JP2009043459A - Electric connection device - Google Patents

Electric connection device Download PDF

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JP2009043459A
JP2009043459A JP2007204851A JP2007204851A JP2009043459A JP 2009043459 A JP2009043459 A JP 2009043459A JP 2007204851 A JP2007204851 A JP 2007204851A JP 2007204851 A JP2007204851 A JP 2007204851A JP 2009043459 A JP2009043459 A JP 2009043459A
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connection device
electrical connection
sheet
insulator
objects
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JP4755151B2 (en
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Takayuki Nishimura
貴行 西村
Takuo Sasaki
琢男 佐々木
Tatsuo Kimura
龍男 木村
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electric connection device by which jointing strength of connecting objects is increased and positioning of the connecting objects is carried out readily. <P>SOLUTION: A plurality of pillar-like conductive members 5 having elasticity are installed on an insulating sheet 3 having thermosetting performance for jointing a printed-circuit board 21 and a connector 22 so as to penetrate from one face to the other face. Hold-down members 7 which have a lower melting point than a hardening temperature of the insulating sheet 3 and are made of a low-melting point metal for welding to the connecting parts 212, 222 installed respectively on the printed-circuit board 21 and the connector 22, are provided on the insulating sheet 3 so as to penetrate from one face to the other face. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は2つの接続対象物の間に介在し、その接続対象物同士を機械的かつ電気的に接続するシート状の電気接続装置に関する。   The present invention relates to a sheet-like electrical connection device that is interposed between two connection objects and mechanically and electrically connects the connection objects.

従来、シート状基材と複数の導電性部材とを備えるコネクタシートが知られている(下記特許文献1参照)。   Conventionally, a connector sheet including a sheet-like base material and a plurality of conductive members is known (see Patent Document 1 below).

シート状基材は例えばシリコーン樹脂とエポキシ樹脂(熱硬化性樹脂の一種)と無機フィラーとで構成されている。シート状基材の表面及び裏面は熱硬化性樹脂を含む。シリコーン樹脂は主に粘着性を発現し、エポキシ樹脂は主に接着性を発現する役割を担っており、無機フィラーは永久接着後のシート基材の熱膨張係数を制御する役割を担っている。   The sheet-like substrate is composed of, for example, a silicone resin, an epoxy resin (a kind of thermosetting resin), and an inorganic filler. The front and back surfaces of the sheet-like substrate contain a thermosetting resin. The silicone resin mainly exhibits adhesiveness, the epoxy resin mainly plays a role of expressing adhesiveness, and the inorganic filler plays a role of controlling the thermal expansion coefficient of the sheet substrate after permanent adhesion.

シート状基材の表面及び裏面には第1の温度条件下では粘着性が現れるが、第2の温度条件下では接着性が現われる。   Although tackiness appears on the front and back surfaces of the sheet-like substrate under the first temperature condition, adhesiveness appears under the second temperature condition.

各導電性部材はシート状基材の厚さ方向へ延びて、シート状基材を貫通しており、導電性部材の一端はシート状基材の表面に露出しており、導電性部材の他端はシート状基材の裏面に露出している。   Each conductive member extends in the thickness direction of the sheet-like base material, penetrates the sheet-like base material, and one end of the conductive member is exposed on the surface of the sheet-like base material. The end is exposed on the back surface of the sheet-like substrate.

上記コネクタシートの使用に際しては、第1の温度条件下でシート状基材の表面及び裏面に粘着性を発現させ、この状態でコネクタシートの表面及び裏面に接続対象物を貼り付ける。   When the connector sheet is used, adhesiveness is developed on the front and back surfaces of the sheet-like base material under the first temperature condition, and in this state, the connection object is attached to the front and back surfaces of the connector sheet.

その後、第2の温度条件下でシート状基材の表面及び裏面に接着性を発現させ、接続対象物同士を接着する。   Then, adhesiveness is made to express on the surface and back surface of a sheet-like base material on 2nd temperature conditions, and connection objects are adhere | attached.

その結果、複数の導電性部材によって接続対象物同士が電気的に接続される。
特開2005−236256号公報(段落0071〜0076、図1参照)
As a result, the connection objects are electrically connected to each other by the plurality of conductive members.
Japanese Patent Laying-Open No. 2005-236256 (see paragraphs 0071 to 0076, FIG. 1)

上述のコネクタシートではシート状基材の熱硬化性樹脂だけで接続対象物同士を接着するので、例えば接続対象物が大きいと接合強度が不足する虞があった。また、接続対象物同士を接着する際には、治具等を用いて位置決めを行う必要があった。   In the connector sheet described above, since the connection objects are bonded together only by the thermosetting resin of the sheet-like base material, for example, if the connection object is large, there is a possibility that the bonding strength is insufficient. Further, when bonding the connection objects, it is necessary to perform positioning using a jig or the like.

この発明はこのような事情に鑑みてなされたもので、その課題は接続対象物同士の接合強度を高くすることができ、また、接続対象物同士の位置決めを簡易に行うことができる電気接続装置を提供することである。   The present invention has been made in view of such circumstances, and the problem thereof is an electrical connection device that can increase the bonding strength between the connection objects and can easily perform the positioning of the connection objects. Is to provide.

前述の課題を解決するため請求項1の発明の電気接続装置は、2つの接続対象物間に配置され、それらの接続対象物を機械的かつ電気的に接続する電気接続装置において、前記2つの接続対象物を接合するための熱硬化性を有するシート状の絶縁体と、前記絶縁体にその一方の面から他方の面へ貫通するように設けられ、前記2つの接続対象物のそれぞれに設けられた端子部間を導通させるための複数の弾性を有する柱状の導電性部材と、前記絶縁体に設けられ、前記絶縁体の硬化温度より低い融点を有し、前記2つの接続対象物のそれぞれに設けられた接続部に溶接するための金属部とを備えていることを特徴とする。   In order to solve the above-mentioned problem, an electrical connection device according to the invention of claim 1 is disposed between two connection objects, and the two electrical connection devices mechanically and electrically connect the connection objects. A sheet-like insulator having thermosetting properties for joining the objects to be connected, and provided on each of the two objects to be connected to the insulator so as to penetrate from the one surface to the other surface. A plurality of elastic columnar conductive members for conducting between the terminal portions provided, and the insulator, having a melting point lower than the curing temperature of the insulator, each of the two connection objects And a metal part for welding to a connection part provided in the case.

上述のように2つの接続対象物のそれぞれに設けられた接続部に溶接するための金属部を備えているので、2つの接続対象物が絶縁体によって接合されるだけでなく、点金属部によっても接合される。   Since the metal part for welding to the connection part provided in each of two connection objects as mentioned above is provided, not only two connection objects are joined by an insulator, but also by a point metal part. Are also joined.

請求項2の発明は、請求項1記載の電気接続装置において、前記金属部が柱状であり、前記絶縁体の一方の面から他方の面へ貫通していることを特徴とする。   According to a second aspect of the present invention, in the electrical connection device according to the first aspect, the metal part is columnar and penetrates from one surface of the insulator to the other surface.

請求項3の発明は、請求項1又は2記載の電気接続装置において、前記絶縁体は、低い熱膨張係数及び高い耐引張り性を有する基材シートと、この基材シートの両面に配置された熱硬化性樹脂層とを有することを特徴とする。   According to a third aspect of the present invention, in the electrical connection device according to the first or second aspect, the insulator is disposed on both sides of the base sheet having a low thermal expansion coefficient and high tensile resistance, and the base sheet. And a thermosetting resin layer.

請求項4の発明は、請求項3項記載の電気接続装置において、前記基材シートの材料がポリイミド又はアラミドであることを特徴とする。   According to a fourth aspect of the present invention, in the electrical connection device according to the third aspect, the material of the base sheet is polyimide or aramid.

請求項5の発明は、請求項3又は4項記載の電気接続装置において、前記熱硬化性樹脂層の材料がエポキシ系樹脂であることを特徴とする。   According to a fifth aspect of the present invention, in the electrical connecting device according to the third or fourth aspect, the material of the thermosetting resin layer is an epoxy resin.

請求項6の発明は、請求項1〜5のいずれか1項記載の電気接続装置において、前記導電性部材が、弾性樹脂材料と、この弾性樹脂材料に混入された導電性金属粒子とで構成されていることを特徴とする。   The invention according to claim 6 is the electrical connection device according to any one of claims 1 to 5, wherein the conductive member includes an elastic resin material and conductive metal particles mixed in the elastic resin material. It is characterized by being.

請求項7の発明は、請求項1〜6のいずれか1項記載の電気接続装置において、前記金属部が、フラックスと、このフラックスに混入された導電性金属粒子とで構成されていることを特徴とする。   According to a seventh aspect of the present invention, in the electrical connecting device according to any one of the first to sixth aspects, the metal part is composed of a flux and conductive metal particles mixed in the flux. Features.

この発明によれば、接続対象物同士の接合強度を高くすることができる。また、金属部の構成によりセルフアライメント機能が働くことにより、接続対象物同士の位置決めを簡易に行うことができる。   According to this invention, the joint strength between the connection objects can be increased. In addition, since the self-alignment function works due to the configuration of the metal part, it is possible to easily position the connection objects.

以下、この発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1はこの発明の一実施形態に係る電気接続装置の断面図である。   FIG. 1 is a cross-sectional view of an electrical connection device according to an embodiment of the present invention.

図1に示すように、電気接続装置1は絶縁シート(絶縁体)3と複数の導電性部材5と複数のホールドダウン部材(金属部)7とを備えている。電気接続装置1は主に一方の接続対象物であるプリント配線板21(図3D参照)と他方の接続対象物であるコネクタ22(図3D参照)とを機械的かつ電気的に接続するいわゆる永久接続型の電気接続装置である。   As shown in FIG. 1, the electrical connecting device 1 includes an insulating sheet (insulator) 3, a plurality of conductive members 5, and a plurality of hold-down members (metal parts) 7. The electrical connection device 1 is a so-called permanent connection that mechanically and electrically connects mainly a printed wiring board 21 (see FIG. 3D) which is one connection object and a connector 22 (see FIG. 3D) which is the other connection object. It is a connection type electrical connection device.

絶縁シート3は基材シート31と熱硬化性樹脂層32とを有する。基材シート31の材料としては、絶縁シート3のXY方向(絶縁シート3の縦方向と横方向)の伸展を妨げて導電性部材5及びホールドダウン部材7のピッチずれを防止するために、耐引張り性が高く、熱膨張係数が低い材料が好ましい。具体的にはポリイミドやアラミド等が好ましい。   The insulating sheet 3 has a base sheet 31 and a thermosetting resin layer 32. As a material of the base sheet 31, in order to prevent the conductive member 5 and the hold-down member 7 from being shifted in pitch in order to prevent the insulating sheet 3 from extending in the XY directions (the vertical direction and the horizontal direction of the insulating sheet 3). A material having high tensile properties and a low coefficient of thermal expansion is preferred. Specifically, polyimide, aramid and the like are preferable.

熱硬化性樹脂層32は基材シート31の上面及び下面に設けられている。熱硬化性樹脂層32は接着剤層である。熱硬化性樹脂層32の材料としては、熱硬化温度(例えば150〜200℃)にさらされると一旦軟化し、その後時間の経過とともに硬化するものが好ましい。具体的にはエポキシ樹脂が好ましい。   The thermosetting resin layer 32 is provided on the upper surface and the lower surface of the base sheet 31. The thermosetting resin layer 32 is an adhesive layer. The material of the thermosetting resin layer 32 is preferably one that softens once when exposed to a thermosetting temperature (for example, 150 to 200 ° C.) and then cures with time. Specifically, an epoxy resin is preferable.

絶縁シート3には複数の貫通孔3a,3bが形成されている。貫通孔3aは所定間隔に配置されている。貫通孔3bは絶縁シート3の両端部に位置している。   The insulating sheet 3 has a plurality of through holes 3a and 3b. The through holes 3a are arranged at a predetermined interval. The through holes 3 b are located at both ends of the insulating sheet 3.

複数の導電性部材5はそれぞれ円柱状であり、絶縁シート3の貫通孔3aに固定状態で収容されている。導電性部材5の両端部は貫通孔3aから突出している。導電性部材5の材料は導電性及び弾性を有する。具体的にはシリコーン樹脂等の弾性樹脂材料中にAuやAg等の導電性金属微粒子を混入したものが好ましい。   Each of the plurality of conductive members 5 has a cylindrical shape, and is accommodated in the through hole 3 a of the insulating sheet 3 in a fixed state. Both ends of the conductive member 5 protrude from the through hole 3a. The material of the conductive member 5 has conductivity and elasticity. Specifically, an elastic resin material such as a silicone resin in which conductive metal fine particles such as Au and Ag are mixed is preferable.

複数のホールドダウン部材7はそれぞれ円柱状であり、絶縁シートの3の貫通孔3bに固定状態で収容されている。ホールドダウン部材7の両端部は貫通孔3bから突出している。ホールドダウン部材7は低融点金属で形成されている。この低融点金属の融点は熱硬化性樹脂層32の熱硬化温度よりも低い(例えば110〜140℃)。低融点金属としては金属微粒子とフラックスとを混合したペースト状のものが好ましい。金属微粒子の具体例としてSn−Bi合金の微粒子やSn−In合金の微粒子が挙げられる。   Each of the plurality of hold-down members 7 has a cylindrical shape, and is housed in a fixed state in the three through holes 3b of the insulating sheet. Both end portions of the hold-down member 7 protrude from the through hole 3b. The hold-down member 7 is made of a low melting point metal. The melting point of the low melting point metal is lower than the thermosetting temperature of the thermosetting resin layer 32 (for example, 110 to 140 ° C.). The low melting point metal is preferably a paste in which metal fine particles and a flux are mixed. Specific examples of the metal fine particles include Sn—Bi alloy fine particles and Sn—In alloy fine particles.

プリント配線板21(図3D参照)は端子部211と接続部212とを有する。端子部211は導電性部材5と接触する。端子部211の断面(横断面)の形状及び大きさは導電性部材5の断面(横断面)の形状及び大きさとほぼ同じである。接続部212にはホールドダウン部材7が溶接される。接続部212の断面(横断面)の形状及び大きさはホールドダウン部材7の断面(横断面)の形状及び大きさとほぼ同じである。   The printed wiring board 21 (see FIG. 3D) has a terminal portion 211 and a connection portion 212. The terminal portion 211 is in contact with the conductive member 5. The shape and size of the cross section (transverse cross section) of the terminal portion 211 are substantially the same as the shape and size of the cross section (transverse cross section) of the conductive member 5. The hold-down member 7 is welded to the connection part 212. The shape and size of the cross section (transverse section) of the connecting portion 212 are substantially the same as the shape and size of the cross section (transverse section) of the hold-down member 7.

コネクタ22(図3D参照)は端子部221と接続部222とを有する。端子部221は導電性部材5と接触する。端子部221の断面(横断面)の形状及び大きさは導電性部材5の断面(横断面)の形状及び大きさとほぼ同じである。接続部222にはホールドダウン部材7が溶接される。接続部222の断面(横断面)の形状及び大きさはホールドダウン部材7の断面(横断面)の形状及び大きさとほぼ同じである。   The connector 22 (see FIG. 3D) has a terminal part 221 and a connection part 222. The terminal part 221 is in contact with the conductive member 5. The shape and size of the cross section (transverse cross section) of the terminal portion 221 are substantially the same as the shape and size of the cross section (transverse cross section) of the conductive member 5. The hold-down member 7 is welded to the connecting portion 222. The shape and size of the cross section (transverse section) of the connecting portion 222 are substantially the same as the shape and size of the cross section (transverse section) of the hold-down member 7.

図2は図1に示す電気接続装置の製造工程を示し、図2Aは基材シートに熱硬化性樹脂層を形成した状態を示す断面図、図2Bは絶縁シートに貫通孔を形成した状態を示す断面図、図2Cは貫通孔に導電性部材及びホールドダウン部材を形成した状態を示す断面図、図2Dは熱硬化性樹脂層から離型薄膜を剥がした状態を示す断面図である。   2 shows a manufacturing process of the electrical connection device shown in FIG. 1, FIG. 2A is a cross-sectional view showing a state in which a thermosetting resin layer is formed on the base sheet, and FIG. 2B shows a state in which through holes are formed in the insulating sheet. 2C is a cross-sectional view showing a state in which a conductive member and a hold-down member are formed in the through hole, and FIG. 2D is a cross-sectional view showing a state in which the release thin film is peeled off from the thermosetting resin layer.

図2A〜Dに基づいて、電気接続装置の製造工程を説明する。   A manufacturing process of the electrical connection device will be described based on FIGS.

まず、図2Aに示すように、基材シート31の表面及び裏面にそれぞれ熱硬化性樹脂層32を貼り付けて絶縁シート3を作成する。その後、各熱硬化性樹脂層32の表面に離型薄膜9を貼り付ける。   First, as shown to FIG. 2A, the thermosetting resin layer 32 is each affixed on the surface and back surface of the base material sheet 31, and the insulating sheet 3 is created. Thereafter, the release thin film 9 is attached to the surface of each thermosetting resin layer 32.

次に、図2Bに示すように、絶縁シート3及び離型薄膜9に貫通孔3a,3b,91,92を形成する。貫通孔3a,3b,91,92の形成はレーザ加工或いはパンチング加工によって行われる。レーザ加工する場合、Co2レーザやYGAレーザが用いられる。離型薄膜9を剥がすときの熱の影響や、狭ピッチに対応するために微細な貫通孔3a,91を形成することを考慮すると、YAGの3次元高周波を用いるのが望ましい。 Next, as shown in FIG. 2B, through holes 3 a, 3 b, 91, and 92 are formed in the insulating sheet 3 and the release thin film 9. The through holes 3a, 3b, 91, 92 are formed by laser processing or punching processing. In the case of laser processing, a Co 2 laser or a YGA laser is used. Considering the influence of heat when peeling the release thin film 9 and the formation of fine through holes 3a and 91 to cope with a narrow pitch, it is desirable to use a three-dimensional high frequency of YAG.

その後、図2Cに示すように、貫通孔3a,91に導電性部材5のペースト状の材料を充填し、貫通孔3b,92にホールドダウン部材7のペースト状の材料を充填する。充填は例えば印刷やディスペンサ等で行われる。   Thereafter, as shown in FIG. 2C, the through-holes 3a and 91 are filled with the paste-like material of the conductive member 5, and the through-holes 3b and 92 are filled with the paste-like material of the hold-down member 7. The filling is performed by, for example, printing or a dispenser.

最後に、熱硬化性樹脂層32から離型薄膜9を剥がす。その結果、図2Dに示すように、導電性部材5及びホールドダウン部材7の両端部がそれぞれ熱硬化性樹脂層32から僅かに突出する。   Finally, the release thin film 9 is peeled off from the thermosetting resin layer 32. As a result, as shown in FIG. 2D, both ends of the conductive member 5 and the hold-down member 7 protrude slightly from the thermosetting resin layer 32, respectively.

以上の工程により、電気接続装置1が完成する。   The electrical connection device 1 is completed through the above steps.

図3は図1に示す電気接続装置の使用方法を説明するための図であり、図3Aは図1に示す電気接続装置をプリント配線板上に配置した状態を示す断面図、図3Bは図3Aに示す電気接続装置上にコネクタを配置した状態を示す断面図、図3Cは図3Bに示す電気接続装置をホールドダウン部材の融点温度で過熱した状態を示す断面図、図3Dはコネクタをプレス機で押している状態を示す断面図、図3Eはプリント配線板とコネクタとの接合作業が完了した状態を示す断面図である。   3 is a view for explaining a method of using the electrical connection device shown in FIG. 1. FIG. 3A is a cross-sectional view showing a state in which the electrical connection device shown in FIG. 1 is arranged on a printed wiring board. FIG. 3A is a cross-sectional view showing a state in which the connector is disposed on the electrical connection device shown in FIG. 3A, FIG. 3C is a cross-sectional view showing a state in which the electrical connection device shown in FIG. 3B is overheated at the melting point temperature of the holddown member, and FIG. FIG. 3E is a cross-sectional view showing a state in which the joining operation between the printed wiring board and the connector is completed.

次に、電気接続装置1の接続作業について説明する。   Next, connection work of the electrical connection device 1 will be described.

まず、図3Aに示すように、プリント配線板21上に電気接続装置1を載せる。このとき、プリント配線板21に対して電気接続装置1を位置決めする。その結果、電気接続装置1の導電性部材5はプリント配線板21の端子部211に接触し、電気接続装置1のホールドダウン部材7はプリント配線板21の接続部212に接触する。   First, as shown in FIG. 3A, the electrical connection device 1 is placed on the printed wiring board 21. At this time, the electrical connecting device 1 is positioned with respect to the printed wiring board 21. As a result, the conductive member 5 of the electrical connection device 1 contacts the terminal portion 211 of the printed wiring board 21, and the hold-down member 7 of the electrical connection device 1 contacts the connection portion 212 of the printed wiring board 21.

次に、図3Bに示すように、電気接続装置1上にコネクタ22を載せる。このとき、電気接続装置1に対してコネクタ22を位置決めする。その結果、電気接続装置1の導電性部材5はコネクタ22の端子部221に接触し、電気接続装置1のホールドダウン部材7はコネクタ22の接続部222に接触する。   Next, as shown in FIG. 3B, the connector 22 is placed on the electrical connection device 1. At this time, the connector 22 is positioned with respect to the electrical connection device 1. As a result, the conductive member 5 of the electrical connection device 1 contacts the terminal portion 221 of the connector 22, and the holddown member 7 of the electrical connection device 1 contacts the connection portion 222 of the connector 22.

その後、ホールドダウン部材7の融点温度よりも高く、熱硬化性樹脂層32の熱硬化温度よりも低い温度で電気接続装置1を加熱する。そうすると、図3Cに示すように、ホールドダウン部材7が溶融し、溶融したホールドダウン部材7の表面張力により、貫通孔3bの中心線とプリント配線板21の接続部212の中心とが自動的に重なり、同様に、貫通孔3bの中心線とコネクタ22の接続部222の中心とが自動的に重なり、いわゆるセルフアライメント機能が働く。その結果、電気接続装置1に対してプリント配線板21と電気接続装置1とが正確に位置決めされる。   Thereafter, the electrical connection device 1 is heated at a temperature higher than the melting point temperature of the hold-down member 7 and lower than the thermosetting temperature of the thermosetting resin layer 32. Then, as shown in FIG. 3C, the hold-down member 7 is melted, and the center line of the through hole 3b and the center of the connection portion 212 of the printed wiring board 21 are automatically set by the surface tension of the melted hold-down member 7. Similarly, the center line of the through hole 3b and the center of the connecting portion 222 of the connector 22 are automatically overlapped, and a so-called self-alignment function works. As a result, the printed wiring board 21 and the electrical connection device 1 are accurately positioned with respect to the electrical connection device 1.

次に、熱硬化性樹脂層32の熱硬化温度よりも高い所定の温度で所定時間電気接続装置1を加熱しながら、図3Dに示すように、プレス機23でコネクタ22を所定の圧力で押圧する。   Next, as shown in FIG. 3D, the connector 22 is pressed with a predetermined pressure by the press machine 23 while heating the electrical connection device 1 for a predetermined time at a predetermined temperature higher than the thermosetting temperature of the thermosetting resin layer 32. To do.

熱硬化性樹脂層3の温度が熱硬化温度に達すると熱硬化性樹脂層3は一旦軟化し、その後硬化し、プリント配線板21とコネクタ22とが熱硬化性樹脂層3によって接着される。熱硬化性樹脂層3が軟化したとき導電性部材5は圧縮され、その状態で熱硬化性樹脂層3が硬化する(図3E参照)。したがって、プリント配線板21の端子部211と導電性部材5との間、コネクタ22の端子部221と導電性部材5との間に、それぞれ安定した導通状態を確保するために必要な接触力が生じる。   When the temperature of the thermosetting resin layer 3 reaches the thermosetting temperature, the thermosetting resin layer 3 is once softened and then cured, and the printed wiring board 21 and the connector 22 are bonded together by the thermosetting resin layer 3. When the thermosetting resin layer 3 is softened, the conductive member 5 is compressed, and the thermosetting resin layer 3 is cured in this state (see FIG. 3E). Therefore, the contact force required to secure a stable conductive state is ensured between the terminal portion 211 of the printed wiring board 21 and the conductive member 5 and between the terminal portion 221 of the connector 22 and the conductive member 5. Arise.

その後、電気接続装置1を冷却する。このとき、ホールドダウン部材7が硬化し、接続部212,222に溶接される。   Thereafter, the electrical connection device 1 is cooled. At this time, the hold-down member 7 is cured and welded to the connection portions 212 and 222.

以上の作業により、図3Eに示すように、電気接続装置1によるプリント配線板21とコネクタ22との機械的かつ電気的な接続作業が完了する。   With the above operation, as shown in FIG. 3E, the mechanical and electrical connection work between the printed wiring board 21 and the connector 22 by the electrical connection device 1 is completed.

この実施形態によれば、熱硬化性樹脂層32によってプリント配線板21とコネクタ22とが接合されるとともに、ホールドダウン部材7が接続部212,222に溶接されるので、プリント配線板21とコネクタ22との接合強度を高くすることができる。したがって、例えばコネクタ22が大きくてもコネクタ22とプリント配線板21との接合強度が不足することはない。   According to this embodiment, the printed wiring board 21 and the connector 22 are joined by the thermosetting resin layer 32, and the hold-down member 7 is welded to the connection portions 212 and 222. The bonding strength with 22 can be increased. Therefore, for example, even if the connector 22 is large, the bonding strength between the connector 22 and the printed wiring board 21 will not be insufficient.

また、ホールドダウン部材7が熱硬化性樹脂層32の熱硬化温度よりも低い融点を有する金属で形成されているので、溶融時の表面張力を利用したセルフアライメント機能が働く。   Further, since the hold-down member 7 is formed of a metal having a melting point lower than the thermosetting temperature of the thermosetting resin layer 32, a self-alignment function using surface tension at the time of melting works.

更に、絶縁シート3は低い熱膨張係数及び高い耐引張り性を有する基材シート31を備えているので、電気接続装置1のXY方向への伸張を抑えることができ、プリント配線板21の端子部211と導電性部材5とのピッチずれを防ぐことができるとともに、コネクタ22の端子部221と導電性部材5とのピッチずれを防ぐことができる。   Furthermore, since the insulating sheet 3 includes the base sheet 31 having a low coefficient of thermal expansion and high tensile resistance, it is possible to suppress the extension of the electrical connecting device 1 in the XY direction, and the terminal portion of the printed wiring board 21. The pitch deviation between the 211 and the conductive member 5 can be prevented, and the pitch deviation between the terminal portion 221 of the connector 22 and the conductive member 5 can be prevented.

なお、この実施形態の電気接続装置1のホールドダウン部材7は円柱状で絶縁シート3を貫通しているが、ホールドダウン部材7は絶縁シート3を貫通している必要は無く、例えば帯状のホールドダウン部材を絶縁シート3の一端部の外周面に巻き付けるように固着してもよい。   The hold-down member 7 of the electrical connection device 1 according to this embodiment is cylindrical and penetrates the insulating sheet 3. However, the hold-down member 7 does not need to penetrate the insulating sheet 3, for example, a belt-like hold The down member may be fixed so as to be wound around the outer peripheral surface of one end of the insulating sheet 3.

また、この実施形態では2つの接続対象物としてプリント配線板21とコネクタ22との接続について述べたが、これ以外の接続すべき対象物としては半導体デバイス等の電子部品がある。   In this embodiment, the connection between the printed wiring board 21 and the connector 22 has been described as two connection objects, but other objects to be connected include electronic components such as semiconductor devices.

なお、この実施形態では、絶縁シート3に基材シート31を設けたが、基材シート31を省略してもよい。   In this embodiment, the base sheet 31 is provided on the insulating sheet 3, but the base sheet 31 may be omitted.

図1はこの発明の一実施形態に係る電気接続装置の断面図である。FIG. 1 is a cross-sectional view of an electrical connection device according to an embodiment of the present invention. 図2Aは基材シートに熱硬化性樹脂層を形成した状態を示す断面図である。FIG. 2A is a cross-sectional view showing a state in which a thermosetting resin layer is formed on a base sheet. 図2Bは絶縁シートに貫通孔を形成した状態を示す断面図である。FIG. 2B is a cross-sectional view showing a state where through holes are formed in the insulating sheet. 図2Cは貫通孔に導電性部材及びホールドダウン部材を形成した状態を示す断面図である。FIG. 2C is a cross-sectional view showing a state in which a conductive member and a hold-down member are formed in the through hole. 図2Dは熱硬化性樹脂層から離型薄膜を剥がした状態を示す断面図である。FIG. 2D is a cross-sectional view showing a state where the release thin film is peeled off from the thermosetting resin layer. 図3Aは図1に示す電気接続装置をプリント配線板上に配置した状態を示す断面図である。FIG. 3A is a cross-sectional view showing a state where the electrical connection device shown in FIG. 1 is arranged on a printed wiring board. 図3Bは図3Aに示す電気接続装置上にコネクタを配置した状態を示す断面図である。FIG. 3B is a cross-sectional view illustrating a state in which the connector is disposed on the electrical connection device illustrated in FIG. 3A. 図3Cは図3Bに示す電気接続装置をホールドダウン部材の融点温度で過熱した状態を示す断面図である。3C is a cross-sectional view showing a state where the electrical connection device shown in FIG. 3B is overheated at the melting point temperature of the hold-down member. 図3Dはコネクタをプレス機で押している状態を示す断面図である。FIG. 3D is a cross-sectional view showing a state where the connector is being pressed by a press. 図3Eはプリント配線板とコネクタとの接合作業が完了した状態を示す断面図である。FIG. 3E is a cross-sectional view showing a state in which the operation of joining the printed wiring board and the connector is completed.

符号の説明Explanation of symbols

1 電気接続装置
3 絶縁シート(絶縁体)
31 基材シート
32 熱硬化性樹脂層
5 導電性部材
7 ホールドダウン部材(金属部)
21 プリント配線板(接続対象物)
211 端子部
212 接続部
22 コネクタ(接続対象物)
221 端子部
222 接続部
1 Electrical connection device 3 Insulation sheet (insulator)
31 Substrate sheet 32 Thermosetting resin layer 5 Conductive member 7 Hold down member (metal part)
21 Printed wiring board (object to be connected)
211 Terminal section 212 Connection section 22 Connector (object to be connected)
221 Terminal 222 Connection

Claims (7)

2つの接続対象物間に配置され、それらの接続対象物を機械的かつ電気的に接続する電気接続装置において、
前記2つの接続対象物を接合するための熱硬化性を有するシート状の絶縁体と、
前記絶縁体にその一方の面から他方の面へ貫通するように設けられ、前記2つの接続対象物のそれぞれに設けられた端子部間を導通させるための複数の弾性を有する柱状の導電性部材と、
前記絶縁体に設けられ、前記絶縁体の硬化温度より低い融点を有し、前記2つの接続対象物のそれぞれに設けられた接続部に溶接するための金属部と
を備えていることを特徴とする電気接続装置。
In an electrical connection device that is arranged between two connection objects and mechanically and electrically connects the connection objects,
A sheet-like insulator having thermosetting properties for joining the two connection objects;
A columnar conductive member having a plurality of elasticity, which is provided in the insulator so as to penetrate from one surface to the other surface, and conducts between the terminal portions provided in each of the two connection objects. When,
A metal portion provided on the insulator, having a melting point lower than a curing temperature of the insulator, and welded to a connection portion provided on each of the two connection objects. Electrical connection device.
前記金属部が柱状であり、前記絶縁体の一方の面から他方の面へ貫通していることを特徴とする請求項1記載の電気接続装置。   The electrical connection device according to claim 1, wherein the metal portion is columnar and penetrates from one surface of the insulator to the other surface. 前記絶縁体は、低い熱膨張係数及び高い耐引張り性を有する基材シートと、この基材シートの両面に配置された熱硬化性樹脂層とを有することを特徴とする請求項1又は2記載の電気接続装置。   The said insulator has the base material sheet which has a low thermal expansion coefficient and high tensile resistance, and the thermosetting resin layer arrange | positioned on both surfaces of this base material sheet, The Claim 1 or 2 characterized by the above-mentioned. Electrical connection device. 前記基材シートの材料がポリイミド又はアラミドであることを特徴とする請求項3項記載の電気接続装置。   The electrical connection device according to claim 3, wherein a material of the base sheet is polyimide or aramid. 前記熱硬化性樹脂層の材料がエポキシ系樹脂であることを特徴とする請求項3又は4項記載の電気接続装置。   The electrical connection device according to claim 3 or 4, wherein the material of the thermosetting resin layer is an epoxy resin. 前記導電性部材が、弾性樹脂材料と、この弾性樹脂材料に混入された導電性金属粒子とで構成されていることを特徴とする請求項1〜5のいずれか1項記載の電気接続装置。   The electrical connection device according to claim 1, wherein the conductive member includes an elastic resin material and conductive metal particles mixed in the elastic resin material. 前記金属部が、フラックスと、このフラックスに混入された導電性金属粒子とで構成されていることを特徴とする請求項1〜6のいずれか1項記載の電気接続装置。   The electrical connection device according to claim 1, wherein the metal part is composed of a flux and conductive metal particles mixed in the flux.
JP2007204851A 2007-08-07 2007-08-07 Electrical connection device Active JP4755151B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021029307A1 (en) * 2019-08-09 2021-02-18 積水ポリマテック株式会社 Connection component and connection structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259609A (en) * 2004-03-12 2005-09-22 Auto Network Gijutsu Kenkyusho:Kk Electric connection structure and electric connection box for automobile comprising the electric connection structure
JP2008234996A (en) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd Anisotropic conductive sheet, its manufacturing method, wiring board connection body, wiring board module, and electronic apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259609A (en) * 2004-03-12 2005-09-22 Auto Network Gijutsu Kenkyusho:Kk Electric connection structure and electric connection box for automobile comprising the electric connection structure
JP2008234996A (en) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd Anisotropic conductive sheet, its manufacturing method, wiring board connection body, wiring board module, and electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021029307A1 (en) * 2019-08-09 2021-02-18 積水ポリマテック株式会社 Connection component and connection structure
EP4012842A4 (en) * 2019-08-09 2023-08-02 Sekisui Polymatech Co., Ltd. Connection component and connection structure

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