JP2009054768A - Jig for bga package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for positioning a BGA package waiting for measurement. <P>SOLUTION: The general-purpose jig for positioning the BGA (Ball Grid Array) waiting for measurement mainly includes: a net-type substrate 110, a latch 120 and a plurality of pins 130. The net-type substrate 110 has an element storing hole 111 and a pressurizing/measuring surface 112. A plurality of positioning holes arranged in a matrix and at equal intervals are disposed in the element storing hole 111. The latch 120 holds the BGA package for arranging it in the net-type substrate 110 and adjusting a solder ball group to a part of or whole positioning hole groups by one to one. The pins elastically project to a periphery of the pressuring/measuring surface 112 of the net-type substrate 110. Thus, the general-purpose jig positions the BGA packages of various specifications irrespective of a substrate size, and the number and arrangement of solder balls. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a jig for a BGA package, and more particularly to a jig for positioning a BGA package waiting for measurement.

  In recent years, with the miniaturization of devices, more and more integrated circuit mounted products are made into BGA type (ball grid array type) semiconductor packages. The BGA type package obtains advantages such as the number of pins and miniaturization by performing surface bonding to the outside via a plurality of solder balls and spherical terminals located on the same surface. For example, BGA type packages such as RAM (Random Access Memory) and Flash Memory (Flash Memory) have a common standard for the gap between solder balls, but products such as board size, number of solder balls, solder ball arrangement, etc. are different. There are problems such as a decrease in measurement speed and too many types of measurement jigs because it is necessary to occasionally replace measurement jigs having a dedicated standard corresponding to each product before measurement.

  As shown in FIG. 1, a conventional fitting jig 200 for positioning a conventional BGA package waiting for measurement mainly has a window open base 210. A positioning plate 211 is provided in the element receiving groove of the window open base 210, and as shown in FIG. 2, the size of the positioning plate 211 is the substrate size of the BGA type package 10 waiting for measurement (that is, the side 13). Aim at. The inner wall of the positioning plate 211 serves as a position limiting frame 212, which serves to limit the side 13 of the BGA type package 10, and the total number of the plurality of solder balls 14 positioned on the ball implantation surface 11 of the BGA type package 10 is a single unit. It is exposed to the positioning plate 211.

  The upper edge of the position limiting frame 212 is a guide surface for facilitating guiding or positioning the BGA type package 10. A plurality of support fingers 214 are formed in the positioning plate 211, and the support fingers 214 can support and prevent the BGA type package 10 from escaping. In addition, coupling portions 215 are formed at both ends of the window open base 210 so as to be coupled to a mounting plate (not shown). Therefore, even if the BGA type package 10 products of the same type are used, the same general-type fitting jig 200 cannot be used unless the board sizes match. On the other hand, for different types of BGA type packages 10, the general type fitting jig 200 must be repurchased or redeveloped if the number of solder balls and the arrangement of the solder balls are different, except that the board sizes do not match. Disappear.

  The present inventor disclosed a kind of jig in Patent Document 1. In such a jig, a positioning plate is installed in the element receiving groove of the window open type base, and this positioning plate size is aimed at the outer edge of the arrangement area of the solder balls of the BGA package waiting for measurement. It becomes smaller than the substrate size. This jig can position the same type of BGA type package product, and is not limited to the substrate size, and support fingers can be omitted. However, since different types of BGA type package products have differences in the number of solder balls and the arrangement of solder balls, it is impossible to position and support and fix them using the above-mentioned jigs, and the versatility is still unsatisfactory. It is enough.

Chinese Patent No. I253705

The main object of the present invention is to provide a jig for positioning a BGA package awaiting measurement.
Another object of the present invention is to provide a jig for a BGA package that allows a BGA type package sealing body to be biased and allows a BGA package waiting for measurement to be tightly attached to the bottom surface of a substrate.

In order to achieve the above object, a jig for a BGA package according to the present invention has a net-type substrate, at least one latch, and a plurality of pins. This net-type substrate has an element receiving hole and a pressure measurement surface. A plurality of positioning holes arranged in a matrix and at equal intervals are formed in the element receiving holes. Some or all of the positioning hole groups are positioned one-to-one with the plurality of solder balls of the BGA type package to perform measurement with the contact pins, and communicate with the pressure measurement surface. The latch is installed in the net-type substrate and presses the BGA package. These pins are provided so as to be able to project freely around the pressure measurement surface of the net-type base. .
This BGA package jig can hold a BGA package whose board size and the number of solder ball terminals do not match when measuring an integrated circuit as a general-purpose jig.
Such a jig is not limited to the substrate size, the number of solder balls, and the solder ball arrangement of the BGA type package, and can position a BGA type package having various standards and uniform solder ball intervals. Furthermore, it is possible to reduce the number of times the jig is replaced in the process of replacing the integrated circuit measuring device, which has the advantage of improving the measurement efficiency and simplifying the type of fitting jig.

In order to achieve the above-mentioned object, the present invention will be described by employing other technical means.
In the general-purpose jig described above, these positioning holes are further divided into a plurality of first positioning holes and a plurality of second positioning holes, and the depth of the second positioning hole group is shallower than the depth of the first positioning hole group. .
In the general-purpose jig described above, at least one recess is formed in the bottom surface of the element receiving hole corresponding to the pressure measurement surface, and the second positioning hole group is arranged in the recess.

In the general-purpose jig described above, the concave portion may be formed in a band shape.
In the general-purpose jig described above, the recess may be located on the side of the bottom surface of the element accommodation hole.
In the general-purpose jig described above, the diameter of the second positioning hole group may be larger than the diameter of the first positioning hole group.
The general-purpose jig described above further includes a base cover, and the base cover is installed on the net-type base and does not cover the element accommodation hole.

In the general-purpose jig described above, a plurality of operating springs are further provided between the base lid and the net-type base.
In the general-purpose jig described above, a central hole is further formed in the element accommodation hole, and this central hole is located at the center of the arrangement region of the positioning hole group.
In the general-purpose jig described above, the net-type substrate is electrically insulated.

  An embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 7 and 8, the BGA type package 10 has a ball implantation surface 11, a back surface 12 opposite to the ball implantation surface 11, and a side 13 between the ball implantation surface 11 and the back surface 12. Have. A plurality of solder balls 14 or spherical terminals are installed on the ball implantation surface 11 for connection to the outside of the integrated circuit chip located in the BGA type package 10. According to a different mounting detail structure, at least one protruding sealing body 15 is formed at the center or the periphery of the ball implantation surface 11 of the BGA type package 10.

  Please refer to FIG. 3, FIG. 4 and FIG. The general-purpose jig 100 includes a net-type substrate 110, at least one latch 120, and a plurality of pins 130. The net-type substrate 110 has an element accommodation hole 111 and a pressure measurement surface 112, and the element accommodation hole 111 accommodates the BGA type package 10 waiting for measurement, as shown in FIG. When measuring an integrated circuit, the pressure measurement surface 112 is in pressure contact with the measurement tank 20 having a plurality of contact pins 21. These contact pins 21 are also referred to as POGO pin (registered trademark).

  As shown in FIG. 6, a plurality of positioning holes 113 and 114 arranged in a matrix and at equal intervals are provided in the element accommodation holes 111. In the present embodiment, the positioning holes 113 and 114 have a 13 × 29 matrix arrangement. “Arranged at equal intervals” means that each of the positioning holes 113 and 114 is approximately 0.85 mm in which the distance from the center point to the center point between the adjacent holes coincides. As shown in FIGS. 7 and 8, some or all of the positioning holes 113 and 114 are positioned one-to-one on the plurality of solder balls 14 of the BGA type package 10 waiting for measurement in order to perform measurement with the contact pins 21. And in communication with the pressure measurement surface.

  Specifically, the positioning hole group can be further divided into a plurality of first positioning holes 113 and a plurality of second positioning holes 114, and the depth of the second positioning hole group 114 is greater than the depth of the first positioning hole group 113. Will also become shallower. It is preferable that at least the recess 115 can be formed on the bottom surface of the element receiving hole 111 corresponding to the pressure measurement surface 112, and the sealing body 15 shifts to the recess 115, so that the ball implantation surface of the BGA type package 10 is obtained. 11 is pressed to be tight with the bottom surface of the element receiving hole 111. A second positioning hole group 114 is arranged in the recess 115.

  In this embodiment, the concave portion 115 is shaped like a band and can be located on the side or center of the bottom surface of the element receiving hole 111. As shown in FIG. 7 again, the first positioning hole group 113 has a first hole diameter D1, the second positioning hole group 114 also has a second hole diameter D2, and the second hole diameter D2 is larger than the first hole diameter D1. It is preferable to do this. Therefore, a large error tolerance is given to the side of the bottom surface of the element receiving hole 111, and the second positioning hole group 114 and the second positioning hole group 114 are caused by a difference in thermal expansion generated between the net type substrate 110 and the BGA type package 10 waiting for measurement. The peripheral solder ball group 14 is shifted in position so that it is not possible to aim at each other and the problem of being unable to fit is avoided. On the other hand, circuit measurement of the BGA type package 10 that allows a certain amount of warpage can be performed.

As shown in FIGS. 2 and 6, it is preferable to further install a central hole 116 in the element receiving hole 111, and this central hole 116 is located at the center of the arrangement area of the positioning hole groups 113 and 114. It is possible to confirm whether the positioning of the BGA type package 10 is accurate.
In general, the net-type substrate 110 is electrically insulated or is covered with an insulating layer, so that the solder ball group 14 comes into contact with the positioning hole groups 113 and 114 to avoid the problem that the net-type substrate 110 is short-circuited.

  As shown in FIG. 5, the latch 120 is installed in the net-type base 110, has a push handle 121 (as shown in FIG. 6) that enters the element receiving hole 111, and is connected to the latch spring 122. Provides pressing elasticity. Further, as shown in FIG. 7, the latch 120 presses the back surface 12 of the BGA type package 10 so that the solder ball group 14 of the BGA type package 10 does not escape from the corresponding positioning hole groups 113, 114. Yes.

  4, 5, and 7, these pins 130 can project to the periphery of the pressurization measurement surface 112 of the net-type substrate 110 in a telescopic manner through the projecting elasticity of the telescopic spring. Referring to FIG. 7 again, in the measurement process of the integrated circuit, the pins 130 are fitted into the positioning hole groups of the measurement tank 20, so that the contact pin group 21 of the measurement tank 20 is accurately connected to the net-type substrate 110. The positioning hole groups 113 and 114 can be aimed.

  As shown in FIGS. 5 and 6, in this embodiment, the general-purpose jig 100 further includes a base lid 140, and the base lid 140 is fitted to the net base 110 to form the element receiving hole 111. Do not cover. A plurality of operating springs 141 are further provided between the base lid 140 and the net-type base 110, and the general-purpose jig 100 can be expanded and contracted by the operating spring group 141 and coupled to the measuring device. As a coupling method, it is only necessary to form ear-shaped coupling portions 117 at both ends of the general-purpose jig 100, and such a coupling portion 117 has a coupling hole 118.

As described above, the general-purpose jig 100 of this embodiment positions the BGA type package waiting for measurement by a method in which the positioning hole groups 113 and 114 are positioned on the solder ball group one-on-one. If the distance between the solder ball groups 14 is equal, not only the board size, the number of solder balls, and the solder ball arrangement, but also different types of BGA type package products can be positioned and fixed, greatly increasing the versatility of the jig. In addition, it is possible to reduce the number of times the jig is replaced in the process of replacing the integrated circuit measuring device, thereby improving the measurement efficiency and simplifying the type of the fitting jig.
Although the present invention has been described based on the preferred embodiments thereof, the scope of protection of the present invention is limited by the scope of claims, and on the basis of this scope of protection, whatever falls within the gist of the present invention and the scope of the claims. Changes and modifications are also within the protection scope of the present invention.

It is a top view which shows the conventional general type fitting jig. It is sectional drawing which shows the use condition of the conventional general type fitting jig. It is a perspective view which shows the general purpose type | mold jig | tool by one Example of this invention. It is a perspective view which shows the general purpose type | mold jig | tool by one Example of this invention. It is a perspective view which shows the general purpose type | mold jig | tool by one Example of this invention. It is a top view which shows the general purpose type | mold jig | tool by one Example of this invention. It is sectional drawing which shows the use condition of the general purpose jig | tool by one Example of this invention. It is a top view which shows the use condition of the general purpose jig | tool by one Example of this invention.

Explanation of symbols

  10: BGA type package, 11: Ball implantation surface, 12: Back surface, 13: Side, 14: Solder ball, 15: Sealing body, 20: Measuring tank, 21: Contact pin, 100: General-purpose type jig, 110: Net type substrate, 111: Element receiving hole, 112: Pressure measurement surface, 113: First positioning hole, 114: Second positioning hole, 115: Recess, 116: Center hole, 117: Coupling part, 118: Coupling Hole: 120: Latch, 121: Push handle, 122: Latch spring, 130: Pin, 131: Extension spring, 140: Base cover, 141: Actuating spring, D1: First hole diameter, D2: Second hole diameter

Claims (10)

A plurality of positioning holes arranged in a matrix and at equal intervals are formed in the element receiving holes, and a part or all of the positioning hole groups are contact pins. A net-type substrate that is positioned one-to-one on a plurality of solder balls of a BGA-type package to communicate with the pressure measurement surface;
At least one latch installed in the net-type substrate and pressing the BGA-type package;
A plurality of pins that can extend and retract around the pressure measurement surface of the net-type substrate,
A jig for a BGA package, comprising:   The positioning hole is further divided into a plurality of first positioning holes and a plurality of second positioning holes, and the depth of the second positioning hole group is shallower than the depth of the first positioning hole group. The jig for BGA packages described in 1.   The treatment for a BGA package according to claim 2, wherein at least one recess is formed in the bottom surface of the element receiving hole corresponding to the pressure measurement surface, and the second positioning hole group is arranged in the recess. Ingredients.   The jig for a BGA package according to claim 3, wherein the concave portion has a band shape.   4. The jig for a BGA package according to claim 3, wherein the recess is located on a side of the bottom surface of the element accommodation hole.   6. The jig for a BGA package according to claim 5, wherein the diameter of the second positioning hole group is larger than the diameter of the first positioning hole group.   The jig for a BGA package according to claim 1, further comprising a base cover, wherein the base cover is installed on a net-type base to expose an element accommodation hole.   8. The jig for a BGA package according to claim 7, wherein a plurality of operating springs are installed between the base lid and the net type base.   The BGA package jig according to claim 1, further comprising a central hole in the element accommodation hole, wherein the central hole is located at a center of the arrangement area of the positioning hole group.   The jig for a BGA package according to claim 1, wherein the net-type substrate is electrically insulated.

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