JP2009016751A - Tape carrier and method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape carrier manufacturing method actualizing both manufacturing efficiency and material using efficiency higher than those in conventional multiple tape preparation. <P>SOLUTION: The method has a first step of preparing multiple manufacturing tapes which can arrange semiconductor devices in a plurality of arrays in the cross direction, from a material tape which has a metal thin film formed on the whole surface of a material insulating tape, a second step of forming sprocket holes in the multiple manufacturing tapes, and a third step of applying metal thin film patterning to the multiple manufacturing tapes to form lead wires, applying solder resist thereto, and performing predetermined test. When the multiple manufacturing tapes are prepared from the material tape with no split or two-split in the first step, the multiple manufacturing tapes can arrange the semiconductor devices in five or more arrays in the cross direction. When the multiple manufacturing tapes are prepared from the material tape with three-split, no sprocket holes are formed tape by tape in both cross ends in a unit manufacturing tape region where the multiple manufacturing tapes are sectioned in product arrangement width units in the longitudinal direction. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a tape carrier and a method for manufacturing a semiconductor device, and more particularly to a thin film tape carrier used for manufacturing a semiconductor device in the form of a chip-on-film or a tape carrier package and a method for manufacturing the semiconductor device.

  19 and 20, a semiconductor in the form of a chip-on-film (hereinafter referred to as “COF” as appropriate; COF: Chip On Film) and a tape carrier package (hereinafter referred to as “TCP” as appropriate; TCP: Tape Carrier Package). The cross-sectional structure of the device is shown. FIGS. 21 and 22 show cross-sectional structures when the COF semiconductor device and the TCP semiconductor device are connected to the printed circuit board 20 and the liquid crystal panel 19 to be modularized, respectively.

  A COF semiconductor device and a TCP semiconductor device differ in the following points. First, in TCP, an opening 15 penetrating in advance is opened in a portion on which a semiconductor chip 10 such as LSI (Large Scale Integrated Circuit) of the insulating tape 2 is mounted, and the lead wiring 3 protrudes in a cantilever shape. Whereas the tip portion of the wiring 3 and the semiconductor chip 10 are joined, the COF does not have a mounting opening for mounting the semiconductor chip 10, and the semiconductor chip 10 is attached to the surface of the thin film insulating tape 2. It is different in that it is mounted on the lead wiring 3 formed above. In addition, since the lead wiring 3 protrudes in a cantilever shape in TCP, the thickness of the lead wiring 3 is 18 μm or more, and it is difficult to manufacture the lead wiring 3 with a wiring pitch of less than 45 μm. On the other hand, since the lead wiring 3 is formed on the surface of the thin film insulating tape 2 in COF, the thickness of the lead wiring 3 can be 8 μm or less, and the lead wiring 3 can be manufactured with a wiring pitch of 35 μm or less. It differs in that it is easy. In addition, in TCP, a slit is provided in advance in a bent portion after mounting on a liquid crystal panel or the like, whereas in COF, a slit for bending is not provided, and the thin film insulating tape 2 can be freely bent anywhere. Is different. Further, in TCP, a raw material tape obtained by laminating a thin film insulating tape 2 and a metal thin film before patterning the lead wiring 3 is formed by laminating a copper foil on an insulating tape made of polyimide using an adhesive 9. On the other hand, in COF, the raw material tape is formed by applying and curing polyimide or the like on the back surface of the copper foil (casting method) or by laminating copper on an insulating tape made of polyimide or the like by sputtering. (Metalizing method) is different.

  The COF uses a thin film insulating tape 2 that can be bent freely for its intended purpose, and each lead wiring 3 arranged on the surface of the thin film insulating tape 2 corresponds to a corresponding terminal (projection electrode) of the semiconductor chip 10. 11 and is connected to the liquid crystal panel 19, the printed board 20, and the like at the external connection connector portion. The exposed portion of the lead wiring 3 other than the above is coated with a solder resist 4 to ensure an insulating state.

  For both COF and TCP, thin film insulating tape 2 has sprocket holes 5 (see FIG. 23 to FIG. 25), which are arranged at intervals of 4.75 mm. Sprocket holes are used in the manufacturing equipment for each process. Is being transported.

  As a conventional technique related to a method for manufacturing a multi-fed tape carrier for COF and TCP, there is a technique disclosed in Patent Document 1 below. In the prior art disclosed in Patent Document 1, a common approximate value width obtained by multiplying a plurality of different standard widths by an integer is set, and the positioning pars at both ends are set so as to have a constant insulating tape width according to the approximate value width. Set the foration (sprocket hole) width, add the approximate value width and positioning perforation (sprocket hole) width to adjust the insulating tape width, and adjust the insulating tape width to the insulating tape. A perforation (sprocket hole) for carrying a carrier is formed, an insulating tape is carried by a roller, and a multi-strip tape carrier for a semiconductor device having a predetermined standard width is manufactured.

  In addition, this prior art is for adjusting the insulating tape width from the standard width, and although some improvement in efficiency is considered, the manufacturing surface and material based on the tape width of the insulating tape raw material Efficiency is not taken into consideration. Moreover, in the manufacturing process of a multi-strip tape carrier, it slits and divides | segments into each tape carrier, and the efficiency improvement including subsequent assembly process and user mounting is not considered.

Japanese Patent No. 3628273

  Currently, manufacturers of tape carriers for COF and TCP carry out tape carrier production from 1 to 4 (when the tape width is 35 mm). FIG. 23 to FIG. 25 show an example of a tape carrier manufactured with a tape for manufacturing one, two, and four strips, respectively.

  In contrast to the increase in production volume, the conventional single-threading method has a low manufacturing efficiency due to the small quantity that can be manufactured in a single manufacturing process, and requires a huge capital investment to increase capacity. In this way, the production by multi-striping is carried out, and in the 2-striping shown in FIG. 24 (tape width: 70 mm, 96 mm), the production efficiency cannot be improved so much, and the 4-striping (tape shown in FIG. 25) (Width: 156 mm to 158 mm), while the manufacturing efficiency is improved to some extent, the main tape width of the raw material for manufacturing the COF tape carrier is 524 mm, but the material usage efficiency is not so good. There is a waste of waste.

  That is, the tape width of the raw material for producing the tape carrier for COF is generally 524 mm, and in the manufacture of 112 mm, 156 mm, and 158 mm width, which is 3 to 4 (when the tape width is 35 mm), Although the production efficiency is improved, the use efficiency of the material is not so good, and waste due to the disposal of the material is also generated. During the shortage of raw materials, it also affected supply shortages from tape carrier manufacturers. For example, in the case of 35 mm width, the material discarded in the case of 1 line is about 7%, but in the case of 4 lines (in the case of 158 mm), about 20% is discarded.

  The present invention has been made in view of the above problems, that is, the problem of a decrease in the use efficiency of materials accompanying an increase in production efficiency in conventional multi-striping, and the object thereof is a chip-on-film or a tape carrier. In a method for manufacturing a thin-film tape carrier used for manufacturing a semiconductor device in the form of a package, a method for manufacturing a tape carrier capable of improving both manufacturing efficiency and material usage efficiency over conventional multi-stripping, and the tape carrier A semiconductor device manufacturing method using the manufacturing method is provided.

A tape carrier manufacturing method according to the present invention for achieving the above object is a method of manufacturing a thin film tape carrier used for manufacturing a semiconductor device in the form of a chip-on-film or a tape carrier package,
From a raw material tape in which a metal thin film is formed on the entire surface of a raw material insulating tape that is not cut in the width direction, which is a raw material of the tape carrier, the same width as the raw tape width of the raw material tape, a predetermined unused width from the raw tape width The same width as the use width from which the tape is removed, the half width of the original tape width, the half width of the use width obtained by removing a predetermined unused width from the original tape width, and the third width of the original tape width A plurality of semiconductor devices that occupy a predetermined product arrangement width in the width direction in a manufacturing width of one width or one-third of a used width obtained by removing a predetermined unused width from the original tape width. A first step of preparing an arrayable multi-row manufacturing tape, and a multi-row sprocket hole for transporting the multi-row manufacturing tape to the multi-row manufacturing tape. At the both ends in the width direction, A second step of forming the metal strip along the longitudinal direction of the tape, and patterning the metal thin film on the multi-strip manufacturing tape to connect lead wires connected to each electrode of the semiconductor chip constituting the semiconductor device. Forming, applying a solder resist, and performing a predetermined inspection,
In the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, the same width as the used width obtained by removing a predetermined unused width from the raw tape width, and a half of the raw tape width When preparing the multi-strip manufacturing tape having a width or a half width of the used width obtained by removing a predetermined unused width from the original tape width, the multi-strip manufacturing tape is predetermined during the manufacturing process. 5 or more of the semiconductor devices occupying the product arrangement width can be arranged in the width direction, and one-third width of the original tape width or a predetermined unused width is removed from the raw tape width from the raw material tape. When preparing the multi-row manufacturing tape having a width of one-third of the width of use, the width direction of the unit-row manufacturing tape region in which the multi-row manufacturing tape is divided along the longitudinal direction by the product arrangement width unit. The sprocket ho The first, characterized in that Le is not formed.

  According to the tape carrier manufacturing method of the first feature, in the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, a half width of the raw tape width, and a predetermined width from the raw tape width. When preparing a multi-row manufacturing tape having a half width of the used width from which the unused width is removed, the semiconductor device occupies a predetermined product arrangement width in the width direction during the manufacturing process. Since it is possible to arrange 5 or more, the process of the third step can be performed collectively on 5 or more tape carriers, so that the production efficiency is improved from the conventional 4-striping, Where material use efficiency is reduced, the width is approximately the same or half the width of the original tape, which is significantly wider than conventional multi-strip manufacturing tapes. To improve. Further, in the first step, a multi-strip manufacturing tape having a width of one third of the original tape width and a width of one third of the used width obtained by removing a predetermined unused width from the original tape width is prepared from the raw material tape. In this case, the tape width of the multi-strip manufacturing tape is narrowed, and the production efficiency and the material use efficiency are lower than when the raw material tape is not divided or divided into two, but the level of the conventional 4-strip or more is maintained. Yes, because there are no separate sprocket holes at both ends in the width direction of the unit strip manufacturing tape area on the multi-segment manufacturing tape, capital investment is required in the assembly process and the mounting process by the user In some cases, the effective use of the sprocket hole section for each strip increases the number of strips of tape carrier per multi-strip manufacturing tape and improves the production efficiency, or increases the effective width of the product. Therefore, even when the semiconductor chip size is slightly larger and it is necessary to use a standard width that is one level higher, there is no need to increase the standard width, resulting in a decrease in the number of tape carriers per tape for multi-strip manufacturing. And the material use efficiency is improved. Here, the product arrangement width indicates the product width during the manufacturing process of the semiconductor device on the multi-row manufacturing tape, and corresponds to the arrangement interval of the semiconductor devices adjacent in the width direction. Therefore, when it has a sprocket hole according to a section, the space is also included.

  In the description of the present invention, the tape carrier is not distinguished whether it is a single long tape shape, a multi-long long tape shape, or a state in which the tape carrier is cut in units of semiconductor devices. A wiring is formed and a semiconductor chip can be mounted or mounted in the form of a chip-on-film or a tape carrier package.

  In addition to the first feature, the tape carrier manufacturing method according to the present invention further includes, in the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, and a predetermined width from the raw tape width. The same width as the used width from which the unused width is removed, the half width of the original tape width, or the half width of the used width obtained by removing the predetermined unused width from the original tape width. In the case of preparing a strip manufacturing tape, the second sprocket hole is not formed at both end portions in the width direction of the unit strip manufacturing tape region on the multi-strip manufacturing tape. Features.

  According to the tape carrier manufacturing method of the second feature, equipment investment may be required in the assembly process or the mounting process by the user. However, since no separate sprocket holes are formed, the raw material tape When preparing multi-strip manufacturing tapes having the same width as the original tape width, half the width of the original tape, or half the used width obtained by removing a predetermined unused width from the original tape width Further, the production efficiency or the material use efficiency is improved.

  In the tape carrier manufacturing method according to the present invention, in addition to the second feature described above, both end portions in the width direction of the unit strip manufacturing tape region on the multi-strip manufacturing tape have the striped sprockets. A third feature is that it is used to form a part of the lead wiring instead of forming a hole.

  In the tape carrier manufacturing method according to the present invention, in addition to the second or third feature, the predetermined product arrangement width of the semiconductor device forms the sprocket holes according to a predetermined standard width. The fourth feature is that it is narrow as much as possible.

  In the tape carrier manufacturing method according to the present invention, in addition to any of the second to fourth features, the predetermined product arrangement width of the semiconductor device is the same as a predetermined standard width, and The fifth feature is that the effective product width is increased by the amount not forming another sprocket hole.

  According to the method for manufacturing a tape carrier of the third or fourth feature, the number of tape carriers per multi-strip manufacturing tape is increased and manufacturing efficiency can be increased by effectively using the sprocket hole portion. Will improve.

  In addition, according to the method of manufacturing the tape carrier of the third or fifth feature, or because the effective width of the product is widened, the semiconductor chip size is slightly larger and the standard width that is one higher must be used. However, it is not necessary to increase the standard width, and as a result, it is possible to suppress a decrease in the number of tape carriers per tape for multi-strip manufacturing, and to improve material use efficiency.

  The tape carrier manufacturing method according to the present invention, in addition to any of the above-described second to fifth features, further includes, in the third step, the unit strip manufacturing tape region on the multiple strip manufacturing tape. Forming the lead wiring so that the wiring pattern for each one of the lead wirings is a pattern reversed in the longitudinal direction of the multi-strip manufacturing tape between two adjacent strips in the width direction; Features.

  According to the method for manufacturing a tape carrier of the sixth feature, the number of tape carriers per multi-strip manufacturing tape is further increased, and the manufacturing efficiency is improved.

  In addition to the first feature, the tape carrier manufacturing method according to the present invention further includes, in the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, and a predetermined width from the raw tape width. The same width as the used width from which the unused width is removed, the half width of the original tape width, or the half width of the used width obtained by removing the predetermined unused width from the original tape width. A strip manufacturing tape is prepared, and in the second step, with respect to the multiple strip manufacturing tape, at both end portions in the width direction of the unit strip manufacturing tape region, along the longitudinal direction of the multiple strip manufacturing tape. The seventh feature is to form the sprocket holes according to the above.

  In addition to the seventh feature described above, the method for manufacturing a tape carrier according to the present invention is further characterized in that the predetermined product arrangement width of the semiconductor device is the same as a predetermined standard width. .

  According to the method for manufacturing the tape carrier of the seventh or eighth feature, the manufacturing efficiency is improved from the conventional four-threading, and the material use efficiency is improved to the same level as the conventional one-threading. The same tape carrier as that of the conventional single strip with a separate sprocket hole at each end of the unit tape manufacturing tape area is prepared by dividing the manufacturing tape, so that the assembly can be performed using conventional equipment. A process or a mounting process by a user is possible.

  In addition to the fourth, fifth, or eighth feature, the tape carrier manufacturing method according to the present invention further includes that the original tape width is 524 mm and the predetermined standard width is 35 mm or 48 mm. Nine features.

  According to the method for manufacturing a tape carrier of the ninth feature, it is possible to improve manufacturing efficiency and material use efficiency by using a raw material tape that is generally supplied.

  The tape carrier manufacturing method according to the present invention is a method for manufacturing a thin-film tape carrier used for manufacturing a semiconductor device in the form of a chip-on film, in addition to any of the first to ninth features. The raw material tape used in the first step is a casting method in which the metal thin film is laminated on the raw material insulating tape by a sputtering method, or an insulating resin is applied on the metal thin film and cured. The tenth feature is that the raw material insulating tape is laminated.

  According to the method for manufacturing a tape carrier of the tenth feature, a raw material tape suitable for manufacturing a semiconductor device in the form of a chip-on-film can be prepared.

  The tape carrier manufacturing method according to the present invention is a method for manufacturing a thin film tape carrier used for manufacturing a semiconductor device in the form of a tape carrier package, in addition to any of the first to ninth features. The eleventh feature is that the raw material tape used in the first step is produced by attaching the metal thin film on the raw material insulating tape with an adhesive by a laminating method.

  According to the tape carrier manufacturing method of the eleventh feature, a raw material tape suitable for manufacturing a semiconductor device in the form of a tape carrier package can be prepared.

  A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device that is resin-sealed on a thin-film tape carrier in the form of either a chip-on-film or a tape carrier package. The semiconductor chip is mounted on each of the multi-row manufacturing tapes after the first, second and third processes of the tape carrier manufacturing method, and the electrodes and the lead wires are connected to each other. The first feature is to execute the fourth step of resin sealing.

  In addition to the first feature, the semiconductor device manufacturing method according to the present invention has a second feature that, after the fourth step, the semiconductor device is individually punched from the multi-row manufacturing tape. .

  According to the semiconductor device manufacturing method of the first or second feature, in the assembly process or the mounting process by the user, the fourth process is executed in the state of the multi-row manufacturing tape. The manufacturing efficiency of the mounting process is greatly improved.

  A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device that is resin-sealed on a thin-film tape carrier in the form of either a chip-on film or a tape carrier package. The tape carrier of each semiconductor device unit is individually punched out from the multi-row manufacturing tape after each of the first, second, and third steps of the tape carrier manufacturing method according to any one of the features Sprocket holes are formed at both end portions in the prepared width direction, and the central portion is transferred to the unit strip transport tape opened in the semiconductor device unit, and the tape carrier is transferred to the unit strip transport tape. And a third step of mounting the semiconductor chip separately, connecting each electrode and the lead wiring, and sealing with resin. To.

  A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device that is resin-sealed on a thin-film tape carrier in the form of either a chip-on film or a tape carrier package. The tape for manufacturing a tape carrier according to any one of the features of 8 is divided along the longitudinal direction after the processing of each of the first, second, and third steps to divide the predetermined tape of the semiconductor device. A tape for manufacturing unit strips having the same width as the product arrangement width is manufactured, and the semiconductor chip is separately mounted on the tape for manufacturing unit strips, the electrodes and the lead wires are connected, and resin sealing is performed. The fourth feature is to execute the sixth step.

  According to the semiconductor device manufacturing method of the third or fourth feature, an assembly process or a mounting process by a user can be performed using conventional equipment without making a new capital investment.

  A semiconductor module device according to the present invention includes a semiconductor device manufactured by using the method for manufacturing a semiconductor device having any one of the first to fourth characteristics.

  Embodiments of a method for manufacturing a tape carrier and a semiconductor device according to the present invention (hereinafter abbreviated as “method of the present invention” as appropriate) will be described below with reference to the drawings. In the drawings referred to in the following description, common components are denoted by common reference numerals for easy understanding of the description.

<First Embodiment>
FIG. 1 is a process diagram showing a manufacturing process of a thin-film tape carrier used for manufacturing a semiconductor device in the form of a chip on film (COF) or a tape carrier package (TCP) according to the method of the present invention in the first embodiment. The process from the raw material tape to the production of a multi-long long tape-like tape carrier is shown. 2 and 3 are plan views showing a tape carrier 1 in the form of a multi-long long tape before being cut into one strip unit produced through the manufacturing process shown in FIG.

  As shown in FIG. 1, the method of the present invention includes a first step (# 11) for preparing a multi-row manufacturing tape capable of arranging a plurality of semiconductor devices occupying a predetermined product arrangement width in the width direction, and a first step. The second step (# 12) for forming the multi-row sprocket holes for the prepared multi-row manufacturing tape, and the lead wiring for the multi-row manufacturing tape, and the solder resist It has a third step (# 13) of applying, plating, predetermined electrical inspection and appearance inspection.

  In the first step, the raw tape width W0 of the raw material tape (in this embodiment, 524 mm is assumed) from the raw material tape in which the metal thin film is formed on the entire surface of the uncut raw material insulating tape in the width direction, which is the raw material of the tape carrier 1 The same width as the used width Wy1 (486 mm, 496 mm) and the original tape width obtained by removing the predetermined unused width Wx1 (in this embodiment, two types of 28 mm and 38 mm are assumed) from the original tape width. Half width of W0 (262 mm), half width of used width Wy2 obtained by removing predetermined unused width Wx2 (in this embodiment, two types of 22 mm and 32 mm are assumed) from original tape width W0 A multi-strip manufacturing tape having a manufacturing width W1 of (246 mm, 251 mm) is prepared. Therefore, in this embodiment, the relationship between the original tape width W0 and the manufacturing width W1 is four as shown in Equation 1 below.

[Equation 1]
W1 = W0
W1 = Wy1 = W0-Wx1
W1 = W0 / 2
W1 = Wy2 / 2 = (W0−Wx2) / 2

  In the first step of the present embodiment, one (no division) or two (two divisions) multi-strip manufacturing tape is prepared from the raw material tape. FIG. 2 shows a tape carrier made of a multi-row production tape having a production width (486 mm, 496 mm, 524 mm) prepared without dividing the raw material tape according to the relationship of the first formula or the second formula of Equation 1. FIG. 3 shows a tape carrier made of a multi-row production tape having a production width (246 mm, 251 mm, 262 mm) prepared by dividing the raw material tape into two parts according to the relationship of the third formula or the fourth formula of Equation 1. Show. 2 and 3 exemplify a case where the product arrangement width W2 of the unit strip manufacturing tape region is 35 mm.

  On the multi-row manufacturing tape prepared in the first step, five or more rows of unit stripe manufacturing tape regions having a product arrangement width W2 are formed in the width direction. When the production width of the multi-row production tape is 486 mm, 496 mm, or 524 mm (no division), the unit arrangement production tape area with the product arrangement width W2 of 35 mm is 14 rows, and the product arrangement width W2 is 48 mm. Ten rows of strip manufacturing tape regions are formed respectively. Further, when the production width of the multi-row production tape is 246 mm, 251 mm, or 262 mm (when divided into two), the product arrangement width W2 is 35 rows and the unit arrangement production tape area is 7 rows and the product arrangement width W2 is Five rows of 48 mm unit strip manufacturing tape regions are formed. The unit strip manufacturing tape region is a region where semiconductor devices are formed in a line along the longitudinal direction. The number of unit strip manufacturing tape regions is the same as the number of unit strip manufacturing tape regions. It is a possible number. Note that the product arrangement width W2 used in the present embodiment is 35 mm and 48 mm, which are the same as the standard width of a conventional single-feed tape carrier.

  On the multi-strip manufacturing tape, the unused width other than the unit-strip manufacturing tape area (the blank space for adjusting the production width W1 of the multi-strip manufacturing tape (not shown in FIGS. 2 and 3) and the multi-strip sprocket. When the hole 6) is Wz and the number of unit strip manufacturing tape regions is N, the relationship between the number N of unit strip manufacturing tape regions, the manufacturing width W1, the product arrangement width W2, and the unused width Wz is as follows. As shown in 2.

[Equation 2]
N = (W1-Wz) / W2

  The raw material tape is a laminated film in which a metal thin film is formed on the entire surface of the raw material insulating tape, but the manufacturing method is different between COF and TCP. The raw material tape used for the COF is based on a polyimide insulating tape having a thin film thickness of 15 to 40 μm which can be bent freely, and the surface of the insulating tape is made of copper having a thickness of 8 to 18 μm. A thin film is formed by laminating by sputtering (metalizing method), or polyimide or the like is applied to a back surface of a copper foil having a thickness of 8 to 18 μm and cured to a thickness of 15 to 40 μm (casting method). The raw material tape used for TCP is formed by laminating a copper foil on an insulating tape made of polyimide using an adhesive. In TCP, since an opening that penetrates in advance to the portion where the semiconductor chip of the insulating tape is mounted is opened, and the lead wiring protrudes in a cantilever shape toward the opening, the thickness of the copper foil to be laminated is 18 μm or more is used, and a slit is provided in advance in a bent portion after mounting on a liquid crystal panel or the like.

  In the first step, when preparing the multi-row manufacturing tape, if the manufacturing width W1 is reduced by removing the unused width Wx1 or Wx2, it can be formed on the manufactured tape carrier after the third step. The surplus part to be discarded (corresponding to the unused width Wz) can be reduced. In other words, in the first step, if the manufacturing width W1 is not removed from the unused width Wx1 or Wx2, there will be more surplus parts to be discarded on the manufactured tape carrier, but it should be discarded as viewed from the raw material tape. The unused ratio occupied by the surplus portion is exactly the same as when the unused width Wx1 or Wx2 is removed in the first step. The only difference is the timing and number of times to remove the surplus part.

  In the second step, the multi-row sprocket holes 6 for conveyance are opened at intervals of 4.75 mm along the longitudinal direction at both end portions in the width direction of the multi-row manufacturing tape. In the individual processing equipment of the next third step, the multi-strip manufacturing tape is transported using the multi-strip sprocket holes 6. In the present embodiment, in the second step, the multi-sprocket sprocket holes 6 and the separate sprocket holes 5 are arranged at intervals of 4.75 mm along the longitudinal direction at both end portions in the width direction of the unit strip manufacturing tape region. Opened.

  In the third step, with respect to the multi-row manufacturing tape, the metal thin film of the multi-row manufacturing tape is patterned using a known photolithography technique and etching technique, and each electrode of the semiconductor chip constituting the semiconductor device and A lead wire to be connected is formed. Further, the lead wiring is plated, and a solder resist is applied to portions other than the contact portion with the electrode of the lead wiring and the terminal portion for external connection to ensure an insulating state. Further, predetermined electrical inspection and appearance inspection are performed. Since each process of the third step is the same as the conventional tape carrier manufacturing step, a detailed description is omitted. As described above, the multi-long long tape-like tape carrier 1 is manufactured.

  The multi-strip tape carrier 1 produced by each step (# 11 to # 13) of the method of the present invention is divided for each unit strip manufacturing tape region, and is equivalent to a conventional single strip tape carrier (corresponding to a unit strip manufacturing tape). ) Is produced (# 14). In this embodiment, the sprocket hole 5 according to the strip is formed in the unit strip manufacturing tape region in the second step, and the tape width of the single strip tape carrier is the same as the standard widths of 35 mm and 48 mm. Therefore, in the subsequent assembly process or the mounting process by the user (# 15, corresponding to the sixth process), the existing equipment can be used effectively when the semiconductor chip is mounted on the divided single-strip tape carrier. In the assembly process or the mounting process (# 15) by the user, the single-stripping tape carrier is transported through the manufacturing equipment for each processing using the separate sprocket holes 5.

  In the assembly process or the user mounting process (# 15), a semiconductor chip is mounted on a single tape carrier, protruding electrodes called bumps formed on the semiconductor chip, and the inside of the lead wiring to be resin-sealed The corresponding ones at the ends are joined and electrically connected. After bonding and mounting the semiconductor chip, in the case of COF, the resin 12 is injected into the gap between the semiconductor chip and the tape carrier. In the case of TCP, the surface of the semiconductor chip exposed in the opening 15 of the tape carrier. Resin 12 is applied to the semiconductor chip, and the bonding portion between the semiconductor chip and the lead wiring and the surface of the semiconductor chip are sealed with resin. The individual semiconductor devices are the same as those shown in FIGS. 19 and 20, and as shown in FIGS. 21 and 22, the terminal portions for external connection of lead wires are connected to the liquid crystal panel 19 and the printed circuit board 20. It is modularized and becomes a semiconductor module device.

  In FIG. 4, the raw tape width (W0) of the raw material tape, the manufacturing width (W1) and the number (M) of the multi-strip manufacturing tape, the used width (Wy1, Wy2) and the unused width of the raw material tape in this embodiment (Wx1, Wx2), the number of unit strip production tape areas (N), product placement width (W2) and effective product width (W3), multi-use production tape use width (W1-Wz) and unused A list of mutual relationships among the width (Wz), the number of tape regions for manufacturing the unit strip with respect to the raw material tape (L = M × N), and the material usage rate (U) of the raw material tape is shown in a list. Note that the effective product width (W3) of the unit strip manufacturing tape region is equal to the final product width of the semiconductor device including a portion that can be used for forming the lead wiring and applying the solder resist in the third step. Therefore, the portion of the product arrangement width (W2) minus the effective product width (W3) includes the striped sprocket hole 5 and the cutting allowance (1 mm on one side) for separating the striped sprocket hole 5 from the semiconductor device. It is.

  In addition, FIG. 5 shows a list of similar interrelationships in a conventional tape carrier with one to four strips as a comparative example. From the comparison between FIG. 4 and FIG. 5, the tape carrier 1 produced by the method of the present invention of the present embodiment can achieve the material usage rate equivalent to that of the conventional single carrier tape carrier, and each of the steps in the third step. It can be seen that the process can be carried out with higher efficiency than the conventional 1 to 4 tape carrier.

Second Embodiment
FIG. 6 is a process chart showing a manufacturing process of a thin film tape carrier used for manufacturing a semiconductor device in the form of COF or TCP according to the method of the present invention in the second embodiment, and a manufacturing process of the semiconductor device. Steps (# 21 to # 23) until a multi-long long tape-like tape carrier is manufactured, and steps (# 24 to # 23) until a semiconductor chip is mounted on the tape carrier and a semiconductor device is manufactured. 25). 7 to 9 are plan views showing the tape carrier 1 in the form of a multi-long long tape before cutting into individual semiconductor device units manufactured through the tape carrier manufacturing steps (# 21 to # 23) shown in FIG. FIG.

  As shown in FIG. 6, the manufacturing process of the tape carrier of the method of the present invention is a first process (# 21) of preparing a multi-strip manufacturing tape capable of arranging a plurality of semiconductor devices occupying a predetermined product arrangement width in the width direction. And the second step (# 22) for forming the multi-row sprocket holes for the multi-row manufacturing tape prepared in the first step, and the lead wiring for the multi-row manufacturing tape. Forming, applying a solder resist, and performing a plating process, a predetermined electrical inspection and an appearance inspection, and the like (# 23).

  In the first step, the raw tape width W0 of the raw material tape (in this embodiment, 524 mm is assumed) from the raw material tape in which the metal thin film is formed on the entire surface of the uncut raw material insulating tape in the width direction, which is the raw material of the tape carrier 1 The same width as the used width Wy1 (490 mm, 502 mm) and the original tape width obtained by removing the predetermined unused width Wx1 (in this embodiment, two types of 22 mm and 34 mm are assumed) from the original tape width Half width of W0 (262 mm), half width of used width Wy2 obtained by removing predetermined unused width Wx2 (in this embodiment, two types of 16 mm and 72 mm are assumed) from original tape width W0 (226 mm, 254 mm), a used width obtained by removing a predetermined unused width Wx3 (in this embodiment, 3 types of 2 mm, 41 mm, and 110 mm) from the original tape width W0 y3 third of the width (138mm, 161mm, 174mm) to prepare a tape for multi-start production with either production width W1 of. Therefore, in the present embodiment, there are five relations between the original tape width W0 and the manufacturing width W1 as shown in the following equation 3. In the present embodiment, the 1/3 width of the original tape width W0 (524 mm) has a fraction of 2/3 mm and is not adopted as the manufacturing width W1, but the original tape width W0 is 3 mm. In the case of a multiple, a width of one third of the original tape width W0 may be used as the manufacturing width W1.

[Equation 3]
W1 = W0
W1 = Wy1 = W0-Wx1
W1 = W0 / 2
W1 = Wy2 / 2 = (W0−Wx2) / 2
W1 = Wy3 / 3 = (W0-Wx3) / 3

  In the first step of the present embodiment, one (no division), two (two divisions), or three (three divisions) multi-strip manufacturing tapes are prepared from the raw material tape. FIG. 7 shows a tape carrier made of a multi-strip manufacturing tape having a manufacturing width (490 mm, 502 mm, 524 mm) prepared without dividing the raw material tape according to the relationship of Formula 1 or Formula 2 of Equation 3. FIG. 8 shows a tape carrier made of a multi-row production tape having a production width (226 mm, 254 mm, 262 mm) prepared by dividing the raw material tape into two parts according to the relationship of the third formula or the fourth formula of Formula 3. FIG. 9 shows a tape carrier made of a multi-strip manufacturing tape having a manufacturing width (138 mm, 161 mm, 174 mm) prepared by dividing the raw material tape into three parts according to the relationship of the fifth formula of Equation 1. . 7 to 9 exemplify a case where the product arrangement width W2 of the unit strip manufacturing tape region is 35 mm.

  On the multi-strip manufacturing tape prepared in the first step, five or more rows of unit strip manufacturing tape regions of product layout width W2 are formed in the width direction, except when the product layout width W2 is 44 mm. Has been. When the manufacturing width of the multi-row manufacturing tape is 490 mm, 502 mm, or 524 mm (no division), the unit arrangement manufacturing tape area is 16 rows with a product arrangement width W2 of 31 mm and the product arrangement width W2 is 44 mm. Eleven rows of tape manufacturing tape regions are formed respectively. Further, when the manufacturing width of the multi-strip manufacturing tape is 226 mm, 254 mm, or 262 mm (when divided into two), the product layout width W2 is 31 mm, the unit strip manufacturing tape area is 8 rows, and the product layout width W2 is Five rows of 44 mm unit strip manufacturing tape regions are formed respectively. Further, when the production width of the multi-row production tape is 138 mm, 161 mm, or 174 mm (when divided into three), the product arrangement width W2 is 31 mm and the product arrangement width W2 is 5 rows. Three rows of 44 mm unit strip manufacturing tape regions are formed. The product arrangement width W2 used in this embodiment is set to be 4 mm (2 mm on one side) narrower than the standard widths 35 mm and 48 mm of the conventional single-feed tape carrier. This is because, in the second process, the sprocket holes 5 are not opened, so that the effective product width W3 of the tape manufacturing area is the same as that of the first embodiment, and the product of the tape manufacturing tape area is maintained. This is because the arrangement width W2 can be reduced. As a result, the number N of unit strip manufacturing tape regions formed on the multi-segment manufacturing tape when there is no division or in two divisions is the first except for the case where the product arrangement width W2 is 44 mm when dividing into two. Since it has increased from the case of embodiment, the process efficiency in a 3rd process improves.

  Relationship between the number N of unit strip manufacturing tape areas, the manufacturing width W1, the product arrangement width W2, and the unused width Wz (the blank space 7 for adjusting the manufacturing width W1 of the multi-start manufacturing tape and the multi-sprocket hole 6) Although each numerical value is different, it is as shown in Formula 2 as in the first embodiment. Moreover, since the raw material tape manufacturing method is the same as that of the first embodiment, a duplicate description is omitted.

  In the second step, the multi-row sprocket holes 6 for conveyance are opened at intervals of 4.75 mm along the longitudinal direction at both end portions in the width direction of the multi-row manufacturing tape. In the individual processing equipment of the next third step, the multi-strip manufacturing tape is transported using the multi-strip sprocket holes 6. In the second embodiment, unlike the first embodiment, in the second step, the separate sprocket holes 5 are not opened at both end portions in the width direction of the unit strip manufacturing tape region. Therefore, in the multi-row manufacturing tape prepared in the first step, the product arrangement width W2 of the unit-row manufacturing tape region is narrowed only by a portion (2 mm × 2) used for the separate sprocket holes 5, As described above, the standard widths of the conventional single tape carrier are set to be 4 mm (2 mm on one side) narrower than the standard widths of 35 mm and 48 mm, respectively. In the second embodiment, since the portion used for the sprocket hole 5 according to the strip is used to increase the number N of tape regions for manufacturing the unit strip, the effective product width (W3) of the semiconductor device is The same as in the first embodiment. In the second embodiment, the portion excluding the effective product width (W3) from the product arrangement width (W2) does not include the separate sprocket holes 5, but the semiconductor devices adjacent in the width direction are individually separated. A cutting allowance 8 (2 mm) is included. The margin 7 between the multi-strand sprocket hole 6 and the unit strip manufacturing tape regions at both ends is for adjusting the manufacturing width W1, and is included in the unused width Wz of the multi-strand manufacturing tape.

  In the third step, with respect to the multi-row manufacturing tape, the metal thin film of the multi-row manufacturing tape is patterned using a known photolithography technique and etching technique, and each electrode of the semiconductor chip constituting the semiconductor device and A lead wire to be connected is formed. Further, the lead wiring is plated, and a solder resist is applied to portions other than the contact portion with the electrode of the lead wiring and the terminal portion for external connection to ensure an insulating state. Further, predetermined electrical inspection and appearance inspection are performed. Each process in the third step is the same as that in the first embodiment. As described above, the multi-long long tape-like tape carrier 1 is manufactured.

  The multi-strip tape carrier 1 produced by the steps (# 21 to # 23) of the method of the present invention is not divided into unit strip manufacturing tape regions, and is directly followed by an assembly step or a mounting step by a user ( # 24, corresponding to the fourth step). In the assembly process or the mounting process (# 24) by the user, the multi-strip tape carrier 1 is transported through the manufacturing equipment for each process using the multi-strip sprocket hole 6.

  In the assembly process or the user mounting process (# 24), the semiconductor chip is mounted on the multi-tape carrier 1, and the bump electrodes called bumps formed on the semiconductor chip and the inside of the lead wiring sealed with resin The corresponding ones at the ends are joined and electrically connected. After the semiconductor chip is bonded and mounted, in the case of COF, resin is injected into the gap between the semiconductor chip and the multi-row tape carrier 1, and in the case of TCP, the semiconductor exposed in the opening of the multi-row tape carrier 1 Resin is applied to the surface of the chip, and the joint between the semiconductor chip and the lead wiring and the surface of the semiconductor chip are sealed with resin.

  The semiconductor device completed on the multi-strip tape carrier 1 is punched into individual semiconductor devices and separated (# 25). Therefore, in this embodiment, the multi-strip tape carrier 1 is not divided into single-strip tape carriers. The individually separated semiconductor devices are the same as those shown in FIGS. 19 and 20, and as shown in FIGS. 21 and 22, terminal portions for external connection of lead wires are connected to the liquid crystal panel 19 and the printed circuit board 20. Connected and modularized, it becomes a semiconductor module device.

  In FIG. 10, the raw tape width (W0) of the raw material tape, the manufacturing width (W1) and the number (M) of the multi-strip manufacturing tape, the used width of the raw material tape (Wy1, Wy2) and unused in the second embodiment Width (Wx1, Wx2), number of tape areas for manufacturing unit strips (N), product arrangement width (W2) and effective product width (W3), use width of multi-strip manufacturing tape (W1-Wz) and not The interrelationships of the width of use (Wz), the number of tape regions for manufacturing the unit strips with respect to the raw material tape (L = M × N), and the material usage rate (U) of the raw material tape are shown in a list.

  From the comparison between FIG. 10 and FIG. 5, in the tape carrier 1 produced by the method of the present invention of the second embodiment, when there is no division or when the product arrangement width W2 is 31 mm at the time of the division, When the material usage rate is equal to or greater than that of a single-cut tape carrier and the product arrangement width W2 is 44 mm in two divisions, or when the product arrangement width W2 is 31 mm in three divisions, the conventional 3 It can be seen that a material usage rate equal to or higher than that of a striped or four-striped tape carrier can be achieved, and that each process in the third step can be executed with higher efficiency than the conventional one to four-striped tape carrier. Furthermore, in the second embodiment, the assembly process or the mounting process by the user can be executed simultaneously on a plurality of rows on the tape carrier 1, so that the manufacturing efficiency is greatly improved as a whole semiconductor manufacturing process. In addition, when the product arrangement width W2 is 44 mm at the time of three divisions, the material usage rate is lower than the conventional three-strand tape carrier, but the reason is that in the conventional three-strand tape carrier, This is because it can be used when the separate sprocket holes are not discarded but separated into a single tape carrier, and the material usage rate when compared with the effective product width (W3) is exactly the same. As described above, the manufacturing efficiency is greatly improved as a whole of the semiconductor manufacturing process.

<Third Embodiment>
The third embodiment is another embodiment of the second embodiment, and each step of the method of the present invention in the third embodiment is basically the same as that of the second embodiment. Steps (# 21 to # 23) until a solid tape carrier is manufactured and steps (# 24 to # 25) until a semiconductor device is manufactured by mounting a semiconductor chip on the tape carrier. The difference from the second embodiment is that the product arrangement width W2 of the unit strip manufacturing tape area is set to the same width as the standard widths 35 mm and 48 mm of the conventional single-row tape carrier as in the first embodiment. It is a point that has been. FIGS. 11 to 13 show a tape carrier of a multi-long long tape shape manufactured under the setting conditions of the product arrangement width W2 in the third embodiment through the tape carrier manufacturing steps (# 21 to # 23) shown in FIG. 1 is a plan view showing 1. FIG. FIG. 14 shows a state before separation into individual semiconductor devices in a state where the semiconductor chip 10 is mounted on the tape carrier 1 at the time of three divisions shown in FIG. 13 to form a semiconductor device.

  In addition, since the product arrangement width W2 of the unit strip manufacturing tape region is different from that in the second embodiment, the manufacturing width W1 of the multi-row manufacturing tape is partially different from that in the second embodiment. .

  In the third embodiment, on the multi-row manufacturing tape prepared in the first step, five or more rows of unit-row manufacturing tape regions of the product arrangement width W2 are formed in the width direction, except when divided into three. ing. When the production width of the multi-row production tape is 486 mm, 496 mm, or 524 mm (no division), the unit arrangement production tape area with the product arrangement width W2 of 35 mm is 14 rows, and the product arrangement width W2 is 48 mm. Ten rows of strip manufacturing tape regions are formed respectively. Further, when the production width of the multi-row production tape is 246 mm, 251 mm, or 262 mm (when divided into two), the product arrangement width W2 is 35 rows and the unit arrangement production tape area is 7 rows and the product arrangement width W2 is Five rows of 48 mm unit strip manufacturing tape regions are formed. In addition, when the production width of the multi-row production tape is 146 mm, 150 mm, or 174 mm (when divided into three), the product arrangement width W2 is 35 mm and the unit arrangement production tape area has four rows and the product arrangement width W2 is Three rows of 48 mm unit strip manufacturing tape regions are formed.

  In addition, although the product arrangement width W2 used in this embodiment is set to the same width as the standard widths 35 mm and 48 mm of the conventional one-step tape carrier, in the second step, as in the second embodiment. Since the separate sprocket holes 5 are not opened, the space for opening the separate sprocket holes 5 can be used for forming the lead wiring, so that the effective product width W3 can be increased by that amount (4 mm in this embodiment). . Therefore, in the conventional single- to four-line tape carrier or the multi-line tape carrier 1 of the first embodiment, the chip size of the semiconductor chip is slightly large (for example, the increase in chip size in the width direction is 4 mm or less). Therefore, it is necessary to expand the product arrangement width W2 with a standard width of 48 mm without being able to be accommodated in the product arrangement width W2 with a standard width of 35 mm, and the number N of tape regions for manufacturing the unit strips is reduced. Even when the efficiency is reduced, the effective product width W3 is expanded so that the product can be accommodated in the product arrangement width W2 having the same standard width of 35 mm, so that a large improvement in the large manufacturing efficiency can be substantially achieved. . Each of the plan views of FIGS. 11 to 13 shows that the wiring pattern of the lead wiring does not correspond to the increase of the chip size of the semiconductor chip, but the blank portion can cope with the increase of the chip size of the semiconductor chip. ing.

  FIG. 15 shows the raw tape width (W0) of the raw material tape, the manufacturing width (W1) and the number (M) of the multi-strip manufacturing tape, the used width of the raw material tape (Wy1, Wy2) and unused in the third embodiment. Width (Wx1, Wx2), number of tape areas for manufacturing unit strips (N), product arrangement width (W2) and effective product width (W3), use width of multi-strip manufacturing tape (W1-Wz) and not The interrelationships of the width of use (Wz), the number of tape regions for manufacturing the unit strips with respect to the raw material tape (L = M × N), and the material usage rate (U) of the raw material tape are shown in a list.

  15 and FIG. 5, the tape carrier 1 produced by the method of the present invention according to the third embodiment shows a conventional single carrier tape carrier in the case of no division or two divisions. A material usage rate equal to or higher than that can be achieved, and in the case of three divisions, a material usage rate equal to or higher than that of a conventional three- or four-strip tape carrier can be achieved, and each process in the third step It can be seen that it can be executed with higher efficiency than the conventional tape carrier with 1 to 4 strips. Furthermore, in the third embodiment, the assembly process or the mounting process by the user can be executed simultaneously on a plurality of rows on the tape carrier 1, so that the manufacturing efficiency is greatly improved as a whole semiconductor manufacturing process. Furthermore, in the third embodiment, as described above, the effect of improving the production efficiency due to the increase in the effective product width W3 of the unit strip production tape region is also great.

<Fourth embodiment>
The fourth embodiment is another embodiment of the second embodiment, and each step of the method of the present invention in the fourth embodiment is basically the same as that of the second embodiment. Steps (# 21 to # 23) until a solid tape carrier is manufactured and steps (# 24 to # 25) until a semiconductor device is manufactured by mounting a semiconductor chip on the tape carrier. The difference from the second embodiment is the wiring pattern of the lead wiring formed in the third step of the unit strip manufacturing tape region formed on the multi-row manufacturing tape.

  In the second embodiment, in the third step, the lead wirings are all formed in the same wiring pattern in all unit strip manufacturing tape regions formed on the multi-strip manufacturing tape. On the other hand, in 4th Embodiment, as shown in FIG. 16, in the 3rd process, the wiring pattern for every 1 lead | read | reed wiring of the tape area | region for unit strip manufacture is between two strips adjacent in the width direction. The lead wiring is patterned so that the pattern is alternately reversed in the longitudinal direction of the multi-row manufacturing tape. As a result, as shown in FIG. 16, when the product width is different at both ends in the longitudinal direction, such as a trapezoidal shape rather than a rectangle or square, the average effective product width is substantially equal. As a result, the number N of unit strip manufacturing tape regions may increase with respect to the manufacturing width W1 of the same multi-strip manufacturing tape. The number N of unit strip manufacturing tape areas in the second embodiment shown in FIG. 8 of the second embodiment is 8, whereas the number of unit strip manufacturing tape areas in the second embodiment shown in FIG. The number N of N is increased by 1 to 9, which improves the material usage rate and further improves the manufacturing efficiency of each of the tape carrier and the semiconductor device.

<Fifth Embodiment>
The fifth embodiment is another embodiment of the second embodiment, and FIG. 17 shows a manufacturing process of a thin-film tape carrier used for manufacturing a semiconductor device in the form of COF or TCP according to the method of the present invention in the fifth embodiment. FIG. 4 is a process diagram showing the manufacturing process of the semiconductor device, and the steps (# 31 to # 33) until the multi-long long tape-shaped tape carrier 1 is manufactured from the raw material tape, and the multi-line tape carrier 1 The process (# 34- # 35) until a semiconductor device is manufactured after mounting a semiconductor chip is shown.

  The steps (# 31 to # 33) until the multi-strip tape carrier 1 is manufactured are the same as the steps (# 21 to # 23) until the multi-strip tape carrier 1 is manufactured in the second embodiment. The description which overlaps with 2nd Embodiment is omitted.

  The difference from the second embodiment is that a process (# 34 to # 35, corresponding to the fifth process) until a semiconductor device is manufactured by mounting a semiconductor chip on the multi-row tape carrier 1, that is, an assembly process or The mounting process by the user is different from the processes (# 24 to # 25) of the second embodiment. In the fifth embodiment, as shown in FIG. 18, an individual semiconductor device in the unit strip manufacturing tape region is formed from the multi-row tape carrier 1 manufactured by the steps (# 31 to # 33) of the method of the present invention. The individual tape carriers 16 are respectively punched, and sprocket holes 18 are formed at both end portions in the width direction, which are separately prepared, and reprinted on the unit strip transport tape 17 for assembly whose center portion is opened in units of semiconductor devices (#). 34). The connection between the individual tape carrier 16 and the unit strip transport tape 17 is performed by, for example, temporarily attaching with an adhesive or the like.

  Subsequently, a semiconductor chip is separately mounted on the individual tape carrier 16 transferred to the unit strip transport tape 17, bump electrodes called bumps formed on the semiconductor chip, and resin sealing of the individual tape carrier 16. In the case of COF, after the corresponding ones of the inner ends of the lead wires to be joined are joined and electrically connected, and the semiconductor chip is joined and mounted, the resin is placed in the gap between the semiconductor chip and the individual tape carrier 16. In the case of TCP, resin is applied to the surface of the semiconductor chip exposed in the opening of the individual tape carrier 16, and the semiconductor chip-lead wiring junction and the semiconductor chip surface are resin-sealed (# 35). The individual semiconductor devices are the same as those shown in FIGS. 19 and 20, and as shown in FIGS. 21 and 22, the terminal portions for external connection of lead wires are connected to the liquid crystal panel 19 and the printed circuit board 20. It is modularized and becomes a semiconductor module device. In the fifth embodiment, the unit strip transport tape 17 on which the individual tape carrier 16 is reprinted is the same as the conventional single strip tape carrier, and therefore, existing equipment can be used effectively.

  Here, it is also preferable that the unit strip transport tape 17 is reused after the individual tape carrier 16 that has become a semiconductor device is collected from the unit strip transport tape 17 every time the assembly process or the mounting process by the user is completed. . Furthermore, even if the unit strip transport tape 17 is not reused, the unit strip transport tape 17 can be produced using a material that is sufficiently cheaper than the raw material tape used for manufacturing the multi-strand tape carrier 1. The advantage that existing facilities can be used effectively without a significant increase in manufacturing costs can be obtained.

  As described above, in the first to fifth embodiments, the manufacturing method of the tape carrier and the semiconductor device according to the present invention has been described in detail by exemplifying specific numerical values, but the numerical values used in the above description and the respective parts shown in the drawings. The shape and the like are merely examples, and do not limit the contents of the method of the present invention, and can be appropriately changed.

  INDUSTRIAL APPLICABILITY The present invention can be used for a thin film tape carrier used for manufacturing a semiconductor device in the form of a chip-on-film or a tape carrier package and a method for manufacturing the semiconductor device.

Process drawing which shows each process in 1st Embodiment of the manufacturing method of the tape carrier and semiconductor device which concern on this invention The top view which shows typically an example of the tape carrier of the multi-row long tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 1st Embodiment The top view which shows typically another example of the tape carrier of the multi-long elongate tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 1st Embodiment. The table | surface which shows each part dimension and material usage rate of the multi-strip long tape-shaped tape carrier produced with the manufacturing method of the tape carrier based on this invention in 1st Embodiment Chart showing the dimensions and material usage rate of conventional tape carriers with 1 to 4 strips Process drawing which shows each process in 2nd Embodiment of the manufacturing method of the tape carrier and semiconductor device which concern on this invention The top view which shows typically an example of the tape carrier of the multi-row long tape shape produced with the manufacturing method of the tape carrier based on this invention in 2nd Embodiment The top view which shows typically another example of the tape carrier of the multi-strip long tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 2nd Embodiment. The top view which shows typically another example of the tape carrier of the multi-strip long tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 2nd Embodiment. The table | surface which shows each part dimension and material usage rate of the tape carrier of the multi-long long tape shape produced with the manufacturing method of the tape carrier based on this invention in 2nd Embodiment The top view which shows typically an example of the tape carrier of the multi-row long tape shape produced with the manufacturing method of the tape carrier based on this invention in 3rd Embodiment The top view which shows typically another example of the tape carrier of the multi-long elongate tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 3rd Embodiment. The top view which shows typically another example of the tape carrier of the multi-long elongate tape shape produced with the manufacturing method of the tape carrier which concerns on this invention in 3rd Embodiment. The top view which shows typically the state which mounted the semiconductor chip on the tape carrier at the time of the 3 division | segmentation shown in FIG. 13, and became the semiconductor device. The table | surface which shows each part dimension and material usage rate of the multi-strip | long tape-shaped tape carrier produced with the manufacturing method of the tape carrier based on this invention in 3rd Embodiment The top view which shows typically an example of the tape carrier of the multi-row long tape shape produced with the manufacturing method of the tape carrier based on this invention in 4th Embodiment Process drawing which shows each process in 5th Embodiment of the manufacturing method of the tape carrier and semiconductor device which concern on this invention The figure which shows typically the process of punching an individual tape carrier from the multiple tape carrier in 5th Embodiment of the manufacturing method of the tape carrier which concerns on this invention, and a semiconductor device, and transferring it to a unit strip conveyance tape. Sectional drawing which shows typically the cross-sectional structure of the semiconductor device by the form of a chip on film Sectional drawing which shows typically the cross-sectional structure of the semiconductor device by the form of a tape carrier package Sectional drawing which shows typically the cross-sectional structure which connected the semiconductor device by the form of a chip on film, the printed circuit board, and the liquid crystal panel, and was modularized Sectional drawing which shows typically the cross-sectional structure which connected the semiconductor device by the form of a tape carrier package, the printed circuit board, and the liquid crystal panel, and was modularized The top view which shows typically an example of the conventional tape carrier of 1 line picking The top view which shows typically an example of the conventional tape carrier of two strips A plan view schematically showing an example of a conventional four-strip tape carrier

Explanation of symbols

1: Tape carrier 2: Thin-film insulating tape 3: Lead wiring 4: Solder resist 5: Sprocket hole according to strip 6: Sprocket hole for multiple strips 7: Blank portion for adjusting the manufacturing width of the tape for multi-strand manufacturing 8: Cutting allowance 9: Adhesive 10: Semiconductor chip 11: Projection electrode (bump)
12: Sealing resin 13: Semiconductor device in the form of chip-on-film (COF) 14: Semiconductor device in the form of a tape carrier package (TCP) 15: Opening 16: Individual tape carrier 17: Unit strip transport tape 18: Unit strip Sprocket hole of transport tape 19: LCD panel 20: Printed circuit board W1: Manufacturing width of multi-strip manufacturing tape W2: Product placement width W3: Effective product width

Claims (16)

A method of manufacturing a thin-film tape carrier used for manufacturing a semiconductor device in the form of a chip-on-film or a tape carrier package,
From a raw material tape in which a metal thin film is formed on the entire surface of a raw material insulating tape that is not cut in the width direction, which is a raw material of the tape carrier, the same width as the raw tape width of the raw material tape, a predetermined unused width from the raw tape width The same width as the use width from which the tape is removed, the half width of the original tape width, the half width of the use width obtained by removing a predetermined unused width from the original tape width, and the third width of the original tape width A plurality of semiconductor devices that occupy a predetermined product arrangement width in the width direction in a manufacturing width of one width or one-third of a used width obtained by removing a predetermined unused width from the original tape width. A first step of preparing an arrayable multi-row manufacturing tape;
With respect to the multi-strip manufacturing tape, multi-strip sprocket holes for conveying the multi-strip manufacturing tape are provided at both end portions in the width direction of the multi-strip manufacturing tape, and the longitudinal direction of the multi-strip manufacturing tape. A second step of forming along
The metal thin film is subjected to patterning on the multi-row manufacturing tape to form lead wirings connected to each electrode of the semiconductor chip constituting the semiconductor device, a solder resist is applied, and a predetermined inspection is performed. A third step,
In the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, the same width as the used width obtained by removing a predetermined unused width from the raw tape width, and a half of the raw tape width When preparing the multi-strip manufacturing tape having a width or a half width of the used width obtained by removing a predetermined unused width from the original tape width, the multi-strip manufacturing tape is predetermined during the manufacturing process. 5 or more of the semiconductor devices occupying the product arrangement width can be arranged in the width direction, and one-third width of the original tape width or a predetermined unused width is removed from the raw tape width from the raw material tape. When preparing the multi-row manufacturing tape having a width of one-third of the width of use, the width direction of the unit-row manufacturing tape region in which the multi-row manufacturing tape is divided along the longitudinal direction by the product arrangement width unit. At both ends of the Manufacturing method of the tape carrier, characterized in that Le is not formed.   In the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, the same width as the used width obtained by removing a predetermined unused width from the raw tape width, and a half of the raw tape width Even when preparing the multi-strip manufacturing tape having a width or a half width of the used width obtained by removing a predetermined unused width from the original tape width, the unit strip on the multi-strip manufacturing tape is prepared. The tape carrier manufacturing method according to claim 1, wherein the striped sprocket holes are not formed at both end portions in the width direction of the manufacturing tape region.   Both end portions in the width direction of the unit-strip manufacturing tape region on the multi-strip manufacturing tape are used to form part of the lead wiring instead of forming the separate sprocket holes. The method for producing a tape carrier according to claim 2.   The tape carrier manufacturing method according to claim 2 or 3, wherein the predetermined product arrangement width of the semiconductor device is narrower than a predetermined standard width by an amount not forming the striped sprocket holes.   5. The device according to claim 2, wherein the predetermined product arrangement width of the semiconductor device is the same as a predetermined standard width, and an effective product width is increased by an amount not forming the striped sprocket holes. A manufacturing method of a tape carrier given in any 1 paragraph.   In the third step, the wiring pattern for each of the lead wirings in the unit strip manufacturing tape region on the multi-strand manufacturing tape is formed between the two strips adjacent to each other in the width direction. The method for manufacturing a tape carrier according to any one of claims 2 to 5, wherein the lead wiring is formed so as to have a pattern reversed in the longitudinal direction. In the first step, from the raw material tape, the same width as the raw tape width of the raw material tape, the same width as the used width obtained by removing a predetermined unused width from the raw tape width, and a half of the raw tape width Preparing the multi-row manufacturing tape having a width or a half width of the used width obtained by removing a predetermined unused width from the original tape width;
In the second step, the striped sprocket holes are formed along the longitudinal direction of the multi-strip manufacturing tape at both end portions in the width direction of the unit-strip manufacturing tape region with respect to the multi-strip manufacturing tape. The tape carrier manufacturing method according to claim 1, wherein the tape carrier is formed.   8. The method of manufacturing a tape carrier according to claim 7, wherein the predetermined product arrangement width of the semiconductor device is the same as a predetermined standard width.   9. The method of manufacturing a tape carrier according to claim 4, wherein the original tape width is 524 mm and the predetermined standard width is 35 mm or 48 mm. A method of manufacturing a thin-film tape carrier used for manufacturing a semiconductor device in the form of a chip-on film,
The raw material tape used in the first step is obtained by casting the metal thin film on the raw material insulating tape by a sputtering method, or by applying an insulating resin on the metal thin film and curing the raw material. The method for manufacturing a tape carrier according to any one of claims 1 to 9, wherein the tape carrier is manufactured by laminating insulating tapes. A method of manufacturing a thin-film tape carrier used for manufacturing a semiconductor device in the form of a tape carrier package,
The said raw material tape used in the said 1st process is produced by affixing the said metal thin film on the said raw material insulation tape with the adhesive by the laminating method, In any one of Claims 1-9 characterized by the above-mentioned. The manufacturing method of the tape carrier of description. A method of manufacturing a semiconductor device resin-sealed on a thin-film tape carrier in any form of a chip-on-film or a tape carrier package,
The semiconductor chip is separately provided for each of the multi-row manufacturing tapes after each of the first, second, and third steps of the tape carrier manufacturing method according to claim 1. A method of manufacturing a semiconductor device, comprising: mounting, connecting each of the electrodes and the lead wiring, and performing resin sealing.   13. The method of manufacturing a semiconductor device according to claim 12, wherein the semiconductor device is individually punched from the multi-row manufacturing tape after the fourth step. A method of manufacturing a semiconductor device resin-sealed on a thin-film tape carrier in any form of a chip-on-film or a tape carrier package,
The said tape carrier of the said semiconductor device unit from the said multi-strip manufacturing tape after each process of the said 1st, 2nd and 3rd process of the manufacturing method of the tape carrier of any one of Claims 2-6 Are individually punched, sprocket holes are formed at both ends in the width direction, which are separately prepared, and the central portion is transferred to the unit strip transport tape that is opened in the semiconductor device unit, and is transferred to the unit strip transport tape. A method of manufacturing a semiconductor device comprising: a fifth step of separately mounting the semiconductor chip on the tape carrier, connecting the electrodes and the lead wiring, and sealing with resin. A method of manufacturing a semiconductor device resin-sealed on a thin-film tape carrier in any form of a chip-on-film or a tape carrier package,
9. The predetermined tape of the semiconductor device by dividing the multi-row manufacturing tape after each of the first, second, and third steps of the tape carrier manufacturing method according to claim 7 or 8 along a longitudinal direction. A tape for manufacturing unit strips having the same width as the product arrangement width is manufactured, the semiconductor chip is separately mounted on the tape for manufacturing unit strips, the electrodes and the lead wires are connected, and resin sealing is performed. A method for manufacturing a semiconductor device, comprising performing a sixth step. A semiconductor module device comprising a semiconductor device manufactured by using the method for manufacturing a semiconductor device according to claim 12.

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