JP2009043902A - Electronic component package, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component package that can perform easy and reliable hermetic sealing of an electronic component such as a crystal oscillator requiring sealing at high degree of vacuum. <P>SOLUTION: An electronic component package 20 includes a case 22 in which a concave part 26 is formed for accommodating an electronic component 21, and a cover 25 placed on the top face of the case 22 to seal the inside of the concave part 26 through a brazing filler metal provided between itself and the case 22, wherein a continuous sealing line is formed by melting the brazing filler metal along the surrounding area of the concave part 26. The sealing line is composed of a first sealing line 33 formed by having at least one or more cut lines 32 on a part of the surrounding area of the concave part 26, and a second sealing line 34 for coupling one end 35 with the other end 36 of the cut lines 32 on the first sealing line 33 at a position displaced from a straight line connecting between one end 35 and the other end 36. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component package for hermetically sealing a small electronic component such as a crystal resonator and a manufacturing method thereof.

  Conventionally, as this type of electronic component package 1, as shown in FIG. 11, for example, a ceramic case 3 provided with a recess 6 for storing an electronic component 2 such as a crystal resonator, and a side wall of the case 3 There is known a structure composed of a metal lid 5 sealed with a weld layer (metallized layer) 4 formed on the upper surface of the metal (see Patent Document 1). The metallized layer 4 is formed in layers by applying nickel plating and gold plating on a metal such as tungsten or molybdenum. On the other hand, a clad metal brazing material 7 is formed on one surface of the lid 5.

  In the manufacture of the electronic component package 1, when the lid 5 is sealed to the case 3, as shown in FIG. 12, the lid 5 is put on the case 3, and the metallized layer 4 and the metal brazing material 7 are placed. After overlapping, the beam 8 is moved in the arrow direction while being uniformly irradiated with the beam 8 along the outer peripheral edge of the lid 5. Thus, the metal brazing material 7 is heated and melted by the irradiation of the beam 8 and sealed to the metallized layer 4, thereby bringing the case 3 and the lid 5 into close contact with each other.

Patent Documents 2 and 3 disclose an electronic component package having a structure in which a lid is brought into close contact while maintaining a degree of vacuum in a case in which the electronic component is accommodated, and a manufacturing method thereof. The method first beam welds the lid along the upper surface of the side wall of the case. At that time, a cut which is not completely welded is left on a part of the upper surface of the side wall, and when the beam welding is performed for the second and subsequent times, the gas is completely sealed while venting the gas in the case.
JP-A-9-246415 JP 2000-223604 A JP 2000-196162 A

  However, the metal brazing material 7 is provided uniformly along the peripheral edge of the recess 6. However, if a part of the peripheral part is cut and the cut part is beam-welded again, the cut part is obtained. The metal brazing material 7 may become thin. Even if the beam is irradiated again on such a thin metal brazing material 7, welding may be insufficient, and a product with insufficient hermetic sealing may be manufactured.

  Moreover, in order to melt again the metal brazing material 7 once melted by the first beam irradiation, a larger irradiation heat is required, so that the generation of gas increases and the hermetic sealing may not be sufficiently performed.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component package that can easily and reliably hermetically seal an electronic component that requires sealing in a high vacuum degree, such as a crystal resonator, and a method for manufacturing the same. is there.

  In order to solve the above-described problems, an electronic component package according to the present invention includes a case in which a concave portion for accommodating an electronic component is formed, and a melting member provided between the case and the upper surface of the case. An electronic component package in which a continuous sealing line is formed by melting the melting member along the periphery of the recess. A first sealing line formed with at least one or more cuts in a part of the periphery of the recess, and a straight line connecting one end and the other end of the cuts of the first sealing line And a second sealing line for connecting the end portions to each other at a position shifted from above.

  In addition, the method for manufacturing an electronic component package according to the present invention includes a case in which a concave portion for accommodating the electronic component is formed, and the concave portion placed on the upper surface of the case via a melting member provided between the case and the case. In the method of manufacturing an electronic component package, comprising: a lid that seals the inside; and the fusion member is sealed by irradiating a beam along the periphery of the recess. Between the one end and the other end of the upper surface of the case Irradiating a beam along the outer periphery of the recess so as to have a cut, forming a first sealing line for fixing the lid to the case, and after the irradiation of the first beam is completed, Forming a second sealing line for hermetically sealing the lid to the case while discharging the gas in the recess to the outside by irradiating the beam at a position shifted from the cut. With features That.

  According to the electronic component package of the present invention, a certain degree of vacuum is maintained by the first sealing line formed with at least one cut in a part of the periphery of the recess provided in the case. The lid is fixed in the state. In addition, the second sealing line connecting the end portions at a position shifted from a straight line connecting one end portion and the other end portion of the cut of the first sealing line is accumulated in the recess. It is possible to completely seal in a state where the degree of vacuum is further increased while discharging the gas. Thus, it is possible to provide an electronic component package having a structure suitable for accommodating a small electronic component that requires a high degree of vacuum, such as a tuning fork crystal resonator.

  In addition, according to the method for manufacturing an electronic component package of the present invention, the first part is intended to be joined to the lid in a state where there is a cut in the upper surface of the thick part formed by thickening a part of the side wall of the case. A sealing line was formed, and a second sealing line extending in parallel with the cut was formed. Thus, since the lid and the case are welded and joined via the double sealing portion including the first sealing line and the second sealing line, the first sealing line is formed. The shortage of the metal brazing material that has been reduced can be compensated by forming the second sealing line, whereby the electronic component can be completely hermetically sealed while maintaining a high degree of vacuum. it can.

  Embodiments of an electronic component package and a manufacturing method thereof according to the present invention will be described below in detail with reference to the accompanying drawings. Here, FIG. 1 is a perspective view of the electronic component package of the present invention in a sealed state, FIG. 2 is a plan view of the electronic component package, and FIG. 3 is a cross-sectional view of the electronic component package before sealing. . 1 and 2 are shown through the lid 25 so that the sealed state can be seen.

  As shown in FIGS. 1 and 2, an electronic component package 20 of the present invention includes a ceramic case 22 having a recess 26 surrounded by a side wall 29 for accommodating an electronic component 21 such as a crystal resonator, and the like. It is comprised by the metal cover body 25 which covers the recessed part 26. FIG. The lid body 25 is hermetically sealed by a first sealing line 33 that makes one round around the recess 26 and a second sealing line 34 that partially overlaps the first sealing line 33. The

  As shown in FIG. 3, the case 22 and the lid body 25 melt the melting member (metal brazing material) 27 provided on the back surface of the lid body 25 on the metallized layer 24 provided on the upper surface of the side wall 29 of the case 22. It adheres by. The metallized layer 24 is formed by layering nickel plating and gold plating on a metal such as tungsten or molybdenum. The lid body 25 welded onto the metallized layer 24 is composed of a metal plate having substantially the same shape as the planar shape of the case 22 and a metal brazing material 27 clad on the entire back surface of the metal plate. . The metal plate is made of 42 alloy, Kovar or other iron-based alloy as in the case of the conventional lid, while the metal brazing material 27 is made of a metal material such as a silver alloy or an aluminum alloy. The melting point of the metal brazing material 27 is desirably 900 ° C. or less in consideration of the influence of heat on the case 22 at the time of melting. Clading of the metal plate and the metal brazing material 27 can be easily manufactured by simultaneously rolling two metal plates. The clad lid body 25 has a metallicly strong bonding structure, so that the heat conduction is extremely good, is heated and melted by irradiation heat by a beam or the like, and is welded to the metallized layer 24. The first sealing line 33 and the second sealing line 34 are melting marks of the metal brazing material 27 formed by irradiating the beam.

  As shown in FIGS. 1 and 2, the electronic component package 20 of the present invention forms a thick portion 31 in which a part of the side wall 29 of the case 22 is thickened, and the metallized layer 24 is formed on the thick portion 31. A double sealing portion 38 is provided in which sealing lines formed by melting the metal brazing material 27 overlap in parallel. The thick portion 31 is formed such that a part of the inner peripheral surface of the side wall 29 protrudes into the recess 26. In addition, the double sealing portion 38 is located at a position shifted from a portion of the first sealing line 33 in a state having a cut 32 that is not completely welded on the concave portion 26 side and the cut 32. The second sealing line 34 is provided.

  As shown in FIG. 4, the first sealing line 33 is a portion irradiated with a beam so as to be continuous along the outer periphery of the concave portion 26. This beam irradiation starts from one end 35 of the thick portion 31 from the top of the lid body 25, makes one round of the upper surface of the side wall 29 along the outer periphery of the concave portion 26, and reaches the other end 36 which is the end point. It is performed continuously. In the beam irradiated portion, the metal brazing material 27 on the back surface side of the lid body 25 is melted and welded to the lower metallized layer 24. The cut 32 between the one end 35 and the other end 36 is The metal brazing material 27 and the metallized layer 24 are minute cavity portions 39 that are not in close contact with each other. In the above-described embodiment, the example in which the first sealing line 33 is continuously irradiated with the beam except for one cut 32 has been described. However, the concave portion 26 is not continuously formed in this manner. Beam irradiation may be performed so as to make one round of the outer periphery.

  On the other hand, as shown in FIG. 2, the second sealing line 34 is formed at a position so as to cover the cut 32 from the plane direction. The second sealing line 34 is formed at a position where a straight line connecting the one end 35 to the other end 36 of the cut 32 is translated in the plane direction as it is. In FIG. 2, the second sealing line 34 is formed linearly along the cut line 32, but is not limited to such a linear shape and is within the range of the thick portion 31. Alternatively, the first sealing line 33 may be formed so as to be connected between the one end 35 and the other end 36 while being bent like an arc or a U-shape.

  FIG. 5 shows a joining state in the BB cross section of FIG. In this way, by irradiating the beam along the second sealing line 34, the metal brazing material 27 of the portion irradiated with the beam is melted and welded to the metallized layer 24 immediately below it, and the first 1 sealing line 33 and a continuous sealing line. Thus, the lid 25 is fixed without completely sealing the inside of the recess 26 in which the electronic component 21 is accommodated by the first sealing line 33, and the inside of the recess 26 is secured by the second sealing line 34. It is possible to seal completely while discharging gas.

  Next, a manufacturing method for hermetically sealing the lid 25 to the case 22 through the metallized layer 24 will be described. The following operations are performed in a vacuum chamber. First, as shown in FIG. 6, an electronic component 21 such as a crystal resonator is accommodated in the recess 26 of the case 22, and then a lid 25 is placed on the upper surface 23 of the side wall 29 of the case 22. At this time, the metal brazing material 27 provided on the lower surface of the lid body 25 comes into contact with the metallized layer 24 formed on the upper surface 23 of the side wall 29. Next, as shown in FIG. 7, the first beam 28 is irradiated from above the lid 25 along the outer periphery of the recess 26, and the metal brazing material 27 is heated and melted and directly welded to the metallized layer 24. The first beam irradiation is performed once along the outer periphery of the concave portion 26 so that one end of the cut is a starting point and the other end is an end point. The lid 25 can be fixed to the case 22 by the first beam irradiation.

  Subsequently, as shown in FIG. 8, the second beam 28 is irradiated along the second sealing line 34 from above the lid body 25. Simultaneously with the irradiation of the second beam, the gas accumulated in the recess 26 from the cut 32 is discharged to the outside. By this second beam irradiation, the metal brazing material 27 provided on the back surface of the lid body 25 is melted and brought into close contact with the first sealing line 33 so as to close the cut 32. As a result, the outer periphery of the lid body 25 is in close contact with the upper surface of the case 22 without a gap, and hermetic sealing can be performed while the degree of vacuum in the recess 26 is high.

  In the said 1st Embodiment, although the double sealing part was provided in one place, it is also possible to provide two or more such double sealing parts. FIG. 9 shows a configuration example of the electronic component package 40 of the second embodiment in which double sealing portions 48a and 48b are provided at two locations. In the electronic component package 40 of this embodiment, the first thick portion 41a and the second thick portion 41b are provided at the symmetrical positions of the case 45. The first sealing lines 43a and 43b are formed inside the thick portions 41a and 41b with the cut lines 42a and 42b therebetween. The second sealing lines 44a and 44b are formed along the outer sides of the cut lines 42a and 42b. The first sealing lines 43a and 43b and the second sealing lines 44a and 44b are portions where the metal brazing material is melted by the irradiation of the beam, and when the second sealing lines 44a and 44b are formed. The recess 46 in which an electronic component (not shown) is accommodated is hermetically sealed. Thus, by providing two double sealing parts, final sealing can be performed in two steps, and sealing can be performed in a state where the degree of vacuum in the case 22 is further increased. The double sealing portions 48a and 48b can be set in the number and position according to the shape of the recess 46 and the type and shape of the electronic components accommodated in the recess 46.

  FIG. 10 shows a configuration example when the tuning fork type crystal resonator 51 is accommodated in the electronic component package 20 of the first embodiment. The tuning fork crystal unit 51 is formed to have a base 52, two vibrating arm portions 53a and 53b extending from the base portion, and support arm portions 54a and 54b extending outward from the base portion 52, respectively. . A pair of internal electrodes 55a and 55b are provided in the recess 26 of the electronic component package 20, and supported by the tip portions of the support arm portions 54a and 54b mounted on the internal electrodes 55a and 55b. The In the structure in which the internal electrodes 55a and 55b are provided on the inner surface of the recess 26 as in the tuning fork type crystal resonator 51, the thick portion 31 provided for final sealing (see FIG. 1 and 2) are formed so as to protrude into the recess 26, the vibration space of the vibrating arms 53a and 53b is not reduced, and the package size is not increased. Further, since the concave portion 26 can be sealed in a high vacuum state by the double sealing portion provided in the thick portion 31, particularly in a high vacuum environment such as the tuning fork type crystal resonator 51. Suitable for electronic component packages that require sealing.

It is a perspective view of the electronic component package in 1st Embodiment of this invention. It is a top view of the electronic component package of the said 1st Embodiment. It is sectional drawing of the electronic component package of the said 1st Embodiment. It is AA sectional drawing of the electronic component package of FIG. It is BB sectional drawing of the electronic component package of FIG. It is a figure which shows the process of accommodating an electronic component in a case, and covering a cover body. It is a figure which shows the process of forming a 1st sealing line. It is a figure which shows the process of forming a 2nd sealing line. It is a top view of the electronic component package in 2nd Embodiment of this invention. It is a top view of the electronic component package which accommodated the tuning fork type crystal unit. It is a perspective view which shows the structure of the conventional electronic component package. It is a figure which shows the sealing method of the said conventional electronic component package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Electronic component package 21 Electronic component 22 Case 23 Upper surface 24 Metallized layer 25 Lid body 26 Recessed part 27 Metal brazing material 28 Beam 29 Side wall 31 Thick part 32 Break 33 First sealing line 34 Second sealing line 35 One end 36 The other end 38 Double sealing part 39 Cavity part 40 Electronic component package 41a, 41b Thick part 42a, 42b Cut 43a, 43b First sealing line 44a, 44b Second sealing line 45 Case 46 Recessed part 48a, 48b Double sealing portion 51 Tuning fork type crystal resonator 52 Base portion 53a, 53b Vibration arm portion 54a, 54b Support arm portion 55a, 55b Internal electrode

Claims (7)

A case formed with a recess for accommodating an electronic component; and a lid placed on the upper surface of the case and sealing the inside of the recess through a melting member provided between the case and the melt. In an electronic component package in which a continuous sealing line is formed by melting a member along the periphery of the recess,
The sealing line includes a first sealing line formed with at least one or more cuts in a part of the periphery of the recess, and one end and the other of the cuts of the first sealing line An electronic component package comprising: a second sealing line that connects the end portions at a position deviated from a straight line connecting the end portions. In the case, a side wall is provided around the recess, and a thick part having a thickness is formed on at least a part of the side wall. A cut line and a second line of the first sealing line are formed on the upper surface of the thick part. The electronic component package according to claim 1, wherein a sealing line is formed. The electronic component package according to claim 2, wherein the thick portion is formed such that a part of the inner peripheral surface of the side wall protrudes into the recess. 4. The electronic component package according to claim 2, wherein the cut line of the first sealing line is provided inside the upper surface of the thick portion, and the second sealing line is provided outside the upper surface of the thick portion. The first sealing line starts from one end of the upper surface of the thick portion, starts around the upper surface of the side wall along the outer periphery of the recess, and ends at the other end of the upper surface of the thick portion. The electronic component package according to claim 1, wherein the electronic component package is formed and has the cut between the start point and the end point. The first and second sealing lines are melting marks formed by melting a melting member between the lid and the upper surface of the case by irradiating a beam from above the lid. The electronic component package described. A case formed with a recess for accommodating an electronic component; and a lid placed on the upper surface of the case and sealing the inside of the recess through a melting member provided between the case and the melt. In a method for manufacturing an electronic component package in which a member is sealed by irradiating a beam along the periphery of the recess,
Irradiating a beam along the outer periphery of the recess so as to have a cut between one end and the other end of the upper surface of the case, and forming a first sealing line for fixing the lid to the case;
After the irradiation of the first beam is completed, the lid is hermetically sealed to the case while discharging the gas in the concave portion by irradiating the beam at a position shifted from the cut. And a step of forming a sealing line. An electronic component package manufacturing method comprising:

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