JP2009016381A - Printed wiring board structure, component mounting method and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board structure that can tightly support a shield case with high position accuracy along the height direction, enables high-density wiring to straddle the inside and outside of the shield case, and facilitates reworking. <P>SOLUTION: The printed wiring board structure includes: a printed wiring board 11; a component mounting surface 11A provided on the printed wiring board 11; a plurality of engagement grooves (recessed groove) 11a provided in the component mounting surface 11A; a lock pattern 11p provided in an internal layer of the printed wiring board 11 and formed of a conductor communicating with the engagement grooves 11a; and the shield case 12 which has a plurality of terminals 12a for fixation engaged with the engagement grooves 11a, and is mounted on the component mounting while having a lock position regulated by the lock pattern 11p. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a printed wiring board structure mounted with a shield case.

In a printed wiring board that handles a high-frequency signal and is applied to an electronic device such as a personal computer, a printed wiring board mounted with a shield case is applied. Conventionally, as a mounting structure for a shield case in a printed wiring board, a two-piece structure constituted by a shield cover and a pedestal that removably supports the shield cover, or a groove formed in the printed wiring board is formed. A mounting structure in which a shield case is fitted into this fitting groove and mounted on a printed wiring board by soldering, and further, a conductor pattern for mounting the shield case is formed on the printed wiring board, and the shield case is soldered to this conductive pattern. There is a structure to do.
Japanese Patent Laid-Open No. 10-335882 Japanese Patent Laid-Open No. 06-216563

  Among the various mounting structures described above, the two-piece structure is excellent in reworkability, but requires a mounting space for mounting the pedestal and has a problem in economy because of the two-piece structure. In addition, the mounting structure that forms the fitting groove in the printed wiring board forms the fitting groove over almost the entire circumference of the shield case mounting part, so that the connection of the wiring pattern straddling the inside and outside of the shield case becomes complicated. There is a problem that the formation area of the wiring pattern is greatly limited, and high-density wiring straddling the inside and outside of the shield case is difficult. In addition, the mounting structure that forms the conductor pattern for mounting the shield case on the printed wiring board forms a conductor pattern that surrounds the shield case mounting surface of the printed wiring board, so that the wiring pattern straddles the inside and outside of the shield case. There is a problem that the connection becomes complicated and the formation area of the wiring pattern is greatly limited, and high-density wiring straddling the inside and outside of the shield case is difficult. Furthermore, the mounting structure in which the groove is formed in the printed wiring board and the mounting structure in which the conductor pattern for attaching the shield case is formed on the printed wiring board are mounted by soldering over the entire circumference of the shield case, respectively. There was a problem in reworkability because of the structure. In addition, the mounting structure in which the conductor pattern for mounting the shield case is formed on the printed wiring board, when the printed wiring board (circuit board) is warped by reflow heating, thermal stress after installation, or mechanical stress such as impact The structure was easy to peel off when subjected to.

  In the printed wiring board structure in which the shield case is mounted, the present invention can firmly support the shield case with high positional accuracy in the height direction, enables high-density wiring straddling the inside and outside of the shield case, and facilitates rework. An object of the present invention is to provide a printed wiring board structure.

  The present invention provides a printed wiring board, a component mounting surface provided on the printed wiring board, a plurality of engagement grooves provided on the component mounting surface, and the engagement provided on an inner layer of the printed wiring board. A locking pattern formed by a conductor communicating with the joint groove, and a plurality of fixing terminals; the fixing terminal is engaged with the engaging groove; and a locking position is defined by the locking pattern; A printed wiring board structure including a shield case mounted on a component mounting surface is characterized.

  Further, the present invention is a component mounting method for mounting a shield case on a component mounting surface of a printed wiring board, wherein a plurality of fixing terminals are provided in an opening of the shield case, and the component mounting surface of the printed wiring board is provided. Provided with a concave groove into which the fixing terminal of the shield case is inserted, and a conductor locking pattern is formed on the inner layer of the printed wiring board in communication with the bottom of the concave groove. The fixing terminal is inserted into the concave groove provided on the component mounting surface of the printed wiring board up to a locking position defined by the locking pattern, and conductively connected to the locking pattern by solder bonding, The shield case is mounted on the component mounting surface of the printed wiring board.

  Moreover, this invention is an electronic device provided with the electronic device main body and the circuit board provided in this electronic device main body, Comprising: The said circuit board is a printed wiring board and components provided in the said printed wiring board A mounting surface, a plurality of engagement grooves provided on the component mounting surface, a locking pattern formed in a conductor communicating with the engagement groove, provided in an inner layer of the printed wiring board, and a plurality of fixings And a shield case that is mounted on the component mounting surface with the fixing terminal engaged with the engaging groove and having a locking position defined by the locking pattern. It is characterized by that.

  It is possible to provide a printed wiring board structure that can firmly support the shield case with high positional accuracy in the height direction, enables high-density wiring across the inside and outside of the shield case, and facilitates rework.

Embodiments of the present invention will be described below with reference to the drawings.
The printed wiring board structure according to the first embodiment of the present invention is shown in FIGS.

  As shown in FIGS. 1 and 2, the printed wiring board structure according to the first embodiment of the present invention includes a printed wiring board 11, a component mounting surface 11A provided on the printed wiring board 11, and the component mounting surface. A plurality of engaging grooves (concave grooves) 11a provided in 11A, a locking pattern 11p formed in a conductor communicating with the engaging grooves 11a provided in an inner layer of the printed wiring board 11, and a plurality of A shield case 12 having a fixing terminal 12a, the fixing terminal 12a being engaged with the engaging groove 11a, the locking position being defined by the locking pattern 11p, and being mounted on the component mounting surface; It is provided and configured.

  The printed wiring board 11 is composed of, for example, a multilayer printed wiring board having 4 to 8 layers. The component mounting surface 11A of the printed wiring board 11 has a plurality of electronic components 13, 13, electromagnetically shielded by the shield case 12 in a mounting surface (shield case mounting surface) on which the shield case 12 is mounted in a plan view. Are mounted in advance before the shield case is mounted. Engaging grooves 11a are provided at predetermined intervals so as to surround the shield case mounting surface. The engagement groove 11a is formed by, for example, a non-through via in which conductive plating 11h is provided in a circular hole in plan view.

  On the predetermined inner layer surface of the printed wiring board 11, a locking pattern 11p having a predetermined land diameter is provided in advance at the position where the engagement groove 11a is formed. The locking pattern 11p can also be used as a circuit component that constitutes a low impedance circuit such as a ground (GND) pattern or a power supply (VCC) pattern that forms a power supply path. Here, each locking pattern 11p is circuit-connected to a ground (GND) pattern. A hole having a predetermined diameter is bored from the component mounting surface 11A toward the locking pattern 11p, and an electrically conductive plating 11h is provided in the hole, thereby forming an engagement groove 11a that is electrically connected to the locking pattern 11p. .

  The fixing terminal 12a of the shield case 12 is inserted into the engaging groove 11a provided on the component mounting surface 11A up to the bottom of the groove, and the fixing terminal 12a is soldered to the engaging groove 11a by solder (s). As a result, the shield case 12 is mounted on the component mounting surface 11 </ b> A of the printed wiring board 11.

  With such a shield case mounting structure, the shield case 12 mounted on the component mounting surface 11A of the printed wiring board 11 has a high position that requires almost no error margin in which the height direction is positioned by the locking pattern 11p. It is mounted on the component mounting surface 11A with accuracy. Further, since the fixing terminal 12a is locked to the locking pattern 11p via the engaging groove 11a, the shield case 12 can be firmly mounted on the component mounting surface 11A, and is stable against thermal stress and mechanical stress. The mounting state can be maintained. In addition, since there are no conductor patterns, straight grooves, etc. that hinder the wiring pattern between the in-plane and out-of-plane surfaces of the shield case mounting surface, In addition, a high-density wiring pattern can be formed. Further, by heating the fixing terminal 12a of the shield case 12 with, for example, hot air, the shield case 12 can be easily removed from the component mounting surface 11A, and the reworking operation can be performed easily and quickly.

  FIG. 3 shows a component mounting process of the printed wiring board structure according to the first embodiment.

  In step S <b> 1 shown in FIG. 3, cream solder is printed on the component mounting surface 11 </ b> A of the printed wiring board 11. In this step S1, cream solder is printed on the solder joint surfaces of the electronic components 13, 13,... Mounted in the shield case mounting surface of the component mounting surface 11A.

  In step S2, an electronic component is mounted on the component mounting surface 11A. In this step S2, the electronic components 13, 13,... Mounted in the shield case mounting surface are mounted at predetermined component mounting positions.

  In step S3, the shield case 12 is mounted. In step S3, the fixing terminals 12a, 12a,... Provided on the shield case 12 engage with the engaging grooves 11a, 11a,. The shield case 12 is mounted on the shield case mounting surface of the mounting surface 11A.

  In step S4, reflow heating is performed. In the reflow heating in step S4, the electronic components 13, 13,... Mounted in the shield case mounting surface are respectively solder-mounted, and the fixing terminals 12a, 12a,. Are mounted on the component mounting surface 11A of the printed wiring board 11 by solder mounting on the locking patterns 11p, 11p,.

  Thereby, as described above, the shield case 12 is mounted on the component mounting surface 11A of the printed wiring board 11 with high positional accuracy defined by the locking pattern 11p. Further, since the fixing terminal 12a is joined and supported to the locking pattern 11p via the engaging groove 11a by solder (s), the shield case 12 is firmly mounted on the component mounting surface 11A.

  FIG. 4 illustrates an example of a process for forming the engagement pattern 11p and the engagement groove 11a provided on the engagement pattern 11p in the printed wiring board 11. Here, a step (a-b1-c1-d1) of performing the drilling of the engaging groove (concave groove) 11a by laser processing and a step of performing the drilling of the engaging groove (concave groove) 11a ( a-b2-c2) example. In the step (a-b1-c1-d1) in which the engagement groove (concave groove) 11a is drilled by laser processing, it corresponds to the arrangement of the locking pattern 11p formed on the pattern formation surface of the inner layer of the printed wiring board 11. Then, the copper foil 11b on the surface layer is peeled off by etching (a-b1), and a hole reaching the locking pattern 11p from the surface layer is formed on the locking pattern 11p by laser processing (c1). By conducting conductor plating (d1) in this hole, an engaging groove (concave groove) 11a having a non-penetrating via structure conducting to the engaging pattern 11p can be formed on the engaging pattern 11p. In the step (a-b2-c2) of drilling the engagement groove (concave groove) 11a by drilling, the arrangement of the locking pattern 11p formed on the pattern formation surface of the inner layer of the printed wiring board 11 is as follows. Drilling is performed to reach the locking pattern 11p from the surface layer (a-b2). By conducting conductor plating in this hole (c2), an engaging groove (concave groove) 11a having a non-penetrating via structure conducting to the engaging pattern 11p can be formed on the engaging pattern 11p.

  A printed wiring board structure according to a second embodiment of the present invention is shown in FIGS.

  The first embodiment described above is configured by the non-penetrating via in which the conductive plating 11h is provided in the circular hole in plan view, whereas in the second embodiment, the planar surface reaches the locking pattern 11p from the surface layer. An oblong hole is formed by viewing, and an engagement groove (concave groove) 11a is formed by this hole.

  Even in such a component mounting structure, the shield case 12 can be mounted on the component mounting surface 11A on the component mounting surface 11A of the printed wiring board 11 with high positional accuracy defined by the locking pattern 11p. In addition, since the fixing terminal 12a is soldered and supported to the locking pattern 11p by solder (s), the shield case 12 is firmly attached to the component mounting surface 11A against thermal stress and mechanical stress. To be implemented. In addition, since there are no conductor patterns, straight grooves, etc. that hinder the wiring pattern between the in-plane and out-of-plane of the shield case mounting surface, there is no gap between the in-plane and out-of-plane of the shield case mounting surface. In addition, a high-density wiring pattern can be formed. Further, by heating the fixing terminal 12a of the shield case 12 with, for example, hot air, the shield case 12 can be easily removed from the component mounting surface 11A, and the reworking operation can be performed easily and quickly.

  In the first embodiment, the engagement groove (concave groove) 11a is formed as a circular hole in a plan view, and in the second embodiment, the engagement groove (concave groove) 11a is formed as an ellipse in a plan view. However, it may be formed in various hole shapes such as a rectangular shape in plan view or an S-shape in plan view.

A third embodiment of the present invention is shown in FIG.
In the third embodiment, an electronic apparatus is configured by applying the printed wiring board structure manufactured according to the first embodiment. FIG. 7 shows an example in which the printed wiring board structure according to the first embodiment is applied to a small electronic device such as a hand-held portable computer.

  In FIG. 7, the main body 2 of the portable computer 1 is provided with a display unit housing 3 so as to be rotatable via a hinge mechanism. The main body 2 is provided with operation units such as a pointing device 4 and a keyboard 5. The display unit housing 3 is provided with a display device 6 such as an LCD.

  Further, the main body 2 is provided with a circuit board (mother board) 8 in which a control circuit for controlling the operation device such as the pointing device 4 and the keyboard 5 and the display device 6 is incorporated. The circuit board 8 is realized by applying the printed wiring board structure of the first embodiment shown in FIGS.

  The printed circuit board 8 includes a printed wiring board 11, a component mounting surface 11A provided on the printed wiring board 11, a plurality of engaging grooves (concave grooves) 11a provided on the component mounting surface 11A, and A locking pattern 11p formed by a conductor communicating with the engagement groove 11a provided in the inner layer of the printed wiring board 11 and a plurality of fixing terminals 12a, the fixing terminal 12a being the engagement groove A shield case 12 which is engaged with 11a and has a locking position defined by the locking pattern 11p and mounted on the component mounting surface.

  The printed circuit board 8 is mounted on the component mounting surface 11A with high positional accuracy because the shield case 12 mounted on the component mounting surface 11A of the printed wiring board 11 is positioned in the height direction by the locking pattern 11p. Is done. Further, since the fixing terminal 12a is locked to the locking pattern 11p via the engaging groove 11a, the shield case 12 can be firmly mounted on the component mounting surface 11A against heat stress and mechanical stress. In addition, since there are no conductor patterns, straight grooves, etc. that hinder the wiring pattern between the in-plane and out-of-plane surfaces of the shield case mounting surface, In addition, a high-density wiring pattern can be formed. Further, by heating the fixing terminal 12a of the shield case 12 with, for example, hot air, the shield case 12 can be easily removed from the component mounting surface 11A, and the reworking operation can be performed easily and quickly.

1 is a perspective view showing a printed wiring board structure according to a first embodiment of the present invention. The sectional side view which shows the printed wiring board structure which concerns on the said 1st Embodiment. Process drawing which shows the component mounting process of the printed wiring board structure which concerns on the said 1st Embodiment. Process drawing which shows the process of the latching pattern and engagement groove | channel which concern on embodiment of this invention. The sectional side view which shows the printed wiring board structure which concerns on 2nd Embodiment of this invention. The perspective view which shows the structure of the shield case mounting part which concerns on the said 2nd Embodiment. The perspective view which shows the structure of the electronic device which concerns on 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Portable computer, 2 ... Main body, 3 ... Display part housing | casing, 4 ... Pointing device, 5 ... Keyboard, 6 ... Display device, 8 ... Circuit board (mother board), 11 ... Printed wiring board, component mounting surface 11A ..., 11a ... engaging groove (concave groove), 11h ... conductive plating, 11p ... locking pattern, 12 ... shield case, 12a ... fixing terminal, 13 ... electronic component.

Claims (6)

A printed wiring board;
Component mounting surface provided on the printed wiring board;
A plurality of engagement grooves provided on the component mounting surface;
A locking pattern formed by a conductor provided in an inner layer of the printed wiring board and communicating with the engaging groove;
A shield case comprising a plurality of fixing terminals, wherein the fixing terminals are engaged with the engaging grooves, and a locking position is defined by the locking pattern and mounted on the component mounting surface;
A printed wiring board structure characterized by comprising:   2. The printed wiring board structure according to claim 1, wherein the fixing terminal of the shield case is electrically connected to the locking pattern by solder bonding in the engagement groove.   The printed wiring board structure according to claim 1, wherein the engagement groove is circular or rectangular in a plan view.   The printed wiring board structure according to claim 1, wherein the shield case and the locking pattern form a power circuit. A component mounting method for mounting a shield case on a component mounting surface of a printed wiring board,
Provide a plurality of fixing terminals in the opening of the shield case,
A concave groove into which the fixing terminal of the shield case is inserted is provided on the component mounting surface of the printed wiring board, and a conductor locking pattern is formed on the inner layer of the printed wiring board in communication with the bottom of the concave groove. Forming
The fixing terminal of the shield case is inserted into the concave groove provided on the component mounting surface of the printed wiring board to the locking position defined by the locking pattern, and is electrically connected to the locking pattern by soldering. A component mounting method comprising connecting and mounting the shield case on the component mounting surface of the printed wiring board. Comprising an electronic device main body and a circuit board provided in the electronic device main body,
The circuit board is
A printed wiring board;
Component mounting surface provided on the printed wiring board;
A plurality of engagement grooves provided on the component mounting surface;
A locking pattern formed by a conductor provided in an inner layer of the printed wiring board and communicating with the engaging groove;
A shield case comprising a plurality of fixing terminals, wherein the fixing terminals are engaged with the engaging grooves, and a locking position is defined by the locking pattern and mounted on the component mounting surface;
An electronic apparatus comprising:

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