JP2009059881A - Sheet capacitor and manufacturing method thereof - Google Patents
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- JP2009059881A JP2009059881A JP2007225686A JP2007225686A JP2009059881A JP 2009059881 A JP2009059881 A JP 2009059881A JP 2007225686 A JP2007225686 A JP 2007225686A JP 2007225686 A JP2007225686 A JP 2007225686A JP 2009059881 A JP2009059881 A JP 2009059881A
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- acrylic polymer
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- 239000003990 capacitor Substances 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011888 foil Substances 0.000 claims abstract description 37
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000004544 sputter deposition Methods 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000058 polyacrylate Polymers 0.000 claims description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 238000004070 electrodeposition Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000001962 electrophoresis Methods 0.000 claims description 5
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 claims description 4
- 238000007733 ion plating Methods 0.000 abstract description 6
- 239000003989 dielectric material Substances 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 28
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 10
- 229920001940 conductive polymer Polymers 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- 229920000128 polypyrrole Polymers 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000011148 porous material Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920006254 polymer film Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- -1 acryl Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002659 electrodeposit Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920001002 functional polymer Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Abstract
Description
本発明は、電気機器・電子機器などの電子回路に用いられるシートキャパシタおよび当該シートキャパシタの製造方法に関するものである。 The present invention relates to a sheet capacitor used in an electronic circuit such as an electric device / electronic device and a method for manufacturing the sheet capacitor.
アルミニウム電解コンデンサは、アルミニウム酸化皮膜を誘電体とするコンデンサであり、この誘電体の両面に金属電極を対応させ、この電極間に電圧を印加することによって電圧に比例した電荷を蓄積するように構成したものである。このアルミニウム電解コンデンサは、アルミニウム箔表面を粗面化(エッチング)することによって実効面積を拡大することができるので、他のコンデンサに比べて容量値がはるかに大きくなる。このアルミニウム電解コンデンサに用いられる表面積の大きいエッチドアルミニウム箔を用いて、アクリル系ポリマーを電着水溶液中に分散させておき、通電によりエッチドアルミニウム箔にアクリル系ポリマー層を電着形成して誘電体とし、対向電極に導電性高分子であるポリエチレンジオキシチオフェン(以下PEDOT)やポリピロール(以下PPy)の化学重合膜を形成し、その上にカーボンペースト、銀ペーストを塗布形成したシートキャパシタが一般的に知られている。 An aluminum electrolytic capacitor is a capacitor having an aluminum oxide film as a dielectric, and metal electrodes are made to correspond to both surfaces of the dielectric, and a voltage proportional to the voltage is accumulated by applying a voltage between the electrodes. It is a thing. Since the effective area of this aluminum electrolytic capacitor can be expanded by roughening (etching) the surface of the aluminum foil, the capacitance value is much larger than that of other capacitors. Using an etched aluminum foil with a large surface area used for this aluminum electrolytic capacitor, an acrylic polymer is dispersed in an electrodeposition aqueous solution, and an acrylic polymer layer is electrodeposited on the etched aluminum foil by energization. In general, a sheet capacitor is formed by forming a chemical polymer film of polyethylenedioxythiophene (hereinafter PEDOT) or polypyrrole (hereinafter PPy), which is a conductive polymer, on a counter electrode, and applying a carbon paste or a silver paste thereon. Known.
特に、エッチドアルミニウム箔にアクリル系ポリマー層を電着形成し、対向電極を導電性高分子のPEDOTやPPyの化学酸化重合膜と電解重合によるPPy膜を引き出し電極としたシートキャパシタとその製造方法が提案されている(例えば、特許文献参照)。 In particular, an electrodeposited acrylic polymer layer is formed on etched aluminum foil, and a sheet capacitor using a conductive polymer PEDOT or PPy chemically oxidized polymer film and an electropolymerized PPy film as a lead electrode for the counter electrode and a method for manufacturing the same Has been proposed (see, for example, patent literature).
このシートキャパシタは、対向電極を導電性高分子の引き出し電極とすることで、無極性で大容量、小形化に優れるコンデンサとされている。 This sheet capacitor is a capacitor that is nonpolar, has a large capacity, and is excellent in miniaturization by using a counter electrode as a lead electrode for a conductive polymer.
従来技術であるシートキャパシタでは、対向電極を導電性高分子のPEDOTやPPyの化学酸化重合膜と電解重合によるPPy膜を引き出し電極とし、エッチドアルミニウム箔の表面にアクリル系ポリマーを誘電体として電着させているために、前記誘電体電着膜の表面粗さにバラツキがあり、さらに欠陥部のない均一な対向電極形成、誘電体と対向電極の密着性が低い課題を有していた。 In the conventional sheet capacitor, the counter electrode is a conductive polymer PEDOT or PPy chemically oxidized polymer film and an electropolymerized PPy film as an extraction electrode, and an acrylic polymer is used as a dielectric on the surface of the etched aluminum foil. Therefore, there are variations in the surface roughness of the dielectric electrodeposition film, and there is a problem that uniform counter electrode formation without a defect portion and adhesion between the dielectric and the counter electrode are low.
対向電極の欠陥部や誘電体と対向電極の密着性のバラツキはシートキャパシタの耐電圧性能や静電容量の安定化に大きく影響し、無極性で大容量化、小形化に優れたコンデンサを得ることが困難であった。 Defects in the counter electrode and variations in adhesion between the dielectric and the counter electrode greatly affect the withstand voltage performance of the sheet capacitor and the stabilization of the capacitance, resulting in a capacitor that is nonpolar and has excellent capacity and size reduction. It was difficult.
また、対向電極としての導電性高分子材料は高価であり、さらに電着関連の生産設備費、化学・電解重合による繰り返し生産が必要なことを含め、材料費、製造費用が高いという課題を有している。 In addition, conductive polymer materials as counter electrodes are expensive, and there are also problems of high material costs and manufacturing costs, including electrodeposition-related production equipment costs and repeated production by chemical / electrolytic polymerization. is doing.
本発明は、上記する課題を解決するものであり、具体的には、表面積を拡大させたエッチドアルミニウム箔と、該エッチドアルミニウム箔の表面に、アクリル系ポリマーを電着形成してなるアクリル系ポリマー誘電体と、前記アクリル系ポリマー誘電体上に、スパッタリング法またはイオンプレーティング法により形成した対向電極とを含むことを特徴とするシートキャパシタである。 The present invention solves the above-described problems. Specifically, an etched aluminum foil having an enlarged surface area, and an acrylic formed by electrodeposition-forming an acrylic polymer on the surface of the etched aluminum foil. A sheet capacitor comprising: a polymer dielectric, and a counter electrode formed on the acrylic polymer dielectric by a sputtering method or an ion plating method.
また、本発明において、前記エッチドアルミニウム箔の粗面化形状が、スポンジ状または柱状であることを特徴とするものである。 In the present invention, the roughened shape of the etched aluminum foil is a sponge shape or a column shape.
さらに、本発明において、前記誘電体が、アクリル単独系、アクリル/メラニン系または変性アクリルポリマー系のいずれかで構成したことを特徴とするものである。 Furthermore, in the present invention, the dielectric is composed of any one of an acryl type, an acryl / melanin type, or a modified acrylic polymer type.
さらにまた、本発明において、前記対向電極が、スパッタリング法によるクロム、ニッケルまたはクロム/ニッケルの2層構造で構成したことを特徴とするものである。 Furthermore, the present invention is characterized in that the counter electrode has a two-layer structure of chromium, nickel or chromium / nickel by sputtering.
さらに、本発明は、表面積を拡大させたエッチドアルミニウム箔の表面に、電気泳動法によりアクリル系ポリマーを電着させて誘電体を形成し、前記誘電体上に、スパッタリング法またはイオンプレーティング法により、クロム、ニッケル、またはクロム/ニッケルの2層構造の対向電極を形成してなることを特徴とするシートキャパシタの製造方法である。 Furthermore, the present invention provides a dielectric material formed by electrodeposition of an acrylic polymer by electrophoresis on the surface of an etched aluminum foil having an enlarged surface area. A sputtering method or an ion plating method is formed on the dielectric material. Thus, a counter capacitor having a two-layer structure of chromium, nickel, or chromium / nickel is formed.
本発明は、シートキャパシタの対向電極の薄膜形成に有利なスパッタリング法やイオンプレーティング法を用いることを特徴としており、電極膜厚は1〜10μmの制御が可能であり、さらに金属の組み合わせや積層化などに対応して電着させた誘電体に応じて形成可能であって、欠陥部のない均一な対向電極を形成し、誘電体と対向電極との密着性を向上させることができる。よって、静電容量や耐電圧のバラツキのない安定した特性を有する効果が得られる。 The present invention is characterized by using a sputtering method or an ion plating method, which is advantageous for forming a thin film of a counter electrode of a sheet capacitor, and the electrode film thickness can be controlled from 1 to 10 μm. It can be formed in accordance with the electrodeposited dielectric corresponding to the formation of the electrode, and a uniform counter electrode having no defect portion can be formed, and the adhesion between the dielectric and the counter electrode can be improved. Therefore, the effect of having stable characteristics without variations in capacitance and withstand voltage can be obtained.
スパッタリング法、アルゴンを真空中においてプラズマによりイオン化させ、そのイオン化したアルゴンを薄膜形成する金属に照射して金属原子を叩き出し、アクリル系ポリマーを電着して誘電体を形成したエッチドアルミニウム箔に対して、薄膜化させるものであり、欠陥部のない均一な対向電極を形成することが可能である。
また、イオンプレーティング法も、電子ビームなどにより蒸発させた金属粒子をイオン化させて高エネルギー状態とし、エッチドアルミニウム箔に対して薄膜を形成させ、欠陥部のない均一な対向電極を形成することができる。
Sputtering method, argon is ionized by plasma in vacuum, the ionized argon is irradiated to the metal forming the thin film, metal atoms are knocked out, and an acrylic polymer is electrodeposited to form an etched aluminum foil formed with a dielectric. On the other hand, it is thinned and it is possible to form a uniform counter electrode without a defect portion.
In the ion plating method, metal particles evaporated by an electron beam or the like are ionized into a high energy state, a thin film is formed on the etched aluminum foil, and a uniform counter electrode without defects is formed. Can do.
このように、欠陥のない均一な対向電極の形成、誘電体と対向電極の密着性の向上によりシートキャパシタの耐電圧性能の改善や静電容量の安定化が図れ、無極性で大容量、小形で性能が優れ、安価なコンデンサを得ることが可能になった。 In this way, the formation of a uniform counter electrode without defects and the improved adhesion between the dielectric and the counter electrode can improve the withstand voltage performance of the sheet capacitor and stabilize the capacitance. Therefore, it has become possible to obtain an inexpensive capacitor with excellent performance.
以下、本発明の実施の形態を、図面に示す一実施例に基づいて説明する。図1において、エッチドアルミニウム箔1として、細孔の平均孔径が0.2〜0.3μmのスポンジ状粗面化部を有する低圧用アルミニウム電解コンデンサ電極箔または細孔の平均孔径が0.6〜0.7μmの柱状粗面化部を有する中高圧用箔を用いた。該エッチドアルミニウム箔1の表面に、濃度と中和度を調整したアクリル系ポリマーの電着液を使用し、定電圧法または定電流法のいずれかの手法を用いた電気泳動法で電着させたアクリル系ポリマー層(電着部)2を誘電体として形成した。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on an example shown in the drawings. In FIG. 1, as an
対向電極は、スパッタリング法を用いて薄膜形成を行った。真空中でアルゴンをプラズマでイオン化させ、そのイオン化したアルゴンを薄膜形成する金属に照射して金属原子を叩き出し、アクリル系ポリマーを電着して誘電体を形成したエッチドアルミニウム箔1表面に薄膜化させ、欠陥部のない均一な対向電極を形成すれば、この実施形態のシートキャパシタが得られる。金属層は今回2層として、1層目はクロム層3で、2層目はニッケル層4を形成したが、単一層でもシートキャパシタの構成は可能である。
The counter electrode was formed into a thin film using a sputtering method. Argon is ionized with plasma in a vacuum, the ionized argon is irradiated onto the metal that forms the thin film, metal atoms are knocked out, and an acrylic polymer is electrodeposited to form a dielectric on the surface of the
以下に本発明の実施例としてエッチドアルミニウム箔1にアクリル系ポリマーを電気泳動法で電着させてアクリル系ポリマー層2を形成し、スパッタリング法を用いて対向電極を形成してなるシートキャパシタと、従来の導電性高分子のPEDOTやPPyの化学酸化重合膜と電解重合によるPPy膜を電極引き出し電極としたシートキャパシタとについて、その単層板特性を比較する。
Hereinafter, as an embodiment of the present invention, a sheet capacitor in which an acrylic polymer is electrodeposited on an
[実施例1: 低圧用エッチング箔+2層スパッタリング]
細孔の平均孔径が0.2〜0.3μm、表面積100倍に粗面化されたエッチドアルミニウム箔1(低圧用箔 20×50mm)を濃度と中和度を調整したアクリル単独系電着液中に浸し、5〜30Vでの定電圧法によって、アクリル系ポリマー層2を電着させ誘電体を形成した。対向電極としては、スパッタリング法を用いて1層目は0.5μm厚さのクロム層3とし、2層目を2.0μm厚さのニッケル層4とした薄膜形成のシートキャパシタを形成する。
[Example 1: Low-pressure etching foil + two-layer sputtering]
Acrylic-only electrodeposition with adjusted concentration and neutralization degree of etched aluminum foil 1 (low pressure foil 20 × 50 mm) roughened to an average pore diameter of 0.2 to 0.3 μm and a surface area of 100 times It was immersed in a liquid, and an
[実施例2: 中高圧用エッチング箔+2層スパッタリング]
細孔の平均孔径が0.6〜0.7μm、表面積50倍にて粗面化されたエッチドアルミニウム箔1(中高圧用箔 20×50mm)を濃度と中和度を調整したアクリル系ポリマー電着液に浸し、5〜30Vでの定電圧法によって、アクリル系ポリマー層2を電着させ誘電体を形成した。対向電極としては、スパッタリング法を用いて1層目は0.5μm厚さのクロム層3、2層目を2.0μm厚さのニッケル層4とした薄膜形成のシートキャパシタを形成する。
[Example 2: Etching foil for medium and high pressure + two-layer sputtering]
Acrylic polymer with adjusted concentration and neutralization degree of etched aluminum foil 1 (medium / high pressure foil 20 × 50 mm) roughened with an average pore diameter of 0.6 to 0.7 μm and a surface area of 50 times It was immersed in an electrodeposition solution, and an
(従来例1: 低圧用エッチング箔+機能性高分子)
細孔の平均孔径が0.2〜0.3μm、表面積100倍に粗面化されたエッチドアルミニウム箔1(低圧用箔 20×50mm)を濃度と中和度を調整したアクリル単独系電着液に浸し、5〜30Vでの定電圧法にてアクリル系ポリマーを電着させ誘電体を形成した。対向電極としては、導電性高分子のPEDOTの化学重合法として、重合から常温乾燥を経て熱硬化をさせる。この重合を数回繰り返した後、カーボン塗布と銀ペースト塗布を行った電極引き出しとしたシートキャパシタとする。
(Conventional example 1: low-pressure etching foil + functional polymer)
Acrylic single electrodeposition in which the concentration and neutralization degree of the etched aluminum foil 1 (low pressure foil 20 × 50 mm) roughened to an average pore diameter of 0.2 to 0.3 μm and a surface area of 100 times are adjusted. It was immersed in a liquid and an acrylic polymer was electrodeposited by a constant voltage method at 5 to 30 V to form a dielectric. As the counter electrode, as a chemical polymerization method of PEDOT, which is a conductive polymer, thermosetting is performed through polymerization and drying at room temperature. This polymerization is repeated several times, and then a sheet capacitor is formed as an electrode lead subjected to carbon coating and silver paste coating.
(従来例2: 中高圧用エッチング箔+機能性高分子)
細孔の平均孔径が0.6〜0.7μm、表面積50倍にて粗面化されたエッチドアルミニウム箔1(中高圧用箔 20×50mm)を濃度と中和度を調整したアクリル系ポリマーを電着液に浸し、5〜30Vでの定電圧法にてアクリル系ポリマーを電着させ誘電体を形成した。対向電極としては、導電性高分子のPEDOTの化学重合法として、重合から常温乾燥を経て熱硬化をさせる。この重合を数回繰り返した後、カーボン塗布と銀ペースト塗布を行った電極引き出しとしたシートキャパシタとする。
(Conventional example 2: Medium-high pressure etching foil + functional polymer)
Acrylic polymer with adjusted concentration and neutralization degree of etched aluminum foil 1 (medium / high pressure foil 20 × 50 mm) roughened with an average pore diameter of 0.6 to 0.7 μm and a surface area of 50 times Was immersed in an electrodeposition solution, and an acrylic polymer was electrodeposited by a constant voltage method at 5 to 30 V to form a dielectric. As the counter electrode, as a chemical polymerization method of PEDOT, which is a conductive polymer, thermosetting is performed through polymerization and drying at room temperature. This polymerization is repeated several times, and then a sheet capacitor is formed as an electrode lead subjected to carbon coating and silver paste coating.
上記の実施例1、実施例2、従来例1、従来例2について、単層板シートキャパシタ特性(静電容量、1kHz-tanδ、耐電圧)を測定した。ここで、試料数は各10個とした。
その結果を表1に示す。
About the said Example 1, Example 2, the prior art example 1, and the prior art example 2, the single layer board sheet capacitor characteristic (an electrostatic capacity, 1 kHz-tan-delta, withstand voltage) was measured. Here, the number of samples was 10 each.
The results are shown in Table 1.
この表1より明らかなように、エッチドアルミニウム箔1にアクリル系ポリマーを電気泳動法で電着させてアクリル系ポリマー層2を形成し、スパッタリング法で対向電極を形
成した実施例1、2のシートキャパシタでは、単層板特性の静電容量、tanδ、耐電圧の変化が小さく、特性的に安定している。
一方、導電性高分子のPEDOTの化学重合膜による電極引き出しとした従来例1、2のシートキャパシタでは、単層板特性の静電容量、tanδ、耐電圧の変化が著しく実施例1〜2より大きい範囲での結果となった。
As is clear from Table 1,
On the other hand, in the sheet capacitors of the conventional examples 1 and 2 in which the electrodes are drawn out by the chemical polymerization film of the conductive polymer PEDOT, the changes in the capacitance, tan δ, and withstand voltage of the single-layer plate characteristics are remarkably higher than those in Examples 1-2. The result was in a large range.
また、イオンプレーティング法を用いても、表1と同様に静電容量、tanδ、耐電圧の平均値およびばらつきも同様の結果が得られた。 Even when the ion plating method was used, the same results were obtained for the capacitance, the tan δ, the average value and the variation of the withstand voltage as in Table 1.
1 エッチドアルミニウム箔
2 アクリル系ポリマー層(電着部)
3 クロム層(金属スパッタリング法)
4 ニッケル層(金属スパッタリング法)
5 ポリエチレンジオキシチオフェン(PEDOT)
6 カーボン/銀ペースト
1 Etched
3 Chromium layer (metal sputtering method)
4 Nickel layer (metal sputtering method)
5 Polyethylenedioxythiophene (PEDOT)
6 Carbon / silver paste
Claims (5)
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JPH11307386A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Capacitor and its manufacture |
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JP2001203455A (en) * | 1999-11-12 | 2001-07-27 | Matsushita Electric Ind Co Ltd | Capacitor-mounted metal foil and its manufacturing method, and circuit board and its manufacturing method |
JP2002037816A (en) * | 2000-07-24 | 2002-02-06 | Matsushita Electric Ind Co Ltd | Electronic component |
JP2002367856A (en) * | 2001-06-06 | 2002-12-20 | Matsushita Electric Ind Co Ltd | Capacitor and its manufacturing method |
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JPH09115768A (en) * | 1995-10-20 | 1997-05-02 | Matsushita Electric Ind Co Ltd | Capacitor and its manufacture |
JPH1027729A (en) * | 1996-07-10 | 1998-01-27 | Matsushita Electric Ind Co Ltd | Manufacture of capacitor |
JPH11307386A (en) * | 1998-04-21 | 1999-11-05 | Matsushita Electric Ind Co Ltd | Capacitor and its manufacture |
JP2000030534A (en) * | 1998-07-08 | 2000-01-28 | Asahi Chem Res Lab Ltd | Photosensitive high dielectric paste and manufacture of capacitor using same |
JP2001203455A (en) * | 1999-11-12 | 2001-07-27 | Matsushita Electric Ind Co Ltd | Capacitor-mounted metal foil and its manufacturing method, and circuit board and its manufacturing method |
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WO2014127236A1 (en) * | 2013-02-14 | 2014-08-21 | Kemet Electronics Corporation | One-sided capacitor foils and methods of making one-sided capacitor foils |
US10283276B2 (en) | 2013-02-14 | 2019-05-07 | Kemet Electronics Corporation | Method of manufacturing a capacitor array |
US10319529B2 (en) | 2013-02-14 | 2019-06-11 | Kemet Electronics Corporation | One-sided capacitor foils and methods of making one-sided capacitor foils |
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