JP2009063864A - Liquid crystal display device, and method for manufacturing liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an FFS mode liquid crystal display device in which no metal wiring is exposed on an edge of an array substrate, in which electrostatic breakdown is prevented from occurring, and which has a flattened film to reduce occurrence of rubbing unevenness in rubbing. <P>SOLUTION: A connection terminal 33A for lower wiring of the array substrate has: a contact hole 36a formed so as to pass through a first insulating film (a gate insulating film 14 and a passivation film 17) covering a surface of a wiring 34 for the connection terminal; a first transparent conductive film 38 partly electrically connected to the wiring 34 for the connection terminal on the bottom of the contact hole 36a and further electrically connected to a short circuit wire 53; a second insulating film 23 to cover the first transparent conductive film 38 and the surface of the first insulating film; and a second conductive film 41 simultaneously covering the surface of the second insulating film 23 on the periphery of the contact hole 36a, the first transparent conductive film 38 on the bottom of the contact hole 36a, and the surface of the wiring 34 for the connection terminal. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to an FFS (Fringe Field Switch) in which a pixel electrode and a common electrode are arranged on a planarizing film.
The present invention relates to a liquid crystal display device in a hing) mode and a method for manufacturing the liquid crystal display device.

The liquid crystal display device has a configuration in which an array substrate including switching elements and pixel electrodes arranged in a matrix and a color filter substrate including a color filter layer are arranged to face each other, and liquid crystal is sealed between the substrates. As such a liquid crystal display device, an IPS (In-Plane Switching) mode or FFS mode (described below) called a lateral electric field type liquid crystal display device having a pair of electrodes consisting of a pixel electrode and a common electrode only on an array substrate. A liquid crystal display device disclosed in Patent Documents 1 and 2) is known.

Among them, the IPS mode liquid crystal display device has a pixel electrode and a common electrode for applying an electric field to the liquid crystal arranged on the same insulating film. In addition, the FFS mode liquid crystal display device has a pixel electrode and a common electrode for applying an electric field to the liquid crystal arranged in different layers through an insulating film. This FFS mode liquid crystal display device has features that it has a wider viewing angle and higher contrast than an IPS mode liquid crystal display device, can be driven at a lower voltage, and has a higher aperture ratio, enabling bright display. ing. In addition, since the FFS mode liquid crystal display device has a larger overlapping area between the pixel electrode and the common electrode in plan view than the IPS mode liquid crystal display device, a larger storage capacity is generated as a secondary, and a separate auxiliary capacity is generated. There is also an advantage that there is no need to provide a line.

Here, an outline of a conventional array substrate for manufacturing a small to medium-sized liquid crystal display device will be described with reference to FIG. In each drawing used for the description in this specification, each layer and each member are displayed in different scales so that each layer and each member can be recognized on the drawing. However, it is not necessarily displayed in proportion to the actual dimensions.

As shown in FIG. 12, a conventional small-sized or medium-sized liquid crystal display device includes a large number of color filter substrates (not shown) separately manufactured after a large number of liquid crystal display devices 51 are formed on an array substrate 50. It is produced by cutting along the scribe line 52 after bonding. When manufacturing such a liquid crystal display device, thin charging or the like occurs when the substrate is transported from the device, and static electricity is charged on the substrate. And in the final process of each substrate, there is a rubbing process step of the alignment film. In the rubbing process process of this alignment film, static electricity is easily generated, and it was charged in the previous process or generated in the rubbing process process. The components in the liquid crystal display device 51 are liable to be electrostatically damaged due to sparks caused by static electricity.

Therefore, in order to disperse this static electricity and prevent electrostatic breakdown of the components in the individual liquid crystal display devices 51, short-circuit wiring (equal potential wiring) 53 (
The following patent documents 3 and 4) are formed. The connection terminal portions 54 of all the liquid crystal display devices 51 are connected to the short-circuit wiring 53 directly or with a high resistance so that they all have the same potential. The short-circuit wiring 53 is cut off when the individual liquid crystal display devices are obtained by cutting along the scribe lines 52.
JP 2001-235863 A JP 2002-182230 A JP-A-6-289417 JP 2001-166327 A

The short-circuit wiring 53 and the connection terminal portion 54 of the conventional example described above are formed simultaneously with the gate wiring or the source wiring. The gate wiring or the source wiring is formed of a metal wiring such as aluminum or aluminum alloy which has good conductivity but is easily corroded.
Therefore, when the scribing process is performed along the scribe line 52 between the short-circuit wiring 53 and the connection terminal portion 54, the metal wiring that is easily corroded is exposed at the end of each obtained array substrate. Corrosion is likely to occur from the exposed surface of the metal wiring during use.

As a configuration in which the metal wiring that is easily corroded is not exposed at the end portion of the liquid crystal display device 51, the connection terminal exposed on the surface of the connection terminal portion 54 and the short-circuit wiring 53 are connected to a pixel electrode made of a transparent conductive material. It is conceivable to form them simultaneously. That is, the pixel electrode made of a transparent conductive material used in a normal liquid crystal display device is formed of an inorganic oxide such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). This is because ITO or IZO is hardly corroded.

An example in which the connection terminal and the short-circuit wiring exposed on the surface of the connection terminal portion are formed simultaneously with the pixel electrode made of a transparent conductive material will be described with reference to FIGS. 13 to 15, the same reference numerals are assigned to the same components as those shown in FIG. 12.

Here, FIG. 13 is an enlarged view of the XIII portion of FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. FIG. 15 is a sectional view taken along line XV-XV in FIG.

As shown in FIGS. 13 to 15, a connection terminal wiring 57 formed simultaneously with the scanning line and the gate electrode is formed on the transparent substrate 56 such as a glass substrate, for example, at the position where the connection terminal portion 54 is formed. The surface of the connection terminal wiring 57 is covered with a gate insulating film 58 and a passivation film 59. The connection terminal wiring 57 is connected to the connection terminal formed of the transparent conductive material simultaneously with the formation of the pixel electrode through the contact hole 60 formed so as to penetrate the passivation film 59 and the gate insulating film 58 at the same time. 55 and the short-circuit wiring 53 and the wiring portion 61 are electrically connected. The connection terminals 55 are provided at positions higher than the connection terminal wirings 57 and wider than the connection terminal wirings 57, and various connection members connected to the connection terminals 55 are connected to the connection terminals 55. Good electrical contact is made.

On the other hand, an FFS mode liquid crystal display device having a planarization film includes a thin film transistor (TFT) as a switching element below the planarization film for each pixel, and an insulating film above the planarization film. And a lower electrode made of a transparent conductive material and an upper electrode on which a plurality of slits are formed. In the FFS mode liquid crystal display device having such a flattening film, as described above, when the connection terminal portion and the short-circuit wiring are formed simultaneously with the upper electrode functioning as the pixel electrode, an insulating film and an upper film are formed on the lower electrode. It is necessary to form electrodes, connection terminals, and short-circuit wiring. For this reason, the number of man-hours until the connection terminal portion is maintained at the same potential by the short-circuit wiring increases, and the possibility of the occurrence of defective products due to static electricity increases during that time. In addition, the wiring portion between the connection terminal made of the same material as the upper electrode and the short-circuit wiring is connected in a bare state on the surface of the insulating film. Such a wiring portion is connected to the surface of the insulating film. If many remain, there is a risk of uneven rubbing during rubbing.

The present invention has been made in view of the above points, and the metal wiring is not exposed at the end of the array substrate, and the generation of static electricity is suppressed and the occurrence of uneven rubbing is reduced during rubbing. An object of the present invention is to provide an FFS mode liquid crystal display device having a planarizing film. Furthermore, an object of the present invention is to provide a method for manufacturing the liquid crystal display device and an electronic apparatus using the liquid crystal display device having the array substrate.

In order to achieve the above object, in the liquid crystal display device of the present invention, a connection terminal portion is formed around the display area of the liquid crystal display device formed on the substrate, and the plurality of liquid crystal display devices are formed on the substrate. In addition, a plurality of scanning lines and signal lines that are electrically connected by short-circuit wirings arranged in the periphery of the liquid crystal display device and formed in a matrix, and planarization formed on the scanning lines and signal lines Each of the liquid crystals comprising a film, a lower electrode made of a transparent conductive material, and an upper electrode having a plurality of slits, which are opposed to each other through an insulating film for each region surrounded by the scanning line and the signal line In the display device, the connection terminal portion is formed so as to penetrate the connection terminal wiring, the first insulating film covering the surface of the connection terminal wiring, and the first insulating film on the connection terminal wiring. Contact holes The first conductive material which covers a part of the surface of the first insulating film around the inner periphery and the inner surface of the contact hole and is partially electrically connected to the connection terminal wiring at the bottom of the contact hole A film, a second insulating film covering the surface of the first conductive film and the first insulating film around the contact hole and the inner peripheral surface, and the second insulating film around the contact hole and the inner peripheral surface And a second conductive film that simultaneously covers the surface and the surface of the first conductive film and the connection terminal wiring at the bottom of the contact hole.

In the liquid crystal display device of the present invention, the display area is formed on the planarization film and the plurality of scanning lines and signal lines each formed in a matrix, and for each area surrounded by the scanning lines and signal lines. A lower electrode made of a transparent conductive material and an upper electrode having a plurality of slits, which are opposed to each other via an insulating film, are provided. With this configuration, the liquid crystal display device of the present invention is
It can be operated as an S-mode liquid crystal display device.

Moreover, in the liquid crystal display device of the present invention, the lower electrode made of a transparent conductive material and the upper electrode having a plurality of slits, which are opposed to each other through the insulating film, are formed on the planarizing film. A step due to a switching element, common wiring, or the like does not occur in the lower electrode or the upper electrode. For this reason, according to the liquid crystal display device manufactured using the array substrate of the present invention, the distance between the other substrate and the upper electrode, that is, the cell gap becomes uniform, and further, the light is not shielded by the black matrix in the display area. Since the area of the region that does not become smaller is reduced, the aperture ratio is increased. Therefore, according to the liquid crystal display device manufactured using the array substrate of the present invention, an FFS mode liquid crystal display device having a bright and good display image quality can be obtained. In the liquid crystal display device of the present invention, both the upper electrode and the lower electrode can act as a pixel electrode or a common electrode. That is, of the upper electrode and the lower electrode, the one connected to the switching element is the pixel electrode, and the one connected to the common wiring is the common electrode.

In addition, according to the liquid crystal display device of the present invention, the connection terminal wiring and the first conductive film are partially electrically connected, and the second conductive film is further connected to the connection terminal wiring and the first conductive film. It is formed so as to cover the conductive film simultaneously. For this reason, the connection terminal wiring, the first conductive film, and the second conductive film are all at the same potential. Therefore, the first conductive film can be drawn out as a pattern for connecting to the short-circuit wiring arranged in the periphery of the liquid crystal display device at the time of manufacture. Therefore, when the insulating film and the second conductive film are subsequently laminated on the first conductive film, the connection terminal wiring is hardly affected by static electricity from the outside, and the occurrence of defects due to static electricity is greatly increased. It becomes possible to suppress. In addition, since the surface of the first conductive film is covered with an insulating film, the short-circuit wiring and the wiring portion that connects the short-circuit wiring and the connection terminal wiring are not exposed when the array substrate is manufactured. At this time, the occurrence of uneven rubbing is reduced.

In the liquid crystal display device of the present invention, the first conductive film is partially electrically connected to the connection terminal wiring, and the second conductive film is formed of the connection terminal wiring and the first conductive film. It is necessary to be electrically connected to both. When the second conductive film is configured to be electrically connected to the connection terminal wiring via the first conductive film, the first and second conductive films are made of ITO (Indium T
In the case of being formed from a transparent conductive material such as in Oxide) or IZO (Indium Zinc Oxide), the contact resistance between the two increases, which is not preferable.

In the liquid crystal display device of the present invention, the first conductive film and the second conductive film are made of the same material as the lower electrode and the upper electrode, respectively, and the second insulating film is between the lower electrode and the upper electrode. It is preferable that it is the same material as the insulating film arrange | positioned.

With such a configuration, since the connection terminal portion can be formed at the same time when the display area is formed,
The display area and the connection terminal portion can be formed without increasing the number of steps. The “same material” in the present invention includes the case where each is formed of the same material, for example, when one has a multilayer structure, the other also has a similar multilayer structure. To do.

In the present invention, a transparent conductive material such as ITO or IZO can be used as the lower electrode and the upper electrode. In this case, the lower electrode and the upper electrode may have the same composition or different compositions. Further, the planarizing film in the present invention can be used as long as it is a transparent organic insulating film having at least a flat surface, and for example, a transparent resin such as acrylic resin or polyimide can be used. Furthermore, as various insulating films in the present invention, inorganic insulating films such as silicon oxide and silicon nitride can be used.

In the liquid crystal display device of the present invention, the connection terminal wiring is formed of the same metal material as the scanning line of the display area, and the first insulating film covers the gate insulating layer covering the scanning line of the display area. The film and the signal line are preferably formed of a multilayer film made of the same material as the passivation film.

Since the scanning line in the display area is usually formed as a low-level wiring directly on the transparent substrate, the surface of the connection terminal wiring formed simultaneously with the scanning line is covered with both the gate insulating film and the passivation film. Both the gate insulating film and the passivation film become the first insulating film. According to the liquid crystal display device of this aspect, even when the connection terminal wiring is a low-level wiring formed directly on the substrate, a liquid crystal display device having the above-described effects can be obtained. However, in the configuration described above, both the gate insulating film and the passivation film serve as the first insulating film, but the present invention may be applied to a single layer or multiple layers of insulating film formed on the connection terminal wiring. No. shown in
1 corresponds to an insulating film.

In the liquid crystal display device of the present invention, the connection terminal wiring is formed of the same metal material as the signal lines in the display area, and the first insulating film covers the signal lines in the display area. The film is preferably formed of the same material as the passivation film.

Since the signal line in the display area is usually formed as a high-level wiring on the surface of the gate insulating film, the surface of the connection terminal wiring formed simultaneously with this signal line is covered with a passivation film. One insulating film is formed. According to the liquid crystal display device of this aspect, even when the connection terminal wiring is a high-level wiring formed on the surface of the gate insulating film, a liquid crystal display device having the above-described effects can be obtained.

In the liquid crystal display device of the present invention, the display region may have a reflection plate partially formed between the planarization film and the lower electrode.

According to the liquid crystal display device of this aspect, the portion where the reflection plate is partially formed between the planarization film and the lower electrode acts as a reflection portion, and the other portion acts as a transmission portion. A mode transflective liquid crystal display device can be formed.

Furthermore, in order to achieve the above object, the method of manufacturing a liquid crystal display device according to the present invention divides the array substrate for the liquid crystal display device into each liquid crystal display device, and the connection of the respective liquid crystal display devices. The terminal region is cut from the short-circuit wiring.

According to the method for manufacturing a liquid crystal display device according to this aspect, it is possible to easily manufacture a liquid crystal display device having the above effects.

The best mode for carrying out the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify an FFS mode liquid crystal display device as a liquid crystal display device for embodying the technical idea of the present invention, and the present invention is specified as the FFS mode liquid crystal display device. And is equally applicable to other embodiments within the scope of the claims. Further, the plan view of the array substrate for the liquid crystal display device of each embodiment shown below is the same as that of the conventional example shown in FIG. 12, so FIG. 12 is used as needed and FIG. The same components as those shown will be described using the same reference numerals.

FIG. 1 is a schematic plan view of one pixel seen through a color filter substrate of a liquid crystal display device using the array substrate of the first embodiment. FIG. 2 is a sectional view taken along line II-II in FIG. FIG.
FIG. 3 is a plan view of a low-level wiring connection terminal portion of the array substrate of Example 1; 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a plan view of the high-level wiring terminal portion of the array substrate of the first embodiment. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is a sectional view taken along line VIII-VIII in FIG. FIG. 9 is a schematic plan view of one pixel seen through the color filter substrate of the FFS mode transflective liquid crystal display device using the array substrate of Example 2. FIG. 10 is a cross-sectional view taken along line XX in FIG. FIG. 11A is a diagram showing a personal computer equipped with the liquid crystal display device of the present invention, and FIG. 11B is a diagram showing a mobile phone equipped with the liquid crystal display device of the present invention.

An example of the array substrate AR and connection terminal portion for the FFS mode liquid crystal display device 10A having the planarizing film of the first embodiment will be described in the order of the manufacturing steps with reference to FIGS. This array substrate A
As shown in FIG. 12, R is produced as a substrate having a plurality of liquid crystal display devices 51 as an array substrate 50, and is finally divided into individual liquid crystal display devices. However, since all the liquid crystal display devices 51 are manufactured in the same configuration in the same process, for convenience of explanation, the following description will be made assuming that one liquid crystal display device 51 is manufactured. Similarly,
Although not shown, the color filter substrate CF for the FFS mode liquid crystal display device 10A having the flattening film of Example 1 is manufactured as a color filter substrate having a plurality of color filter substrate regions, and is finally divided into individual color filter substrates. In the following, the liquid crystal display device is 1
A description will be given assuming that individual color filter substrate regions are produced.

In manufacturing the liquid crystal display device 51 of the array substrate 50 of the first embodiment, first, a conductive layer made of, for example, aluminum or an aluminum alloy is formed over the entire surface of the transparent substrate 11 such as a glass substrate. Thereafter, a plurality of scanning lines 12 and a plurality of common wirings 13 are formed in the display region so as to be parallel to each other by a known photolithography method and etching method, and a low-level wiring connection terminal portion 33A at the peripheral portion of the display region. (Refer to FIGS. 3 to 5) A connection terminal wiring 34 made of a gate wiring is formed. This gate wiring is not necessarily used as the wiring for the scanning line 12 and is called “gate wiring” because it is the same material as the scanning line 12. It is used for various wiring. Here, an example is shown in which the common wiring 13 is formed along the scanning line 12 of the own pixel. However, the common wiring 13 may be formed along the scanning line 12 side of the adjacent pixel or between the scanning lines 12. You may form in.

Next, the entire surface is covered with a gate insulating film 14 made of a silicon nitride layer or a silicon oxide layer. After that, for example, an amorphous silicon (hereinafter referred to as “a-Si”) layer is coated over the entire surface of the gate insulating film 14 by a CVD (chemical vapor deposition) method, and then also by a photolithography method and an etching method. Then, a semiconductor layer 15 made of an a-Si layer is formed in the TFT formation region. The region of the scanning line 12 at the position where the semiconductor layer 15 is formed forms the gate electrode G of the TFT.

Next, a conductive layer made of, for example, aluminum or an aluminum alloy is formed on the surfaces of the gate insulating film 14 and the semiconductor layer 15. Further, a signal line 16 including a source electrode S is formed on the conductive layer by a photolithography method and an etching method so as to intersect the scanning line 12 in the display region, and a drain electrode D is formed in the TFT formation region. Further, the connection terminal wiring 35 made of the source wiring is formed in the high-level wiring connection terminal portion 33B (see FIGS. 6 to 8). As in the case of the gate wiring, this source wiring is not necessarily used as the wiring of the signal line 16 but is called a “source wiring” because it is made of the same material as the signal line 16. Although not shown, it is used for various wirings as appropriate.

Thereafter, a passivation film 17 is coated on the entire surface of the transparent substrate 11 obtained in the above process. As the passivation film 17, a silicon nitride layer or a silicon oxide layer can be used, but a silicon nitride layer is more desirable from the viewpoint of insulation. Among these, the gate insulating film 14 and the passivation film 17 present on the surface of the connection terminal wiring 34 of the low level wiring connection terminal portion 33A correspond to the first insulating film of the present invention. The passivation film 17 present on the surface of the connection terminal wiring 35 also corresponds to the first insulating film of the present invention.

Next, contact holes 21 and 36a are respectively formed in the gate insulating film 14 and the passivation film 17 on the common wiring 13 and on the connection terminal wiring 34 of the low-level wiring connection terminal portion 33A by photolithography and etching. . At the same time,
A contact hole 37a is formed in the passivation film 17 on the connection terminal wiring 35 of the high-level wiring connection terminal portion 33B. For the formation of the contact holes 21, 36a and 37a, a plasma etching method which is a kind of dry etching method or a wet etching method using buffered hydrofluoric acid can be employed. Thereby, the surfaces of the common wiring 13 and the connection terminal wirings 34 and 35 are exposed. At this time, no contact hole is formed in the passivation film 17 on the drain electrode D yet. Further, a planarizing film (interlayer film) made of, for example, acrylic resin or polyimide resin is formed on the surface of the passivation film 17 in the display region, except for the contact hole 21 portion and the contact hole formation planned portion on the drain electrode D by photolithography. (Also referred to as 18).

Next, over the entire surface of the transparent substrate on which the planarizing film 18 is formed, for example, ITO or IZO
A transparent conductive layer made of is coated. Thereafter, the lower electrode 22 is formed on the surface of the planarizing film 18 for each pixel by photolithography and etching, and part of the surface of the connection terminal wirings 34 and 35 and the passivation film 17 surrounding them. A first transparent conductive film 38 and 39 are formed respectively. At this time, in the array substrate 50, as shown in FIG. 12, all the first transparent conductive films 38 and 39 and the wiring portion 61 are surrounded so as to surround the respective liquid crystal display devices 51. The short circuit wiring 53 is formed so as to be electrically connected via the wiring. At this time, the connection terminal wirings 34 and 3
It is necessary to form the first transparent conductive films 38 and 39 so that a part of the surface of 5 is exposed. When the entire surfaces of the connection terminal wirings 34 and 35 are covered with the first transparent conductive films 38 and 39, the connection terminal wirings 34 and 35 are covered in the subsequent steps via the first transparent conductive films 38 and 39. The second transparent conductive layer is electrically connected. In such a state,
Since the contact resistance between the first transparent conductive films 38 and 39 and the second transparent conductive film is large, the static electricity dispersion effect is suppressed. In this step, the lower electrode 22 for each pixel is electrically connected to the common wiring 13 through the contact hole 21.

Further, an insulating film 23 made of a silicon nitride layer or a silicon oxide layer is formed over the entire surface of the transparent substrate 11 on which the lower electrode 22 and the first transparent conductive films 38 and 39 are formed. At this time,
The surface of the passivation film 17 where the contact hole is to be formed on the drain electrode D, the exposed surfaces of the connection terminal wirings 34 and 35, the surfaces of the first transparent conductive films 38 and 39,
The surfaces of the wiring portion 61 and the short-circuit wiring 53 are also covered with the insulating film 23. Next, the contact hole 24 is formed in the contact hole formation planned portion on the drain electrode D and the insulating film 23 by the photolithography method and the etching method, the connection terminal wirings 34 and 35 and the first transparent conductive film. Insulating film 2 located on the surfaces of 38 and 39
3, openings 36b and 37b are formed, respectively. Accordingly, the surface of the drain electrode D, the connection terminal wirings 34 and 35, and the surfaces of the first transparent conductive films 38 and 39 are exposed. The contact hole 24 and the openings 36b and 37b are formed by a dry etching method 1
A seeded plasma etching method or a wet etching method using buffered hydrofluoric acid may be employed. In FIG. 1, the insulating film 23 appears on the entire surface except for the upper electrode 26 described below, but is not shown in order to facilitate understanding of the liquid crystal display device 10A.

The openings 36b and 37b are formed from the contact hole 36a formed in the gate insulating film 14 and the passivation film 17 on the connection terminal wiring 34 and the contact hole 37a formed in the passivation film 17 on the connection terminal wiring 35. Also has a small diameter.
Therefore, the insulating film 23 on the connection terminal wirings 34 and 35 and the first transparent conductive films 38 and 39.
Means that the connection terminal wirings 34 and 35 and the first transparent conductive films 38 and 39 are partially covered on the peripheral sides of the openings 36b and 37b. Of the insulating film 23, portions formed on the surfaces of the first transparent conductive films 38 and 39 existing on the connection terminal wirings 34 and 35 correspond to the second insulating film in the present invention.

Further, over the entire surface of the transparent substrate 11 on which the insulating film 23 is formed, for example, ITO or IZO
A transparent conductive layer made of is coated. Thereafter, an upper electrode 26 having a plurality of slits 25 formed on the surface of the insulating film 23 is formed for each pixel by photolithography and etching, and the connection terminal wirings 34 and 35 and the first transparent conductive material are formed. Second transparent conductive films 41 and 42 are formed so as to cover the surfaces of the films 38 and 39 and the insulating film 23 around them. The second transparent conductive films 41 and 42 are connected to the connection terminal wirings 34 and 35 and the first transparent conductive film 38 through the openings 36b and 37b formed in the insulating film 23, respectively.
And 39, respectively, which correspond to the connection terminal portions in the present invention. Thereafter, an alignment film (not shown) is provided on the entire surface including the upper electrode 26 of the display portion, and a rubbing process is performed, whereby the array substrate 50 including a plurality of liquid crystal display devices 51 is obtained.

Further, the individual color filter substrate regions 62 of the color filter substrate (not shown) are shown in FIG.
As shown in FIG. 4, the scanning lines 12 of the individual liquid crystal display devices 51 are formed on the surface of the second transparent substrate 27.
A black matrix 28 is formed so as to cover positions corresponding to the signal lines 16 and the TFTs. Further, a color filter layer 29 of a predetermined color is formed on the surface of the second transparent substrate 27 surrounded by the black matrix 28, and the overcoat is applied so as to cover the surfaces of the black matrix 28 and the color filter layer 29. A coat layer 30 is formed. And
An alignment film (not shown) is formed on the surface of the overcoat layer 30 to complete a color filter substrate having a plurality of color filter substrate regions 62.

Then, after the color filter substrate having the above-described configuration is bonded to the above-described array substrate 50, the substrate is divided along the scribe line 52, and the liquid crystal 31 is sealed between the two substrates, whereby the FFS mode of the first embodiment is achieved. A liquid crystal display device 10A is obtained.

In the first embodiment, the lower electrode 22 is a common electrode and the upper electrode 26 is a pixel electrode. However, for example, the lower electrode 26 is a pixel electrode and is connected to the drain electrode D. It is also possible to adopt a configuration in which the common electrode is electrically connected to the common electrode 13 disposed in the pixel or in the periphery of the display region.

As described above, according to the array substrate 50 of the first embodiment, the low-level connection terminal wiring 34 and the high-level connection terminal wiring 35 and the first transparent conductive films 38 and 39 are partially electrically connected. ,
Further, the second transparent conductive films 41 and 42 are provided with a low-level connection terminal wiring 34 and a high-level connection terminal wiring 35.
And the first conductive films 38 and 39 are formed so as to cover them simultaneously. Therefore, at the stage where the first transparent conductive films 38 and 39 are formed, all the low-level connection terminal wirings 34 and the high-level connection terminal wirings 35 in the array substrate 50 are short-circuited by the short-circuit wiring 53 and have the same potential. . Therefore, when the insulating film 23 and the second transparent conductive films 41 and 42 are laminated on the first transparent conductive films 38 and 39 after that, the low-level connection terminal wiring 34 and the high-level connection terminal wiring 35 are connected from the outside. It becomes difficult to be affected by static electricity, and it is possible to greatly suppress the occurrence of defects due to static electricity. Furthermore, since the wiring portion 61 between the first transparent conductive films 38 and 39 and the short-circuit wiring 53 is covered with the insulating film 23, it is not directly exposed to the outside. Occasionally rubbing unevenness is reduced.

In addition, although the example of the transmissive FFS mode liquid crystal display device is shown as the liquid crystal display device 10A of the first embodiment, a transflective FFS mode liquid crystal display device may be used. Here, the configuration of a transflective FFS mode liquid crystal display device 10B will be described as a second embodiment with reference to FIGS. In the liquid crystal display device 10B of the second embodiment, the same reference numerals are given to the same components as those of the liquid crystal display device 10A of the first embodiment, and detailed description thereof is omitted.

The transflective FFS mode liquid crystal display device 10B of the second embodiment is the same as the transmissive FFS of the first embodiment.
The difference from the mode liquid crystal display device 10A is that unevenness is formed on a part of the surface of the flattening film 18 (not shown), and light is reflected on the surface of the flattening film 18 on which the unevenness is formed. This is a point where a reflective plate 19 made of a conductive metal is formed. The reflecting plate 19 is disposed between the surface of the planarizing film 18 and the lower electrode 22. Therefore, in the liquid crystal display device 10B according to the second embodiment, in each portion where the upper electrode 26 is formed, the portion where the reflection plate 19 is formed forms the reflection portion 20, and the other portion forms the transmission portion. To do. In addition, as a light reflective metal, what is generally used as a reflecting plate forming material of a transflective liquid crystal display device such as aluminum, an aluminum alloy, or silver can be appropriately selected and used.

In the liquid crystal display device 10B of the second embodiment, after the planarization film 18 is formed, a light reflective metal film is formed over the entire surface, and then the reflection plate 19 is formed by a photolithography method and an etching method. Thereafter, the light-reflective metal film of the other part is removed by leaving the part of the reflection plate 19 for each pixel first by photolithography and etching. Subsequently, by performing etching, contact holes 21 and 36a are formed in the gate insulating film 14 and the passivation film 17 on the surface of the common wiring 13 and the connection terminal wiring 34 of the low-level wiring connection terminal portion 33A, respectively. The contact hole 37a is formed in the passivation film 17 on the connection terminal wiring 35 of the high-level wiring connection terminal portion 33B.
Form. The subsequent manufacturing process is the same as that of the liquid crystal display device 10A of the first embodiment.

The configuration of the connection terminal portions 33A and 33B formed at the peripheral edge of the display region in the liquid crystal display device 10B of the second embodiment is the same as that of the liquid crystal display device 10A of the first embodiment. Therefore, according to the liquid crystal display device 10B of the second embodiment, a transflective FFS mode liquid crystal display device having the same effects as the liquid crystal display device 10A of the first embodiment can be obtained.

In the above, examples of the transmissive and transflective FFS mode liquid crystal display devices have been described as the first and second embodiments of the present invention. Such a liquid crystal display device of the present invention can be used for electronic devices such as personal computers, mobile phones, and portable information terminals. Among these, an example in which the liquid crystal display device 71 is used in the personal computer 70 is shown in FIG.
FIG. 11B shows an example in which is used for the mobile phone 75. However, since the basic configuration of the personal computer 70 and the mobile phone 75 is well known to those skilled in the art, a detailed description thereof will be omitted.

3 is a schematic plan view of one pixel seen through a color filter substrate of a liquid crystal display device using the array substrate of Example 1. FIG. It is sectional drawing along the II-II line of FIG. 3 is a plan view of a low-level wiring connection terminal portion of the array substrate of Example 1. FIG. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is sectional drawing along the VV line of FIG. 4 is a plan view of a high-level wiring terminal portion of the array substrate of Example 1. FIG. It is sectional drawing along the VII-VII line of FIG. It is sectional drawing along the VIII-VIII line of FIG. FIG. 6 is a schematic plan view of one pixel as seen through a color filter substrate of an FFS mode transflective liquid crystal display device using the array substrate of Example 2. It is sectional drawing along the XX line of FIG. FIG. 11A is a diagram showing a personal computer equipped with the liquid crystal display device of the present invention, and FIG. 11B is a diagram showing a mobile phone equipped with the liquid crystal display device of the present invention. It is a schematic plan view of a conventional array substrate. It is an enlarged view of the XIII part of FIG. It is sectional drawing along the XIV-XIV line | wire of FIG. It is sectional drawing along the XV-XV line | wire of FIG.

Explanation of symbols

10A, 10B: Liquid crystal display device 11: Transparent substrate 12: Scanning line 13: Common wiring 1
4: Gate insulating film 15: Semiconductor layer 16: Signal line 17: Passivation film 18:
Flattening film 19: Reflector 20: Reflector 21, 24: Contact hole 22: Lower electrode 23: Insulating film 25: Slit 26: Upper electrode 27: Transparent substrate 28: Black matrix 29: Color filter layer 30: Overcoat layer 31: Liquid crystal 33A: Low-level wiring connection terminal part 33B: High-level wiring connection terminal part 34: Low-level connection terminal wiring 35:
Higher connection terminal wirings 36a, 37a: contact holes 36b, 37b: openings 38
39: First transparent conductive film 41, 42: Second transparent conductive film 50: Array substrate 51:
Liquid crystal display device 52: Scribe line 53: Short-circuit wiring 54: Connection terminal portion 55: Connection terminal 56: Transparent substrate 57: Connection terminal wiring 58: Gate insulating film 59: Passivation film 60: Contact hole 61: Wiring portion 62: Color Filter substrate area

Claims (7)

A connection terminal portion is formed at the periphery of the display area of the liquid crystal display device formed on the substrate, and the plurality of liquid crystal display devices are short-circuit wirings arranged at the periphery of the liquid crystal display device formed on the substrate, respectively. Electrically connected,
A plurality of scanning lines and signal lines formed in a matrix, a planarization film formed on the scanning lines and signal lines, and an opposing arrangement through an insulating film for each region surrounded by the scanning lines and signal lines In each of the liquid crystal display devices including the lower electrode made of each transparent conductive material and the upper electrode having a plurality of slits,
The connection terminal portion is
Connection terminal wiring,
A first insulating film covering a surface of the connection terminal wiring;
A contact hole formed so as to penetrate the first insulating film on the connection terminal wiring;
A first portion that covers a part of the surface of the first insulating film on the periphery and the inner peripheral surface of the contact hole and is partially electrically connected to the connection terminal wiring at the bottom of the contact hole.
A conductive film;
A second insulating film covering the surfaces of the first conductive film and the first insulating film around the inner periphery and the contact hole;
A second conductive film that simultaneously covers the surface of the second insulating film on the periphery and inner peripheral surface of the contact hole and the surface of the first conductive film and the connection terminal wiring at the bottom of the contact hole; ,
A liquid crystal display device comprising: The liquid crystal display device according to claim 1, wherein the short-circuit wiring is electrically connected to the first conductive film. The first conductive film and the second conductive film are made of the same material as the lower electrode and the upper electrode, respectively.
The liquid crystal display device according to claim 1, wherein the second insulating film is made of the same material as the insulating film disposed between the lower electrode and the upper electrode. The connection terminal wiring is made of the same metal material as the scanning line of the display region, and the first insulating film is a gate insulating film that covers the scanning line of the display region and a passivation that covers the signal line. 2. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is formed of a multilayer film made of the same material as the film. The connection terminal wiring is formed of the same metal material as the signal lines in the display area, and the first insulating film is formed of a film of the same material as the passivation film covering the signal lines in the display area. The liquid crystal display device according to claim 1. 6. The liquid crystal display device according to claim 1, wherein a reflector is partially formed between the planarizing film and the lower electrode in the display region. The substrate of the liquid crystal display device according to claim 1 is divided for each of the liquid crystal display devices, and the connection terminal region of each of the liquid crystal display devices is cut from the short-circuit wiring. A method for manufacturing a liquid crystal display device.

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