JP2009038269A - Method of hermetically sealing electronic component package and hermetic sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To hermetically seal an electronic component package having an electronic mounting case covered with a lid body where not only the former but also the latter comprises a thermoplastic resin. <P>SOLUTION: According to this invention, a method of hermetically sealing the electronic component package includes the steps of disposing the lid body comprised of the thermoplastic resin having the transmissivity to laser light on the electronic component package which is provided with an aperture on an upper surface comprised of the thermoplastic resin having the absorptivity to the laser light and in which the electronic components are mounted, irradiating the laser light to the portion on which the lid body and electronic component package are superimposed from the upper direction, and melting the thermoplastic resin to weld the lid body and laser irradiated portion of the electronic package. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method and apparatus for hermetic sealing of an electronic component package, and in particular, an electronic component package filled with a hollow structure or silicon oil and a lid body are both resin-welded with a laser. The present invention relates to a hermetic sealing method for realizing hermetic sealing and a hermetic sealing device.

  Conventionally, many electronic component cases that require hermetic sealing use ceramic. For example, a surface-mount type surface acoustic wave filter that needs to be hermetically sealed because it is sensitive to moisture, a surface acoustic wave element is chip-mounted in a ceramic case, and a metal lid is welded and sealed after wire bonding The structure is adopted.

  However, the structure using the ceramic case has a problem that the ceramic case is expensive and the degree of freedom of the shape of the ceramic case is small.

  Therefore, a case made of, for example, an epoxy resin has been used instead of the ceramic case. On the other hand, the lid is made of metal as usual, and since the metallized layer is not formed on the case, it cannot be welded and sealed as in the prior art, so the case and the lid are bonded with an adhesive. FIG. 11 is a sectional view of a case and a lid that are hermetically sealed by this conventional method. For this reason, the adhesive 211 is applied to the inner peripheral surface of the case 201. After the adhesive 211 is applied to the lid 204, it is temporarily cured to a viscosity that does not cause the surface to become sticky by evaporating the diluent, and the lid is interposed through the adhesive 211 in such a temporarily cured state. After the cover 204 is placed on the case 201, it is further cured by being heated, whereby airtightness in the cavity 202 is secured.

JP 2001-237560 A

  However, in such hermetic sealing, since an adhesive is used, there is a drawback in that it requires trouble in processes such as application of adhesive and heat curing. There is a strong demand for miniaturization of electronic components, and this drawback is becoming increasingly serious.

  In addition, the adhesive applied to the lid body temporarily becomes in a low-viscosity state during the main curing, and flows and spreads so as to conform to the bonding surface between the case and the lid body. At this time, if the adhesive flows into the case, it affects the characteristics of the internal electronic component element, and the original characteristics cannot be obtained.

  Furthermore, in the conventional case described above, when applying the adhesive to the adhesive surface of the lid, it is common to apply the adhesive by discharging it from a dispenser. It is difficult to manage, and if the discharge amount is small, the adhesive strength is insufficient, and if the discharge amount is too large, there is a drawback that the flow into the case frequently occurs.

  The present invention has been made to solve the above-described problems. The lid body is also made of a thermoplastic resin, and the lid body and the electronic component package are welded to each other using a semiconductor laser, whereby the electronic component package is sealed. A first object is to provide a method for hermetically sealing, and a second object is to provide a hermetic sealing device for an electronic component package used in this hermetic sealing method.

  An airtight sealing method for an electronic component package according to the present invention includes an opening on an upper surface made of a thermoplastic resin that absorbs laser light, and a laser is mounted on the electronic component package on which the electronic component is mounted. Covering the lid made of a thermoplastic resin that is transparent to light, irradiating the overlapping portion of the lid and the electronic component package with laser light from above the lid, the lid and the electronic component The laser beam irradiation site of the package is welded with resin.

  In this airtight sealing method for the electronic component package, the laser is moved over the entire periphery of the upper opening of the electronic component package and the overlapping portion of the lid by moving the mounting table for mounting the electronic component package. It is characterized by irradiating light.

  Further, the hermetic sealing method of the electronic component package is to maintain a positional relationship between the lid and the electronic component package, and includes a pressing member that is transparent to laser light. It is what.

  Further, in this hermetic sealing method for an electronic component package, the laser irradiation portion is provided for the number of sides around the entire upper surface opening of the electronic component package.

  Further, in this hermetic sealing method of the electronic component package, the laser light irradiation position is obtained from the shape of the electronic component package and the moving speed of the laser light irradiation position, and the output of the laser light is set according to the position. It is characterized by this.

  An airtight sealing device for an electronic component package according to the present invention is transparent to laser light in an opening of an electronic component package made of a thermoplastic resin that has an absorption property for laser light having an opening on the upper surface. The electronic component package is hermetically sealed by placing a thermoplastic resin lid and irradiating the entire circumference of the lid with a laser beam to weld the resin, and this laser beam continuously oscillates. And a laser oscillation means for changing a laser output according to a position of a laser beam irradiated according to a shape of the electronic component package.

  Further, the hermetic sealing device for an electronic component package according to the present invention is transparent to the laser beam through the opening of the electronic component package made of a thermoplastic resin that absorbs the laser beam having an opening on the upper surface. The electronic component package is hermetically sealed by placing a lid made of a thermoplastic resin and having a laser beam applied to the entire periphery of the lid to weld the resin. A laser oscillating unit that continuously oscillates and outputs a laser beam having a laser output according to the above, and a mounting table on which the electronic component package on which the lid is mounted is mounted, the mounting surface being in a vertical direction and a horizontal direction A mounting table that is movable, a laser output measuring unit that measures the laser output by measuring a drive current of a laser element of the laser oscillation unit, and the electronic component package on which the lid is mounted. A mounting table that is movable in a vertical direction and a horizontal direction with respect to the mounting surface; a laser output measuring unit that measures the laser output by measuring a driving current of a laser element of the laser oscillation unit; A laser power supply unit that supplies power to the laser oscillation unit so that a laser output measurement value obtained from the laser output measurement unit matches a preset laser output setting value or waveform, and is generated by the laser oscillation unit A continuous output laser beam is applied to the entire periphery of the lid, and the controller for controlling the laser power source and the mounting table so as to go around the entire periphery of the lid.

  In addition, this hermetic sealing device is transmissive to laser light having a predetermined area larger than that of the lid as a mechanism for preventing variation in the positional relationship between the lid after positioning and the electronic component package. An upper pressing member made of a material having the above and a mounting table on which the electronic component package is mounted, and either the upper pressing member or the mounting table is moved up and down to attach the lid to the opening of the electronic component package. It is characterized by pressing.

  If the electronic component package hermetic sealing method and the hermetic sealing device as described above are used, the laser light is absorbed by the electronic component package and the part is heated, so that the opposing lid also generates heat, and the resin is formed between the two resins. Weld. If this laser irradiation is performed over the entire periphery of the electronic component package, the lid and the electronic component package are joined after cooling, and the hermetic sealing of the electronic component package is completed. Therefore, since the process management becomes easy, the manufacturing cost can be reduced, and the hermetic sealing method and hermetic sealing device for the electronic component package with high reliability can be provided without adversely affecting the characteristics of the built-in electronic component.

  In the present invention, the lid is made of a thermoplastic resin that is transparent to laser light, the case is made of a combination of thermoplastic resins that are absorbent to laser light, and the case is irradiated with laser light from the lid side. Adopting the method to achieve hermetic sealing. That is, heat is generated by laser light irradiation on the case side that absorbs the laser light, and this heat generation melts the resin in the laser irradiation part on the case side, and also melts the resin in the corresponding part of the lid body. Welds. Then, the entire surface of the opening is resin welded by moving the irradiated portion of the laser light along the entire peripheral wall portion of the upper surface opening of the case.

Next, the present invention will be described in detail with reference to the drawings.
1A and 1B are schematic views of a main part of a hermetic sealing execution unit in a hermetic sealing apparatus for an electronic component package according to the present invention, in which FIG. 1A is a front view and FIG. FIG. 2 is a schematic view of the main part of the entire hermetic sealing device. FIG. 3 is a functional block diagram of the main part of the control device in this hermetic sealing device. 4 to 6 are flowcharts for explaining an airtight sealing method for an electronic component package according to the present invention. FIG. 7 is a diagram showing the movement of the sealing position by laser welding when this hermetic sealing method is used. In this embodiment, an electronic component package whose upper surface is rectangular is assumed.

  In FIG. 1, 11 is a base, 13 is a moving member for moving the table 15 in the Z direction (the vertical direction in the figure), 15 is an electronic component package 45, and this electronic component package 45 is placed in the X direction (the depth The table is moved in the front direction and the Y direction (left and right direction in the figure), 17 is a mounting table on which the electronic component package 45 is mounted, 19 is a column that supports the entire hermetic sealing mechanism, and 21 is transparent to laser light The holding member is made of quartz glass or the like and prevents the position change between the lid 43 and the case 41 of the electronic component package 45, the supporting members 23 a and 23 b support the holding member 21, and the laser irradiation unit 31. This is a connecting member that supports the support member 19 by connecting it to the support column 19. Between the connecting member 23b and the pressing member 21, there is provided a sliding portion (not shown) that is movable in the front and depth directions in the drawing and in the left and right directions.

  Reference numeral 31 denotes a laser irradiation unit, 31a denotes a holding unit for an optical fiber cable that guides laser light to a predetermined position, and 41 denotes a concave structure having an opening on the upper surface, which absorbs laser light for mounting electronic components therein. A case 43 made of a thermoplastic resin has a thermoplastic resin 43 that is placed on the upper opening surface of the case 41 and is transparent to laser light for hermetically sealing electronic components mounted in the recesses of the case 41. It is a flat lid member made of resin and having a small thickness. The case 41 and the lid 43 constitute an electronic component package 45. A load detection unit 51 includes a load cell that detects a load when the electronic component package 45 is clamped between the mounting table 17 and the pressing member 21 when the table 15 is moved upward in the drawing.

  In FIG. 2, reference numeral 33 denotes a laser beam generator that generates laser light under the control of the controller 100, and reference numeral 100 denotes a controller that controls the entire hermetic sealing device. This hermetic sealing device receives a separately input operation start command, outputs a command to move the table 15 upward in the drawing, and loads the electronic component package 45 when it is sandwiched between the mounting table 17 and the pressing member 21. When input from the load detection unit 51 and a predetermined load is reached, the laser beam is irradiated from the optical fiber cable in the holding unit 31a of the laser irradiation unit 31, and the table 15 is moved in the front / depth direction and the left / right direction in the drawing. Thus, the electronic component package 45 is hermetically sealed.

  In FIG. 3, 101 is a control unit that instructs overall control of the hermetic sealing device for the electronic component package 45, and 103 is a profile setting unit that sets laser light output in units of time in accordance with the hermetic sealing operation of the electronic component package 45. , 105 is a data storage unit for storing data necessary for hermetic sealing work such as the profile of the laser beam from the profile setting unit 103, and 107 is for transporting the case 41 to the mounting table 17 on the table 15 of the hermetic sealing device. Reference numeral 109 denotes a case conveyance driving unit, 109 denotes a case alignment driving unit that aligns the case 41 placed on the mounting table 17, and 111 denotes a lid conveyance driving unit that conveys the lid 43 covering the case 41 onto the case 41. , 113 is a lid alignment driving unit that aligns the lid 43 with an appropriate position of the opening of the case 41.

115, the electronic component package 45 is placed by moving the table 15 on which the electronic component package 45 placed with the lid 43 aligned with the case 41 is moved in the Z direction (the vertical direction in FIG. 1). A Z-direction table moving drive unit that is sandwiched between the table 17 and the pressing member 21, 117 is a laser output control unit that controls the output of laser light in accordance with the profile data read from the data storage unit 105, and 119 is the table 15 in the X direction An X-direction table moving drive unit 121 moves the laser light in the X direction of the electronic component package 45 by moving the laser beam in the X direction of the electronic component package 45 in FIG. Y-direction table moving drive that moves the laser light in the Y direction of the electronic component package 45 by moving in the direction). It is.

  Next, an explanation will be given of the hermetic sealing method of the electronic component package according to the present invention while explaining the operation of the hermetic sealing device of the electronic component package having such a configuration.

[Profile settings]
A profile is set before starting the hermetic sealing operation (S101 in FIG. 4). This is for accurately executing the output management of the laser beam.
Data necessary for profile setting is input from the profile setting unit 103, a profile including time versus laser light output is set by the control unit 101, and the set profile is stored in the data storage unit 105. This profile is preferably determined experimentally according to the shape of the electronic component package 45 to be hermetically sealed. The data necessary for determining this profile includes the length of the four sides of the electronic component package 45, the moving speed of each direction (X, Y, and Z directions) of the table 15 on which the electronic component package 45 is placed, A laser output corresponding to the irradiation position of the laser beam to the electronic component package 45 and the like, and a profile (laser output corresponding to the elapsed time from the start of laser irradiation) is set from these data. In addition, a threshold value of a load applied to the electronic component package 45 in order to determine the laser irradiation start timing is set.

[Airtight sealing]
After the setting of the profile or the like is completed, an operation start command is input from an input unit (not shown) (S102 in FIG. 4). After the operation start command is input, the hermetic sealing operation is performed under the control of the control unit 101.

  First, the control unit 101 drives case transporting means (not shown) via the case transport driving unit 107, places the case 41 at a specified position of the mounting table 17 on the table 15, and the case alignment driving unit 109. The case alignment means (not shown) is driven via the, and alignment is performed at a predetermined position by aligning the direction of the case 41 (S103 in FIG. 4). As the case transporting means and the case positioning means here, a known carrying mechanism and imaging means can be adopted a position detection mechanism and a mounting mechanism by combining image processing means.

  Subsequently, the control unit 101 drives a lid transport means (not shown) via the lid transport driving unit 111 and places the lid 43 at a predetermined position so as to cover the upper opening surface of the case 41. Then, a lid positioning means (not shown) is driven via the lid positioning drive unit 113 to position the lid 43 at a predetermined position so as to accurately cover the upper surface opening of the case 41 ( S104 in FIG. 4). Also, a known mechanism similar to the above can be employed for the lid transport means and the lid positioning means.

  In this way, the case 41 and the lid 43 are aligned to form an electronic component package 45 including the case 41 and the lid 43. Thereafter, the control unit 101 moves the table 15 upward via the Z-direction table movement driving unit 115 (S105 in FIG. 4). When the table 15 moves upward, the upper surface of the lid 43 on the electronic component package 45 comes into contact with the pressing member 21, but continues to move until a predetermined load is detected. When the table 15 is moved in the Z direction, the load applied to the electronic component package 45 is always detected by the load detection unit 51, and this detected load is taken into the control unit 101 (S106 in FIG. 4).

  The control unit 101 compares the detected load with a set load threshold value. When the detected load exceeds the threshold value, the movement of the table 15 is stopped via the Z-direction table movement driving unit 115, and the load is set. To maintain. From this time onward, the lid 43 and the case 41 maintain the positional relationship in which they are aligned, so that the control unit 101 drives the laser beam generator 33 via the laser output controller 117 to generate the laser beam. The device 33 starts outputting laser light (S107 in FIG. 4). As described above, the laser beam is guided by the optical fiber cable and irradiated to a predetermined position, and the case 41 and the lid 43 are welded to the irradiated portion.

  Next, the control unit 101 starts moving the table 15 in the X1 direction (the depth direction shown in FIG. 1) via the X direction table movement driving unit 119 (S108 in FIG. 4). Then, the control unit 101 drives the laser light generator 33 via the laser output control unit 117 to adjust and irradiate the laser output according to the profile from the data storage unit 105 (S109 in FIG. 4). This movement of the table 15 in the X1 direction continues for the set distance (S110 in FIG. 4), and laser irradiation is executed according to the profile read during that time (S109 in FIG. 4). Thus, the resin welding on the X1 side of the electronic component package 45 is completed (see X1 in FIG. 7).

  Next, the control unit 101 starts moving the table 15 in the Y1 direction (the right direction in FIG. 1) via the Y direction table movement driving unit 121 (S111 in FIG. 5). The control unit 101 adjusts the laser output according to the profile from the data storage unit 105 via the laser output control unit 117 (S112 in FIG. 5). The movement of the table 15 in the Y1 direction continues for the set distance (S113 in FIG. 5), and laser irradiation is executed according to the profile read during that time (S112 in FIG. 5). Thus, the resin welding of the Y1 side of the electronic component package 45 is completed (see Y1 in FIG. 7).

  Next, the control unit 101 starts moving the table 15 in the X2 direction (the front side in the drawing in FIG. 1) via the X direction table movement driving unit 119 (S114 in FIG. 5). Then, the control unit 101 adjusts the laser output according to the profile from the data storage unit 105 via the laser output control unit 117 (S115 in FIG. 5). This movement of the table 15 in the X2 direction continues for the set distance (S116 in FIG. 5), and laser irradiation is executed according to the profile read during that time (S115 in FIG. 5). Thus, the resin welding on the X2 side of the electronic component package 45 is completed (see X2 in FIG. 7).

  Next, the control unit 101 starts to move the table 15 in the Y2 direction (the left direction in FIG. 1) via the Y direction table movement driving unit 121 (S117 in FIG. 6). Then, the control unit 101 adjusts the laser output according to the profile from the data storage unit 105 via the laser output control unit 117 (S118 in FIG. 6). The movement of the table 15 in the Y2 direction continues for the set distance (S119 in FIG. 6), and laser irradiation is executed according to the profile read during that time (S118 in FIG. 6). In this way, resin welding on the Y2 side of the electronic component package 45 is completed (see Y2 in FIG. 7).

  Thus, when the laser irradiation is completed over the entire periphery of the electronic component package 45, the control unit 101 stops the laser output via the laser output control unit 117 (S120 in FIG. 6). And the control part 101 moves the table 15 below via the Z direction table movement drive part 115 (S121 of FIG. 6). Thus, since the resin of the case 41 and the lid 43 is resin welded over the entire periphery of X1, Y1, X2, and Y2 of the electronic component package 45, the hermetic sealing of the electronic component package 45 is completed.

  In the above description, the operation of controlling the movement of the table 15 in the X direction and the movement in the Y direction at different timings has been described. However, by moving the table 15 in both directions at the same time, an electronic component that is not a simple rectangular shape It can also be applied to packages.

The lid body 43a used in the second embodiment is provided with a standing wall having substantially the same outer dimensions as the inner diameter of the opening of the case 41 when the lid body 41 is put on the case 41.
An airtight sealing device and an airtight sealing method for an electronic component package when using such a lid 43a will be described in comparison with the first embodiment.

  In the airtight sealing device for the electronic component package, since it is not necessary to consider the positional deviation between the lid and the case, the pressing member 21 and the load detection unit 51 are not required, and accordingly the associated control block is not required. Become. Further, in the hermetic sealing method, it is not necessary to move the table 15 in the vertical direction.

  Most of the hermetic sealing work using such a hermetic sealing device is the same as that in the first embodiment, and no load is detected because no load is applied. Further, the rest is the same except that the point where the predetermined load is reached and the laser irradiation is started is changed to the point where the lid is positioned and placed on the case.

  In the airtight sealing device for the electronic component package used in the third embodiment, the laser beam generator is one in the first embodiment. However, the two laser beam generators are used to weld the resin in the X direction and the Y direction. Resin welding is performed. In other words, after both sides in the X direction of the electronic component package are welded with resin, the electronic component package is rotated 90 degrees, and both sides in the Y direction of the electronic component package are welded with resin.

First, the airtight sealing device will be described.
FIG. 8 shows a laser irradiation unit 35 used in the third embodiment. Other configurations of the hermetic sealing execution unit are the same as those in the first embodiment. Further, as described above, although not shown, two laser light generators are used, and the laser beams LBa and LBb are irradiated through the optical fiber cables in the holding portions 35a and 35b, respectively. In this embodiment, the case 41 and the lid 43 are welded to the opposite sides of the rectangular electronic component package 45 by heat generated by laser beam irradiation simultaneously. Therefore, the interval between the laser beams must be equal to the interval between the standing walls surrounding the opening of the case 41 of the electronic component package 45, and therefore, an angle control unit 35c that changes the angles of the holding units 35a and 35b is provided.

  The control device 100 (see FIG. 2) is provided with angle control driving units (not shown) for the holding units 35a and 35b. Further, instead of the Y-direction table movement drive unit 119, a table 90-degree rotation drive unit is provided.

  Next, FIGS. 9 and 10 are flowcharts for explaining the hermetic sealing method of the electronic component package according to the present invention, which is Embodiment 3. FIG. In these drawings, the same reference numerals are given to the same operations as those shown in FIGS.

  Next, an explanation will be given of the hermetic sealing method of the electronic component package according to the present invention while explaining the operation of the hermetic sealing device of the electronic component package having such a configuration.

[Profile settings]
The process is the same as in the first embodiment (S101 in FIG. 9). However, in the third embodiment, the distance between opposing sides (X side and Y side) is calculated from the length of the four sides of the electronic component package, and the angles of the holding units 35a and 35b of the laser irradiation unit 35 are changed and built in. The control value is calculated so that the interval at the laser irradiation position corresponds to the X side and the Y side of the electronic component package by changing the angle of the optical fiber cable.

[Airtight sealing]
After the profile setting is completed, an operation start command is input from an input unit (not shown) (S102 in FIG. 9). After the operation start command is input, the hermetic sealing operation is performed under the control of the control unit 101.

  First, the control unit 101 sends the interval in the X direction of the electronic component package 45 to be hermetically sealed to the laser irradiation unit 35 via the angle control driving unit. In response to this, the angle control unit 35c changes the angles of the holding units 35a and 35b to match the interval in the X direction of the electronic component package 45 at the irradiation position of the laser beams LBa and LBb (S131 in FIG. 9).

  Next, the same process as described above is performed from the process of placing the case 41 on the table (S103 in FIG. 9) to the completion of resin welding on the X1 side of the electronic component package 45 (S110 in FIG. 9). However, unlike the foregoing, resin welding on both sides of the X side facing each other is completed at the same time.

  Next, the control unit 101 rotates the table 15 90 degrees around the center of the electronic component package 45 through the table 90-degree rotation driving unit (S132 in FIG. 10). Subsequently, the control unit 101 sends the interval in the Y direction of the electronic component package 45 to the laser irradiation unit 35 via the angle control driving unit. In response to this, the angle control unit 35c changes the angles of the holding units 35a and 35b to match the interval in the Y direction of the electronic component package 45 at the irradiation position of the laser beams LBa and LBb (S133 in FIG. 10).

  Thereafter, the control unit 101 starts moving the table 15 in the X2 direction via the Y-direction table movement driving unit 121 (S114 in FIG. 10). The same process as described above is executed until the resin welding of Y2 side) is completed (S116 in FIG. 10). However, unlike the foregoing, resin welding on both sides of the Y side facing each other is completed at the same time.

  When the laser irradiation is thus completed over the entire periphery of the electronic component package 45, the control unit 101 stops the laser output via the laser output control unit 117 (S120 in FIG. 10). And the control part 101 moves the table 15 below via the Z direction table movement drive part 115 (S121 of FIG. 10). As described above, since the resin of the case 41 and the lid 43 is resin-welded over the entire X side and Y side of the electronic component package 45, the hermetic sealing of the electronic component package 45 is completed.

It is the principal part schematic of the airtight sealing part in the airtight sealing apparatus of the electronic component package which becomes this invention, (a) is a front view, (b) is a side view. It is the principal part schematic which included the airtight sealing part of FIG. 1 including the control part. It is a principal part functional block diagram of this control part. It is a flowchart figure explaining the 1st step when dividing into three steps of the airtight sealing method of the electronic component package which becomes this invention. It is a flowchart figure explaining the 2nd step when dividing into three steps of the airtight sealing method of the electronic component package which becomes this invention. It is a flowchart figure explaining the 3rd step when dividing into the 3 steps of the airtight sealing method of the electronic component package which becomes this invention. It is a figure which shows the movement condition of the sealing position by laser welding when using the airtight sealing method which becomes this invention. It is a schematic diagram of the laser irradiation part used for the other Example of the airtight sealing apparatus of the electronic component package which becomes this invention. It is a flowchart figure explaining the 1st step when the other Example of the airtight sealing method of the electronic component package which becomes this invention is divided into two steps. It is a flowchart figure explaining the 2nd step when the other Example of the airtight sealing method of the electronic component package which becomes this invention is divided into 2 steps. It is sectional drawing of the electronic component package airtightly sealed by the prior art example.

Explanation of symbols

11 base, 13 moving member, 15 table, 17 mounting base, 19 strut,
21 holding member, 23a, 23b support member, 25 connecting member, 31 laser irradiation part, 31a holding part, 41 case, 43 lid, 45 electronic component package,
51 load detector, 33 laser light generator, 100 controller,
101 control unit, 103 profile setting unit, 105 data storage unit,
107 Case transport drive unit, 109 Case alignment drive unit, 111 Lid transport drive unit, 113 Lid alignment drive unit, 115 Z direction table movement drive unit,
117 laser output control unit, 119 X direction table movement drive unit,
121 Y direction table movement drive unit

Claims (9)

On the electronic component package that has an opening on the upper surface made of a thermoplastic resin that absorbs laser light and mounts the electronic component inside,
Cover the lid made of a thermoplastic resin that is transparent to the laser light,
Irradiate a laser beam from above the lid to the overlapping part of the lid and the electronic component package,
A method of hermetically sealing an electronic component package, wherein the lid and the laser beam irradiation portion of the electronic component package are welded together with a resin.   In the irradiation of the laser beam, by moving a mounting table on which the electronic component package is mounted, the laser beam is irradiated over the entire periphery of the upper portion of the electronic component package in the overlapping portion. The method of hermetically sealing an electronic component package according to claim 1.   The hermetic sealing of an electronic component package according to claim 1, further comprising a pressing member that maintains a positional relationship between the lid and the electronic component package and is transparent to laser light. Method.   2. A method for hermetic sealing of an electronic component package according to claim 1, further comprising laser irradiation portions corresponding to the number of sides around the entire upper surface opening of the electronic component package.   The laser light output is obtained by obtaining a laser light irradiation position from a shape of an electronic component package and a moving speed of the laser light irradiation position, and setting the laser light output according to the position. 2. A method for hermetically sealing an electronic component package according to 1. A lid made of a thermoplastic resin that is transparent to laser light is placed in the opening of an electronic component package made of a thermoplastic resin that absorbs laser light having an opening on the top surface. An electronic component package hermetic sealing device that hermetically seals the electronic component package by irradiating the entire circumference of the body with laser light and resin welding,
An airtight sealing device for an electronic component package comprising laser oscillation means for changing the laser output according to the position of the laser beam irradiated according to the shape of the electronic component package, wherein the laser beam has a continuous oscillation output. . A lid made of a thermoplastic resin that is transparent to laser light is placed in the opening of an electronic component package made of a thermoplastic resin that absorbs laser light having an opening on the top surface. An electronic component package hermetic sealing device that hermetically seals the electronic component package by irradiating the entire circumference of the body with laser light and resin welding,
A laser oscillation unit that continuously oscillates and outputs a laser beam having a laser output corresponding to the supplied power;
A mounting table for mounting the electronic component package on which the lid is mounted, the mounting table being movable in a vertical direction and a horizontal direction with respect to the mounting surface;
A laser output measuring unit that measures the laser output by measuring a drive current of a laser element of the laser oscillation unit;
A laser power supply unit that supplies power to the laser oscillation unit so that a laser output measurement value obtained from the laser output measurement unit matches a preset laser output setting value or waveform;
Control for controlling the laser power supply unit and the mounting table so that the continuous output laser beam generated from the laser oscillation unit is irradiated to the entire peripheral portion of the lid body and goes around the entire peripheral portion of the lid body The airtight sealing device for an electronic component package according to claim 1, further comprising:   2. The hermetic sealing device for an electronic component package according to claim 1, wherein the lid is provided with a protrusion that matches the opening of the electronic component package. As a mechanism for preventing variation in the positional relationship between the lid after positioning and the electronic component package,
An upper pressing member made of a material that is transparent to laser light having a predetermined area larger than the lid,
A mounting table for mounting the electronic component package;
2. An airtight sealing device for an electronic component package according to claim 1, wherein either the upper pressing member or the mounting table is moved up and down to press the lid against the opening of the electronic component package.

Images