JP2009069068A - Manufacturing method of pointer board and manufacturing method of display panel for pointer board - Google Patents

Manufacturing method of pointer board and manufacturing method of display panel for pointer board Download PDF

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JP2009069068A
JP2009069068A JP2007239684A JP2007239684A JP2009069068A JP 2009069068 A JP2009069068 A JP 2009069068A JP 2007239684 A JP2007239684 A JP 2007239684A JP 2007239684 A JP2007239684 A JP 2007239684A JP 2009069068 A JP2009069068 A JP 2009069068A
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electrode
pointer
organic
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mask
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JP5092639B2 (en
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Mitsuyoshi Matsumura
光芳 松村
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To enhance sealability of an organic EL element in the case that an organic EL display panel is used for a pointer board. <P>SOLUTION: A plurality of first electrodes 3 are formed in the shape of a two-dimensional array on one surface of a transparent substrate 2. An insular part 32 of a mask 30 is put over an area where a pointer is to be formed, of the surface on which the first electrodes 3 are formed, and the peripheral edge part 31 of the mask 30 is put on the surrounding part of the insular part. A connective part 33 connecting the peripheral edge part 31 and the insular part 32 is made thinner than the insular part 32 and the peripheral edge part 31, and in this state, an organic EL layer 10 and a second electrode 12 are formed in films sequentially on the first electrodes 3. After the mask 30 is removed, a center seal 15 is formed in the place where the insular part 32 has been present, while a frame-shaped seal 16 is formed in the place where the peripheral edge part 31 has been present, and a cover 17 is put from above on the center seal 15 and the frame-shaped seal 16. The transparent substrate 2 and the cover 17 are bored in portions where they are superposed on the center seal 15. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、指針盤の製造方法及び指針盤用表示パネルの製造方法に関し、特にディスプレイ機能付きの指針盤の製造方法及びその指針盤に用いられる表示パネルの製造方法に関する。   The present invention relates to a method for manufacturing a pointer panel and a method for manufacturing a display panel for a pointer panel, and more particularly to a method for manufacturing a pointer panel with a display function and a method for manufacturing a display panel used for the pointer panel.

針式腕時計、針式壁掛け時計、針式置き時計、針式計測器等において、針の位置によって時刻、計測値等が表される。針の裏側には指針盤が設けられており、指針盤には目盛り等が設けられている。指針盤の背面には指針駆動部が取り付けられており、指針盤の中央部が穿孔されており、その孔に指針駆動部の駆動軸が通され、指針盤の正面側において針が駆動軸に取り付けられている。   In a needle type wristwatch, a needle type wall clock, a needle type clock, a needle type measuring instrument, etc., the time, measured value, etc. are represented by the position of the hand. A pointer board is provided on the back side of the needle, and a scale or the like is provided on the pointer board. A pointer drive unit is attached to the back of the pointer panel, and the central part of the pointer panel is perforated. The drive shaft of the pointer drive unit is passed through the hole, and the needle is connected to the drive shaft on the front side of the pointer panel. It is attached.

また、各種の表示機能付きの指針盤も用いられている。例えば、指針盤の前面側に液晶ディスプレイパネルが設けられ、その液晶ディスプレイパネルで各種の表示が行われる。
特開平１１−２０２０５９号公報 In addition, pointer boards with various display functions are also used. For example, a liquid crystal display panel is provided on the front side of the pointer board, and various displays are performed on the liquid crystal display panel.
JP-A-11-202059

ところで、液晶ディスプレイだけでなく、有機ＥＬ（ＥＬ：Electro-Luminescence：エレクトロ ルミネッセンス）素子アレイを利用したディスプレイパネルも指針盤に利用したいという要望がある。ところが、ディスプレイパネルの有機ＥＬ素子に外気が接触すると、有機ＥＬ素子が劣化しやすいという問題があり、そのような劣化を防止するべく、有機ＥＬ素子を封止する必要がある。その封止の方法としては、基板に形成された有機ＥＬ素子アレイの周辺部に枠状のシールを形成し、そのシールの上からカバーを被せる方法がある。   By the way, there is a demand for not only a liquid crystal display but also a display panel using an organic EL (EL: Electro-Luminescence) element array for a pointer board. However, when outside air comes into contact with the organic EL element of the display panel, there is a problem that the organic EL element is likely to deteriorate, and it is necessary to seal the organic EL element in order to prevent such deterioration. As a sealing method, there is a method in which a frame-like seal is formed around the organic EL element array formed on the substrate and a cover is placed on the seal.

しかしながら、有機ＥＬディスプレイパネルを指針盤に用いる場合、針の駆動軸を通すための孔をディスプレイパネルの指針駆動軸が形成される領域に貫通させる必要がある。そのためには、有機ＥＬ素子アレイの中央部やカバーの中央部に孔を形成し、その孔の周囲にシールを設け、その孔の周囲においてそのシールを有機ＥＬ素子アレイとカバーとの間に挟持する必要がある。ところが、有機ＥＬ素子アレイとシールの密着性は高くないので、そのシール性が高くない。更に、その孔の壁面には有機ＥＬ素子アレイの断面が存するので有機ＥＬ素子が外気に接してしまう。
そこで、本願は、シール性を高められるようにすることを課題とする。 However, when an organic EL display panel is used for the pointer board, it is necessary to penetrate a hole for passing the needle drive shaft into a region where the needle drive shaft of the display panel is formed. For this purpose, a hole is formed in the center of the organic EL element array or the center of the cover, a seal is provided around the hole, and the seal is sandwiched between the organic EL element array and the cover around the hole. There is a need to. However, since the adhesion between the organic EL element array and the seal is not high, the sealability is not high. Furthermore, since the cross section of the organic EL element array exists on the wall surface of the hole, the organic EL element comes into contact with the outside air.
Therefore, an object of the present application is to improve the sealing performance.

以上の課題を解決するために、請求項１に係る発明によれば、
枠状の周縁部と、前記周縁部の内側において前記周縁部から離れた位置にある島部と、前記周縁部と前記島部とを連結した連結部と、を有したマスクの前記島部を、基板の両面のうち第１電極が形成された面の指針駆動軸が形成される領域に重ねるとともに、前記マスクの前記周縁部を、前記第１電極が形成された面の周囲部に重ねて、前記第１電極の上に有機ＥＬ層及び第２電極を順に成膜し、
前記マスクを外した後に、前記島部があった箇所にセンターシールを形成し、前記周縁部があった箇所に枠状シールを形成し、
前記センターシールに重なる部分において前記基板を穿孔する、ことを特徴とする指針盤の製造方法が提供される。 In order to solve the above problems, according to the invention according to claim 1,
The island part of the mask having a frame-shaped peripheral part, an island part at a position away from the peripheral part inside the peripheral part, and a connecting part connecting the peripheral part and the island part. And overlapping the region where the pointer drive shaft is formed on the surface of the substrate where the first electrode is formed, and overlapping the peripheral portion of the mask on the periphery of the surface where the first electrode is formed The organic EL layer and the second electrode are sequentially formed on the first electrode,
After removing the mask, forming a center seal where the island was, forming a frame seal where the peripheral edge was,
A method for manufacturing a pointer board is provided, wherein the substrate is perforated at a portion overlapping the center seal.

請求項２に係る発明によれば、
前記マスクの設置に際して、前記第１電極が形成された面から前記連結部までの距離を前記第１電極が形成された面から前記島部及び前記周縁部までの距離よりも長くする、ことを特徴とする請求項１に記載の指針盤の製造方法が提供される。 According to the invention of claim 2,
When installing the mask, the distance from the surface on which the first electrode is formed to the connecting portion is longer than the distance from the surface on which the first electrode is formed to the island portion and the peripheral portion. A method for manufacturing a pointer board according to claim 1 is provided.

請求項３に係る発明によれば、
前記基板の穿孔の前に、前記センターシールの上からカバーを被せ、前記センターシールに重なる部分において前記カバーも穿孔する、ことを特徴とする請求項１又は２に記載の指針盤の製造方法が提供される。 According to the invention of claim 3,
The method for manufacturing a pointer board according to claim 1 or 2, wherein a cover is placed on the center seal before the substrate is drilled, and the cover is also drilled in a portion overlapping the center seal. Provided.

請求項４に係る発明によれば、
前記センターシールを形成するに際してそのセンターシールをリング状に形成し、
前記基板の穿孔に際して、前記センターシールの指針駆動軸が形成される領域の穴に重なる部分において前記基板を穿孔する、ことを特徴とする請求項１から３の何れか一項に記載の指針盤の製造方法が提供される。 According to the invention of claim 4,
When forming the center seal, the center seal is formed in a ring shape,
4. The pointer board according to claim 1, wherein when drilling the substrate, the substrate is drilled in a portion overlapping a hole in a region where the pointer drive shaft of the center seal is formed. 5. A manufacturing method is provided.

請求項５に係る発明によれば、
枠状の周縁部と、前記周縁部の内側において前記周縁部から離れた位置にある島部と、前記周縁部と前記島部とを連結した連結部と、を有したマスクの前記島部を、基板の両面のうち第１電極が形成された面の指針駆動軸が形成される領域に重ねるとともに、前記マスクの前記周縁部を、前記第１電極が形成された面の周囲部に重ねて、前記第１電極の上に有機ＥＬ層及び第２電極を順に成膜する、ことを特徴とする指針盤用表示パネルの製造方法が提供される。 According to the invention of claim 5,
The island part of the mask having a frame-shaped peripheral part, an island part at a position away from the peripheral part inside the peripheral part, and a connecting part connecting the peripheral part and the island part. And overlapping the region where the pointer drive shaft is formed on the surface of the substrate where the first electrode is formed, and overlapping the peripheral portion of the mask on the periphery of the surface where the first electrode is formed An organic EL layer and a second electrode are sequentially formed on the first electrode, and a method for producing a pointer panel display panel is provided.

請求項６に係る発明によれば、
前記マスクの設置に際して、前記第１電極が形成された面から前記連結部までの距離を前記第１電極が形成された面から前記島部及び前記周縁部までの距離よりも長くする、ことを特徴とする請求項５に記載の指針盤用表示パネルの製造方法が提供される。 According to the invention of claim 6,
When installing the mask, the distance from the surface on which the first electrode is formed to the connecting portion is longer than the distance from the surface on which the first electrode is formed to the island portion and the peripheral portion. A method for manufacturing a pointer panel display panel according to claim 5 is provided.

本発明によれば、マスクを設置した状態で第１電極の上に有機ＥＬ層、第２電極を積層したので、島部や周縁部に重なった部分には有機ＥＬ層や第２電極が形成されない。一方、島部と周縁部との間の開口には有機ＥＬ層、第２電極が積層される。更に、第１電極が形成された面から連結部までの距離をその面から島部及び周縁部までの距離よりも長くしたので、連結部の下側には有機ＥＬ層、第２電極が積層される。そして、島部があった箇所にセンターシールを形成し、周縁部があった箇所に枠状シールを形成したので、センターシールや枠状シールの密着性が高い。そのため、シール性を高くすることができる。
島部は周囲の周縁部から離れているが、島部が連結部によって周縁部に支えられているから、有機ＥＬ層や第２電極の成膜の際に島部の位置がずれない。そのため、決められた指針が形成される領域に有機ＥＬ層や第２電極を成膜しないようにすることを確実に行える。
また、センターシールに重なる部分が穿孔されるが、その部分には有機ＥＬ層や第２電極が形成されていないので、その孔の壁面には有機ＥＬ層や第２電極が露出していない。そのため、有機ＥＬ層や第２電極の外気への接触を防止することができる。 According to the present invention, since the organic EL layer and the second electrode are stacked on the first electrode in a state where the mask is installed, the organic EL layer and the second electrode are formed on the portion overlapping the island portion and the peripheral portion. Not. On the other hand, an organic EL layer and a second electrode are stacked in the opening between the island part and the peripheral part. Further, since the distance from the surface on which the first electrode is formed to the connecting portion is longer than the distance from the surface to the island portion and the peripheral portion, the organic EL layer and the second electrode are laminated below the connecting portion. Is done. And since the center seal | sticker was formed in the location with an island part, and the frame-shaped seal was formed in the location with a peripheral part, the adhesiveness of a center seal or a frame-shaped seal is high. Therefore, the sealing performance can be increased.
Although the island part is separated from the peripheral peripheral part, since the island part is supported by the peripheral part by the connecting part, the position of the island part does not shift when the organic EL layer or the second electrode is formed. Therefore, it is possible to reliably prevent the organic EL layer and the second electrode from being formed in a region where a predetermined pointer is formed.
Moreover, although the part which overlaps with a center seal | sticker is perforated, since the organic EL layer and the 2nd electrode are not formed in the part, the organic EL layer and the 2nd electrode are not exposed to the wall surface of the hole. Therefore, contact of the organic EL layer and the second electrode with the outside air can be prevented.

以下に、本発明を実施するための好ましい形態について図面を用いて説明する。但し、以下に述べる実施形態には、本発明を実施するために技術的に好ましい種々の限定が付されているが、発明の範囲を以下の実施形態及び図示例に限定するものではない。   Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

マトリクスディスプレイ機能付きの指針盤を製造するに際して、まず、図１、図２に示すように、ガラス製又はプラスチック製の透明基板２を準備する。基材として透明基板２を用いるが、基材として透明な可撓性シートを用いてもよい。   When manufacturing a pointer board with a matrix display function, first, a transparent substrate 2 made of glass or plastic is prepared as shown in FIGS. Although the transparent substrate 2 is used as the base material, a transparent flexible sheet may be used as the base material.

透明基板２の一方の面に対し、透明な導電性膜を気相成長法（例えば、スパッタリング法、蒸着法等）によって成膜し、その導電性膜をフォトリソグラフィー法及びエッチング法によって複数の第１電極３に形状加工する。第１電極３を形成するに際して、これら第１電極３を二次元アレイ状に配列するようにする。第１電極３は、例えば、錫ドープ酸化インジウム（ＩＴＯ）、亜鉛ドープ酸化インジウム、酸化インジウム（Ｉｎ2Ｏ3）、酸化スズ（ＳｎＯ2）、酸化亜鉛（ＺｎＯ）又はカドミウム−錫酸化物（ＣＴＯ）からなるものである。なお、第１電極３が、有機ＥＬ素子のアノード電極になる。 A transparent conductive film is formed on one surface of the transparent substrate 2 by a vapor phase growth method (for example, sputtering method, vapor deposition method, etc.), and the conductive film is formed into a plurality of layers by a photolithography method and an etching method. The shape is processed into one electrode 3. When the first electrodes 3 are formed, the first electrodes 3 are arranged in a two-dimensional array. The first electrode 3 is made of, for example, tin-doped indium oxide (ITO), zinc-doped indium oxide, indium oxide (In 2 O 3 ), tin oxide (SnO 2 ), zinc oxide (ZnO), or cadmium-tin oxide (CTO). ). The first electrode 3 becomes an anode electrode of the organic EL element.

続いて、透明基板２の一方の面に対して気相成長法、フォトリソグラフィー法、エッチング法、レジスト除去工程を適宜行うことによって透明基板２の一方の面にトランジスタ層４を形成する。トランジスタ層４はアクティブマトリクス駆動回路を構成するものであって、アクティブマトリクス駆動回路は複数の信号線、平面視してそれら信号線に直交する複数の走査線、信号線と走査線の各交差部に配置された薄膜トランジスタ５等を有するものである。アクティブマトリクス駆動回路の回路構成はどのようなものであってもよく、１画素につき設けられる薄膜トランジスタ５の数は本発明を限定するものでない。   Subsequently, the transistor layer 4 is formed on one surface of the transparent substrate 2 by appropriately performing a vapor deposition method, a photolithography method, an etching method, and a resist removing process on one surface of the transparent substrate 2. The transistor layer 4 constitutes an active matrix driving circuit. The active matrix driving circuit includes a plurality of signal lines, a plurality of scanning lines orthogonal to the signal lines in plan view, and intersections of the signal lines and the scanning lines. The thin film transistor 5 and the like disposed in the. The active matrix driving circuit may have any circuit configuration, and the number of thin film transistors 5 provided per pixel does not limit the present invention.

トランジスタ層４を形成するに際しては、オーバーコート層６を成膜し、そのオーバーコート層６によって薄膜トランジスタ５を被覆する。また、そのオーバーコート層６をパターニングすることによって、それぞれの第１電極３に対応する箇所に開口７を形成する。これにより、第１電極３を露出させる。   In forming the transistor layer 4, an overcoat layer 6 is formed, and the thin film transistor 5 is covered with the overcoat layer 6. Further, the overcoat layer 6 is patterned to form openings 7 at locations corresponding to the respective first electrodes 3. Thereby, the first electrode 3 is exposed.

なお、トランジスタ層４を形成した後に、複数の第１電極３をオーバーコート層６の上に形成してもよい。   Note that the plurality of first electrodes 3 may be formed on the overcoat layer 6 after the transistor layer 4 is formed.

次に、図３〜４に示すように、トランジスタ層４が形成された面にマスク３０を設置する。ここで、このマスク３０は、透明基板２の縁に沿った枠状の周縁部３１と、周縁部３１の内側において周縁部３１から離れた位置に設けられた円形状の島部３２と、島部３２と周縁部３１との間に連結され、周縁部３１に対して島部３２を保持する連結部３３と、を有する。連結部３３は周縁部３１及び島部３２よりも薄く、オーバーコート層６の表面から連結部３３までの距離はオーバーコート層６の表面から周縁部３１や島部３２までの距離よりも長い。このマスク３０を設置するに際して、透明基板２の指針駆動軸が形成される領域に島部３２を配置し、周縁部３１を透明基板２の縁に沿って配置する。   Next, as shown in FIGS. 3 to 4, a mask 30 is provided on the surface on which the transistor layer 4 is formed. Here, the mask 30 includes a frame-shaped peripheral portion 31 along the edge of the transparent substrate 2, a circular island portion 32 provided at a position away from the peripheral portion 31 inside the peripheral portion 31, and an island And a connecting portion 33 that is connected between the portion 32 and the peripheral portion 31 and holds the island portion 32 with respect to the peripheral portion 31. The connecting portion 33 is thinner than the peripheral edge portion 31 and the island portion 32, and the distance from the surface of the overcoat layer 6 to the connecting portion 33 is longer than the distance from the surface of the overcoat layer 6 to the peripheral edge portion 31 and the island portion 32. When installing the mask 30, the island portion 32 is disposed in the region where the pointer drive shaft of the transparent substrate 2 is formed, and the peripheral portion 31 is disposed along the edge of the transparent substrate 2.

次に、図５に示すように、有機ＥＬ層１０を蒸着法によって成膜する。そうすると、周縁部３１及び島部３２の重なっていない部分では、複数の第１電極３の上に有機ＥＬ層１０が積層される。また、連結部３３が第１電極３から離れているので、連結部３３の下側においても有機ＥＬ層１０が形成される。一方、マスク３０の上には、有機ＥＬ層１０と同材料の層１１が形成される。ここで、有機ＥＬ層１０を成膜するに際して、発光層だけを成膜してその発光層を有機ＥＬ層１０としてもよいし、正孔輸送層及び発光層を順に積層してその積層物を有機ＥＬ層１０としてもよいし、発光層及び電子輸送層を順に積層してその積層物を有機ＥＬ層１０としてもよいし、正孔輸送層、発光層及び電子輸送層を順に積層してその積層物を有機ＥＬ層１０としてもよい。なお、他の気相成長法によって有機ＥＬ層１０を成膜してもよいし、塗布法によって有機ＥＬ層１０を成膜してもよい。また、有機ＥＬ層１０を複数の画素に共通するよう一面に成膜するのではなく、印刷法によって有機ＥＬ層１０を画素ごとに形成してもよい。   Next, as shown in FIG. 5, the organic EL layer 10 is formed by vapor deposition. As a result, the organic EL layer 10 is laminated on the plurality of first electrodes 3 in a portion where the peripheral edge portion 31 and the island portion 32 do not overlap. Further, since the connecting portion 33 is separated from the first electrode 3, the organic EL layer 10 is also formed on the lower side of the connecting portion 33. On the other hand, a layer 11 made of the same material as the organic EL layer 10 is formed on the mask 30. Here, when forming the organic EL layer 10, only the light emitting layer may be formed and the light emitting layer may be used as the organic EL layer 10, or the hole transport layer and the light emitting layer are sequentially laminated to form the laminate. The organic EL layer 10 may be used, the light emitting layer and the electron transport layer may be stacked in order, and the laminate may be used as the organic EL layer 10, or the hole transport layer, the light emitting layer, and the electron transport layer may be stacked in order. The laminate may be the organic EL layer 10. Note that the organic EL layer 10 may be formed by another vapor deposition method, or the organic EL layer 10 may be formed by a coating method. In addition, the organic EL layer 10 may be formed for each pixel by a printing method instead of forming the organic EL layer 10 on one side so as to be common to a plurality of pixels.

次に、第２電極１２を気相成長法（蒸着法、スパッタリング法等）によって成膜する。そうすると、周縁部３１及び島部３２の重なっていない部分では、第２電極１２が有機ＥＬ層１０の上に積層され、更に、連結部３３の下側においても第２電極１２が有機ＥＬ層１０の上に積層される。一方、マスク３０の上には、第２電極１２と同材料の層１３が形成される。成膜された第２電極１２が有機ＥＬ素子のカソード電極となる。以上の工程を経ることで、指針盤用の表示パネル４０が得られる。
次に、マスク３０を外す。 Next, the second electrode 12 is formed by vapor deposition (evaporation method, sputtering method, etc.). Then, the second electrode 12 is stacked on the organic EL layer 10 in a portion where the peripheral edge portion 31 and the island portion 32 do not overlap, and further, the second electrode 12 is placed below the connecting portion 33 in the organic EL layer 10. Laminated on top. On the other hand, a layer 13 of the same material as the second electrode 12 is formed on the mask 30. The formed second electrode 12 becomes a cathode electrode of the organic EL element. The display panel 40 for the pointer board is obtained through the above steps.
Next, the mask 30 is removed.

次に、図６に示すように、有機ＥＬ層１０や第２電極１２が形成されていない中央部（指針駆動軸が形成される領域であって、島部３２があった箇所）に保護メタル膜１４を成膜する。
次に、図６〜７に示すように、有機ＥＬ層１０や第２電極１２が形成されていない中央部（指針が形成される領域であって、島部３２があった箇所）にリング状のセンターシール１５を印刷するとともに、有機ＥＬ層１０や第２電極１２が形成されていない周囲部（周縁部３１があった箇所）に枠状のシール１６を印刷する。なお、シール１５はリング状でなく、円形状であってもよいが、シール１５がリング状であると、ドリルにシール１５が絡み付くことがなくなる。 Next, as shown in FIG. 6, a protective metal is formed in the central portion where the organic EL layer 10 and the second electrode 12 are not formed (the region where the pointer drive shaft is formed and where the island portion 32 is present). A film 14 is formed.
Next, as shown in FIGS. 6 to 7, a ring shape is formed in the central portion where the organic EL layer 10 and the second electrode 12 are not formed (the region where the pointer is formed and the island portion 32 is present). The center seal 15 is printed, and the frame-shaped seal 16 is printed on the peripheral portion where the organic EL layer 10 and the second electrode 12 are not formed (the portion where the peripheral edge portion 31 was present). The seal 15 may be circular instead of ring-shaped, but when the seal 15 is ring-shaped, the seal 15 does not get tangled with the drill.

次に、図８に示すように、有機ＥＬ層１０、第２電極１２が形成された面をシール１５，１６の上からガラス製のカバー１７で覆い、シール１５，１６にカバー１７を接合する。なお、カバー１７の指針駆動軸が形成される領域に予め孔が形成されていてもよく、その場合、シール１５の周囲部分がカバー１７の孔の縁部分に重ねる。   Next, as shown in FIG. 8, the surface on which the organic EL layer 10 and the second electrode 12 are formed is covered with a glass cover 17 from above the seals 15 and 16, and the cover 17 is joined to the seals 15 and 16. . In addition, a hole may be formed in advance in a region where the pointer drive shaft of the cover 17 is formed, and in this case, a peripheral portion of the seal 15 is overlapped with an edge portion of the hole of the cover 17.

次に、図９に示すように、ドリルによって透明基板２及びカバー１７の中央部を穿孔し、島部３２の直径よりも小さい直径のセンターホール１８をその中央部に形成する。このように、透明基板２、カバー１７、オーバーコート層６、保護メタル膜１４を同時に穿孔することができる。ここで、穿孔する箇所は、シール１５の中央部の穴１９に重なる部分である。以上により、指針盤１が完成する。
なお、シール１５がリング状でなく、円形状である場合、シール１５の中央部もドリルによって穿孔する。また、カバー１７の中央部に予め孔が形成されている場合、透明基板２にセンターホール１８を形成し、カバー１７に予め形成された孔とそのセンターホール１８が連なる。 Next, as shown in FIG. 9, the center portion of the transparent substrate 2 and the cover 17 is drilled with a drill, and a center hole 18 having a diameter smaller than the diameter of the island portion 32 is formed in the center portion. Thus, the transparent substrate 2, the cover 17, the overcoat layer 6, and the protective metal film 14 can be drilled simultaneously. Here, the portion to be perforated is a portion that overlaps the hole 19 at the center of the seal 15. Thus, the pointer board 1 is completed.
In addition, when the seal | sticker 15 is not ring shape but circular shape, the center part of the seal | sticker 15 is also drilled with a drill. When a hole is formed in advance in the center of the cover 17, a center hole 18 is formed in the transparent substrate 2, and the hole formed in the cover 17 and the center hole 18 are connected.

次に、図１０〜１１に示すように、得られた指針盤１に対して半透明化粧板２０を貼り付ける。具体的には、トランジスタ層４が形成された面とは反対側の面に、中央部に穴の開いた半透明化粧板２０を貼り付ける。   Next, as shown to FIGS. 10-11, the translucent decorative board 20 is affixed with respect to the obtained pointer board 1. FIG. Specifically, a translucent decorative board 20 having a hole in the center is attached to the surface opposite to the surface on which the transistor layer 4 is formed.

次に、指針駆動部２１の駆動軸２２をセンターホール１８に通して、指針駆動部２１をカバー１７に取り付ける。次に、駆動軸２２に指針２３を取り付ける。指針駆動部２１は指針２３を回転させるものである。   Next, the pointer drive unit 21 is attached to the cover 17 by passing the drive shaft 22 of the pointer drive unit 21 through the center hole 18. Next, the pointer 23 is attached to the drive shaft 22. The pointer driving unit 21 rotates the pointer 23.

この指針盤１は時計用、計測用等に用いられるものであり、指針２３の数、指針駆動部２１の動作、半透明化粧板２０の表示等は指針盤１の用途に応じたものである。この指針盤１においては、透明基板２が表示面となる。なお、カバー１７が表示面となってもよい。この場合、透明基板２や第１電極３は透明でなくてもよいが、カバー１７及び第２電極１２を透明にする必要がある。   The pointer board 1 is used for timepieces, measurements, and the like. The number of hands 23, the operation of the pointer driving unit 21, the display of the translucent decorative board 20, and the like are in accordance with the use of the pointer board 1. . In this pointer board 1, the transparent substrate 2 serves as a display surface. The cover 17 may be a display surface. In this case, the transparent substrate 2 and the first electrode 3 may not be transparent, but the cover 17 and the second electrode 12 need to be transparent.

以上のように、本実施形態においては、有機ＥＬ層１０や第２電極１２を成膜する際には、第１電極３が形成された面から連結部３３までの距離が、第１電極３が形成された面から島部３２及び周縁部３１までの距離よりも大きく設定されている。そのため、連結部３３の下側にも有機ＥＬ層１０や第２電極１２が形成され、連結部３３の跡が残らない。   As described above, in the present embodiment, when the organic EL layer 10 and the second electrode 12 are formed, the distance from the surface on which the first electrode 3 is formed to the connecting portion 33 is the first electrode 3. It is set to be larger than the distance from the surface on which is formed to the island part 32 and the peripheral part 31. For this reason, the organic EL layer 10 and the second electrode 12 are also formed on the lower side of the connecting portion 33, and no trace of the connecting portion 33 is left.

また、マスク３０を設置した状態で第１電極３の上に有機ＥＬ層１０、第２電極１２を積層したので、有機ＥＬ層１０や第２電極１２を積層した後でも、周縁部３１や島部３２に重なった部分には有機ＥＬ層や第２電極が形成されず、オーバーコート層６が露出している。そして、島部３２があった箇所にセンターシール１５を形成し、周縁部３１があった箇所に枠状シール１６を形成したので、センターシール１５や枠状シール１６の密着性が高い。そのため、シール性を高くすることができる。   In addition, since the organic EL layer 10 and the second electrode 12 are laminated on the first electrode 3 with the mask 30 installed, the peripheral portion 31 and the island 31 can be obtained even after the organic EL layer 10 and the second electrode 12 are laminated. The organic EL layer and the second electrode are not formed in the portion overlapping the portion 32, and the overcoat layer 6 is exposed. And since the center seal | sticker 15 was formed in the location with the island part 32, and the frame-shaped seal | sticker 16 was formed in the location with the peripheral part 31, the adhesiveness of the center seal | sticker 15 and the frame-shaped seal | sticker 16 is high. Therefore, the sealing performance can be increased.

また、透明基板２やカバー１７はセンターシール１５に重なる部分において穿孔されるが、その部分には有機ＥＬ層１０や第２電極１２が形成されていないので、そのセンターホール１８の壁面には有機ＥＬ層１０や第２電極１２が露出していない。そのため、有機ＥＬ層１０や第２電極１２の外気への接触を防止することができる。   In addition, the transparent substrate 2 and the cover 17 are perforated in a portion overlapping the center seal 15, but the organic EL layer 10 and the second electrode 12 are not formed in the portion, so that the organic material is not formed on the wall surface of the center hole 18. The EL layer 10 and the second electrode 12 are not exposed. Therefore, the organic EL layer 10 and the second electrode 12 can be prevented from contacting the outside air.

また、センターホール１８の形成前に、カバー１７、センターシール１５及び枠状シール１６を設けたので、穿孔時の切り屑が第２電極１２の上に付着しない。そのため、第２電極１２を保護することができる。   In addition, since the cover 17, the center seal 15, and the frame-shaped seal 16 are provided before the formation of the center hole 18, chips at the time of drilling do not adhere to the second electrode 12. Therefore, the second electrode 12 can be protected.

なお、本発明は上記実施形態に限定されるものではなく、上記実施形態に対して種々の設計変更を行ったものも本発明の範囲に含まれる。
上記実施形態では、センターホール１８の形成前にカバー１７を重ねて接合したが、カバー１７を重ねずにセンターホール１８をドリルにより形成してもよい。その場合、センターホール１８の形成後にカバー１７を重ねるのがより好ましい。センターホール１８の形成後に重ねるカバー１７の中央部には予め孔が形成されており、カバー１７を重ねて接合する際には、カバー１７の孔がセンターホール１８に重なる。 In addition, this invention is not limited to the said embodiment, What changed various design with respect to the said embodiment is also contained in the scope of the present invention.
In the above embodiment, the cover 17 is overlapped and joined before the center hole 18 is formed, but the center hole 18 may be formed by a drill without overlapping the cover 17. In that case, it is more preferable to overlap the cover 17 after the center hole 18 is formed. A hole is formed in advance in the center of the cover 17 to be overlapped after the formation of the center hole 18, and the hole of the cover 17 overlaps the center hole 18 when the cover 17 is overlapped and joined.

図１は、指針盤の製造方法において第１電極を形成した状態を示した平面図である。FIG. 1 is a plan view showing a state in which a first electrode is formed in a method for manufacturing a pointer board. 図２は、図１のII−II線に沿った面の矢視断面図である。2 is a cross-sectional view taken along the line II-II in FIG. 図３は、指針盤の製造方法においてマスクを設置した状態を示した平面図である。FIG. 3 is a plan view showing a state in which a mask is installed in the method of manufacturing the pointer board. 図４は、図３のIV−IV線に沿った面の矢視断面図である。FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 図５は、指針盤の製造方法において有機ＥＬ層及び第２電極を形成した状態を示した断面図である。FIG. 5 is a cross-sectional view showing a state in which the organic EL layer and the second electrode are formed in the method for manufacturing the pointer board. 図６は、指針盤の製造方法においてシールを施した状態の状態を示した断面図である。FIG. 6 is a cross-sectional view showing a state in which a seal is applied in the method of manufacturing the pointer board. 図７は、指針盤の製造方法においてシールを施した状態の状態を示した平面図である。FIG. 7 is a plan view showing a state in which a seal is applied in the method of manufacturing the pointer board. 図８は、指針盤の製造方法においてカバーを施した状態の状態を示した断面図である。FIG. 8 is a cross-sectional view showing a state in which a cover is applied in the method for manufacturing the pointer board. 図９は、指針盤の製造方法において孔を施した状態の状態を示した断面図である。FIG. 9 is a cross-sectional view showing a state in which a hole is provided in the method for manufacturing the pointer board. 図１０は、指針盤に指針等を取り付けた状態を示した平面図である。FIG. 10 is a plan view showing a state in which a pointer or the like is attached to the pointer board. 図１１は、図１０のXI−XI線に沿った面の矢視断面図である。11 is a cross-sectional view taken along the line XI-XI in FIG.

符号の説明Explanation of symbols

２ 透明基板
３ 第１電極
１０ 有機ＥＬ層
１２ 第２電極
１５ センターシール
１６ 枠状シール
１７ カバー
１８ 孔
１９ 穴
３０ マスク
３１ 周縁部
３２ 島部
３３ 連結部
４０ 表示パネル DESCRIPTION OF SYMBOLS 2 Transparent substrate 3 1st electrode 10 Organic EL layer 12 2nd electrode 15 Center seal 16 Frame-shaped seal 17 Cover 18 Hole 19 Hole 30 Mask 31 Peripheral part 32 Island part 33 Connection part 40 Display panel

Claims (6)

枠状の周縁部と、前記周縁部の内側において前記周縁部から離れた位置にある島部と、前記周縁部と前記島部とを連結した連結部と、を有したマスクの前記島部を、基板の両面のうち第１電極が形成された面の指針駆動軸が形成される領域に重ねるとともに、前記マスクの前記周縁部を、前記第１電極が形成された面の周囲部に重ねて、前記第１電極の上に有機ＥＬ層及び第２電極を順に成膜し、
前記マスクを外した後に、前記島部があった箇所にセンターシールを形成し、前記周縁部があった箇所に枠状シールを形成し、
前記センターシールに重なる部分において前記基板を穿孔する、ことを特徴とする指針盤の製造方法。 The island part of the mask having a frame-shaped peripheral part, an island part at a position away from the peripheral part inside the peripheral part, and a connecting part connecting the peripheral part and the island part. And overlapping the region where the pointer drive shaft is formed on the surface of the substrate where the first electrode is formed, and overlapping the peripheral portion of the mask on the periphery of the surface where the first electrode is formed The organic EL layer and the second electrode are sequentially formed on the first electrode,
After removing the mask, forming a center seal where the island was, forming a frame seal where the peripheral edge was,
A method for manufacturing a pointer board, wherein the substrate is perforated at a portion overlapping the center seal. 前記マスクの設置に際して、前記第１電極が形成された面から前記連結部までの距離を前記第１電極が形成された面から前記島部及び前記周縁部までの距離よりも長くする、ことを特徴とする請求項１に記載の指針盤の製造方法。   When installing the mask, the distance from the surface on which the first electrode is formed to the connecting portion is longer than the distance from the surface on which the first electrode is formed to the island portion and the peripheral portion. The method for manufacturing a pointer board according to claim 1, wherein 前記基板の穿孔の前に、前記センターシールの上からカバーを被せ、前記センターシールに重なる部分において前記カバーも穿孔する、ことを特徴とする請求項１又は２に記載の指針盤の製造方法。   The method for manufacturing a pointer board according to claim 1 or 2, wherein a cover is placed on the center seal before the substrate is drilled, and the cover is also drilled at a portion overlapping the center seal. 前記センターシールを形成するに際してそのセンターシールをリング状に形成し、
前記基板の穿孔に際して、前記センターシールの指針駆動軸が形成される領域の穴に重なる部分において前記基板を穿孔する、ことを特徴とする請求項１から３の何れか一項に記載の指針盤の製造方法。 When forming the center seal, the center seal is formed in a ring shape,
4. The pointer board according to claim 1, wherein when drilling the substrate, the substrate is drilled in a portion overlapping a hole in a region where the pointer drive shaft of the center seal is formed. 5. Manufacturing method. 枠状の周縁部と、前記周縁部の内側において前記周縁部から離れた位置にある島部と、前記周縁部と前記島部とを連結した連結部と、を有したマスクの前記島部を、基板の両面のうち第１電極が形成された面の指針駆動軸が形成される領域に重ねるとともに、前記マスクの前記周縁部を、前記第１電極が形成された面の周囲部に重ねて、前記第１電極の上に有機ＥＬ層及び第２電極を順に成膜する、ことを特徴とする指針盤用表示パネルの製造方法。   The island part of the mask having a frame-shaped peripheral part, an island part at a position away from the peripheral part inside the peripheral part, and a connecting part connecting the peripheral part and the island part. And overlapping the region where the pointer drive shaft is formed on the surface of the substrate where the first electrode is formed, and overlapping the peripheral portion of the mask on the periphery of the surface where the first electrode is formed An organic EL layer and a second electrode are sequentially formed on the first electrode, and the method for producing a pointer panel display panel is characterized in that: 前記マスクの設置に際して、前記第１電極が形成された面から前記連結部までの距離を前記第１電極が形成された面から前記島部及び前記周縁部までの距離よりも長くする、ことを特徴とする請求項５に記載の指針盤用表示パネルの製造方法。   When installing the mask, the distance from the surface on which the first electrode is formed to the connecting portion is longer than the distance from the surface on which the first electrode is formed to the island portion and the peripheral portion. The method for manufacturing a display panel for a pointer board according to claim 5,
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096355A (en) * 2012-11-09 2014-05-22 Em Microelectronic Marin Sa Method of manufacturing oled display device, oled display device manufactured, and clock including the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120977A (en) * 1974-03-12 1975-09-22
JP2006210246A (en) * 2005-01-31 2006-08-10 Nippon Seiki Co Ltd Manufacturing method of organic el panel
JP2007121691A (en) * 2005-10-28 2007-05-17 Epson Imaging Devices Corp Method for manufacturing liquid crystal panel
JP2007186740A (en) * 2006-01-11 2007-07-26 Seiko Epson Corp Mask, film deposition method, light emitting device, and electronic equipment
JP2008103585A (en) * 2006-10-20 2008-05-01 Dainippon Printing Co Ltd Area light emitting organic el member, article provided with the same, and method of manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120977A (en) * 1974-03-12 1975-09-22
JP2006210246A (en) * 2005-01-31 2006-08-10 Nippon Seiki Co Ltd Manufacturing method of organic el panel
JP2007121691A (en) * 2005-10-28 2007-05-17 Epson Imaging Devices Corp Method for manufacturing liquid crystal panel
JP2007186740A (en) * 2006-01-11 2007-07-26 Seiko Epson Corp Mask, film deposition method, light emitting device, and electronic equipment
JP2008103585A (en) * 2006-10-20 2008-05-01 Dainippon Printing Co Ltd Area light emitting organic el member, article provided with the same, and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096355A (en) * 2012-11-09 2014-05-22 Em Microelectronic Marin Sa Method of manufacturing oled display device, oled display device manufactured, and clock including the same

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