JP2009016564A - Manufacturing method of resin molded object for shielding electromagnetic wave - Google Patents

Manufacturing method of resin molded object for shielding electromagnetic wave Download PDF

Info

Publication number
JP2009016564A
JP2009016564A JP2007176484A JP2007176484A JP2009016564A JP 2009016564 A JP2009016564 A JP 2009016564A JP 2007176484 A JP2007176484 A JP 2007176484A JP 2007176484 A JP2007176484 A JP 2007176484A JP 2009016564 A JP2009016564 A JP 2009016564A
Authority
JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
resin molded
resin
vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007176484A
Other languages
Japanese (ja)
Other versions
JP4873247B2 (en
Inventor
Mitsuru Kajita
充 梶田
Katsuaki Mitani
勝昭 三谷
Hitoshi Wada
仁 和田
Osamu Kajita
治 梶田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADO UNION KENKYUSHO KK
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
ADO UNION KENKYUSHO KK
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADO UNION KENKYUSHO KK, Fukuda Metal Foil and Powder Co Ltd filed Critical ADO UNION KENKYUSHO KK
Priority to JP2007176484A priority Critical patent/JP4873247B2/en
Publication of JP2009016564A publication Critical patent/JP2009016564A/en
Application granted granted Critical
Publication of JP4873247B2 publication Critical patent/JP4873247B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin molded object for shielding electromagnetic waves which can efficiently form an electromagnetic shielding layer at low cost on the face of the resin molded object to which an electromagnetic wave shielding process is applied simultaneously when the resin molded object of such as a resin housing is formed. <P>SOLUTION: A coating material layer of a conductive base material sheet is arranged at a position used as the face of the resin molded object to be molded to which the electromagnetic wave shielding process is applied. The conductive base material sheet is formed by laminating a coating material in a finger-touch dry state on the face of a vehicle impregnating base material which is bendable and deformable, wherein the coating material includes conductive metal particles dispersed in a vehicle. When the resin molded object is formed, the conductive base material sheet is heated and pressurized to make the coating material layer-closely into contact with the face of the resin molded object to be molded to which the electromagnetic wave shielding process is applied, then the vehicle of the coating material layer is impregnated into the vehicle impregnating base material to form the electromagnetic wave shielding layer, in which the conductive metal particles of the coating material layer are flat-rolled and deformed between the resin molded object and the conductive base material sheet. The conductive base material sheet is peeled off and removed from the resin molded object in such a state that the electromagnetic wave shielding layer remains on the face of the resin molded object to which the electromagnetic wave shielding process is applied. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電磁波を発生するプラズマディスプレイ等の電気製品や電子機器の筐体部等に採用する電磁波遮蔽樹脂成形体の製造方法に関するものである。   The present invention relates to a method of manufacturing an electromagnetic wave shielding resin molded body that is employed in electrical products such as plasma displays that generate electromagnetic waves, and casings of electronic devices.

周知の通り、電磁波を発生するプラズマディスプレイ等の電気製品や電子機器には樹脂製筐体部に他の電気製品や電子機器に悪影響を及ぼす電磁波を遮蔽する対策が施されており、当業界においては樹脂製筐体部に電磁波シールド対策を効率良く施せ、しかもシールド特性に優れた電磁波遮蔽樹脂成形体が切望されている。   As is well known, electrical products and electronic devices such as plasma displays that generate electromagnetic waves have measures to shield electromagnetic waves that adversely affect other electrical products and electronic devices in the resin casing. Therefore, there is a strong demand for an electromagnetic wave shielding resin molded body that can efficiently take measures against electromagnetic wave shielding on a resin casing and that has excellent shielding characteristics.

前記樹脂製筐体部に電磁波シールド材を装着する対策方法として、合成樹脂ビヒクルが浸み込む熱可塑性不織布よりなる含浸性基材と、その上に塗布された導電性塗料、導電性ペースト又は導電性インクよりなる導電体粒子を含有する導電性付与剤とからなり、且つ、該導電性付与剤を塗布された含浸性基材が加熱及び加圧されている電磁波シールド材及び該電磁波シールド材の製造方法が提案されている(特許文献1)。   As a countermeasure method for mounting an electromagnetic wave shielding material on the resin casing, an impregnated base material made of a thermoplastic nonwoven fabric into which a synthetic resin vehicle is immersed, and a conductive paint, conductive paste or conductive material applied thereon. An electromagnetic wave shielding material comprising a conductive agent containing conductive particles made of a conductive ink, and an impregnated base material coated with the conductive property imparting agent being heated and pressurized, and the electromagnetic wave shielding material A manufacturing method has been proposed (Patent Document 1).

また、電磁波シールド材を前記樹脂製筐体部と一体的に成形する対策方法として、外層樹脂成形体、電磁波シールド材及び内層樹脂成形体の層状一体構造を有する電磁波シールド樹脂成形体であって、且つ該電磁波シールド材が導電性付与剤を塗布された含浸性基材シートを加熱加圧して製造した電磁波シールドシートである電磁波シールド樹脂成形品において、その外層樹脂成形体、電磁波シールド材及び内層樹脂成形体の層状一体構造を金型内にインサートして内層樹脂成形体を射出成形することによって形成された層状一体構造の電磁波シールド樹脂成型品が提案され(特許文献2)、成形金型内に軟質性のメッシュ状電磁波シールド繊維を配置し、金型を型締めして樹脂を射出し、これによりメッシュ状電磁波シールド繊維の表面に射出樹脂が入り込んで電磁波シールド繊維と射出樹脂との密着性を向上させた樹脂製成型品及びその製造方法も提案されている(特許文献3)。   Further, as a countermeasure method for integrally molding the electromagnetic shielding material with the resin casing, an electromagnetic shielding resin molded body having a layered integrated structure of the outer layer resin molded body, the electromagnetic shielding material and the inner layer resin molded body, In addition, in the electromagnetic wave shielding resin molded product, the electromagnetic wave shielding material is an electromagnetic wave shielding sheet produced by heating and pressing an impregnating base material sheet coated with a conductivity imparting agent, the outer layer resin molded body, the electromagnetic wave shielding material, and the inner layer resin An electromagnetic shielding resin molded article having a layered integrated structure formed by inserting a layered integrated structure of a molded body into a mold and injection molding an inner resin molded body has been proposed (Patent Document 2). A flexible mesh-like electromagnetic shielding fiber is placed, the mold is clamped, and a resin is injected. Electromagnetic shielding fibers and resin molded article and a manufacturing method thereof to improve the adhesion between the injected resin is out resin enters has been proposed (Patent Document 3).

特許第2606504号公報Japanese Patent No. 2606504 登録実用新案第3028096号公報Registered Utility Model No. 3028096 特開平11−292050号公報Japanese Patent Laid-Open No. 11-292050

しかし、特許文献1に開示されている電磁波シールド材では、樹脂製筐体部の電磁波遮蔽処理を施す面に装着する前に該電磁波シールド材を該面の形状に合うように型加工しなければならず、しかも、装着する際には接着剤等を使用しなければならないという問題点があり、また、特許文献2に開示されている電磁波シールド樹脂成型品では、外層樹脂成形体を射出成形した後に該外層樹脂成形体の電磁波遮蔽処理を施す面に電磁波シールド材を該面の形状に合うように型加工して装着して内層樹脂成形体を射出成形しなければならないという問題点があり、また、特許文献3に開示されている樹脂製成型品では、メッシュ状繊維に銅やニッケルの無電解メッキを施して電磁波シールド性を有するメッシュ状電磁波シールド繊維を得なければならないので、製造工程が増えて作業効率が悪いという問題点があった。   However, in the electromagnetic wave shielding material disclosed in Patent Document 1, the electromagnetic wave shielding material must be molded so as to conform to the shape of the surface before being attached to the surface of the resin casing that is subjected to the electromagnetic wave shielding treatment. In addition, there is a problem that an adhesive or the like must be used when mounting, and in the electromagnetic wave shielding resin molded product disclosed in Patent Document 2, the outer layer resin molded body is injection molded. There is a problem that the inner layer resin molded body must be injection molded by molding and mounting an electromagnetic wave shielding material on the surface to be subjected to electromagnetic wave shielding treatment of the outer layer resin molded body later, so as to match the shape of the surface, Moreover, in the resin-molded product disclosed in Patent Document 3, unless the mesh-like electromagnetic shielding fiber having electromagnetic shielding properties is obtained by performing electroless plating of copper or nickel on the mesh-like fiber. Since there is no et al., Work efficiency is increasing the production process there has been a problem that bad.

そこで、本発明は、前記諸問題点を解決することを技術的課題とし、樹脂製筐体等の樹脂成形体を成形する際に同時に樹脂成形体の電磁波遮蔽処理を施す面に電磁波遮蔽層を効率よく、且つ、低コストにて形成することができる電磁波遮蔽樹脂成形体の製造方法を提供することにより、当該課題を達成したものである。   Then, this invention makes it a technical subject to solve the said various problems, and when forming resin moldings, such as a resin-made housing | casing, an electromagnetic wave shielding layer is provided in the surface which performs the electromagnetic wave shielding process of a resin molding simultaneously. The object has been achieved by providing a method for producing an electromagnetic wave shielding resin molded body that can be formed efficiently and at low cost.

前記技術的課題は、次の通りの本発明によって解決できる。   The technical problem can be solved by the present invention as follows.

即ち、本発明に係る電磁波遮蔽樹脂成形体の製造方法は、ビヒクル中に導電性金属粒子を分散して含有する塗工材を折り曲げ変形自在のビヒクル含浸性基材面に指触乾燥状態に積層してなる導電性基材シートの該塗工材層を、成形される樹脂成形体の電磁波遮蔽処理を施す面となる位置に配置し、当該樹脂成形体を成形する際に、当該導電性基材シートを加熱・加圧して塗工材層を成形される樹脂成形体の電磁波遮蔽処理を施す面に密着させると共に、塗工材層のビヒクルをビヒクル含浸性基材に含浸させて樹脂成形体と導電性基材シートとの間に塗工材層の導電性金属粒子が圧延・変形された電磁波遮蔽層を形成し、この後、当該電磁波遮蔽層を樹脂成形体の電磁波遮蔽処理を施す面に残した状態で導電性基材シートを樹脂成形体から剥離・除去するようにしたものである。   That is, in the method for producing an electromagnetic wave shielding resin molded body according to the present invention, a coating material containing conductive metal particles dispersed in a vehicle is laminated in a dry state on the surface of the vehicle-impregnated base material that can be bent and deformed. The conductive material sheet of the conductive base sheet formed is disposed at a position to be a surface to be subjected to electromagnetic wave shielding treatment of the resin molded body to be molded, and when the resin molded body is molded, the conductive group The material sheet is heated and pressed to closely adhere to the surface of the resin molded body to be subjected to the electromagnetic wave shielding treatment, and the vehicle impregnated base material is impregnated with the vehicle-impregnated base material. An electromagnetic shielding layer in which the conductive metal particles of the coating material layer are rolled and deformed is formed between the conductive base sheet and the electromagnetic shielding layer of the resin molded body. The conductive substrate sheet is peeled off from the resin molded body while remaining on It is obtained so as to remove.

本発明によれば、折り曲げ変形自在のビヒクル含浸性基材面にビヒクル中に導電性金属粒子を分散して含有する塗工材を指触乾燥状態に積層してなる導電性基材シートを用い、当該塗工材層を成形される樹脂成形体の電磁波遮蔽処理を施す面となる位置に配置し、樹脂成形に際して加熱・加圧により成形される樹脂成形体と導電性基材シートとの間に塗工材層の導電性金属粒子が圧延・変形されてなる電磁波遮蔽層を形成し、当該電磁波遮蔽層を樹脂成形体の電磁波遮蔽処理を施す面に残した状態で導電性基材シートを樹脂成形体から剥離・除去するので、電気製品や電子機器の樹脂製筐体等を成形する際、同時に樹脂成形体の電磁波遮蔽処理を施す面に電磁波遮蔽層を効率よく、且つ、低コストにて形成することができる。   According to the present invention, there is used a conductive substrate sheet obtained by laminating a coating material containing conductive metal particles dispersed in a vehicle on a surface of a vehicle-impregnable substrate that can be bent and deformed, in a dry-to-touch state. The coating material layer is disposed at a position to be a surface to be subjected to electromagnetic wave shielding treatment of the resin molded body to be molded, and between the resin molded body molded by heating and pressing during the resin molding and the conductive base sheet. The conductive base material sheet is formed in a state where an electromagnetic wave shielding layer is formed by rolling and deforming the conductive metal particles of the coating material layer, and the electromagnetic wave shielding layer is left on the surface to be subjected to the electromagnetic wave shielding treatment of the resin molded body. Because it is peeled and removed from the resin molded body, when molding a resin casing of an electric product or electronic device, an electromagnetic wave shielding layer is efficiently and inexpensively provided on the surface of the resin molded body to be subjected to electromagnetic wave shielding treatment at the same time. Can be formed.

以下、本発明の実施の形態を図面に基づき説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

実施の形態1. Embodiment 1 FIG.

図1は導電性基材シートの縦断面図、図2は電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図であり、これらの図において、1は折り曲げ変形自在のビヒクル含浸性基材2と該ビヒクル含浸性基材2の上面に指触乾燥状態に積層されている塗工材層3とからなる導電性基材シートであり、塗工材層3はビヒクル4中に導電性金属粒子5を分散して含有する塗工材によって形成されている。また、図2において、6は樹脂成形体7の電磁波遮蔽処理を施す面(以下、「処理面」ともいう。)8の位置に密着して残っている電磁波遮蔽層9と当該樹脂成形体7とからなる電磁波遮蔽樹脂成形体であり、電磁波遮蔽層9は、熱プレス法による加熱・加圧によって塗工材層3が処理面8に密着され、成形される樹脂成形体7と導電性基材シート1との間で導電性金属粒子5が圧延・変形されることにより形成される。なお、10は熱プレス押し台、11は加熱プレス台、12は成形によって樹脂成形体7となる成形樹脂である。   FIG. 1 is a longitudinal sectional view of a conductive substrate sheet, and FIG. 2 is a longitudinal sectional view for explaining a production process of an electromagnetic wave shielding resin molded body. In these drawings, 1 is a vehicle-impregnated substrate 2 that can be bent and deformed. And a coating material layer 3 laminated on the top surface of the vehicle-impregnated substrate 2 in a dry-to-touch state. The coating material layer 3 is composed of conductive metal particles in the vehicle 4. 5 is formed by a coating material containing 5 in a dispersed manner. In FIG. 2, reference numeral 6 denotes an electromagnetic wave shielding layer 9 that remains in close contact with the surface 8 (hereinafter also referred to as “treated surface”) of the resin molded body 7 on which electromagnetic wave shielding processing is performed, and the resin molded body 7. The electromagnetic wave shielding resin molded body is composed of a resin molded body 7 and a conductive group which are molded by the coating material layer 3 being in close contact with the treatment surface 8 by heating and pressurizing by a hot press method. It is formed by rolling and deforming the conductive metal particles 5 between the material sheets 1. In addition, 10 is a hot press stand, 11 is a heat press stand, and 12 is a molding resin that becomes a resin molded body 7 by molding.

次に、電磁波遮蔽樹脂成形体6の製造方法について説明する。   Next, the manufacturing method of the electromagnetic wave shielding resin molded body 6 will be described.

先ず、図2の(a)に示すように、導電性基材シート1の塗工材層3面を成形樹脂12の片面(成形により樹脂成形体7の処理面8となる面)に位置付けて配置し、次いで、塗工材層3の熱変形温度又は該温度より10〜20℃低い温度(熱可塑性樹脂では180〜300℃)で加熱して導電性基材シート1側から成形樹脂12に向かって加圧して塗工材層3のビヒクル4をビヒクル含浸性基材2に含浸・吸着させると共に、塗工材層3を成形樹脂12の片面に密着させてビヒクル4を含浸・吸着させ、図2の(b)に示すように、成形樹脂12を成形して形成された樹脂成形体7と導電性基材シート1との間に塗工材層3の導電性金属粒子5が圧延・変形して層と成った電磁波遮蔽層9を形成し、この後、成形された樹脂成形体7から導電性基材シート1を剥離・除去して樹脂成形体7の処理面8に電磁波遮蔽層9を残す。   First, as shown in FIG. 2A, the surface of the coating material layer 3 of the conductive base sheet 1 is positioned on one surface of the molding resin 12 (the surface that becomes the processing surface 8 of the resin molded body 7 by molding). And then heated at a heat deformation temperature of the coating material layer 3 or a temperature lower by 10 to 20 ° C. (180 to 300 ° C. in the case of a thermoplastic resin) than the conductive material layer 3 to the molding resin 12 from the conductive substrate sheet 1 side. The vehicle 4 of the coating material layer 3 is impregnated and adsorbed on the vehicle-impregnated base material 2 by applying pressure toward the vehicle, and the vehicle 4 is impregnated and adsorbed by adhering the coating material layer 3 to one surface of the molding resin 12. As shown in FIG. 2 (b), the conductive metal particles 5 of the coating material layer 3 are rolled between the resin molded body 7 formed by molding the molding resin 12 and the conductive substrate sheet 1. An electromagnetic wave shielding layer 9 which is deformed to form a layer is formed, and thereafter, the conductive substrate sheet 1 is peeled and removed from the molded resin molded body 7. To leave an electromagnetic shielding layer 9 on the treated surface 8 of the resin molded body 7.

前記塗工材としては、樹脂塗料、樹脂インク及び樹脂ペーストを使用すればよく、ビヒクル4は樹脂成形体7に相溶性のある熱可塑性樹脂又は接着性のある熱硬化性樹脂(アクリル系、ポリエステル系、ウレタン系等)のものを選択的に使用するのが好ましく、塗工材層3が指触乾燥(半硬化)の状態であれば、ビヒクル4が容易に溶解して樹脂成形体7に溶融固着すると同時にビヒクル含浸性基材2に溶融含浸するのでより好ましい。また、導電性金属粒子5とビヒクル4とを30〜80重量部:70〜20重量部の割合で混合したものを塗工材とすれば、印刷や塗布等の方法によってビヒクル含浸性基材2面に容易に塗工(積層)することができ、電磁波遮蔽層9を30〜200μmの範囲の厚さに形成できるのでより好ましい。   As the coating material, resin paints, resin inks, and resin pastes may be used. The vehicle 4 is a thermoplastic resin compatible with the resin molded body 7 or an adhesive thermosetting resin (acrylic, polyester). It is preferable to selectively use a coating material layer 3 if the coating material layer 3 is in a dry-to-touch (semi-cured) state, the vehicle 4 is easily dissolved into the resin molded body 7. It is more preferable because the vehicle-impregnable base material 2 is melt-impregnated at the same time as being melt-fixed. Further, if a mixture of conductive metal particles 5 and vehicle 4 in a ratio of 30 to 80 parts by weight: 70 to 20 parts by weight is used as the coating material, the vehicle-impregnated base material 2 is obtained by a method such as printing or coating. It is more preferable because it can be easily applied (laminated) to the surface and the electromagnetic wave shielding layer 9 can be formed to a thickness in the range of 30 to 200 μm.

また、加圧条件は高圧であればよいが、成形樹脂12は加熱されているので、成形加工法によって、5〜300kgf/cm2の範囲で選択すればよい。生産性の面より熱プレス法では50〜300kgf/cm2、圧空成形法では5〜30kgf/cm2とすればよい。 The pressurizing condition may be a high pressure, but since the molding resin 12 is heated, it may be selected in the range of 5 to 300 kgf / cm 2 depending on the molding process. From the viewpoint of productivity, the hot press method may be 50 to 300 kgf / cm 2 , and the compressed air molding method may be 5 to 30 kgf / cm 2 .

また、導電性金属粒子5はAg、Cu、Al、Ni、Fe、又は、これらの合金、及び、Ag被覆Cu、Ag被覆Ni等の処理合金、その他の各種処理した複合粒子の合金等を用いればよい。当該金属粒子5の形状は、フレーク形状又は不規則形状であることが好ましい。球形粒子では加熱と圧着により金属粒子が変形・密着しても金属粒子同士の接触が点接触となって導電性能が悪いので好ましくない。フレーク状金属粒子であれば、粒子が折れ曲がった状態で粒子間隙間へ立体的・三次元的に入り込んで網目構造的に接触するから、粒子同士の非接触部が少なくなって接触密度が高まって電磁波遮蔽層9の導電性能が良くなり、安定した性能と品質が得られる。また、フレーク状金属粒子と不規則形状金属粒子との混合粒子やフレーク状金属粒子と球形状金属粒子との混合粒子やフレーク状金属粒子と不規則形状金属粒子と球形状金属粒子との混合粒子では、フレーク状金属粒子が不規則形状金属粒子間隙間又は球形状金属粒子間隙間へ、不規則形状金属粒子がフレーク状金属粒子間隙間へ食い込む現象が起こるので、フレーク状金属粒子単独の場合と同様の効果が得られる。従って、導電性金属粒子5には、フレーク状金属粒子、不規則形状金属粒子、不規則形状金属粒子とフレーク状金属粒子との混合粒子、不規則形状金属粒子と球形状金属粒子との混合粒子、又は、不規則形状金属粒子とフレーク状金属粒子と球形状金属粒子との三種混合粒子のものを使用すれば良い。これにより、具体的には、Cu金属粒子においては0.6Ωの導電性能が得られ、Ag金属粒子において0.05Ωの導電性能が得られる。   In addition, the conductive metal particles 5 are made of Ag, Cu, Al, Ni, Fe, or an alloy thereof, a treated alloy such as Ag-coated Cu or Ag-coated Ni, or an alloy of other various treated composite particles. That's fine. The shape of the metal particles 5 is preferably a flake shape or an irregular shape. In the case of spherical particles, even if the metal particles are deformed and brought into close contact by heating and pressure bonding, the contact between the metal particles becomes a point contact, which is not preferable. In the case of flaky metal particles, since the particles are bent in a three-dimensional and three-dimensional manner into the inter-particle gap and contact in a network structure, the non-contact part between the particles decreases and the contact density increases. The conductive performance of the electromagnetic wave shielding layer 9 is improved, and stable performance and quality can be obtained. Also, mixed particles of flaky metal particles and irregular metal particles, mixed particles of flaky metal particles and spherical metal particles, or mixed particles of flaky metal particles, irregular metal particles and spherical metal particles In flaky metal particles, a phenomenon occurs in which irregularly shaped metal particles bite into gaps between irregularly shaped metal particles or spherical metal particles, and irregularly shaped metal particles into gaps between flaky metal particles. Similar effects can be obtained. Therefore, the conductive metal particles 5 include flaky metal particles, irregular metal particles, mixed particles of irregular metal particles and flaky metal particles, mixed particles of irregular metal particles and spherical metal particles. Or what is necessary is just to use the thing of 3 types mixed particle | grains of an irregular-shaped metal particle, a flaky metal particle, and a spherical metal particle. Thus, specifically, a conductive performance of 0.6Ω is obtained for Cu metal particles, and a conductive performance of 0.05Ω is obtained for Ag metal particles.

具体的には、粒子径1〜90μm,BET比表面積0.1〜1m2/g,充填密度0.7〜4.0g/cm3の不規則形状金属粒子を基本材料とし、当該金属粒子に粒子形5〜50μm,アスペクト比(粒子の厚さと最大粒子径との比)1/50〜1/5,BET比表面積0.1〜3m2/g,充填密度0.7〜3.0g/cm3のフレーク状金属粒子と粒子径1〜30μm,BET比表面積0.1〜5m2/g,充填密度0.7〜5.0g/cm3の球形状金属粒子とを混合した導電性金属粒子5を使用すれば良い。 Specifically, irregular metal particles having a particle diameter of 1 to 90 μm, a BET specific surface area of 0.1 to 1 m 2 / g, and a packing density of 0.7 to 4.0 g / cm 3 are used as basic materials, and the metal particles have a particle shape of 5 to 50 μm. , Flaky metal particles with an aspect ratio (ratio of particle thickness to maximum particle size) of 1/50 to 1/5, BET specific surface area of 0.1 to 3 m 2 / g, packing density of 0.7 to 3.0 g / cm 3 and particle size Conductive metal particles 5 mixed with spherical metal particles having 1 to 30 μm, BET specific surface area of 0.1 to 5 m 2 / g, and packing density of 0.7 to 5.0 g / cm 3 may be used.

また、前記導電性金属粒子5には酸化・腐食防止処理を施すのが好ましい。具体的には、金属粒子とビヒクルとの間に発生した極微少の密着不足によって金属粒子界面に酸素や水分が侵入して金属粒子が酸化して導電性が低下するので、金属粒子表面に0.5mass%以下のアミン系、2mass%以下の有機系、チタネート系、アルミネート系、ジルコネート系、シラン系等のカップリング剤で被覆した導電性金属粒子5を使用するのが好ましく、当該導電性金属粒子5では、濃度2〜5%の塩水を24時間噴霧するサイクルを3回繰り返す塩水噴霧テストや60℃/500時間の高温・高湿テストや−40℃の低温から60℃の高温へを20〜30サイクル繰り返すヒートサイクルテストの環境テストを実施しても環境テスト前と後とにおける導電性能がいずれも0.6Ω以下という安定した値を示している。   The conductive metal particles 5 are preferably subjected to oxidation / corrosion prevention treatment. Specifically, oxygen and moisture enter the metal particle interface due to the extremely small adhesion between the metal particles and the vehicle and the metal particles are oxidized to reduce the conductivity. It is preferable to use conductive metal particles 5 coated with a coupling agent such as an amine-based material of less than mass%, an organic material of less than 2 mass%, a titanate-based material, an aluminate-based material, a zirconate-based material, and a silane-based material. For Particle 5, a salt spray test that repeats a cycle of spraying 2-5% salt water for 24 hours three times, a high temperature / high humidity test of 60 ° C / 500 hours, and a low temperature of -40 ° C to a high temperature of 60 ° C 20 Even when the environmental test of the heat cycle test repeated for 30 cycles is performed, the conductive performance before and after the environmental test shows a stable value of 0.6Ω or less.

前記ビヒクル含浸性基材2としては、樹脂成形時の成型温度・圧力に耐えることができ、前記塗工材を含浸又は吸着することができ、前記導電性金属粒子5が通過しない不織布、布、網目状シート等の折り曲げ変形自在な繊維状樹脂であればよいが、電磁波遮蔽層9を形成後、当該電磁波遮蔽層9から剥がし易い材料を使用するのが好ましい。具体的には、熱可塑性・熱硬化性合成樹脂(ポリエステル、ナイロン、ポリプロピレン、アラミド等)や麻、絹、綿等の天然繊維で製造された繊維状、網目状又はマット状の布や不織布、折り曲げ自在でビヒクルが容易に含浸・浸透するものであれば、紙や、ガラスマット、ガラスクロス等のシート状無機材料、その他の材料を使用できる。   The vehicle-impregnated substrate 2 can withstand the molding temperature and pressure during resin molding, can impregnate or adsorb the coating material, and does not allow the conductive metal particles 5 to pass through. A fibrous resin that can be bent and deformed, such as a mesh sheet, may be used, but it is preferable to use a material that is easily peeled off from the electromagnetic wave shielding layer 9 after the electromagnetic wave shielding layer 9 is formed. Specifically, a fiber-like, mesh-like or matte-like cloth or nonwoven fabric made of thermoplastic / thermosetting synthetic resin (polyester, nylon, polypropylene, aramid, etc.) or natural fiber such as hemp, silk, cotton, etc. Paper, a sheet-like inorganic material such as a glass mat or glass cloth, and other materials can be used as long as they can be bent and the vehicle can easily be impregnated and penetrated.

熱プレス法による加熱・加圧によって、図3(加熱・加圧前における塗工材層の金属粒子構造を示す倍率×230の図面代用電子顕微鏡写真)及び図4(加熱・加圧後における電磁波遮蔽層の金属粒子構造を示す倍率×180の図面代用電子顕微鏡写真)に示すように、加熱・加圧後では塗工材層3とビヒクル含浸性基材2との間にビヒクル層が形成されるので、電磁波遮蔽層9からビヒクル含浸性基材2を容易に剥がすことができる。金属粒子5の周りにあるビヒクル4が加熱と加圧によりビヒクル含浸性基材2に吸着されて金属粒子5が圧着されることにより、導電性が得られる。   FIG. 3 (electron micrograph of drawing substitute of magnification × 230 showing the metal particle structure of the coating material layer before heating / pressing) and FIG. 4 (electromagnetic wave after heating / pressing) by heating / pressing by the hot press method. A vehicle layer is formed between the coating material layer 3 and the vehicle-impregnated substrate 2 after heating and pressurization, as shown in a drawing-substituting electron micrograph at 180 × showing the metal particle structure of the shielding layer). Therefore, the vehicle-impregnated base material 2 can be easily peeled from the electromagnetic wave shielding layer 9. The vehicle 4 around the metal particles 5 is adsorbed to the vehicle-impregnated substrate 2 by heating and pressurization, and the metal particles 5 are pressure-bonded, whereby conductivity is obtained.

なお、当該図3及び図4において、加熱・加圧前の電子顕微鏡写真(図3)では、塗工材層3中の導電性金属粒子(Cu)5はビヒクル4によって覆われており、Cu粒子5同士の密着・固着性が不完全であるが、加熱・加圧後の電子顕微鏡写真(図4)では、加熱温度180℃、熱プレス加圧280kgf/cm2によって加熱されたビヒクル4が溶融してビヒクル含浸性基材2に含浸し、Cu粒子5が押し潰されてCu粒子5同士が密着・固着されて電磁波遮蔽層9が形成されている。本例では、加熱・加圧前の塗工材層3の厚さ200μmに対して加熱・加圧によって形成された電磁波遮蔽層9の厚さは75μmとなっていた。 3 and 4, in the electron micrograph before heating and pressurization (FIG. 3), the conductive metal particles (Cu) 5 in the coating material layer 3 are covered with the vehicle 4, and Cu The adhesion / adhesion between the particles 5 is incomplete, but in the electron micrograph after heating / pressing (FIG. 4), the vehicle 4 heated at a heating temperature of 180 ° C. and a hot press pressure of 280 kgf / cm 2 is shown. The vehicle impregnated base material 2 is melted and impregnated, and the Cu particles 5 are crushed and the Cu particles 5 are adhered and fixed to each other to form the electromagnetic wave shielding layer 9. In this example, the thickness of the electromagnetic wave shielding layer 9 formed by heating and pressing was 75 μm with respect to the thickness of 200 μm of the coating material layer 3 before heating and pressing.

また、電磁波遮蔽層9は熱プレス法に替えて真空成形法、圧空成形法等による加熱・加圧によって形成してもよい。   Further, the electromagnetic wave shielding layer 9 may be formed by heating / pressing by a vacuum forming method, a pressure forming method or the like instead of the hot pressing method.

実施の形態2. Embodiment 2. FIG.

本実施の形態はプラズマディスプレイ(以下、「PDP」ともいう。)の後面筐体(樹脂成形体)に電磁波シールド対策を施した電磁波遮蔽樹脂成形体であり、図5はプラズマディスプレイ筐体の縦断面図、図6はプラズマディスプレイの後面筐体の型成形を説明する一部縦断面図、図7はプラズマディスプレイの後面筐体の縦断面図である。これらの図において、図1,図2と同一符号は同一又は相当部分を示し、13は電磁波遮蔽処理が施されている後面筐体(樹脂成形体)7からなるPDP筐体であり、当該PDP筐体13は前面筐体14と後面筐体7とによって形成されており、電気回路基板15と、フレキシブルケーブルによって電気回路基板15に接続された表示パネル16と、電気回路基板15と表示パネル16との間に設けられた金属シャーシ17と、画面を覆う前面フィルター18とから構成されている。そして、後面筐体7の電磁波遮蔽処理を施す面8には電磁波遮蔽層9が形成されている。従って、本実施の形態においては、後面筐体7と電磁波遮蔽層9とからなるPDP後面筐体成形体が電磁波遮蔽樹脂成形体6である。   This embodiment is an electromagnetic wave shielding resin molded body in which a rear surface casing (resin molded body) of a plasma display (hereinafter also referred to as “PDP”) is provided with an electromagnetic shielding measure. FIG. FIG. 6 is a partial longitudinal sectional view for explaining the molding of the rear casing of the plasma display, and FIG. 7 is a longitudinal sectional view of the rear casing of the plasma display. In these drawings, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts, and reference numeral 13 denotes a PDP casing composed of a rear casing (resin molded body) 7 that has been subjected to electromagnetic wave shielding treatment. The housing 13 is formed by a front housing 14 and a rear housing 7, and includes an electric circuit board 15, a display panel 16 connected to the electric circuit board 15 by a flexible cable, and the electric circuit board 15 and the display panel 16. Between the metal chassis 17 and the front filter 18 covering the screen. An electromagnetic wave shielding layer 9 is formed on the surface 8 of the rear housing 7 on which electromagnetic wave shielding processing is performed. Therefore, in the present embodiment, the PDP rear case molded body composed of the rear case 7 and the electromagnetic wave shielding layer 9 is the electromagnetic wave shielding resin molded body 6.

次に、電磁波遮蔽樹脂成形体の製造方法を図6を参照して説明する。   Next, the manufacturing method of the electromagnetic wave shielding resin molding will be described with reference to FIG.

先ず、導電性基材シート1を導電性基材シート供給装置19にセットして金型キャビティ20と金型コア21との間に金型キャビティ20側に塗工材層3が向くように挿入して塗工材層面を成形樹脂(金型成形される後面筐体7)12の処理面8に位置付け、次いで、金型コア21とエジェクターピン22とエジェクタプレート23とを移動させて型締めして加熱筒24のスクリュウ25を駆動させて加熱筒24内部の溶融樹脂26を金型内部に射出注入する。これにより、塗工材層3は成形樹脂12に密着して180〜350℃の樹脂温度によってビヒクル4が溶融して成形樹脂12の内面に固着し、ビヒクル4がビヒクル含浸性基材2に含浸・吸着され、塗工材層3中の導電性金属粒子5が300〜800kgf/cm2の射出成形圧力によって圧延・変形されて導電性金属粒子5同士の密着が起こって電磁波遮蔽層9が形成される。この後、金型を開いて導電性基材シート1を成形された後面筐体7から剥離すれば、ビヒクル4によって後面筐体7の内面に強固に固着した電磁波遮蔽層9が該内面に転写された状態で残り、電磁波シールド対策を施したPDP後面筐体成形体(電磁波遮蔽樹脂成形体)6が得られる。 First, the conductive base sheet 1 is set in the conductive base sheet supply device 19 and inserted between the mold cavity 20 and the mold core 21 so that the coating material layer 3 faces the mold cavity 20 side. Then, the coating material layer surface is positioned on the processing surface 8 of the molding resin (rear housing 7 to be molded) 12, and then the mold core 21, ejector pins 22 and ejector plate 23 are moved and clamped. Then, the screw 25 of the heating cylinder 24 is driven to inject and inject the molten resin 26 inside the heating cylinder 24 into the mold. As a result, the coating material layer 3 is in close contact with the molding resin 12 and the vehicle 4 melts and adheres to the inner surface of the molding resin 12 at a resin temperature of 180 to 350 ° C., and the vehicle 4 impregnates the vehicle-impregnated substrate 2. -Adsorbed, the conductive metal particles 5 in the coating material layer 3 are rolled and deformed by an injection molding pressure of 300 to 800 kgf / cm 2 to cause the conductive metal particles 5 to adhere to each other, thereby forming an electromagnetic wave shielding layer 9. Is done. Thereafter, when the mold is opened and the conductive base sheet 1 is peeled off from the molded rear case 7, the electromagnetic wave shielding layer 9 firmly fixed to the inner surface of the rear case 7 by the vehicle 4 is transferred to the inner surface. In this state, a PDP rear case molded body (electromagnetic wave shielding resin molded body) 6 is obtained which is subjected to electromagnetic wave shielding measures.

本実施の形態では、折り曲げ変形自在なシート状ビヒクル含浸性基材2を使用して電磁波遮蔽層9を形成することにより、PDP後面筐体成形体6の屈曲部コーナー部においてひび割れやしわのない電磁波遮蔽樹脂成形体を形成することができる。   In the present embodiment, the electromagnetic wave shielding layer 9 is formed using the sheet-like vehicle-impregnated base material 2 that can be bent and deformed, so that there are no cracks or wrinkles at the corners of the bent portion of the PDP rear case molded body 6. An electromagnetic wave shielding resin molding can be formed.

実施の形態3. Embodiment 3 FIG.

図8は熱プレス法による電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図であり、同図において、図1,図2,図5〜図7と同一符号は同一又は相当部分を示し、本実施の形態では、熱プレス上型27と熱プレス下型28とを開いた状態で樹脂シート29の上面(処理面)に基材シート1の塗工材層3を向けて熱プレス上型・下型27,28間に挿入して設置し、この後、図8の(a)に示すように、熱プレス上型27と熱プレス下型28とを閉じ、続いて、金型内の樹脂シート29と基材シート1とを加熱して油圧によって加圧プレスを実施する。これにより、図8の(b)に示すように、樹脂シート29が型成形されて該樹脂シート29の処理面に溶融したビヒクル4が接着して樹脂シート29とビヒクル4とが固着すると共に、ビヒクル含浸性基材2にビヒクル4が含浸・吸着され、さらに、油圧プレスの圧力により塗工材層3中の導電性金属粒子5が樹脂シート29とビヒクル含浸性基材2との間で加圧・圧延されて電磁波遮蔽層9が形成される。図8の(c)に示すように、プレス機が冷却後、電磁波遮蔽層9が形成されている樹脂シート29を取り出して基材シート1のビヒクル含浸性基材2を剥がせば、樹脂シート29を型成形した樹脂成形体7と電磁波遮蔽層9とからなる電磁波遮蔽樹脂成形体6が得られる。   FIG. 8 is a longitudinal sectional view for explaining a production process of an electromagnetic wave shielding resin molded body by a hot press method, in which the same reference numerals as those in FIGS. 1, 2 and 5 to 7 denote the same or corresponding parts, In the present embodiment, the hot press upper die 27 with the coating material layer 3 of the base sheet 1 facing the upper surface (treated surface) of the resin sheet 29 with the hot press upper die 27 and the hot press lower die 28 opened. -Insert between the lower dies 27 and 28, and then close the hot press upper die 27 and the hot press lower die 28 as shown in FIG. The resin sheet 29 and the base sheet 1 are heated and a pressure press is performed by hydraulic pressure. As a result, as shown in FIG. 8B, the resin sheet 29 is molded and the molten vehicle 4 adheres to the treated surface of the resin sheet 29, so that the resin sheet 29 and the vehicle 4 are fixed, The vehicle-impregnated base material 2 is impregnated and adsorbed with the vehicle 4, and the conductive metal particles 5 in the coating material layer 3 are added between the resin sheet 29 and the vehicle-impregnated base material 2 by the pressure of the hydraulic press. The electromagnetic wave shielding layer 9 is formed by pressing and rolling. As shown in FIG. 8C, after the press machine is cooled, the resin sheet 29 on which the electromagnetic wave shielding layer 9 is formed is taken out and the vehicle-impregnated substrate 2 of the substrate sheet 1 is peeled off. An electromagnetic wave shielding resin molded body 6 composed of the resin molded body 7 obtained by molding 29 and the electromagnetic wave shielding layer 9 is obtained.

実施の形態4. Embodiment 4 FIG.

図9はシート状電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図であり、同図において、図1,図2,図5〜図8と同一符号は同一又は相当部分を示し、本実施の形態では、押出成形機30より押し出された加熱状態のシート状樹脂31の処理面に基材シート1の塗工材層3が当接するように基材シート1を供給装置32にセットし、加圧ローラ33に通してシート状樹脂31に対して基材シート1を圧着することにより、シート状樹脂31とビヒクル4とが固着すると共に、ビヒクル含浸性基材2にビヒクル4が含浸・吸着され、同時に、塗工材層3中の導電性金属粒子5がシート状樹脂31とビヒクル含浸性基材2との間で加圧・圧延されて電磁波遮蔽層9が形成され、シート状樹脂31により成形された樹脂成形体7と電磁波遮蔽層9とからなる電磁波遮蔽樹脂成形体6が得られる。なお、34はガイドローラ、35は巻き取り装置である。   FIG. 9 is a longitudinal sectional view for explaining the manufacturing process of the sheet-like electromagnetic wave shielding resin molding, in which the same reference numerals as those in FIGS. 1, 2, and 5 to 8 denote the same or corresponding parts. In this embodiment, the base material sheet 1 is set in the supply device 32 so that the coating material layer 3 of the base material sheet 1 comes into contact with the treated surface of the heated sheet-like resin 31 extruded from the extruder 30. By pressing the base sheet 1 against the sheet-shaped resin 31 through the pressure roller 33, the sheet-shaped resin 31 and the vehicle 4 are fixed, and the vehicle-impregnated base material 2 is impregnated and adsorbed with the vehicle 4. At the same time, the conductive metal particles 5 in the coating material layer 3 are pressed and rolled between the sheet-like resin 31 and the vehicle-impregnated base material 2 to form the electromagnetic wave shielding layer 9, and the sheet-like resin 31 is formed. Electromagnetic wave shielding comprising a resin molded body 7 and an electromagnetic wave shielding layer 9 molded by The covering resin molding 6 is obtained. Reference numeral 34 denotes a guide roller, and 35 denotes a winding device.

実施例1:不規則形状Cu粒子5(商品名:FCC-115A:福田金属箔粉工業株式会社製)とビヒクル4(商品名:PETインキ900-N:十条ケミカル株式会社製)とを80重量部:20重量部の割合で配合して塗工材を得た。当該塗工材をビヒクル含浸性基材2(ナイロン製タフタ織り布)の面に2回重ね塗りのスクリーン印刷を施して指触乾燥状態の塗工材層3を形成し、導電性基材シート1を得た。 Example 1: 80 weights of irregularly shaped Cu particles 5 (trade name: FCC-115A: manufactured by Fukuda Metal Foil Powder Co., Ltd.) and vehicle 4 (trade name: PET ink 900-N: manufactured by Jujo Chemical Co., Ltd.) Part: A coating material was obtained by blending at a ratio of 20 parts by weight. The coating material is screen-printed twice on the surface of the vehicle-impregnated base material 2 (nylon taffeta woven fabric) to form a coating material layer 3 in a dry-to-touch state, and a conductive base material sheet 1 was obtained.

前記導電性基材シート1を使用して図6に示す実施の形態2に基づき、使用樹脂:ABS(商品名:930N:東レ株式会社製),成形温度:250℃,金型温度:60℃,射出圧力:一次圧650kgf/cm2,二次圧400kgf/cm2,保圧時間:15秒,冷却時間:45秒の射出成形条件によって、成形樹脂12により成形された後面筐体7と電磁波遮蔽層9とからなるPDP後面筐体成形体(電磁波遮蔽樹脂成形体)6を形成した。 Based on Embodiment 2 shown in FIG. 6 using the conductive base sheet 1, resin used: ABS (trade name: 930N: manufactured by Toray Industries, Inc.), molding temperature: 250 ° C., mold temperature: 60 ° C. , Injection pressure: Primary pressure 650kgf / cm 2 , Secondary pressure 400kgf / cm 2 , Holding time: 15 seconds, Cooling time: 45 seconds Under the injection molding conditions, the rear housing 7 and electromagnetic waves molded with the molding resin 12 A PDP rear case molded body (electromagnetic wave shielding resin molded body) 6 composed of the shielding layer 9 was formed.

電磁波遮蔽層9の厚さは120μm、電気抵抗値0.6Ω,電界−62dBのシールド性能であった。なお、電気抵抗値の測定には、株式会社エー・アンド・ディ製AD-5523測定距離100mmを使用し、電界測定はKEC法により、アンリツ株式会社MA8202,0.1-1000Mzを使用した。   The electromagnetic wave shielding layer 9 had a thickness of 120 μm, an electric resistance value of 0.6Ω, and an electric field of −62 dB. The electrical resistance value was measured using an AD-5523 measuring distance of 100 mm manufactured by A & D Co., Ltd., and the electric field was measured by KEC method using Anritsu MA8202, 0.1-1000Mz.

実施例2:図9に示す実施の形態4に基づき、使用樹脂:ABS(商品名:930N:東レ株式会社製),シリンダー温度:210〜230℃,ダイス温度:230℃,樹脂温度:240℃,ロール温度:80℃の押し出し成形条件にてロール間寸法2mmのシート厚さのシート状樹脂31を得、該シート状樹脂31を使用して図8に示す実施の形態3に基づき、実施例1で得た導電性基材シート1を使用してシート加熱温度:180℃,加熱プレス圧力:280kgf/cm2,加圧・冷却時間:60秒の熱プレス条件によってPDP後面筐体成形体(電磁波遮蔽樹脂成形体)6を形成した。 Example 2: Resin used: ABS (trade name: 930N: manufactured by Toray Industries, Inc.), cylinder temperature: 210-230 ° C, die temperature: 230 ° C, resin temperature: 240 ° C, based on Embodiment 4 shown in FIG. , Roll temperature: a sheet-like resin 31 having a sheet thickness of 2 mm between rolls is obtained under extrusion molding conditions of 80 ° C., and the sheet-like resin 31 is used and the example is based on the third embodiment shown in FIG. Using the conductive base sheet 1 obtained in 1 above, the PDP rear case molded body (sheet heating temperature: 180 ° C., heating press pressure: 280 kgf / cm 2 , pressurization / cooling time: 60 seconds under hot press conditions ( An electromagnetic wave shielding resin molded body) 6 was formed.

実施例3:実施例2のシート状樹脂31を使用して実施例1で得た導電性基材シート1を用いてシート加熱温度:180℃,圧空圧力(エアー圧力):10〜15kgf/cm2,加圧・冷却時間:60秒の圧空成形条件によってPDP後面筐体成形体(電磁波遮蔽樹脂成形体)6を形成した。 Example 3: Using the conductive base sheet 1 obtained in Example 1 using the sheet-like resin 31 of Example 2, sheet heating temperature: 180 ° C., pressure pressure (air pressure): 10 to 15 kgf / cm 2. Pressurization / cooling time: A PDP rear case molded body (electromagnetic wave shielding resin molded body) 6 was formed under pressure forming conditions of 60 seconds.

実施例2及び3のPDP後面筐体成形体は、いずれも電磁波遮蔽層9の厚さ120μm、電気抵抗値0.6Ω,電界−62dBのシールド性能であった。   Each of the PDP rear case molded bodies of Examples 2 and 3 had a shielding performance of the electromagnetic wave shielding layer 9 having a thickness of 120 μm, an electric resistance value of 0.6Ω, and an electric field of −62 dB.

本発明によれば、電磁波を発生するプラズマディスプレイ等の電気製品や電子機器の筐体部は勿論のこと、建築物資材や自動車部品等、電磁波遮蔽を必要とする電磁波遮蔽樹脂成形体に利用できる。   INDUSTRIAL APPLICABILITY According to the present invention, it can be used for an electromagnetic wave shielding resin molded body that requires electromagnetic wave shielding, such as a building material and an automobile part, as well as an electric product such as a plasma display that generates electromagnetic waves and a casing part of an electronic device. .

従って、本発明の産業上利用性は非常に高いといえる。   Therefore, it can be said that the industrial applicability of the present invention is very high.

導電性基材シートの縦断面図である。It is a longitudinal cross-sectional view of an electroconductive base material sheet. 電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図である。It is a longitudinal cross-sectional view explaining the manufacturing process of an electromagnetic wave shielding resin molding. 加熱・加圧前における塗工材層の金属粒子構造を示す倍率×230の図面代用電子顕微鏡写真である。It is a drawing substitute electron micrograph of the magnification x230 which shows the metal-particle structure of the coating material layer before a heating and pressurization. 加熱・加圧後における電磁波遮蔽層の金属粒子構造を示す倍率×180の図面代用電子顕微鏡写真である。2 is a drawing-substituting electron micrograph at a magnification of × 180 showing the metal particle structure of the electromagnetic wave shielding layer after heating and pressing. プラズマディスプレイ筐体の縦断面図である。It is a longitudinal cross-sectional view of a plasma display housing. プラズマディスプレイの後面筐体の型成形を説明する一部縦断面図である。It is a partial longitudinal cross-sectional view explaining the shaping | molding of the rear surface housing | casing of a plasma display. プラズマディスプレイの後面筐体の縦断面図である。It is a longitudinal cross-sectional view of the rear housing | casing of a plasma display. 熱プレス法による電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図である。It is a longitudinal cross-sectional view explaining the manufacturing process of the electromagnetic wave shielding resin molding by a hot press method. シート状電磁波遮蔽樹脂成形体の製造工程を説明する縦断面図である。It is a longitudinal cross-sectional view explaining the manufacturing process of a sheet-like electromagnetic wave shielding resin molding.

符号の説明Explanation of symbols

1 導電性基材シート
2 ビヒクル含浸性基材
3 塗工材層
4 ビヒクル
5 導電性金属粒子
6 電磁波遮蔽樹脂成形体
7 樹脂成形体
8 処理面(電磁波遮蔽処理を施す面)
9 電磁波遮蔽層
12 成形樹脂
13 PDP筐体(電磁波遮蔽樹脂成形体)
29 樹脂シート(樹脂成形体)
DESCRIPTION OF SYMBOLS 1 Conductive base material sheet 2 Vehicle impregnation base material 3 Coating material layer 4 Vehicle 5 Conductive metal particle 6 Electromagnetic wave shielding resin molding 7 Resin molding 8 Treated surface (surface which performs electromagnetic shielding treatment)
9 Electromagnetic wave shielding layer 12 Molding resin 13 PDP housing (electromagnetic wave shielding resin molding)
29 Resin sheet (resin molding)

Claims (1)

ビヒクル中に導電性金属粒子を分散して含有する塗工材を折り曲げ変形自在のビヒクル含浸性基材面に指触乾燥状態に積層してなる導電性基材シートの該塗工材層を成形される樹脂成形体の電磁波遮蔽処理を施す面となる位置に配置し、当該樹脂成形体を成形する際に、当該導電性基材シートを加熱・加圧して塗工材層を成形される樹脂成形体の電磁波遮蔽処理を施す面に密着させると共に塗工材層のビヒクルをビヒクル含浸性基材に含浸させて樹脂成形体と導電性基材シートとの間に塗工材層の導電性金属粒子が圧延・変形された電磁波遮蔽層を形成し、この後、当該電磁波遮蔽層を樹脂成形体の電磁波遮蔽処理を施す面に残した状態で導電性基材シートを樹脂成形体から剥離・除去することを特徴とする電磁波遮蔽樹脂成形体の製造方法。 Forming the coating material layer of a conductive substrate sheet formed by laminating a coating material containing conductive metal particles dispersed in a vehicle on a vehicle-impregnated substrate surface that can be bent and deformed in a dry touch state. The resin molded body is disposed at a position to be a surface to be subjected to electromagnetic wave shielding treatment, and when molding the resin molded body, the conductive base material sheet is heated and pressurized to form a coating material layer. Conductive metal of the coating material layer is placed between the resin molded body and the conductive base material sheet by adhering the vehicle of the coating material layer to the vehicle-impregnated base material while closely contacting the surface of the molded body to which electromagnetic wave shielding treatment is performed. Form an electromagnetic wave shielding layer in which particles are rolled and deformed, and then peel and remove the conductive substrate sheet from the resin molded body in a state where the electromagnetic wave shielding layer is left on the surface to be subjected to the electromagnetic wave shielding treatment of the resin molded body. Manufacturing method of electromagnetic wave shielding resin molded article characterized by
JP2007176484A 2007-07-04 2007-07-04 Method for producing electromagnetic wave shielding resin molding Expired - Fee Related JP4873247B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007176484A JP4873247B2 (en) 2007-07-04 2007-07-04 Method for producing electromagnetic wave shielding resin molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007176484A JP4873247B2 (en) 2007-07-04 2007-07-04 Method for producing electromagnetic wave shielding resin molding

Publications (2)

Publication Number Publication Date
JP2009016564A true JP2009016564A (en) 2009-01-22
JP4873247B2 JP4873247B2 (en) 2012-02-08

Family

ID=40357118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007176484A Expired - Fee Related JP4873247B2 (en) 2007-07-04 2007-07-04 Method for producing electromagnetic wave shielding resin molding

Country Status (1)

Country Link
JP (1) JP4873247B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013028115A (en) * 2011-07-29 2013-02-07 Toda Kogyo Corp Method for producing molded article, and molded article
WO2014181926A1 (en) * 2013-05-10 2014-11-13 경은산업(주) Mobile phone case cover fabric having electromagnetic wave shielding function and method for manufacturing same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020195A (en) * 1983-07-14 1985-02-01 株式会社東芝 Device for fixing inert gas
JPS61162095A (en) * 1985-01-11 1986-07-22 セイコーインスツルメンツ株式会社 Musical sound generator
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave
JPH01149833A (en) * 1987-12-07 1989-06-12 Kurimoto Ltd Reinforced filmy formed article having high electric conductivity and production thereof
JPH0328642U (en) * 1989-07-28 1991-03-22
JPH05102694A (en) * 1991-10-07 1993-04-23 Ado Union Kenkyusho:Kk Electromagnetic shielding material and manufacture thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020195A (en) * 1983-07-14 1985-02-01 株式会社東芝 Device for fixing inert gas
JPS61162095A (en) * 1985-01-11 1986-07-22 セイコーインスツルメンツ株式会社 Musical sound generator
JPS61225900A (en) * 1985-03-29 1986-10-07 大日本印刷株式会社 Transfer sheet for shielding electromagnetic wave
JPH01149833A (en) * 1987-12-07 1989-06-12 Kurimoto Ltd Reinforced filmy formed article having high electric conductivity and production thereof
JPH0328642U (en) * 1989-07-28 1991-03-22
JPH05102694A (en) * 1991-10-07 1993-04-23 Ado Union Kenkyusho:Kk Electromagnetic shielding material and manufacture thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013028115A (en) * 2011-07-29 2013-02-07 Toda Kogyo Corp Method for producing molded article, and molded article
WO2014181926A1 (en) * 2013-05-10 2014-11-13 경은산업(주) Mobile phone case cover fabric having electromagnetic wave shielding function and method for manufacturing same

Also Published As

Publication number Publication date
JP4873247B2 (en) 2012-02-08

Similar Documents

Publication Publication Date Title
US20050208251A1 (en) Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials
KR101038033B1 (en) Circuit board, method of forming wiring pattern, and method of manufacturing circuit board
JP6521138B1 (en) CONDUCTIVE COMPOSITION FOR MOLDED FILM, MOLDED FILM, MOLDED BODY, AND METHOD FOR PRODUCING THE SAME
US20050178496A1 (en) Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials
US20050173145A1 (en) Electromagnetic wave shield gasket and its manufacturing method
CN104797420B (en) Stacked film and shielding printed wiring board
JPWO2009035059A1 (en) Conductive film, conductive member, and method of manufacturing conductive film
CN102047777A (en) Electromagnetic-wave shielding material, and printed-wiring board
CN103858178B (en) Composition metal surface
CN103597551A (en) Electrically conductive sheet and process for producing same, and electronic component
KR101739809B1 (en) Printed wiring board, printed wiring board manufacturing method, and electronic apparatus
JP6860821B2 (en) Conductive paste and manufacturing method of three-dimensional circuit
JP4873247B2 (en) Method for producing electromagnetic wave shielding resin molding
US10703925B2 (en) Electrically-conductive ink formulations containing microcrystalline cellulose, methods of printing electrically-conductive traces, and laminates containing the same
CN106883786A (en) A kind of preparation method of comprehensive thermal setting conductive glue
CN207362133U (en) A kind of incorgruous type conductive fabric glue of multilayer
JP2005340764A (en) Electromagetic wave shield gasket and its manufacturing method
JP4673573B2 (en) Method for manufacturing electromagnetic shielding material
CN107852817A (en) The manufacture method of printed circuit board and printed circuit board diaphragm and sheet layered product for methods described
JP2606504B2 (en) Electromagnetic wave shielding material and method of manufacturing the same
WO2002067274A2 (en) PRECIOUS METAL CLAD Ni/C CONDUCTIVE FILLERS AND CONDUCTIVE POLYMERS MADE THEREFROM
JP2008192792A (en) Conductive sheet molded body and its molding method
CN211509708U (en) Electromagnetic wave shielding film and printed wiring board with electromagnetic wave shielding film
CN110324959A (en) Electromagnetic shielding film, shielding printed wiring board and the manufacturing method for shielding printed wiring board
CN111385973A (en) Method for manufacturing printed wiring board with electromagnetic wave shielding film

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111011

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111025

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111109

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141202

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees