JP2009023856A - Molding die for glass - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding die for glass, in which the adhesive strength between the adjacent layers of the layers layered on the surface of the base material part of the molding die is made more excellent than before. <P>SOLUTION: The molding die for glass has such a layered structure that an electrically conductive layer deposited by a vapor phase method, a metal-plated layer formed by electroplating and a diffusion preventing layer for preventing the diffusion of lower-layer constituent components at the least are layered in this order on the surface of the base material part of the molding die. The electrically conductive layer preferably comprises at least one metal selected from Au, Pt, Ni, Cu, Ag and Ta and/or an alloy containing one or more metals of Au, Pt, Ni, Cu, Ag and Ta, diamond-like carbon or silicon carbide. The metal-plated layer preferably is a Au-plated layer and the diffusion preventing layer may be a Rh layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a glass mold.

  2. Description of the Related Art Conventionally, as a glass mold, one in which a diffusion prevention layer and a release layer are coated in this order on the surface of a mold base part is known.

  For example, Patent Document 1 discloses that a diffusion prevention layer made of Nb, Hf, Ta or the like formed by sputtering on a base material made of WC, and an Ir—Pt alloy or Ir—Re alloy made by sputtering. A glass mold in which a release layer composed of the above and the like is coated in this order is disclosed.

Japanese Patent Laid-Open No. 2002-60239 (Examples)

  However, conventionally known glass molds have the following problems.

  That is, the sputtering method can form a film regardless of the conductivity of the mold base part such as WC. And it can form into a film with a comparatively uniform film thickness in the flat part among type | mold base-material part surfaces.

  However, the mold base portion surface is not only a flat portion. A concave portion such as a V groove or a convex portion such as a protrusion may be formed on the surface of the mold base portion in accordance with the outer shape of the glass molded product.

  In this case, it is difficult to form a film on a surface that intersects the surface of the mold base part such as the slope of the V-groove by the sputtering method, and the film thickness of this part tends to be thinner than that of the flat part. As a result, the film thickness of the sputter layer tends to vary.

  For this reason, when a sputter layer is laminated on the surface of the mold base part, the adhesive strength of the relatively thin part is lowered, and this part tends to cause delamination starting from this part during glass forming. there were.

  Therefore, the problem to be solved by the present invention is to provide a glass mold that is superior in adhesion to the layer laminated on the surface of the mold base portion as compared with the prior art.

  In order to solve the above problems, a glass mold according to the present invention comprises a conductive layer formed by a vapor phase method, a metal plating layer formed by electroplating, and at least a lower layer component on the surface of a mold base. The gist is to have a laminated structure in which a diffusion preventing layer for preventing diffusion is laminated in this order.

  Here, the gas phase method is preferably a sputtering method and / or a vacuum deposition method.

  The conductive layer is made of at least one metal selected from Au, Pt, Ni, Cu, Ag and Ta and / or an alloy containing one or more of the above metals, diamond-like carbon, or silicon carbide. Good to be configured.

  The metal plating layer is preferably an Au plating layer.

  The diffusion prevention layer may be an Rh layer.

  In addition, a release layer that facilitates release from the glass molded product is preferably laminated on the surface of the diffusion preventing layer. In this case, the release layer is preferably made of Ir or an Ir alloy.

  Moreover, it is preferable that a concave portion and / or a convex portion is formed on the surface of the mold base portion. In this case, the concave part and / or the convex part may have a surface oblique to the surface of the mold base part.

  On the other hand, the gist of the glass molding according to the present invention is that it is molded using the glass molding die.

  The glass mold according to the present invention has a laminated structure in which a conductive layer by a vapor phase method, a metal plating layer by electroplating, and a diffusion prevention layer are laminated in this order on the surface of the mold base portion.

  The vapor phase method can form a layer regardless of the conductivity variation of the mold base portion and the presence or absence of surface contaminants. Electroplating can ensure a uniform film thickness regardless of the shape of the surface on which the layer is formed, as compared with the vapor phase method.

  Therefore, in the glass mold according to the present invention, the conductivity variation on the surface of the mold substrate is reduced by the conductive layer formed by the vapor phase method, and the metal plating layer having a relatively uniform thickness is laminated thereon. become. And a diffusion prevention layer will be laminated on this metal plating layer. Therefore, it is excellent in the adhesiveness of a layer compared with the past.

  Therefore, the glass mold according to the present invention is less likely to cause delamination at the time of glass molding and has excellent durability as compared to the conventional mold.

  Here, when the gas phase method is a sputtering method and / or a vacuum vapor deposition method, there are advantages such as excellent layer homogeneity and adhesion to the mold substrate.

  Moreover, when the said conductive layer is comprised from the above-mentioned specific material, it becomes easy to ensure the adhesive force and electroconductivity of a layer.

  Moreover, when the said metal plating layer is Au plating layer, it becomes easy to improve the adhesiveness of a type | mold base material part and a diffusion prevention layer.

  Further, when the diffusion preventing layer is an Rh layer, the diffusion preventing effect of constituent components such as a metal plating layer, a conductive layer, and a mold base part is excellent. Moreover, it is easy to prevent the diffusion of the glass constituent component to the mold base portion side.

  Moreover, when the mold release layer which promotes mold release with a glass molding is laminated | stacked on the surface of the said diffusion prevention layer, mold release property improves. Therefore, combined with the above-described effects, the durability of the glass mold can be further improved.

  Moreover, when the said release layer is comprised from Ir or Ir alloy, it is excellent in the mold release property with a glass material.

  Further, in the case where the surface of the mold base portion has a concave portion and / or a convex portion, in the glass mold having the conventional configuration, delamination is particularly likely to occur from around this portion. However, according to the glass mold according to the present invention, the above-described effects can be obtained even in this case.

  On the other hand, since the glass molded product according to the present invention is molded using the above glass mold, it has advantages such as excellent mass productivity.

  Hereinafter, the glass mold according to this embodiment (hereinafter, also referred to as “main mold”) will be described in detail.

  FIG. 1 is a cross-sectional view schematically showing a part of the mold. As shown in FIG. 1, the main mold 10 has a laminated structure 20 in which a conductive layer 14, a metal plating layer 16, and a diffusion prevention layer 18 are laminated in this order on the surface of a mold base part 12. ing.

  In the present mold, the mold base portion forms a mold body. The surface of the mold base portion is a transfer surface that transfers a desired shape to the glass material.

  The surface shape of the mold base portion is not particularly limited, and can be determined in consideration of the outer shape of the glass molding to be molded. The surface of the mold base part may be formed from a flat part, or a concave part or a convex part may be formed. Moreover, you may form from these combinations.

  The concave portion or the convex portion may have an oblique surface that obliquely intersects with the mold base portion surface. In this case, preferably, from the viewpoint of delamination prevention at the time of glass molding, demoldability after molding, and the like, the angle formed by the mold base portion surface and the oblique surfaces of the concave portions and convex portions is from over 90 ° to 180 ° It should be within the range of less than °.

  2-4 is the figure which showed the specific example of the type | mold base material part surface, All are (a) sectional drawing, (b) is a top view.

  As shown in FIG. 2, the concave portion of the mold base portion is a groove 12a having a substantially V-shaped cross section (in this case, “V” includes not only isosceles triangles and equilateral triangles but also unequal sides. A triangular shape is also included), and as shown in FIG. 3, a lattice-shaped groove 12b and the like can be exemplified. In addition to the above, although not shown in the drawings, the concave portion has a groove with a substantially square cross section, a substantially spherical cross section, a hole with a cylindrical shape, a polygonal column shape, a conical shape, a polygonal pyramid shape, a substantially hemispherical shape, etc. It may be. Moreover, these combinations may be sufficient.

  On the other hand, examples of the convex part of the mold base part include a ridge 12c having a substantially inverted V-shaped cross section as shown in FIG. In addition to the above, although not shown, the convex portion is a protrusion having a substantially quadrangular cross section, a substantially spherical cross section, or a protrusion having a cylindrical shape, a polygonal column shape, a conical shape, a polygonal pyramid shape, a substantially hemispherical shape, or the like. It may be. Moreover, these combinations may be sufficient.

  Specific examples of the material of the mold base part include WC-based cemented carbide, W alloy, glassy carbon, stainless steel, ceramics made of Si and a composite thereof, and the like. Of these, WC-based cemented carbides and ceramics are preferable from the viewpoint of excellent durability and heat resistance. In addition, it is preferable that the WC type cemented carbide has less binder component.

  In the present mold, the conductive layer mainly serves as a foundation for the metal plating layer to be laminated next, by reducing the conductivity variation on the surface of the mold base portion.

  Here, the conductive layer is formed by a vapor phase method. As described above, a material having a large conductivity variation such as a WC cemented carbide is often used for the mold base portion. This is because, according to the vapor phase method, a layer can be formed regardless of such a variation in conductivity on the surface of the mold base portion and the presence or absence of surface contaminants.

  Specific examples of the vapor phase method include physical vapor deposition methods (PVD) such as sputtering, vacuum deposition, ion plating, MBE, and laser ablation, thermal CVD, and plasma CVD. Examples thereof include chemical vapor deposition (CVD) and the like.

  As the gas phase method, from the viewpoint of adhesion and the like, a sputtering method, a vacuum deposition method, and the like can be preferably selected as a suitable method.

  Note that the film formation conditions by the vapor phase method (for example, in the case of the sputtering method, conditions such as sputtering power, sputtering pressure, sputtering time, sputtering temperature, etc.) are appropriately optimized in consideration of the layer composition to be formed, film thickness, etc. You can select the correct value.

  Specific examples of the material constituting the conductive layer include metals such as Au, Pt, Ni, Cu, Ag, and Ta, and alloys containing one or more of these metals. These can be used alone or in combination of two or more. In this case, a sputtering method, a vacuum deposition method, or the like can be suitably selected as the vapor phase method.

  Other examples of the material constituting the conductive layer include diamond-like carbon (DLC) and silicon carbide. In this case, a vacuum vapor deposition method, a plasma CVD method, a sputtering method, or the like can be suitably selected as the vapor phase method.

  As the material constituting the conductive layer, Au, Au alloy, Pt, Pt alloy, Ni, Ni alloy, Ag, Ag alloy, and the like are preferable from the viewpoint of easily ensuring the adhesion of the stacked layers. In addition, the said conductive layer may be comprised from 1 layer or 2 layers or more.

  The thickness of the said conductive layer will not be specifically limited if the electroconductivity of the type | mold base-material part surface can be made uniform, The necessity for making it too thick is low. This is because the desired shape cannot be obtained, the productivity of the mold is lowered, and the cost is likely to increase.

  The thickness of the conductive layer is preferably smaller than the thickness of the metal plating layer. The upper limit of the thickness of the conductive layer is preferably 200 nm or less, more preferably 100 nm or less, and most preferably 50 nm or less from the viewpoint of film formation time, cost, and the like. On the other hand, the lower limit of the thickness of the conductive layer is preferably 10 nm or more, more preferably 15 nm or more, and most preferably 20 nm or more from the viewpoint of ensuring good adhesion and conductivity.

  In the present mold, the metal plating layer mainly plays a role of bonding (bonding) the diffusion preventing layer to be laminated next to the mold base portion. It also has a role of smoothing the mold base portion surface. The “metal” in the metal plating layer includes not only a simple metal but also an alloy.

  Here, the metal plating layer is formed by electroplating. This is because electroplating makes it easier to ensure a uniform film thickness and improve the adhesion of the layer, regardless of the shape of the surface on which the layer is formed, as compared with the vapor phase method.

  In addition, the film-forming conditions (for example, the type of plating solution, the plating current density, the plating time, the plating bath temperature, the type of additive added to the plating bath and the amount added) are the metal plating layer. The optimum value may be selected as appropriate in consideration of the composition, film thickness, and the like.

  Examples of the metal constituting the metal plating layer include metals such as Au, W, Rh, and Ni, and alloys containing one or more of these metals. These can be used alone or in combination of two or more.

  The metal constituting the metal plating layer is preferably Au, an Au alloy, or the like from the viewpoint of excellent adhesion to the diffusion preventing layer. More preferably, it may be Au. In addition, the said metal plating layer may be comprised from 1 layer or 2 layers or more.

  The upper limit of the thickness of the metal plating layer is preferably 300 nm or less, more preferably 200 nm or less, and most preferably 100 nm or less, from the viewpoint of maintaining the shape of the desired pattern formed on the mold base part, cost, and the like. Good to have. On the other hand, the lower limit of the thickness of the metal plating layer is preferably 20 nm or more, more preferably 30 nm or more, from the viewpoints of ensuring good adhesion, ensuring the strength of the layer itself, ensuring the uniformity of film thickness and film quality, and the like. Most preferably, it is 50 nm or more.

  In the present mold, the diffusion preventing layer mainly serves to suppress the components constituting the metal plating layer, the conductive layer, and the mold base portion from diffusing to the surface of the present mold. Preferably, it is further possible to suppress the components constituting the glass material from diffusing downward (on the mold base part side) from the diffusion preventing layer.

  Specific examples of the diffusion component include W, Co, Fe, Ni, Cr, Nb, and Au.

  The film formation method of the diffusion preventing layer is not particularly limited, and various wet coating methods such as the various gas phase methods, electroplating methods, and sol-gel methods described above can be applied. Of these, sputtering, vacuum deposition, electroplating, and the like are preferably used from the viewpoint of preventing metal diffusion.

  Examples of the material constituting the diffusion preventing layer include metals such as Rh, Nb, Mo, Ru, and Ta, and alloys containing one or more of these metals. These can be used alone or in combination of two or more.

  The material constituting the diffusion preventing layer is preferably Rh, Rh alloy, or the like from the viewpoint of excellent diffusion preventing effect. Rh is more preferable. In addition, the said diffusion prevention layer may be comprised from 1 layer or 2 layers or more.

  The upper limit of the thickness of the diffusion preventing layer is preferably 500 nm or less, more preferably 400 nm or less, and most preferably 300 nm or less, from the viewpoint of maintaining the shape of the desired pattern formed on the mold base portion, cost, and the like. Good to have. On the other hand, the lower limit of the thickness of the diffusion preventing layer is preferably 100 nm or more, more preferably 150 nm or more, and most preferably 200 nm or more from the viewpoint of obtaining a good and uniform diffusion preventing effect.

  In the above description, the case where the mold has the diffusion prevention layer as the outermost layer has been described. In addition to this, as shown in FIG. 5, the main mold 10 includes a conductive layer 14, a metal plating layer 16, a diffusion prevention layer 18, and a release layer 22 on the surface of the mold base 12. You may have the laminated structure 20 laminated | stacked in order.

  The release layer mainly has a role of promoting release from the glass molded product. Whether or not to further laminate the release layer can be appropriately determined as necessary in consideration of the molding conditions such as the type of glass material and molding temperature.

  That is, depending on the molding conditions and the like, there is a case where there is no hindrance to mold release even if the lamination is up to the diffusion preventing layer. In such a case, it is not necessary to layer a release layer. On the other hand, for example, when molding at a high temperature of 450 ° C. or higher, the glass molded product may be difficult to release. In such a case, a release layer may be further laminated.

  The method for forming the release layer is not particularly limited, and various wet coating methods such as the various gas phase methods, electroplating methods, and sol-gel methods described above can be applied. Of these, sputtering, vacuum deposition, electroplating, and the like are preferably used from the viewpoint of uniformity of film quality.

  Examples of the material constituting the release layer include Ir, Ir alloy, diamond-like carbon, and the like. These can be used alone or in combination of two or more.

  The material constituting the release layer is preferably Ir, Ir alloy, or the like from the viewpoint of excellent releasability with respect to a glass material. More preferably, from the viewpoints of heat resistance and durability, an Ir alloy is preferable.

  Examples of alloy elements other than Ir in the Ir alloy include Re, Pt, Pd, Rh, Ru, and the like. These may be contained alone or in combination of two or more.

  The Ir alloy is preferably an Ir—Re alloy, an Ir—Pt alloy, or the like from the viewpoints of releasability and durability. The release layer can be composed of one layer or two or more layers.

  The upper limit of the thickness of the release layer is preferably 1000 nm or less, more preferably 500 nm or less, and most preferably 300 nm or less, from the viewpoint of maintaining the shape of the desired pattern formed on the mold base part. good. On the other hand, the lower limit of the thickness of the release layer is preferably 100 nm or more, more preferably 150 nm or more, and most preferably 200 nm or more from the viewpoint of obtaining durability and uniform release properties.

  The above-mentioned forming mold basically includes a step of forming a conductive layer on the surface of the mold base portion by a vapor phase method, and a step of forming a metal plating layer by electroplating on the surface of the conductive layer. And a step of forming a diffusion prevention layer on the surface of the metal plating layer. When a release layer is optionally added, a step of forming a release layer may be added on the surface of the diffusion preventing layer.

  The glass material molded by the present mold is not particularly limited, and any kind of glass material may be used. Specifically, for example, borosilicate glass that requires high-temperature molding can be exemplified.

  Specific examples of the glass molded product formed by the present mold include, for example, optical members such as glass lenses and optical filters, glass substrates used in the field of optical communication, elements, connectors, medical and analytical applications, and the like. The thing of various uses, such as a biochip used, can be illustrated.

  Moreover, the said glass molding can be obtained if it passes through the process of shape | molding the said glass material by various shaping | molding methods, such as press molding and injection molding, using this shaping | molding die.

  Hereinafter, the present invention will be described in detail using examples.

1. Preparation of mold base part and pretreatment on its surface As a mold base part, a sintered mold was prepared by sintering tungsten carbide powder containing 12% by mass of Co. The mold base part contained 1000 ppm or less of Fe, Ni, and Cr as impurity components.

  Next, as illustrated in FIG. 2, eight V-grooves with an angle of 70 ° were formed on the surface of the mold base portion at intervals of 250 μm using a grinder. In addition, the angle | corner which the plane part of the type | mold base-material part surface and the slope of a V-groove make is about 125 degrees.

2. Formation of conductive layer and metal plating layer 2.1 Formation method 1
Sputtering pressure 2.2 × 10 ⁻¹ Pa, sputtering power 150 W, film formation temperature 23 ° C., film formation on the mold surface using a sputtering apparatus (“ACS-4000-C4” manufactured by ULVAC, Inc.) An Au sputter layer was formed under the condition of time 90 seconds.

2.2 Formation method 2
A Ta sputter layer was formed on the mold surface using the sputtering apparatus under the conditions of sputtering pressure 2.2 × 10 ⁻¹ Pa, sputtering power 200 W, film forming temperature 23 ° C., and film forming time 180 seconds. .

2.3 Formation method 3
Using a gold strike plating bath (manufactured by Nippon Electroplating Engineers Co., Ltd., “Nutronex Strike”), plating current density 3 A / dm ² , plating bath temperature 50 ° C., plating time 50 seconds (Example 1, 2, 5, 6) or 25 seconds (25 seconds for Examples 3 and 4) on the surface of the Au layer formed by the formation method 1 or the surface of the Ta layer formed by the formation method 2 An Au plating layer made of strike plating was formed.

2.4 Formation method 4
Using a gold strike plating bath (manufactured by Nippon Electroplating Engineers Co., Ltd., “Nutronex Strike”), plating current density 3 A / dm ² , plating bath temperature 50 ° C., plating time 60 seconds, the above An Au plating layer made of Au strike plating was formed on the mold substrate surface.

3. Formation of diffusion prevention layer 3.1 Formation method 5
On the surface of the Au plating layer or the Au sputter layer, using the sputtering apparatus, the sputtering pressure is 2.2 × 10 ⁻¹ Pa, the sputtering power is 150 W, the film formation temperature is 23 ° C., and the film formation time is 50 minutes. A Rh sputter layer was formed.

3.2 Formation method 6
Using a plating solution containing 80 g / L of Rh ₂ (SO ₄ ) ₃ and 180 g / L of sulfuric acid, under conditions of a plating current density of 1.3 A / dm ² , a plating bath temperature of 45 ° C., and a plating time of 2.5 minutes. The Rh plating layer was formed on the surface of the Au plating layer.

4 Formation of Release Layer 4.1 Formation Method 7
On the surface of the Rh plating layer, an Ir-Re sputter layer (with a sputtering pressure of 2.2 × 10 ⁻¹ Pa, a sputtering power of 150 W, a film formation temperature of 300 ° C., and a film formation time of 60 minutes is used. Ir: 50% by mass, Re: 50% by mass).

4.2 Formation method 8
On the surface of the Rh plating layer, an Ir-Pt sputter layer (sputter pressure: 2.2 × 10 ⁻¹ Pa, sputtering power: 150 W, film formation temperature: 300 ° C., film formation time: 60 minutes) Ir: 50% by mass, Pt: 50% by mass).

5). Measurement of thickness of each layer Using a focused ion beam (FIB) apparatus ("FIB200" manufactured by FEI), etching the flat surface of the glass mold surface, and then performing SIM (scanning ion microscope) observation, The thickness of each layer was measured. In addition, the thickness of Table 1 mentioned later is an average value of the thickness measured about five arbitrary places in the sample center part.

6). Durability Evaluation The following durability evaluation was performed on the glass molds according to Examples and Comparative Examples shown in Table 1 described later.

  That is, a glass molding die to be evaluated was attached to a high-temperature glass element vacuum molding apparatus (Toshiba Machine Co., Ltd., “GMP-207HV”), and a glass material (Ohara Co., Ltd., “Optical Glass S-BSL7”). ) Was molded at a molding temperature of 750 ° C., cooled to 200 ° C., and then a glass molded product was produced by a molding cycle of taking out the glass. And the frequency | count which can be shape | molded repeatedly was measured.

7). Evaluation of Diffusion Prevention Effect The diffusion prevention effect was evaluated for the glass molds according to Examples and Comparative Examples shown in Table 1 described later. That is, each glass mold was held for 100 hours at 800 ° C. in an Ar atmosphere and then allowed to cool to room temperature.

  Next, W, Co, Fe, Ni, Cr, Au, Ta, and Nb, components that may diffuse from the lower layer, are confirmed on the surface of the surface layer (diffusion prevention layer or release layer) by Auger spectroscopy. It was investigated whether or not. As the component detection device, “Scanning Auger Electron Spectrometer PH1700” manufactured by ULVAC-PHI Co., Ltd. was used.

  At this time, if the components other than the surface layer components (Rh, Ir, Re, Pt) were not confirmed, or if the components other than the surface layer components were 15 atom% or less, the lower layer components were diffused. Judged that it was possible to prevent. On the other hand, it was judged that the diffusion of the lower layer component could not be prevented when the component other than the surface layer component exceeded 15 atom%.

  Table 1 shows a summary of the configuration, formation method, thickness, and the like of each layer formed on the surface of the mold base portion for the glass molds according to Examples and Comparative Examples. Table 2 summarizes the evaluation results of the glass molds according to Examples and Comparative Examples.

  According to Tables 1 and 2, the following can be understood. That is, the glass mold according to Comparative Example 1 in which the surface of the mold base portion is not surface-treated with the conductive layer and the metal sputter layer is formed instead of the metal plating layer of the present application is a layer immediately after durability evaluation. Separation occurred, making molding impossible. This is presumed to be because the film thickness on the slope of the V-groove was thinner than the film thickness on the flat surface of the mold base material surface, resulting in a decrease in the adhesion of the layers.

  In addition, the glass mold according to Comparative Example 2 in which the surface of the mold base part is not surface-treated with the conductive layer and the metal plating layer is directly formed on the surface of the mold base part cannot be molded by durability evaluation at all. It was. This is presumably due to the following reason. The surface of the mold base is mixed with its constituent components W, Co, Fe, Ni, Cr, Nb, etc., and the conductivity varies. Therefore, when the metal plating layer is formed, the film quality becomes uneven, and the diffusion prevention layer laminated on the metal plating layer fluctuates. As a result, the diffusion of the lower layer metal component cannot be prevented, and the fusion with the glass material is prevented. It is presumed that arrival occurred.

  In addition, the glass mold according to Comparative Example 3 in which the diffusion preventing layer is not laminated on the surface of the metal plating layer cannot prevent the diffusion of the lower layer metal component, and can be completely molded by the fusion with the glass material. There wasn't.

  A glass mold according to Comparative Example 4 in which a conductive layer by sputtering is laminated on the surface of the mold base portion and a metal sputter layer is formed instead of the metal plating layer of the present application is the glass mold according to Comparative Example 1. The result was similar to that of the mold.

  On the other hand, in the glass mold according to the example, the conductive layer by the sputtering method which is a vapor phase method, the metal plating layer by electroplating, and the diffusion prevention layer are laminated in this order on the surface of the mold base part. It has a laminated structure.

  That is, the conductivity variation on the surface of the mold base portion is reduced by the conductive layer, and a metal plating layer having a relatively uniform thickness is laminated thereon. Therefore, according to the glass mold described above, even when a pattern such as a V-groove is formed on the surface of the mold substrate portion, the adhesion of the layer is improved even when the pattern is thinned only by the lamination of the sputter layer. It was confirmed that it was possible.

  Further, it was confirmed that by providing the diffusion preventing layer, diffusion of the lower layer component can be effectively prevented, and fusion during glass forming is hardly caused.

  In particular, when a release layer is further laminated on the surface of the diffusion preventing layer, the releasability with the glass material (glass molded product) is improved. Therefore, it was confirmed that the durability of the glass mold can be further improved by adding a release layer as appropriate depending on the components of the glass material and the like, in combination with the above-described effects.

  The glass mold according to the present embodiment and examples has been described above, but the present invention is not limited to the above embodiment and examples, and various modifications can be made without departing from the spirit of the present invention. Is possible.

It is sectional drawing which showed typically a part of glass molding die concerning this embodiment. It is the figure which showed typically an example of the type | mold base material part in which the cross-sectional substantially V-shaped groove | channel was formed as a recessed part, (a) is sectional drawing, (b) is a top view. It is the figure which showed typically an example of the type | mold base material part in which the grid | lattice-like groove | channel was formed as a recessed part, (a) is sectional drawing, (b) is a top view. It is the figure which showed typically an example of the type | mold base material part in which the cross-section substantially reverse V-shaped protrusion was formed as a convex part, (a) is sectional drawing, (b) is a top view. It is sectional drawing which showed typically a part of glass shaping | molding die concerning another example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Glass mold 12 Type | mold base material part 14 Conductive layer 16 Metal plating layer 18 Diffusion prevention layer 20 Laminated structure 22 Release layer

Claims (11)

On the mold substrate surface,
A conductive layer formed by a vapor phase method;
A metal plating layer formed by electroplating;
A glass mold having a laminated structure in which at least a diffusion preventing layer for preventing diffusion of lower layer constituent components is laminated in this order.   The glass mold according to claim 1, wherein the vapor phase method is a sputtering method and / or a vacuum deposition method.   The conductive layer is made of at least one metal selected from Au, Pt, Ni, Cu, Ag and Ta and / or an alloy containing one or more of the metals, diamond-like carbon, or silicon carbide. The glass mold according to claim 1 or 2, wherein the glass mold is provided.   The glass mold according to any one of claims 1 to 3, wherein the metal plating layer is an Au plating layer.   The glass mold according to any one of claims 1 to 4, wherein the diffusion preventing layer is an Rh layer.   The glass mold according to any one of claims 1 to 5, wherein a mold release layer that facilitates mold release from the glass mold is laminated on the surface of the diffusion preventing layer.   The glass mold according to claim 6, wherein the release layer is made of Ir or an Ir alloy.   The glass mold according to claim 7, wherein the Ir alloy is an alloy made of a combination of Ir and Re and / or Pt.   The glass mold according to any one of claims 1 to 8, wherein a concave portion and / or a convex portion are formed on the surface of the mold base portion.   The glass forming mold according to claim 9, wherein the concave portion and / or the convex portion has a surface oblique to the surface of the mold base portion.   A glass molded article formed by using the glass mold according to claim 1.

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