JP2009032756A - Semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of eliminating a stagnant area developing in a space between a support unit and a work table to bring the work table into a clean condition. <P>SOLUTION: The semiconductor manufacturing apparatus includes a first chamber 11, a second chamber 12 adjacent to the first chamber 11, the work table 23 movable between both chambers 11 and 12, the support unit 24 which is formed on the boundary between both chambers 11 and 12 above the moving area of the work table 23 and supports a processing unit 25 that processes a workpiece 50 on the worktable 23, a partition 13 which partitions the first chamber 11 from the second chamber 12 at a side face or the outer periphery of the support unit 24, a first fan filter 15 which is disposed on the ceiling of the first chamber 11 to send air into the first chamber 11, and a second fan filter 16 which is disposed on the ceiling of the second chamber 12 to send air into the second chamber 12. The first chamber 11 communicates with the second chamber 12 through a space 14 between the support unit 24 and the moving area of the work table 23. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing apparatus installed in a room provided with a fan filter.

  In the laser crystallization technique, a substrate on which an amorphous silicon film is formed is irradiated with laser light by annealing, and the amorphous silicon film is heated to be converted into a polycrystalline silicon film.

  At this time, the heat conversion layer is actively used in order to efficiently use the irradiation energy of the laser beam. When a laser beam is irradiated, high heat is instantaneously applied to the substrate. Therefore, if there is a particle on the substrate, the particle is irradiated with the laser beam energy before the energy of the laser beam irradiated to the heat conversion layer is absorbed. Will be absorbed. When the particle is an organic material, the organic material explodes and scatters to the surroundings, resulting in insufficient annealing at the place where the particle was present due to insufficient energy. Alternatively, the substrate or the object to be processed is damaged by the impact of the particle explosion, and a defective product is produced. Spattered debris causes problems in subsequent processes. In the case where the particle is an inorganic material, heat conversion is selectively performed at the part, so that the substrate is damaged and becomes a defective product.

  The place where the particles are generated is mainly the movable part of the apparatus. At the sliding portion of the guide surface, there are metal powder generated by friction, resin powder such as a seal member, and lubricating oil droplets. In the drive section, there are metal powder generated by friction and resin powder / metal powder generated by rubbing the coating of the wiring. Although the amount is smaller than that of the movable part, metal powder and resin powder are also generated in the fixed part due to deterioration of the member.

  Even if measures are taken to suppress particle generation, it cannot be completely suppressed. Therefore, it is necessary to configure the apparatus so that these particle generation sources are not arranged above the workpiece. For example, if the conveying posture of the object to be processed is changed from the flat position to the vertical position, the particles do not accumulate on the object to be processed. Since the laser annealing apparatus is required to have high irradiation position accuracy, it is easier to realize an apparatus configuration in which a workpiece is processed flat than an apparatus configuration in which the workpiece is processed in a vertical position. When performing the annealing process in a flat position, it is advantageous in terms of accuracy, cost, safety, etc., that the laser beam is irradiated from above the workpiece. Therefore, it is necessary to fix the laser head for irradiating laser light to a horizontal column provided above the workpiece. When considering increasing the throughput by increasing the number of laser heads, it is necessary to provide a drive mechanism and a guide in the column in order to adjust the distance between the laser heads.

  An example of a conventional laser annealing apparatus 101 will be described with reference to the schematic configuration perspective view shown in FIG.

  As shown in FIG. 7, a work table moving device 22 is provided on a surface plate 21, and the work table moving device 22 is provided with a work table 23 that can be moved by the work table moving device 22. A support unit 24 is installed on the surface plate 21, and a laser irradiation unit 35 is installed on the support unit 24 via a moving unit 30 that moves the laser head. The laser irradiation unit 35 and the work table 23 are relatively movable by the work table moving device 22 and the moving unit 30 movable along the guide unit 29 formed on the support unit 24. Alternatively, it may be realized by removing the moving unit 30 and providing the work table moving device 22 with an equivalent mechanism. An object to be processed (work) 50 is fixed on the work table 23, and an annealing process is performed by irradiating a laser beam from the laser irradiation unit 35.

  Further, in an apparatus in which the apparatus configuration is limited and a particle generation source must be disposed above the workpiece 50, a dustproof cover that completely covers the particle generation source is provided, and the inside of the dustproof cover is exhausted. Thus, a means for preventing the particles from scattering on the workpiece 50 is taken.

  Next, an example of a conventional laser annealing apparatus 103 provided with a dustproof cover 32 will be described with reference to a schematic configuration perspective view shown in FIG.

  As shown in FIG. 8, a dust-proof cover 32 is installed to prevent particles from scattering. Specifically, a dustproof cover 32 having a shape covering the laser irradiation part 35 and the moving part 30 is installed together with the beam part 28 of the support part 24, and the beam part 28 is exhausted through an exhaust port 33 provided in the dustproof cover 32. The particles generated from the moving unit 30 that moves the laser irradiation unit 35 along the guide unit 29 provided in the apparatus are positively discharged, and the particles are not scattered on the workpiece 50 placed on the work table 23. The structure is realized.

  As means used in combination with the above measures, there is a laser annealing apparatus 105 shown in FIG.

  As shown in FIG. 9, the laser annealing apparatus 105 includes a first main body 20 (corresponding to the semiconductor manufacturing apparatus 103 shown in FIG. 8) placed in the booth 10 and installed on the ceiling of the booth 10. The inside of the booth 10 is forcibly ventilated using the second fan filters 15 and 16. The performance of the first and second fan filters 15 and 16 is determined by the volume inside the booth 10 and the ventilation frequency. The first and second fan filters 15 and 16 can positively discharge dust generated in the booth 10 to the outside of the booth 10 from the exhaust parts 17 and 18. In this case, particles are deposited on the object to be processed 50 by arranging the apparatus so as not to disturb the laminar flow generated by the first and second fan filters 15 and 16 from inside the booth 10 onto the object to be processed 50. In the unlikely event that particles are deposited on the workpiece 50, the particles can be removed from the workpiece 50.

  If the laminar flow of the first and second fan filters 15, 16 is disturbed inside the booth 10, not only is it difficult to remove the particles on the workpiece 50, but the winding of the particles occurs and the workpiece 50 is processed. There is a possibility that particles that have been deposited in places other than the above deposit on the workpiece 50.

  Next, an example of the laser annealing apparatus 107 in which three fan filters 15, 16, and 19 are installed on the ceiling of the booth 10 according to the side view of the main body in the booth of the semiconductor manufacturing apparatus in FIG. 10. explain.

  As shown in FIG. 10, the laser annealing apparatus 107 has a main body 20 (corresponding to the semiconductor manufacturing apparatus 103 shown in FIG. 8) installed in the booth 10. First and second fan filters 15 having two equivalent blowing capabilities on the ceiling portion of the booth 10 with a gate-shaped support portion 24 installed on the surface plate 21 constituting the main body 20 as a boundary, 16 is installed. Further, a third fan filter 19 having a blowing ability equivalent to the above is installed on the ceiling of the booth 10 on the support 24. In such a configuration, the laminar flow generated from the third fan filter 19 is obstructed by the dust-proof cover 32 provided on the support portion 24, and the third fan filter 19 becomes almost meaningless. The airflow blown out from the first, second, and third fan filters 15, 16, and 19 is the booth 10 between the first and second fan filters 15 and 16 and between the second and third fan filters 16 and 19. The stagnation areas 43 and 44 are formed in the ceiling-side space. Further, a stagnation region 45 is formed between the surface plate 21 and the support portion 24. This is because the flow entering the space below the support portion 24 from both sides of the support portion 24 collides. This stagnation region 45 is not a laminar flow but a turbulent flow that flows in a complicated direction, or a flow that is very slow compared to the speed for discharging the particles out of the booth 10. For this reason, particles are likely to accumulate, and particles are likely to be rolled up. Therefore, it becomes difficult to keep the space on the work table 23 clean.

  Next, the generation state of the stagnation regions 41 and 42 in the laser annealing apparatus 105 described above will be described with reference to the side view of the main body in the booth of the semiconductor manufacturing apparatus in FIG.

  As shown in FIG. 11, a main body 20 of a semiconductor manufacturing apparatus is installed in the booth 10, with a gate-shaped support 24 installed on a surface plate 21 constituting the main body 20 as a boundary. The first and second fan filters 15 and 16 having the same blowing ability are installed on the ceiling of the booth 10. In such a configuration, most of the airflow blown out from the first and second fan filters 15 and 16 is exhausted from the exhaust parts 17 and 18, but a part thereof is the first and second fan filters 15 and 16. A stagnation region 41 is created in the space on the support portion 24 between them, and a stagnation region 42 is created in the space between the surface plate 21 and the dustproof cover 32 provided on the support portion 24. In particular, due to the occurrence of the stagnation region 42, as described above, the air flow in the space 14 on the work table 23 that has come to the lower region of the support portion 24 is not laminar or has an insufficient flow rate. Therefore, it is difficult to keep the space 14 clean.

  In addition, it is necessary for the support portion 24 to have sufficient rigidity in order to hold the laser irradiation portion 31 with high accuracy. For this reason, since the support portion 24 becomes large, the range surrounding the support portion 24 (for example, the size of the dustproof cover 32) is inevitably enlarged so that particles are not scattered, and the first and second fan filters 15, 16 are inevitably enlarged. Since the area that obstructs the laminar flow from the air also becomes large, the performance of the first and second fan filters 15 and 16 cannot be fully exhibited.

  For example, two fan filters are installed on the ceiling in the booth in the exposure apparatus in which the semiconductor manufacturing apparatus is housed in the booth. A configuration is adopted in which clean air is allowed to flow (see, for example, Patent Document 1). In such a configuration, the laminar flow from the fan filter is obstructed by the exposure apparatus, and the same problem as described above that the performance of the fan filter cannot be exhibited sufficiently is included.

JP-A-4-22118

  The problem to be solved is that it is difficult to eliminate the stagnation region generated in the space between the support part and the work table in the airflow blown from the fan filter installed on the ceiling part of the booth. .

  The present invention eliminates the stagnation region generated in the space between the support portion and the work table, and makes it possible to clean the work table.

  The present invention includes a first chamber, a second chamber provided adjacent to the first chamber, a work table capable of moving between the first chamber and the second chamber, and movement of the work table. A support unit provided at a boundary between the first chamber and the second chamber on the area and supporting a processing unit for processing an object to be processed on the work table; and a side surface of the support unit or the support A partition that partitions the first chamber and the second chamber on an outer peripheral portion of the unit, a first fan filter that is provided on the ceiling of the first chamber and blows air into the first chamber, and the second chamber A second fan filter that is provided on a ceiling portion and blows air into the second chamber, and the first chamber and the second chamber communicate with each other in a space between the support portion and the work table. It is characterized by that.

  In the present invention, the first fan filter that blows air into the first chamber and the second fan filter that blows air into the second chamber are provided. Since the chamber is partitioned and the first chamber and the second chamber communicate with each other between the support portion and the work table, the amount of air blown from the first fan filter and the amount of air blown from the second fan filter By adjusting the pressure, a pressure difference between the first chamber and the second chamber can be generated. Therefore, by causing the atmospheric pressure difference, the space in which the first chamber and the second chamber on the moving area of the work table are communicated can be made into a laminar flow.

  The semiconductor manufacturing apparatus of the present invention can make the space where the first chamber and the second chamber on the moving area of the work table communicate with each other in a laminar flow, so that the work table can be clean. . Therefore, there is an advantage that yield and quality can be improved.

  1 is a partially broken perspective view showing a schematic configuration of FIG. 1 and a side view showing a main body of a semiconductor manufacturing apparatus in a booth of FIG. Will be explained by. 1 and 2 show a laser processing apparatus (for example, a laser annealing apparatus) as an example of the semiconductor manufacturing apparatus, and FIG. 1 shows the inside of the booth as seen through so that the state inside the booth can be seen.

  As shown in FIGS. 1 and 2, the semiconductor manufacturing apparatus 1 includes a booth 10 and a main body portion (hereinafter referred to as a main body portion) 20 of a semiconductor manufacturing apparatus installed in the booth 10.

  The main body 20 includes a surface plate 21, a work table moving device 22 provided on an upper portion of the surface plate 21 and serving as a work table moving area, a work table 23 moved by the work table moving device 22, and the surface plate 21. A support unit 24 installed above and above the work table moving device 22, and a processing unit supported by the support unit 24 above the work table moving device 22 and processing the workpiece 50 on the work table 23. 25.

  A partition wall 13 that partitions the booth 10 into a first chamber 11 and a second chamber 12 is provided on a side surface of the support portion 24. And the space between the support part 24 and the movement area of the work table 23, specifically, the first chamber 11 in the space 14 between the support part 24 and the work table moving device 22 to which the work table 23 is moved. The second chamber 12 communicates with the second chamber 12. The partition wall 13 may be provided, for example, on the outer peripheral portion of the support portion 24 of the support portion 24. Further, when the partition wall 13 is provided on the side surface of the support portion 24, it may be the side surface on the first chamber 11 side or the side surface on the second chamber 12 side.

  The work table moving device 22 includes, for example, a drive mechanism (not shown) that can move in the x direction connecting the first chamber 11 and the second chamber 12 and the θ direction that rotates in the xy plane. ing. This drive mechanism is not limited to the above moving direction, and may further include a mechanism that can move in the direction perpendicular to the surface of the surface plate 21 (z direction). Moreover, you may provide the mechanism which can move to ay direction.

  The support portion 24 has, for example, a so-called gate-shaped configuration including columns 26 and 27 provided on both sides of the work table moving device 22 and beam portions 28 supported on the upper portions of the columns 26 and 27. Yes. Therefore, the support part 24 is formed so as to straddle the moving region of the work table 23. A guide portion 29 for guiding the processing portion 25 is formed on the beam portion 28. The processing unit 25 includes a moving unit 30 that is movable along the guide unit 29, and a processing unit main body 31 provided on the moving unit 30, and the processing unit main body 31 is an object to be processed on the work table 23. 50 includes a laser beam irradiation unit that irradiates laser beam, for example. The laser light irradiation unit includes, for example, a light source (not shown) that oscillates laser light and a uniformizing optical system (not shown) that makes the laser light oscillated from the light source uniform light intensity distribution. The support unit 24 may be a cantilever type instead of a portal type as long as the processing unit 25 can be supported with high accuracy.

  In the above configuration, the processing unit 25 and the work table 23 can be relatively moved by the work table moving device 22 and the moving unit 30. The moving unit 30 may be excluded, and the function may be provided in the work table moving device 22. An object to be processed 50 is fixed on the work table 23, and laser processing (for example, annealing) is performed by irradiating a laser beam from a laser beam irradiation unit of the processing unit main body 31.

  In addition, a dustproof cover 32 for preventing particles from being scattered in the guide unit 29, the moving unit 30 and the like is installed so as to cover the moving unit 30 and the processing unit main body 31 movable along the guide unit 29. Also good. Specifically, a dust-proof cover 32 having a shape covering the beam portion 28 of the support unit 24 including the processing unit 25 is installed, and exhaust is performed from the exhaust unit 33 provided on the dust-proof cover 32, for example, from the moving unit 30. The generated particles are positively discharged, and a structure in which the particles are not scattered on the workpiece 50 is realized. Although not shown in the figure, the dust cover 32 is provided with an air intake port provided with a cleaning filter at a position facing the exhaust part 33, for example. Further, the bottom side of the dust cover 32 is transparent to laser light such as glass so that the laser light emitted from the processing unit main body 31 of the processing unit 25 is transmitted. A window 34 in which the airtightness of the dust cover 32 is maintained is provided.

  A first fan filter 15 is installed on the ceiling of the first chamber 11, and clean air is blown into the first chamber 11 to forcibly ventilate the inside of the first chamber 11. Similarly, a second fan filter 16 is installed on the ceiling of the second chamber 12, and clean air is blown into the second chamber 12 to forcibly ventilate the inside of the second chamber 12. The first and second fan filters 15, 16 take in air outside the booth 10, clean the air taken in by the built-in filter, and send the cleaned air into the booth 10. A first exhaust part 15 is provided at the bottom of the first chamber 11. A second exhaust unit 16 is provided at the bottom of the second chamber 12. The air flow rate of the first and second fan filters 15 and 16 and the first and second air pressures so that a difference between the air pressure in the first chamber 11 and the air pressure in the second chamber 12 is constant. The exhaust amount of the exhaust parts 17 and 18 is adjusted.

  For example, by adjusting the air flow rate of the first fan filter 15 and the air flow rate of the second fan filter 16, a pressure difference is created between the first chamber 11 and the second chamber 12, and the processing unit 25. Through the space in which the first chamber 11 and the second chamber 12 are communicated between the dust-proof cover 32 and the work table 23, from the first chamber 11 side to the second chamber 12 side, Alternatively, a certain amount of air can be blown in the opposite direction. For this reason, the gas flow on the work table 23 is a laminar flow. For example, by setting the air pressure in the first chamber 11 higher than the air pressure in the second chamber 12, the airflow in the space on the work table moving device 22 (work table 23) flows from the first chamber 11 toward the second chamber 12. Laminar flow.

  The first and second exhaust parts 17 and 18 may be provided in at least one of the first chamber 11 and the second chamber 12 having a low atmospheric pressure. For example, if the pressure in the first chamber 11 is lower than that in the second chamber 12, only the first exhaust part 17 may be provided on the first chamber 11 side. Conversely, if the second chamber 12 is in a state where the atmospheric pressure is lower than that of the first chamber 11, only the first exhaust part 18 may be provided on the second chamber 12 side. The first and second exhaust parts 17 and 18 may be provided with exhaust valves (not shown) for adjusting the exhaust amount. Further, the first and second exhaust parts 17 and 18 may be provided with an exhaust device (not shown) for forcibly exhausting the room. Further, when no exhaust device is provided, natural exhaust is performed. In this case, the pressure difference between the first chamber 11 and the second chamber 12 is adjusted by adjusting the air volume of the first and second fan filters 15 and 16. Is adjusted.

  The performance of the first and second fan filters 15 and 16 is determined by the ventilation amount with respect to the volumes inside the first chamber 11 and the second chamber 12. Assuming that the first and second fan filters 15 and 16 have the same blowing capacity, the blowing amount of the first and second fan filters 15 and 16 is, for example, that of the first and second fan filters 15 and 16. It is adjusted based on the result of measuring the wind speed at each outlet. Or it adjusts based on the result of having measured the wind pressure in each blower outlet of the 1st, 2nd fan filters 15 and 16.

  Particles (dust) generated in the booth 11 of the semiconductor manufacturing apparatus 1 are positively discharged out of the booth 11 from the first and second exhaust parts 17 and 18 by the first and second fan filters 15 and 16. . In this case, particles are prevented from being deposited on the workpiece 50 by arranging the apparatus so as not to disturb the laminar flow generated from the first and second fan filters 15 and 16 onto the workpiece 50 as much as possible. If particles are deposited on the object to be processed 50, particles on the object to be processed 50 can be removed by the air flowing on the object to be processed 50.

  For example, the air speed at the outlet of the first fan filter 15 installed in the first chamber 11 is 0.5 [m / s], and the outlet of the second fan filter 16 installed in the other second chamber 12 is used. The wind speed at the mouth is set to 0.3 [m / s]. Since the clean air that has exited from the respective outlets is divided by the partition wall 13, they cannot interfere with each other. The air currents in the first chamber 11 and the second chamber 12 do not interfere with each other until they reach the vicinity of the space formed between the dust cover 32 and the surface plate 21. At this time, there is a difference in wind speed (the wind speed is a set value but actually a difference in air pressure (wind pressure)), so the wind speed at the outlet of the first fan filter 15 is 0.5 [m / s]. The airflow set to can enter the second chamber 12 which is the other space. Since the flow generated by this pressure difference works as a flow for transporting the particles out of the booth 10, the cleanliness of the space formed between the dust-proof cover 32 and the surface plate 21 between the first chamber 11 and the second chamber 12 is maintained. Will be able to.

  Next, a simulation result of an air flow in the semiconductor manufacturing apparatus 1 will be described with reference to a cross-sectional view showing an outline of the air flow in FIG. 3 and a wind speed distribution diagram of the main part in FIG. In the arrow in the figure, the length of the arrow indicates the wind speed, and the size of the arrow indicates the air volume. FIG. 4 shows the wind speed distribution as a result of simulating the airflow in the space 14 between the dust cover 32 and the moving area of the work table 23 (on the work table moving device 22 (see FIG. 1)).

  As shown in FIGS. 3 and 4, in the semiconductor manufacturing apparatus 1 according to the present invention, two units of first and second fan filters 15 and 16 having the same blowing capacity are installed on the ceiling side of the booth 10. Air A and B blown out from the first and second fan filters 15 and 16 are exhausted to the outside through exhaust regions 17 and 18 provided at the bottom of the booth 10 through the moving region of the work table 23 and the vicinity thereof. ing.

  For example, the first fan filter 15 is set such that the wind speed at its outlet is 0.5 [m / s], and the second fan filter 16 has a wind speed of 0.3 [m] at its outlet. / S]. Accordingly, since the air pressure in the first chamber 11 is higher than that in the second chamber 12, the air A blown out from the first fan filter 15 flows mainly from the first chamber 11 side to the second chamber 12 side, and the exhaust section 18. The air is exhausted outside the booth 10. A part of the air A blown out of the first fan filter 15 is discharged to the outside from the exhaust part 17 provided at the bottom of the booth 10. On the other hand, the air B blown from the second fan filter 16 to the second chamber 12 where the atmospheric pressure is lower than that of the first chamber 11 is exhausted from the exhaust unit 18 to the outside of the booth 10. In particular, the air flowing from the first chamber 11 to the second chamber 12 side is processed by the processing unit 25 at the lower part of the dust cover 32 so that the workpiece 50 on the work table 23 is processed by the processing unit 25. It will flow through the space 14. As shown in FIG. 4, it can be seen that in the space 14 below the dust cover 32, the flow flowing from the first chamber 11 side to the second chamber 12 side is a laminar flow.

  Therefore, the laminar air flow is discharged from the exhaust unit 18 together with other air without winding up the particles. For example, even if there are particles on the work table 23, the particles are carried in the laminar flow and discharged from the exhaust unit 18 to the outside of the booth 10.

  Next, as a comparative example, a side view of the inside of the booth shown in FIG. 5 is an example of a semiconductor manufacturing apparatus in which two fan filters are installed on the ceiling of the booth without providing the partition wall which is a component of the present invention. This will be described with reference to the wind speed distribution diagram of the main part shown in FIG. FIG. 6 shows a wind speed distribution as a result of simulating the airflow in the space 14 between the dust cover 32 and the moving area of the work table 23 (on the work table moving device 22 (see FIG. 5)).

  As shown in FIG. 5, the semiconductor manufacturing apparatus of the comparative example is the semiconductor manufacturing apparatus 105 described with reference to FIG. 9 and FIG. In this semiconductor manufacturing apparatus 105, two units of first and second fan filters 15 and 16 having the same blowing capacity are installed on the ceiling side of the booth 10. Air A and B blown out from the first and second fan filters 15 and 16 are discharged to the outside from exhaust portions 17 and 18 provided at the bottom of the booth 10.

  For example, the first fan filter 15 is set so that the wind speed at its outlet becomes 0.3 [m / s], and the second fan filter 16 has the wind speed at 0.3 [m / s]. / S] is set to be equivalent. Therefore, since there is no pressure difference between the first chamber 11 and the second chamber 12, the air A blown out of the first fan filter 15 is mainly exhausted from the exhaust chamber 17 to the outside of the booth 10 from the first chamber 11 side. . On the other hand, the air B blown out from the second fan filter 16 is mainly exhausted from the exhaust chamber 18 to the outside of the booth 10 from the second chamber 12 side. In such a configuration, the airflow blown out from the first and second fan filters 15 and 16 is a stagnation area in the space on the dustproof cover 32 provided in the support portion 24 between the first and second fan filters 15 and 16. 41, and a stagnation region 42 is created between the surface plate 21 and the dustproof cover 32 provided on the support 24.

  In particular, as shown in FIG. 6, a large vortex is generated in the space 14 where the workpiece 50 on the work table 23 is processed by the processing unit 25 (see FIG. 5) provided in the dust-proof cover 32. It turns out that it is a turbulent flow. For this reason, the particles accumulated on the surface plate 21 (see FIG. 5) are wound up. Therefore, it has been difficult to keep the space 14 in which the work table 23 is moved clean.

  Even if the wind speed at the outlet of the first fan filter 15 is different from the wind speed at the outlet of the second fan filter 16, the partition wall 13 is not provided as in the present invention. Even if the wind speed at the air outlet of the filter 15 is faster than the air speed at the air outlet of the second fan filter 16, the space between the support 24 and the ceiling of the booth 10, and between the support 24 and the side wall of the booth 10. In the meantime, since a flow is generated everywhere such as below the support portion 24, a turbulent flow is generated in a region where the flow is collected, and the particle is likely to be rolled up. Therefore, it is difficult to keep the space 14 in a laminar flow and keep it clean simply by changing the wind speed at the outlet of the first and second fan filters 15 and 16. Further, if the wind speed at the outlet of the first and second fan filters 15 and 16 is slowed down, the entire flow becomes laminar, but then the particles generated in the booth 10 are discharged out of the booth 10. It becomes difficult to keep the booth 10 clean.

  As described above, the semiconductor manufacturing apparatus 1 of the present invention communicates the first chamber 11 and the second chamber 12 on the work table 23 as compared with the comparative example that does not have the partition that separates the booth 10 into two chambers. As described above, since the partition wall 13 that partitions the booth 10 into the first chamber 11 and the second chamber 12 is provided, the stagnation regions 41 and 42 as shown in FIG. 5 do not occur. Therefore, the space in which the work table 23 is moved can be kept cleaner than in the prior art. In addition, since the third fan filter 19 (see FIG. 10) that does not sufficiently perform the function of cleaning the work table 23 is not provided, the apparatus cost can be reduced.

  As described above, the semiconductor manufacturing apparatus 1 includes the first fan filter 15 that blows air into the first chamber 11 and the second fan filter 16 that blows air into the second chamber 12. Alternatively, the first chamber 11 and the second chamber 12 are partitioned by the partition wall 13 at the outer peripheral portion of the support portion 24, and the first chamber 11 and the second chamber 12 are provided between the support portion 24 and the work table 23. Since the air flow is communicated, the air flow rate from the first fan filter 15 and the air flow rate from the second fan filter 16 are adjusted, so that a pressure difference is easily generated between the first chamber 11 and the second chamber 12. be able to. Therefore, by causing the atmospheric pressure difference, the space 14 where the first chamber 11 and the second chamber 12 communicate with each other on the moving area of the work table 23 can be made laminar. Therefore, since the space 14 in which the work table 23 is moved can be made clean, there is an advantage that yield and quality can be improved. Moreover, since the cleanliness is improved, there is an advantage that the number of washings can be reduced and the unit price of the product can be reduced.

  The semiconductor manufacturing apparatus 1 of the present invention is not limited to the laser annealing apparatus described above, but is a process affected by particles such as general laser processing apparatuses, inspection apparatuses, repair apparatuses, etc. used for manufacturing semiconductor devices. The present invention can also be applied to an apparatus in which a particle generation source must be arranged above 50. Moreover, the semiconductor manufacturing apparatus 1 of the present invention can obtain the cleanliness of the space on the work table 23 by simply modifying the existing apparatus in which the partition wall 13 is installed. The cleanliness of the apparatus can be improved without wasting apparatus assets.

1 is a partially broken perspective view showing a schematic configuration showing an embodiment (first example) according to a semiconductor manufacturing apparatus of the present invention. It is the side view which showed the main-body part of the semiconductor manufacturing apparatus in the booth of 1st Example. 1 is a cross-sectional view illustrating an outline of an air flow in a semiconductor manufacturing apparatus 1. It is the wind speed distribution map of the principal part which showed the simulation result of the airflow in the semiconductor manufacturing apparatus. It is the side view in the booth which showed the semiconductor manufacturing apparatus which installed two fan filters of the comparative example. It is the wind speed distribution figure of the principal part which showed the simulation result of the airflow of the semiconductor manufacturing apparatus of a comparative example. It is the schematic structure perspective view which showed an example of the conventional laser annealing apparatus. It is the schematic structure perspective view which showed an example of the conventional laser annealing apparatus which provided the dust-proof cover. It is the schematic structure perspective view which showed an example of the conventional laser annealing apparatus provided with two fan filters. It is drawing which showed the main-body part in the booth of the conventional laser annealing apparatus which provided three fan filters by the side view. It is drawing which showed the main-body part in the booth of the conventional laser annealing apparatus which provided two fan filters by the side view.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor manufacturing apparatus, 11 ... 1st chamber, 12 ... 2nd chamber, 13 ... Partition, 14 ... Space, 23 ... Work table, 24 ... Support part, 25 ... Processing part

Claims (4)

The first room,
A second chamber provided adjacent to the first chamber;
A work table that is movable between the first chamber and the second chamber;
A support unit provided at a boundary between the first chamber and the second chamber on the moving area of the work table and supporting a processing unit for processing an object to be processed on the work table;
A partition wall that partitions the first chamber and the second chamber on a side surface of the support portion or an outer peripheral portion of the support portion;
A first fan filter that is provided on the ceiling of the first chamber and blows air into the first chamber;
A second fan filter that is provided on the ceiling of the second chamber and blows air into the second chamber;
The semiconductor manufacturing apparatus, wherein the first chamber and the second chamber communicate with each other in a space between the support section and the moving area of the work table. A pressure difference between the pressure in the first chamber and the pressure in the second chamber;
The semiconductor manufacturing apparatus according to claim 1, wherein an exhaust unit is provided in at least a chamber having a low atmospheric pressure among the first chamber and the second chamber. The semiconductor manufacturing apparatus according to claim 1, wherein the processing unit includes a laser beam irradiation unit that irradiates a workpiece placed on the work table with a laser beam. The blast volume of the first fan filter and the second fan filter is adjusted so that there is a pressure difference between the atmospheric pressure in the first chamber and the atmospheric pressure in the second chamber. Semiconductor manufacturing equipment.

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