JP2009031275A - Rack for measuring instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To minimize temperature influence in the inside of a rack by a temperature change in installation environments as much as possible. <P>SOLUTION: This stand for the measuring instrument is to house a measuring instrument to measure a substrate, and is equipped with a frame body 3 disposed in the inside of the measuring instrument, and a double wall structure 4 provided in the frame body 3 and composed of an inner surface plate 61 surrounding at least the side of the measuring instrument and an external surface plate 62 forming a gas layer between itself and the inner surface plate 61. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a gantry, and more particularly to a gantry used in a measuring instrument for measuring the surface of a workpiece such as a semiconductor substrate.

  2. Description of the Related Art Conventionally, a semiconductor inspection apparatus such as a semiconductor wafer thickness measuring apparatus used in a semiconductor manufacturing process is an irradiation optical system that irradiates a semiconductor wafer (substrate) placed on a sample stage with inspection light, as shown in Patent Document 1. And a detection optical system for detecting light from the semiconductor wafer, and a measuring instrument base for housing them.

  The measuring instrument base includes a base for holding the sample stage and the optical system, a frame provided on the base, and the sample stage and the optical system disposed therein, and the frame. And a panel surrounding the optical system. A common base member to which the irradiation optical system and the detection optical system are fixed is fixed to the base.

  The measurement target of the semiconductor wafer thickness measuring apparatus having such a configuration is a circuit of, for example, 100 μm or less formed on the semiconductor wafer, and the positional relationship between the irradiation optical system and the detection optical system requires high accuracy. ing.

  However, this measuring instrument base covers the irradiation optical system and the detection optical system only with a single exterior panel. For this reason, the optical system is directly affected by the temperature of the installation environment (room temperature of the clean room), and in a semiconductor measurement device that requires submicron to nano-order measurement accuracy, the optical system is affected by the temperature change of the installation environment. There is a problem that the temperature effect of the system cannot be ignored.

  Specifically, when the temperature of the installation environment changes, for example, by 2 ° C. to 3 ° C., the base member holding the irradiation optical system and the detection optical system undergoes thermal expansion or the like, and the position of the irradiation optical system is shifted. As a result, there is a problem that the irradiation point of the inspection light is shifted.

  In addition, the lenses provided in the irradiation optical system and the detection optical system are also thermally deformed, and there is a problem that an error occurs in the measurement result even if the irradiation point is correct.

In addition, the same problem also exists in the apparatus used for the measurement of the board | substrate in manufacturing processes, such as a flat display and a solar cell.
JP 2000-321339 A

  Therefore, the present invention has been made to solve the above problems all at once, and its main intended task is to minimize the temperature effect inside the pedestal due to temperature changes in the installation environment. is there.

  That is, the measurement instrument gantry according to the present invention is a measurement instrument gantry that accommodates a measurement instrument for measuring a substrate, the frame in which the measurement instrument is disposed, and the frame, A double wall structure surrounding at least a side of the measuring instrument and having a gas layer therein.

  If it is such, the bad influence to the temperature stability inside an apparatus stand resulting from the temperature change of an installation environment can be suppressed. As a result, it is possible to reduce measurement errors such as measurement data shifts or measurement point shifts based on temperature changes. In addition, since the temperature stability inside the apparatus base is improved, high-precision temperature control can be realized only by using an inexpensive temperature control mechanism.

  The double wall structure provided on the maintenance surface of the frame body includes an inner surface plate that faces the measuring instrument and an outer surface plate that forms a gas layer between the inner surface plate and can be attached to and detached from the frame body. It is particularly desirable that all or a part of the other double wall structure is composed of an interior panel and an exterior panel, which are each attached to a frame body.

  In such a case, while maintaining the temperature stability inside the gantry at the time of measurement, it is only necessary to remove the panel member from the frame body at the time of maintenance of the measuring device or the like, so that the work can be facilitated.

  As a specific embodiment of the panel member, the panel member has a box shape in which one of the inner surface plate or the outer surface plate is open, and the other of the inner surface plate or the outer surface plate is the other. It is a box having an opening wider than one opening of the inner surface plate or outer surface plate, and it is mentioned that the openings are overlapped and one of them is accommodated in the other. it can.

  In particular, the opening of the outer plate is wider than the opening of the inner plate, the outer plate accommodates the inner plate, and the flat plate portion of the outer plate is fixed to the fixing piece welded to the flat plate portion of the inner plate. Therefore, it is desirable that the inner surface plate and the outer surface plate are stacked and fixed. If this is the case, it is not necessary to process the inner surface of the inner surface plate that faces the measuring device, so that dust generation can be prevented.

  It is desirable that a blower mechanism that blows air from above to below the measuring device is provided on the upper portion of the frame. If this is the case, the side wall has a double-wall structure and the measuring device is blown, so that the temperature stability of the measuring device can be further improved. In addition, since the temperature stability can be ensured by the double wall structure, it is not necessary to increase the blowing capacity of the fan, and it can be realized at low cost and easily in configuration.

  In order to prevent heat transfer between the inside and outside of the measuring instrument base due to heat radiation, and to improve the temperature stability of the measuring instrument, the double wall structure prevents the heat transfer due to heat radiation. What is necessary is just to have the interruption | blocking part.

  As a specific embodiment for preventing the movement of heat between the inside and the outside of the measuring instrument base due to thermal radiation, the thermal radiation blocking section includes a mirror surface formed on the outer wall surface of the double wall structure. Can be mentioned. If this is the case, heat from radiation from the outside to the inside is prevented by reflecting light including infrared rays from the outside of the measuring instrument base, and light containing infrared rays from the inside of the measuring instrument base is prevented. Reflection can prevent internal heat from being transferred by heat radiation to the outside or the gas layer inside the double wall structure. Therefore, the temperature stability of the measuring instrument can be further improved.

  As a most preferred embodiment, the thermal radiation blocking part further includes a mirror surface formed on the inner wall surface. If it is such, the infrared rays etc. which permeate | transmitted the mirror surface formed in the external wall surface can be reflected, and the movement of heat can be prevented.

  In order to further improve the heat insulating effect of the double wall structure, it is sufficient if it has a temperature adjusting mechanism for adjusting the temperature of the gas layer flowing inside the double wall structure.

  The air blowing mechanism eliminates the need to take in air from the outside, maintains the cleanness of the measurement object, and improves the temperature stability of the measuring device. What is necessary is just to provide the collection | recovery flow path which returns to a mechanism.

  Further, a measuring instrument gantry according to the present invention is a measuring instrument gantry that accommodates a measuring instrument for measuring a measurement object, and a frame in which the measuring instrument is disposed, and the frame A double wall structure that surrounds at least a side of the measuring instrument and has a heat insulating layer therein, and the double wall structure provided on the maintenance surface of the frame body faces the measuring instrument. It comprises an inner surface plate and an outer surface plate that forms a heat insulating layer between the inner surface plate, and is composed of an integral panel member that can be attached to and detached from the frame body. It consists of the interior panel and exterior panel which were each attached to the frame.

  According to the present invention configured as described above, it is possible to minimize the temperature influence of the measuring device arranged inside the gantry due to the temperature change of the installation environment.

  An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the measurement instrument mount 1 according to the present embodiment. 2 is a perspective view showing a state in which the double wall structure 4B on the front surface (maintenance surface) of the gantry 1 is removed, FIG. 3 is a rear perspective view mainly showing the frame body 3, and FIG. FIG. 3 is a perspective view showing a state in which an interior panel 4A1 is mainly attached to a frame 3. FIG. 5 is a schematic cross-sectional view of the gantry 1 showing the gas flow from the blower mechanism 8. FIG. 6 is a cross-sectional view showing the frame 3 and the double wall structure 4. FIG. 7 is a front perspective view of the panel member 6, and FIG. 8 is a rear perspective view of the panel member 6. FIG. 9 is a cross-sectional view of the panel member 6, and FIG. 10 is an exploded view of the panel member 6.

  <Device configuration>

  The measuring instrument base 1 according to the present embodiment is used in a semiconductor inspection apparatus that inspects the surface thickness of a semiconductor wafer W that is a measurement target, foreign matter, presence of defects, and the like.

  Specifically, as shown in FIGS. 1 to 6, this is provided on the base 2 on which the irradiation optical system 101, the detection optical system 102, the sample stage 103 and the like are placed, and the base 2, A frame 3 in which the optical systems 101 and 102 and the like are disposed, and a frame 3 provided in the frame 3, which surrounds at least the sides of the irradiation optical system 101 and the detection optical system 102, and is a heat insulating layer inside. A double wall structure 4 having an air layer.

  Each part 2-4 is demonstrated below.

  The irradiation optical system 101 irradiates the semiconductor wafer W with laser light as inspection light obliquely from above, and includes a laser light source, an optical fiber, a lens, and the like.

  The detection optical system 102 detects reflected light and / or scattered light from the semiconductor wafer W irradiated with inspection light, and includes a photodetector and a lens.

  The irradiation optical system 101 and the detection optical system 102 are fixed to a common base member 21 so as to have a predetermined positional relationship (relative position is a predetermined relationship). The base member 21 is fixed on the base 2. A measuring instrument is constituted by the irradiation optical system 101, the detection optical system 102 and the base member 21.

  The sample stage 103 has a semiconductor wafer W mounted thereon and moves the semiconductor wafer W in the XYZ directions, and includes an XY stage portion that moves in the XY directions and a Z stage portion that moves in the Z direction. Yes. One stage that moves in the XYZ directions may be used, or a stage that moves in the X, Y, and Z directions may be combined.

  As shown in FIGS. 2 and 3, the frame body 3 is provided with a main frame body 31 configured in a rectangular parallelepiped shape and the main frame body 31, and at least front, rear, left and right openings of the main frame body 31. A plurality of sub-frames 32 partitioned into a plurality of sub-frames.

  The main frame 31 is fixed to the base end portion of the base 2, and has a rectangular lower frame 311, four support columns 312 erected on the four upper surfaces of the lower frame 311, and the support frame 312. And an upper frame 313 having a rectangular shape formed horizontally on the upper end portion.

  The sub-frame 32 is horizontally mounted on the columns 312 adjacent to each other of the main frame 31, and the horizontal beam 321 that divides the opening of the main frame 31 into the upper and lower sides, and the horizontal beam 321 and the lower frame 311 of the main frame 31 or A vertical beam 322 connected to the upper frame 313. Thereby, the opening part formed in each surface of the main frame 31 is divided into a substantially lattice shape.

  On the right side of the frame 3 toward the maintenance surface of the irradiation optical system 101 and the detection optical system 102, an operation unit 5 for operating the irradiation optical system 101 and the detection optical system 102 is incorporated.

  The left side surface of the frame 3 toward the maintenance surface of the irradiation optical system 101 and the detection optical system 102 is divided into three by the sub-frame 32 (see FIG. 3).

  On the maintenance surface of the irradiation optical system 101 and the detection optical system 102 in the frame 3, an opening (hereinafter referred to as a maintenance opening 3 </ b> A) in which almost all of the irradiation optical system 101 and the detection optical system 102 can be viewed from the front is formed. (See FIG. 2). Specifically, the maintenance opening 3 </ b> A is formed of an upper frame 313, a column 312, a horizontal beam 321, and a vertical beam 322.

  Here, the maintenance surface in the present embodiment is a surface on which an opening to the inside of the gantry at the time of maintenance is provided. In FIG. 2, it is a surface that faces at least the adjustment part RS of the irradiation optical system 101 and the detection optical system 102 that are measuring instruments. In this embodiment, the frame 3 is opposite to the back surface on which a port P described later is provided. It is the front of the side. In addition, when there are a plurality of surfaces facing the adjustment site RS, any one may be used as a maintenance surface.

  The double wall structure 4 is provided in the frame 3 so as to surround at least the sides of the irradiation optical system 101 and the detection optical system 102. That is, the side of the irradiation optical system 101 and the detection optical system 102 which are measuring instruments is enclosed except for portions other than the double wall such as a port P and a window which will be described later. The double wall structure 4 is provided on the left side and the back side of the irradiation optical system 101 and the detection optical system 102, and on the front (maintenance surface) of the irradiation optical system 101 and the detection optical system 102. The structure differs from the double wall structure 4B.

  The double wall structure 4A provided on the left and right side surfaces and the back surface of the irradiation optical system 101 and the detection optical system 102 includes an interior panel 4A1 and an exterior panel 4A2. The interior panel 4A1 and the exterior panel 4A2 are independently attached to the frame 3. As shown in FIG. 6, a double wall structure 4A is formed between a space where the irradiation optical system 101 and the detection optical system 102 are located and a space where the operation unit 5 (electric system) is located. The temperature effect received from the operation unit 5 (electric system) can be reduced as much as possible, as well as the external temperature effect.

  As shown in FIGS. 4 and 6, the interior panel 4 </ b> A <b> 1 has a rectangular shape provided to face the irradiation optical system 101 and the detection optical system 102, and includes an upper frame 313, a column 312, and a horizontal beam 3. 321, the vertical beam 322, or the lower frame 311 is fixed to the inner surface forming the opening of the frame 3 with screws or the like.

  Therefore, on the four sides of the interior panel 4A1, mounting portions 4A11 for mounting and fixing to the upper frame 313, the support column 312, the horizontal beam 321, the vertical frame or the lower frame 311 are provided upright over almost the entire side. (See the enlarged view of FIG. 6). In FIG. 4, only a part of the mounting portion of the interior panel 4 </ b> A <b> 1 at the upper right in the drawing is given a reference numeral.

  Then, the mounting portion 4A11 is fitted into a plurality of openings formed in the frame 3, and the mounting portion 4A11 is attached to the frame 3 (each member forming the frame 3 (upper frame 313, support column 312, horizontal beam 321, vertical frame 322 or lower frame). 311)).

  As shown in FIGS. 4 and 6, the interior panel 4A1 such as the upper stage on the back and left and right side surfaces of the irradiation optical system 101 and the detection optical system 102 has a plurality of fixing portions 4A3 for fixing the exterior panel 4A2 with screws. Is provided. The fixed portion 4A3 has a substantially gate shape in cross section, and is provided on the interior panel 4A1 at equal intervals in the vertical direction. In FIG. 4, only a part of the fixing portion 4A3 of the interior panel 4A1 on the upper right in the drawing is given a reference numeral.

  The exterior panel 4A2 forms an air layer between the interior panel 4A1 and forms a rectangular shape that forms the double wall structure 4A in relation to the interior panel 4A1.

  The exterior panel 4 </ b> A <b> 2 includes one fixed to a fixing portion 4 </ b> A <b> 3 provided on the interior panel 4 </ b> A <b> 1 and one fixed to the frame body 3.

  The exterior panel 4 </ b> A <b> 2 fixed to the frame body 3 is attached to an attachment auxiliary tool 33 attached to the inner surface of the frame body 3. The attachment assisting tool 33 is substantially L-shaped in a side view. Further, the exterior panel 4A2 is provided with a handle for facilitating the attaching / detaching operation to the frame 3.

  As shown in FIGS. 4 and 5, a semiconductor wafer W transferred by a semiconductor wafer transfer device (not shown) is placed on the double wall structure 4A provided on the back surface of the irradiation optical system 101 and the detection optical system 102. A port P for carrying in / out is provided.

  The front (maintenance surface) of the irradiation optical system 101 and the detection optical system 102, specifically, the double wall structure 4 </ b> B provided in the maintenance opening 3 </ b> A of the frame 3 can be attached to and detached from the frame 3. It consists of an integral panel member 6. Here, the integral type has a double wall structure 4B composed of an inner wall and an outer wall, and can be attached to and detached from the frame 3 at the same time.

  As shown in FIGS. 7 and 8, the panel member 6 has a rectangular shape, and air is interposed between the inner surface plate 61 facing the irradiation optical system 101 and the detection optical system 102, and the inner surface plate 61. And an outer plate 62 forming a layer. The panel member 6 has a structure thinner than the double wall structure 4A provided except for the maintenance surface. That is, the panel member 6 has a structure that is thinner than the thickness of each member (the upper frame 313, the column 312, the horizontal beam 321, and the vertical frame 322) that forms the frame 3. Thereby, when the panel member 6 is attached to the frame 3, the panel member 6 does not protrude into the gantry 1, and the gas flow flowing inside the gantry 1 is not disturbed.

  As shown in FIG. 9, the inner surface plate 61 is formed by a rectangular flat plate portion 611 and side wall portions 612 erected on the four sides of the flat plate portion 611, and has a box shape with an open top surface. .

  As shown in FIG. 8, a plurality of fixing pieces 63 for fixing the outer surface plate 62 are provided at equal intervals on the surface (inner surface) 611a of the flat plate portion 611 of the inner surface plate 61 facing the outer surface plate 62. ing. The fixed piece 63 has a substantially gate shape in cross section and is welded to the inner surface plate 61. Further, the contact surface 63 a of the fixed piece 63 is formed so as to contact the inner surface 621 a of the outer surface plate 62 in a state where the inner surface plate 61 and the outer surface plate 62 are overlapped. The contact surface 63a is formed with a through hole for fixing the outer plate 62 with screws.

  As shown in FIGS. 8 and 9, the outer surface plate 62 has a box shape having an opening wider than one opening of the inner surface plate 61, and includes a rectangular flat plate portion 621 and four pieces of the flat plate portion 621. These are formed into a box shape having an open top surface formed by a side wall portion 622 and a top wall portion 623 extending inwardly from the tip end portion of the side wall portion 622.

  Further, a handle 64 is provided at the center of the surface (outer surface) 621b opposite to the surface 621a facing the inner surface plate 61 of the flat plate portion 621 of the outer surface plate 62 for facilitating the attachment / detachment operation of the panel member 6. (See FIG. 7 etc.).

  Then, as shown in FIG. 10, the opening of the inner surface plate 61 and the opening of the outer surface plate 62 are overlapped to accommodate the inner surface plate 61 inside the outer surface plate 62, and the outer surface plate 62 is attached to the fixed piece 63 of the inner surface plate 61. An integral panel member 6 is formed by screw fixing. At this time, the front end surface of the side wall portion 612 of the inner surface plate 61 and the flat plate portion inner surface 621a of the outer surface plate 62 are in contact with each other. That is, the height of the fixed piece 63 and the height from the flat plate portion 611 of the side wall portion 612 of the inner surface plate 61 are made the same.

  In addition, the measuring instrument mount 1 of the present embodiment is provided with an attaching / detaching mechanism 7 for easily attaching and removing the panel member 6 to and from the frame body 3.

  As shown in FIG. 11, the attachment / detachment mechanism 7 is provided on a locking pin 71 extending upward on a horizontal beam 321 to which the panel member 6 is attached, and a lower side wall portion 622 of the outer surface plate 62. A locking hole 72 into which the mating pin 71 is fitted, and an engaging projection 73 provided perpendicularly to the flat plate portion 621 at the top of the flat plate portion 621 of the outer surface plate 62 and rotatably attached to the flat plate portion 621. And an engaged portion 74 that is provided on the upper frame 313 and engages with the engaging convex portion 73.

  The engaging convex portion 73 is attached perpendicularly to the flat plate portion 621 of the outer surface plate 62 and includes a rotating shaft 731 capable of rotating by 90 degrees and an engaging piece 732 attached to the tip portion of the rotating shaft 731. . Then, when the rotation shaft 731 rotates 90 degrees, the engagement piece 732 engages with the engaged portion 74. The engaged portion 74 is a guide plate that extends downward from the upper frame 313 and defines the mounting position of the panel member 6. The engaged portion 74 is in contact with the panel member 6 on one surface, and the engaging piece 732 of the engaging convex portion 73 is in contact with the other surface. In this way, the light shielding structure in which light from the outside does not enter is configured such that one surface of the engaged portion 74 and the panel member 6 are in surface contact.

  The panel member 6 can be attached / detached by simply rotating the rotating shaft 731 of the engaging convex part 73 by 90 degrees by the attaching / detaching mechanism 7 configured as described above. Therefore, the panel member 6 can be attached / detached to / from the frame 3 very easily. It can be carried out.

  The members provided for the locking pin 71, the locking hole 72, the engaging convex portion 73, and the engaged portion 74 are not limited to the above, and may be provided oppositely.

  As described above, the maintenance surface is provided with the panel member 6 on the frame 3 by an installation method different from the other surfaces.

  The attachment / detachment operation (opening / closing operation of the maintenance opening 3A) of the panel member 6 configured as described above will be described.

  The operation of attaching the panel member 6 (operation of closing the maintenance opening 3A) will be described. First, in a state in which the maintenance opening 3A is open, the holding pin 64 of the panel member 6 is held, and the locking hole 72 provided in the lower side wall portion 621 of the outer plate 62 is provided in the locking pin 71 provided in the cross beam 321. Fit and lock. Then, after the panel member 6 is brought into contact with the column 312 or the vertical beam 322, the engagement convex portion 73 provided on the outer surface plate 62 is rotated by 90 degrees to engage with the engaged portion 74 provided on the upper frame 313. Combine. Thereby, the panel member 6 is closely fixed to the frame 3. In addition, what is necessary is just to perform the procedure contrary to the said procedure, when opening 3A of panel member 6 maintenance openings.

  Further, as shown in FIG. 5 in particular, the measurement instrument gantry 1 of the present embodiment blows air to the irradiation optical system 101 and the detection optical system 102, and blows the temperature of the optical systems 101 and 102. 8 and a flow distribution structure 9 that distributes a gas flow (wind) from the blower mechanism 8 and blows air to the irradiation optical system 101, the detection optical system 102, and the semiconductor wafer W.

  The blower mechanism 8 is a clean fan that cleans the temperature-adjusted air from an external temperature controller (not shown) provided outside the measurement instrument base 1 and blows it out into the measurement instrument base 1. The blower mechanism 8 is provided on the upper portion of the frame 3 and blows air to the irradiation optical system 101 and the detection optical system 102 from above to below.

  The flow distribution structure 9 includes a flow dividing mechanism that divides one united wind from one air blowing mechanism 8 into two, and one flow divided by the flow dividing mechanism is applied to the irradiation optical system 101 and the detection optical system 102. At the same time, the other flow is applied to the semiconductor wafer W from the side in one direction at an increased flow velocity.

  Specifically, as shown in FIG. 5, the flow distribution structure 9 is provided between the blower mechanism 8 and the irradiation optical system 101 and the detection optical system 102, and introduces the wind from the blower mechanism 8. The splitting plate 9a as a branching mechanism that divides the gas flow that has entered from the inlet 9a, and one flow split by the splitting plate 9b as it is, the irradiation optical system 101 and the detection optical system 102. And a second flow path 9d for increasing the flow velocity of the other flow divided by the flow dividing plate 9b to the semiconductor wafer W.

  The flow dividing plate 9a is provided along the flow of the gas flow that has entered from the inlet 9a.

  The first flow path 9c has the same cross-sectional area, and has a rectangular shape formed with the flow dividing plate 9b as a part of the side peripheral wall. The outlet is opened above the irradiation optical system 101 and the detection optical system 102.

  The second flow path 9d has a cross-sectional area that narrows continuously or stepwise, and has a substantially L-shaped side view formed by using the flow dividing plate 9b as a part of the side wall. Specifically, the second flow path 9d is provided along the longitudinal direction of the frame 2 and allows a gas flow to flow toward the maintenance surface. That is, the second flow path 9 d is provided along the interior panel 4 A 1 on the back surface of the base member 21, and the outlet thereof is opened obliquely above the semiconductor wafer W. Thus, since the cross-sectional area of the second channel 9d is narrowed continuously or stepwise, the flow velocity can be increased. Moreover, since it is provided along the longitudinal direction, when sending a gas flow to a transversal direction, a gas flow can be applied efficiently. For example, in the case where the gas flow is provided along the direction orthogonal to the longitudinal direction, when the gas flow is sent in the longitudinal direction, the distance from the outlet of the second flow path 9 to the semiconductor wafer W becomes long, and a sufficient gas flow is sent. There is a problem that can not be.

  Moreover, since the 2nd flow path 9d and the flow direction control board 10 are provided in addition to a maintenance surface by flowing toward a maintenance surface, it does not become a hindrance at the time of a maintenance.

  The first flow path 9c and the second flow path 9d are continuously provided in parallel via the flow dividing plate 9b, and the flow distribution structure 9 is a hollow long body that is generally L-shaped in a side view as a whole. is there.

  As shown in FIG. 5, the measurement instrument base 1 further includes a flow direction control plate 10 that controls the flow direction of the other diversion from the flow distribution structure 9.

  The flow direction control plate 10 directs the flow from the second flow path 9d toward the semiconductor wafer W in order to more efficiently apply the flow from the second flow path 9d to the semiconductor wafer W. Between the distribution structure 9 and the semiconductor wafer W, it is provided downstream of the outlet of the second flow path 9d.

  More specifically, the flow direction control plate 10 is a long body having a V-shaped cross section, and one side plate of the flow direction control plate 10 is fixed to the vertical beam 322 of the frame 3 so as to have an inverted V shape. As a result, the other side plate faces both the outlet of the second flow path 9d of the flow distribution structure 9 and the semiconductor wafer W.

  A gap H is provided between the lower end of the frame 3 and the base 2. As shown in FIG. 5, the gap H includes a gap H1 that flows out the gas flow that has passed through the front surface of the base 2 and a gap H2 that flows out the gas flow that has passed through the back surface of the base 2 to the outside. is there. The gap H1 on the front surface of the base 2 is larger than the gap H2 on the back surface of the base 2. Thereby, the flow volume of the gas flow which passes the front of the base 2 can be made larger than the flow volume of the gas flow which passes the back surface of the base 2, and a gas flow can be flowed from the back of the base 2 to the front. . That is, the gas flow from the second flow path 9d can be reliably applied to the semiconductor wafer W. The sizes of the gaps H1 and H2 can be appropriately set so as to prevent upward turbulence.

  Thus, since the gap | interval H is provided in the base 1 lower part, generation | occurrence | production of the upward turbulent flow can be prevented and dust generation can be prevented.

  <Effect of this embodiment>

  According to the measuring instrument base 1 according to the present embodiment configured as described above, it is possible to suppress an adverse effect on the temperature stability inside the apparatus base 1 due to the temperature change of the installation environment. As a result, it is possible to reduce measurement errors such as measurement data shifts or measurement point shifts based on temperature changes. Moreover, since the temperature stability inside the apparatus base 1 is improved, high-precision temperature control can be realized by using a simple and inexpensive air blowing mechanism 8.

  Further, since the maintenance opening 3A is an integral panel member 6 and it is only necessary to remove the panel member 6 from the frame 3, it is easy to perform maintenance work while maintaining the temperature stability inside the gantry 1 during measurement. Can be improved.

  Furthermore, in this embodiment, only the maintenance opening 3A is used as the integrated panel member 6, and the other double wall structure 4A is formed by the interior panel 4A1 and the exterior panel 4A2, thereby reducing the cost. Can do.

  In addition, an air layer which is a heat insulating layer can be formed very easily by the inner surface plate 61 and the outer surface plate 62, or the interior panel 4A1 and the exterior panel 4A2.

  Further, since the air is blown by using the air blowing mechanism 8 in addition to the double wall structure, the temperature of the irradiation optical system 101 and the detection optical system 102 can be reliably controlled. Further, since air is blown from the side while the air is blown from the upper side to the lower side, dust and the like on the semiconductor wafer W can be removed.

  <Other modified embodiments>

  The present invention is not limited to the above embodiment. In the following description, the same reference numerals are given to members corresponding to the above-described embodiment.

  For example, in the above-described embodiment, only the maintenance opening 3 </ b> A is configured as a double wall structure by the integrated panel member 6, but the other surfaces are also doubled by using the integrated panel member 6. It may be a wall structure.

  In the above embodiment, the double wall structure is not formed on the upper surface on which the clean fan 8 is provided and the lower surface considered to hardly affect the temperature of the optical systems 101 and 102. A double wall structure may be formed. In this case, the temperature stability can be further improved.

  Further, the panel member 6 may be configured by fixing two panels with a rectangular frame sandwiched therebetween.

  In addition, in the embodiment, the flow direction control plate 10 is provided on the back surface of the base member 21 to which the irradiation optical system 101 and the detection optical system 102 are fixed, but the irradiation optical system 101 and the detection optical system 102 are provided. You may make it provide in front of. In this case, since the panel member 6 is attached to and detached from the frame 3 in front of the optical system, the flow direction control plate 10 may be provided on the panel member 6 or may be provided on the frame 3. .

  In addition, the flow distribution structure 9 may have only the second flow path 9d. That is, the flow distribution structure 9 includes an introduction port 9a for introducing a part of the gas flow from the blower mechanism 8 and a second flow path 9d connected to the introduction port 9a. Similarly to the above-described embodiment, the second flow path 9d has a cross-sectional area that narrows continuously or stepwise as it goes downstream.

  Further, the shape of the flow direction control plate 10 is not limited to a long body having a V-shaped cross section, and may be other shapes. Specifically, an optimum shape can be obtained according to the positional relationship between the irradiation optical system 101, the detection optical system 102, and the sample stage 103 on which the semiconductor wafer W is placed.

  Further, as shown in FIG. 12, the temperature-controlled air is sent into the double wall structure from the blower mechanism 8 provided in the upper part of the gantry 1 so that the gas layer flows in the double wall structure. It is also possible. In this case, since the temperature-controlled air can be diverted from the blower mechanism 8 and sent into the double wall structure, it is not necessary to newly provide the blower mechanism 8 and the temperature control mechanism, resulting in an increase in cost. Furthermore, it becomes easier to adjust the temperature inside the gantry. In addition, another air blowing mechanism may be provided to feed the temperature-controlled air into the double wall structure. Even in this case, it becomes easier to control the temperature inside the gantry. In addition, the temperature of the gas layer in the double wall structure may be controlled. Specifically, it is possible to attach a temperature control heater to the inner panel as a temperature control mechanism for controlling the temperature of the gas layer flowing in the double wall structure. In this way, it is possible to make it less susceptible to external temperature effects. In addition, the gas layer in the double wall structure flows to form a negative pressure in the double wall structure. For example, a positive pressure gas flow from the transport mechanism is sucked in and the object to be measured is carried in and out. It is also possible to prevent a gas flow from flowing into the cradle from the port. Furthermore, the air flowing from the upper part of the gantry by the blower mechanism 8 may be used to send the air into the double wall structure. By controlling the temperature of the gas layer in this way, the temperature stability in the gantry can be improved.

  Moreover, you may provide the collection | recovery flow path comprised so that the air which flowed from the upper direction which the ventilation mechanism 8 ventilated may be returned to the ventilation mechanism 8 again. For example, as shown in FIG. 13, the air blown from the upper part of the gantry to the lower part of the gantry may be circulated so as to return to the air blowing mechanism 8 after passing through the gas layer of the double wall structure 4 as a recovery channel. In this way, the blower mechanism can eliminate the need to take in air from the outside, maintain the cleanliness of the measurement object, improve the temperature stability in the gantry, and reduce the capacity of the blower mechanism 8. This can help reduce costs.

  Furthermore, in the above-described embodiment, the front surface of the frame 3 is the maintenance surface, but the maintenance surface may be a surface other than the surface (back surface) on which the port P is provided.

  The port P is usually provided on the surface where the transport distance to the sample stage 103 is the shortest. Accordingly, the port P is provided on the longitudinal surface of the gantry 1 and the semiconductor wafer W is transferred from the short direction. A maintenance surface is provided on any of the remaining surfaces. However, the wider the maintenance surface, the easier the maintenance of the measuring instrument or the like, and thus the maintenance surface is often provided on the longitudinal surface. Therefore, the normal maintenance surface is often provided on the surface facing the port P.

  Moreover, in the said embodiment, each of the side wall surrounding a measuring instrument has the double wall structure 4, However, When a side wall is divided into the up-down direction in multiple steps, the position where a measuring instrument is included in a horizontal direction Only the side wall at (height) may have a double wall structure.

  The measuring instrument of the embodiment irradiates a semiconductor wafer with inspection light and detects light generated from the semiconductor wafer. In addition, for example, a scanning probe microscope (such as an atomic force microscope (AFM)) ( SPM) or the like.

  As a measurement object, in addition to the semiconductor wafer W, a substrate such as a display glass substrate or a solar cell substrate such as a silicon substrate may be measured.

  Moreover, the heat insulation layer of the double wall structure 4 may be configured by being filled with a heat insulating material in addition to the air layer, or may be configured by another gas of air.

  Furthermore, in the said embodiment, although the other flow was flowed toward the maintenance surface, conversely, the other flow may be flowed from the maintenance surface toward the opposite surface.

  In addition, as shown in FIG. 14, the four surfaces of the outer wall surface OS and the inner wall surface IN of the double wall structure 4 may be mirror surfaces. If it does in this way, the infrared rays which go to the inside from the exterior of measuring instrument stand 1 can be reflected, and the temperature rise in the inside of measuring instrument stand 1 by infrared rays can be prevented, and the infrared rays which go from the inside to the outside are reflected. Thus, heat dissipation from the inside to the outside can be prevented and the temperature can be kept constant. Therefore, the temperature stability of the measuring instrument can be further improved. Further, since the temperature stability is improved, it is possible to maintain a constant temperature without using a large-capacity blower mechanism 8, which can help to reduce the cost.

  Further, only the outer wall surface OS of the double wall structure 4 may be a mirror surface. Even in this case, the temperature change due to infrared rays can be prevented, and the manufacturing cost can be reduced because there are few mirror surfaces. Furthermore, both of the outer wall surfaces may be mirror surfaces, and only one of the inner wall surfaces may be a mirror surface.

  In addition, some or all of the above-described embodiments and modified embodiments may be combined as appropriate, and the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. .

The perspective view of the mount frame for measuring instruments which concerns on this embodiment. The perspective view which shows the state which removed the double wall structure of the gantry front in the same embodiment. The rear perspective view which mainly shows the frame in the same embodiment. The perspective view which shows the state which mainly attached the interior panel in the same embodiment. Typical sectional drawing which shows the gas flow from the ventilation mechanism in the embodiment. Sectional drawing which shows the frame and double wall structure in the embodiment. The front perspective view of the panel member in the embodiment. The rear perspective view of the panel member in the embodiment. Sectional drawing of the panel member in the embodiment. The assembly exploded view of the panel member in the embodiment. The typical sectional view showing the attachment-and-detachment mechanism in the embodiment. The typical sectional view showing the flow of the gas layer inside the double wall structure concerning another embodiment. The typical sectional view showing the flow of the gas layer inside the double wall structure concerning still another embodiment. The typical enlarged view of the double wall structure which concerns on different embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Measuring instrument mount W ... Measurement object 101 ... Irradiation optical system 102 ... Detection optical system 3 ... Frame body 4 ... Double wall structure 6 ... Panel member 4A1 ... Interior panel 4A2 ... Exterior panel 61 ... Inner plate 62 ... Outer plate 8 ... Blower mechanism

Claims (7)

A measuring instrument stand for accommodating a measuring instrument for measuring a substrate,
A frame in which the measuring device is disposed;
A measuring instrument gantry comprising: a double wall structure provided on the frame, surrounding at least a side of the measuring instrument and having a gas layer therein. The double wall structure provided on the maintenance surface of the frame body includes an inner surface plate that faces the measuring instrument and an outer surface plate that forms a gas layer between the inner surface plate and can be attached to and detached from the frame body. Made of a single integrated panel member,
The measuring instrument stand according to claim 1, wherein all or a part of the other double wall structure includes an interior panel and an exterior panel respectively attached to the frame. The panel member is
One of the inner surface plate or the outer surface plate has a box shape with one surface opened,
The other of the inner surface plate or the outer surface plate has a box shape having an opening wider than one opening of the inner surface plate or the outer surface plate,
The measuring instrument stand according to claim 2, wherein the openings are overlapped and one of the openings is accommodated in the other.   The measuring instrument stand according to claim 1, wherein an air blowing mechanism for blowing air from above to below is provided on an upper portion of the frame.   The measuring instrument base according to claim 1, 2, 3, or 4, wherein the double wall structure is provided with a heat radiation blocking portion that prevents movement of heat due to heat radiation.   The measuring instrument mount according to claim 1, further comprising a temperature adjusting mechanism for adjusting the temperature of the gas layer flowing inside the double wall structure. It is a measuring instrument stand that accommodates a measuring instrument for measuring a measurement object,
A frame in which the measuring device is disposed;
A double wall structure provided in the frame, surrounding at least the side of the measuring instrument and having a heat insulating layer inside,
The double wall structure provided on the maintenance surface of the frame body includes an inner surface plate that faces the measuring instrument and an outer surface plate that forms a heat insulating layer between the inner surface plate and can be attached to and detached from the frame body. Made of a single integrated panel member,
A measuring instrument gantry comprising an interior panel and an exterior panel, all or part of other double wall structures attached to a frame.