FIG. 19 is a diagram illustrating an example of the liquid temperature corresponding output value T. FIG. 20 is a graph schematically showing that a predetermined liquid identification criterion based on the combination of the liquid type corresponding first voltage value V01 and the liquid type corresponding second voltage value V02 changes according to the temperature. FIG. 21 is a flowchart showing the liquid type identification process. FIG. 22 is a longitudinal sectional view of a conventional thermal sensor. FIG. 23 is a longitudinal sectional view taken along line AA of a conventional thermal sensor. FIG. 24 is a process schematic diagram for explaining a manufacturing process of a thermal sensor using a conventional lead frame.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lead frame body 2 Lead frame 3 Hole 4 Outer frame body 6 Lower frame body 8 Outer lead 10 External connection terminal part 12 Left frame body 14 Right frame body 16 Horizontal direction support part 18 Left side center support part 20 Right side center support part 20A Container body portion 22 Inner lead 24 Inner lead distal end portion 24a Electrode portion 26 Left side hanging lead 28 Right side hanging lead 30 Left side central hanging lead 32 Right side central hanging lead 34 Die pad portion 34a End portion 36 Support protruding portion 38 Bonding material 40 Thin film chip 40a Corner part 42 Bonding wire 44 Mold resin 50 Sensor 54 Sensor body 56 Flange part 58 Back surface protruding part 60 Detection part 62 Fluid identification detection part 62a2 Temperature sensing element 62a4 Heating element 64 Fluid temperature sensing part 64a2 Temperature sensing element 66 Tank 68 Opening 70 Fluid identification device 72 Inlet piping 74 Outlet piping 76 Pump 78 Fluid identification sensor unit 80 Support unit 82 Mounting unit 86 Switch 88 Resistor 90 Resistor 91 Microcomputer 92 Differential amplifier 93 Output buffer circuit 94 Liquid temperature detection amplifier 96 Liquid to be measured 98 Cover member 100 Sensor 101 Bonding material 102 Mold resin 104 Sensor body 106 Flange portion 108 Back surface protruding portion 110 Detection portion 112 Fluid identification detection portion 114 Fluid temperature detection portion 116 Opening portion 118 Die pad portion 119 Support portion 120 Mounting surface 122 Thin film chip 124 Inner lead 124a Electrode 126 External connection Terminal part 128 Outer lead 130 Bonding wire

Claims (22)

A lead frame including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The lead frame, wherein the inner lead part and the electronic component mounting part are spaced apart. A lead frame including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The electronic component mounting portion includes a support lead portion for supporting the electronic component mounting portion,
The lead frame, wherein the support lead portion extends a predetermined linear distance or more from a corner portion of the electronic component mounted on the electronic component mounting portion. A lead frame including an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
The electronic component mounting portion includes a support lead portion for supporting the electronic component mounting portion,
The inner lead portion and the electronic component mounting portion are arranged apart from each other,
The lead frame, wherein the support lead portion extends a predetermined linear distance or more from a corner portion of the electronic component mounted on the electronic component mounting portion.   The end portion of the inner lead portion and the end portion of the electronic component mounted on the electronic component mounting portion facing the end portion of the inner lead portion are disposed at a distance of 1.6 mm or more. The lead frame according to claim 1 or 3.   The lead frame according to any one of claims 2 to 4, wherein the predetermined linear distance is 2.0 mm.   The lead frame according to claim 1, wherein the inner lead portion and the electronic component mounted on the electronic component mounting portion are electrically connected.   The lead frame according to any one of claims 1 to 6, wherein the inner lead portion and an electronic component mounted on the electronic component mounting portion are hermetically sealed or resin-sealed.   The lead frame according to claim 2, wherein the support lead portion is hermetically sealed or resin-sealed.   An electronic device comprising the lead frame according to claim 1.   The electronic device according to claim 9, wherein the electronic device is a sensor for performing fluid identification.   The fluid identification is at least one of fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid leakage identification, and fluid level identification. The electronic device according to. A method of manufacturing a lead frame comprising an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
A method of manufacturing a lead frame, wherein the inner lead portion and the electronic component mounting portion are formed apart from each other. A method of manufacturing a lead frame comprising an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
A support lead portion for supporting the electronic component mounting portion is formed on the electronic component mounting portion so as to extend from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more. A method for manufacturing a lead frame. A method of manufacturing a lead frame comprising an outer lead portion, an inner lead portion, and an electronic component mounting portion for mounting an electronic component,
While forming the inner lead part and the electronic component mounting part apart,
A support lead portion for supporting the electronic component mounting portion is formed on the electronic component mounting portion so as to extend from a corner portion of the electronic component mounted on the electronic component mounting portion by a predetermined linear distance or more. A method for manufacturing a lead frame.   The end portion of the inner lead portion and the end portion of the electronic component mounted on the electronic component mounting portion facing the end portion of the inner lead portion are disposed at a distance of 1.6 mm or more. The lead frame manufacturing method according to claim 12 or 14.   16. The lead frame manufacturing method according to claim 13, wherein the predetermined linear distance is 2.0 mm.   The lead frame manufacturing method according to claim 12, wherein the inner lead portion and the electronic component mounted on the electronic component mounting portion are electrically connected.   The lead frame manufacturing method according to claim 12, wherein the inner lead portion and the electronic component mounted on the electronic component mounting portion are hermetically sealed or resin-sealed. .   The lead frame manufacturing method according to claim 13, wherein the support lead portion is hermetically sealed or resin-sealed.   An electronic device manufacturing method comprising the lead frame according to claim 12.   The method of manufacturing an electronic device according to claim 20, wherein the electronic device is a sensor for performing fluid identification.   The fluid identification is at least one of fluid type identification, concentration identification, fluid presence / absence identification, fluid temperature identification, flow rate identification, fluid leakage identification, and fluid level identification. The manufacturing method of the electronic device of description.