JP2009070760A - Light-emitting device and method for manufacturing light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device realizing excellent sealability for a light-emitting element by providing a sealing member so as to contact continuously with: a first plane including a light-emitting element; at least part of a second plane opposite to the first plane; and an outer peripheral plane connecting the first and second planes. <P>SOLUTION: The light-emitting device 2 includes a substrate 10, a light-emitting element 12 arranged on a first plane 18 of the substrate 10, and a sealing member 14 provided so as to contact continuously with: the first plane 18 including the light-emitting element 12; at least part of a second plane 20 opposite to the first plane 18; and an outer peripheral plane 22 connecting the first and second planes 18 and 20, and sealing the light-emitting element 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the light emitting device.

  In recent years, a light emitting device including a light emitting element such as an organic EL element (organic electroluminescence element) on a substrate has been widely used as an exposure device for a display device or an electrophotographic image forming apparatus.

  Such a light emitting device is required to have durability to withstand light emission for a long period of time. As one of the causes for deteriorating the light emission characteristics of the organic EL element, generation of dark spots is raised. A dark spot is formed by a transparent electrode, a light emitting layer (organic layer), and a back electrode when moisture adhering to the surface of a component part of the organic EL element or moisture (humidity) or oxygen gas entering the organic EL element Is caused by intrusion from a defect or the like on the surface of the back electrode into a laminate formed by sequentially laminating and separating the organic layer and the back electrode.

  In such a light emitting device, in order to improve the reliability and extend the life of the organic EL element, it is important that the light emitting layer and each electrode constituting the organic EL element are surely shielded from the atmospheric gas. For this purpose, the substrate (transparent substrate) on which the organic EL element portion is formed and the sealing member are integrated via an adhesive to protect the organic EL element sealed between them from atmospheric gas or the like. Technology is known.

  For example, on a translucent substrate made of a glass material as disclosed in Patent Document 1, a transparent electrode such as ITO, which becomes an anode, an organic layer having at least a light emitting layer made of an organic compound, and a cathode A laminated body is formed by sequentially laminating a non-translucent back electrode such as aluminum (Al), and a concave sealing member made of a glass material covering the laminated body is hermetically sealed on the substrate via an adhesive. A light-emitting device is known in which a moisture absorbent formed by a compound that chemically adsorbs moisture and maintains a solid state even when adsorbed is disposed on a surface facing the laminate of sealing members. It has been.

Japanese Patent Laid-Open No. 5-89959

  However, in the case of hollow sealing with a lid such as an adhesive and glass, the interface between the sealing member and the substrate due to insufficient adhesive strength of the adhesive, although there are some differences depending on the thickness and width of the applied adhesive. Therefore, the atmospheric gas enters the internal space.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 At least of a substrate, a light emitting element arranged on the first surface of the substrate, the first surface including the light emitting element, and a second surface opposite to the first surface A light emitting device comprising: a sealing member that is provided so as to be continuously in contact with a part and an outer peripheral surface that connects the first and second surfaces and seals the light emitting element. .

  According to this, the first surface including the light emitting element, at least a part of the second surface opposite to the first surface, and the outer peripheral surface connecting the first and second surfaces are continuous. By providing the sealing member so as to be in contact with the liquid crystal, the intrusion route of moisture (humidity) and oxygen entering from the outside becomes longer, so the time until the light-emitting element that is vulnerable to moisture (humidity) and oxygen deteriorates is reduced. It becomes possible to prolong.

  Application Example 2 In the light emitting device, the optical device further includes an optical unit disposed on the second surface of the substrate, and the sealing member is further provided in contact with a part of the optical unit, A light-emitting device, wherein a joint portion between the second surface and the optical portion is sealed.

  According to this, since the sealing member is further provided so as to be in contact with a part of the optical unit, the intrusion path for moisture (humidity) and oxygen entering from the outside becomes longer, so moisture (humidity), oxygen, etc. It is possible to lengthen the time until the light-emitting element that is weak to the deterioration. Furthermore, since the optical part is fixed with the same material, warpage, distortion, and the like can be suppressed.

  Application Example 3 In the above light emitting device, the joining portion is provided with a fluid member having a transmittance equivalent to that of the optical portion.

  According to this, the rate at which the light from the light emitting element is attenuated by the optical unit is reduced, and the light utilization efficiency is improved.

  Application Example 4 In the above light-emitting device, the optical unit includes a spacer member and an SLA lens.

  According to this, arrangement | positioning of an optical part becomes easy. Furthermore, light leakage from the spacer member can be prevented.

  Application Example 5 In the light-emitting device, the optical unit includes a substrate on which the light-emitting element is provided, a first sealing material that is provided on the substrate so as to surround the light-emitting element, and the first sealing material. And a sealing substrate that is disposed to face the substrate while sandwiching the substrate.

  According to this, since the first sealing material and the sealing substrate are provided, the intrusion route of moisture (humidity) and oxygen entering from the outside becomes longer, so light emission that is weak against moisture (humidity) and oxygen etc. It is possible to lengthen the time until the element deteriorates.

  Application Example 6 At least one of a step of forming light emitting elements arranged on a first surface of a substrate, the first surface including the light emitting elements, and a second surface opposite to the first surface. And a step of forming a sealing member continuously in contact with the outer peripheral surface connecting the first and second surfaces. A method of manufacturing a light emitting device, comprising:

  According to this, the first surface including the light emitting element, at least a part of the second surface opposite to the first surface, and the outer peripheral surface connecting the first and second surfaces are continuous. By providing the sealing member so as to be in contact with the liquid crystal, the intrusion route of moisture (humidity) and oxygen entering from the outside becomes longer, so the time until the light-emitting element that is vulnerable to moisture (humidity) and oxygen deteriorates is reduced. It becomes possible to prolong. Moreover, since the sealing member is continuously formed, the variation of the sealing member can be reduced.

  Application Example 7 In the method of manufacturing the light emitting device, the method further includes a step of disposing an optical part on the second surface of the substrate, and the step of forming the sealing member includes the step of forming the sealing member. Further, the method for manufacturing a light-emitting device, wherein the light-emitting device is provided so as to be in contact with a part of the optical unit, and a joint between the second surface and the optical unit is sealed.

  According to this, since the sealing member is further provided so as to be in contact with a part of the optical unit, the intrusion path for moisture (humidity) and oxygen entering from the outside becomes longer, so moisture (humidity), oxygen, etc. It is possible to lengthen the time until the light-emitting element that is weak to the deterioration. Moreover, the variation of the sealing member can be further reduced. Furthermore, since the optical part is attached simultaneously with the sealing operation, the manufacturing process can be shortened.

(Organic EL device)
FIG. 1A is a plan configuration diagram of an organic EL device (organic electroluminescence device) 2 as a light emitting device according to the present embodiment, and FIG. 1B is a II line in FIG. FIG.
As shown in FIGS. 1A and 1B, the organic EL device 2 according to the present embodiment sandwiches the light emitting element 12 and the substrate 10, the light emitting element 12 provided on the substrate 10. Mainly the sealing member 14 facing the substrate 10. A protective layer 16 that covers the light emitting element 12 is formed between the substrate 10 and the sealing member 14. Further, a spacer member 24 is provided on the opposite side of the substrate 10 from the light emitting element 12, and an SLA (Selfoc (registered trademark) lens array) lens 26 is provided on the opposite side of the spacer member 24 from the substrate 10. In FIG. 1A, the sealing member 14 is shown by a one-dot chain line for easy viewing of the drawing.

  The organic EL device 2 of the present embodiment employs either a form in which light emitted from the light emitting element 12 is extracted from the substrate 10 side (bottom emission type) or a form in which the light emission is extracted from the sealing member 14 side (top emission type). be able to. In the case of the bottom emission type, the substrate 10 is made of a transparent or translucent material that can transmit light, for example, transparent glass, quartz, sapphire, or a transparent synthetic material such as polyester, polyacrylate, polycarbonate, or polyetherketone. It is formed using a resin or the like. In the case of the top emission type, a transparent or translucent material is used for the protective layer 16 and the sealing member 14.

  The sealing member 14 includes the first surface 18 of the substrate 10 including the light emitting element 12, at least a part of the second surface 20 opposite to the first surface 18, the first and second surfaces 18, 20 is provided so as to be continuously in contact with the outer peripheral surface 22 connecting 20. The sealing member 14 seals the light emitting element 12.

  In the case of this embodiment, the sealing member 14 also functions as an adhesive that bonds the substrate 10, the spacer member 24 as an optical unit, and the SLA lens 26. A material for forming the sealing member 14 is not particularly limited as long as it can maintain stable adhesive strength and has good airtightness. For example, a photo-curable epoxy resin that is cured by irradiation with ultraviolet light (UV) is used. In addition to cationic materials such as epoxy and vinyl ether, radical materials such as acrylates such as ester acrylate and urethane acrylate, and urethane polyester Can be used.

  The sealing member 14 is preferably formed using a material having a low moisture permeability. By adopting a configuration in which moisture (humidity), oxygen, and the like are blocked at the outermost peripheral portion of the device in this manner, the amount of moisture (humidity), oxygen, and the like that reaches the inside can be reduced, and moisture reaching the light emitting element 12 In addition to reducing the amount, the time until moisture (humidity), oxygen, or the like reaches the light emitting element 12 can be extended, and the life of the light emitting element 12 can be extended.

  The light emitting element 12 is an organic EL element in which an organic functional layer including an organic light emitting layer as an electro-optical material is sandwiched between two electrode films as a first electrode and a second electrode on the first surface 18 of the substrate 10. For example, as shown in FIG. 2B, a structure in which an anode 34, a hole transport layer 36, a light emitting layer 38, and a cathode 40 are stacked is provided. The light emitting element 12 is configured in various modes depending on the application of the organic EL device 2. For example, in the case of illumination application, the light emitting element 12 is formed in a planar shape. In the case of use as a display means of an electronic device, a plurality of light emitting elements 12 are arranged in a substantially matrix shape in plan view. Furthermore, if it is the use as an exposure means of a printer, it will become the form with which the several light emitting element 12 was arranged in 1 row or multiple rows.

Returning to FIG. 1, the protective layer 16 is a thin film of an inorganic insulating material and has a function of suppressing moisture and the like from entering the light emitting element 12. Examples of the material for forming the protective layer 16 include silicon oxynitride (SiON), silicon dioxide (SiO ₂ ), and silicon nitride (SiN).

  In the present embodiment, a configuration in which only one protective layer 16 is provided between the light emitting element 12 and the sealing member 14 is shown. In addition, the protective layer 16 may not be provided. Alternatively, a plurality of protective layers 16 may be stacked between the light emitting element 12 and the sealing member 14. Generation of cracks can be prevented by stacking a plurality of protective layers 16. If the protective layer 16 has a multilayer structure, the sealing performance for the light emitting element 12 can be further enhanced.

  As described above, the sealing member 14 includes the first surface 18 including the light emitting element 12, at least a part of the second surface 20 opposite to the first surface 18, the first and second surfaces. Since the outer peripheral surface 22 connecting the surfaces 18 and 20 is provided so as to be continuously in contact with the outer peripheral surface 22, the intrusion path for moisture (humidity) and oxygen entering from the outside becomes longer, so moisture (humidity), oxygen, and the like It is possible to lengthen the time until the light-emitting element 12 that is weak to the deterioration. In addition, good sealing performance with respect to the light emitting element 12 can be realized. Furthermore, since the spacer member 24 and the SLA lens 26 are fixed with the same material, warpage, distortion, and the like can be suppressed. Further, light leakage from the spacer member 24 can be prevented.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 2 having the above-described configuration will be described with reference to schematic diagrams shown in FIGS. 2A and 2B, FIG. 2A is a plan process diagram in each process, and FIG. 2B is a sectional process diagram corresponding to a position along each sectional line in FIG.

First, as shown in FIG. 2, the light emitting element 12 is formed on the first surface 18 of the substrate 10. Although not shown in FIG. 2, it is assumed that a drive circuit for driving and controlling the light emitting element 12 is already formed on the substrate 10 on which the light emitting element 12 is formed.
The light emitting element 12 can be formed by sequentially laminating the anode 34, the hole transport layer 36, the light emitting layer 38, and the cathode 40 in a predetermined region on the substrate 10. In the light emitting element 12 having such a laminated structure, when a drive signal is supplied from the drive circuit, a current flows between the anode 34 and the cathode 40 and the light emitting layer 38 emits light. The light is emitted to the outer surface side of the transparent substrate 10.

  In the laminated structure shown in FIG. 2, the anode 34 is connected to a drive circuit (not shown), and holes are injected into the hole transport layer 36 by a voltage applied from the drive circuit. A transparent conductive material such as ITO (Indium Tin Oxide) or a metal material such as aluminum (Al) or silver (Ag) can be used.

  The hole transport layer 36 is for transporting and injecting holes of the anode 34 to the light emitting layer 38, and a known material can be used. For example, polythiophene, polyaniline, polypyrrole, or the like can be used. More specifically, 3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like can be used.

  The light emitting layer 38 is a layer that emits light by recombination of holes injected from the hole transport layer 36 and electrons injected from the cathode 40. As a material for forming the light emitting layer 38, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. For example, polyfluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinyl carbazole (PVK), polythiophene derivative, polymethylphenylsilane (PMPS) Polysilanes such as those can be used.

  Further, an electron transport layer may be provided between the light emitting layer 38 and the cathode 40. By providing the electron transport layer, the efficiency of injecting electrons from the cathode 40 to the light emitting layer 38 can be improved. As the material for forming the electron transport layer, oxadiazole derivatives, anthraquinodimethane and its derivatives, benzoquinone and its derivatives, naphthoquinone and its derivatives, anthraquinone and its derivatives, tetracyanoanthraquinodimethane and its derivatives, fluorenone derivatives, Diphenyldicyanoethylene and derivatives thereof, diphenoquinone derivatives, metal complexes of 8-hydroxyquinoline and derivatives thereof, and the like can be used.

  The cathode 40 is a metal having a low work function that can efficiently inject electrons into the light emitting layer 38, such as aluminum (Al), magnesium (Mg), gold (Au), silver (Ag), or calcium (Ca). And a structure in which a transparent conductive film such as ITO is laminated on the metal film.

When providing each of the layers constituting the light emitting element 12, for example, a known patterning method such as a photolithography method or a droplet discharge method can be used, and each layer is laminated in a predetermined region on the substrate 10. A light emitting element 12 having a structure can be provided.
For the formation of the anode 34 and the cathode 40 made of a metal material or a transparent conductive material, a sputtering method, a vacuum evaporation method, and a photolithography method can be suitably used, and a hole transport layer made of a polymer material For forming the light emitting layer 36 and the light emitting layer 38, a droplet discharge method can be suitably used.

  The droplet discharge method is a method in which a material for forming a functional layer to be formed is made into a liquid material, and the liquid material is quantitatively discharged using a droplet discharge device such as a dispenser or an ink jet device, so that This is a method of applying a forming material. Specifically, the amount of liquid per droplet is controlled from the nozzle while moving the nozzle and the substrate 10 in a state where the nozzle provided in the droplet discharge head (inkjet head) and the substrate 10 face each other. In this technique, a film pattern having a desired shape is formed on the substrate 10 by discharging the liquid droplets.

  By forming the hole transport layer 36 and the light emitting layer 38 by using a droplet discharge method, the manufacturing cost can be reduced. That is, in the droplet discharge method, since a material can be arranged in a desired local region on the substrate 10, the film formation process is simple and the use material is less wasteful than the photolithography method or the like. .

  After the light emitting element 12 is formed on the substrate 10, next, as shown in FIG. 3, the light emitting element 12 is covered with a protective layer 16 by a predetermined method. In the present embodiment, the protective layer 16 is coated on the surface of the light emitting element 12 using a film forming method such as an ion plating method or a sputtering method. Thereby, the protective layer 16 is connected to the surface of the light emitting element 12 so as to cover the light emitting element 12. By covering the surface of the light emitting element 12 with the protective layer 16 having a predetermined thickness, it is possible to prevent the light emitting element 12 from contacting moisture or the like even during the manufacturing process of the organic EL device 2. Sealed well.

  Next, as shown in FIG. 4A, the positioning jig 52 is set at a predetermined position of the first jig 50.

  Next, as shown in FIG. 4B, the substrate 10 on which the light emitting element 12 covered with the protective layer 16 is formed is set and fixed on the first jig 50 using the vacuum suction port 54.

  Next, as shown in FIG. 4C, the positioning jig 52 is removed from the first jig 50, and the sealing jig 56 is set at a predetermined position of the first jig 50.

  Next, as shown in FIG. 5A, the spacer member 24 and the SLA lens 26 are set at predetermined positions of the second jig 58. A glass paste 60 is applied to the upper surface of the spacer member 24 that comes into contact with the second surface 20 of the substrate 10. The glass paste 60 is a member having fluidity and the same transmittance as glass. Thereby, the rate at which the light from the light emitting element 12 is attenuated by the spacer member 24 and the SLA lens 26 is reduced, and the light use efficiency is improved. The glass paste 60 may not be applied.

  Next, as shown in FIG. 5B, the light emitting element 12 covered with the sealing jig 56 and the protective layer 16 is formed on the second jig 58 on which the spacer member 24 and the SLA lens 26 are set. The first jig 50 on which the substrate 10 to be set is set is inserted.

  Next, as shown in FIG. 5C, the sealing material 64 is injected from the sealing member inlet 62 above the sealing jig 56, and the first jig 50 and the sealing jig 56 are filled. Is filled with a sealing material 64.

  Next, as shown in FIG. 6, when the sealing material 64 is hardened, the first jig 50, the sealing jig 56, and the second jig 58 are removed, and the organic EL device 2 is taken out. In addition, it is preferable to perform each manufacturing process in inert gas atmosphere, such as nitrogen gas and argon gas, in order to prevent deterioration of the light emitting element 12. FIG.

In the manufacturing process of the organic EL device 2 of the present embodiment, the step of arranging the sealing member 14 is performed between the substrate 10, the protective layer 16, the spacer member 24, the SLA lens 26, and the sealing member 14. In order to prevent air bubbles and the like from being mixed, the sealing member 14 is pressed against the light emitting element 12 by the atmospheric pressure by returning the pressure to the atmospheric pressure after the sealing member 14 is deposited. It has become. Thereafter, when a thermosetting resin material is used as the resin material for forming the sealing member 14, predetermined heat is applied to the resin material on the substrate 10.
Through the above steps, the organic EL device 2 can be manufactured by curing the resin material to form the sealing member 14.

  As described above, according to the manufacturing method of the present embodiment, the resin material and the desiccant forming material are arranged after the protective layer 16 is provided on the light emitting element 12, so that during the sealing process In addition, it is possible to prevent the solvent contained in the resin material or the desiccant forming material from coming into contact with the light emitting element 12 to deteriorate the light emitting element 12, and the organic EL device 2 can be manufactured with a high yield.

  Further, the first surface including the light emitting element, at least part of the second surface opposite to the first surface, and the outer peripheral surface connecting the first and second surfaces are continuously in contact with each other. By providing the sealing member 14 on the surface, the intrusion route of moisture (humidity) and oxygen entering from the outside becomes longer, so the time until the light-emitting element 12 that is weak against moisture (humidity) or oxygen is deteriorated is prolonged. Can be realized. Moreover, since the sealing member 14 is continuously formed, the variation of the sealing member 14 can be reduced. Further, since the spacer member 24 and the SLA lens 26 are attached simultaneously with the sealing operation, the manufacturing process can be shortened.

(Example)
(Organic EL display device)
Next, an organic EL display device 100 that is an embodiment of the organic EL device will be described with reference to FIGS.
FIG. 7 is a circuit configuration diagram of the organic EL display device 100 according to the present embodiment, and FIG. 8 is a plan configuration diagram of the display device. FIG. 9 is a diagram showing a planar structure of the pixel 102 of the display device, and FIG. 9A is a diagram mainly showing a pixel driving portion such as a TFT (thin film transistor) in the pixel 102, and FIG. FIG. 5 is a diagram showing banks (partition wall members) that partition pixels. 10 is a cross-sectional configuration diagram taken along line XX of FIG.

  In the circuit configuration shown in FIG. 7, the organic EL display device 100 includes a plurality of scanning lines 104, a plurality of signal lines 106 extending in a direction intersecting the scanning lines 104, and a plurality of signal lines 106 extending in parallel to the signal lines 106. The common power supply line 108 is wired, and a pixel 102 is provided at each intersection of the scanning line 104 and the signal line 106.

  For the signal line 106, a data side driving circuit 110 including a shift register, a level shifter, a video line, an analog switch, and the like is provided. On the other hand, for the scanning line 104, a scanning side driving circuit 112 including a shift register, a level shifter, and the like is provided. Each pixel 102 holds a switching TFT (thin film transistor) 114 to which a scanning signal is supplied to the gate electrode via the scanning line 104 and an image signal supplied from the signal line 106 via the switching TFT 114. A holding capacitor CAP, a driving TFT 116 to which an image signal held by the holding capacitor CAP is supplied to the gate electrode, and the common feeding line 108 when electrically connected to the common feeding line 108 via the driving TFT 116 A pixel electrode 118 into which a drive current flows, and a light emitting unit 122 sandwiched between the pixel electrode 118 and the common electrode 120 are provided. An element constituted by the pixel electrode 118, the common electrode 120, and the light emitting unit 122 is an organic EL element (light emitting element).

  Under such a configuration, when the scanning line 104 is driven and the switching TFT 114 is turned on, the potential of the signal line 106 at that time is held in the holding capacitor CAP, and is driven according to the state of the holding capacitor CAP. The on / off state of the TFT 116 is determined. Then, a current flows from the common power supply line 108 to the pixel electrode 118 through the channel of the driving TFT 116, and further a current flows to the common electrode 120 through the light emitting unit 122, so that the light emitting unit 122 corresponds to the amount of current flowing therethrough. Flashes.

  Next, as shown in the planar configuration of FIG. 8, the organic EL display device 100 includes a display region 126 in which a plurality of pixels 102 are arranged in a matrix in a plan view at a substantially central portion of a rectangular substrate 124. A sealing member 128 is formed so as to cover the display region 126.

  That is, the organic EL display device 100 is a display device having a basic configuration similar to that of the organic EL device 2 of the previous embodiment, and includes a pixel 102 having an organic EL element corresponding to the light emitting element 12 of the organic EL device 2. The display area 126 formed in an array has a configuration in which a sealing member 128 is provided.

  Next, when viewing the planar structure of the pixel 102 shown in FIG. 9A, the pixel 102 has four sides of a pixel electrode 118 having a substantially rectangular shape in plan view, the signal line 106, the common power supply line 108, the scanning line 104, and The arrangement is surrounded by other pixel electrode scanning lines (not shown). In the vicinity of the pixel electrode 118, a switching TFT 114 and a driving TFT 116 are provided.

  The switching TFT 114 is a top-gate thin film transistor mainly including a rectangular island-shaped semiconductor layer 138, and the scanning line 104 that intersects the semiconductor layer 138 serves as a gate electrode of the switching TFT 114 at the intersection. . A branch wiring 106A extending in the direction along the scanning line 104 from the signal line 106 extending in the vertical direction in the figure is electrically connected to the semiconductor layer 138 via a contact hole C1. Furthermore, a relay electrode 140 having a rectangular shape in plan view disposed on the right side of the pixel electrode 118 in the drawing is electrically connected to the semiconductor layer 138 through a contact hole C2.

  The driving TFT 116 is a top-gate thin film transistor mainly including a rectangular island-shaped semiconductor layer 142, and includes a gate electrode 144 G, a source electrode 146 (a part of the power supply line 108), and a drain electrode 148. ing. The drain electrode 148 is electrically connected to the pixel electrode 118 via a contact hole (not shown) (see FIG. 10). The gate electrode 144G extends downward from the position overlapping the semiconductor layer 142 and is formed integrally with the electrode 150 of the storage capacitor CAP. Further, the electrode 150 extends downward in the figure, and is electrically connected to the relay electrode 140 disposed so as to overlap with the electrode 150 via a contact hole C3. Therefore, the gate of the driving TFT 116 and the drain of the switching TFT 114 are electrically connected via the relay electrode 140.

  Further, in the cross-sectional structure of the pixel 102 shown in FIG. 10, the driving TFT 116 is provided on the substrate 124. On the substrate 124 through a plurality of insulating films formed to cover the driving TFT 116. An organic EL element 152 is formed. The organic EL element 152 is mainly composed of an organic functional layer (light emitting part) 122 provided in a region surrounded by banks (inorganic banks 154 and organic banks 156) erected on the substrate 124. A structure in which the layer 122 is sandwiched between the pixel electrode 118 and the common electrode 120 is provided. Here, in the planar structure shown in FIG. 9B, the organic bank 156 has an opening 158 having a substantially rectangular shape in plan view corresponding to the region where the pixel electrode 118 is formed. The previous organic functional layer 122 is formed.

  As shown in FIG. 10, the driving TFT 116 includes a channel region via a source region 144A, a drain region 144B, a channel region 144C formed in the semiconductor layer 142, and a gate insulating film 160 formed on the surface of the semiconductor layer 142. The main structure is a gate electrode 144G opposed to 144C. A first interlayer insulating film 162 is formed to cover the semiconductor layer 142 and the gate insulating film 160. The drain electrodes 148 are respectively formed in the contact holes 164 and 166 that penetrate the first interlayer insulating film 162 and reach the semiconductor layer 142. The source electrode 146 is buried, and each electrode is conductively connected to the drain region 144B and the source region 144A. A second interlayer insulating film 168 is formed on the first interlayer insulating film 162, and a part of the pixel electrode 118 is embedded in a contact hole penetrating the second interlayer insulating film 168. The pixel electrode 118 and the drain electrode 148 are conductively connected, so that the driving TFT 116 and the pixel electrode 118 (organic EL element 152) are electrically connected.

  An inorganic bank (first partition wall layer) 154 made of an inorganic insulating material is formed on the second interlayer insulating film 168, and the inorganic bank 154 is disposed so as to partially ride on the peripheral edge of the pixel electrode 118. Yes. On the inorganic bank 154, an organic bank (second partition layer) 156 made of an organic material is laminated to form a partition member in the organic EL device.

The organic EL element 152 is configured by stacking a hole transport layer 122 </ b> A and a light emitting layer 122 </ b> B on the pixel electrode 118, and forming a common electrode 120 that covers the light emitting layer 122 </ b> B and the organic bank 156. That is, the organic EL element 152 according to this example corresponds to the light emitting element 12 according to the previous embodiment, and the pixel electrode 118, the hole transport layer 122A, the light emitting layer 122B, and the common electrode 120 are respectively The constituent elements correspond to the anode 34, the hole transport layer 36, the light emitting layer 38, and the cathode 40 of the light emitting element 12.
The hole transport layer 122 </ b> A is formed so as to cover the surface of the pixel electrode 118, and the peripheral edge thereof is the edge of the inorganic bank 154 extending from the lower end side of the organic bank 156 to the center side of the pixel electrode 118. Covering.

  A protective layer 170 corresponding to the protective layer 16 of the previous embodiment is formed on the common electrode 120, and a sealing member 128 is formed to cover the protective layer 170.

  Similar to the organic EL device 2 according to the previous embodiment, the organic EL display device 100 having the above configuration is configured to include a sealing member 128. Thereby, the favorable sealing performance with respect to the organic EL element 152 is realizable.

(Optical writing head)
Next, as another embodiment, an optical writing head using an organic EL device will be described with reference to FIGS.
FIG. 11 is a plan configuration diagram of an organic EL device 8 having a configuration suitable for the optical writing head application according to the present embodiment.

  As shown in FIG. 11, on a substrate 172 constituting the organic EL device 8, a light emitting element region 174 in which organic EL elements (not shown) are arrayed is provided in the longitudinal direction along the length direction of the substrate 172. A plurality of driving elements 176 are arranged along the light emitting element region 174. Although details are omitted, each organic EL element provided in the light emitting element region 174 is electrically connected to a connection wiring 178 extending from each driving element 176 and is driven by an electric signal supplied from the driving element 176. It has become so.

  The organic EL device 8 of the present example also has a sealing structure similar to that of the organic EL device 2 of the previous embodiment. That is, a protective layer (not shown) is formed on the surface of the organic EL element provided in the light emitting element region 174, and the sealing member 180 is formed to cover the light emitting element region 174.

  Similar to the organic EL device 2 according to the previous embodiment, the organic EL device 8 having the above-described configuration has a configuration in which a sealing member 180 is provided. Thereby, the favorable sealing performance with respect to the light emitting element area | region 174 is realizable.

  FIG. 12 is a diagram showing an example where the above-described organic EL device 8 is applied to an optical writing head (printer head) of an electrophotographic printer. In FIG. 12, a photosensitive drum (photosensitive member) 192 is provided in the light emission direction (upward in the drawing) of the organic EL device 8. The organic EL device 8 emits light to the photosensitive drum 192. In this example, good sealing performance with respect to the light emitting element 12 can be realized. Furthermore, since the spacer member 24 and the SLA lens 26 are fixed with the same material, warpage, distortion, and the like can be suppressed. Further, light leakage from the spacer member 24 can be prevented, and the reliability of the entire electrophotographic printer can be improved.

(Electronics)
Next, an example of an electronic apparatus provided with the organic EL display device 100 of the above embodiment will be described.
FIG. 13 is a perspective view showing an example of a mobile phone according to the present embodiment. A mobile phone 200 shown in FIG. 13 includes a display unit 202 using the organic EL display device 100 of the above embodiment, an operation button unit 204, a receiver unit 206, and a transmitter unit 208. . Since the electronic apparatus shown in FIG. 13 includes the organic EL display device 100 of the above-described embodiment, the electronic apparatus has a good sealing performance for the organic EL element by the sealing member 128.

(Organic EL device)
Next, as another embodiment, an organic EL device will be described with reference to FIG.
FIG. 14A is a plan configuration diagram of an organic EL device 9 as a light emitting device according to the present embodiment, and FIG. 14B is a sectional configuration diagram taken along line XIV-XIV in FIG. is there.
As shown in FIG. 14A and FIG. 14B, the organic EL device 9 according to this example includes a substrate 10 as an optical unit, a sealing substrate 210, and a first sealing material 212. 10 is mainly composed of a light emitting element 12 provided on 10, a sealing substrate 210 that sandwiches the light emitting element 12 and faces the substrate 10, and a sealing member 14 that surrounds the substrate 10 and the sealing substrate 210. Between the substrate 10 and the sealing substrate 210, a protective layer 16 that covers the light emitting element 12, an adsorbent 214 that is provided to face the protective layer 16, and a first seal that is provided so as to surround the protective layer 16. A stop material 212 is formed. In FIG. 14A, the sealing member 14 is shown by a one-dot chain line in order to make the drawing easier to see.

  The organic EL device 9 according to the present embodiment adopts both a form in which light emitted from the light emitting element 12 is taken out from the substrate 10 side (bottom emission type) and a form in which the light emission is taken out from the sealing substrate 210 side (top emission type). be able to. In the case of the bottom emission type, the substrate 10 is made of a transparent or translucent material that can transmit light, for example, transparent glass, quartz, sapphire, or a transparent synthetic material such as polyester, polyacrylate, polycarbonate, or polyetherketone. It is formed using a resin or the like. In the case of the top emission type, a transparent or translucent material is used for the protective layer 16, the adsorbent 214, the sealing substrate 210, and the sealing member 14.

  The sealing substrate 210 is provided with a recess 216 facing the light emitting element 12 on the surface facing the substrate 10. The sealing substrate 210 is a substrate disposed so as to cover the light emitting element 12, the protective layer 16, and the adsorbent 214, and through the first sealing material 212 provided on the convex portion 218 on the outer periphery of the concave portion 216. The light emitting element 12 is sealed by being bonded to the substrate 10.

  The sealing substrate 210 only needs to have a function capable of satisfactorily protecting the light emitting element 12, the protective layer 16, and the adsorbent 214. For example, glass, quartz, synthetic resin, or a material having a low moisture permeability such as metal. Can be used. As the glass, for example, soda lime glass, lead alkali glass, borosilicate glass, aluminosilicate glass, silica glass and the like can be used. As the synthetic resin, transparent synthetic resins such as polyolefin, polyester, polyacrylate, polycarbonate, polyether ketone, and the like can be used. As the metal, aluminum, stainless steel, or the like can be used.

  By using a glass substrate as the sealing substrate 210 and covering the entire surface of the protective layer 16, entry of moisture (humidity), oxygen, or the like into the light emitting element 12 can be favorably prevented. Note that if the thickness of the light emitting element 12 and the protective layer 16 can be secured by adjusting the thickness of the first sealing material 212, the concave portion 216 and the convex portion 218 are not formed in the sealing substrate 210. In both cases, the first sealing material 212 and the adsorbent 214 may be formed separately on each installation portion and bonded to the substrate 10.

  The sealing member 14 is continuous with the outer peripheral surface of the sealing substrate 210, at least a part of the second surface 20 of the substrate 10, and the outer peripheral surface 22 connecting the first and second surfaces 18 and 20. It is provided so that it may touch. The sealing member 14 seals the light emitting element 12.

  The adsorbent 214 is provided in the recess 216 of the sealing substrate 210. An adsorbent 214 is provided in a substantially rectangular shape in a plan view so as to face the protective layer 16 formed in a substantially rectangular shape in a plan view. In the case of the present embodiment, as shown in FIG. 14B, the adsorbent 214 has a protective layer 16 and a gap 220 facing each other, and among the substrate 10 and the sealing substrate 210 that sandwich the adsorbent 214. It is disposed in contact with the sealing substrate 210. That is, it is preferable that the adsorbent 214 can maintain a predetermined planar shape and cross-sectional shape. For example, an adsorbent material (dehydrating material and oxygen scavenger) that exhibits an adsorbing action such as moisture (humidity) or oxygen is used. Good moldability can be imparted to the adsorbent 214 by using a resin, wax, oil or fat dispersed in a binder.

  As the adsorbing material, a material that does not easily react with the organic compound constituting the binder is used. For example, calcium hydride, strontium hydride, barium hydride, lithium aluminum hydride, sodium oxide, potassium oxide, calcium oxide, barium oxide. And magnesium oxide.

  As the binder, resins, waxes, fats and oils can be used. To give specific examples, resin materials such as polyethylene resins and polypropylene resins, petroleum waxes such as paraffin wax and microlistin wax, plant waxes, Examples thereof include animal waxes, mineral waxes, fatty acids, fatty acid esters, fatty acid amides and aliphatic amines.

  In the case where a mixed material of a binder and an adsorbing material is not used for the adsorbent 214, the adsorbent 214 has a desired adsorbing function in the sealing space including the gap 220 between the substrate 10 and the sealing substrate 210. The adsorbing material is not limited as described above, and various materials can be used. For example, silica gel, zeolite, activated carbon, calcium oxide, germanium oxide, phosphorus pentoxide, calcium chloride, or the like can be used alone or in combination. Further, if such a gap 220 is provided, even when moisture (humidity), oxygen or the like enters the gap 220 through the sealing member 14 and the first sealing material 212, the gap 220 has moisture. (Moisture), oxygen, and the like diffuse, and the load on the adsorbent 214 can be made uniform on the peripheral surface. Therefore, according to such a configuration, a good adsorption effect can be obtained over a long period of time, and the reliability and durability of the organic EL device can be improved.

  The first sealing material 212 is provided on the convex portion 218 of the sealing substrate 210. The first sealing material 212 is formed in a rectangular frame shape that surrounds the outer periphery of the protective layer 16, and is sandwiched between the substrate 10 and the sealing substrate 210. In the case of the present embodiment, the first sealing material 212 also functions as an adhesive that bonds the substrate 10 and the sealing substrate 210. The material for forming the first sealing material 212 is not particularly limited as long as it can maintain stable adhesive strength and has good airtightness. For example, a thermosetting resin material is used. it can. As a material for forming the first sealing material 212, a photo-curable epoxy resin that is cured by irradiation with ultraviolet light (UV) can be used.

  In addition, the 1st sealing material 212 can also be set as the structure by which the granular material (spacer) which spaces apart the board | substrate 10 and the sealing board | substrate 210 at predetermined intervals was mixed in the inside. Thus, it is possible to prevent the light emitting element 12 from being damaged by the pressing force when the sealing substrate 210 is attached. Further, it has a function of keeping the gap 220 between the adsorbent 214 and the protective layer 16 on the light emitting element 12 constant. In addition, the surface shape of the substrate 10 and the sealing substrate 210 in contact with the first sealing material 212 may be at least one of a step, a depression, a hole, a corrugation, and an unevenness.

  As described above, by providing the adsorbent 214, the first sealing material 212, and the sealing member 14, the intrusion path of moisture (humidity), oxygen, and the like becomes long, and the moisture (humidity), oxygen, etc. It is possible to lengthen the time until the weak light emitting element 12 deteriorates.

The plane block diagram and cross-sectional block diagram of the organic electroluminescent apparatus which concern on this embodiment. The plane process drawing and sectional process drawing for demonstrating the manufacturing process of the organic electroluminescent apparatus concerning this embodiment. The plane process drawing and sectional process drawing for demonstrating the manufacturing process of the organic electroluminescent apparatus concerning this embodiment. The schematic diagram for demonstrating the manufacturing process of the organic electroluminescent apparatus concerning this embodiment. The schematic diagram for demonstrating the manufacturing process of the organic electroluminescent apparatus concerning this embodiment. The schematic diagram for demonstrating the manufacturing process of the organic electroluminescent apparatus concerning this embodiment. The circuit block diagram of the organic electroluminescence display which concerns on a present Example. 1 is a plan configuration diagram of an organic EL display device according to an embodiment. FIG. 1 is a plan configuration diagram showing one pixel region of an organic EL display device according to an embodiment. 1 is a cross-sectional configuration diagram of one pixel region of an organic EL display device according to an embodiment. 1 is a plan configuration diagram of an organic EL device for an optical writing head according to an embodiment. FIG. 1 is a schematic configuration diagram of an optical writing head according to an embodiment. FIG. 11 is a perspective configuration diagram illustrating an example of an electronic apparatus according to the embodiment. The plane block diagram and cross-sectional block diagram of the organic electroluminescent apparatus concerning a present Example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2,8,9 ... Organic EL apparatus (light-emitting device) 10 ... Board | substrate 12 ... Light emitting element 14 ... Sealing member 16 ... Protective layer 18 ... 1st surface 20 ... 2nd surface 22 ... Outer peripheral surface 24 ... Spacer member ( Optical part) 26 ... SLA lens (optical part) 34 ... Anode 36 ... Hole transport layer 38 ... Light emitting layer 40 ... Cathode 50 ... First jig 52 ... Positioning jig 54 ... Vacuum suction port 56 ... Sealing jig 58 ... Second jig 60 ... Glass paste 62 ... Sealing member injection port 64 ... Sealing material 100 ... Organic EL display device 102 ... Pixel 104 ... Scanning line 106 ... Signal line 108 ... Common power supply line (power supply line) DESCRIPTION OF SYMBOLS 110 ... Data side drive circuit 112 ... Scanning side drive circuit 114 ... Switching TFT (thin film transistor) 116 ... Drive TFT 118 ... Pixel electrode 120 ... Common electrode 122 ... Light emission part (presence) Functional layer) 122A ... hole transport layer 122B ... light emitting layer 124 ... substrate 126 ... display region 128 ... sealing member 138 ... semiconductor layer 140 ... relay electrode 142 ... semiconductor layer 144A ... source region 144B ... drain region 144C ... channel region 144G ... Gate electrode 146 ... Source electrode 148 ... Drain electrode 150 ... Electrode 152 ... Organic EL element 154 ... Inorganic bank (first partition layer) 156 ... Organic bank (second partition layer) 158 ... Opening portion 160 ... Gate insulating film 162 ... First interlayer insulating film 164, 166 ... contact hole 168 ... second interlayer insulating film 170 ... protective layer 172 ... substrate 174 ... light emitting element region 176 ... drive element 178 ... connection wiring 180 ... sealing member 192 ... photosensitive drum 200 ... mobile phone Telephone 202 ... Display unit 204 ... Operation button Down portion 206 ... receiving portion 208 ... transmitter unit 210 ... sealing substrate 212 ... first sealing member 214 ... adsorbent 216 ... recess 218 ... protrusions 220 ... gap.

Claims (7)

A substrate,
A light emitting device arranged on the first surface of the substrate;
Continuously on the first surface including the light emitting element, at least a part of a second surface opposite to the first surface, and an outer peripheral surface connecting the first and second surfaces. A sealing member provided so as to be in contact with and sealing the light emitting element;
A light emitting device comprising: The light-emitting device according to claim 1.
An optical unit disposed on the second surface of the substrate;
The light-emitting device, wherein the sealing member is further provided so as to be in contact with a part of the optical unit, and seals a joint portion between the second surface and the optical unit. The light-emitting device according to claim 2.
The light emitting device according to claim 1, wherein a fluid member having a transmittance equivalent to that of the optical part is provided at the joint part. The light emitting device according to claim 2 or 3,
The optical unit includes a spacer member and an SLA lens. The light emitting device according to claim 2 or 3,
The optical unit includes a substrate on which the light emitting element is provided;
A first sealing material provided on the substrate so as to surround the light emitting element;
And a sealing substrate disposed to face the substrate with the first sealing material interposed therebetween. Forming light emitting elements arranged on the first surface of the substrate;
Continuously on the first surface including the light emitting element, at least a part of a second surface opposite to the first surface, and an outer peripheral surface connecting the first and second surfaces. Forming a sealing member in contact;
A method for manufacturing a light-emitting device, comprising: In the manufacturing method of the light-emitting device of Claim 6,
Further comprising disposing an optical part on the second surface of the substrate;
In the step of forming the sealing member, the sealing member is further provided so as to be in contact with a part of the optical part, and a joint part between the second surface and the optical part is sealed. A method for manufacturing a light emitting device.

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