JP2009027038A - Circuit board conveying/holding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a more practical circuit board conveying/holding apparatus capable of stably clamping even a shape defective circuit board while evading cost increase or the like. <P>SOLUTION: A belt support rail 204 is provided on each of the respective side faces 200 and 202 of clamp members 110 and 111 and a part of the side faces 200 and 202 is made to function as guide surfaces 210 and 212, respectively. The upper end part of the side face 200 of the fixed clamp member 110 provides a clamp surface 218, rubber 222 is provided on the upper end part of the side face 202 of the movable clamp member 111 and the front surface provides a clamp surface 220. The board 40 is lightly slid by the guidance of the metallic guide surfaces 210 and 212, and while the board 40 is surfaced from a belt 66 after the movement, the movable clamp member 111 is moved, the metallic clamp surface 218 highly accurately positions the board 40, the rubber clamp surface 220 absorbs the shape defect of the board 40 by elastic deformation, and a side face 208 of the board 40 and the clamp surface 220 come in contact with each other in a wide range in a direction parallel to a conveying direction and thereby the board 40 is stably clamped. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a circuit board transporting / holding apparatus for carrying a circuit board into and holding it on a screen printing machine for printing cream solder on a circuit board, a component mounting machine for mounting electronic circuit components on a circuit board, and the like.

An example of this type of circuit board transfer / holding device is described in Patent Document 1 below. This circuit board transport / holding device is provided in a screen printing machine, which carries a circuit board by a belt conveyor and holds the loaded circuit board sandwiched from both sides in a direction parallel to the plate surface. It is a clamp type. When holding a circuit board with a side clamp type circuit board transport / holding device, if the shape of the circuit board is good, that is, the flatness of both sides is high and the parallelism of both sides is high There is no. However, when both sides have low flatness or parallelism and are clamped by a clamp member, the clamp surface only touches a small part of the side of the circuit board, and part of it is a circuit. The circuit board cannot be securely held unless it is sufficient to stably position or fix the board. This state of the circuit board is referred to as a shape defect.
Therefore, in the circuit board transport / holding device described in Patent Document 1, one of the clamp members can be rotated around a rotation axis perpendicular to the plate surface of the circuit board, Even when the degree of parallelism is poor, the clamp member is rotated around the rotation axis so as to be able to stably hold the circuit board along the side surface of the circuit board.
JP 2006-103073 A

If the clamp member can be rotated as described above, it is possible to stably clamp even if the circuit board has a poor shape, but in the state where the circuit board is not clamped, In addition, a device for maintaining the posture substantially along the side surface of the circuit board is also required, and there is a problem that the structure becomes complicated and the device cost becomes high, or when the circuit board is transported, the clamp member is rotated. The problem of getting in the way arises. This problem is an example of a problem that hinders the practicality of the conventional circuit board transport / holding device, and the conventional circuit board transport / holding device has room for improvement from various viewpoints.
Under the circumstances described above, the present invention provides a more practical circuit board transport / holding device that can stably clamp a defective circuit board while avoiding the occurrence of the above problems. Was made as an issue.

  According to the present invention, the circuit board is supported from below by the belt conveyor, and both side surfaces of the circuit board are guided by the guide surfaces of the pair of guide members and transported in the transport direction, and then the clamp surfaces of the pair of clamp members A circuit board transporting / holding device that clamps and holds the both side surfaces from a clamping direction orthogonal to the transporting direction, wherein at least one of the clamp surfaces of the pair of clamp members is formed of an elastic material, A circuit board conveying / holding device is obtained in which each of the guide surfaces of the pair of guide members is formed of a material having a smaller friction coefficient than the elastic material.

  In the circuit board transport / holding device having the above configuration, since the guide surface is formed of a material having a small friction coefficient, the circuit board slides lightly on the guide surface and is guided well, while at least one of the clamp surfaces Is formed of an elastic material, the shape defect of the circuit board is absorbed well, and the circuit board is clamped stably. Moreover, since the elastic material itself has the property of maintaining the basic shape in the no-load state, there is a special device for maintaining the posture of the clamping member when the circuit board is not clamped. It is not necessary and the structure of the apparatus is simple and can be manufactured at low cost.

Aspects of the Invention

  In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, the prior art, and the like. The added aspect and the aspect in which the constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

  In each of the following terms, (1) corresponds to claim 1, (2) corresponds to claim 2, (3) corresponds to claim 3, (4) corresponds to claim 4, (5) corresponds to claim 5 respectively.

(1) The circuit board is supported from below by the belt conveyor, and both side surfaces of the circuit board are guided by the guide surfaces of the pair of guide members and transported in the transport direction. A circuit board transport / holding device that clamps and holds a surface from a clamping direction orthogonal to the transport direction,
At least one of the clamp surfaces of the pair of clamp members is formed of an elastic material, while each of the guide surfaces of the pair of guide members is formed of a material having a smaller friction coefficient than the elastic material. Holding device.
The elastic material should be appropriately selected according to the waist strength of the circuit board to be clamped (determined by the material, thickness, dimensions in the clamping direction, etc.) and the parallelism of both side surfaces to be clamped. Generally, those having a Young's modulus of 1 MPa or more and 10 MPa or less, 8 MPa or less, 5 MPa or less, or 3 MPa or less are suitable, for example, rubber or the like is suitable. . Examples of the material having a smaller friction coefficient than the elastic material include metals and hard resins such as polytetrafluoroethylene. The guide surface may be formed by coating a metal with polytetrafluoroethylene.
The clamp member may be configured to clamp the circuit board guided to the guide member and conveyed to a predetermined position. For example, the clamp member is provided above the guide member, and is lifted from the belt conveyor by the levitation device. The formed circuit board can be clamped by the clamp member. In addition, clamp members are provided at a plurality of locations in the longitudinal direction of the guide member and are usually retracted from the guide member in the clamping direction, but are advanced from the guide member during clamping to clamp the circuit board. Is also possible.
(2) a belt conveyor that supports the circuit board and conveys it in the conveying direction;
A pair of guide members each having a guide surface for guiding each one of both side surfaces parallel to the transport direction of the circuit board transported by the belt conveyor;
A board support member for supporting the circuit board;
A levitating device that raises and lowers the substrate support member and the belt conveyor relatively, and causes the substrate support member to support the circuit board and float from the belt conveyor;
A pair of clamp members each having a clamp surface that contacts the both side surfaces of the circuit board, the clamp surfaces being positioned above the pair of guide surfaces;
A clamp member moving device that moves at least one of the pair of clamp members in a clamp direction orthogonal to the transport direction, and clamps the circuit board floating from the belt conveyor by the clamp surface on the clamp members; and The circuit board transport / holding in which at least one of the clamp surfaces of the pair of clamp members is formed of an elastic material, while the guide surfaces of the pair of guide members are formed of a material having a smaller friction coefficient than the elastic material apparatus.
(3) The circuit board transport / hold according to (1) or (2), wherein one of the clamp surfaces of the pair of clamp members is formed of an elastic material, and the other is formed of a material harder than the elastic material. apparatus.
Examples of the material harder than the elastic material include metals and hard resins such as polytetrafluoroethylene.
The clamp surface made of an elastic material is easily elastically deformed to absorb a defective shape of the circuit board, while the clamp surface made of a material harder than the elastic member positions one side surface of the circuit board at a substantially constant position. Therefore, even a circuit board having a defective shape can be stably clamped while ensuring high positioning accuracy by using a clamp surface made of a material harder than an elastic material as a reference.
Even if the cause of the circuit board shape defect is only on one of the two side surfaces, and one of them is clamped on a clamp surface formed of a material harder than the elastic material, the circuit board is positioned by the hard clamp surface. In addition, the other side of the circuit board is clamped in a relatively wide area in the direction parallel to the conveyance direction by the clamp surface formed of an elastic material, and a relatively large frictional force is obtained, thereby stabilizing the circuit board. And is clamped.
(4) The circuit board transport / holding device according to (1) or (2), wherein the clamp surfaces of both of the pair of clamp members are formed of an elastic material.
If both clamp surfaces of the pair of clamp members are formed of an elastic material, the circuit board can be stably clamped with an increased ability to absorb poor shape of the circuit board. In particular, when the elastic material is made of rubber, both side surfaces of the circuit board are clamped by the clamp surfaces having a large friction coefficient, so that the circuit board can be clamped more stably. For example, when the circuit board transport / holding device is provided in a screen printing machine, a tensile force acts on the circuit board when the screen is separated from the circuit board after printing. Although it is easy to come off, this circuit board can be prevented from coming off particularly well if the configuration of this section is adopted.
In addition, the circuit board is clamped sufficiently stably regardless of which side of the circuit board is responsible for the shape defect of the circuit board.
(5) One of the pair of clamp members includes a first layer made of the elastic material and a second layer made of a material harder than the elastic material and supporting the first layer from the back. The front surface forms the clamp surface, and the other of the pair of clamp members includes at least a third layer thicker than the first layer and made of the elastic material, and the front surface of the third layer forms the clamp surface. The circuit board conveying / holding device according to (1) or (2).
The clamp member provided with the first layer and the second layer has a high coefficient of friction on the clamp surface and a low elastic deformability, so according to the circuit board transport / holding device of this section, The advantages of the circuit board carrying / holding device and the circuit board carrying / holding device of the item (4) can be enjoyed together.
(6) The belt conveyor is
A pair of belts supported by a pair of belt support rails, each supporting a lower surface of both side portions adjacent to the both side surfaces of the circuit board;
A circuit board conveying / holding device according to any one of (1) to (5), including an interval changing device that changes an interval between the pair of belts by moving at least one of the belt support rails toward and away from the other. apparatus.
(7) Each of the pair of guide members is integrally formed with each of the pair of belt support rails, and the guide surfaces are opposed to the both side surfaces of the circuit board in a state of being supported by the pair of belts. The circuit board carrying / holding device according to (6).
If the guide member is formed integrally with the belt support rail, the configuration of the apparatus can be simplified, and the guide member can be easily maintained at the optimum relative position with respect to the belt supported by the belt support rail. This effect is particularly great when the distance between the pair of belt support rails can be changed. The guide member and the belt support rail may be formed integrally or may be formed separately and then fixed to each other.
(8) Each of the pair of clamp members is integrally formed with each of the pair of belt support rails, and the clamp surfaces are opposed to the both side surfaces of the circuit board in a state of being lifted from the pair of belts. The circuit board transport / transfer device according to (6) or (7), wherein the clamp member moving device is configured to move the clamp member by moving at least one of the pair of belt support rails. Holding device.
If the clamp member is configured integrally with the belt support rail, the clamp member can be easily maintained at an optimum relative position with respect to the belt supported by the belt support rail.
The clamp member and the belt support rail may be formed integrally or may be formed separately and then fixed to each other.
The interval changing device can also serve as a clamp member moving device, and by doing so, the configuration of the device can be simplified.
(9) The circuit board transport / holding device according to any one of (2) to (8), wherein the clamp member moving device moves one of the pair of clamp members and does not move the other.
The configuration of the clamp member moving device can be simplified.
In an embodiment in which this item is subordinate to item (3) or (5), the fixed clamp member, which is the clamp member that is not moved by the clamp member moving device, is formed of a material harder than the elastic material, or It is desirable to have one layer and a second layer. When one of the pair of clamp members is a movable clamp member that is moved by a clamp member moving device and the other is a fixed clamp member that is not moved, the fixed clamp member is a main positioning member that defines the position of the circuit board. This is because it is desirable to function, and a higher positioning accuracy can be obtained if the clamp surface of the main positioning member is less likely to be elastically deformed.

  Several embodiments of the claimable invention will now be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 shows a screen printing machine which is a type of a substrate working machine and includes a circuit board transport / holding device as one embodiment of the claimable invention. The screen printing machine includes a frame 10 as a printing machine body, a circuit board transport / holding device 12, a substrate position adjusting device 16 (see FIG. 3), a screen support device 18, a squeegee device 20, an imaging device 22, and a substrate stop position specification. The apparatus 24 (refer FIG. 2), the control apparatus 26, etc. are included.

  As shown in FIG. 1, the screen support device 18 holds the screen 30 horizontally. Further, the squeegee device 20 is a release type in this screen printing machine, and as shown in FIG. 1, a pair of squeegee heads 32 (only one is shown in FIG. 1), the squeegee heads. Each squeegee 33 is moved up and down, and a squeegee elevating device 34 as a contact / separation device for bringing the squeegee 33 into and out of contact with the screen 30 and a pair of squeegee heads 32 are moved in a direction parallel to the screen 30 and placed on the screen 30 A squeegee moving device 36 for moving the cream solder to the squeegee 33 is included. The squeegee lifting device 34 is a relative movement device that relatively moves the screen 30 and the squeegee 33 in a direction perpendicular to the screen 30. The squeegee movement device 36 moves the screen 30 and the squeegee 33 in a direction parallel to the screen 30. It is a relative movement device that makes the relative movement.

  The imaging device 22 includes a reference mark camera. The imaging device 22 is a plane parallel to the screen 30 supported by the screen support device 18 by the imaging device moving device 38, and is in two directions orthogonal to each other in the horizontal plane. It is moved in the axial direction, and images are taken of reference marks (not shown) provided on the screen 30 and the circuit board 40 (hereinafter abbreviated as the board 40). The imaging device moving device 38 also moves the substrate stop position defining device 24 to stop the substrate 40 conveyed by the circuit board conveying / holding device 12 at a predetermined position. The imaging device 22 and the board stop position defining device 24 are configured in the same manner as the imaging device described in Japanese Patent Application Laid-Open No. 2007-38456, and detailed illustration and description thereof are omitted.

  In this embodiment, the circuit board transfer / holding device 12 includes a circuit board transfer device 50, a substrate holding device 52, and a substrate support device 54 as shown in FIGS. As shown in FIG. 2, the circuit board transfer device 50 includes a carry-in conveyor 60, a main conveyor 62, and a carry-out conveyor 64. Each of the conveyors 60, 62, and 64 is a belt conveyor, and includes a pair of endless belts 66 (see FIGS. 2 and 3). The conveyors 60, 62, and 64 are provided in a line, and each pair of belts 66 is a belt. By being circulated by the circulator 68, the substrate 40 is conveyed in a horizontal direction in a direction parallel to the solder printing surface in a posture in which the solder printing surface as a work surface which is a plate surface thereof is horizontal. Each belt rotating device 68 includes a belt rotating motor 70 as a driving source and a plurality of pulleys 72 as rotating winding members, and the circuit board transfer device 50 can transfer the substrate 40 to an arbitrary position in the transfer direction. The X-axis direction is a direction parallel to the transport direction, and the Y-axis direction is a plane parallel to the solder printing surface of the substrate 40 held by the circuit board transport / holding device 12 and is transported in the horizontal plane. The direction is perpendicular to. The circuit board transfer device 50 will be described in detail later.

  As shown in FIGS. 1 and 2, the substrate holding device 52, the substrate supporting device 54, and the main conveyor 62 are provided below the screen supporting device 18 and the squeegee device 20 of the frame 10, and are a kind of relative moving device. It is moved up and down by a lifting / lowering device 76 which is a certain approach / separation device, and is moved closer to and away from the screen 30. As shown in FIG. 3, the lifting device 76 includes a lifting platform 78 as a moving member and a lifting platform lifting drive device 80. The lifting platform lifting / lowering drive device 80 includes a lifting platform lifting / lowering motor 82 as a drive source, a ball screw 84 which is a kind of feed screw, and a nut 86, while guiding the lifting platform 78 to a guide rail 88 as a guide member. Then, it is moved to an arbitrary position in the vertical direction.

  The substrate holding device 52 and the like are provided on the lifting platform 78 via the substrate position adjusting device 16 and are moved in the X-axis direction and the Y-axis direction by the substrate position adjusting device 16 and at an axis parallel to the Z-axis. The position of the substrate 40 held by the substrate holding device 52 and the screen 30 supported by the screen support device 18 is adjusted by being rotated around a vertical axis. The substrate position adjusting device 16 is configured in the same manner as the substrate position adjusting device described in Japanese Patent Application Laid-Open No. 2007-38456, and detailed illustration and description thereof are omitted.

A part of the substrate holding device 52 is configured in the same manner as the substrate holding device described in Japanese Patent Laid-Open No. 2006-281712, and the same part will be briefly described.
As shown in FIG. 3, the substrate holding device 52 includes a side clamp device 90 and a matching device 92. The aligning device 92 includes a pair of aligning members 96 provided on the adjusting table 94 of the substrate position adjusting device 16 so as to be movable in the Y-axis direction, and aligning member moving devices 98 for moving the aligning members 96, respectively. The alignment member moving device 98 uses, for example, an air cylinder as a drive source. Further, each of the pair of alignment members 96 has a plate-like substrate edge pressing portion or alignment portion 100 that protrudes horizontally toward the side approaching each other and is long in a direction parallel to the transport direction.

  The side clamp device 90 includes a pair of clamp members 110 and 111 and is lifted and lowered by a side clamp device lifting device 112. The side clamp device lifting device 112 includes a lifting platform 114 and a lifting platform lifting drive device 116 as lifting members. The lifting platform lifting / lowering drive device 116 includes a lifting platform lifting / lowering motor 118 serving as a driving source, a ball screw 120, a nut 122, and a pair of cam members 124. A pair of cam members 124 are guided by guide rails 126 while the Y By being moved in the axial direction, the lifting table 114 is guided to the guide rod 132 as a guide by the action of the inclined surface of the cam surface 128 and the rolling element 130 as the cam follower provided on the lower surface of the lifting table 114. The aligning device 92 is raised and lowered.

  As shown in FIG. 3, the substrate support device 54 and a substrate support pin lifting device 138 as a levitation device are provided on the lifting platform 114. As shown in FIG. 4, the substrate support device 54 includes a plurality of substrate support pins 140 as substrate support members and a support base 142 as a support member. The substrate support pins 140 are non-adsorptive support members that do not have a function of adsorbing the substrate 40, and as shown in FIG. 4, the front end surface is a horizontal substrate support surface 148. The substrate support pins 140 are fixed upward to the support table 142 by the pin fixing device 150. The pin fixing device 150 is configured in the same manner as the pin fixing device described in Japanese Patent Laid-Open No. 11-195899, and has a longitudinal support plate 152 and a bolt 154 as a fixing device for fixing the support plate 152 to the support base 142. And a bolt 154 passes through a long hole 156 formed in the support plate 152 and is screwed into one of a plurality of female screw holes 158 provided in the support base 142, whereby the support plate Substrate support pins 140 provided perpendicular to 152 are fixed to the support base 142. The substrate support pins 140 can be positioned at any position within an annular region surrounding the female screw hole 158. The support table 142 has a size that can be used to support a plurality of types of substrates 40 having different sizes, and supports the substrate at a position corresponding to a supported location on the supported surface that is the back surface of the substrate 40. The pin 140 is fixed by the operator.

  As shown in FIG. 3, the substrate support pin lifting device 138 includes a lifting platform 164 and a lifting platform lifting drive 166 as moving members. The lifting platform lifting / lowering driving device 166 includes a lifting platform lifting / lowering motor 168, a ball screw 170 and a nut 172 held by the lifting platform 114, and lifts the lifting platform 164 to an arbitrary position in the vertical direction with respect to the lifting platform 114. The substrate support device 54 provided on the lifting platform 164 is moved up and down with respect to the side clamp device 90. The raising / lowering of the lifting platform 164 is guided by the guide rod 132 that is attached to the lifting platform 164 and guides the lifting / lowering platform 114.

  The pair of clamp members 110 and 111 of the side clamp device 90 are long in the direction parallel to the transport direction, and one of them is a fixed clamp member 110 that is fixed to the lifting platform 114 and the other is movable. The clamp member 111 is moved to an arbitrary position in the Y-axis direction, parallel to the solder printing surface of the substrate 40, and perpendicular to the transport direction by the interval changing device 180 shown in FIG. Accordingly, the movable clamp member 111 is moved closer to and away from the fixed clamp member 110, and the interval between the pair of belts 66 held by the clamp members 110 and 111 is changed as will be described later. The movable clamp member 111 is also moved by the clamp member moving device 182 in the clamping direction which is the same direction as the interval changing direction and is parallel to the solder printing surface of the substrate 40 and orthogonal to the transport direction. Is held and released. The interval changing device 180 includes a clamp member moving motor 188, a ball screw 190, and a nut 192 as a drive source. The clamp member moving device 182 is an air cylinder that is a kind of a fluid pressure actuator, for example. And is provided between the movable clamp member 111 and the nut 192, and the piston rod is engaged with the movable clamp member 111.

  When the movable clamp member 111 is moved by the interval changing device 180, the air cylinder of the clamp member moving device 182 is released to the atmosphere and moves integrally with the movable clamp member 111. It is moved based on dimension data in a direction parallel to the solder printing surface of the substrate 40 and perpendicular to the conveying direction. At the time of substrate clamping, the interval changing device 180 does not operate, and the movable clamp member 111 is moved to the fixed clamp member 110 side by the supply of air to the air chamber of the air cylinder that constitutes the clamp member moving device 182, and the substrate 40. And the movable clamp member 111 is moved away from the fixed clamp member 110 by releasing the air chamber to the atmosphere, and the clamp is released. The pressure of the air supplied to the air chamber is controlled by a pressure control device (not shown), and the force for pressing the movable clamp member 111 against the substrate 40 is adjusted. The air cylinder constituting the clamp member moving device 182 also serves as a shock absorber. The clamp member moving device may include a spring, and the spring may have a buffer function.

  As shown in FIG. 3, the pair of clamp members 110 and 111 are opposed to each other, and the vertical side surfaces 200 and 202 are respectively disposed on the lower portions of the side surfaces 200 and 202 from the upper ends of the clamp members 110 and 111. Each of the pair of belts 66 of the main conveyor 62 is provided. Each of the side surfaces 200 and 202 is integrally provided with a belt support rail 204 parallel to the transport direction, and a part of the belt 66 is supported so as to be movable in the longitudinal direction from below. Each of these side surfaces 200 and 202 is perpendicular to the horizontal belt support surface of the belt support rail 204, and the portion 40 immediately above the belt support rail 204 is respectively supported by the pair of belts 66. The side surfaces 206 and 208 face each other in parallel with the conveying direction, and each one of the side surfaces 206 and 208 is guided. The portions of the side surfaces 200 and 202 of the clamp members 110 and 111 that guide the side surfaces 206 and 208 of the substrate 40 constitute guide surfaces 210 and 212. The clamp members 110 and 111 are made of metal, and the guide surfaces 210 and 212 are made of metal. Each of the pair of belts 66 is supported by the belt support rail 204 with a small gap between the guide surfaces 210 and 212, as shown in FIGS. The lower surfaces of both sides adjacent to 206 and 208 are supported.

  The upper ends of the side surfaces 200 and 202 of the pair of clamp members 110 and 111, which are longer than the guide surfaces 210 and 212, are long and continuous in the transport direction, and are formed on both side surfaces 206 and 208 of the substrate 40. Are provided with clamping surfaces 218 and 220 for clamping the sheet from a clamping direction orthogonal to the conveying direction. In the fixed clamp member 110, the upper end portion of the side surface 200 forms the clamp surface 218 as it is and is made of metal, and the fixed clamp member 110 functions as a main positioning member. In the movable clamp member 111, as shown in FIG. 3 and FIG. 5A, the portion of the upper end facing the fixed clamp member 110 is formed of an elastic material, for example, rubber, and has a long elasticity in the transport direction. A rubber part 222 as a material-made part is provided, and the front surface which is the surface on the fixed clamp member 110 side constitutes the clamp surface 220. The rubber forming the rubber part 222 has, for example, a Young's modulus of 3 MPa, and has a thickness that can absorb the defective shape of the substrate 40 by elastic deformation. The clamp surface 220 is made of rubber, and the fixed clamp surface 218 made of metal is made of a material harder than rubber. The guide surfaces 210 and 212 are made of metal and are made of a material having a smaller coefficient of friction than rubber. The guide surfaces 210 and 212 and the clamp surfaces 218 and 220 are formed in the side surfaces 200 and 202 and are located in the same vertical plane, and the clamp surfaces 218 and 220 are located above the guide surfaces 210 and 212.

  Thus, in the present embodiment, each of the pair of clamp members 110 and 111 is integrally provided with each of the pair of belt support rails 204, and the guide surface 210 and the clamp surface 218 are provided on the fixed clamp member 110. The guide surface 212 and the clamp surface 220 are formed on the movable clamp member 111, and the pair of clamp members 110 and 111 are each integrally formed with the guide member, and each of the pair of guide members supports a pair of belts. Each of the rails 204 is integrally provided. Therefore, the movable belt support rail 204 provided on the movable clamp member 111 is moved by moving the movable clamp member 111 toward and away from the fixed clamp member 110 by the interval changing device 180. , The distance between the pair of belts 66 is changed. The clamp member moving device 182 moves the clamp member by moving one of the pair of belt support rails.

  The movable clamp member 111 has a gate shape, and can be moved closer to and away from the fixed clamp member 110 without interfering with the support table 142 of the substrate support device 54 and the lift table 164 of the substrate support pin lifting device 138. The side surface 202 of the movable clamp member 111 is a side surface of a portion extending in parallel with the conveyance direction of the upper part of the portal shape. Although not shown, the pair of belts 66 of the carry-in conveyor 60 and the carry-out conveyor 64 are also supported by a pair of belt support rails provided integrally with each of the pair of guide members. One is a movable guide member, and is moved by an interval changing device configured in the same manner as the interval changing device 180, whereby the interval between the belt support rails is changed according to the size of the substrate 40. Further, the control device 26 is mainly composed of a computer, and controls the circuit board transport / holding device 12 and the like. A motor as a drive source of various devices constituting the screen printing machine is configured by a lift motor for raising and lowering the lift 82 and a servo motor having an encoder, and is servo-controlled. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle.

  In the screen printing machine configured as described above, the conveyors 60, 62, and 64 are simultaneously operated in synchronism, and the board 40 on which the cream-like solder is not printed is carried from the carry-in conveyor 60 to the main conveyor 62. The printed substrate 40 is carried out from the main conveyor 62 to the carry-out conveyor 64. When the board 40 is transported, the circuit board transport / holding device 12 is at the lower end position or the transport position, and the pair of belts 66 of the conveyors 60, 62, 64 are positioned at the same height, and the board 40 is delivered. Done.

  The distance between each pair of belts 66 of the conveyors 60, 62, 64 is changed in advance according to the dimensions of the substrate 40. With respect to the main conveyor 62, the movable clamp member 111 is moved by the interval changing device 180, and as shown in FIG. 3, the pair of belts 66 respectively move the lower surfaces of the side portions adjacent to the both side surfaces 206, 208 of the substrate 40. And the guide surfaces 210 and 212 are opposed to the side surfaces 206 and 208 of the substrate 40 with a slight gap allowing sliding while maintaining the posture of the substrate 40 parallel to the transport direction. It is done. In a state where the distance between the pair of belts 66 is changed, the clamp surfaces 218 and 220 located in the same plane as the guide surfaces 210 and 212 are slightly separated from the side surfaces 206 and 208 and positioned at an unclamping position where the substrate 40 is released. To do.

  The substrate 40 is supported from below by a pair of belts 66 and is conveyed while being guided by the guide surfaces 210 and 212 by the circumference of the belt 66. The guide surfaces 210 and 212 are made of metal, have a low coefficient of friction, and the substrate 40 slides lightly. The substrate 40 is carried onto the substrate support device 54 as shown in FIG. 6A and stopped at a position defined by the substrate stop position defining device 24. In FIG. 6, the movable clamp member 111 side of the pair of clamp members 110 and 111 is shown as a representative, but the fixed clamp member 110 is not moved in a direction orthogonal to the transport direction. Thus, it is operated in the same manner as the movable clamp member 111.

  After stopping the substrate 40, the mating portion 100 is advanced onto the clamp members 110 and 111 as shown in FIG. 6 (b), and then the movable clamp as shown in FIGS. 6 (c) and 6 (d). The member 111 is moved toward the fixed clamp member 110 by the air cylinder of the clamp member moving device 182, presses the substrate 40 against the fixed clamp member 110, and is clamped and then separated. The pair of clamp members 110 and 111 temporarily clamps the substrate 40 and determines the position in the direction orthogonal to the transport direction. At this time, the pressure of the air supplied to the air cylinder is controlled in the same manner as in the main clamping described later.

  After the temporary clamping, the side clamp device 90 is raised by the side clamp device lifting / lowering device 112 in a state where the movable clamp member 111 is separated from the substrate 40, and as shown in FIGS. 6 (e) and 6 (f), The clamp members 110 and 111 are brought into contact with the mating portion 100, the substrate support device 54 is raised by the substrate support pin lifting device 138, and the plurality of substrate support pins 140 support the substrate 40 from below and are lifted from the belt 66. To make contact with the mating portion 100. Accordingly, the upper surface of the substrate 40 and the upper surfaces of the clamp members 110 and 111 are positioned in the same plane, and both edge portions parallel to the transport direction of the substrate 40 are pressed by the mating unit 100. In addition, the clamp surfaces 218 and 220 provided on the upper end portions of the clamp members 110 and 111 above the guide surfaces 210 and 212 are opposed to both side surfaces 206 and 208 of the substrate 40.

  After the substrate 40 is lifted from the belt 66 in this way, the movable clamp member 111 of the side clamp device 90 is moved from the unclamping position to the fixed clamp member 110 side, and as shown in FIG. Is clamped from the direction orthogonal to the conveying direction by the clamp surfaces 218 and 220 of the pair of clamp members 110 and 111. The movable clamp member 111 is moved to the clamp position by supplying air to the air cylinder of the clamp member moving device 182. The pressure of this air is controlled by a pressure control device, and the movable clamp member 111 is moved to the fixed clamp member 110 side until a predetermined pressure is obtained.

  The pressure is such that the substrate 40 is not displaced during the printing of the cream solder, and a holding force that does not cause the substrate 40 to be detached from the clamp members 110 and 111 when the plate 40 is separated from the screen 30 is obtained. Is set. One clamp surface 220 of the pair of clamp surfaces 218 and 220 is made of rubber and has a large friction coefficient, so that a necessary holding force can be obtained without increasing the force for pressing the movable clamp member 111 against the substrate 40. It is done. The pressure is set based on the friction coefficient of the clamp surface 220 and the necessary holding force, and even the thin substrate 40 or the weak substrate 40 does not warp or come off from the clamp members 110 and 111 when the plate is separated. , Can be held stably.

  Due to the movement of the movable clamp member 111 toward the fixed clamp member 110, the clamp surface 220 contacts the side surface 208 to press the substrate 40, and the side surface 206 of the substrate 40 is pressed against the metal clamp surface 218 of the fixed clamp member 110. The positioning is performed with high accuracy in the direction orthogonal to the conveying direction. In addition, the clamp surface 220 is formed by a rubber portion 222 having a thickness capable of absorbing the shape defect of the substrate 40 by elastic deformation. For example, as shown in FIG. Even if there are burrs 230 and 232 in 208, the substrate 40 is clamped with high stability.

  These beams 230 and 232 are exaggerated in FIG. 5 (b) for easy understanding, but actually, the substrate 40 is slid easily by the guide surfaces 210 and 212. It is a thing which does not disturb. If the flashes 230 and 232 are generated at positions shifted in the direction parallel to the conveying direction of the side surfaces 206 and 208, and the pair of clamp surfaces are both made of metal, the side surfaces of the substrate 40 at the flashes 230 and 232, respectively. The substrate 40 is brought into contact with 206 and 208, and the substrate 40 is clamped in a state where a moment around an axis perpendicular to the plate surface is applied. Therefore, the substrate 40 is once clamped by the frictional force between each of the pair of clamp surfaces and the flashes 230 and 232. If the cream solder is printed by being brought into contact with the screen 30, the substrate 40 is printed. As a result, a load or vibration is applied to the beam, slip occurs between the beams 230 and 232 and the side surfaces 206 and 208, the clamp is loosened, and the position is likely to be displaced. On the other hand, if one clamp surface 220 is formed of rubber, even if there is a flash 232, the flash 232 is received by the clamp surface 220 due to elastic deformation of the rubber, and the side surface 208 and the clamp surface 220 are in the transport direction. The substrate 40 is not easily displaced and the clamp is difficult to loosen due to the contact in a wide range in the direction parallel to the surface and the large frictional force obtained between the side surface 208 and the clamp surface 220, and the substrate 40 is stable. Highly clamped.

  Further, even when the side surfaces 206 and 208 of the substrate 40 bulge outward in an arc shape, or when the side surface 208 is inclined and the substrate 40 has a trapezoidal shape in plan view, the clamp surface 220 is a rubber. By being made, the clamping surface 220 and the side surface 208 come into contact with each other in a wide range in the direction parallel to the conveying direction due to elastic deformation, and the frictional force between the clamping surface 220 and the side surface 208 increases. The substrate 40 is clamped with high stability.

  After the substrate 40 is clamped, as shown in FIG. 6 (h), the side clamp device 90 is once lowered and the substrate 40 and the clamp members 110 and 111 are separated from the mating unit 100. 6 (i) and 6 (j), the mating portion 100 of the mating member 96 is retracted from the clamp members 110 and 111 and the substrate 40, and the side clamp device 90 is lifted, so that the mating member 96, the substrate 40, and the upper surfaces of the clamp members 111 are positioned in the same plane. Then, after the reference marks provided on the screen and the substrate 40 are imaged by the imaging device 22, the circuit board transport / holding device 12 is lifted by the lifting device 76 as shown in FIGS. 6 (k) and 6 (l). The cream solder is printed on the substrate 40 by moving the squeegee 33.

  After the printing is finished, as shown in FIG. 6 (m), the side clamp device 90 is lowered by the side clamp device lifting device 112, and the substrate 40 is separated from the screen 30, but the substrate 40 is clamped by the clamp members 110 and 111. Separated in a clamped state. Therefore, a tensile force acts on the substrate 40 from the screen 30 at the time of separation, but the substrate 40 is stably clamped by the clamp members 110 and 111 in a state where a necessary holding force is obtained. The screen is separated from the screen 30 without detaching from the screen 111. After the separation, as shown in FIG. 6 (n), the side clamp device 90 is lowered, and the entire circuit board transport / holding device 12 is lowered to the lower end position. In parallel with this lowering, the air is released from the air cylinder, the movable clamp member 111 is moved to the unclamping position, the holding of the substrate 40 is released, and after the lowering to the lower end position of the circuit board transfer / holding device 12, The substrate support device 54 is lowered, and the substrate 40 is placed on the belt 66 as shown in FIG.

Another embodiment will be described with reference to FIG.
In the circuit board transport / holding device 250 of this embodiment, the clamp surfaces 256 and 258 of the pair of clamp members 252 and 254 of the side clamp device 251 are all formed of rubber. The clamp members 252 and 254 are similar to the clamp members 110 and 111 in that one clamp member 252 is a fixed clamp member and the other clamp member 254 is a movable clamp member, and the clamp member is the same as the clamp member moving device 182. Although it is moved by the moving device, it can be elastically deformed in accordance with the shape defect of the substrate 40 at the upper ends of the vertical surfaces 260 and 262 facing each other and above the guide surfaces 210 and 212, respectively. Rubber portions 264 and 266 having a sufficient thickness are provided continuously in parallel with the conveying direction, and the front surfaces thereof are located in the side surfaces 260 and 262 to form clamp surfaces 256 and 258.

  Therefore, after the substrate 40 is conveyed by the main conveyor 32 and stopped, the substrate 40 is supported by the substrate support device 54 and lifted from the belt 66, and when the clamp members 252 and 254 clamp the substrate 40, both side surfaces 206 and 208 of the substrate 40. Are clamped by the clamping surfaces 256 and 258 having a large elastic deformability and a large friction coefficient. Therefore, for example, even when the side surfaces 206 and 208 of the substrate 40 have the flashes 230 and 232, both the flashes 230 and 232 are received by the clamp surfaces 256 and 258 by elastic deformation of rubber, and the side surfaces 206 and 208 and the clamps are clamped. Since the surfaces 258 and 260 come into contact with each other in a wide range in the direction parallel to the transport direction, and a large frictional force is obtained between the side surfaces 206 and 208 and the clamp surfaces 258 and 260, the substrate 40 is further stabilized. Clamped. In addition, the pressing force of the movable clamp member 254 to the substrate 40 (the pressure of the air supplied to the air cylinder) by the clamp member moving device 182 can be further reduced, and by clamping a thin substrate or a substrate with a weak waist Is suitable.

Still another embodiment will be described with reference to FIG.
Similarly to the clamp members 110 and 111, the pair of clamp members 302 and 304 of the side clamp device 301 of the circuit board transport / holding device 300 of the present embodiment is also a fixed clamp member and the other clamp member. Reference numeral 304 denotes a movable clamp member, which is moved by a clamp member moving device. A first layer 308 made of rubber is formed at the upper end portion of the vertical side surface 306 facing the movable clamp member 304 of the fixed clamp member 302 and above the guide surface 210. The fixed clamp member 320 is made of metal, and a portion opposite to the movable clamp member 304 with respect to the first layer 308 forms a second layer 310 that supports the first layer 308 from the back, and the first layer 308. The front surface of this forms a clamp surface 312. In addition, the upper end portion of the vertical side surface 314 facing the fixed clamp member 302 of the movable clamp member 304 and the portion above the guide surface 212 is thicker than the first layer 308 and has a poor shape of the substrate 40 due to elastic deformation. A third layer 316 made of rubber having a thickness capable of absorbing water is provided, and a front surface of the third layer 316 forms a clamp surface 318.

  After the substrate 40 is transported by the main conveyor 32 and stopped, the substrate 40 is supported by the substrate support device 54 and lifted from the belt 66, and then the movable clamp member 304 is moved to the fixed clamp member 302 side by the clamp member moving device. When the members 302 and 304 clamp the substrate 40 from the direction orthogonal to the transport direction, the substrate 40 is positioned with the side surface 206 in contact with the clamp surface 312. Although the clamp surface 312 is made of rubber, the first layer 308 forming the clamp surface 312 is thin, has a small elastic deformation capability, and is supported from behind by a metal second layer 310. Since the fixed clamp member 302 functions as a main positioning member, the substrate 40 is positioned with high accuracy. On the other hand, the third layer 316 forming the clamp surface 318 has a large elastic deformability, and if the substrate 40 has a shape defect, it is absorbed by the elastic deformation of the clamp surface 318 and the clamp surface 318 is parallel to the side surface 208 in the transport direction. The clamp surfaces 312 and 318 have a large friction coefficient, and a large frictional force can be obtained at the clamp surface 312 as well. Therefore, the substrate 40 is clamped by the clamp surfaces 312 and 318 with high positioning accuracy and with higher stability.

It is not essential to lift the circuit board from the belt conveyor at the time of clamping, and the circuit board may be clamped to the clamp member while being supported by the belt conveyor. The embodiment will be described with reference to FIGS.
The circuit board transporting / holding device is provided in a component mounting machine that is a kind of a substrate working machine for mounting electronic circuit components on the circuit board 350, and transports and holds the board 350. One of the pair of guide members of the circuit board transfer / holding device is a fixed guide member (not shown), and the other is a movable guide member 360 shown in FIGS. 9 and 10, and is fixed by an interval changing device (not shown). The distance between the belt support rails 362 provided integrally with the fixed guide member and the movable guide member 360 is changed by moving the guide member toward and away from the guide member. This interval changing device is configured in the same manner as the interval changing device 180 of the above embodiment, for example, but in this embodiment, the nut is directly attached to the movable guide member 360 without an air cylinder.

  The movable guide member 360 has a portion immediately above the belt support rail 362 at a plurality of locations at an appropriate interval in the longitudinal direction of the movable guide member 360 and parallel to the transport direction, for example, at equal intervals. The clamp members 370 are fitted so as to be movable in a direction perpendicular to the transport direction and parallel to the plate surface of the substrate 350. Each of the clamp members 370 is a movable clamp member. Each of the clamp members 370 has a circular cross-sectional shape as shown in FIG. 9, and the front portion thereof has a shape of the substrate 350 as shown in FIG. A rubber portion 372 having a thickness that can be elastically deformed according to a defect is provided, and a front surface thereof forms a clamp surface 374. As shown in FIG. 10, the rear portions of the plurality of movable clamp members 370 are protruded rearward from the movable guide member 360 and are connected by a plate-like connecting member 376. The connecting member 376 is moved in the clamping direction orthogonal to the conveying direction by the clamp member moving device 378, and the plurality of movable clamp members 370 are moved together, as shown in FIG. As shown in FIG. 10B, the unclamping position retracted into 360 is projected forward from the guide surface 380 of the movable guide member 360 and moved to the clamping position for clamping the substrate 350. The clamp member moving device 378 is composed of, for example, an air cylinder, and the movable clamp member 370 is pressed against the substrate 350 with a predetermined force by controlling the air pressure supplied to the air chamber. A portion of the vertical metal side surface of the movable guide member 360 where the movable clamp member 370 is not provided constitutes the guide surface 380. The fixed guide member is configured in the same manner as the fixed clamp member 110 of the above embodiment, and a part of the vertical metal side surface forms a guide surface, and the guide surface also functions as a clamp surface, The fixed guide member also functions as a fixed clamp member. Each of the pair of guide members may be provided with a plurality of movable clamp members and may be moved by a clamp member moving device, or each of the pair of guide members may be a movable guide member and may be moved by an interval changing device. .

  The substrate 350 is placed on the belt 382 supported by the belt support rail 362 and conveyed. The movable clamp member 370 is opposed to the side surface 384 of the substrate 350 placed on the belt 382 as shown in FIG. 9, but when the substrate 350 is transported, as shown in FIG. All of the clamp members 370 are retracted to the unclamp position, and the substrate 350 is guided to move by the metal guide surface 380 and slides lightly. After the substrate 350 is stopped, the plurality of movable clamp members 370 are advanced all at once to the clamp position while the substrate 350 remains on the belt 382, and as shown in FIG. The base plate 350 is brought into contact with the 384 and pressed against a clamp surface provided on the fixed guide member to be clamped. Even if each clamp surface 374 of the plurality of movable clamp members 370 is in contact with the side surface 384 of the substrate 350 in a distributed manner in a direction parallel to the transport direction, and there is a burr at the portion where the clamp surface 374 of the side surface 384 contacts, Absorbed by the elastic deformation of the rubber part 372, the substrate 350 is clamped with high stability.

At least one of the pair of clamp members includes an elastically deformable portion that can be elastically deformed in the clamping direction, and can be elastically deformed together with the elastically deformable portion on the circuit board side of the elastically deformable portion and continuously in the conveyance direction of the circuit board. It is good also as what was provided with the formed clamp surface formation part.
The elastic deformation portion is formed of, for example, an elastic member made of an elastic material, an elastic member having an easily elastically deformable structure such as an airbag, a compression coil spring, or a honeycomb structure. An elastic material such as rubber or the like itself has a property of maintaining a basic shape in an unloaded state, and it is easy to form a continuous clamping surface in the circuit board conveyance direction. However, the wear resistance is often insufficient, and it is desirable to provide the clamp surface forming portion on the surface of the elastic deformation portion made of an elastic material with a material superior to the elastic material in terms of wear resistance. Or when making a clamp member serve as a guide member which guides conveyance of a circuit board, it is desirable to form a clamp surface formation part with a material whose friction coefficient is smaller than an elastic material. In an aspect in which at least one of the pair of clamp members includes the elastic deformation portion and the clamp surface forming portion, the clamp surface can be easily maintained along the side surface of the circuit board, and an elastically deformable clamp member can be easily formed. obtain. Examples of wear-resistant materials include metals such as stainless steel, aluminum alloys, and spring steel, mineral materials such as ceramics and zirconia, and fiber reinforced plastics reinforced with fibers such as glass fiber and carbon. For example, a metal or a hard resin such as polytetrafluoroethylene can be used as the material having a small friction coefficient. The clamp surface forming portion is, for example, a thin plate, and is provided in a state of covering the front surface of the elastically deforming portion to form a clamp surface. Or it is good also as a clamp surface formation part by coating the material which has abrasion resistance or the material with a small friction coefficient on the front surface of an elastic deformation part.
In addition, when the elastically deforming portion is formed of an elastic member such as a compression coil spring which cannot form a continuous clamping surface in the circuit board conveying direction or is difficult to form, the circuit board is clamped in cooperation with these elastic members. It is necessary to provide a clamp surface forming member. The clamp surface forming member itself needs to have a structure that can be easily elastically deformed, and is preferably excellent in wear resistance or has a low coefficient of friction.
Both of the pair of clamp members may be provided with an elastically deforming portion and a clamp surface forming portion, and one may be formed of a material having wear resistance as a whole including the clamp surface. . Alternatively, one of the pair of clamp members may be a fixed clamp member and the other may be a movable clamp member and may be moved by the clamp member moving device, or both may be movable clamp members.
According to such a circuit board holding device, the clamping surface forming portion is elastically deformed together with the elastic deformation portion, whereby the shape defect of the circuit board is absorbed well, and compared with the circuit board holding device described in Patent Document 1. Thus, the circuit board can be clamped stably with a simple structure. In addition, when the clamping surface forming part is formed of a wear-resistant material, the clamping surface is worn even if the clamping member repeatedly contacts and separates from the circuit board in order to clamp the circuit board. A clamp member that is difficult and has a long life is obtained, and maintenance costs such as replacement costs can be reduced.
Further, the clamp surface forming portion having wear resistance allows light sliding when the circuit board is conveyed, and the clamp surface is used as a guide surface for guiding the side surface of the circuit board when the circuit board is conveyed. The clamp member can also serve as a guide member. In this case, it is not indispensable that the circuit board transported by the transport device is lifted from the conveyor belt by the levitation device and clamped to the clamp member, and is clamped to the clamp member while being placed on the conveyor belt. It may be allowed. The same applies to the clamp surface forming portion having a small friction coefficient.

  An example of a circuit board holding device in which at least one of the pair of clamp members includes an elastic deformation portion and a clamp surface forming portion will be described with reference to FIG. 1 to 6, the same reference numerals are given to the same components as those of the circuit board carrying / holding device of the embodiment shown in FIGS. 1 to 6, and detailed description thereof is omitted.

  In the circuit board holding device 400 of the present embodiment, the pair of clamp members 404 and 406 of the side clamp device 402 is the same as the clamp members 110 and 112 of the side clamp device 90. The member 406 is a movable clamp member and is moved by the clamp member moving device 182. The elastic members 412 made of rubber, which is a kind of elastic material, are located at the upper ends of the vertical side surfaces 200, 202 of the clamp members 404, 406 facing each other and above the guide surfaces 210, 212, respectively. 414 is continuously provided in parallel to the transport direction. For example, the rubber has a Young's modulus of 3 MPa. The range of Young's modulus suitable for the elastic material is the same as the range described in the section of the embodiment of the invention. The elastic portions 412 and 414 are elastically deformable in the clamping direction, have a thickness that can absorb the shape defect of the substrate 40 by elastic deformation, and constitute an elastic deformation portion. It can also be considered that the portion of the clamp member where the elastic deformation portion is provided constitutes the clamp member body. Metal, for example, stainless steel thin plates 416 and 418 are continuously attached to the front surfaces of the elastic portions 412 and 414, that is, the surfaces facing each other, in the conveying direction of the substrate 40 to form a clamp surface forming portion. Yes. The front surfaces of these thin plates 416 and 418 are located in the side surfaces 200 and 202 to form clamp surfaces 420 and 422. The thicknesses of the thin plates 416 and 418 are preferably 0.2 mm or less, 0.1 mm or less, and 0.08 mm or less, and are 0.05 mm in this embodiment. The thin plates 416 and 418 are preferably formed of spring steel or the like having high hardness and not easily plastically deformed.

  The clamping of the substrate 40 by the circuit board holding device 400 is performed in the same manner as the substrate holding device 52. When clamping the substrate 40 conveyed by the main conveyor 62, supported by the substrate support device 54 and lifted from the belt 66, and brought into contact with the mating portion 100 of the mating member 96, the clamp member 406 is a fixed clamping member. 404 side is moved, the clamp surface 422 contacts the side surface 208 and pushes the substrate 40, and the side surface 206 of the substrate 40 is pressed against the metal clamp surface 420 of the clamp member 404, and positioning is performed in a direction perpendicular to the conveyance direction. And being clamped. Since the clamp surfaces 420 and 422 are made of metal, the wear resistance is high. For example, when the substrate 40 is made of a material having high hardness such as ceramics or glass fiber, the clamp members 404 and 406 repeatedly hold and release the substrate 40. Even in this case, the clamp surfaces 420 and 422 are not easily worn and the life is improved.

The clamp surfaces 420 and 422 are made of metal, but the thin plates 416 and 418 forming the clamp surfaces 420 and 422 are thin and can be elastically deformed in the clamping direction, and almost prevent the elastic deformation of the elastic portions 412 and 414 behind. do not do. Therefore, even if the side surfaces 206 and 208 of the substrate 40 have the flashes 230 and 232, the thin plates 416 and 418 together with the elastic portions 412 and 414 and the flashes 230 from the state where the clamp surfaces 420 and 422 are in contact with the flashes 230 and 232. , 232 is elastically deformed at the contact portion and the vicinity thereof, and the clamp surfaces 420, 422 are pressed against the front and rear portions of the beams 230, 232 in the direction parallel to the conveying direction of the side surfaces 206, 208, and the clamp members 404, 406. Are in contact with the side surfaces 206 and 208 in a wide range in a direction parallel to the conveying direction. Therefore, the clamp members 404 and 406 clamp the substrate 40 in a state in which a moment around an axis perpendicular to the plate surface is not applied, the substrate 40 is difficult to be displaced, the clamp is difficult to loosen, and the stability is high. Clamped.
Even when the side surfaces 206 and 208 of the substrate 40 bulge outward in an arc shape or the substrate 40 has a trapezoidal shape in plan view, the thin plates 416 and 418 and the elastic portions 412 and 414 are elastically deformed. The clamp surfaces 420 and 422 and the side surfaces 206 and 208 are in contact with each other over a wide range in the direction parallel to the transport direction, and the substrate 40 is clamped with high stability.

  Note that either one of the clamp members 404 and 406 is not provided with an elastic portion and a clamp surface forming portion, and is similar to the clamp surface 218 of the clamp member 110 of the embodiment shown in FIGS. A part of the side surface of the member may be a clamping surface.

  When the clamp member is provided with an elastic deformation portion and a clamp surface forming portion, the elastic deformation portion is constituted by a thin metal belt 432 as shown in a clamp member 430 schematically shown in FIG. The front surface may be a clamp surface 434. The belt 432 itself also serves as a clamp surface forming part. A belt 432 is disposed in parallel with the conveyance direction on a portion above the portion where the guide surface 436 for guiding the conveyance of the circuit board of the clamp member 430 is provided, and is wound around a pair of rollers 438 and 440. Both ends in the longitudinal direction are fixed to the clamp members. The pair of rollers 438 and 440 are provided at both ends of the clamp member 430 separated from each other in the conveying direction so as to be rotatable around the vertical axis, and one roller 440 is a tension roller, and is parallel to the conveying direction. And is urged away from the roller 438 by a spring as an elastic member which is a kind of urging device (not shown) as shown by an arrow in the drawing. Accordingly, the belt 432 is maintained in a state where the outer surface thereof is parallel to the transport direction and is retracted slightly rearward from the guide surface 436 (to the side away from the opposing clamp member), thereby forming the clamp surface 434. . The other clamp member is configured similarly to the clamp member 110 of the embodiment shown in FIGS. 1 to 6, for example. The other clamp member may be configured similarly to the clamp member 430.

  At the time of clamping the circuit board, the clamp member 430 which is a movable clamp member is moved to the other clamp member (not shown) side, and the clamp surface 434 of the clamp member 430 is in a portion between the pair of rollers 438 and 440. While being brought into contact with the side surface of the circuit board, the circuit board is pressed against the clamp surface of the other clamp member and clamped. The belt 432 is made of metal but is thin and elastically deformable in the clamping direction.For example, if there is a flash on the side surface of the circuit board, the belt 432 moves the roller 440 against the urging force of the spring, It is elastically deformed along the beam and comes into contact with the side surface of the circuit board for stable clamping.

  Further, like the clamp member 460 schematically shown in FIG. 13, the elastically deformable portion is configured by the airbag 462, and a thin metal plate 464 is attached to the front surface of the airbag 462, and the front surface is used as the clamp surface 466. Also good. The thin plate 464 constitutes a clamp surface forming part. The airbag 462 is disposed in a portion above the guide surface 468 of the clamp member 460 in parallel with the conveyance direction, and maintains a basic shape extending in parallel with the conveyance direction by filling with air. 466 is located in a vertical plane slightly retracted from the guide surface 468, and is maintained in a continuous state in the transport direction of the substrate 40. At the time of clamping the circuit board, the clamp member 460 is moved to the other clamp member side, and the clamp surface 466 comes into contact with the side surface of the circuit board and clamps. For example, if there is a burr on the side surface of the circuit board, the thin plate 464 is elastically deformed together with the airbag 462, and the clamp surface 466 contacts in a wide range along the side surface of the circuit board, so that the circuit board is stably clamped.

  Further, like the clamp member 500 schematically shown in FIG. 14, the elastic deformation portion is constituted by a plurality of compression coil springs 502 which are springs as elastic members which are a kind of urging device, and a metal thin plate The circuit board may be clamped together with the plurality of springs 502 at 504. Each of the plurality of springs 502 is fixed to the clamp member 500 at an appropriate interval in a direction parallel to the conveyance direction, for example, at an equal interval, and the other end is parallel to the conveyance direction of the circuit board. It is fixed to a thin plate 504 that is long in any direction, and can be expanded and contracted in a direction parallel to the clamping direction. The lengths of the plurality of springs 502 in the extended state are fixed to each other, and the front surface of the thin plate 504 forms a clamp surface 506 and is positioned at a position slightly retracted from the guide surface 508. The thin plate 504 constitutes a clamp surface forming member, and the clamp surface forming portion is formed by the clamp surface forming member. When the circuit board is clamped, the clamp member 500 is moved to the other clamp member side, and the clamp surface 506 is brought into contact with the side surface of the circuit board and clamped. For example, if there is a burr on the side surface of the circuit board, the thin plate 504 is elastically deformed along the burr while compressing the spring 502, contacts the side surface in a wide range, and the circuit board is stably clamped.

Further, like the clamp member 530 schematically shown in FIG. 15, the elastically deforming portion is constituted by the honeycomb structure 532 and the metal thin plate 534 is fixed to the honeycomb structure 532 to constitute the clamp surface forming portion. The front surface of the thin plate 534 may be used as the clamp surface 536. The honeycomb structure 532 is formed of, for example, metal, for example, thin steel, and is disposed in parallel with the conveyance direction of the circuit board. The thin plate 534 is fixed to the front surface of the honeycomb structure 532 in parallel with the conveyance direction, is long, and the front surface forms a clamp surface 536 and is positioned at a position slightly retracted from the guide surface 538. When the circuit board is clamped, the clamp member 530 is moved to the other clamp member side, and the clamp surface 536 is brought into contact with the side surface of the circuit board to be clamped. For example, if there is a flash on the side surface of the circuit board, the honeycomb structure 532 is elastically deformed together with the thin plate 534, the clamp surface 536 is in contact with the side surface of the circuit board in a wide range, and the circuit board is stably clamped.
In each of the embodiments shown in FIGS. 13 to 15, the other clamp member may be configured in the same manner as the clamp members 460, 500, and 530, configured in the same manner as the clamp member 110, and does not include an elastic deformation portion. It is good.
Moreover, in each Example shown in FIGS. 12-15, you may provide the clamp surfaces 434,466,506,536 in the state located in the same plane as the guide surfaces 436,468,508,538.

  Note that it is not essential to control the pressing force with which the movable clamp member presses the substrate against the fixed clamp member. For example, if the elastic deformability (elastic coefficient, etc.) of an elastic material is properly selected in relation to the stiffness of the substrate, the approach position of the movable clamp member to the fixed clamp member side can be ensured to ensure that the substrate is not defective. It is only necessary to set a position where the substrate can be absorbed and does not buckle the substrate, and move the movable clamp member to that position to clamp the substrate.

  Further, the substrate support member may be a member that adsorbs and holds the circuit board by negative pressure.

  Further, in each of the embodiments shown in FIGS. 1 to 6, 7, 8, 9, and 10, the rubber portions 222, 264, 266, the first layer 308 made of rubber, the third layer 316, made of rubber The portion 372 is attached to the clamp members 110, 252, 254, 302, 304, and 370, and is detachably fixed. If the clamp surfaces 220, 256, 258, 312, 318, and 374 are worn or damaged, they are removed. It may be exchanged for a new one. For example, the rubber part 222 or the like is fixed to the clamp member 110 or the like by a fixing means capable of releasing the fixed state, such as a double-sided tape, and is removed from the clamp member together with the tape. It can be considered that the clamp member including the elastic material-made part includes a clamp member main body, and the elastic material-made part forming member is fixed to the clamp member main body.

  Further, a metal thin plate may be attached to the front surface of the rubber portion 372 of the clamp member 370 of the embodiment shown in FIGS. 9 and 10, and the front surface may be used as the clamp surface. In this case, the rubber part 372 constitutes an elastic deformation part, and the thin plate constitutes a clamp surface forming part. At this time, the clamp member 370 may position the clamp surface in the same plane as the guide surface 380 during unclamping, and guide the conveyance of the substrate 40 together with the guide surface 380, and is retracted into the guide member 360. Also good.

  Further, both of the pair of clamp members may be movable clamp members and each may be moved by a clamp member moving device.

It is a front view which shows roughly the screen printing machine provided with the circuit board conveyance and holding device which is one Example of claimable invention. It is a front view which shows roughly the circuit board conveying apparatus of the said screen printer, an imaging device, and an imaging device moving apparatus. It is a side view (part cross section) which shows the said circuit board conveyance / holding | maintenance apparatus. It is a perspective view which shows the board | substrate support apparatus of the said circuit board conveyance / holding | maintenance apparatus. FIG. 5 (a) is a plan view showing a pair of clamp members, belts and belt support rails of the circuit board transport / holding device, and FIG. 5 (b) is a plan view showing a state in which the board is clamped by these clamp members. FIG. It is a figure explaining holding | maintenance of the circuit board by the said circuit board conveyance / holding | maintenance apparatus. It is a side view (partial cross section) showing a pair of clamp members, a belt, a belt support rail, and a substrate support device of a circuit board transport / holding device according to another embodiment. It is a side view (partial cross section) showing a pair of clamp members, a belt, a belt support rail, and a substrate support device of a circuit board transport / holding device that is still another embodiment. It is a front view which shows one part of a pair of guide member of a circuit board conveyance and holding device which is another Example, and some clamp members provided in it. FIG. 10A is a plan view (partially cross-sectional view) illustrating the guide member, the clamp member, and the clamp member moving device illustrated in FIG. 9, in which FIG. It is a figure which shows the state in which a clamp member is located in a clamp position, respectively. It is a side view (partial cross section) which shows the circuit board holding | maintenance apparatus which is another Example. It is a perspective view which shows roughly one side of a pair of clamp member of the circuit board holding | maintenance apparatus which is another Example. It is a perspective view which shows roughly one side of a pair of clamp member of the circuit board holding | maintenance apparatus which is another Example. It is a perspective view which shows roughly one side of a pair of clamp member of the circuit board holding | maintenance apparatus which is another Example. It is a perspective view which shows roughly one side of a pair of clamp member of the circuit board holding | maintenance apparatus which is another Example.

Explanation of symbols

  12: Circuit board transfer / holding device 40: Circuit board 50: Circuit board transfer device 52: Substrate holding device 54: Substrate support device 62: Main conveyor 66: Belt 90: Side clamp device 110, 111: Clamp member 138: Substrate support Pin lifting device 140: Board support pin 180: Interval change device 182: Clamp member moving device 204: Belt support rail 206, 208: Side surface 210, 212: Guide surface 218, 220: Clamp surface 222: Rubber part 250: Circuit board Transport / holding device 251: Side clamp device 252 and 254: Clamp member 256, 258: Clamp surface 264, 266: Rubber part 300: Circuit board transport / hold device 301: Side clamp device 302, 304: Class 308: First layer 310: Second layer 312: Clamp surface 316: Third layer 318: Clamp surface

Claims (5)

The circuit board is supported from below by the belt conveyor, and both side surfaces of the circuit board are guided by the guide surfaces of the pair of guide members and transported in the transport direction, and then the both side surfaces are clamped by the clamp surfaces of the pair of clamp members. A circuit board transport / holding device that clamps and holds from a clamping direction perpendicular to the transport direction,
At least one of the clamp surfaces of the pair of clamp members is formed of an elastic material, and each of the guide surfaces of the pair of guide members is formed of a material having a smaller friction coefficient than the elastic material. Circuit board transfer / holding device. A belt conveyor that supports the circuit board and transports it in the transport direction;
A pair of guide members each having a guide surface for guiding each one of both side surfaces parallel to the transport direction of the circuit board transported by the belt conveyor;
A board support member for supporting the circuit board;
A levitating device that raises and lowers the substrate support member and the belt conveyor relatively, and causes the substrate support member to support the circuit board and float from the belt conveyor;
A pair of clamp members each having a clamp surface that contacts the both side surfaces of the circuit board, the clamp surfaces being positioned above the pair of guide surfaces;
A clamp member moving device that moves at least one of the pair of clamp members in a clamp direction orthogonal to the transport direction, and clamps the circuit board floating from the belt conveyor by the clamp surface on the clamp members; and The circuit board transport / holding in which at least one of the clamp surfaces of the pair of clamp members is formed of an elastic material, while the guide surfaces of the pair of guide members are formed of a material having a smaller friction coefficient than the elastic material apparatus.   The circuit board transport / holding device according to claim 1, wherein one of the clamp surfaces of the pair of clamp members is formed of an elastic material, and the other is formed of a material harder than the elastic material.   The circuit board transport / holding device according to claim 1, wherein the clamp surfaces of both of the pair of clamp members are formed of an elastic material.   One of the pair of clamp members includes a first layer made of the elastic material and a second layer made of a material harder than the elastic material and supporting the first layer from the back, and the front surface of the first layer is the A clamp surface is formed, and the other of the pair of clamp members includes at least a third layer that is thicker than the first layer and made of the elastic material, and a front surface of the third layer forms the clamp surface. Or the circuit board carrying / holding device according to 2;

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