JP2009019174A5

JP2009019174A5 -

Info

Publication number: JP2009019174A5
Application number: JP2007184759A
Authority: JP
Filing date: 2007-07-13
Publication date: 2010-08-26
Anticipated expiration: 2027-07-13

Description

（１）光硬化性樹脂組成物を光硬化することで形成された膜状の成型体であって、表面に規則的に形成された微細な凸凹構造を有し、凸凹構造は、深さが０．０１〜２０μｍの範囲であり、少なくとも１方向のピッチが０．０１〜２０μｍの範囲である、該成型体の厚み方向について０．５ＭＰａ以上の耐圧縮性能を有することを特徴とする成型体、
（２）成型体を構成する樹脂が（ａ）１分子中に３以上のアクリル基及び／またはメタクリル基を含有する１種以上のユニットを、２０〜６０重量％の範囲で含有することを特徴とする、（１）に記載の成型体。
（３）成型体を構成する樹脂がＮ−ビニル化合物であるユニットを、５〜４０重量％の範囲で含有することを特徴とする、（２）に記載の成型体。
（４）成型体を構成する樹脂がアクリル基及び／またはメタクリル基を含有するシリコン化合物を０．１〜１０重量％の範囲で含有することを特徴とする、（２）または（３）に記載の成型体。
（５）プラスチックフィルム上に形成され、ＪＩＳＫ−５６００−５−６に準拠した碁盤目剥離試験で、分類１以上の基材付着性を示すことを特徴とする、（２）〜（４）に記載の成型体、
( 1 ) A film-like molded body formed by photocuring a photocurable resin composition, having a fine uneven structure regularly formed on the surface, and the uneven structure has a depth of A molded article characterized by having a compression resistance of 0.5 MPa or more in the thickness direction of the molded article having a pitch in the range of 0.01 to 20 μm and a pitch in at least one direction of 0.01 to 20 μm. ,
( 2 ) The resin constituting the molded body contains (a) one or more units containing 3 or more acrylic groups and / or methacrylic groups in one molecule in a range of 20 to 60% by weight. The molded article according to ( 1 ).
( 3 ) The molded body according to ( 2 ), wherein the resin constituting the molded body contains a unit of N-vinyl compound in an amount of 5 to 40% by weight.
( 4 ) The resin constituting the molded body contains a silicon compound containing an acrylic group and / or a methacrylic group in a range of 0.1 to 10% by weight, as described in ( 2 ) or ( 3 ) Molded body.
( 5 ) It is formed on a plastic film, and exhibits a substrate adhesion of classification 1 or higher in a cross-cut peel test in accordance with JIS K-5600-5-6, ( 2 ) to ( 4 ) The molded article according to

（６）（２）〜（５）に記載の成型体を製造する方法であって、該成型体の表面構造の反転形状である、凹凸構造を有するモールドに、（ａ）１分子中に３以上のアクリル基及び／またはメタクリル基を含有する１種以上の単量体を、２０〜６０重量％の範囲で含有することを特徴とする光硬化性樹脂組成物であって、（ｂ）光硬化反応によって結合して固形となる成分が９８重量％以上であり、（ｃ）２５℃における粘度が１０ｍＰａ・ｓ以下である光硬化性樹脂組成物を流し込み、光硬化させ、該モールドの温度を２５〜１００℃の範囲に保つことを特徴とする、成型体の製造方法、
（７）前記光硬化性樹脂組成物が、Ｎ−ビニル化合物である単量体を、５〜４０重量％の範囲で含有することを特徴とする、（６）に記載の成型体の製造方法、
（８）前記光硬化性樹脂組成物が、アクリル基及び／またはメタクリル基を含有するシリコン化合物を０．１〜１０重量％の範囲で含有することを特徴とする、（６）または（７）に記載の成型体の製造方法。 ( 6 ) A method for producing the molded article according to ( 2 ) to ( 5 ), wherein the mold has a concavo-convex structure which is an inverted shape of the surface structure of the molded article, and (a) 3 in one molecule. One or more monomers containing the above acryl group and / or methacryl group are contained in the range of 20 to 60% by weight, and (b) light The component which becomes solid by binding by the curing reaction is 98% by weight or more, and (c) a photocurable resin composition having a viscosity at 25 ° C. of 10 mPa · s or less is poured, photocured, and the temperature of the mold is set. A method for producing a molded body, characterized by maintaining the temperature in a range of 25 to 100 ° C.,
( 7 ) The method for producing a molded article according to ( 6 ), wherein the photocurable resin composition contains a monomer that is an N-vinyl compound in an amount of 5 to 40% by weight. ,
( 8 ) The photocurable resin composition contains an acrylic group and / or a methacrylic group-containing silicon compound in the range of 0.1 to 10% by weight ( 6 ) or ( 7 ) The manufacturing method of the molded object of description.

Claims

A film-like molded body formed by photocuring a photocurable resin composition, having a fine uneven structure regularly formed on the surface, and the uneven structure has a depth of 0.01. A molded article characterized by having a compression resistance of 0.5 MPa or more in the thickness direction of the molded article, which is in the range of ~ 20 µm and the pitch in at least one direction is in the range of 0.01 to 20 µm.

The resin constituting the molded body contains (a) one or more units containing 3 or more acrylic groups and / or methacrylic groups in one molecule in a range of 20 to 60% by weight, The molded product according to claim 1 .

The molded body according to claim 2 , wherein the resin constituting the molded body contains an N-vinyl compound unit in a range of 5 to 40% by weight.

The molded body according to claim 2 or 3 , wherein the resin constituting the molded body contains a silicon compound containing an acrylic group and / or a methacrylic group in an amount of 0.1 to 10% by weight. .

Formed on a plastic film, in a cross-cut peeling test according to JIS K-5600-5-6, characterized in that it presents a classification of one or more substrate adhesion, according to claims 2 to 4 Molded body.

A method of manufacturing a molded body according to claims 2 to 5, an inverted shape of the surface structure of the component type body, the mold having an uneven structure, (a) 3 or more acrylic in one molecule 1 or more types of monomers containing a group and / or a methacryl group are contained in the range of 20 to 60% by weight, and (b) 98% by weight or more of components that are bonded and solidified by a photocuring reaction. (C) A photocurable resin composition having a viscosity at 25 ° C. of 10 mPa · s or less is poured, photocured, and the temperature of the mold is maintained in the range of 25 to 100 ° C. Production method.

The said photocurable resin composition contains the monomer which is a N-vinyl compound in 5-40 weight%, The manufacturing method of the molded object of Claim 6 characterized by the above-mentioned.

The said photocurable resin composition contains the silicon compound containing an acrylic group and / or a methacryl group in 0.1 to 10weight% of range, The Claim 6 or Claim 7 characterized by the above-mentioned. A method for producing a molded body.