JP2009028735A - Laser machining apparatus and shielding method of laser beam - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To machine a machining target without damaging the machining target due to laser beam leaked from a machining part. <P>SOLUTION: The laser machining apparatus performs machining by irradiating the machining part of the machining target formed into a prescribed shape with laser beam emitted from a fiber, and includes: a fixing member for fixing the machining target at a prescribed position; a reflection member for reflecting, in the prescribed direction, the laser beam leaked on the back side after irradiating the machining part of the machining target fixed to the fixing member with the laser beam; and an absorption member for absorbing the laser beam reflected by the reflection member, wherein the reflection member is installed in the fixing member, thereby solving the above problem. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus and a shielding method in laser processing, and in particular, a laser processing apparatus for processing a processing target without damaging the processing target with laser light leaking from a processing portion. And a shielding method in laser processing.

  Conventionally, drilling (penetration) processing is performed by irradiating a laser beam when a predetermined shape having irregularities or the like is formed in advance on a workpiece (work) such as resin, aluminum, ceramic or the like. In some cases, when the non-processed surface of the processing target exists on the optical path of the laser beam leaked from the processed part to the back surface side, damage (damage) may be caused by the irradiation of the leaked laser beam.

  Therefore, there is a technique to adjust the focus of the laser beam to the extent that it is not damaged to prevent damage other than the predetermined processing part, or to prevent damage to the processing object due to leaked laser light etc. by providing a protector etc. Known (for example, refer to Patent Documents 1 and 2).

Here, Patent Document 1 discloses a protector including a translucent member provided along the back side of the processing surface of the workpiece and a reflecting member provided along the back side of the translucent member. . Patent Document 2 discloses a laser beam that penetrates by covering a part of the back surface of a portion irradiated with laser light or a part of the surface of a jig for holding a workpiece with a fiber made of a ceramic material. Has been shown to shield.
Japanese Patent Laid-Open No. 6-55291 JP-A-7-136792

  By the way, when using, for example, a YAG laser or the like as laser light used for processing, the beam quality is inferior to that of a fiber laser, so the processing speed is slow and the processing surface is dirty. In addition, when using YAG laser, when drilling or cutting a workpiece from resin or metal, etc., a certain amount of space for shifting the focal point of the laser beam is provided on the back side of the processing part. The non-machined surface of the workpiece to be processed was not damaged.

  However, for example, when drilling or cutting an object to be processed with a fiber laser or the like that outputs 1070 to 1080 nm light, the non-processed surface on the back surface of the processing part is laser-induced by the laser light that has passed through the member during drilling or cutting. Damaged by light.

  The fiber laser is different from the YAG laser in that the laser medium is in the form of a fiber. Its advantages are that it is easy to increase the output and is compact, and the fiber diameter is very thin. There are advantages such as high beam quality, low running cost, and maintenance-free due to the structure of the oscillator.

  Here, FIG. 1 is a diagram illustrating an example of a problem in the prior art. First, as shown in FIG. 1 (a), when a laser beam 12 is irradiated at a predetermined focal point via a nozzle 11 or the like on a workpiece 10 that has been formed in a predetermined shape in advance, After the hole 13 is drilled, the non-machined surface 14 of the workpiece 10 is irradiated with laser light. At this time, the laser light applied to the non-processed surface 14 is out of focus, but is damaged by high output using a fiber laser, high beam quality, and the like.

  Further, for example, as shown in FIG. 1B, for example, when the laser light absorbing member 15 is provided to prevent the non-processed surface 14 from being irradiated with laser light, the laser light absorbing member 15 is irradiated with the laser light. The back surface of the processed part is damaged by reflection.

  The present invention has been made in view of the above-described problems, and a laser processing apparatus for processing a processing target without damaging the processing target with laser light leaking from a processing unit, and It aims at providing the shielding method in laser processing.

  In order to achieve the above-mentioned object, the present invention is a laser processing apparatus for performing processing by irradiating a laser beam output from a fiber onto a processing portion of a processing object formed in a predetermined shape, A fixing member for fixing the object at a predetermined position, and the laser light leaked to the back side after the laser light is irradiated to the processing part of the processing object fixed to the fixing member in a predetermined direction And a reflecting member for absorbing the laser beam reflected by the reflecting member, and the reflecting member is installed on the fixing member. Thereby, a processing target object can be processed, without giving the processing target object the damage by the laser beam which leaked from the process part.

  Furthermore, it is preferable that the reflection member has a planar irradiation surface of the laser beam. Thereby, it can reflect easily and correctly to a predetermined position.

  Furthermore, it is preferable that the reflection member has a curved irradiation surface of the laser beam. Thereby, since light can be further diffused and weakened, processing to a non-processed surface can be prevented.

  Furthermore, it is preferable to have rotating means for rotating the reflecting member in association with the change in the irradiation direction in order to reflect the laser light in a predetermined direction when the irradiation direction of the laser light changes. Thereby, even if the direction in which the laser beam is irradiated is changed, it can be reflected in a predetermined direction. Further, when the direction of laser light irradiation is the same, the reflection direction can be changed.

  Furthermore, it is preferable that the reflection member is formed integrally with the fixing member. As a result, it is possible to process the processing object with a simple configuration without taking up space and without damaging the processing object with the laser light leaking from the processing unit.

  The present invention also provides a laser that leaks to the back side of the processing portion irradiated with the laser light when the processing portion of the processing target formed in a predetermined shape is irradiated with the laser light output from the fiber. A laser beam shielding method for shielding light, a fixing step of fixing the object to be processed at a predetermined position by a fixing member, a reflecting step of deriving the leaked laser light in a predetermined direction by a reflecting member, An absorbing step of absorbing the laser light reflected by the reflecting member by an absorbing member, wherein the reflecting member is installed on the fixing member. Thereby, a processing target object can be processed, without giving the processing target object the damage by the laser beam which leaked from the process part.

  Furthermore, it is preferable that the reflecting step uses a reflecting member in which the laser light irradiation surface is formed in a flat shape. Thereby, it can reflect easily and correctly to a predetermined position.

  Further, it is preferable that the reflecting step uses a reflecting member in which the laser light irradiation surface is formed in a curved shape. Thereby, since light can be further diffused and weakened, processing to a non-processed surface can be prevented.

  Furthermore, it is preferable to have a rotation step of rotating the reflecting member in association with the change in the irradiation direction by a rotating means in order to reflect the laser beam in a predetermined direction when the irradiation direction of the laser beam is changed. Thereby, even if the direction in which the laser beam is irradiated is changed, it can be reflected in a predetermined direction. Further, when the direction of laser light irradiation is the same, the reflection direction can be changed.

  Furthermore, it is preferable that the reflecting step uses a reflecting member formed integrally with the fixing member. As a result, it is possible to process the processing object with a simple configuration without taking up space and without damaging the processing object with the laser light leaking from the processing unit.

  ADVANTAGE OF THE INVENTION According to this invention, a processing target object can be processed, without giving the damage to the processing target object with the laser beam which leaked from the process part.

<Shielding method in the present invention>
First, a laser light shielding method according to the present invention will be described with reference to the drawings. FIG. 2 is a diagram illustrating an example for explaining a laser beam shielding method according to the present invention. In this invention, as shown in FIG. 2, it is comprised so that it may have the reflection member 21 and the absorption member 22 which were formed planarly with respect to the irradiation surface of a laser beam.

  That is, the laser beam 12 output from the nozzle 11 is subjected to predetermined processing by the processing unit 13, then moved to a position where the processing target 10 is not irradiated via the reflecting member 21, and an absorbing member installed in the moving direction. 22 absorbs the laser beam 12. As a result, the laser beam 12 leaked from the processed portion 13 does not reach the non-processed surface 14, and the reflected light from the reflecting member 21 is not irradiated on the back surface of the processed portion 13. Surface damage can be prevented.

Also, with this configuration, the distance to reach the absorbing member 12 is longer than before, so that the focal point can be greatly shifted. In other words, since the diameter d ₁ irradiated to the absorbing member 22 is increased and light is diffused, the absorbing member 22 is not processed and no hole is formed. There is no influence that the workpiece 10 is damaged by the reflected light.

FIG. 3 is a diagram illustrating an example of another embodiment. In the example shown in FIG. 3, it has the reflection member 23 formed in the curved shape with respect to the irradiation surface of a laser beam. Note that the reflecting member 23 can be curved in an arc shape having a radius of about 50 mm to 100 mm, for example.
By curving the reflecting member 23 can be more diffuse laser diameter d ₂ at the time of reaching the absorbing member 22 from the laser light 12 irradiated. Thereby, the distance of the reflection member 23 and the absorption member 22 can be shortened, and an installation space can be made small.

  In addition, since the reflecting members 21 and 23 reflect the laser beam in a predetermined direction when the irradiation direction of the laser beam is changed, the reflecting member is arbitrarily set at a predetermined angle in association with the change in the irradiation direction. Can be moved. Moreover, it is preferable that the absorbing member 22 is provided at a position where all the laser beams reflected by the reflecting members 21 and 23 can be received.

  Moreover, as the reflecting members 21 and 23, for example, a SUS material or the like can be used, and as the absorbing member 22, for example, an SS material or the like can be used.

  In the above-described configuration, the absorbing member may not be provided as long as the laser beam leaked by the reflecting member 21 can be reflected to a position where the non-machined surface of the workpiece is not irradiated. .

  In addition, the absorbing member 22 may be directly disposed at the position of the reflecting member 21 when a certain distance can be secured on the back surface of the processed portion 13. In this case, for example, when a 500 W laser is used, a distance of about 100 mm or more is sufficient.

  In the present invention, as described above, when the distance between the processed portion 13 and the non-processed surface 14 is not sufficient, as shown in FIG. 1, the reflecting member 21 is disposed therebetween, and the laser beam is reflected by this reflecting member. Let it diffuse. The absorbing member 22 is disposed where the laser light from the reflecting member 21 reaches.

  Thereby, a processing target object can be processed, without giving the processing target object the damage by the laser beam which leaked from the process part.

<Laser processing equipment>
Next, a laser processing apparatus to which the above-described shielding method is applied will be specifically described with reference to the drawings. FIG. 4 is a diagram illustrating an example of a laser processing apparatus. A laser processing apparatus 30 shown in FIG. 4 is an apparatus for performing laser processing such as drilling or cutting with a fiber laser on a workpiece (processing object) 31 formed in advance in a predetermined shape.

  A laser processing apparatus 30 shown in FIG. 4 includes, on a stage 32, at least one work receiving member 33 as a fixing member for fixing the work 31, at least one clamp part 34, a robot arm part 35, a laser, The oscillator 36, the fiber 37, the machining head 38, and the machining nozzle 39 are configured.

  In the laser processing apparatus 30 shown in FIG. 4, the work 31 is placed at a predetermined position on the work receiving member 33 provided on the stage 32. At this time, the receiving surface of the workpiece receiving member 33 is provided with irregularities corresponding to the shape of the workpiece 31, and the workpiece 31 is positioned corresponding to the irregular shape.

  Further, the work 31 placed at a predetermined position of the work receiving member 33 is pressed and fixed by the clamp portion 34 from above. In addition, the contact part with the workpiece | work 31 in the clamp part 34 consists of elastic bodies, such as rubber | gum, and is the structure which does not damage the workpiece | work 31. FIG.

  The robot 35 has a mechanism for moving the machining head 38 to a predetermined machining area of the workpiece 31 fixed to the workpiece receiving member 33 and the clamp portion 34. The laser oscillator 36 emits a predetermined laser beam at a predetermined timing. Specifically, the laser oscillator 36 emits a pulsed laser beam having a predetermined intensity at a predetermined timing in order to perform predetermined processing on the workpiece 31.

Here, for example, a fiber laser can be used as the laser beam in the present embodiment, but a general laser beam such as an Nd: YAG laser or a CO ₂ laser can also be used. The type of laser beam in the present invention is not particularly limited. That is, it can be arbitrarily selected according to various processing conditions such as the material and thickness of the work 31 and what kind of processing (drilling, annealing, etc.) is performed.

  The fiber 37 is a mechanism for guiding the laser beam from the laser oscillator 36 to the machining head. Further, the processing head 38 has an optical system for condensing the laser light and forming an image with a predetermined size. The processing nozzle 39 is formed in a conical shape with an open end, and is a nozzle for accurately irradiating a predetermined position with laser light. Moreover, dross, spatter, etc. generated by processing can be removed by ejecting an assist gas such as air from the processing nozzle 39 simultaneously with the laser beam.

  FIG. 5 is a diagram showing an example of the reflecting member in the present invention. As shown in FIG. 5, the reflection member 21 described above is provided on the work receiving member 33. The reflecting member 21 is provided with a rotating means 40 for moving the direction in a predetermined direction by rotation. Thereby, even if the direction in which the laser beam 41 is irradiated is changed, it can be reflected in a predetermined direction. Further, when the direction of laser light irradiation is the same, the reflection direction can be changed to a predetermined direction.

  Here, in FIG. 5, the laser light 41 output from the processing nozzle 39 performs a desired drilling process on the processing portion 42 of the workpiece 31, and then the laser light penetrating the processing portion 42 is transmitted by the rotating means 40. The light is reflected by the reflecting member 21 that is directed and fixed in the direction (for example, the direction in which the absorbing member 22 is present), and the laser beam is absorbed by the absorbing member 22 described above. It should be noted that a sufficient distance from the non-processed surface is provided, or the intensity of the laser beam is so weak that it cannot be processed, even if the structure does not include the absorbing member 22 without being affected by the laser beam. It only has to be.

  In addition, although the reflection member 21 mentioned above provided the rotation drive mechanism for moving a reflective surface as a structure different from the workpiece receiving member 33, the structure integrated with the workpiece receiving member 33 may be sufficient.

  Here, FIG. 6 is a diagram illustrating an example of a workpiece receiving member that also serves as a reflecting member. As described above, the workpiece receiving member 33 as a fixing member shown in FIG. 6 has irregularities formed in accordance with the shape of the workpiece 31, and the workpiece 31 is fixed at a predetermined position and is easily stabilized.

  Further, the reflecting member 21 shown in FIG. 6 is fixedly installed on the work receiving member 33 and formed integrally with the work receiving member 33. At this time, the workpiece receiving member 33 installs the reflecting member 21 at a position where the reflecting member 21 reflects the laser beam in a predetermined direction. The reflecting member 21 may be the above-described planar member or curved member.

  The reflecting member 21 is installed at a predetermined position of the work receiving member 33 by adhesion, screwing, a magnet, or the like. Further, the reflecting member 21 may be a sheet-like member such as a flexible reflecting sheet attached to a predetermined position of the work receiving member 33.

  Thereby, as shown in FIG. 6, the laser beam 41 irradiated to the workpiece 31 processes the processing portion 42, and the laser beam leaking from the processing portion 42 is reflected by the reflecting member 21 to be in a predetermined direction (for example, , The absorbing member 22 is in a certain direction). Thus, by forming the reflecting member 21 and the workpiece receiving member 33 integrally, no space is required, and the workpiece 31 is not damaged by the laser light leaking from the processing portion 42 with a simple configuration. The workpiece 31 can be processed.

  As described above, according to the present invention, it is possible to process the workpiece without damaging the workpiece with the laser beam leaking from the processing portion. Furthermore, it is possible to prevent spatter, dross, and the like from adhering to locations other than the processed portion (for example, the back side of the processed portion or the non-processed surface adjacent to the processed portion). Therefore, laser processing such as drilling and cutting can be performed with high accuracy on the processing target without damaging the processing target.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be changed.

It is a figure for demonstrating the subject in a prior art. It is a figure which shows an example for demonstrating the shielding method of the laser beam in this invention. It is a figure which shows an example of other embodiment. It is a figure which shows an example of a laser processing apparatus. It is a figure which shows an example of the reflection member in this invention. It is a figure which shows an example of the workpiece | work receiving member which served as the reflection member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Processing target object 11 Nozzle 12,41 Laser beam 13 Processing part 14 Non-processing surface 15 Laser light absorption member 21,23 Reflective member 22 Absorption member 30 Laser processing apparatus 31 Work 32 Stage 33 Work receiving member 34 Clamp part 35 Robot arm part 36 Laser oscillator 37 Fiber 38 Processing head 39 Processing nozzle 40 Rotating means 42 Processing section

Claims (10)

A laser processing apparatus that performs processing by irradiating a laser beam output from a fiber to a processing portion of a processing object formed in a predetermined shape,
A fixing member for fixing the object to be processed at a predetermined position;
A reflecting member for reflecting the laser beam leaked to the back side after the laser beam is irradiated on the processing portion of the workpiece fixed to the fixing member in a predetermined direction;
An absorbing member that absorbs the laser light reflected by the reflecting member;
The laser processing apparatus, wherein the reflecting member is installed on the fixing member.   The laser processing apparatus according to claim 1, wherein the reflection member has a plane irradiated with the laser light.   The laser processing apparatus according to claim 1, wherein the reflecting member has a laser light irradiation surface formed in a curved shape.   2. A rotating means for rotating the reflecting member in association with the change in the irradiation direction in order to reflect the laser light in a predetermined direction when the irradiation direction of the laser light is changed. 4. The laser processing apparatus according to any one of 3 above.   The laser processing apparatus according to claim 1, wherein the reflecting member is formed integrally with the fixing member. A laser that shields laser light leaking to the back side of the processing portion irradiated with the laser light when the processing portion of the processing target formed in a predetermined shape is irradiated with the laser light output from the fiber. A light shielding method,
A fixing step of fixing the object to be processed at a predetermined position by a fixing member;
A reflecting step for deriving the leaked laser light in a predetermined direction by a reflecting member;
An absorption step of absorbing the laser light reflected by the reflection member by an absorption member,
The said reflecting member is installed in the said fixing member, The shielding method characterized by the above-mentioned. The reflection step includes
The shielding method according to claim 6, wherein a reflection member having a planar irradiation surface of the laser beam is used. The reflection step includes
The shielding method according to claim 6, wherein a reflection member having a curved irradiation surface of the laser beam is used.   A rotation step of rotating the reflecting member in association with the change of the irradiation direction by a rotating unit to reflect the laser beam in a predetermined direction when the irradiation direction of the laser light is changed. Item 9. The shielding method according to any one of Items 6 to 8. The reflection step includes
The shielding method according to claim 6, wherein a reflective member formed integrally with the fixing member is used.

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