JP2009032790A - Method and apparatus for peeling substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for peeling a substrate which quickly peel off the substrate provided on the attracting surface of an electrostatic chuck from the attracting surface without damaging the substrate attracted to the electrostatic chuck by a residual attractive force. <P>SOLUTION: The substrate peeling method for peeling off the substrate provided on the attracting surface of the electrostatic chuck from the attracting surface is characterized in that after the outer peripheral portion of the substrate is peeled off from the attracting surface, a portion inside the outer peripheral portion is peeled off from the attracting surface. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate peeling method and a substrate peeling apparatus for peeling a substrate on an adsorption surface of an electrostatic chuck from the adsorption surface.

Generally, in an exposure apparatus such as EBL, EPL, EUVL, a wafer stage is accommodated in a vacuum atmosphere. An electrostatic chuck is used for the wafer stage to attract the wafer.
JP-A-9-139419

  However, the electrostatic chuck has a problem that charges remain even when the power is turned off, and it takes time to peel off the wafer due to the residual adsorption force due to the remaining charges. Moreover, there was a risk that the wafer could be damaged if it was forcibly separated.

  The present invention has been made to solve such a conventional problem, and provides a substrate peeling method and a substrate peeling apparatus capable of quickly peeling without damaging a substrate attracted to an electrostatic chuck by a residual attracting force. The purpose is to provide.

  A substrate peeling method according to a first aspect of the present invention is the substrate peeling method for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface. After peeling the outer peripheral portion of the substrate from the suction surface, the outer periphery of the substrate The inside of the part is peeled off from the adsorption surface.

  The substrate peeling method according to a second aspect of the present invention is the substrate peeling method in which the substrate on the suction surface of the electrostatic chuck is peeled from the suction surface, and after the outer peripheral portion of a part of the substrate is peeled from the suction surface, the substrate The inside of the outer peripheral portion of the part of the substrate is peeled off from the suction surface, and thereafter, a portion different from the part of the substrate is peeled off from the suction surface.

  A substrate peeling method according to a third invention is the substrate peeling method according to the second invention, wherein the outer peripheral portion of a portion different from the portion is peeled from the suction surface inside the outer peripheral portion of a portion different from the portion. It peels from the said adsorption surface, It is characterized by the above-mentioned.

  A substrate peeling apparatus according to a fourth aspect of the present invention is the substrate peeling apparatus for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface, wherein the outer member contacts the outer peripheral portion of the substrate from the side facing the suction surface. And an inner member that is in contact with the substrate inward from the outer peripheral portion from the side facing the suction surface, and an outer peripheral portion of the substrate is pushed up by the inner member after the outer member is pushed up by the outer member. And a drive mechanism that pushes inward.

  The substrate peeling apparatus of 5th invention is a board | substrate peeling apparatus of 4th invention, It is arrange | positioned on the opposite side to the said adsorption surface of the said electrostatic chuck, The moving member to which the said outer member and inner member are fixed, The length of the outer member is longer than the length of the inner member, and the drive mechanism moves the moving member in the push-up direction.

  A substrate peeling apparatus according to a sixth invention is the substrate peeling apparatus according to the fourth invention, wherein the driving mechanism is capable of individually moving the outer member and the inner member in the push-up direction and moving the outer member. The inner member is moved.

  A substrate peeling apparatus according to a seventh aspect of the invention is a substrate peeling apparatus for peeling a substrate on an adsorption surface of an electrostatic chuck from the adsorption surface, and abuts on an outer peripheral portion on one side of the substrate from the side facing the adsorption surface. A first outer member, a second outer member that contacts the outer peripheral portion on the other side of the substrate from the side facing the suction surface, and the outer peripheral portion with respect to the substrate from the side facing the suction surface After the inner member abutting on the inside and the first outer member push up the outer peripheral portion on one side of the substrate, the inner member pushes up the inner side from the outer peripheral portion of the substrate, and then the second outer member. And a drive mechanism that pushes up the other side of the outer peripheral portion of the substrate.

  In the present invention, the substrate that is attracted to the electrostatic chuck by the residual attracting force can be quickly peeled without being damaged.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
1 and 2 show a first embodiment of a substrate peeling apparatus of the present invention.

  The electrostatic chuck 11 has a chuck body 13. The upper surface of the chuck body 13 is a suction surface 13a that sucks the substrate 15 made of a wafer. A known internal electrode 17 is disposed on the chucking surface 13 on the suction surface 13 a side. By applying a voltage from a power source (not shown) to the internal electrode 17, the substrate 15 is adsorbed to the adsorption surface 13a.

  The chuck body 13 is formed with an outer through hole 13b and an inner through hole 13c in the vertical direction. As shown in FIG. 2, the outer through hole 13 b is formed concentrically at a radius r <b> 1 from the center O of the chuck body 13. The outer through holes 13b are formed at eight positions at an angle of 45 degrees. The outer through hole 13 b is formed at a position corresponding to the outer peripheral portion of the substrate 15. The inner through hole 13c is formed concentrically from the center O at a radius r2. The radius r2 is, for example, a dimension less than half of the radius r1. The inner through holes 13c are formed at four positions at an angle of 90 degrees. The inner through hole 13 c is formed at a position corresponding to the inner side of the outer peripheral portion of the substrate 15.

  As can be seen from the above description, in the first embodiment, a location that is relatively close to the center O of the chuck body 13 is an inside, and a location that is relatively close to the periphery of the chuck body 13 is an outside. For example, the through hole 13b arranged on the circumference of the radius r1 centered on the center O of the chuck body is more than the through hole 13c arranged on the circumference of the radius r2 centered on the center O of the chuck body. Since it is far from the center O of the main body chuck 13 and closer to the periphery of the chuck main body 13, it is referred to as an “outside through hole 13 b”. Further, the through hole 13c arranged on the circumference of the radius r2 centered on the center O of the chuck body is more than the through hole 13b arranged on the circumference of the radius r1 centered on the center O of the chuck body. Since it is close to the center O of the main body chuck 13, it is referred to as an “inner through hole 13c”.

  The outer member 19 is movably inserted into the outer through hole 13b. The outer member 19 has a pin shape, and can contact the outer peripheral portion of the substrate 15 from the side facing the suction surface 13a. The inner member 21 is movably inserted into the inner through hole 13c. The inner member 21 has a pin shape, and can come into contact with the inner side of the outer peripheral portion of the substrate 15 from the side facing the suction surface 13a.

  A moving member 23 is disposed on the opposite side of the chuck body 13 from the suction surface 13a. The moving member 23 has a disk shape. The lower ends of the outer member 19 and the inner member 21 are fixed to the upper surface of the moving member 23. The length L1 of the outer member 19 is longer than the length L2 of the inner member 21, for example, by about 0.5 mm. Therefore, when the moving member 23 is moved upward, the inner member 21 contacts the substrate 15 after the outer member 19 contacts the substrate 15.

  The moving member 23 can be moved in the vertical direction by the drive mechanism 25. The drive mechanism 25 includes a hydraulic or pneumatic actuator, and includes a cylinder 27 and a piston rod 29. The tip of the piston rod 29 is fixed to the center of the lower surface of the moving member 23. The drive mechanism 25 only needs to be able to move the moving member 23 in the vertical direction, and may be configured using, for example, a motor, a piezoelectric actuator, or the like.

  In the electrostatic chuck 11 described above, when the electrostatic chuck 11 is turned on and the substrate 15 is attracted to the suction surface 13a, the charge remains on the suction surface 13a even when the power is turned off. Then, when the substrate 15 is attracted to the attracting surface 13a due to the residual attracting force due to the remaining charge and the substrate 15 is detached after waiting for the charge to escape, it takes a lot of time to remove the substrate 15. The throughput is reduced. Therefore, it is desirable to forcibly peel the substrate 15 from the electrostatic chuck 11.

  In this embodiment, the substrate 15 is peeled from the electrostatic chuck 11 by moving the moving member 23 upward by the drive mechanism 25 as shown in FIG.

  When the moving member 23 is moved upward, first, as shown in FIG. 3A, the outer peripheral portion of the substrate 15 is pushed up by the outer member 19, and the outer peripheral portion is peeled off from the suction surface 13 a of the chuck main body 13. Since the outer peripheral portion of the substrate 15 is easier to peel compared to the inner side, the substrate 15 can be peeled with a relatively small peeling force by first peeling from the outer peripheral portion. Thereby, an excessive peeling force does not act on the outer peripheral portion of the substrate 15, and the outer peripheral portion of the substrate 15 can be peeled without being damaged. Further, by pushing up the outer peripheral portion of the substrate 15 with a plurality of outer members 19 arranged concentrically, the substrate 15 can be peeled off with a smaller peeling force.

  After that, when the moving member 23 is further moved upward, as shown in FIG. 3B, the inner member 21 pushes the inner side of the outer periphery of the substrate 15 and the inner side of the outer periphery of the chuck body 13 is pushed up. Peel from the adsorption surface 13a. The inner side of the substrate 15 is harder to peel than the outer peripheral portion. At this time, since the outer peripheral portion has already been peeled off by the outer member 19, the substrate 15 can be peeled off with a relatively small peeling force. Thereby, an excessive peeling force does not act on the inside of the substrate 15 and the substrate 15 can be peeled without being damaged. Further, by pushing up the inside of the substrate 15 with a plurality of outer members 19 arranged concentrically, the substrate 15 can be peeled off with a smaller peeling force.

  In this embodiment, after the outer peripheral portion of the substrate 15 is peeled off, the inner side is peeled off from the outer peripheral portion of the substrate 15. Can be peeled off.

Further, since the outer member 19 and the inner member 21 are fixed to the moving member 23 and the length of the outer member 19 is longer than the length of the inner member 21, the outer peripheral portion of the substrate 15 can be moved only by moving the moving member 23. After peeling, the inside can be peeled from the outer peripheral portion of the substrate 15. Therefore, the substrate peeling apparatus can be made a simple structure.
(Second Embodiment)
4 and 5 show a second embodiment of the substrate peeling apparatus of the present invention.

  In addition, in this embodiment, the same code | symbol is attached | subjected to the element same as 1st Embodiment, and detailed description is abbreviate | omitted. Similarly to the first embodiment described above, in the second embodiment, a location that is relatively close to the center of the chuck body 13 will be described as the inside, and a location that is relatively close to the periphery of the chuck body 13 will be described as the outside.

  In the first embodiment, both the outer member 19 and the inner member 21 are fixed to the moving member 23 and integrally move up and down. In the second embodiment, a driving mechanism 25A described later is provided on the outer side. The member 19A and the inner member 21A can be moved individually. In the first embodiment, the length L1 of the outer member 19 is configured to be, for example, about 0.5 mm longer than the length L2 of the inner member 21, but in the second embodiment, the length of the outer member 19A is not necessarily long. The length need not be longer than the length of the inner member 21A, and the outer member 19A and the inner member 21A may have the same length. Large diameter portions 19a and 21a are formed at the lower ends of the outer member 19A and the inner member 21A. On the opposite side of the chucking body 13 of the electrostatic chuck 11 from the outer through hole 13b and the inner through hole 13c on the suction surface 13a, drive mechanisms 25A are arranged corresponding to the respective outer members 19A and inner members 21A. Has been.

  The drive mechanism 25 </ b> A includes an actuator 31 and a coil spring 33. As the actuator 31, for example, a piezo actuator is used. The piezo actuator is formed by stacking a plurality of piezo elements, and has a property of expanding when a voltage is applied. Each drive device 25A is connected to the control device 33, and the control device 33 individually applies a voltage to each drive mechanism 25A, thereby individually extending the actuator 31 of each drive mechanism 25A, and the outer member 19 and The inner member 21 can be individually moved up and down. The drive mechanism 25A only needs to be able to individually move the outer member 19A or the inner member 21A in the vertical direction, and may be configured using, for example, a cylinder, a piston rod, a motor, and the like.

  The upper end of the actuator 31 is in contact with the large diameter portions 19a and 21a at the lower end of the outer member 19A or the inner member 21A. The large diameter portions 19 a and 21 a are pressed against the actuator 31 by the repulsive force of the coil spring 33. The lower end of the actuator 31 is in contact with a lid member 35 that is fixed to the lower end of the outer through hole 13b or the inner through hole 13c with a screw or the like. Therefore, in a state where no voltage is applied to the actuator 31, the upper end of the outer member 19A or the inner member 21A is located at a predetermined position below the suction surface 13a.

  In this embodiment, the substrate 15 is peeled from the electrostatic chuck 11 by individually moving the outer member 19A and the inner member 21A upward.

  First, a voltage is applied only to the actuator 31 accommodated in the outer through-hole 13b by the control device 33, and the actuator 31 to which the voltage is applied is extended, so that as shown in FIG. 19A moves upward, the outer peripheral portion of the substrate 15 is pushed up, and the outer peripheral portion is peeled off from the suction surface 13a of the chuck body 13.

  Next, a voltage is also applied to the actuator 31 accommodated in the inner through-hole 13c by the control device 33, and the actuator 31 to which the voltage is applied is expanded, so that as shown in FIG. The member 21 </ b> A moves upward, the inner side is pushed up from the outer peripheral portion of the substrate 15, and the inner side of the substrate 15 is peeled off from the suction surface 13 a of the chuck body 13. And the board | substrate 15 peels completely from the adsorption | suction surface 13a.

  In this embodiment, the outer member 19A and the inner member 21A are individually moved by the driving mechanism 25A, and the driving mechanism 25A is incorporated in the electrostatic chuck 11. Therefore, it is necessary to secure a separate space under the electrostatic chuck 11. And a compact substrate peeling apparatus can be provided.

  In the second embodiment, since the time until the inner member 21A is moved upward after the outer member 19A is moved upward can be arbitrarily set, the static electricity that changes depending on the thickness, area, and environment of the substrate 15 can be set. It is also possible to appropriately adjust the time until the inside of the substrate 15 is pushed up after the outside of the substrate 15 is pushed up according to the remaining state of the substrate.

  In the second embodiment described above, the timing at which each of the eight outer members 19 </ b> A moves upward is not mentioned, but this may move eight at the same time, or eight outer members. After n (n = 1 to 7) of 19A move upward, the remaining m (m = 8-n) outer members 19A may move upward.

Furthermore, as shown in FIG. 10, a plurality of partial regions (four partial regions 13a1, 13a2, 13a3, 13a4 divided by straight lines L1, L2 in FIG. 10) obtained by dividing the suction surface 13a by a straight line passing through the center O are assumed. Then, after the outer member 19A included in a part (one of the partial areas) is moved upward, the inner member included in the same part is moved upward, and at the same time or after a predetermined time, the outer members of different parts (partial areas) 19A may be moved upward, for example, the two outer members 19A of the partial region 13a1 may be moved upward. For example, after moving the two outer members 19A included in the partial region 13a1 upward, the one inner member 21A included in the partial region 13a1 is moved upward, and at the same time or after a predetermined time, two outer members included in the partial region 13a2 The member 19A may be moved upward.
(Third embodiment)
7 and 8 show a third embodiment of the substrate peeling apparatus of the present invention.

  In this embodiment, the same elements as those of the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the third embodiment, the center line L3 passing through the center O of the chuck body 13 is assumed, and the side that is relatively close to the center line L3 is referred to as the inner side, and the distance from the center line L3 is relative. The far side is called the outside. In FIG. 8, the assumed center line L3 is shown by a two-dot chain line.

  In this embodiment, the chuck body 13 of the electrostatic chuck 11 has a first outer member 19B, a first inner member 21B, a second inner member 21C, and a second member in order from the right side of FIG. The outer member 19C is disposed. The first outer member 19B is accommodated in three first outer through holes 13d formed in an arc shape along the outer peripheral portion on the right side of the chuck body 13. The first inner member 21 </ b> B is accommodated in three first inner through holes 13 e that are linearly formed inside the right outer peripheral portion of the chuck body 13. The second inner member 21 </ b> C is accommodated in three second inner through holes 13 f that are linearly formed on the inner side of the left outer peripheral portion of the chuck body 13. The second outer member 19 </ b> C is accommodated in three second outer through holes 13 h formed in an arc shape along the left outer peripheral portion of the chuck body 13. The first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C have the same length, and a large-diameter portion is formed in each.

  Further, corresponding to each of the first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C, an actuator 31 and a coil spring similar to those of the second embodiment are provided. The provided drive mechanism 25A is arranged. Each drive mechanism 25A is connected to the control device 33, and the control device 33 individually applies a voltage to each drive mechanism 25A, whereby each actuator 31 of each drive mechanism 25A is individually extended, and the first outer side. The member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C can be individually moved up and down.

  In this embodiment, the peeling of the substrate 15 from the electrostatic chuck 11 sequentially moves the first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C upward. Is done.

  First, as shown in FIG. 9A, a voltage is applied only to the actuator 31 accommodated in the first outer through hole 13d by the control device 33A, and the actuator 31 to which the voltage is applied is extended. As a result, the first outer member 19 </ b> B moves upward, the right outer peripheral portion of the substrate 15 is pushed up, and the right outer peripheral portion is peeled off from the suction surface 13 a of the chuck body 13.

  Next, as shown in FIG. 9B, a voltage is also applied to the actuator 31 accommodated in the first inner through hole 13e by the control device 33A, and the actuator 31 to which the voltage is applied is extended. As a result, the first inner member 21 </ b> B moves upward, the right inner side of the substrate 15 is pushed up, and the right half of the substrate 15 is peeled off from the suction surface 13 a of the chuck body 13.

  Next, as shown in FIG. 9C, a voltage is also applied to the actuator 31 accommodated in the second inner through hole 13f by the control device 33A, and the actuator 31 to which the voltage is applied extends. As a result, the second inner member 21 </ b> C moves upward, the left inner side of the substrate 15 is pushed up, and the substrate 15 is peeled off from the suction surface 13 a of the chuck body 13, leaving the left outer peripheral part.

  Next, as shown in FIG. 9D, a voltage is also applied to the actuator 31 accommodated in the second outer through hole 13h by the control device 33A, and the actuator 31 to which the voltage is applied extends. As a result, the second outer member 19 </ b> C moves upward, the left outer peripheral portion of the substrate 15 is pushed up, and the entire substrate 15 is peeled from the chucking surface 13 a of the chuck body 13.

In this embodiment, the first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C are sequentially moved upward and sequentially from one side of the substrate 15 toward the other side. Since the substrate 15 is peeled off, the substrate 15 attracted to the electrostatic chuck 11 can be quickly peeled off without being damaged by the residual attracting force.
(Supplementary items of the embodiment)
As mentioned above, although this invention was demonstrated by embodiment mentioned above, the technical scope of this invention is not limited to embodiment mentioned above, For example, the following forms may be sufficient.

  (1) In the second and third embodiments described above, the example in which the drive mechanism 25A is built in the electrostatic chuck 11 has been described. However, the drive mechanism 25A may be provided outside the electrostatic chuck 11.

  (2) In the above-described third embodiment, the first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C are individually moved by the drive mechanism 25A. As described above, for example, as in the first embodiment, the moving member 23 has the first outer member 19B, the first inner member 21B, the second inner member 21C, and the second outer member 19C. May be fixed so as to be sequentially shortened, and the moving member 23 may be moved.

  (3) In the above-described embodiment, an example in which the present invention is applied to adsorption of a substrate made of a wafer has been described. However, the present invention can be widely applied to adsorption of a substrate such as a liquid crystal panel substrate.

It is explanatory drawing which shows 1st Embodiment of the board | substrate peeling apparatus of this invention. It is explanatory drawing which shows the state which looked at the electrostatic chuck of FIG. 1 from upper direction. It is explanatory drawing which shows peeling operation | movement of the board | substrate peeling apparatus of FIG. It is explanatory drawing which shows 2nd Embodiment of the board | substrate peeling apparatus of this invention. It is explanatory drawing which shows the state which looked at the electrostatic chuck of FIG. 4 from upper direction. It is explanatory drawing which shows peeling operation | movement of the board | substrate peeling apparatus of FIG. It is explanatory drawing which shows 3rd Embodiment of the board | substrate peeling apparatus of this invention. It is explanatory drawing which shows the state which looked at the electrostatic chuck of FIG. 7 from upper direction. It is explanatory drawing which shows peeling operation | movement of the board | substrate peeling apparatus of FIG. It is explanatory drawing which shows the peeling method of the board | substrate peeling apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Electrostatic chuck, 13 ... Chuck body, 13a ... Adsorption surface, 15 ... Substrate, 19, 19A ... Outer member, 19B ... First outer member, 19C ... Second outer member, 21, 21A ... Inner member, 21B: first inner member, 21C: second inner member, 25, 25A: drive mechanism.

Claims (7)

In the substrate peeling method for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface,
After peeling the outer peripheral part of the said board | substrate from the said adsorption | suction surface, the inner side from the outer peripheral part of the said board | substrate is peeled from the said adsorption | suction surface. In the substrate peeling method for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface,
After peeling the outer peripheral portion of a part of the substrate from the suction surface, the inner side from the outer peripheral portion of the part of the substrate is peeled from the suction surface, and thereafter, a portion different from the part of the substrate is removed from the suction surface. The substrate peeling method characterized by peeling from. The substrate peeling method according to claim 2,
A substrate peeling method, comprising: peeling an inner part from an outer peripheral part of a part different from the part from the suction surface, and then peeling an outer peripheral part of a part different from the part from the suction surface. In the substrate peeling apparatus for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface,
An outer member that comes into contact with the outer periphery of the substrate from the side facing the suction surface;
An inner member that comes into contact with the substrate on the inside from the outer peripheral portion from the side facing the suction surface;
A drive mechanism that pushes up the outer peripheral portion of the substrate by the outer member and then pushes the inner portion of the substrate from the outer peripheral portion by the inner member;
A substrate peeling apparatus comprising: The substrate peeling apparatus according to claim 4, wherein
A movable member disposed on the opposite side of the electrostatic chuck to the attracting surface and to which the outer member and the inner member are fixed;
The outer member is made longer than the inner member,
The substrate peeling apparatus, wherein the driving mechanism moves the moving member in a push-up direction. The substrate peeling apparatus according to claim 4, wherein
The drive mechanism is
The substrate peeling apparatus, wherein the outer member and the inner member are individually movable in the push-up direction, and the inner member is moved after the outer member is moved. In the substrate peeling apparatus for peeling the substrate on the suction surface of the electrostatic chuck from the suction surface,
A first outer member in contact with the outer peripheral portion on one side of the substrate from the side facing the suction surface;
A second outer member in contact with the outer peripheral portion on the other side of the substrate from the side facing the suction surface;
An inner member that comes into contact with the substrate on the inside from the outer peripheral portion from the side facing the suction surface;
After the outer peripheral portion on one side of the substrate is pushed up by the first outer member, the inner member pushes inward from the outer peripheral portion of the substrate, and thereafter, the outer member of the outer peripheral portion of the substrate is pushed by the second outer member. A drive mechanism that pushes up the side,
A substrate peeling apparatus comprising:

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