JP2009018396A - Correction grinding wheel for super-abrasive grinding wheel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a correction grinding wheel for a super-abrasive grinding wheel with both improved functions of truing and dressing of the super-abrasive grinding wheel by combining a super-abrasive grinding wheel layer composed of diamond like a grinding wheel and a grinding wheel layer containing WA, GC, etc. <P>SOLUTION: The correction grinding wheel is composed by accumulating the super-abrasive grinding wheel layer (diamond grinding wheel layer 2) containing diamond abrasive grains 3 bound with porcelain binder 4 and an alumina system grinding wheel layer 5 bound with the porcelain binder or a silicon carbide system grinding wheel layer. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a correction grindstone for a superabrasive grindstone used for truing and dressing a cup-type grindstone obtained by baking and bonding diamond grits with an inorganic glassy binder.

  Conventionally, vitrified grinding stones (hereinafter simply referred to as “diamond grinding stones”) obtained by baking and bonding diamond abrasive grains with inorganic glassy binder as hard abrasive grains have good grinding performance and are widely used in the field of mechanical grinding. ing. However, the grinding surface (surface) of the diamond grindstone is clogged with chips or the like in the recesses (chip pockets) formed between the abrasive grains by grinding the workpiece (workpiece), or worn abrasive grains There is a problem that the grinding wheel surface is smoothed without the renewal of peeling, or that the grinding function drops due to spillage that falls off before the abrasive wears, reducing the grinding function and lowering the work surface accuracy of the workpiece. . Moreover, the processing surface accuracy of a workpiece | work falls also by the flatness of the grinding surface (surface) of a diamond grindstone breaking. Therefore, it is necessary to correct the grinding surface of the grindstone so that normal grinding is possible. Truing and dressing are performed to correct the grinding surface of the grindstone.

  By the way, when the grinding surface of the cup-type grindstone is corrected with the diamond grindstone, as shown in FIG. 6A, the WA grindstone is usually applied to the grinding surface 101 (surface) of the rotating cup-type grindstone 100 (working grindstone). The operation of reciprocating in the radial direction of the rotating cup-type grindstone 100 by pressing a stick-type grindstone 110 (correction grindstone) such as (alumina grindstone) or GC grindstone (silicon carbide grindstone) is repeatedly performed. In this way, by pressing the correction grindstone 110 against the grinding surface 101 of the cup-type grindstone 100 and moving it to the left and right, the grinding surface 101 can be straightly corrected (truing). Can eliminate clogging, clogging, and spilling (dressing). Alternatively, as shown in FIG. 6 (b), truing and dressing of the grinding surface 101 are performed by pressing the correction grindstone 115 made into a cup shape with a WA grindstone, a GC grindstone or the like against the cup grindstone 100 while rotating it. Done. In addition to this, Patent Document 1 discloses a method for dressing and truing a grindstone by irradiating a laser beam.

  However, in the correction operation using the above-described correction grindstone 110 (115), the correction grindstone 110 (high-hardness of the abrasive grains (diamond grits)) (the diamond grindstone) is improved in order to increase the durability of the cup-type grindstone 100 (diamond grindstone). 115), the surfaces repel each other and the surface becomes smooth, and the operation of correcting the grinding surface 101 of the cup-type grindstone 100 cannot be performed smoothly, truing takes time, and the dressing cannot be performed sufficiently. There is. Therefore, operability is improved by using a correction grindstone using WA abrasive grains or GC abrasive grains. However, in the correction work using the correction grindstone using WA abrasive grains or GC abrasive grains, the wear on the grinding surface 101 of the cup-type grindstone 100 is severely worn out in a short time. In order to form and maintain the proper grinding surface 101, a new grindstone is frequently required for correction, and it takes time to replace, and there are problems that a lot of grindstones are generated. On the other hand, when a general grindstone is used, there is a problem that it takes too much time for truing. Further, in order to adopt the method of correcting by laser light irradiation known from Patent Document 1, since laser irradiation equipment is required, a grinding machine equipped with the laser irradiation equipment is required, which increases costs. Of course, there is a problem that it is not general-purpose.

JP-A-2005-95992

  The present invention has been made in view of such circumstances, and a superabrasive grain in which both functions of true ink and dressing are enhanced by combining a superabrasive grindstone layer of diamond abrasive grains and a grindstone layer such as WA, GC. An object of the present invention is to provide a correcting grindstone for a grindstone.

In order to achieve the above object, a correction grindstone for a superabrasive grindstone according to the present invention comprises:
A super-abrasive grindstone layer formed by bonding diamond with a porcelain binder and an alumina grindstone layer or silicon carbide grindstone layer formed by bonding with a porcelain binder (First invention).

  In the present invention, the superabrasive grindstone layer is disposed in the middle, and an alumina-based grindstone layer or a silicon carbide-based grindstone layer is disposed on both sides thereof to form a three-layered stick type (second invention). The superabrasive grindstone layer may be arranged on one side and an alumina grindstone layer or silicon carbide grindstone layer may be arranged on the other side to form a two-layered stick type (third invention).

  Further, in the present invention, an alumina-based grindstone layer or a silicon carbide-based grindstone layer is disposed on the outer side, and a super-abrasive grindstone layer is disposed on the inner side to form a cup-type grindstone or a ring-type grindstone (No. 1). 4 invention). Further, an alumina-based grindstone layer or a silicon carbide-based grindstone layer may be arranged on the inner side, and a superabrasive grindstone layer may be arranged on the outer side to form a cup-type grindstone or a ring-type grindstone (fifth invention).

  According to the present invention, the correction grindstone has a laminated structure of a diamond grindstone layer and an alumina-based (WA) grindstone layer or a silicon carbide-based (GC) grindstone layer. It has a truing action that wears and drops the abrasive grains and binder of the wheel to make it a uniform flat surface. On the other hand, the alumina-based grindstone layer is easily dropped off mainly by contact with the processing grindstone, and the fallen abrasive grains are sandwiched between the processing grindstones to dig up the binder of the processing grindstone to make a chip pocket and make it sharp. In addition, this digging is also noticeable by acting on the binder of the modified grinding wheel layer. Further, when the processing grindstone is sharpened, the holding power of the diamond abrasive grains of the processing grindstone is reduced, so that the processing grindstone is easily dropped. By repeating this operation, the truing action and the dressing action are performed at the same time, and by continuing, the work is completed in a much shorter time than before.

  Next, specific embodiments of the correction grindstone for cup-type grindstone according to the present invention will be described with reference to the drawings.

  FIG. 1 shows a cross-sectional view of a modified grindstone according to an embodiment of the present invention. FIG. 2 is a perspective view showing a part of a correction grindstone formed in a stick shape, and FIG. 3 is an enlarged view showing a surface layer when the processing grindstone is corrected.

  As shown in FIG. 1, the modified grindstone 1 of the present embodiment includes a diamond grindstone layer 2 having a required thickness and an alumina grindstone layer 5 or a silicon carbide grindstone layer slightly thicker than the thickness of the diamond grindstone layer 2. It is comprised as a composite grindstone.

  The diamond grindstone layer 2 is a vitrified grindstone in which diamond 3 is bonded with a porcelain binder 4. The alumina grindstone layer 5 or the silicon carbide grindstone layer is formed of a WA grindstone or a GC grindstone formed by bonding alumina-based abrasive grains 6 or silicon carbide-based abrasive grains with a sodium silicate binder 7. ing.

  The diamond grindstone layer 2 and the alumina grindstone layer 5 or the silicon carbide grindstone layer are composed of the alumina-based abrasive grains 6 having the required thickness on both the front and rear surfaces of the diamond grindstone layer 2 previously fired to the required dimensions. A silicon carbide abrasive grain sintered with a sodium silicate binder 7 is bonded with an adhesive such as an epoxy resin to form a stick type grindstone 1A having a three-layer structure. By carrying out like this, the diamond grindstone layer 2 (vitrified grindstone) and the alumina grindstone layer 5 or the silicon carbide grindstone layer are joined and formed integrally. In addition, it can replace with adhering with an epoxy resin etc., and can also integrally mold by baking.

  When the surface 11 (grinding surface) of the processing grindstone 10 is corrected, the three-layered stick-type correction grindstone 1A configured as described above has the correction grindstone 1A on the surface 11 of the rotating processing grindstone 10 as in the prior art. The truing and dressing are performed by reciprocating in the radial direction of the processing grindstone 10 while applying an appropriate pressing force or cutting.

  If truing and dressing of the processing grindstone 10 (diamond grindstone) is performed with this stick-type correction grindstone 1A, diamond abrasive grains 12 (hereinafter simply referred to as “abrasive grains 12”) on the surface 11 (grinding surface) of the processing grindstone 10. However, they are rubbed against each other by the diamond abrasive grains 3 of the diamond grindstone layer 2 in the correction grindstone 1A, and at the same time, the binder 13 in the surface layer portion of the processing grindstone 10 is also scraped by the diamond abrasive grains 3 of the correction grindstone 1A. Further, since the adjacent alumina grindstone layer 5 (or silicon carbide grindstone layer, hereinafter referred to as “alumina grindstone layer 5”) simultaneously rubs the processed grindstone surface 11 with the diamond grindstone layer 2, this alumina grindstone layer. Further, the binder 13 of the processing grindstone 10 is cut out by the alumina-based abrasive grains 5. The chips 12 of the abrasive grains 12 and the scraps of the binder 13 (hereinafter referred to as “scraps 16”) fill the chip pockets 15 formed between the abrasive grains on the processing wheel surface 11. . However, due to the wear of the alumina grindstone layer 5 adjacent to the diamond grindstone layer 2 and having a bond strength lower than that of the diamond grindstone layer 2, the chips of the binder 7 and the separated alumina-based abrasive grains 6 become chip pockets 15. Since the scraps 16 and the like filling the chip pocket 15 are scraped off by the entry into the surface and the scraping by the updated alumina-based abrasive grains 6 of the grindstone layer 5, the abrasive grains on the surface 11 of the processing grindstone 10. It is estimated that 12 cutting edges will be generated quickly. Therefore, the surface 11 of the processing grindstone 10 can be flatly corrected by the correction grindstone 1A. In other words, truing can be done quickly. At the same time, the abrasive grains 12 are updated and a so-called sharpening action is performed. In other words, dressing is performed.

  In this way, the correction whetstone 1A is worn away as the correction whetstone 1A is brought into contact with the surface 11 of the processing whetstone 10 and the correction operation is performed. As described above, the correction whetstone 1A includes the diamond whetstone layer 2 and the whetstone 2A. Since the alumina grindstone layer 5 (silicon carbide grindstone layer) is caused to act simultaneously, the modified grindstone 1A is not rapidly worn as in the prior art, and the durability is improved.

  Further, in this embodiment, the stick-type correction grindstone 1A has a three-layer structure in which alumina grindstone layers 5 and 5 (silicon carbide grindstone layers) are integrally laminated on both the front and rear sides of the diamond grindstone layer 2. The same function is demonstrated even when used in either the front or back direction. In addition, the thing of the two-layer structure which laminated | stacked the alumina grindstone layers 5 and 5 (silicon carbide grindstone layer) on the one side of the diamond grindstone layer 2 may be used.

  Next, FIG. 4 is a perspective view showing a part of a correction grindstone formed in a cup shape in cross section.

  The modified grindstone 1B of this embodiment is a rotating grindstone formed in a cup shape in the same manner as in the above embodiment, and the outer peripheral portion of the grindstone portion 1B ′ is made the alumina grindstone layer 5 or the silicon carbide grindstone layer. The diamond grindstone layer 2 is disposed on the inner peripheral portion and is integrally formed.

  The cup-type correcting grindstone 1B configured in this manner is rotated at a required speed with respect to the surface 11 of the rotating processing grindstone 10 (fixed grindstone), and the cup end surface 14 (grinding surface) is the same as the conventional correcting grindstone. To make a correction work by reciprocating in the radial direction. In this way, like the stick-type correction grindstone 1A, the diamond grindstone layer 2 mainly wears the abrasive grains 12 of the processing grindstone 10 and the surrounding binder 13 to make the surface 11 flat, and the alumina having a low bond strength. Shavings are removed from the chip pocket 15 on the surface 11 of the processing grindstone 10 to be ground and corrected by the grindstone layer 5 (silicon carbide grindstone layer), and the abrasive grains 12 of the processing grindstone 10 are sharpened to perform truing and dressing. In other words, the processing wheel surface 11 can be quickly corrected. According to the cup-type correcting grindstone 1B, the correction grindstone can be applied and corrected while rotating with respect to the processing grindstone 10, so that a wide range can be corrected in a shorter time compared to the stick type, and the correction work can be carried out effectively. .

  FIG. 5 is a perspective view showing a part of a modified grindstone formed in a ring shape in cross section.

  In the modified grindstones 1C and 1D of this embodiment, the alumina grindstone layer 5 or the silicon carbide grindstone layer is provided on the inner peripheral portion of the grindstone portions 1C ′ and 1D ′, and the diamond grindstone layer 2 is disposed on the outer peripheral portion to be integrated. The whole is formed into a plate shape. Among these, the correction grindstone 1C in FIG. 5A is an example in which the diamond grindstone layer 2 is provided in the upper half of the outer peripheral portion, and the correction grindstone 1D in FIG. It is the example provided in the intermediate part of the part. Even with such a configuration, the same effects as those of the above-described embodiment can be obtained.

  Next, an example of a correction grindstone for a cup-type grindstone according to the present invention will be described.

The grain size of the modified grinding wheel is 1/1 to 4/1 for the modified diamond grinding wheel layer and 1/2 to 5 / for the modified alumina (WA) grinding wheel layer or silicon carbide (GC) grinding wheel layer relative to the processed grinding wheel. 1 is effective.
In addition, the degree of bonding of the modified diamond grindstone layer is free, and the degree of bonding of the modified alumina (WA) grindstone layer or silicon carbide (GC) grindstone layer is suitably EK according to JIS standards.
An effective ratio of the thickness of the modified diamond grinding wheel layer to the alumina (WA) grinding wheel layer or silicon carbide (GC) grinding wheel layer is 1/4 to 2/3.
The ratio of the size of these abrasive grains, the degree of bonding of the grinding stone, and the thickness is appropriately determined depending on whether priority is given to truing or dressing, the efficiency of truing / dressing and the priority of wear resistance of the modified grinding stone. Selected and not stay in this range.

Table 1 shows the correction whetstone of the present invention shown in FIG. 2 in comparison with a processing whetstone and a conventional correction whetstone.

The expanded sectional view of the correction grindstone concerning one embodiment of the present invention. A perspective view showing a part of a correction grindstone formed in a stick shape The figure which expands and shows the surface layer at the time of correction of a processing grindstone Perspective view showing a part of a modified grinding wheel formed in a cup shape in cross section Perspective view showing a part of a modified grinding wheel formed in a ring shape in cross section The figure which shows the aspect which corrects the surface of the conventional cup type vitrified whetstone with a correction whetstone, (a) shows the case where a stick type whetstone is used, (b) shows the case where a cup type correction whetstone is used, respectively.

Explanation of symbols

1 Correction whetstone 1A Stick type whetstone (correction whetstone)
1B Cup type correction whetstone 1C, 1D Ring type correction whetstone 2 Diamond whetstone layer 3 Diamond abrasive grain 4 Porcelain binder 5 Alumina whetstone layer (silicon carbide whetstone layer)
6 Alumina-based abrasive (silicon carbide-based abrasive)
7 Sodium silicate binder 10 Processing whetstone (fixed whetstone)
11 Surface of processing wheel 12 Diamond abrasive grains of processing wheel 13 Bonding agent of processing wheel 15 Chip pocket

Claims (5)

  A super-abrasive grindstone layer formed by bonding diamond with a porcelain binder and an alumina grindstone layer or silicon carbide grindstone layer formed by bonding with a porcelain binder A modified grinding wheel for super abrasive wheels.   2. The superabrasive grindstone according to claim 1, wherein the superabrasive grindstone layer is disposed in the middle, and an alumina grindstone layer or a silicon carbide grindstone layer is disposed on both sides thereof to form a three-layered stick type. Correction whetstone.   2. The superabrasive grindstone according to claim 1, wherein the superabrasive grindstone layer is disposed on one side and an alumina grindstone layer or silicon carbide grindstone layer is disposed on the other side to form a double-layered stick type. Correction whetstone.   The superabrasive grinding wheel according to claim 1, wherein an alumina grinding wheel layer or a silicon carbide grinding wheel layer is disposed on the outer side, and a superabrasive grinding wheel layer is disposed on the inner side to form a cup-type grinding wheel or a ring-type grinding wheel. Correction whetstone.   The superabrasive grinding wheel according to claim 1, wherein an alumina grinding wheel layer or a silicon carbide grinding wheel layer is disposed on the inner side, and a superabrasive grinding wheel layer is disposed on the outer side to form a cup-type grinding wheel or a ring-type grinding wheel. Correction whetstone.

Images