JP2009016099A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment devised to improve on failures generated by change with time or the like of members fitted on its surface. <P>SOLUTION: The electronic equipment is made provided with an operating board for key inputting on the surface of a key input part made of a shape memory element capable of returning to a shape preliminarily memorized. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device including a key input unit.

  A mobile phone, which is a type of electronic device provided with a key input unit, has been required to be thin for carrying convenience and design. In particular, in a situation where the key input part is required to be thin, as an example of the thinning technique, the spring member used for the key input of the mobile phone is replaced with a shape memory alloy, so that the key input part is thinned. The technique which gave is disclosed (for example, refer patent document 1).

  In addition, as an example of thinning technology, mobile phones and other products that have a thin key input part using a metal operation panel with a key top of the key input part that the user presses with a finger in a sheet shape are also products. It has become. In the case of this metal operation plate, for example, the number displayed on the key top is formed by a through groove, and a rubber support plate having a convex portion is formed so as to close the through groove. It is provided on the back side. However, due to aging of the operation plate or the like, the operation plate may be deformed, and the operation plate may be turned up or peeled off. In order to explain this problem in more detail, a specific example will be described below.

  FIG. 8 is a front view illustrating an example of an operation plate made of stainless steel (metal). FIG. 9 is an enlarged view of the number zero key top portion shown in FIG. In the operation panel 20 shown in FIG. 8, grooves (21 a to 21 e) for separating input keys such as numbers, characters, symbols and the like represented by diagonal lines and input keys also represented by diagonal lines are through grooves. These through-grooves are closed by providing a rubber support plate 22 having a convex portion described later on the back side of the operation plate 20. In addition, in FIG. 8, the part shown with the oblique line has drawn the figure after the through-groove was plugged up with rubber | gum.

  In the mobile phone employing the stainless steel operation panel 20, an external load is applied when the user presses the key top. For example, a part of the numeral “0” indicated by the symbol a in FIG. The connecting portion between the inner portion surrounded by the through groove and the outer portion thereof may be deformed due to secular change or the like because the strength is structurally weak. As a result, the portion indicated by the symbol b in FIG. 9, that is, the inner portion substantially surrounded by the through groove may be turned up.

  Further, description will be made with reference to FIG. 10 which is a cross-sectional view taken along line X-X ′ of FIG. 9. The support plate 22 is a support member having a convex portion having a shape corresponding to the shape of the through groove so as to close the through groove. For example, in the support plate 22, the portions of reference numerals 22a and 22b, which are portions positioned in the shape of the number zero shown in FIG. 9, and the portions of reference numerals 22c and 22d that close the through grooves separating the input keys are convex. It has become. By providing the support plate 22 on the back side of the operation plate 20, the space between S1 and S2, which is part of the operation plate 20, and between S2 and S3, that is, the through groove portion is blocked. (FIG. 10A). However, as described above, there is a problem that deformation is caused by the secular change of the operation plate 20 and the b surface illustrated by the arrow is turned up as shown in FIG.

JP 2000-299031 A

  Then, an object of this invention is to provide the electronic device by which the device which improves the malfunction which generate | occur | produces by the secular change etc. of the member provided in the surface of an electronic device was considered in view of the said situation.

The electronic device of the present invention that achieves the above object is
It has a key input part,
A configuration is adopted in which a key input operation plate formed of a shape memory member capable of returning to a previously stored shape is provided on the surface of the key input unit.

  According to the electronic device of the present invention, since the operation plate is formed of a shape memory member that can be restored to the shape stored in advance, even if the operation plate itself is deformed due to secular change or the like, the original shape is obtained. Return to. Thereby, it has the outstanding effect that the fall of a user's operativity can be suppressed.

  The electronic device of the present invention is provided with a key input operation plate formed on a shape memory member capable of returning to a previously stored shape on the surface of the key input unit. As a result, as described above, even if the operation plate itself is deformed due to aging or the like, the original shape is restored.

  Moreover, in this invention, the said operation board takes the structure that it has the penetration groove | channel which penetrates the said operation board to a plate | board thickness direction. In the case of such a configuration, the operation plate is likely to be deformed in the vicinity of the through groove, but the deformation can be restored as described above. Therefore, deformation of the key surface can be suppressed while improving the design by forming the through groove.

  Moreover, in this invention, the said through-groove takes the structure that it has a curved or bent shape part. In the case of such a configuration, the operation plate is likely to be deformed near the curved or bent portion, but the deformation can be restored in the same manner as described above. Accordingly, it is possible to suppress the deformation of the key surface while further improving the design by forming the through groove in the curved or bent portion.

  Moreover, in this invention, the said through-groove employ | adopts the structure that it has a substantially C or a substantially U-shaped part. In the case of such a configuration, the substantially C or substantially U-shaped portion is weak in strength and particularly easily deformed, but the deformation can be restored in the same manner as described above. Accordingly, it is possible to suppress the deformation of the key surface while further improving the design by forming a substantially C or substantially U-shaped through groove on the operation plate.

  Further, in the present invention, the through groove is a groove having a shape for displaying an identifier indicating the type of the key displayed on the operation panel and / or a groove having a shape for separating each key from each other. Take the configuration. Thereby, even if it is a case where the said through-groove is used for the character of a key or a division | segmentation in order to aim at the improvement of design property and functionality, as above-mentioned, the deformation | transformation of a key surface can be suppressed.

  Moreover, in this invention, the structure of providing the support member which has a convex-shaped part so that the said through-groove may be plugged in on the back side of the said operation board is taken. Accordingly, as described above, the operation plate is supported by the support member while suppressing the deformation of the key surface, so that the key configuration can be stabilized and the strength can be improved.

  Here, in this invention, the shape memory member which forms the said operation board takes the structure that it is a shape memory alloy which returns to the shape memorize | stored previously in a specific temperature range. As a result, the shape memory alloy can change the range of a specific temperature range by changing the composition of the alloy, so it is possible to select an operation plate of a shape memory alloy that can return the shape appropriately according to the application. it can.

  Further, the present invention adopts a configuration in which the specific temperature region is a temperature at which the battery dissipates heat when the battery built in the electronic device is charged. Thereby, even if it is a case where the shape of a shape memory alloy changes, the shape of the operation board deform | transformed by the heat_generation | fever from the said battery at the time of charge of a battery can be restored.

  In the present invention, the specific temperature region is 30 ° C. or higher and 40 ° C. or lower. As a result, the user's body temperature is transmitted to the operation plate by heat conduction when the user grips it with the hand when using the electronic device, and the shape of the shape memory alloy can be recovered by this heat.

  Furthermore, the present invention adopts a configuration in which the shape memory alloy is composed of any one of a NiTi alloy, a NiTiCo alloy, and a NiTiCu alloy. Thereby, since these shape memory alloys have different ranges of temperature regions in which the shape is recovered, it is possible to select a suitable shape memory alloy operation plate according to the application.

Here, the assembling method of the present invention that achieves the above object is as follows.
A method of assembling an electronic device having a key input unit,
A configuration is adopted in which an operation plate assembling step is provided in which a key input operation plate made of a shape memory element capable of returning to a shape stored in advance is provided on the surface of the key input portion.

  According to the assembling method of the present invention, in the operation plate assembling step, a key input operation plate made of a shape memory element capable of returning to a previously stored shape is provided on the surface of the key input portion. Thereby, the electronic device by which the device which improves the malfunction which generate | occur | produces by the secular change etc. of the member provided in the surface of an electronic device was given is obtained.

  Moreover, in this invention, before the said operation board assembly | attachment process, the structure of having the through-groove formation process which forms the through-groove penetrated in the plate | board thickness direction in the operation board is taken. In this case, the operation plate is likely to be deformed in the vicinity of the through groove, but the shape memory element returns to the shape stored in advance. Therefore, deformation of the key surface can be suppressed while improving the design by forming the through groove.

  Furthermore, in this invention, the said operation board assembly | attachment process takes the structure that the support member which has a convex part is provided in the back side of the said operation board so that the said through-groove formed in the said operation board may be plugged up. Accordingly, the operation plate is supported by the support member while suppressing the deformation of the key surface, so that the key configuration can be stabilized and the strength can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Hereinafter, a mobile phone will be described as an example of the electronic device, but the present invention can be applied to any electronic device having a key input unit.

[Constitution]
FIG. 1 is a front view of a mobile phone which is an embodiment of the electronic apparatus of the present invention. As shown in FIG. 1, the mobile phone 1 is a foldable mobile phone including an upper housing 11 and a lower housing 12 that are hinged to each other by a hinge portion 13 and opened and closed. The upper housing 11 has a display unit 14 made of a liquid crystal LCD (LCD: Liquid Crystal Display) for liquid crystal display. The lower housing 12 is provided with a key input unit 5. The key input unit 5 forms a sheet-like sheet key by assembling a support plate 151 described later to the operation plate 15. Note that the operation plate 15 of the mobile phone 1 shown in FIG. 1 shows a state after the support plate 151 is assembled.

  FIG. 2 is a main block diagram of the mobile phone. As shown in this figure, the mobile phone 1 is provided with a control unit 2, a memory 3, and a battery 4.

  The control unit 2 is a central processing unit (CPU), and comprehensively controls the operation of the mobile phone 1 via the data bus 8. The memory 3 is a nonvolatile memory, and stores a program executed by the control unit 2 and the like. The battery 4 is a power source of the mobile phone. In the battery 4 of this embodiment, when the battery is charged, the heat radiation temperature from the battery becomes about 40 ° C., and the shape recovery of the shape memory alloy becomes possible as will be described later.

  In addition, the mobile phone 1 is provided with a display unit 14, a key input unit 5, an audio processing unit 6, a radio unit 7, and an antenna 71. The display unit 14 and the key input unit 5 are as described above. The voice processing unit 6 processes voice collected by a microphone and voice output from a speaker when using a mobile phone. The wireless unit 7 transmits and receives radio waves via the antenna 71. In this embodiment, a foldable mobile phone is used. However, the mobile phone is not necessarily a foldable mobile phone, and may be a mobile phone other than the foldable mobile phone.

  FIG. 3 is a front view illustrating an example of an operation plate made of a shape memory alloy. The operation plate 15 is a substantially rectangular thin plate member that covers substantially one surface of the lower housing 12 of the mobile phone 1. The operation plate 15 is formed with a plurality of through grooves penetrating in the thickness direction. The through groove is formed, for example, in order to represent an identifier representing the type of each key on the operation panel 15 or to partition each key (identifier) region. Specifically, first, a plurality of linear through-grooves 15a to 15e are formed along the horizontal direction, and through-grooves that are cut vertically are formed so as to be connected to the respective linear through-grooves 15a to 15e. Has been. As a result, each key area surrounded by an L-shaped or U-shaped groove is formed. In addition, numbers (0 to 9) and symbols (*, #, phone symbols, etc.) are formed in the through groove, and the identifier itself is displayed.

  At this time, for example, the numeral “0” is not formed as a completely annular through groove, but has a shape in which a part of the groove is interrupted. In other words, the operation plate 15 is formed in an alphabetic “C” shape having an opening in a part so that the inner part and the outer part of “0” are connected. Note that the position of the opening is arbitrary. Thereby, the internal part of the number “0” is not separated from the main body of the operation plate 15. In addition, in the case of other annular portions such as the numbers “6”, “8”, “9”, etc., similarly, a character in which an opening for connecting the inner portion and the outer portion is formed in part. A through groove is formed in the shape. Note that the through grooves of these numbers “0”, “6”, “8”, and “9” are examples of through grooves having a curved portion according to the present invention, and the input key “#” shown in FIG. The through groove of “” corresponds to an example of the through groove having a bent portion according to the present invention.

  FIG. 4 is a diagram illustrating an example of the shape recovery temperature of the shape memory alloy that is a material for forming the operation plate 15. In FIG. 4, in the case of a NiTi (nickel titanium) alloy, the Ni content (%) is 54 to 56%, and the rest is Ti. In this case, the shape recovery temperature is 20 to 100 ° C. In the case of a NiTiCo (nickel titanium cobalt) alloy, the Ni content (%) is 53 to 55%, the Co content (%) is 1 to 3%, and the remainder is Ti. In this case, the shape recovery temperature is −30 to 30 ° C. In the case of a NiTiCu (nickel titanium copper) alloy, the Ni content (%) is 53 to 55%, the Cu content (%) is 5 to 9%, and the remainder is Ti. In this case, the shape recovery temperature is 40 to 70 ° C. This figure is an example, and the shape memory alloy employed in the present invention is not limited to NiTi, NiTiCo, or NiTiCu.

  In this embodiment, a NiTiCu shape memory alloy that can recover its shape at about 40 ° C. is used for the operation plate 15. Thereby, when the battery is charged, the heat dissipation temperature of the battery is transmitted to the operation plate 15 by heat conduction, and when the operation plate 15 is heated to about 40 ° C., the shape can be recovered even if the deformation is caused.

  FIG. 5 is a front view illustrating an example of a support plate. The support plate 151 corresponds to an example of a support member according to the present invention. The support plate 151 is made of rubber and has a thin plate shape. And the convex part of the convex shape which respond | corresponds to the shape of the through-groove for the number, character, figure, and division formed in the operation board 15 mentioned above on the surface, and closes the said through-groove is formed. . The support plate 151 is assembled to the operation plate 15 from the back side of the operation plate 15 as described later. At this time, the convex portion formed on the support plate 151 is fitted into the through groove formed on the operation plate 15, and the through groove is closed by the convex portion. Accordingly, the operation plate 15 and the support plate 151 are integrated, and the both plates 15 and 151 are thin plates, so that a relatively thin sheet key is configured. Next, the assembly method of the present invention will be described.

  FIG. 6 is a flowchart showing an example of an assembling method of the mobile phone 1. First, a through groove penetrating in the thickness direction of the NiTiCu shape memory alloy operation plate is formed (step S101, through groove forming step). As a result, the operation plate 15 shown in FIG. 3 is formed. Subsequently, the support plate 151 is assembled to the back surface of the NiTiCu shape memory alloy operation plate 15 (step S102, operation plate assembly step). At this time, it is assembled so that the shape of the convex portion formed on the support plate 151 matches the shape of the through groove of the operation plate 15. As a result, the through groove of the operation plate 15 shown in FIG. 3 is closed by the convex portion of the support plate 151, and the operation plate 15 of the shape memory alloy of NiTiCu is provided on the surface of the key input unit 5. The assembling method may be an adhesive or a double-sided tape. Moreover, you may carry out by insert molding.

  After that, as described above, the sheet key formed by assembling the support plate 151 to the operation plate 15 is assembled to the lower housing 12 of the mobile phone. The mobile phone 1 can be configured by assembling other components.

  FIG. 7 is a cross-sectional view of a key input portion of the mobile phone having the above-described configuration, particularly a sheet key portion in which an operation plate and a support plate are assembled. First, as shown in FIG. 7 (a), the sheet key composed of the operation plate 15 and the support plate 151 is not deformed in the operation plate 15 in the initial state, and the operation plate 15 is not turned over. Absent. Here, FIG. 7B shows a case where the operation plate 15 has its b surface illustrated by an arrow deformed due to secular change or the like and turned up. However, since the operation plate 15 of the present invention is a NiTiCu shape memory alloy, unlike the stainless steel operation plate 22 shown in FIG. 10, the heat radiated from the battery 4 shown in FIG. When the operation plate 15 is raised to about 40 ° C. by this, the b surface portion of the operation plate 15 turned up can be restored to its original shape (FIG. 7C).

  As described above, since the operation plate 15 is a shape memory alloy, even if the operation plate 15 is deformed due to secular change or the like, it returns to its original shape. Thereby, the user's operability can be improved.

  The deformation of the operation plate 15 as described above is particularly caused by a portion where the through groove is formed by being curved or bent, such as a numeral “0” formed in a substantially C or substantially U shape. This is likely to occur at the part, and also at the separation part of each key. Therefore, the present invention is particularly effective for a mobile phone that requires the formation of the numerals and separators as described above in the through groove.

  Next, a second embodiment of the present invention will be described. The mobile phone in the present embodiment has substantially the same configuration as that of the first embodiment described above, but the composition of the shape memory alloy forming the operation plate 15 is different. For example, a NiTi alloy having a shape recovery temperature of about 30 degrees is employed. This temperature assumes, for example, the heat of the human body, that is, the temperature of the user's hand. Thus, while the user is using the mobile phone, the body temperature is transmitted from the hand to the operation panel 15 of the mobile phone by heat conduction. Then, the shape memory alloy which forms the operation plate 15 with such heat is heated to the shape recovery temperature, and the shape recovery is performed. Therefore, deformation of the operation plate 15 can always be suppressed during use, and user operability can be improved. As described above, the shape memory alloy whose shape recovers to about 30 degrees is an example, and when the operation plate 15 is formed so as to recover the shape by the heat of the human body, the range of human body temperature, for example, 30 It is preferable to use a shape memory alloy that recovers its shape within a range of from 40 degrees to 40 degrees.

  Here, the means for heating the operation plate 15 formed of the shape memory alloy is not limited to the heat dissipation from the battery or the body temperature of the user as described above, and any heat may be used. For example, the heat generated from the internal circuit by using a mobile phone may heat the operation plate 15 and the shape of the operation plate 15 may be recovered. In this case, it is desirable to use a shape memory alloy for the operation plate 15 that recovers its shape at a temperature that can be reached by the operation plate 15 heated by heat from the internal circuit. In addition, the shape recovery temperature of the shape memory alloy forming the operation plate 15 is not limited to the above-described temperature, and may be set to any temperature.

  The present invention can be used for an electronic device having a key input unit such as a mobile phone, and has industrial applicability.

It is a front view of the mobile phone which is one Example of the electronic device of this invention. It is a main block block diagram of the said mobile telephone. It is a front view showing an example of the operation board which consists of shape memory alloys. It is a figure showing an example of the shape recovery temperature of a shape memory alloy. It is a front view showing an example of a support plate. 3 is a flowchart illustrating an example of an assembling method of the mobile phone 1. It is sectional drawing of the key input part of the mobile telephone of the structure mentioned above, especially the sheet | seat key part which assembled | attached the operation board and the support plate. It is a front view showing an example of the operation board made from stainless steel (metal). It is an enlarged view of the key top part of the number zero shown in FIG. FIG. 10 is a cross-sectional view taken along line X-X ′ of FIG. 9.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mobile phone 2 Control part 3 Memory 4 Battery 5 Key input part 6 Audio | voice processing part 7 Radio | wireless part 8 Data bus 11 Upper housing | casing 12 Lower housing | casing 13 Hinge part 14 Display part 15 Operation board 15a-15e Groove 20 Operation board 21a- 21e groove 22 support plate 71 antenna 151 support plate

Claims (13)

An electronic device having a key input unit,
An electronic apparatus, wherein a key input operation plate formed of a shape memory member capable of returning to a previously stored shape is provided on a surface of the key input unit.   The electronic device according to claim 1, wherein the operation plate has a through groove that penetrates the operation plate in a plate thickness direction.   The electronic device according to claim 2, wherein the through groove has a curved or bent portion.   The electronic device according to claim 2, wherein the through groove has a substantially C or U-shaped portion.   The through-groove is a groove having a shape for displaying an identifier representing a type of a key displayed on the operation plate and / or a groove having a shape for partitioning each key. The electronic device according to any one of 2 to 4.   The electronic apparatus according to claim 2, wherein a support member having a convex portion is provided on a back side of the operation plate so as to close the through groove.   The shape memory member that forms the operation plate is a shape memory alloy that returns to a shape stored in advance in a specific temperature region, according to any one of claims 1 to 6. Electronics.   The electronic device according to claim 7, wherein the specific temperature region is a temperature at which the battery dissipates heat when a battery built in the electronic device is charged.   The electronic device according to claim 7, wherein the specific temperature range is 30 ° C. or more and 40 ° C. or less.   The electronic device according to claim 7, wherein the shape memory alloy is made of any one of a NiTi alloy, a NiTiCo alloy, and a NiTiCu alloy. A method of assembling an electronic device having a key input unit,
An assembly of electronic devices, comprising an operation plate assembling step of providing a key input operation plate formed on a shape memory member capable of returning to a previously stored shape on the surface of the key input portion. Attaching method.   12. The electronic device assembling method according to claim 11, further comprising a through groove forming step of forming a through groove penetrating in the thickness direction of the operation plate before the operation plate assembling step. 13. The electronic device according to claim 12, wherein in the operation plate assembly step, a support member having a convex portion is provided on the back side of the operation plate so as to close the through groove formed in the operation plate. How to assemble equipment.

Images