JP2009032943A - Printed circuit board for light-emitting element - Google Patents
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Abstract
Description
本発明は、発光素子用のプリント配線基板、および当該発光素子用プリント配線基板に発光素子が搭載された発光デバイスに関するものである。 The present invention relates to a printed wiring board for a light emitting element and a light emitting device in which the light emitting element is mounted on the printed wiring board for the light emitting element.
発光ダイオード(LED)などの発光素子は、携帯電話、液晶ディスプレイのバックライト、電光板、信号、車のテールランプなどに使用されており、今後、車のヘッドライトや照明などさらに多方面で実用化される可能性が見込まれている。かかる発光素子を実装する基板において、発光素子自体は特定方向に光を発するのではなく全方向に向けて発光するため、基板前面方向だけでなく基板側に向かって出射される光も存在する。また、発光素子から発せられる光の一部は上部スクリーンや側面等で反射し、基板側へ戻ってくる。これらの光を基板前面方向に反射させることにより、発光デバイスとしての発光効率が改善される。この様な方法としては、従来、以下のものが知られている。
1.基板自体にチタン等の白色粉末を混ぜ基板を白色化させる方法
2.基板材料自体を液晶ポリマーなど光を反射し易い白色に近い材料にする方法
3.通常の基板の表面に白色のソルダーレジストを使用する方法。
Light-emitting diodes (LEDs) and other light-emitting elements are used in mobile phones, liquid crystal display backlights, lightning boards, signals, car tail lamps, etc., and will be put to practical use in various fields such as car headlights and lighting. It is expected that In a substrate on which such a light-emitting element is mounted, the light-emitting element itself does not emit light in a specific direction but emits light in all directions, so that there is light emitted not only toward the front surface of the substrate but also toward the substrate side. Further, part of the light emitted from the light emitting element is reflected by the upper screen, the side surface, etc., and returns to the substrate side. By reflecting these lights toward the front surface of the substrate, the light emission efficiency as the light emitting device is improved. Conventionally, the following methods are known as such methods.
1. 1. A method of whitening a substrate by mixing the substrate itself with a white powder such as titanium. 2. A method of making the substrate material itself a material close to white that easily reflects light, such as a liquid crystal polymer. A method of using a white solder resist on the surface of a normal substrate.
しかし上記1の方法では、白色粉末を増やすと基板強度が低下したり粉末が脱落しやすくなるのでその添加量は制限せざるを得ない。よって当該技術における光反射率は85%程度までしか期待できない。上記2の方法では様々な基板材料が検討されていたが、その反射率は一般的にやはり85%程度までであった。また、白色基板の材料としてはPETなどからなる発泡体が考えられるが、一般的な樹脂は半田付けなどのために要求される耐熱性を有さないことから基板の材料とすることは難しい。上記3の方法ではソルダーレジストを用いなければならず乾燥工程などを追加する必要があり、製造効率が低下するという問題があった。 However, in the method 1 described above, when the white powder is increased, the strength of the substrate is lowered or the powder is easily dropped, so the amount of addition must be limited. Therefore, the light reflectance in the technique can be expected only to about 85%. In the above method 2, various substrate materials have been studied, but the reflectance is generally up to about 85%. In addition, a foam made of PET or the like can be considered as a material for the white substrate, but a general resin does not have the heat resistance required for soldering or the like, so that it is difficult to make a material for the substrate. In the above method 3, a solder resist must be used, and it is necessary to add a drying step and the like.
その他にも、上記方法では発光素子から発せられる光に含まれる紫外線によって基板表面の色が変色し易いという問題もあった。 In addition, the above method has a problem that the color of the substrate surface is easily changed by ultraviolet rays contained in the light emitted from the light emitting element.
そこで特許文献1と2に記載の技術では基板材料として多孔質PTFE(ポリテトラフルオロエチレン)からなるシートを光反射部材として用いている。多孔質PTFEはその微細な多孔質構造により光を多方向へ効率的に散乱させることができる上に、紫外線に対する耐性が高く変色の問題もない。また、耐熱性にも優れることから、製造工程において半田付けなどにより熱を受けても変質し難いという利点もある。
上述した様に、発光デバイスにおける光反射部材の優れた材料としては多孔質PTFEが既に知られている。しかし特許文献1は多孔質PTFEシートが光反射部材として優れることを一般的に示しているにすぎない。また、特許文献2は蛍光管などの発光管の周りに設置する光反射部材を示すものである。よって、LEDが搭載されたもののような近年の発光デバイスにそのまま適用できるものではなかった。 As described above, porous PTFE is already known as an excellent material for a light reflecting member in a light emitting device. However, Patent Document 1 merely shows that a porous PTFE sheet is excellent as a light reflecting member. Patent Document 2 shows a light reflecting member installed around an arc tube such as a fluorescent tube. Therefore, it has not been directly applicable to recent light emitting devices such as those equipped with LEDs.
より詳しくは、多孔質PTFEシートを発光素子回路基板の光反射部材とすべく基板の回路面上に積層する場合には、水分やガスの浸入による回路部分の劣化を抑制するために、回路、基板、および多孔質PTFEシートの間に空隙が生じないようにする必要がある。そのため、多孔質PTFEシートの表面または回路面へ単に接着剤を塗布して両者を接着する場合には、接着剤の量を多くするか接着剤の溶融粘度を低くしなければならない。ところが、通常、LEDなどの発光素子は回路面に直接搭載されることから、発光素子を搭載する部分は回路面を露出させるために光反射部材である多孔質PTFEシートに穴を設ける必要がある。その場合、接着剤を過剰に用いたりその溶融粘度を低くすると接着時の圧力により接着剤が平面方向に流れるレジンフローという現象が起こり、接着剤により発光素子の搭載部分が被覆されるという問題が生じ得る。その一方で、このレジンフローを抑制するために接着剤を少なくしたりその溶融粘度を高くすると、基板表面の凹凸を十分に埋め込むことができず、基板内にボイドが発生して耐熱性等が低下する。 More specifically, when the porous PTFE sheet is laminated on the circuit surface of the substrate to serve as a light reflecting member of the light emitting element circuit substrate, in order to suppress deterioration of the circuit portion due to the ingress of moisture or gas, It is necessary to prevent a void from being generated between the substrate and the porous PTFE sheet. Therefore, when the adhesive is simply applied to the surface or circuit surface of the porous PTFE sheet and bonded to each other, the amount of the adhesive must be increased or the melt viscosity of the adhesive must be lowered. However, since light emitting elements such as LEDs are usually mounted directly on the circuit surface, it is necessary to provide a hole in the porous PTFE sheet, which is a light reflecting member, in order to expose the circuit surface in the portion where the light emitting element is mounted. . In that case, if an adhesive is used excessively or its melt viscosity is lowered, a phenomenon called a resin flow in which the adhesive flows in a plane direction due to the pressure during bonding occurs, and the mounting portion of the light emitting element is covered with the adhesive. Can occur. On the other hand, if the adhesive is reduced or the melt viscosity is increased in order to suppress the resin flow, the unevenness of the substrate surface cannot be embedded sufficiently, and voids are generated in the substrate, resulting in heat resistance and the like. descend.
近年、回路基板の高密度化により回路が極めて微細になってきており、上記レジンフローの問題は非常に厳しくなってきている。同時に電子デバイスの長寿命化の要求はさらに高まってきているため、埋め込み性も高める必要がある。しかしながら上述した通り、これら2つの要求を同時に満たすのは接着剤の量や溶融粘度の調整といった手段では不可能であった。 In recent years, the circuit has become very fine due to the high density of circuit boards, and the problem of the resin flow has become very severe. At the same time, since the demand for extending the lifetime of electronic devices is increasing, it is necessary to improve the embedding property. However, as described above, it has been impossible to satisfy these two requirements at the same time by means such as adjusting the amount of adhesive and adjusting the melt viscosity.
そこで本発明が解決すべき課題は、化学的安定性や耐熱性に優れる上に光反射効率の高い多孔質PTFEシートを光反射部材として回路基板に積層するに当たり、レジンフローの抑制と埋め込み性の向上という互いに相反する要求を同時に満たすことができる発光素子用プリント配線基板を提供することを目的とする。 Therefore, the problem to be solved by the present invention is that, when laminating a porous PTFE sheet having excellent chemical stability and heat resistance and high light reflection efficiency on a circuit board as a light reflection member, the resin flow is suppressed and the embedding property is improved. It is an object of the present invention to provide a printed wiring board for a light emitting element that can simultaneously satisfy the mutually contradictory demands for improvement.
本発明者は上記課題を解決すべく鋭意研究を進めた。その結果、多孔質PTFEシートからなる光反射部材と回路基板を接着するに当たり、内部に接着性樹脂が含浸されている多孔質PTFEシートからなる接着性樹脂層を用いれば上記課題を解決できることを見出して本発明を完成した。より詳しくは、接着性樹脂を含浸した多孔質PTFEは、その多孔質ゆえの柔軟性に加えて、溶融粘度の低い接着性樹脂をもその多孔質構造内に保持できることから、レジンフローの抑制と埋め込み性の向上という互いに相反する要求を同時に満たすことができる。 The present inventor has intensively studied to solve the above problems. As a result, it has been found that the above-mentioned problems can be solved by using an adhesive resin layer made of a porous PTFE sheet that is internally impregnated with an adhesive resin when adhering a light reflecting member made of a porous PTFE sheet and a circuit board. The present invention has been completed. More specifically, the porous PTFE impregnated with the adhesive resin can retain the adhesive resin having a low melt viscosity in the porous structure in addition to the flexibility due to the porousness, thereby suppressing the resin flow. It is possible to simultaneously satisfy mutually conflicting demands for improving embedding.
本発明の発光素子用プリント配線基板は、発光素子を搭載するための回路が少なくとも片面に形成されている回路基板と、当該回路面上に接着性樹脂層を介して光反射部材を有する発光素子用プリント配線基板であって;光反射部材は多孔質PTFEシートからなり;接着性樹脂層は内部に接着性樹脂が含浸されている多孔質PTFEシートからなり;且つ、回路の一部が発光素子を搭載するため露出していることを特徴とする。 A printed wiring board for a light-emitting element according to the present invention includes a circuit board on which a circuit for mounting the light-emitting element is formed on at least one surface, and a light reflecting member on the circuit surface via an adhesive resin layer. A light-reflecting member made of a porous PTFE sheet; an adhesive resin layer made of a porous PTFE sheet impregnated with an adhesive resin; and a part of a circuit being a light-emitting element It is exposed because it is mounted.
本発明に係る発光素子用プリント配線基板の接着性樹脂層を構成する多孔質PTFEシートの空孔率としては、40%以上、70%以下が好適である。当該空孔率が40%未満であると上述した埋め込み性の向上と接着性樹脂の保持という作用効果を発揮し難い場合がある。一方、当該空孔率が70%を超えると同じく接着性樹脂を十分に保持することができず、溶融粘度の低い接着性樹脂を用いた場合にレジンフローを抑制できないおそれがある。 The porosity of the porous PTFE sheet constituting the adhesive resin layer of the light emitting element printed wiring board according to the present invention is preferably 40% or more and 70% or less. If the porosity is less than 40%, it may be difficult to achieve the above-described effects of improving the embedding property and holding the adhesive resin. On the other hand, when the porosity exceeds 70%, the adhesive resin cannot be sufficiently retained, and the resin flow may not be suppressed when an adhesive resin having a low melt viscosity is used.
本発明の発光デバイスは、発光素子用プリント配線基板において、露出した回路上に発光素子が搭載されていることを特徴とする。 The light emitting device of the present invention is characterized in that a light emitting element is mounted on an exposed circuit in a printed wiring board for a light emitting element.
本発明の発光素子用プリント配線基板は、多孔質PTFEによる高い光反射率を示すと共に、レジンフローの抑制と埋め込み性の向上という互いに相反する要求を同時に満たすことから高品質であり且つ長寿命である。従って本発明は、近年高まっている発光素子に対する要求を満足させ得るものとして産業上極めて有用である。 The printed wiring board for a light emitting device of the present invention exhibits high light reflectivity due to porous PTFE, and simultaneously satisfies the mutually contradictory requirements of suppressing resin flow and improving embedding property, and thus has high quality and long life. is there. Therefore, the present invention is extremely useful industrially as being capable of satisfying demands for light emitting elements that have been increasing in recent years.
本発明の発光素子用プリント配線基板は、発光素子を搭載するための回路が少なくとも片面に形成されている回路基板と、当該回路面上に接着性樹脂層を介して光反射部材を有する発光素子用プリント配線基板であって;光反射部材は多孔質PTFEシートからなり;接着性樹脂層は内部に接着性樹脂が含浸されている多孔質PTFEシートからなり;且つ、回路の一部が発光素子を搭載するため露出していることを特徴とする。 A printed wiring board for a light-emitting element according to the present invention includes a circuit board on which a circuit for mounting the light-emitting element is formed on at least one surface, and a light reflecting member on the circuit surface via an adhesive resin layer. A light-reflecting member made of a porous PTFE sheet; an adhesive resin layer made of a porous PTFE sheet impregnated with an adhesive resin; and a part of a circuit being a light-emitting element It is exposed because it is mounted.
本発明の発光素子用プリント配線基板は、発光素子を搭載するための回路が少なくとも片面に形成されている回路基板と、当該回路面上に接着性樹脂層を介して光反射部材を有する。回路基板の材料は従来公知のものを特に制限なく用いることができる。例えば、ガラス基板やガラスエポキシ基板のほか、ポリイミド基板や液晶ポリマー基板など高分子からなるフレキシブル基板を使用することもできる。また、回路の材料も特に制限されず、銅や銅合金などを用いることができる。 The printed wiring board for a light emitting element of the present invention has a circuit board on which a circuit for mounting the light emitting element is formed on at least one surface, and a light reflecting member on the circuit surface via an adhesive resin layer. Conventionally known materials can be used for the circuit board without particular limitation. For example, in addition to a glass substrate or a glass epoxy substrate, a flexible substrate made of a polymer such as a polyimide substrate or a liquid crystal polymer substrate can also be used. Further, the circuit material is not particularly limited, and copper, copper alloy, or the like can be used.
回路基板には、片面に回路が形成された片面基板、両面に回路が形成された両面基板、複数の片面基板または両面基板が積層されており3層以上の回路面を有する多層基板がある。本発明ではこれら何れの基板を用いることができるが、少なくとも最外面に形成された回路の一部に発光素子を搭載する。なお、回路の形成方法や基板の積層方法は、従来公知の方法を用いることができる。 Circuit boards include a single-sided board with a circuit formed on one side, a double-sided board with a circuit formed on both sides, and a multi-layer board having a plurality of single-sided boards or a double-sided board and having three or more circuit faces. In the present invention, any of these substrates can be used, but the light emitting element is mounted on at least a part of the circuit formed on the outermost surface. Note that a conventionally known method can be used as a circuit formation method and a substrate lamination method.
本発明の発光素子用プリント配線基板を構成する光反射部材は多孔質PTFEシートからなる。多孔質PTFEシートはPTFEフィブリルが複数のPTFE結節を接続するという多孔質構造を有し、照射された光を効率的に乱反射することができる。また、PTFEという素材自体が優れた耐熱性や化学的安定性を有するので、高熱や紫外線などにも耐性を示す。 The light reflecting member constituting the printed wiring board for a light emitting device of the present invention is made of a porous PTFE sheet. The porous PTFE sheet has a porous structure in which PTFE fibrils connect a plurality of PTFE nodules, and can efficiently diffuse the irradiated light. In addition, since the material PTFE itself has excellent heat resistance and chemical stability, it is resistant to high heat and ultraviolet rays.
光反射部材としての多孔質PTFEの厚さは適宜調節すればよいが、通常はプリント配線基板における厚さで50μm以上、500μm以下程度とすることが好ましい。50μm未満であると光反射効率が低下するおそれがある一方で、500μmを超えるとコストが高くなる他、発光素子を搭載し難くなる場合があり得る。 The thickness of the porous PTFE as the light reflecting member may be adjusted as appropriate, but it is usually preferable to set the thickness of the printed wiring board to about 50 μm or more and 500 μm or less. If the thickness is less than 50 μm, the light reflection efficiency may be lowered. On the other hand, if it exceeds 500 μm, the cost may increase and it may be difficult to mount the light emitting element.
かかる多孔質PTFEシートは市販のものがあれば市販のものを購入して使用してもよいが、例えばPTFE粉末をシートに成形してさらに一軸方向または二軸方向に延伸して多孔質にするなど、公知方法により製造してもよい。 Such a porous PTFE sheet may be purchased and used as long as it is commercially available. For example, PTFE powder is molded into a sheet and further stretched uniaxially or biaxially to make it porous. For example, it may be produced by a known method.
本発明の発光素子用プリント配線基板における回路基板と光反射部材は、内部に接着性樹脂が含浸されている多孔質PTFEシートからなる接着性樹脂層により接着されている。なお、ここでいう「含浸」とは多孔質PTFEシートの多孔質構造中に接着性樹脂が十分に浸入している状態をいい、例えば多孔質PTFEシートの表面へ単に接着性樹脂を塗布するような場合は含浸の定義には含まれないものとする。接着性樹脂を単に塗布するのみでは接着性樹脂が多孔質構造中へ十分に浸入できず、接着性樹脂層を回路基板に熱圧着する際に回路基板の周辺部に空隙が生じるおそれがある。 The circuit board and the light reflecting member in the printed wiring board for a light emitting element of the present invention are bonded to each other with an adhesive resin layer made of a porous PTFE sheet impregnated with an adhesive resin. Here, “impregnation” refers to a state in which the adhesive resin is sufficiently infiltrated into the porous structure of the porous PTFE sheet. For example, the adhesive resin is simply applied to the surface of the porous PTFE sheet. In such cases, the definition of impregnation shall not be included. If the adhesive resin is simply applied, the adhesive resin cannot sufficiently penetrate into the porous structure, and there is a possibility that a void may be generated in the peripheral portion of the circuit board when the adhesive resin layer is thermocompression bonded to the circuit board.
当該接着性樹脂層を構成する多孔質PTFEシートは、光反射部材としての多孔質PTFEシートと同様のものを用いることができるが、その厚さは回路基板と光反射部材を接着する前の状態において10μm以上、50μm以下程度とすることが好ましい。10μm未満であると回路面を十分に被覆することができず回路周辺に空隙が生じるおそれがある一方で、50μmを超えるとコストが高くなる他、レジンフローが大きくなるおそれがある。 The porous PTFE sheet constituting the adhesive resin layer can be the same as the porous PTFE sheet as the light reflecting member, but its thickness is the state before bonding the circuit board and the light reflecting member. In this case, the thickness is preferably about 10 μm or more and 50 μm or less. When the thickness is less than 10 μm, the circuit surface cannot be sufficiently covered, and there is a possibility that voids are generated around the circuit. On the other hand, when the thickness exceeds 50 μm, the cost increases and the resin flow may increase.
多孔質PTFEシートの空孔率としては、40%以上、70%以下が好適である。当該空孔率が40%未満であると上述した埋め込み性の向上と接着性樹脂の保持という作用効果を発揮し難い場合がある。一方、当該空孔率が70%を超えると同じく接着性樹脂を十分に保持することができず、溶融粘度の低い接着性樹脂を用いた場合にレジンフローを抑制できないおそれがある。 The porosity of the porous PTFE sheet is preferably 40% or more and 70% or less. If the porosity is less than 40%, it may be difficult to achieve the above-described effects of improving the embedding property and holding the adhesive resin. On the other hand, when the porosity exceeds 70%, the adhesive resin cannot be sufficiently retained, and the resin flow may not be suppressed when an adhesive resin having a low melt viscosity is used.
多孔質PTFEシートに含浸させる接着性樹脂は、溶融粘度が比較的低いものを用いることが好ましい。溶融粘度の低い接着性樹脂は埋め込み性が高い一方で、各層を熱圧着する際に発光素子を搭載する回路にまで到達するおそれがある。しかし本発明では接着性樹脂を多孔質PTFEに含浸させていることから溶融粘度が比較的低い接着性樹脂であっても、熱圧着時に溶融した樹脂を保持できることから、レジンフローを抑制すると共に埋め込み性の向上が可能になる。 As the adhesive resin impregnated into the porous PTFE sheet, it is preferable to use a resin having a relatively low melt viscosity. The adhesive resin having a low melt viscosity has a high embedding property, but may reach a circuit on which a light emitting element is mounted when thermocompression bonding each layer. However, in the present invention, since porous PTFE is impregnated with an adhesive resin, even if the adhesive resin has a relatively low melt viscosity, the molten resin can be retained during thermocompression bonding. It is possible to improve the performance.
なお、接着性樹脂の溶融粘度は、通常、完全に溶解した状態における粘度として定義される。しかし本発明では、接着性樹脂は多孔質PTFEシートに含浸された上で、比較的短時間の熱プレスにより使用される。よって、本発明における接着性樹脂の溶融粘度は、接着性樹脂を短時間加熱した場合における粘度をいうものとする。例えば、本発明における溶融粘度は、1分間以内に室温から100〜180℃程度まで加熱した場合における樹脂の粘度と定義することができる。 The melt viscosity of the adhesive resin is usually defined as the viscosity in a completely dissolved state. However, in the present invention, the adhesive resin is impregnated into the porous PTFE sheet and then used by a relatively short time hot pressing. Therefore, the melt viscosity of the adhesive resin in the present invention refers to the viscosity when the adhesive resin is heated for a short time. For example, the melt viscosity in the present invention can be defined as the viscosity of a resin when heated from room temperature to about 100 to 180 ° C. within 1 minute.
接着性樹脂層としては、回路基板に対する接着性を有し且つ適度な溶融粘度を有するものから適宜選択すればよい。例えば、エポキシ樹脂、フェノール樹脂、ポリイミド樹脂、BT樹脂などから1種を選択して用いるか、2種以上を選択し混合して用いることができる。好適には、耐熱性、半硬化後における安定性、加工後の硬度、コストの観点などからエポキシ樹脂を用いる。 The adhesive resin layer may be appropriately selected from those having adhesiveness to the circuit board and having an appropriate melt viscosity. For example, one type can be selected and used from an epoxy resin, a phenol resin, a polyimide resin, a BT resin, etc., or two or more types can be selected and mixed for use. Preferably, an epoxy resin is used from the viewpoints of heat resistance, stability after semi-curing, hardness after processing, cost, and the like.
多孔質PTFEシートに接着性樹脂を含浸させて接着性樹脂層とする方法としては常法を用いることができる。例えば、接着性樹脂をメチルエチルケトンやトルエンなどに溶解して多孔質PTFEシートに含浸させた後、乾燥すればよい。或いは、接着性樹脂を含浸させた多孔質PTFEシートの製品をそのまま用いてもよい。かかる製品としては、ジャパンゴアテックス社のFLEXBOND Leafなどがある。 As a method for impregnating the porous PTFE sheet with an adhesive resin to form an adhesive resin layer, a conventional method can be used. For example, the adhesive resin may be dissolved in methyl ethyl ketone or toluene, impregnated in a porous PTFE sheet, and then dried. Alternatively, a porous PTFE sheet product impregnated with an adhesive resin may be used as it is. An example of such a product is FLEXBOND Leaf of Japan Gore-Tex.
なお、光反射部材とする原料多孔質PTFEシートとして100〜500μm程度といった比較的厚いものを用い、その片面のみに接着性樹脂を含浸させて、光反射部材と接着性樹脂層を一体的に形成してもよい。但しこの場合には、接着性樹脂層溶液が毛細管現象により吸い上げられて接着性樹脂層が過剰に厚くなり光反射効率が低下するおそれがある。よって、光反射部材と接着性樹脂層は別々に作製した後に熱圧着する態様が好適である。光反射部材と接着性樹脂層は別々に作製すれば、プリント配線基板における光反射部材と接着性樹脂層の厚さを容易に制御できるからである。 In addition, as a raw material porous PTFE sheet used as a light reflecting member, a relatively thick material such as about 100 to 500 μm is used, and only one side thereof is impregnated with an adhesive resin to integrally form the light reflecting member and the adhesive resin layer. May be. However, in this case, the adhesive resin layer solution is sucked up by capillary action, and the adhesive resin layer becomes excessively thick and the light reflection efficiency may decrease. Therefore, an embodiment in which the light reflecting member and the adhesive resin layer are separately manufactured and then thermocompression bonded is preferable. This is because if the light reflecting member and the adhesive resin layer are produced separately, the thicknesses of the light reflecting member and the adhesive resin layer in the printed wiring board can be easily controlled.
本発明では、接着性樹脂層を介して回路基板と光反射部材を熱圧着する。よって、回路基板の発光素子を搭載する回路面側に接着性樹脂層を積層し、さらにその上に光反射部材を積層した上で一体的に熱圧着してもよい。しかし、本発明では回路の一部に発光素子を搭載する必要があるので、かかる発光素子搭載部に対応する位置で接着性樹脂層と光反射部材に穴を設けなければならない。そのため、先ずは光反射部材と接着性樹脂層を熱圧着した後に発光素子搭載部に対応する位置に穴を形成し、次いでこの積層体の接着性樹脂層側を回路基板の発光素子を搭載する回路面側に積層し、熱圧着することが好ましい。 In the present invention, the circuit board and the light reflecting member are thermocompression bonded via the adhesive resin layer. Therefore, an adhesive resin layer may be laminated on the circuit surface side on which the light emitting element of the circuit board is mounted, and a light reflecting member may be further laminated thereon, and then thermocompression bonding may be performed integrally. However, in the present invention, since it is necessary to mount the light emitting element in a part of the circuit, it is necessary to provide a hole in the adhesive resin layer and the light reflecting member at a position corresponding to the light emitting element mounting portion. Therefore, first, after thermocompression bonding of the light reflecting member and the adhesive resin layer, a hole is formed at a position corresponding to the light emitting element mounting portion, and then the adhesive resin layer side of this laminate is mounted with the light emitting element of the circuit board. It is preferable to laminate on the circuit surface side and perform thermocompression bonding.
熱圧着の条件は、使用する接着性樹脂の種類などにより適宜調整すればよい。例えば、光反射部材と接着性樹脂層を熱圧着する場合には、これらを積層してからその上下にPETシートなどの離型シートを挿入し、温度:50〜150℃、圧力:0.1〜1MPa、熱圧着時間:30秒〜5分間と比較的温和な条件で熱圧着する。次いで、接着性樹脂層側に回路基板の発光素子を搭載する回路面側を重ね合わせ、例えば、温度:100〜200℃、圧力:0.5〜2MPa、熱圧着時間:30〜120分間といった条件で熱圧着する。 What is necessary is just to adjust the conditions of thermocompression bonding suitably by the kind etc. of adhesive resin to be used. For example, in the case where the light reflecting member and the adhesive resin layer are thermocompression bonded, after laminating them, a release sheet such as a PET sheet is inserted above and below, and the temperature: 50 to 150 ° C., pressure: 0.1 ˜1 MPa, thermocompression bonding time: thermocompression bonding under relatively mild conditions of 30 seconds to 5 minutes. Next, the circuit surface side on which the light emitting element of the circuit board is mounted is superimposed on the adhesive resin layer side, for example, conditions such as temperature: 100 to 200 ° C., pressure: 0.5 to 2 MPa, thermocompression bonding time: 30 to 120 minutes. Thermocompression with.
発光素子用プリント配線基板では、発光素子を搭載すべき部分の回路が露出しているため、熱圧着時に溶融した接着性樹脂が当該露出部にはみ出す。かかる現象をレジンフローといい、このレジンフローを抑制するには接着性樹脂の量を減らしたり溶融粘度を高めればよい。しかしそれでは回路の周辺部が接着性樹脂で満たされず空隙ができて基板寿命が短くなるので十分量の接着性樹脂を用いざるを得ない。よって、レジンフローは現在のところ必ず起こると考えるべきである。 In the printed wiring board for a light emitting element, the circuit of the portion where the light emitting element is to be mounted is exposed, and thus the adhesive resin melted at the time of thermocompression protrudes into the exposed portion. Such a phenomenon is called a resin flow. To suppress this resin flow, the amount of the adhesive resin may be reduced or the melt viscosity may be increased. However, since the peripheral portion of the circuit is not filled with the adhesive resin, a gap is formed, and the life of the substrate is shortened. Therefore, a sufficient amount of the adhesive resin must be used. Therefore, it should be considered that resin flow always occurs at present.
従来、かかるレジンフロー量は500μmでも許容されていた。しかし近年では回路の微細化や高密度化が進んでおり、従来の基準では発光素子を搭載すべき回路上にまで接着性樹脂がはみ出す場合がある。よって、本発明では当該レジンフロー量を100μm以下とすることを目標にしている。 Conventionally, such resin flow was allowed even at 500 μm. However, in recent years, the miniaturization and high density of circuits have progressed, and the adhesive resin sometimes protrudes over the circuit on which the light emitting element is to be mounted according to the conventional standard. Therefore, the present invention aims to make the resin flow amount 100 μm or less.
この様に本発明のプリント配線基板はレジンフローが抑制されているため、発光素子が搭載されるべき回路面上に樹脂が漏出するおそれがない。そして同時に高い埋め込み性を示す。よって本発明のプリント配線基板の露出した回路上に発光素子が搭載された発光デバイスは高品質で且つ長寿命である。その上、本発明のプリント配線基板は、耐熱性に優れたPTFEシートを構成要素とするため、発光素子を搭載する際に必要な熱に対しても安定である。よって、発光デバイスを歩留良く効率的に製造することが可能になる。 Thus, since the resin flow is suppressed in the printed wiring board of the present invention, there is no possibility that the resin leaks onto the circuit surface on which the light emitting element is to be mounted. At the same time, it exhibits high embedding properties. Therefore, the light emitting device in which the light emitting element is mounted on the exposed circuit of the printed wiring board of the present invention has high quality and long life. In addition, since the printed wiring board of the present invention includes a PTFE sheet having excellent heat resistance as a constituent element, the printed wiring board is stable against heat necessary for mounting a light emitting element. Therefore, it becomes possible to manufacture a light emitting device efficiently with a high yield.
以下、実施例を挙げて本発明をより具体的に説明するが、本発明はもとより下記実施例により制限を受けるものではなく、前・後記の趣旨に適合し得る範囲で適当に変更を加えて実施することも可能であり、それらはいずれも本発明の技術的範囲に含まれる。 EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited by the following examples, but may be appropriately modified within a range that can meet the purpose described above and below. It is also possible to implement, and they are all included in the technical scope of the present invention.
なお、各試験方法の詳細は以下の通りである。 The details of each test method are as follows.
空孔率の測定方法
多孔質PTFEシートの空孔率は、JIS K6885で定義されている見掛け密度の測定方法に準拠して測定した見掛け密度ρより、下記式から算出した。
空孔率(%)=[(2.2−ρ)/2.2]×100
Method for Measuring Porosity The porosity of the porous PTFE sheet was calculated from the following equation from the apparent density ρ measured according to the apparent density measuring method defined in JIS K6885.
Porosity (%) = [(2.2−ρ) /2.2] × 100
レジンフロー量の測定方法
接着性樹脂層となる接着シートを直径10mmのポンチで打抜き、当該接着シートと電解銅箔の光沢面とを温度:170℃、圧力:1MPaの条件で10分間プレスした。打抜いた面を実体顕微鏡(Nikon社製、SMZ−1500、50倍、リング照明使用)で観察して、接着性樹脂層から打抜いた面に流れ出た樹脂のうち、その先端部と打抜き部の周辺との距離が最も大きい部分数点で当該距離を測定し、その平均値をレジンフロー量とした。当該サンプルを打抜き面上から見たものの模式図を図1に、その断面図を図2に示す。なお、当該レジンフロー量が多いと予想される場合には、はみ出した樹脂がプレス機に付着するおそれがあるため、接着シート面に厚さ:12.5μmのポリイミドフィルムをカバーフィルムとして用いた。
Measuring method of resin flow amount An adhesive sheet serving as an adhesive resin layer was punched out with a punch having a diameter of 10 mm, and the adhesive sheet and the glossy surface of the electrolytic copper foil were pressed for 10 minutes under the conditions of temperature: 170 ° C. and pressure: 1 MPa. Observe the punched surface with a stereomicroscope (Nikon, SMZ-1500, 50 ×, using ring illumination), and out of the resin flowing out from the adhesive resin layer, the tip and punched portions The distance was measured at several points where the distance to the periphery of the resin was the largest, and the average value was taken as the resin flow amount. A schematic view of the sample as viewed from the punched surface is shown in FIG. 1, and a cross-sectional view thereof is shown in FIG. In the case where the resin flow amount is expected to be large, the protruding resin may adhere to the press, so a polyimide film having a thickness of 12.5 μm was used as the cover film on the adhesive sheet surface.
回路面の埋め込み性
レジンフロー量の測定で用いたサンプルを回路の断面が観察できる位置で切断し、実体顕微鏡(Nikon社製、SMZ−1500、50倍、リング照明使用)により拡大観察することによって、回路断面の周辺が多孔質PTFEまたは接着剤により十分に充填されているか否かを判定した。
Circuit surface embedding By cutting the sample used in the measurement of the resin flow amount at a position where the cross section of the circuit can be observed, and magnifying with a stereomicroscope (Nikon, SMZ-1500, 50 times, using ring illumination) It was determined whether or not the periphery of the circuit cross section was sufficiently filled with porous PTFE or an adhesive.
実施例1 本発明に係る発光素子用プリント配線基板の製造
光反射部材として厚さ:200μm、空孔率:75%の多孔質PTFEシート(ジャパンゴアテックス社製)と、接着性樹脂層として厚さ:25μmのエポキシ樹脂含浸多孔質PTFEプリプレグ(ジャパンゴアテックス社製、FLEXIBOND Leaf)を重ね、その上下を離型フィルム(東レフィルム加工社製、HP−4C)で挟み、温度90℃、圧力0.5MPaで2分間プレスして一体化接着フィルムを作製した。離型フィルムを剥がし、接着性樹脂層側にテスト用プリント基板を重ね、温度170℃、圧力1MPaで60分間プレスして接着性樹脂を硬化させた。なお、テスト用プリント基板は、ラインスペース2mm、ライン幅0.5mmで格子状に回路パターンが形成されており、回路パターンを形成している銅箔の厚さが18μmのものを使用した。
Example 1 Production of Printed Wiring Board for Light Emitting Element According to the Present Invention A porous PTFE sheet (made by Japan Gore-Tex) having a thickness of 200 μm and a porosity of 75% as a light reflecting member, and a thickness as an adhesive resin layer Length: 25 μm epoxy resin-impregnated porous PTFE prepreg (manufactured by Japan Gore-Tex, FLEXIBONd Leaf) is stacked, and the upper and lower sides are sandwiched between release films (manufactured by Toray Film Processing Co., Ltd., HP-4C), temperature 90 ° C., pressure 0 An integrated adhesive film was produced by pressing at 5 MPa for 2 minutes. The release film was peeled off, a printed circuit board for test was stacked on the adhesive resin layer side, and the adhesive resin was cured by pressing at a temperature of 170 ° C. and a pressure of 1 MPa for 60 minutes. In addition, the circuit board was formed in the grid | lattice form with the line space of 2 mm and the line width of 0.5 mm, and the test printed circuit board used the thickness of the copper foil which forms the circuit pattern of 18 micrometers.
得られた発光素子用プリント配線基板の回路露出部分におけるレジンフロー量は70μmであった。また、図3として示す試料の断面写真の通り、白色半透明に見える接着性樹脂層が、基板または回路面と光反射部材との間を空隙無く埋めており、回路部分の周辺における埋め込み性が良好であることが観察される。 The resin flow amount in the exposed circuit portion of the obtained printed wiring board for light emitting element was 70 μm. In addition, as shown in the cross-sectional photograph of the sample shown in FIG. 3, the adhesive resin layer that looks white and translucent fills the space between the substrate or the circuit surface and the light reflecting member without gaps, and the embedding property around the circuit portion is excellent. It is observed to be good.
比較例1 発光素子用プリント配線基板の製造
上記実施例1において、接着性樹脂層としてエポキシ樹脂含浸多孔質PTFEプリプレグの代わりに厚さ:25μmのエポキシ樹脂プリプレグ(ニッカン工業製、SAFD)を用いた以外は同様にして、発光素子用プリント配線基板を作製した。
Comparative Example 1 Production of Printed Circuit Board for Light-Emitting Element In Example 1 above, an epoxy resin prepreg (SAFD manufactured by Nikkan Kogyo Co., Ltd.) having a thickness of 25 μm was used as the adhesive resin layer instead of the epoxy resin-impregnated porous PTFE prepreg. A printed wiring board for a light emitting element was produced in the same manner except for the above.
図4として示す試料の断面写真の通り、基板または回路面と光反射部材との間がエポキシ樹脂を含む接着性樹脂層により空隙無く埋められており、回路部分の周辺における埋め込み性が良好であることが観察される。しかし回路露出部分におけるレジンフロー量は450μmと大きな値を示した。 As shown in the cross-sectional photograph of the sample shown in FIG. 4, the space between the substrate or the circuit surface and the light reflecting member is filled with an adhesive resin layer containing an epoxy resin without a gap, and the embedding property around the circuit portion is good. It is observed. However, the resin flow amount in the exposed part of the circuit was as large as 450 μm.
比較例2 発光素子用プリント配線基板の製造
レジンフロー量を抑制することを目的として、比較例1で用いたエポキシ樹脂プリプレグを40℃のオーブン中で30分間加熱することにより、エポキシ樹脂をある程度硬化させた。上記実施例1において、接着性樹脂層としてエポキシ樹脂含浸多孔質PTFEプリプレグの代わりに当該エポキシ樹脂プリプレグを用いた以外は同様にして、発光素子用プリント配線基板を作製した。
Comparative Example 2 Production of Printed Wiring Board for Light Emitting Element For the purpose of suppressing the resin flow amount, the epoxy resin prepreg used in Comparative Example 1 is heated in an oven at 40 ° C. for 30 minutes to cure the epoxy resin to some extent. I let you. A printed wiring board for a light emitting device was produced in the same manner as in Example 1 except that the epoxy resin prepreg was used instead of the epoxy resin-impregnated porous PTFE prepreg as the adhesive resin layer.
得られた発光素子用プリント配線基板の回路露出部分におけるレジンフロー量は70μmと抑制されていた。しかし図5として示す試料の断面写真の通り、回路面端部と基板との境界部分には白色に見える空隙が観察されることから、埋め込み性が十分でないことが分かる(図5中の黒丸内を参照)。 The resin flow amount in the circuit exposed portion of the obtained printed wiring board for light emitting device was suppressed to 70 μm. However, as shown in the cross-sectional photograph of the sample shown in FIG. 5, a white-colored gap is observed at the boundary between the edge of the circuit surface and the substrate, indicating that the embedding is not sufficient (inside the black circle in FIG. 5). See).
以上の結果の通り、従来接着性樹脂層として汎用されているエポキシ樹脂プリプレグを用いると、熱プレス時にエポキシ樹脂が流れ出て発光素子を搭載すべき回路面上を覆ってしまうおそれがある。そこで当該プリプレグのエポキシ樹脂をある程度硬化させてから用いると、回路面が十分に被覆されず回路端部近辺の基板上に空隙が発生する場合がある。 As described above, when an epoxy resin prepreg that has been widely used as an adhesive resin layer is used, the epoxy resin may flow out during hot pressing and cover the circuit surface on which the light emitting element is to be mounted. Therefore, if the epoxy resin of the prepreg is used after being cured to some extent, the circuit surface may not be sufficiently covered and a gap may be generated on the substrate in the vicinity of the circuit end.
一方、接着性樹脂層として接着剤を含浸させた多孔質PTFEシートを用いた本発明のプリント配線基板では、回路面が十分に被覆されている上にレジンフロー量も抑制されており、はみ出した樹脂により発光素子を搭載すべき回路面が覆われることがない。よって本発明のプリント配線基板は、発光デバイスの構成要素として非常に有用性が高い。 On the other hand, in the printed wiring board of the present invention using the porous PTFE sheet impregnated with the adhesive as the adhesive resin layer, the circuit surface is sufficiently covered and the resin flow amount is also suppressed and protruded. The circuit surface on which the light emitting element is to be mounted is not covered with the resin. Therefore, the printed wiring board of the present invention is very useful as a component of the light emitting device.
1:光反射部材、 2:発光素子搭載部、 3:回路基板、 4:電解銅箔、 5:接着性樹脂層、 6:レジンフロー 1: light reflecting member, 2: light emitting element mounting portion, 3: circuit board, 4: electrolytic copper foil, 5: adhesive resin layer, 6: resin flow
Claims (3)
光反射部材は多孔質PTFEシートからなり;
接着性樹脂層は内部に接着性樹脂が含浸されている多孔質PTFEシートからなり;且つ
回路の一部が発光素子を搭載するため露出していることを特徴とする発光素子用プリント配線基板。 A circuit board on which a circuit for mounting a light-emitting element is formed on at least one surface, and a printed wiring board for a light-emitting element having a light reflecting member on the circuit surface via an adhesive resin layer;
The light reflecting member comprises a porous PTFE sheet;
A printed wiring board for a light emitting element, wherein the adhesive resin layer is made of a porous PTFE sheet impregnated with an adhesive resin inside; and a part of the circuit is exposed for mounting the light emitting element.
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JP2007196000A JP2009032943A (en) | 2007-07-27 | 2007-07-27 | Printed circuit board for light-emitting element |
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JP2007196000A JP2009032943A (en) | 2007-07-27 | 2007-07-27 | Printed circuit board for light-emitting element |
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Cited By (2)
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WO2011006754A1 (en) * | 2009-07-15 | 2011-01-20 | Osram Opto Semiconductors Gmbh | Light-emitting diode and method for producing a light-emitting diode |
JP2011135069A (en) * | 2009-11-26 | 2011-07-07 | Nitto Denko Corp | Substrate for led mounting |
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JP2003003134A (en) * | 2001-06-20 | 2003-01-08 | Japan Gore Tex Inc | Sheet for ic chip adhesion and ic package |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2011006754A1 (en) * | 2009-07-15 | 2011-01-20 | Osram Opto Semiconductors Gmbh | Light-emitting diode and method for producing a light-emitting diode |
KR20120039023A (en) * | 2009-07-15 | 2012-04-24 | 오스람 옵토 세미컨덕터스 게엠베하 | Light-emitting diode and method for producing a light-emitting diode |
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JP2011135069A (en) * | 2009-11-26 | 2011-07-07 | Nitto Denko Corp | Substrate for led mounting |
US8985818B2 (en) | 2009-11-26 | 2015-03-24 | Nitto Denko Corporation | LED mounting substrate |
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