JP2009051937A - Epoxy resin composition, cured product thereof, and new epoxy resin - Google Patents
Epoxy resin composition, cured product thereof, and new epoxy resin Download PDFInfo
- Publication number
- JP2009051937A JP2009051937A JP2007219665A JP2007219665A JP2009051937A JP 2009051937 A JP2009051937 A JP 2009051937A JP 2007219665 A JP2007219665 A JP 2007219665A JP 2007219665 A JP2007219665 A JP 2007219665A JP 2009051937 A JP2009051937 A JP 2009051937A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- structural formula
- cured product
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 122
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 122
- 239000000203 mixture Substances 0.000 title claims abstract description 54
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 16
- 239000011256 inorganic filler Substances 0.000 claims description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 13
- 238000003860 storage Methods 0.000 abstract description 22
- 238000006243 chemical reaction Methods 0.000 abstract description 12
- 239000012772 electrical insulation material Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 description 28
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 22
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- -1 amine compounds Chemical class 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- 150000002989 phenols Chemical class 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 5
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 5
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N alpha-naphthol Natural products C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- 238000010533 azeotropic distillation Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001471 micro-filtration Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- VIQAPEDAHOSNGW-UHFFFAOYSA-N OC=1C(=C2C(=C3C=CC=CC=13)C1C(COCC3C2O3)O1)O Chemical compound OC=1C(=C2C(=C3C=CC=CC=13)C1C(COCC3C2O3)O1)O VIQAPEDAHOSNGW-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- XFSBVAOIAHNAPC-WSORPINJSA-N acetylbenzoylaconine Chemical compound O([C@H]1[C@]2(O)C[C@H]3C45[C@@H]6[C@@H]([C@@]([C@H]31)(OC(C)=O)[C@@H](O)[C@@H]2OC)[C@H](OC)C4[C@]([C@@H](C[C@H]5OC)O)(COC)CN6CC)C(=O)C1=CC=CC=C1 XFSBVAOIAHNAPC-WSORPINJSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 2
- 229910001863 barium hydroxide Inorganic materials 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N beta-hydroxynaphthyl Natural products C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000003444 phase transfer catalyst Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XGIDEUICZZXBFQ-UHFFFAOYSA-N 1h-benzimidazol-2-ylmethanethiol Chemical compound C1=CC=C2NC(CS)=NC2=C1 XGIDEUICZZXBFQ-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- VVHFXJOCUKBZFS-UHFFFAOYSA-N 2-(chloromethyl)-2-methyloxirane Chemical compound ClCC1(C)CO1 VVHFXJOCUKBZFS-UHFFFAOYSA-N 0.000 description 1
- SFRDXVJWXWOTEW-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)CO SFRDXVJWXWOTEW-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- JDZKDORFRNQOFO-UHFFFAOYSA-N N(C(=O)N)CCC[Si](N)(N)N Chemical compound N(C(=O)N)CCC[Si](N)(N)N JDZKDORFRNQOFO-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Images
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- Epoxy Resins (AREA)
Abstract
Description
本発明は、硬化物のガラス領域における線膨張係数が極めて低く寸法安定性に優れるエポキシ樹脂組成物に関する。 The present invention relates to an epoxy resin composition having a very low linear expansion coefficient in a glass region of a cured product and excellent dimensional stability.
エポキシ樹脂及びその硬化剤を必須成分とするエポキシ樹脂組成物は、その硬化物において優れた耐熱性と絶縁性を発現することから、半導体やプリント配線基板などの電子部品用途において広く用いられている。 An epoxy resin composition containing an epoxy resin and a curing agent as an essential component exhibits excellent heat resistance and insulation in the cured product, and is therefore widely used in electronic component applications such as semiconductors and printed wiring boards. .
この電子部品用途に適したエポキシ樹脂としては、ジヒドロキシナフタレンとエピクロルヒドリンとの縮合物であって、かつ、ジヒドロキシナフタレンジグリシジルエーテルを高含有率で含むエポキシ樹脂を用いる技術が知られている（下記、特許文献１参照）。かかるエポキシ樹脂は、その硬化物において優れた耐熱性、耐水性を発現する為に半導体封止材料などの電子部品用途に有用な材料である。しかしながら、例えば、液状封止材に好適に用いられるイミダゾール系硬化剤を配合した際の保存安定性が悪く、必ずしも満足できるレベルではなかった。一般にエポキシ樹脂の貯蔵安定性を改善するにはエポキシ樹脂自体の反応性を低下させればよいが、この場合、却って硬化性の低下を招いて前記エポキシ樹脂の特長である耐熱性を損なうものであった。 As an epoxy resin suitable for this electronic component application, a technique using an epoxy resin which is a condensate of dihydroxynaphthalene and epichlorohydrin and contains a high content of dihydroxynaphthalenediglycidyl ether is known (the following, Patent Document 1). Such an epoxy resin is a material useful for use in electronic parts such as a semiconductor sealing material in order to exhibit excellent heat resistance and water resistance in the cured product. However, for example, the storage stability when an imidazole-based curing agent suitably used for the liquid sealing material is blended is not satisfactory. In general, to improve the storage stability of the epoxy resin, the reactivity of the epoxy resin itself should be lowered. In this case, however, the curability is lowered and the heat resistance which is a feature of the epoxy resin is impaired. there were.
本発明が解決しようとする課題は、電子部品の絶縁材料として硬化物の耐熱性に優れ、かつ、貯蔵安定性に優れたエポキシ樹脂組成物、それらの硬化物、及びこれらの性能を与える新規エポキシ樹脂を提供することにある。 The problem to be solved by the present invention is an epoxy resin composition excellent in heat resistance of a cured product as an insulating material for electronic parts and excellent in storage stability, a cured product thereof, and a novel epoxy that provides these performances It is to provide a resin.
本発明者等は上記課題を解決すべく鋭意検討を重ねた結果、ジヒドロキシナフタレン類とエピハロヒドリンとを反応させて得られるエポキシ樹脂における末端基のα−グリコール量に着目し、これを特定範囲に調節することにより優れた貯蔵安定性と硬化物の高耐熱性とを兼備させることができることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have focused on the α-glycol amount of the terminal group in the epoxy resin obtained by reacting dihydroxynaphthalenes with epihalohydrin, and adjusted this to a specific range. As a result, it has been found that excellent storage stability and high heat resistance of the cured product can be combined, and the present invention has been completed.
即ち、本発明は、ジヒドロキシナフタレン類とエピハロヒドリンとを反応させて得られるエポキシ樹脂であって、該エポキシ樹脂中のα−グリコール量が０．００５〜０．０２５ミリ当量／ｇであるエポキシ樹脂（Ａ）、及び硬化剤（Ｂ）を必須成分とすることを特徴とするエポキシ樹脂組成物に関する。
本発明は、更に、上記エポキシ樹脂組成物を硬化させてなる硬化物に関する。
本発明は、更に、ジヒドロキシナフタレン類とエピハロヒドリンとを反応させて得られるエポキシ樹脂であって、該エポキシ樹脂中のα−グリコール量が０．００５〜０．０２５ミリ当量／ｇであることを特徴とする新規エポキシ樹脂に関する。
That is, the present invention is an epoxy resin obtained by reacting dihydroxynaphthalene and epihalohydrin, wherein the amount of α-glycol in the epoxy resin is 0.005 to 0.025 meq / g ( The present invention relates to an epoxy resin composition comprising A) and a curing agent (B) as essential components.
The present invention further relates to a cured product obtained by curing the epoxy resin composition.
The present invention further relates to an epoxy resin obtained by reacting dihydroxynaphthalene with epihalohydrin, wherein the amount of α-glycol in the epoxy resin is 0.005 to 0.025 meq / g. It relates to a novel epoxy resin.
本発明によれば、エポキシ樹脂硬化物自体の線膨張係数が著しく低く、電子部品の絶縁材料として硬化物の耐熱性に優れ、かつ、貯蔵安定性に優れたエポキシ樹脂組成物、その硬化物、及びこれらの性能を与える新規エポキシ樹脂を提供できる。 According to the present invention, the epoxy resin cured product itself has a remarkably low linear expansion coefficient, is excellent in the heat resistance of the cured product as an insulating material for electronic components, and has excellent storage stability, the cured product thereof, And a novel epoxy resin that provides these performances.
本発明で用いるエポキシ樹脂（Ａ）は、前記した通り、ジヒドロキシナフタレン類とエピハロヒドリンとを反応させて得られるエポキシ樹脂であって、該エポキシ樹脂中のα−グリコール量が０．００５〜０．０２５ミリ当量／ｇの範囲のものである。α−グリコール量が０．０２５ミリ当量／ｇを上回る場合、エポキシ樹脂自体の貯蔵安定性及びエポキシ樹脂組成物としての貯蔵安定性を著しく低下させるものとなる。一方、該エポキシ樹脂中のα−グリコール量が０．００５ミリ当量／ｇを下回る場合には、硬化性が低下し硬化物の耐熱性が低下する。このように本発明で用いるエポキシ樹脂（Ａ）は貯蔵安定性と耐熱性とのバランスに優れるという特徴を有する。かかる効果が顕著なものとなる点から、なかでもエポキシ樹脂（Ａ）中のα−グリコール量は０．００８〜０．０２０ミリ当量／ｇの範囲の範囲であることが好ましい。 As described above, the epoxy resin (A) used in the present invention is an epoxy resin obtained by reacting dihydroxynaphthalene and epihalohydrin, and the amount of α-glycol in the epoxy resin is 0.005 to 0.025. It is in the range of milliequivalent / g. When the amount of α-glycol exceeds 0.025 meq / g, the storage stability of the epoxy resin itself and the storage stability as an epoxy resin composition are significantly reduced. On the other hand, when the amount of α-glycol in the epoxy resin is less than 0.005 meq / g, the curability is lowered and the heat resistance of the cured product is lowered. As described above, the epoxy resin (A) used in the present invention has a feature of excellent balance between storage stability and heat resistance. From the standpoint that such effects become remarkable, it is preferable that the amount of α-glycol in the epoxy resin (A) is in the range of 0.008 to 0.020 meq / g.
ここで用いるジヒドロキシナフタレン類としては、具体的には、１，４−ジヒドロキシナフタレン、１，５−ジヒドロキシナフタレン、１，６−ジヒドロキシナフタレン、２，６−ジヒドロキシナフタレン、２，７−ジヒドロキシナフタレン、及びこれらのメチル基又はエチル基が核置換した化合物が挙げられる。これらの中でも特に低粘度で流動性に優れる点から、１，６−ジヒドロキシナフタレンが好ましい。 Specific examples of the dihydroxynaphthalene used here include 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, and Examples thereof include compounds in which these methyl groups or ethyl groups are substituted by a nucleus. Among these, 1,6-dihydroxynaphthalene is preferable from the viewpoint of low viscosity and excellent fluidity.
一方、これと反応させるエピハロヒドリンとしては、具体的には、エピクロルヒドリン、エピブロモヒドリン、β−メチルエピクロルヒドリン等が挙げられる。これらのなかでも特に、流動性、反応性の点からエピクロルヒドリンであることが好ましい。 On the other hand, specific examples of the epihalohydrin to be reacted therewith include epichlorohydrin, epibromohydrin, β-methylepichlorohydrin, and the like. Of these, epichlorohydrin is particularly preferred from the viewpoint of fluidity and reactivity.
ジヒドロキシナフタレン類とエピハロヒドリンとを反応させて得られる構造を有する前記エポキシ樹脂（Ａ）は、特にそのエポキシ当量は限定されるものではないが、エポキシ当量が大きくなる場合、硬化物中の架橋点間距離が長くなり、架橋密度の低下を招き易くなる。その為、前記エポキシ樹脂（Ａ）はエポキシ当量１３６〜１６０ｇ／ｅｑ．であることが、硬化物の線膨張係数をより低くすることができる点から好ましい。通常、エポキシ当量が低い場合、一般に組成物中の官能基濃度（エポキシ基）が高くなるため、貯蔵安定性を害することになるが、本発明ではエポキシ樹脂（Ａ）中のα−グリコール量を０．００５〜０．０２５ミリ当量／ｇなる範囲に調節することにより、エポキシ当量１３６〜１６０ｇ／ｅｑ．なる範囲に低減しても、優れた貯蔵安定性を発現させることができ、低線膨張係数と貯蔵安定性とのバランスを高度に兼備させることができる。特に、低線膨張係数と貯蔵安定性とのバランスが良好なものとなる点から前記エポキシ樹脂（Ａ）のエポキシ当量は１４０〜１５５ｇ／ｅｑ．の範囲であることが好ましい。 The epoxy resin (A) having a structure obtained by reacting dihydroxynaphthalene and epihalohydrin is not particularly limited in its epoxy equivalent, but when the epoxy equivalent is large, the epoxy resin has a structure between the crosslinking points in the cured product. The distance becomes longer, and the crosslink density tends to be lowered. Therefore, the epoxy resin (A) has an epoxy equivalent of 136 to 160 g / eq. It is preferable that the linear expansion coefficient of the cured product can be further reduced. Usually, when the epoxy equivalent is low, the functional group concentration (epoxy group) in the composition is generally high, which impairs storage stability. In the present invention, the amount of α-glycol in the epoxy resin (A) is reduced. By adjusting to the range of 0.005-0.025 meq / g, epoxy equivalent 136-160 g / eq. Even if it reduces to the range which consists of this, outstanding storage stability can be expressed, and the balance of a low linear expansion coefficient and storage stability can be combined highly. Particularly, the epoxy equivalent of the epoxy resin (A) is 140 to 155 g / eq. From the viewpoint that the balance between the low linear expansion coefficient and the storage stability is good. It is preferable that it is the range of these.
前記エポキシ樹脂（Ａ）は、更に、具体的には下記構造式１
The epoxy resin (A) is more specifically represented by the following
（式中、Ｘ１及びＸ２は、それぞれ独立的に下記構造式ａ
(Wherein X 1 and X 2 are each independently the following structural formula a
又は下記構造式ｂ
Or the following structural formula b
で表される構造であり、ｎは繰り返し単位で０以上の数である。）で表されるものであり、かつ、該構造式１中のｎ＝０体のＧＰＣ測定による含有率が９８〜８８面積％であって、前記構造式ｂで表される構造の含有率が０．００５〜０．０２５ミリ当量／ｇのものであることが貯蔵安定性、低線膨張係数に加え、硬化物の耐熱性、耐水性が良好なものとなる点から好ましい。
Where n is a repeating unit and is a number of 0 or more. And the content of the n = 0 body in the
ここで、ＧＰＣの測定条件は、具体的には下記の条件を採用することができる。
測定装置 ：東ソー株式会社製「ＨＬＣ−８２２０ ＧＰＣ」、
カラム：東ソー株式会社製ガードカラム「ＨＸＬ−Ｌ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ２０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ２０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ３０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ４０００ＨＸＬ」
検出器： ＲＩ（示差屈折径）
データ処理：東ソー株式会社製「ＧＰＣ−８０２０モデルIIバージョン４．１０」
測定条件： カラム温度 ４０℃
展開溶媒 テトラヒドロフラン
流速 １．０ｍｌ／分
標準 ： 前記「ＧＰＣ−８０２０モデルIIバージョン４．１０」の測定マニュアルに準拠して、分子量が既知の下記の単分散ポリスチレンを用いた。
（使用ポリスチレン）
東ソー株式会社製「Ａ−５００」
東ソー株式会社製「Ａ−１０００」
東ソー株式会社製「Ａ−２５００」
東ソー株式会社製「Ａ−５０００」
東ソー株式会社製「Ｆ−１」
東ソー株式会社製「Ｆ−２」
東ソー株式会社製「Ｆ−４」
東ソー株式会社製「Ｆ−１０」
東ソー株式会社製「Ｆ−２０」
東ソー株式会社製「Ｆ−４０」
東ソー株式会社製「Ｆ−８０」
東ソー株式会社製「Ｆ−１２８」
試料 ： 樹脂固形分換算で１．０質量％のテトラヒドロフラン溶液をマイクロフィルターでろ過したもの（５０μｌ）。
Here, specifically, the following conditions can be adopted as GPC measurement conditions.
Measuring device: “HLC-8220 GPC” manufactured by Tosoh Corporation
Column: Guard column “H XL -L” manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ Tosoh Corporation “TSK-GEL G3000HXL”
+ Tosoh Corporation “TSK-GEL G4000HXL”
Detector: RI (Differential refraction diameter)
Data processing: “GPC-8020 Model II version 4.10” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml / min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of “GPC-8020 Model II version 4.10”.
(Polystyrene used)
“A-500” manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
“F-1” manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
“F-4” manufactured by Tosoh Corporation
“F-10” manufactured by Tosoh Corporation
“F-20” manufactured by Tosoh Corporation
“F-40” manufactured by Tosoh Corporation
“F-80” manufactured by Tosoh Corporation
“F-128” manufactured by Tosoh Corporation
Sample: A 1.0 mass% tetrahydrofuran solution filtered in terms of resin solids and filtered through a microfilter (50 μl).
本発明で用いる前記エポキシ樹脂（Ａ）は、上記ジヒドロキシナフタレン類にエピクロルヒドリンを反応せしめることにより工業的に製造することができる。
例えば、
1)上記ジヒドロキシナフタレン類の水酸基の１モルに対し、エピクロルヒドリンを０．７〜１０モル添加し、塩基性触媒の存在下に２０〜１２０℃で２〜７時間エポキシ化反応を行う方法、
2)上記ジヒドロキシナフタレン類とエピクロルヒドリンとを４級アンモニウム塩の存在下に５０〜１５０℃で１〜５時間反応させてクロルヒドリンエーテルを得、次いで、これに、アルカリ金属水酸化物の固体または水溶液を加え、再び２０〜１２０℃で１〜１０時間反応させ脱ハロゲン化水素（閉環）させる方法が挙げられる。
上記方法１）で用いる塩基性触媒は、例えば、水酸化カリウム、水酸化ナトリウム、水酸化バリウム、酸化マグネシウム、炭酸ナトリウム、炭酸カリウム等が挙げられるが、中でも水酸化カリウム又は水酸化ナトリウムが好ましい。
また、上記方法２）で用いる４級アンモニウム塩は、テトラメチルアンモニウムクロライド、テトラメチルアンモニウムブロマイド、トリメチルベンジルアンモニウムクロライド等が挙げられる。
The said epoxy resin (A) used by this invention can be manufactured industrially by making epichlorohydrin react with the said dihydroxynaphthalene.
For example,
1) A method in which 0.7 to 10 mol of epichlorohydrin is added to 1 mol of a hydroxyl group of the dihydroxynaphthalene and an epoxidation reaction is performed at 20 to 120 ° C. for 2 to 7 hours in the presence of a basic catalyst,
2) The above-mentioned dihydroxynaphthalene and epichlorohydrin are reacted in the presence of a quaternary ammonium salt at 50 to 150 ° C. for 1 to 5 hours to obtain a chlorohydrin ether, which is then added to an alkali metal hydroxide solid or A method of adding an aqueous solution and reacting again at 20 to 120 ° C. for 1 to 10 hours to dehydrohalogenate (ring closure) can be mentioned.
Examples of the basic catalyst used in the above method 1) include potassium hydroxide, sodium hydroxide, barium hydroxide, magnesium oxide, sodium carbonate, potassium carbonate and the like, among which potassium hydroxide or sodium hydroxide is preferable.
Examples of the quaternary ammonium salt used in the above method 2) include tetramethylammonium chloride, tetramethylammonium bromide, and trimethylbenzylammonium chloride.
方法２）におけるアルカリ金属水酸化物は、具体的には、水酸化カリウム、水酸化ナトリウム、水酸化バリウム等が挙げられ、その使用量は粗エポキシ樹脂中に残存する加水分解性塩素１モルに対して、通常０．５〜１０モル、好ましくは１．２〜５．０モルである。反応温度としては通常５０〜１２０℃、反応時間としては通常０．５〜３時間である。反応速度の向上を目的として、４級アンモニウム塩やクラウンエーテル等の相関移動触媒を存在させてもよい。相関移動触媒を使用する場合のその使用量としては、粗エポキシ樹脂に対して０．１〜３．０質量％の範囲であることが好ましい。 Specific examples of the alkali metal hydroxide in method 2) include potassium hydroxide, sodium hydroxide, barium hydroxide and the like, and the amount used is 1 mol of hydrolyzable chlorine remaining in the crude epoxy resin. On the other hand, it is 0.5-10 mol normally, Preferably it is 1.2-5.0 mol. The reaction temperature is usually 50 to 120 ° C., and the reaction time is usually 0.5 to 3 hours. For the purpose of improving the reaction rate, a phase transfer catalyst such as a quaternary ammonium salt or crown ether may be present. When the phase transfer catalyst is used, the amount used is preferably in the range of 0.1 to 3.0% by mass with respect to the crude epoxy resin.
また、前記方法１）又は方法２）において、反応を円滑に進行させるためにメタノール、エタノール、イソプロピルアルコール、ブタノールなどのアルコール類；アセトン、メチルエチルケトンなどのケトン類；ジオキサンなどのエーテル類；ジメチルスルホン、ジメチルスルホキシド等の非プロトン性極性溶媒などを添加して反応を行うことが好ましい。溶媒を使用する場合のその使用量としては、エピクロルヒドリンの使用量に対し通常５〜５０質量％、好ましくは１０〜３０質量％である。また非プロトン性極性溶媒を用いる場合はエピクロルヒドリンの量に対し通常５〜１００質量％、好ましくは１０〜６０質量％である。 In the method 1) or method 2), alcohols such as methanol, ethanol, isopropyl alcohol and butanol; ketones such as acetone and methyl ethyl ketone; ethers such as dioxane; dimethyl sulfone; The reaction is preferably carried out by adding an aprotic polar solvent such as dimethyl sulfoxide. The amount of the solvent used is usually 5 to 50% by mass, preferably 10 to 30% by mass, based on the amount of epichlorohydrin used. Moreover, when using an aprotic polar solvent, it is 5-100 mass% normally with respect to the quantity of epichlorohydrin, Preferably it is 10-60 mass%.
そして、エポキシ樹脂（Ａ）中のα−グリコール量を０．００５〜０．０２５ミリ当量／ｇの範囲に調整する方法は、具体的には、上記１）又は２）の反応において、反応系内の水分量を制御しながら行う方法が挙げられる。即ち、反応系内の水分量低減させながら反応を行うことにより、エピクロルヒドリンのグリシドール化を防ぐと共に、生成したエポキシ基の加水分解を防止することができ、最終的なエポキシ樹脂（Ａ）中のα−グリコール量を前記範囲に調整することできる。 The method for adjusting the amount of α-glycol in the epoxy resin (A) to the range of 0.005 to 0.025 meq / g is specifically the reaction system in the reaction 1) or 2) above. The method of performing while controlling the moisture content in the inside is mentioned. That is, by carrying out the reaction while reducing the amount of water in the reaction system, epichlorohydrin can be prevented from being glycidolated, and hydrolysis of the generated epoxy group can be prevented, and α in the final epoxy resin (A) can be prevented. -The amount of glycol can be adjusted to the said range.
反応終了後、生成した塩を濾過、水洗などにより除去し、更に、加熱減圧下トルエン、メチルイソブチルケトンなどの溶剤を留去することにより目的とするエポキシ樹脂（Ａ）を得ることができる。 After completion of the reaction, the produced salt is removed by filtration, washing with water and the like, and the target epoxy resin (A) can be obtained by distilling off a solvent such as toluene and methyl isobutyl ketone under heating and reduced pressure.
また、前記エポキシ樹脂（Ａ）は、前記した通り、構造式１中におけるｎ＝０体のＧＰＣ測定による含有率が９８〜８８面積％となるものであることが、耐熱性、耐水性に優れる硬化物を与える点から好ましい。このように前記エポキシ樹脂（Ａ）中の構造式１中におけるｎ＝０体の含有率を向上させるには、ジヒドロキシナフタレン類とエピクロルヒドリンとの反応において、エピクロルヒドリンのモル数の過剰率をできるだけ高くすることが好ましく、具体的には、ジヒドロキシナフタレン１モルに対するエピクロルヒドリンのモル数を４〜１０モルの範囲でエポキシ化反応を行うことが好ましい。或いは、ジヒドロキシナフタレン類とエピクロルヒドリンとの縮合を行って得られた、オリゴマー成分を多量に含有するエポキシ樹脂について分子蒸留又は再結晶を行ってジヒドロキシナフタレンジグリシジルエーテルの含有率を高める方法を用いてもよい。
Moreover, as above-mentioned, it is excellent in heat resistance and water resistance that the said epoxy resin (A) is what becomes the content rate by GPC measurement of n = 0 body in
次に、本発明で用いる硬化剤（Ｂ）は、具体的には、例えば、アミン系化合物、アミド系化合物、酸無水物系化合物、フェノ−ル系化合物などが挙げられる。 Next, specific examples of the curing agent (B) used in the present invention include amine compounds, amide compounds, acid anhydride compounds, phenol compounds, and the like.
具体的には、アミン系化合物は、ジアミノジフェニルメタン、ジエチレントリアミン、トリエチレンテトラミン、ジアミノジフェニルスルホン、イソホロンジアミン、イミダゾ−ル、ＢＦ３−アミン錯体、グアニジン誘導体等が挙げられる。
アミド系化合物は、ジシアンジアミド、リノレン酸の２量体とエチレンジアミンとより合成されるポリアミド樹脂等が挙げられる。
Specifically, examples of the amine compound include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF 3 -amine complex, and guanidine derivatives.
Examples of the amide compounds include polyamide resins synthesized from dimer of dicyandiamide and linolenic acid and ethylenediamine.
酸無水物系化合物としては、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、無水マレイン酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、ヘキサヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸等が挙げられる。 Acid anhydride compounds include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydro And phthalic anhydride.
フェノール系化合物は、フェノールノボラック樹脂、クレゾールノボラック樹脂、芳香族炭化水素ホルムアルデヒド樹脂変性フェノール樹脂、ジシクロペンタジエンフェノール付加型樹脂、フェノールアラルキル樹脂、α−ナフトールアラルキル樹脂、β−ナフトールアラルキル樹脂、ビフェニルアラルキル樹脂、トリメチロールメタン樹脂、テトラフェニロールエタン樹脂、ナフトールノボラック樹脂、ナフトール−フェノール共縮ノボラック樹脂、ナフトール−クレゾール共縮ノボラック樹脂、アミノトリアジン変性フェノール樹脂等が挙げられる。また、前記アミノトリアジン変性フェノール樹脂は、具体的には、メラミンやベンゾグアナミン等のアミノ基含有トリアジン化合物と、フェノール、クレゾール等のフェノール類と、ホルムアルデヒドとの共重合体が挙げられる。 Phenol compounds include phenol novolac resin, cresol novolac resin, aromatic hydrocarbon formaldehyde resin modified phenol resin, dicyclopentadiene phenol addition resin, phenol aralkyl resin, α-naphthol aralkyl resin, β-naphthol aralkyl resin, biphenyl aralkyl resin. , Trimethylolmethane resin, tetraphenylolethane resin, naphthol novolak resin, naphthol-phenol co-condensed novolak resin, naphthol-cresol co-condensed novolak resin, aminotriazine-modified phenol resin, and the like. Specific examples of the aminotriazine-modified phenol resin include copolymers of formaldehyde and amino group-containing triazine compounds such as melamine and benzoguanamine, phenols such as phenol and cresol, and formaldehyde.
これらの中でも、特に、硬化物の線膨張係数がより低くなり、熱的衝撃及び物理的衝撃に強く靱性に優れる点から多価フェノール系化合物が好ましく、フェノールノボラック樹脂、クレゾールノボラック樹脂、フェノールアラルキル樹脂、α−ナフトールアラルキル樹脂、β−ナフトールアラルキル樹脂、ビフェニルアラルキル樹脂、アミノトリアジン変性フェノール樹脂が好ましい。 Among these, polyhydric phenol compounds are particularly preferred because the linear expansion coefficient of the cured product is lower, and they are resistant to thermal and physical impacts and are excellent in toughness. Phenol novolac resins, cresol novolac resins, phenol aralkyl resins Α-naphthol aralkyl resin, β-naphthol aralkyl resin, biphenyl aralkyl resin, and aminotriazine-modified phenol resin are preferable.
本発明のエポキシ樹脂組成物において、硬化剤（Ｂ）として前記フェノール性水酸基を１分子内に２つ以上含有する多価フェノール系化合物を用いる場合には、前記ビスフェノール型エポキシ樹脂（Ａ）中のエポキシ基と、硬化剤（Ｂ）中のフェノール性水酸基との比率が、前者のエポキシ基／後者のフェノール性水酸基のモル比で０．９５〜１．０５となる配合割合であることが、線膨張係数が極めて低く、熱的衝撃／物理的衝撃に強い強靭な硬化物を得ることができる点から好ましい。 In the epoxy resin composition of the present invention, when a polyhydric phenol compound containing two or more phenolic hydroxyl groups in one molecule is used as the curing agent (B), the bisphenol-type epoxy resin (A) contains It is a line that the ratio of the epoxy group and the phenolic hydroxyl group in the curing agent (B) is 0.95 to 1.05 in terms of the molar ratio of the former epoxy group / the latter phenolic hydroxyl group. It is preferable from the viewpoint that a tough cured product having an extremely low expansion coefficient and strong against thermal shock / physical shock can be obtained.
上記したとおり、本発明のエポキシ樹脂組成物は、前記ビスフェノール型エポキシ樹脂（Ａ）、及び硬化剤（Ｂ）を必須成分とするものであるが、これらの各成分に加え、３官能以上のエポキシ樹脂を用いることが、硬化性に優れ、かつ、硬化物の耐湿性及び耐熱性が良好となる点から好ましい。 As described above, the epoxy resin composition of the present invention comprises the bisphenol-type epoxy resin (A) and the curing agent (B) as essential components, but in addition to these components, a trifunctional or higher functional epoxy. It is preferable to use a resin from the viewpoints of excellent curability and good moisture resistance and heat resistance of the cured product.
上記したとおり、本発明のエポキシ樹脂組成物は、前記エポキシ樹脂（Ａ）、及び硬化剤（Ｂ）を必須成分とするものであるが、これらの各成分に加え、３官能以上のエポキシ樹脂を用いることが、硬化性に優れ、かつ、硬化物の耐湿性及び耐熱性が良好となる点から好ましい。例えば、ビルドアップフィルムとして用いる場合、３官能以上のエポキシ樹脂を併用することにより、硬化物の破断強度を向上させ、また硬化物の架橋密度を向上させることができ、無機充填材を３５質量％以上充填させても粗化処理後の硬化物表面に無機充填材が剥き出しになるのを抑制し、安定して高いめっきピール強度を得ることができる。 As described above, the epoxy resin composition of the present invention contains the epoxy resin (A) and the curing agent (B) as essential components. In addition to these components, a trifunctional or higher functional epoxy resin is used. It is preferable to use from the viewpoints of excellent curability and good moisture resistance and heat resistance of the cured product. For example, when used as a build-up film, by using a trifunctional or higher functional epoxy resin in combination, the breaking strength of the cured product can be improved, and the crosslinking density of the cured product can be improved, and the inorganic filler is 35% by mass. Even if it fills above, it can suppress that an inorganic filler will be exposed to the hardened | cured material surface after a roughening process, and can obtain high plating peel strength stably.
ここで用いる３官能以上のエポキシ樹脂は、例えば、フェノール類とフェノール性水酸基を有する芳香族アルデヒドとの縮合物のエポキシ化物、及び、
下記構造式
The trifunctional or higher functional epoxy resin used here is, for example, an epoxidized product of a condensation product of a phenol and an aromatic aldehyde having a phenolic hydroxyl group, and
The following structural formula
で表される４官能ナフタレン型エポキシ樹脂が挙げられる。
The tetrafunctional naphthalene type epoxy resin represented by these is mentioned.
本発明のエポキシ樹脂組成物におけるビスフェノール型エポキシ樹脂（Ａ）と３官能以上のエポキシ樹脂（Ａ’）との配合割合は、成分（Ａ）／成分（Ａ’）の質量比で、１／０．１〜１／２の範囲、特に１／０．３〜１／１の範囲であることが、特にビルドアップフィルムを製造する場合の組成物の粘着性が適度に抑えられ、真空ラミネート時の脱気性が良好でボイドの発生を防止できる点から好ましい。 The blending ratio of the bisphenol type epoxy resin (A) and the tri- or higher functional epoxy resin (A ′) in the epoxy resin composition of the present invention is 1/0 in terms of mass ratio of component (A) / component (A ′). The range of 1 to 1/2, especially 1 / 0.3 to 1/1, can suppress the adhesiveness of the composition particularly when producing a build-up film, and is suitable for vacuum lamination. This is preferable from the viewpoint of good deaeration and prevention of voids.
また、エポキシ樹脂成分として前記エポキシ樹脂（Ａ’）を併用する場合であって、かつ、硬化剤（Ｂ）として前記フェノール性水酸基を１分子内に２つ以上含有する多価フェノール系化合物を用いる場合には、前記硬化剤（Ｂ）中のフェノール性水酸基のモル数に対して、成分（Ａ）及び成分（Ａ’）中のエポキシ基の総モル数の比（エポキシ基／フェノール性水酸基）が０．９５〜１．０５となる範囲であることが好ましい。 Moreover, it is a case where the said epoxy resin (A ') is used together as an epoxy resin component, and the polyhydric phenol type compound which contains two or more of the said phenolic hydroxyl groups in 1 molecule as a hardening | curing agent (B) is used. In this case, the ratio of the total number of moles of epoxy groups in component (A) and component (A ′) to the number of moles of phenolic hydroxyl group in the curing agent (B) (epoxy group / phenolic hydroxyl group) Is preferably in the range of 0.95 to 1.05.
本発明のエポキシ樹脂組成物は、上記した各成分に加え、更に、硬化促進剤（Ｃ）を併用してもよい。 The epoxy resin composition of the present invention may further contain a curing accelerator (C) in addition to the components described above.
ここで使用し得る硬化促進剤（Ｃ）は、例えば、リン系化合物、第３級アミン、イミダゾール、有機酸金属塩、ルイス酸、アミン錯塩等が挙げられる。この中でも、硬化物の低線膨張係数化の効果が顕著なものとなる点からイミダゾール類が好ましい。 Examples of the curing accelerator (C) that can be used here include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like. Among these, imidazoles are preferable because the effect of reducing the linear expansion coefficient of the cured product becomes remarkable.
また、硬化促進剤（Ｃ）の添加量は、目標とする硬化時間等によって適宜調整することができるが、前記したエポキシ樹脂成分、硬化剤成分及び前記硬化促進剤（Ｃ）の総質量に対して０．１〜７質量％となる範囲であることが好ましい。 Moreover, although the addition amount of a hardening accelerator (C) can be suitably adjusted with the target hardening time etc., with respect to the total mass of an above-described epoxy resin component, a hardening | curing agent component, and the said hardening accelerator (C). Is preferably in the range of 0.1 to 7% by mass.
上記したとおり、本発明のエポキシ樹脂組成物は、前記エポキシ樹脂（Ａ）、及び、前記硬化剤（Ｂ）を必須成分とするものであるが、これらの各成分に加え、更に、エポキシ樹脂成分として、３官能以上のエポキシ樹脂（Ａ’）を用いることが、硬化性に優れ、かつ、硬化物の耐湿性及び耐熱性が良好となる点から好ましい。特に、前記したビルドアップフィルムとして用いる場合、３官能以上のエポキシ樹脂を併用することが、硬化物の破断強度を向上させ、また硬化物の架橋密度を向上させて、無機充填材を３５質量％以上の高充填させても粗化処理後の硬化物表面に無機充填材が剥き出しになるのを抑制し、安定して高いめっきピール強度を得ることができる点からから好ましい。 As described above, the epoxy resin composition of the present invention comprises the epoxy resin (A) and the curing agent (B) as essential components. In addition to these components, the epoxy resin component It is preferable to use a tri- or higher functional epoxy resin (A ′) from the viewpoint of excellent curability and good moisture resistance and heat resistance of the cured product. In particular, when used as the above-described buildup film, the use of a trifunctional or higher functional epoxy resin improves the breaking strength of the cured product and improves the crosslink density of the cured product, so that the inorganic filler is 35% by mass. Even if it carries out the above high filling, it is preferable from the point which can suppress that an inorganic filler exposes on the hardened | cured material surface after a roughening process, and can obtain high plating peel strength stably.
本発明のエポキシ樹脂組成物は、用途に応じて、上記した各成分に加え、更に有機溶剤（Ｄ）を使用することができる。例えば、エポキシ樹脂組成物を積層板用ワニスとして用いる場合には基材への含浸性が改善される他、ビルドアップ用接着フィルムとして用いる場合には、基材シートへの塗工性が良好になる。ここで使用し得る有機溶剤（Ｄ）は、例えば、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン類、酢酸エチル、酢酸ブチル、セロソルブアセテート、プロピレングリコールモノメチルエーテルアセテート、カルビトールアセテート等の酢酸エステル類、セロソルブ、ブチルカルビトール等のカルビトール類、トルエン、キシレン等の芳香族炭化水素類、ジメチルホルムアミド、ジメチルアセトアミド、Ｎ−メチルピロリドン等が挙げられる。 The epoxy resin composition of the present invention can further use an organic solvent (D) in addition to the above-described components depending on the application. For example, when the epoxy resin composition is used as a varnish for a laminated board, the impregnation property to the base material is improved, and when used as an adhesive film for buildup, the coating property to the base material sheet is good. Become. Examples of the organic solvent (D) that can be used here include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, and acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate. , Carbitols such as cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone and the like.
本発明のエポキシ樹脂組成物は、上記した各成分に加え、更に無機質充填材（Ｅ）を使用することができる。この無機質充填材（Ｅ）は、具体的には、溶融シリカ、結晶シリカ、アルミナ、窒化珪素、窒化アルミ等が挙げられる。無機質充填材の配合量を特に大きくする場合は、溶融シリカを用いることが好ましい。溶融シリカは、破砕状、球状のいずれでも使用可能であるが、溶融シリカの配合量を高め、且つ成形材料の溶融粘度の上昇を抑えるためには、球状のものを主に用いる方が好ましい。更に、球状シリカの配合量を高めるためには、球状シリカの粒度分布がより広くなるように調製することが好ましい。ここで無機質充填材（Ｅ）の使用量は、用途に応じ適宜選択することができるが、例えば、前記したビルドアップフィルムに用いる場合、該無機質充填材（Ｅ）の使用量を増加させた場合には、硬化物の線膨張係数は低くなるものの、めっき層との接着性が低下する傾向にある。本発明のエポキシ樹脂組成物は、その硬化物が顕著に低い線膨張係数を示すことから無機質充填材（Ｅ）の使用量を低く抑えることができる。かかる観点から無機質充填材（Ｅ）の使用量は、エポキシ樹脂組成物中２０〜８０質量％であることが好ましい。 The epoxy resin composition of the present invention can further use an inorganic filler (E) in addition to the above-described components. Specific examples of the inorganic filler (E) include fused silica, crystalline silica, alumina, silicon nitride, and aluminum nitride. When particularly increasing the blending amount of the inorganic filler, it is preferable to use fused silica. The fused silica can be used in either a crushed shape or a spherical shape, but in order to increase the blending amount of the fused silica and to suppress an increase in the melt viscosity of the molding material, it is preferable to mainly use a spherical shape. Furthermore, in order to increase the compounding amount of the spherical silica, it is preferable to prepare so that the particle size distribution of the spherical silica becomes wider. Here, the amount of the inorganic filler (E) used can be appropriately selected according to the application. For example, when used for the above-described buildup film, the amount of the inorganic filler (E) used is increased. However, although the linear expansion coefficient of hardened | cured material becomes low, it exists in the tendency for adhesiveness with a plating layer to fall. The epoxy resin composition of the present invention can keep the amount of the inorganic filler (E) used low because the cured product exhibits a significantly low linear expansion coefficient. From this viewpoint, the amount of the inorganic filler (E) used is preferably 20 to 80% by mass in the epoxy resin composition.
また、本発明のエポキシ樹脂組成物は、必要に応じて、難燃剤、シランカップリング剤、離型剤、顔料等の種々の配合剤を添加することができる。 Moreover, the epoxy resin composition of this invention can add various compounding agents, such as a flame retardant, a silane coupling agent, a mold release agent, and a pigment, as needed.
ここで、難燃剤としては、ハロゲン化合物、燐原子含有化合物や窒素原子含有化合物や無機系難燃化合物などが挙げられる。具体的には、テトラブロモビスフェノールＡ型エポキシ樹脂などのハロゲン化合物、赤燐、燐酸エステル化合物などの燐原子含有化合物、メラミンなどの窒素原子含有化合物、水酸化アルミニウム、水酸化マグネシウム、硼酸亜鉛、硼酸カルシウムなどの無機系難燃化合物が挙げられる。 Here, examples of the flame retardant include a halogen compound, a phosphorus atom-containing compound, a nitrogen atom-containing compound, and an inorganic flame retardant compound. Specifically, halogen compounds such as tetrabromobisphenol A type epoxy resin, phosphorus atom-containing compounds such as red phosphorus and phosphate ester compounds, nitrogen atom-containing compounds such as melamine, aluminum hydroxide, magnesium hydroxide, zinc borate, boric acid Examples include inorganic flame retardant compounds such as calcium.
本発明のエポキシ樹脂組成物は、上記した各成分を均一に混合することにより得られ、接着剤、塗料、半導体封止材料、回路基板材、複合材料、及びビルドアップフィルム等の各種の用途に適用できる。 The epoxy resin composition of the present invention is obtained by uniformly mixing the above-described components, and is used for various applications such as adhesives, paints, semiconductor sealing materials, circuit board materials, composite materials, and build-up films. Applicable.
例えば、無溶剤型の接着剤や塗料や半導体封止材料を調整するには、当該エポキシ樹脂を含む、硬化剤及び、必要に応じて無機充填材などの成分を、予備混合した後に、撹拌混合機や押出機、ニ−ダ、ロ−ル等を用いて均一になるまで充分に混合して製造することができる。これらの用途において無機充填材（Ｅ）の使用量は通常、充填率３０〜９５質量％となる範囲である。 For example, to prepare solvent-free adhesives, paints, and semiconductor sealing materials, pre-mix components such as curing agents and inorganic fillers as needed, including the epoxy resin, followed by stirring and mixing. It can be produced by sufficiently mixing until uniform using a machine, an extruder, a kneader, a roll or the like. In these applications, the amount of the inorganic filler (E) used is usually in a range where the filling rate is 30 to 95% by mass.
また、本発明のエポキシ樹脂組成物を半導体封止材料に用いる場合、添加剤として、２−メルカプトメチルベンズイミダゾール、又は、２−メルカプトベンズイミダゾールを半導体封止用エポキシ樹脂組成物全量に対して０．０１〜３質量％含有させることが、半導体封止材料の硬化物の金属に対する密着性を向上させることができる点から好ましい。 Moreover, when using the epoxy resin composition of this invention for a semiconductor sealing material, as an additive, 2-mercaptomethylbenzimidazole or 2-mercaptobenzimidazole is 0 with respect to the epoxy resin composition for semiconductor sealing whole quantity. It is preferable to make it contain 0.01-3 mass% from the point which can improve the adhesiveness with respect to the metal of the hardened | cured material of a semiconductor sealing material.
半導体封止材料の用途では、更に、エポキシ樹脂組成物に、シランカップリング剤やチタネートカップリング剤を配合させることができる。ここで、シランカップリング剤としては、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルトリエトキシシラン、β−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン等のエポキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルトリメトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルトリメトキシシラン、γ−ウレイドプロピルトリエトキシシラン等のアミノシラン、３−メルカプトプロピルトリメトキシシラン等のメルカプトシラン、ｐ−スチリルトリメトキシシラン、ビニルトリクロルシラン、ビニルトリス（β−メトキシエトキシ）シラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン等のビニルシラン、さらに、エポキシ系、アミノ系、ビニル系の高分子タイプのシラン等が挙げられる。 In the application of the semiconductor sealing material, a silane coupling agent or a titanate coupling agent can be further added to the epoxy resin composition. Here, as the silane coupling agent, epoxy silane such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ, -Aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ-ureidopropyltri Aminosilane such as ethoxysilane, mercaptosilane such as 3-mercaptopropyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltrimethoxysilane, vinyltriethoxysila And vinyl silanes such as γ-methacryloxypropyltrimethoxysilane, and epoxy, amino and vinyl polymer type silanes.
一方、チタネートカップリング剤としては、イソプロピルトリイソステアロイルチタネート、イソプロピルトリ（Ｎ−アミノエチル・アミノエチル）チタネート、ジイソプロピルビス（ジオクチルホスフェート）チタネート、テトライソプロピルビス（ジオクチルホスファイト）チタネート、テトラオクチルビス（ジトリデシルホスファイト）チタネート、テトラ（２，２−ジアリルオキシメチル−１−ブチル）ビス（ジトリデシル）ホスファイトチタネート、ビス（ジオクチルパイロホスフェート）オキシアセテートチタネート、ビス（ジオクチルパイロホスフェート）エチレンチタネート等が挙げられる。 On the other hand, titanate coupling agents include isopropyl triisostearoyl titanate, isopropyl tri (N-aminoethyl / aminoethyl) titanate, diisopropyl bis (dioctyl phosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis ( Ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, bis (dioctyl pyrophosphate) ethylene titanate It is done.
これらのカップリング剤は、単独で使用しても良いし、２種類以上を混合して使用することもできる。このときカップリング剤は、エポキシ樹脂組成物全量に対して０．１〜１質量％、あるいは無機質充填材（Ｅ）に対して０．３〜２質量％となる範囲であることが好ましい。 These coupling agents may be used alone or in combination of two or more. At this time, it is preferable that a coupling agent is 0.1-1 mass% with respect to an epoxy resin composition whole quantity, or the range used as 0.3-2 mass% with respect to an inorganic filler (E).
さらに、半導体封止材料用途では、着色目的で使用される顔料をはじめとして、分散剤、乳化剤、難燃剤、低弾性化剤、カーボンブラック等の着色剤、希釈剤、消泡剤、イオントラップ剤等の各種添加剤を配合してもよい。 Furthermore, for semiconductor encapsulating materials, pigments used for coloring purposes, dispersants, emulsifiers, flame retardants, low elastic agents, colorants such as carbon black, diluents, antifoaming agents, ion trapping agents You may mix | blend various additives, such as.
そして、上記各成分から半導体封止材料を調製には、上記各成分を撹拌型分散機、ビーズミル、３本ロールにより混合する方法が挙げられる。 And preparation of the semiconductor sealing material from each said component includes the method of mixing said each component with a stirring type disperser, bead mill, and 3 rolls.
また、溶剤型の接着剤、塗料、銅張り積層板、ビルドアップ基板、繊維強化複合材料用のエポキシ樹脂組成物を調整するには、本発明のエポキシ樹脂成分、硬化剤成分、硬化促進剤、及び、必要により難燃剤等をトルエン、キシレン、アセトン、メチルエチルケトン、メチルイソブチルケトン等の有機溶剤（Ｄ）に溶解させることにより製造することができる。この際の溶剤の使用量は、前記組成物ワニス中、１０〜７０質量％となる範囲であることが好ましい。 In addition, in order to adjust the epoxy resin composition for solvent-type adhesives, paints, copper-clad laminates, build-up substrates, fiber reinforced composite materials, the epoxy resin component, curing agent component, curing accelerator of the present invention, And if needed, a flame retardant etc. can be manufactured by dissolving in organic solvents (D), such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone. The amount of the solvent used in this case is preferably in the range of 10 to 70% by mass in the composition varnish.
この様にして得られた本発明のエポキシ樹脂組成物を硬化させるには、例えば、塗料用途の場合、上記の様にして調整された塗料を基材に塗布して、それを１５〜２００℃の環境で５分間〜１週間放置することによって、目的の塗膜硬化物を得ることができる。
また、接着剤の場合は、それを用いて基材を接着後、塗料と同様にして硬化させればよい。封止材硬化物は、該組成物を注型、或いはトランスファ−成形機、射出成形機などを用いて成形し、さらに８０〜２００℃で２〜１０時間に加熱することにより硬化物を得ることができる。
In order to cure the epoxy resin composition of the present invention thus obtained, for example, in the case of a coating application, the coating material prepared as described above is applied to a substrate, and the coating is applied at 15 to 200 ° C. The desired cured film can be obtained by leaving it for 5 minutes to 1 week in this environment.
In the case of an adhesive, the substrate may be bonded using the adhesive and then cured in the same manner as the paint. The cured encapsulant is obtained by molding the composition using a casting, transfer molding machine, injection molding machine or the like, and further heating at 80 to 200 ° C. for 2 to 10 hours. Can do.
また、回路基板材や複合材料用のワニス組成物の硬化物は積層物であり、この硬化物を得る方法としては、回路基板用ワニスをガラス繊維、カーボン繊維、ポリエステル繊維、ポリアミド繊維、アルミナ繊維、紙などの基材に含浸させ加熱乾燥してプリプレグを得て、それを熱プレス成形して得ることができる。 Moreover, the hardened | cured material of the varnish composition for circuit board materials and a composite material is a laminated body, As a method of obtaining this hardened | cured material, glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber is used for the varnish for circuit boards. It can be obtained by impregnating a substrate such as paper and drying by heating to obtain a prepreg, which is then hot press molded.
また製品形態としては、タブレット、ワニス、ペースト、パウダー、プリプレグ、フィルム或いはテープ（基材付き/無し、離型材付き/無し）、及び１液系でも２液系の何れでも構わない。 The product form may be tablet, varnish, paste, powder, prepreg, film or tape (with / without base material, with / without release material), and one-component or two-component system.
また、本発明のエポキシ樹脂組成物からビルドアップ用接着フィルムを製造する方法は、例えば、本発明のエポキシ樹脂組成物を、支持フィルム上に塗布し樹脂組成物層を形成させて多層プリント配線板用の接着フィルムとする方法が挙げられる。 The method for producing an adhesive film for buildup from the epoxy resin composition of the present invention is, for example, a multilayer printed wiring board in which the epoxy resin composition of the present invention is applied on a support film to form a resin composition layer. And an adhesive film for use.
次に、繊維からなるシート状補強基材に本発明のエポキシ該樹脂組成物を含浸させて多層プリント配線板の層間絶縁層用のプリプレグを製造する方法は、例えば、本発明のエポキシ樹脂組成物を繊維からなるシート状補強基材にホットメルト法又はソルベント法により含浸させ、加熱により半硬化させることにより製造する方法が挙げられる。ここで使用し得る繊維からなるシート状補強基材としては、例えばガラスクロスやアラミド繊維等が挙げられる。 Next, a method for producing a prepreg for an interlayer insulating layer of a multilayer printed wiring board by impregnating a sheet-like reinforcing substrate made of fibers with the epoxy resin composition of the present invention includes, for example, the epoxy resin composition of the present invention. There is a method in which a sheet-like reinforcing substrate made of fiber is impregnated by a hot melt method or a solvent method and semi-cured by heating. Examples of the sheet-like reinforcing substrate made of fibers that can be used here include glass cloth and aramid fibers.
次に上記プリプレグを用いて多層プリント配線板を製造する方法は、例えば回路基板に本発明のプリプレグを１枚あるいは必要により数枚重ね、離型フィルムを介して金属プレートを挟み加圧・加熱条件下でプレス積層する方法が挙げられる。圧力条件は具体的には５〜４０ｋｇｆ／ｃｍ２、温度は１２０〜２００℃で２０〜１００分の範囲であることが好ましい。また接着フィルムと同様に真空ラミネート法により回路基板にラミネートした後、加熱硬化することによっても製造可能である。その後、前に記載した方法と同様、酸化剤により硬化したプリプレグ表面を粗化した後、導体層をめっきにより形成して多層プリント配線板を製造することができる。 Next, a method for producing a multilayer printed wiring board using the above prepreg includes, for example, one or several prepregs of the present invention on a circuit board, and a metal plate sandwiched between release films and pressurizing / heating conditions. The method of carrying out press lamination below is mentioned. Specifically, the pressure condition is preferably 5 to 40 kgf / cm 2 , and the temperature is preferably 120 to 200 ° C. for 20 to 100 minutes. Moreover, it can also be manufactured by laminating on a circuit board by a vacuum laminating method as in the case of an adhesive film, and then curing by heating. Thereafter, similar to the method described above, the surface of the prepreg cured with an oxidizing agent is roughened, and then a conductor layer is formed by plating to produce a multilayer printed wiring board.
以上の各種用途のなかでも、本発明では、特に、半導体封止材、及び、ビルドアップ用接着フィルムがとりわけ有用である。 Among the various uses described above, the semiconductor encapsulant and the build-up adhesive film are particularly useful in the present invention.
以下、実施例により本発明を詳細に説明する。各実施例及び比較例における評価方法は以下の通りである。
［貯蔵安定性］
各エポキシ樹脂１００部に２−エチル−４−メチルイミダゾールを２部配合し、素早く攪拌し相溶させた。配合した組成物をサンプル瓶に入れ、-２５℃にて保管し、経時的に粘度と硬化性（ゲルタイム）を測定した。
［粘度測定方法］
Ｅ型粘度計（東機産業株式会社製ＴＶ-２０形粘度計「コーンプレートタイプ ＴＶＥ−２０Ｈ」）を用いて、各樹脂組成物の２５℃における粘度を測定した。
測定レンジ：Ｕ、ローター：１°３４’×Ｒ２４、回転スピード：０．５ｒｐｍ
（但し、比較例２は、経時の粘度上昇が大きく測定可能範囲を超えてしまうため、２４ｈｒ以降は以下の測定条件にて測定した。
測定レンジ：Ｕ、ローター：３°×Ｒ９．７、回転スピード：１０ｒｐｍ）
［硬化性（ゲルタイム）測定方法］
キュアプレート（ＴＨＥＲＭＯ ＥＬＥＣＴＲＩＣ社製）を用いて、１７５℃における樹脂組成物の硬化時間（ゲルタイム）を測定した。
［ＧＰＣ］
測定装置 ：東ソー株式会社製「ＨＬＣ−８２２０ ＧＰＣ」、
カラム：東ソー株式会社製ガードカラム「ＨＸＬ−Ｌ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ２０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ２０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ３０００ＨＸＬ」
＋東ソー株式会社製「ＴＳＫ−ＧＥＬ Ｇ４０００ＨＸＬ」
検出器： ＲＩ（示差屈折径）
データ処理：東ソー株式会社製「ＧＰＣ−８０２０モデルIIバージョン４．１０」
測定条件： カラム温度 ４０℃
展開溶媒 テトラヒドロフラン
流速 １．０ｍｌ／分
標準 ： 前記「ＧＰＣ−８０２０モデルIIバージョン４．１０」の測定マニュアルに準拠して、分子量が既知の下記の単分散ポリスチレンを用いた。
（使用ポリスチレン）
東ソー株式会社製「Ａ−５００」
東ソー株式会社製「Ａ−１０００」
東ソー株式会社製「Ａ−２５００」
東ソー株式会社製「Ａ−５０００」
東ソー株式会社製「Ｆ−１」
東ソー株式会社製「Ｆ−２」
東ソー株式会社製「Ｆ−４」
東ソー株式会社製「Ｆ−１０」
東ソー株式会社製「Ｆ−２０」
東ソー株式会社製「Ｆ−４０」
東ソー株式会社製「Ｆ−８０」
東ソー株式会社製「Ｆ−１２８」
試料 ： 樹脂固形分換算で１．０質量％のテトラヒドロフラン溶液をマイクロフィルターでろ過したもの（５０μｌ）。
［ＮＭＲ］
日本電子株式会社「ＮＭＲ ＧＳＸ２７０」にて測定した。
Hereinafter, the present invention will be described in detail by way of examples. The evaluation methods in each example and comparative example are as follows.
[Storage stability]
Two parts of 2-ethyl-4-methylimidazole were blended with 100 parts of each epoxy resin, and stirred rapidly to make them compatible. The blended composition was placed in a sample bottle and stored at −25 ° C., and the viscosity and curability (gel time) were measured over time.
[Viscosity measurement method]
Using an E-type viscometer (TV-20 viscometer “Cone Plate Type TVE-20H” manufactured by Toki Sangyo Co., Ltd.), the viscosity of each resin composition at 25 ° C. was measured.
Measurement range: U, rotor: 1 ° 34 ′ × R24, rotation speed: 0.5 rpm
(However, in Comparative Example 2, since the viscosity increase over time greatly exceeds the measurable range, the measurement was performed under the following measurement conditions after 24 hours.
(Measurement range: U, rotor: 3 ° × R9.7, rotation speed: 10 rpm)
[Method of measuring curability (gel time)]
The curing time (gel time) of the resin composition at 175 ° C. was measured using a cure plate (manufactured by THERMO ELECTRIC).
[GPC]
Measuring device: “HLC-8220 GPC” manufactured by Tosoh Corporation
Column: Guard column “H XL -L” manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ "TSK-GEL G2000HXL" manufactured by Tosoh Corporation
+ Tosoh Corporation “TSK-GEL G3000HXL”
+ Tosoh Corporation “TSK-GEL G4000HXL”
Detector: RI (Differential refraction diameter)
Data processing: “GPC-8020 Model II version 4.10” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml / min Standard: The following monodisperse polystyrene having a known molecular weight was used in accordance with the measurement manual of “GPC-8020 Model II version 4.10”.
(Polystyrene used)
“A-500” manufactured by Tosoh Corporation
"A-1000" manufactured by Tosoh Corporation
"A-2500" manufactured by Tosoh Corporation
"A-5000" manufactured by Tosoh Corporation
“F-1” manufactured by Tosoh Corporation
"F-2" manufactured by Tosoh Corporation
“F-4” manufactured by Tosoh Corporation
“F-10” manufactured by Tosoh Corporation
“F-20” manufactured by Tosoh Corporation
“F-40” manufactured by Tosoh Corporation
“F-80” manufactured by Tosoh Corporation
“F-128” manufactured by Tosoh Corporation
Sample: A 1.0 mass% tetrahydrofuran solution filtered in terms of resin solids and filtered through a microfilter (50 μl).
[NMR]
Measured with JEOL Ltd. “NMR GSX270”.
実施例１
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに１，６−ジヒドロキシナフタレン１６０．０ｇ（１．０モル）とエピクロルヒドリン９２５．０ｇ（１０．０モル）、ｎ−ブタノール２７７．５ｇを仕込み、系内を減圧窒素置換し溶解させた。その後、窒素ガスパージを施しながら、６５℃に昇温した後に、共沸する圧力までに減圧して、４９％水酸化ナトリウム水溶液１８０ｇ（２．２０モル）を５時間かけて滴下した。次いでこの条件下で０．５時間撹拌を続けた。この間、共沸で留出してきた留出分をディーンスタークトラップで分離して、水層を除去し、有機層を反応系内に戻しながら反応した。その後、未反応のエピクロルヒドリンを減圧蒸留して留去させた。それで得られた粗エポキシ樹脂にメチルイソブチルケトン１０００ｇとｎ−ブタノール１００ｇを加え溶解した。更にこの溶液に１０質量％水酸化ナトリウム水溶液２０ｇを添加して８０℃で２時間反応させた後に洗浄液のｐＨが中性となるまで水３００ｇで水洗を３回繰り返した。次いで共沸によって系内を脱水し、精密濾過を経た後に、溶媒を減圧下で留去して、エポキシ樹脂（Ｅ−１）２６３．８ｇを得た。この樹脂（Ｅ−１）のエポキシ当量は１４３ｇ／ｅｑ．、α−グリコール基＝０．０１ｍｅｑ／ｇ、理論構造体（ｎ＝０体）含有量＝９４．５面積％であった。このエポキシ樹脂（Ｅ−１）の１３Ｃ−ＮＭＲチャート図を図１に示す。
得られたエポキシ樹脂（Ｅ−１）１００部に２−エチル−４−メチルイミダゾールを２部配合し、素早く攪拌し相溶させた。配合した組成物をサンプル瓶に入れ、-２５℃にて保管し、経時的に粘度と硬化性（ゲルタイム）を測定した。
貯蔵安定性は、初期値を１００とした粘度増粘率（保存後粘度／初期粘度×１００）、及び初期値を１００とした硬化性変化率（保存後ゲルタイム／初期ゲルタイム×１００）で評価した（共に、数値が小さいほど、貯蔵安定性が良好）。
Example 1
In a flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer, 160.0 g (1.0 mol) of 1,6-dihydroxynaphthalene, 925.0 g (10.0 mol) of epichlorohydrin, n-butanol 277.5 g was charged, and the inside of the system was purged with nitrogen under reduced pressure to be dissolved. Thereafter, the temperature was raised to 65 ° C. while purging with nitrogen gas, and then the pressure was reduced to an azeotropic pressure, and 180 g (2.20 mol) of a 49% aqueous sodium hydroxide solution was added dropwise over 5 hours. Stirring was then continued under these conditions for 0.5 hour. During this time, the distillate distilled azeotropically was separated with a Dean-Stark trap, the aqueous layer was removed, and the reaction was conducted while returning the organic layer to the reaction system. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. 1000 g of methyl isobutyl ketone and 100 g of n-butanol were added to the crude epoxy resin thus obtained and dissolved. Further, 20 g of a 10% by mass aqueous sodium hydroxide solution was added to this solution and reacted at 80 ° C. for 2 hours. After that, washing with 300 g of water was repeated three times until the pH of the washing solution became neutral. Next, the system was dehydrated by azeotropic distillation, and after microfiltration, the solvent was distilled off under reduced pressure to obtain 263.8 g of epoxy resin (E-1). The epoxy equivalent of this resin (E-1) is 143 g / eq. , Α-glycol group = 0.01 meq / g, content of theoretical structure (n = 0 body) = 94.5 area%. A 13 C-NMR chart of this epoxy resin (E-1) is shown in FIG.
Two parts of 2-ethyl-4-methylimidazole were blended with 100 parts of the obtained epoxy resin (E-1), and the mixture was rapidly stirred to be compatible. The blended composition was placed in a sample bottle and stored at −25 ° C., and the viscosity and curability (gel time) were measured over time.
Storage stability was evaluated by viscosity increase rate with initial value of 100 (viscosity after storage / initial viscosity × 100) and curable change rate with initial value of 100 (gel time after storage / initial gel time × 100). (In both cases, the smaller the value, the better the storage stability).
実施例２
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに１，６−ジヒドロキシナフタレン１６０．０ｇ（１．０モル）とエピクロルヒドリン７４０．０ｇ（８．０モル）、ジメチルスルホキシド２５０．０ｇを仕込み、系内を減圧窒素置換し溶解させた。その後、常圧で窒素ガスパージを施しながら、６５℃に昇温した後、４９％水酸化ナトリウム水溶液１８０ｇ（２．２０モル）を３時間かけて滴下した。次いでこの条件下で０．５時間撹拌を続けた。その後、水２６０ｇを加えて同温度で静置分液して、下層の水層を棄却した。その後、未反応のエピクロルヒドリンを減圧蒸留して留去させた。それで得られた粗エポキシ樹脂にメチルイソブチルケトン１０００ｇとｎ−ブタノール１００ｇを加え溶解した。更にこの溶液に１０質量％水酸化ナトリウム水溶液２０ｇを添加して８０℃で２時間反応させた後に洗浄液のｐＨが中性となるまで水３００ｇで水洗を３回繰り返した。次いで共沸によって系内を脱水し、精密濾過を経た後に、溶媒を減圧下で留去して、エポキシ樹脂（Ｅ−１）２６４．０ｇを得た。この樹脂（Ｅ−２）のエポキシ当量は１４３ｇ／ｅｑ．、α−グリコール基＝０．０２ｍｅｑ／ｇ、理論構造体（ｎ＝０体）含有量＝９１．２面積％であった。
得られたエポキシ樹脂（Ｅ−１）１００部に２−エチル−４−メチルイミダゾールを２部配合し、素早く攪拌し相溶させた。配合した組成物をサンプル瓶に入れ、-２５℃にて保管、経時的に粘度と硬化性（ゲルタイム）を測定し、実施例１と同様にして貯蔵安定性を評価した。
Example 2
In a flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer, 160.0 g (1.0 mol) of 1,6-dihydroxynaphthalene, 740.0 g (8.0 mol) of epichlorohydrin, dimethyl sulfoxide 250 0.0 g was charged and the system was purged with nitrogen under reduced pressure to dissolve. Thereafter, the temperature was raised to 65 ° C. while purging with nitrogen gas at normal pressure, and then 180 g (2.20 mol) of 49% aqueous sodium hydroxide solution was added dropwise over 3 hours. Stirring was then continued under these conditions for 0.5 hour. Thereafter, 260 g of water was added and the solution was allowed to stand at the same temperature, and the lower aqueous layer was discarded. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. 1000 g of methyl isobutyl ketone and 100 g of n-butanol were added to the crude epoxy resin thus obtained and dissolved. Further, 20 g of a 10% by mass aqueous sodium hydroxide solution was added to this solution and reacted at 80 ° C. for 2 hours. After that, washing with 300 g of water was repeated three times until the pH of the washing solution became neutral. Next, the system was dehydrated by azeotropic distillation, and after microfiltration, the solvent was distilled off under reduced pressure to obtain 264.0 g of an epoxy resin (E-1). The epoxy equivalent of this resin (E-2) is 143 g / eq. , Α-glycol group = 0.02 meq / g, theoretical structure (n = 0 isomer) content = 91.2 area%.
Two parts of 2-ethyl-4-methylimidazole were blended with 100 parts of the obtained epoxy resin (E-1), and the mixture was rapidly stirred to be compatible. The blended composition was placed in a sample bottle, stored at −25 ° C., the viscosity and curability (gel time) were measured over time, and the storage stability was evaluated in the same manner as in Example 1.
比較例１
温度計、滴下ロート、冷却管、分留管、撹拌器を取り付けたフラスコに１，６−ジヒドロキシナフタレン１６０．０ｇ（１．０モル）とエピクロルヒドリン７４０．０ｇ（８．０モル）を仕込み、系内を減圧窒素置換し溶解させた。その後、窒素ガスパージを施しながら、８０℃に昇温した後に、２０％水酸化ナトリウム水溶液４４０．０ｇ（２．２０モル）を５時間かけて滴下した。次いで、この条件下で１時間撹拌を続け、静置後、水層を棄却した。その後、未反応のエピクロルヒドリンを減圧蒸留して留去させた。それで得られた粗エポキシ樹脂にトルエン１３０．０ｇを加えて均一溶解させ、水洗した後、油水分離し、油層から共沸蒸留により水を除いた後、精密濾過を経た後に、溶媒を減圧下で留去して、エポキシ樹脂（Ｒ−１）２５８．４ｇを得た。この樹脂（Ｒ−１）のエポキシ当量は１５４ｇ／ｅｑ．、α−グリコール基＝０．０９ｍｅｑ／ｇ、理論構造体（ｎ＝０体）含有量＝８６．０面積％であった。
得られたエポキシ樹脂（Ｒ−１）１００部に２−エチル−４−メチルイミダゾールを２部配合し、素早く攪拌し相溶させた。配合した組成物をサンプル瓶に入れ、-２５℃にて保管、経時的に粘度と硬化性（ゲルタイム）を測定し、実施例１と同様にして貯蔵安定性を評価した。
Comparative Example 1
A flask equipped with a thermometer, dropping funnel, condenser, fractionator, and stirrer was charged with 160.0 g (1.0 mol) of 1,6-dihydroxynaphthalene and 740.0 g (8.0 mol) of epichlorohydrin. The inside was purged with nitrogen under reduced pressure and dissolved. Thereafter, the temperature was raised to 80 ° C. while purging with nitrogen gas, and then 440.0 g (2.20 mol) of a 20% aqueous sodium hydroxide solution was added dropwise over 5 hours. Subsequently, stirring was continued for 1 hour under these conditions, and after standing, the aqueous layer was discarded. Thereafter, unreacted epichlorohydrin was distilled off under reduced pressure. After 130.0 g of toluene was added to the crude epoxy resin thus obtained and uniformly dissolved, washed with water, separated into oil and water, water was removed from the oil layer by azeotropic distillation, and after microfiltration, the solvent was removed under reduced pressure. Distilled off to obtain 258.4 g of epoxy resin (R-1). The epoxy equivalent of this resin (R-1) is 154 g / eq. , Α-glycol group = 0.09 meq / g, theoretical structure (n = 0 isomer) content = 86.0 area%.
Two parts of 2-ethyl-4-methylimidazole was blended with 100 parts of the obtained epoxy resin (R-1), and the mixture was rapidly stirred to be dissolved. The blended composition was placed in a sample bottle, stored at −25 ° C., the viscosity and curability (gel time) were measured over time, and the storage stability was evaluated in the same manner as in Example 1.
比較例２
比較例１で得られたエポキシ樹脂を、２６０℃、２mmHgで減圧蒸留し、エポキシ樹脂（Ｒ−２）を得た。この樹脂（Ｒ−２）のエポキシ当量は１４２ｇ/ｅｑ.、α−グリコール基＝０．０３ｍｅｑ／ｇ、理論構造体（ｎ＝０体）含有量＝９６．６面積％であった。
得られたエポキシ樹脂（Ｒ−２）１００部に２−エチル−４−メチルイミダゾールを２部配合し、素早く攪拌し相溶させた。配合した組成物をサンプル瓶に入れ、-２５℃にて保管、経時的に粘度と硬化性（ゲルタイム）を測定し、実施例１と同様にして貯蔵安定性を評価した。
Comparative Example 2
The epoxy resin obtained in Comparative Example 1 was distilled under reduced pressure at 260 ° C. and 2 mmHg to obtain an epoxy resin (R-2). The epoxy equivalent of this resin (R-2) was 142 g / eq., Α-glycol group = 0.03 meq / g, and the content of theoretical structure (n = 0 body) = 96.6 area%.
Two parts of 2-ethyl-4-methylimidazole were blended with 100 parts of the obtained epoxy resin (R-2), and the mixture was quickly stirred to be dissolved. The blended composition was placed in a sample bottle, stored at −25 ° C., the viscosity and curability (gel time) were measured over time, and the storage stability was evaluated in the same manner as in Example 1.
Claims (9)
（式中、Ｘ１及びＸ２は、それぞれ独立的に下記構造式ａ
又は下記構造式ｂ
で表される構造であり、ｎは繰り返し単位で０以上の数である。）
で表されるものであり、かつ、該構造式１中のｎ＝０体のＧＰＣ測定による含有率が９８〜８８面積％であって、前記構造式ｂで表される構造の含有率が０．００５〜０．０２５ミリ当量／ｇである請求項１又は２記載のエポキシ樹脂組成物。 The epoxy resin (A) has the following structural formula 1
(Wherein X 1 and X 2 are each independently the following structural formula a
Or the following structural formula b
Where n is a repeating unit and is a number of 0 or more. )
And the content of the n = 0 body in the structural formula 1 by GPC measurement is 98 to 88 area%, and the content of the structure represented by the structural formula b is 0. The epoxy resin composition according to claim 1, which has a ratio of 0.005 to 0.025 meq / g.
（式中、Ｘ１及びＸ２は、それぞれ独立的に下記構造式ａ
で表される構造を有し、かつ、該構造式１中のｎ＝０体のＧＰＣ測定による含有率が９８〜８８面積％であって、前記構造式ｂで表される構造の含有率が０．００５〜０．０２５ミリ当量／ｇである請求項７又は８記載の新規エポキシ樹脂。 Structural formula 1
(Wherein X 1 and X 2 are each independently the following structural formula a
And the content of the n = 0 body in the structural formula 1 by GPC measurement is 98 to 88 area%, and the content of the structure represented by the structural formula b is The novel epoxy resin according to claim 7 or 8, wherein the amount is 0.005 to 0.025 meq / g.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101234571B1 (en) * | 2011-03-09 | 2013-02-19 | 한국생산기술연구원 | Epoxy Composition for Encapsulating Semiconductor Device and Semiconductor Device Encapsulated With the Same |
| CN103483619A (en) * | 2012-06-12 | 2014-01-01 | 仲田涂覆株式会社 | Compound containing imido group, solution of compound containing imido group and method for producing of compound containing imido group |
| JP2016028156A (en) * | 2009-05-14 | 2016-02-25 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | Liquid resin composition based on monobenzoxazine |
| JPWO2018139112A1 (en) * | 2017-01-24 | 2019-04-18 | Dic株式会社 | Epoxy resin, epoxy resin composition containing the same, and cured product using the epoxy resin composition |
| US10961208B1 (en) | 2019-12-24 | 2021-03-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol |
| CN114685760A (en) * | 2022-04-29 | 2022-07-01 | 安徽觅拓材料科技有限公司 | Preparation method of low-chlorine 1, 6-dihydroxy naphthalene type epoxy resin |
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| JP7244452B2 (en) | 2020-03-24 | 2023-03-22 | 株式会社東芝 | isolator |
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|---|---|---|---|---|
| JP2016028156A (en) * | 2009-05-14 | 2016-02-25 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | Liquid resin composition based on monobenzoxazine |
| KR101234571B1 (en) * | 2011-03-09 | 2013-02-19 | 한국생산기술연구원 | Epoxy Composition for Encapsulating Semiconductor Device and Semiconductor Device Encapsulated With the Same |
| CN103483619A (en) * | 2012-06-12 | 2014-01-01 | 仲田涂覆株式会社 | Compound containing imido group, solution of compound containing imido group and method for producing of compound containing imido group |
| JPWO2018139112A1 (en) * | 2017-01-24 | 2019-04-18 | Dic株式会社 | Epoxy resin, epoxy resin composition containing the same, and cured product using the epoxy resin composition |
| US10961208B1 (en) | 2019-12-24 | 2021-03-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol |
| EP3842466A1 (en) | 2019-12-24 | 2021-06-30 | Chang Chun Plastics Co., Ltd. | Product of glycidyl ether of a mono or polyhydric phenol, epoxy resin composition, and process for producing product of glycidyl ether of a mono or polyhydric phenol |
| CN114685760A (en) * | 2022-04-29 | 2022-07-01 | 安徽觅拓材料科技有限公司 | Preparation method of low-chlorine 1, 6-dihydroxy naphthalene type epoxy resin |
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