JP2009023299A - Full-multi-ink-jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a power consumption of a CR manufacturing method FM head, eliminate unstable inclination and wet clogging, improve the relative position precision of nozzles and heaters, and reduce cost by shortening processing steps and reducing defect rate. <P>SOLUTION: The thickness of an orifice plate of the CR manufacturing method head and the height of liquid chambers are reduced, thereby reducing a discharge resistance of ink. After forming the liquid chambers by pasting the orifice plate, nozzle holes of the orifice plate are processed by laser. An insulating layer covering the upper surfaces of the heaters also serves as a protective film against the nozzle hole processing laser light. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inkjet head of a full multi-printer.

Conventional cover resist structure FM heads are as follows: (1) Orifice plate thickness exceeds 17.5μ which is the standard thickness of TAB material (2) Main droplet size generally exceeds 5 pl (for example, 15 pl)
(3) Liquid chamber height exceeds 10 μm (for example, 30 μm)
(4) The nozzle hole shape has a smaller hole diameter on the discharge port side than that on the liquid chamber side.
(5) Since the material of the orifice plate is polyimide and cannot be bonded to the heater board or the tab, an adhesive layer made of an epoxy material is provided.
(6) A water repellent coating step is provided. The main method of coating is printing.

For example, Patent Document 1 and Patent Document 2 can be cited as conventional examples.
JP 2002-079666 A JP 07-329304 A

(1) The nozzle path length perforated in the orifice plate was large and the ink ejection resistance was large.
(2) A dither pattern is conspicuous at the time of light color printing, resulting in a decrease in image quality.
(3) The capillary force of the liquid chamber and the liquid path is small and the ink refill speed is low. Discharge / frequency cannot be increased.
(4) An orifice plate having a laser hole formed by a reduction optical system must be attached and assembled to a heater board formed with a liquid chamber. At that time, it is difficult to align the heater and the nozzle hole.
(5) The orifice plate is thickened by the adhesive layer. Further, since the adhesive layer is exposed on the ceiling of the liquid chamber wall, there are two-layer obstacles in laser processing and obstacles in contact with chemicals.
(6) Since a coater (spin coater or roll coater) that can be applied uniformly cannot be used, there is a problem of uneven coating, and the coating process including the curing process process is limited in order.

  What is necessary is just to divert ID cartridge manufacturing method etc. of a transpulmonary medication device (ID-TF).

(1) An orifice plate having a thickness of 5 μm to 10 μm can be implemented by diverting the manufacturing method.
(2) By processing a small-diameter nozzle in (1), a droplet having a main droplet diameter of 5 μm to 10 μm can be ejected without increasing the discharge resistance. The discharge energy efficiency can be increased by (3).
(3) It is obvious that the capillary force increases if the liquid chamber height can be reduced from this structure. In general, when the liquid chamber is processed by a photo-resist device, a taper of the side wall portion is generated.
(4) According to the orifice plate sticking step, a reverse taper nozzle is obtained, but the heater and nozzle hole alignment step is eliminated.
(5) If an adhesive polyimide material is used, the adhesive layer can be eliminated.
(6) The application process to the orifice plate is eliminated, and the water repellent layer can be made to have a uniform thickness.

  According to the present invention, it is possible to reduce the power consumption of the full multi-ink jet head and to eliminate the tendency and the wet discharge. In addition, the relative position accuracy of the nozzle and heater can be improved, and the cost can be reduced by shortening the machining process and reducing the defect rate.

(First embodiment)
As shown in FIG. FIG. 1 shows the appearance of a single-row nozzle full multi-ink jet head, in which the nozzle portions are sequentially enlarged. The arrow in the enlarged view indicates the inflow direction of ink.

  Reference numeral 1 denotes an orifice plate having a thickness of 10 μm or less and having a nozzle hole 1a formed by laser processing. FIG. 2 is formed by two heater boards and one. 2b is a schematic cross-sectional view of a liquid chamber portion, 2a is a liquid chamber formation / wall portion, 2c is a heater portion, and 2d is a protective film portion. 1 is a material composed mainly of transparent polyimide, 2a is an epoxy resin formed on siliconware 2 and after 1 and 2 are attached and assembled, 2c is used as a target with a reduced optical system. Laser beam processing is performed using a nozzle pattern mask. Since 2c becomes a target, the hole position is not shifted by processing. 1a has a tapered shape due to the optical system, but since 1 is thin, even if it is a small hole, it is possible to reduce the ink ejection resistance compared to the conventional case. Since the surplus laser energy for processing is shielded by 2d, 2c is not affected.

  In FIG. 1, reference numeral 3 denotes a tab, which is a wiring board. The 2e heater board terminal portion on 2 and the terminal portion 3a are connected by a bonding wire 4a and protected by a sealant 4b.

(Example 2)
As shown in FIG. This is a type in which two row nozzles are arranged so as to interpolate between adjacent nozzles between rows (staggered nozzles). This head enables higher-definition image printing. Since 3 are arranged on both side surfaces of 1, the ink flow path cannot be provided on the 2 side surfaces. Therefore, refill holes penetrating a plurality of 2 are provided in the middle of the central flow path of 2 to supply ink (FIG. Not shown).

  FIG. 4 shows a comparison diagram of the order of steps with the conventional example.

  FIG. 5 is a schematic cross-sectional side view of a conventional head portion.

  As described above, according to the present embodiment, the discharge resistance can be reduced. Drive voltage can be lowered. Low power consumption. The discharge frequency can be increased. Modulation is easy under drive conditions. Small droplets were made. High definition can be achieved, and the dithered pattern in the light color is inconspicuous. Improved refill speed. The discharge frequency can be increased. The cost of the head can be reduced, and the heater ← → alignment process can be eliminated. The water repellent coating step can be eliminated. Improvement of ink ejection direction, heater and nozzle hole position can be accurately matched.

FIG. 3 is an external view of an FM head according to the first embodiment. FIG. 3 is a schematic cross-sectional side view of a head portion according to the first embodiment. FIG. The comparison figure of the Example of a process order, and a prior art example. The head part side cross-sectional schematic diagram of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Orifice plate 1a Nozzle hole part 2 Heater board 2a Liquid chamber formation wall part 2b Liquid chamber part 2c Heater part 2d Protective film part 2e Terminal part 3 Tab 3a Terminal part 4a Bonding wire 4b Sealant

Claims (1)

In full multi inkjet head,
(1) The orifice plate thickness is in the range of 5 μm to 10 μm,
(2) The main droplet diameter not including satellites is in the range of 5 μm to 10 μm (0.65 pl to 5.2 pl),
(3) The height of the liquid chamber is within a range of about 10 μm. (4) The nozzle hole shape is such that the hole diameter on the discharge port side is larger than the hole diameter on the liquid chamber side, and a reverse taper.
(5) The orifice material is a polyimide material blended with an epoxy material having an adhesive function;
(6) A water repellent on the orifice surface is used as a release agent for the protective sheet mount of the orifice material,
A full multi inkjet head with a cover resist structure for a full multi printer characterized by the above.

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