JP2009012434A - Liquid ejection head, image forming apparatus, and manufacturing method for liquid ejection head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid ejection head which hardly causes defects by enhancing the flatness of an ejection surface, an image forming apparatus which is equipped with the liquid ejection head, and a manufacturing method for the liquid ejection head. <P>SOLUTION: This liquid ejection head comprises a channel layer with a liquid chamber 3 which is formed of a plated layer on a conductive layer 7, and a top plate layer which is formed by plating the channel layer and which serves as a top plate 11 for the liquid chamber 3. In the liquid ejection head, a conductive layer 8 different from the plated layer is formed on the inner wall surface of the liquid chamber 3 provided with the top plate 11, and continuously formed among the plurality of liquid chambers 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid discharge head that discharges liquid by applying energy to the liquid, an image forming apparatus using the liquid discharge head, and a method of manufacturing the liquid discharge head.

Printers, copiers, facsimiles with communication systems, word processors with printer units, and other industrial recording devices combined with various processing devices, paper, thread, fiber, fabric, leather, metal, Recording is performed on a recording medium such as plastic, glass, wood, and ceramic.
Here, “recording” not only applies an image having a meaning such as a character or a figure to a recording medium, but also applies an image having no meaning such as the entire surface or a pattern to the recording medium. This means that image formation, printing, printing, and printing are also used synonymously.
In an industrial recording apparatus, in order to apply these images to a recording medium, it is known to use a liquid discharging head that discharges liquid onto the recording medium. Various configurations of such a liquid discharging head are also proposed. (For example, see Patent Documents 1 and 2).

In Patent Document 1, a first conductive layer is formed on a substrate, a mold material is formed on the substrate in the shape of a flow path, and then a second material is formed on the mold material so as not to contact the first conductive layer. The conductive layer is formed, and a metal film by plating is formed around the mold material by using the first conductive layer and the second conductive layer, thereby communicating with the discharge port and the discharge port on the substrate. A technique for manufacturing a flow path without a bonding step is disclosed.
Patent Document 2 discloses a diaphragm having a diaphragm portion deformed by displacement of an electromechanical transducer or a nozzle plate having a nozzle hole communicating with an ink liquid chamber, and a liquid chamber forming an ink liquid chamber corresponding to the diaphragm portion. A technique for integrally forming the partition walls with electroformed metal is disclosed.
In addition, although the present applicant is a technology before publication, in Japanese Patent Application No. 2006-02984, as a technology for reducing the uneven thickness of the flow path plate, which is a problem when joining the flow path plate and another member, Proposed that the flow path plate in which the path is formed is made of plated metal, and that a plurality of hollow portions without metal are provided along the flow path array outside the flow path array area where the plurality of flow paths are arranged. ing.
When electroplating is performed on a certain surface of the pattern, the electric field is concentrated on a thin pattern or a pattern having a small area, and the growth rate of the portion becomes larger than the others. When a plating layer is grown on the second conductive layer described in Patent Document 1, the growth rate of the plating layer varies depending on the width of the groove portion of the mold material, which is the portion where the plating layer grows.

The electric field strength increases in the narrow part of the groove, and the plating layer grows quickly. For this reason, the height varies depending on the pattern. As a result, when the second plating layer is grown on the second conductive layer, the growth start point of the second plating layer varies depending on the pattern, and the thickness of the second plating layer varies. .
When such a second plating layer is applied to a diaphragm, the thickness of the diaphragm greatly affects the discharge performance. Therefore, when the thickness of the diaphragm varies, discharge variation occurs. The accuracy required for the thickness of the diaphragm is very high, and according to the conventional method, the diaphragm cannot be produced with a uniformity that can withstand practical use. Further, when the discharge port is formed in the second plating layer, there arises a problem that the discharge surface does not become flat.
Further, the plating layer grown from the first conductive layer reaches the second conductive layer depending on the pattern. When the plating layer grown from the first conductive layer reaches the second conductive layer somewhere, the plating layer starts to grow on the conductive second conductive layer, thereby increasing the plating area and the plating. The layer growth rate decreases.
The growth rate of the plating layer that does not reach the second conductive layer also decreases, and depending on the pattern and plating conditions, a portion that reaches the second conductive layer and a portion that does not reach it occur, and the liquid chamber cannot be sealed May be defective.
Further, when the plating layer on the first conductive layer is continuously performed with the plating layer on the second conductive layer, the plating layer on the first conductive layer is changed to the plating layer on the second conductive layer. The plating area changes. Therefore, the current density differs between the plated layer on the first conductive layer and the plated layer on the second conductive layer. However, the current density is the same in the plated layer on the first conductive layer or in the plated layer on the second conductive layer, and is uniform in the plane of each layer.
JP 2006-69203 A JP-A-11-105283

However, in Patent Document 1, in this case, if the plating layer on the first conductive layer has uneven thickness in the surface, the electroforming area gradually changes, and the current density changes with time accordingly. I will do it.
Therefore, the current density in the plane differs depending on whether the plating layer on the first conductive layer or the plating layer on the second conductive layer, and the surface property and crystal structure depending on the current density are in-plane. Unevenness will occur. If unevenness occurs in the surface property, crystal structure, etc., the contact resistance with the liquid and the liquid resistance against the liquid may become uneven or uncontrollable, causing variations and defects in the liquid ejection head.
In addition, when changing from a plated layer on the first conductive layer to a plated layer on the second conductive layer, the surface properties of the plated layer on the first conductive layer and the plated layer on the second conductive layer, the crystal structure, In order to correct the plating layer growth rate and the like, the current value may be changed when the plating changes from the plating on the first conductive layer to the second conductive layer.
Also in this case, there is a problem that the timing for switching the current value cannot be set if the thickness of the plating layer on the first conductive layer is uneven within the surface. Even if the current value is switched, the area gradually changes in the same manner as described above, and the current density gradually changes. Therefore, in-plane unevenness occurs in the surface properties and crystal structure of electroforming.
It is not realistic to adjust the current value with the gradually changing area. Since plating on the first conductive layer is continuously performed from plating on the first conductive layer, the thickness unevenness of the plating layer on the first conductive layer is made uniform by a method such as polishing. I can't.
In Patent Document 2, a liquid chamber partition wall that forms an ink liquid chamber corresponding to a diaphragm portion and a diaphragm having a diaphragm portion that is deformed by the displacement of an electromechanical conversion element are integrally formed of electroformed metal. Although the same problem as described above occurs due to the uneven thickness of the liquid chamber partition layer, no countermeasure is shown.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a liquid discharge head that improves the flatness of the discharge surface and has few defects in consideration of the above-described circumstances, and a forming apparatus and a method of manufacturing the liquid discharge head that include this liquid discharge head. There is to do.

In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that a flow path layer having a liquid chamber formed by a plating layer on a conductive layer, and a liquid layer formed by plating on the flow path layer and the liquid. A top plate layer serving as a top plate of a chamber, and a conductive layer different from the plating layer is formed on a wall surface of the liquid chamber of the top plate, and the conductive layer is continuously formed between the plurality of liquid chambers. It is formed.
According to a second aspect of the present invention, the liquid ejection head according to the first aspect is characterized in that a deformable diaphragm is formed on the top plate layer.
According to a third aspect of the present invention, the liquid ejection head according to the first aspect is characterized in that a discharge port for discharging a liquid is formed in the top plate layer.
According to a fourth aspect of the present invention, there are provided a plurality of liquid chamber rows in which a plurality of the liquid chambers are arranged, and the conductive layer is continuous between the plurality of liquid chamber rows. The liquid discharge head according to item 1 is characterized.
According to a fifth aspect of the present invention, in the flow path layer according to any one of the first to fourth aspects, a common liquid chamber in which a plurality of liquid chambers communicate in common via a fluid resistance portion is provided. Features a liquid discharge head.
According to a sixth aspect of the present invention, the flow path layer is provided with a pattern that does not communicate with the liquid chamber, and the interval between the partition walls is substantially the same as the width of the partition wall between the liquid chambers. A liquid discharge head according to claim 1.
The invention according to claim 7 is characterized in that the pattern is a pattern similar in shape and interval to the liquid chamber.
According to an eighth aspect of the present invention, in the image forming apparatus that prints and forms an image on a recording medium sent from the paper feeding unit, the liquid discharge head of the printing unit is any one of the first to seventh aspects. The image forming apparatus is equipped with a liquid discharge head.
The invention according to claim 9 is composed of at least two plating layers, at least one of the plating layers is a flow path layer in which a liquid chamber is formed, and the other plating layer is a top of the liquid chamber. A process for forming a mold material in a liquid chamber shape on a substrate in a manufacturing method of a liquid discharge head, which is a top plate layer to be a plate, and a conductive layer different from a plating layer is formed on a liquid chamber wall surface of the top plate A step of forming a conductive layer continuous between a plurality of the mold materials on the mold material, a step of forming a flow path layer by plating around the mold material, and the electrical connection between the flow path layer and the conductive layer. After the connection, the plating process is further performed to form the top plate layer, the plating process of the top plate layer is stopped at a predetermined thickness, and the mold material is removed to form the liquid chamber. And a step of performing.

According to the present invention, since the conductive layer is continuous between the plurality of liquid chambers, even if the growth rate of the plating layer for forming the partition between the liquid chambers varies depending on the location, a certain part When the plated layer reaches the conductive layer, the conductive layers on all the liquid chambers are energized, and the growth of the plated layer serving as the top plate on the liquid chambers starts simultaneously. Thus, a liquid discharge head having the same thickness of the top plate on all the liquid chambers can be obtained.
Further, the image forming apparatus equipped with the liquid discharge head according to the present invention can cause the droplets to land on the recording medium with an accurate droplet size and landing position by a head with small discharge variation, thereby forming an image by printing. In some cases, a high quality image can be obtained.
Further, according to the manufacturing method of the present invention, even when the growth rate of the plating layer for forming the partition between the liquid chambers varies depending on the location, when the plating layer reaches the conductive layer in a certain part. The conductive layers on all the liquid chambers are energized, and the growth of the plating layer serving as the top plate on the liquid chambers starts simultaneously. As a result, liquid discharge heads having the same top plate thickness on all the liquid chambers can be produced.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a thermal ink jet type liquid discharge head using thermal energy according to a first embodiment of the present invention. 1A is a plan perspective view, FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. 1A, FIG. 1C is a cross-sectional view taken along line BB ′ of FIG. 1A, and FIG. FIG.
1A to 1D, the liquid discharge head 1 has a flow path structure (flow path layer) including a liquid chamber 3 and a through-hole 2 serving as a liquid discharge port. . In FIG. 1, liquid is supplied to the liquid chamber 3 from the opening 5 penetrating the substrate 10, and the supplied liquid is heated and foamed by the heater 14 formed on the substrate 10 in the liquid chamber 3. The liquid is discharged from the through-hole serving as the liquid discharge port 2 by the pressure.
As will be described in detail later, the partition walls 9 and 9 b of the liquid chamber 3 are formed by a plating layer 6 formed above the substrate 10. The plated layer 6 is formed above the metal layer (conductive layer) 7. The top plate 11 forming the upper surface of the liquid chamber 3 has a laminated structure of the conductive layer 8 and the plating layer 6.

In FIG. 1, a plurality of liquid chambers 3 are arranged and have flow paths such as a fluid resistance portion 12 and a common liquid chamber 4 that are narrower than the liquid chamber 3, and the common liquid chamber 4 passes through the fluid resistance portion 12. Then, the liquid is supplied to the liquid chamber 3.
The liquid ejection head 1 of the present invention is characterized in that the conductive layer 8 is continuous between the plurality of liquid chambers 3. As will be described later in detail with respect to the manufacturing method, when the conductive layer 8 continues between the plurality of liquid chambers 3, the same thickness d of the top plate 11 on all the liquid chambers 3 is obtained.
Further, in the liquid discharge head 1 of the present invention, the pattern 25 that does not communicate with the liquid chamber 3 is formed, and the partition wall 9 around the flow path has substantially the same width as the partition wall 9 b between the liquid chambers 3. Yes. The width of the partition wall 9 around the flow path may be set between the partition wall width between the liquid chambers 3 and the partition wall width between the fluid resistance portions 12.

FIG. 2 is a process cross-sectional view schematically showing a manufacturing process of a liquid discharge head using thermal energy. Next, the concept of the manufacturing method will be described by taking the liquid discharge head using the thermal energy of the first embodiment shown in FIG. 1 as an example. Hereafter, each process of Fig.1 (a)-(l) is demonstrated using drawing.
In FIG. 2A, an insulating film 15 that insulates the substrate 10 from a heating element (not shown here) serving as a heater is formed on the surface of the substrate 10. A protective film 16 for preventing the substrate 10 other than a predetermined portion from being etched when forming an opening penetrating the substrate 10 on the back surface of the substrate 10 and the surface opposite to the insulating film 15. Form. The portion of the protective film 16 corresponding to the opening of the protective film 16 formed on the back surface is removed.
Here, as a material of the substrate 10, a silicon substrate, a glass substrate, a plastic substrate, or the like can be used. Any substrate can be used as long as it has the desired strength. However, a silicon substrate is used because it is easy to form highly integrated and high-density drive circuits by microfabrication technology, and it is easy to form a good quality insulating film by oxidation. It is preferable to use it.
When the substrate 10 is a silicon substrate, the insulating film 15 and the protective film 16 are easy to be finely processed. Therefore, silicon-based materials such as a silicon oxide (SiO ₂ ) film, a silicon nitride (SiNx) film, and a silicon oxynitride (SiON) film are used. An insulating film is preferred.
In the case of a silicon substrate, the opening penetrating the substrate 10 is anisotropic etching with an alkaline etching solution such as TMAH (tetramethylammonium hydride), KOH (potassium hydroxide), RIE, DeepRIE (ICP). For example, dry etching or sand blasting can be used.
However, anisotropic etching using an alkaline etching solution and Deep RIE (ICP) are easy to perform microfabrication, so it is preferable to use these, and a large number of substrates can be processed at one time. It is more preferable to employ isotropic etching.

When the substrate 10 is etched using anisotropic etching using an alkaline etching solution or DeepRIE (ICP), silicon-based materials such as a silicon oxide (SiO ₂ ) film, a silicon nitride (SiNx) film, and a silicon oxynitride (SiON) film are used. The insulating film 15 is preferably used because it is resistant to these etchings.
When a silicon-based insulating film is used as the protective film 16, the protective film 16 corresponding to the opening can be removed by ordinary dry etching using a photo resist pattern as a mask using a photolithography method.
In order to adjust the film stress and improve the adhesion, the insulating film 15 and the protective film 16 are, for example, a laminated film in which two or more kinds of films are laminated such as a laminated film of a silicon oxide film and a silicon nitride film. May be.

Next, in FIG. 2B, the heating resistor element 14 is formed on the insulating film 15. The heating resistor element 14 can be manufactured by using a normal semiconductor process such as a heater, an electrode, and wiring.
The heating resistance element 14 is formed on a heat resistant resistance material such as HfB ₂ , ZrB ₂ , TaN ₂ and TaSi via an intermediate layer (for example, Ti, Cr, etc.). In this case, the heating resistor element 14 is formed by laminating a wiring portion (for example, Al, Au, Ag, Cu, etc.) made of a metal that is a good electrical conductor so that the intermediate layer is exposed, and the exposed portion. Becomes the heater 14.
In addition, a protective film or the like for preventing electrolytic corrosion due to the liquid to be discharged or oxidation is formed on the heater and the electrode as necessary. In the figure, only a heat resistant resistor that is a part of the heater 14 is illustrated as a heater.
For example, the heat resistant material is formed by normal dry etching using the sputtering method on the insulating film 15 to form a film made of HfB ₂ and using the photolithography method with a desired pattern made of photoresist as a mask. can do.

In FIG. 2C, next, a conductive layer (first conductive layer) 17 (corresponding to the metal layer 7 in FIG. 1) serving as a seed film for plating is formed on the substrate 10. As the conductive layer 17, Pt, Au, Ag, Cu, Ni, or the like can be used.
The conductive layer 17 is preferably made of a low resistance material, and Pt, Au, Ag, Cu or the like is preferably used. In addition, in order to improve adhesiveness with the insulating film 15, it is also possible to make a laminated structure with Ti as a binder metal.
Since the wall surface of the liquid chamber is formed by plating, the conductive layer 17 does not need to be formed in a region that is inside the liquid chamber. The region inside the liquid chamber of the conductive layer 17 can be formed by photolithography, using the desired pattern made of photoresist as a mask and etching away the conductive layer 17 by normal dry etching.
Usually, an insulating film serving as a protective film is formed on the heater 14, but is omitted in this description.
Since the conductive layer 17 serves as a plating seed film, it is preferable that a voltage is supplied to the entire plating seed layer by supplying a voltage from one portion of the conductive layer 17. For this reason, it is preferable that the conductive layer 17 has no discontinuous portions on the substrate 10.

In FIG. 2D, next, a resin layer 18 that can be dissolved by a solvent for forming a first pattern 22 (described later) that forms the shape of the liquid chamber is formed on the substrate 10. Examples of a method for obtaining a desired pattern using a desired resin film include a printing method and a photolithography method. However, in order to obtain a fine shape, it is preferable to use a photosensitive resin and use a photolithography method.
In this step, the dissolvable resin layer 18 that forms the first pattern 22 to be a liquid chamber by being removed later is formed by, for example, applying using a spin coating method and then drying.
In FIG. 2E, a conductive layer (second conductive layer) 19 (corresponding to the conductive layer 8 in FIG. 1) is formed on the soluble resin layer 18. As the conductive layer, Ti, Pt, Au, Ag, Cu, Ni, or the like can be used.
The conductive layer on the substrate 10 is preferably made of a material having low resistance and resistance to the plating solution, and a material having a small ionization tendency such as Pt, Au, or Ag is preferably used. In this step, since it becomes easy to form a through-hole at the time of removing the mold material in a later step, the conductive layer in the region where the second pattern is formed may be removed with a laser or the like.

In FIG. 2F, a dissolvable resin layer 20 that forms a second pattern that later becomes a discharge port of a liquid chamber is applied by applying a resin similar to the resin layer 18 in the same manner. dry. The discharge port of the liquid chamber preferably has a tapered shape, and a positive photosensitive resin is preferably used.
In FIG. 2G, in order to pattern the conductive layer on the first pattern 22, a mask is used so that the dissolvable resin layer 20 forming the second pattern remains on the upper surface of the liquid chamber. To expose and develop. Using this resin pattern as a mask, the second conductive layer 19 is removed.
When the second conductive layer 19 is Pt, it can be removed by ion milling, and when it is Au and Ag, it can be removed by ion milling or wet etching.
Here, as a feature of the present invention, the second conductive layer 19 is continuous between the liquid chambers (in the figure, continuous between a plurality of liquid chambers arranged in the depth direction).

Next, in FIG. 2H, the resin layer 20 remaining on the second conductive layer 19 is exposed using a mask in order to form a second pattern 21 serving as a discharge port. Thereafter, the resin layer 18 is exposed and then developed to form a second pattern 21 serving as a discharge port, and a first pattern 22 formed of a laminated film of the resin layer 18 and the second conductive layer 19 forming a liquid chamber. By doing so, the flow path pattern 22a in which the liquid chamber and the discharge port are integrally formed is formed.
Here, in the liquid discharge head according to the present invention, the resin layer 18 is formed with a pattern 22b different from the flow path pattern 22a. In order to efficiently convert the discharge pressure generated in the liquid chamber into liquid discharge, the second pattern 21 preferably has a forward tapered shape.
That is, it is preferable that the area of the upper surface side of the second pattern 21 is smaller than the area of the first pattern 22 side. This shape can be realized by shifting the focus when a projection aligner is used in exposure, or by widening the gap between the photomask and the substrate when a proximity aligner is used.
Further, a forward tapered shape can be obtained by performing over-etching in development, using a gradation mask as a photomask, or performing exposure with a laser.
In FIG. 2 (i) showing the first patterns 22a and 22b, a mask 23 made of a photoresist is used by photolithography so that only the region of the conductive layer 17 forming the wall surface of the liquid chamber is exposed. Form.

In FIG. 2 (j), a plating layer 24 serving as a wall surface of the liquid chamber is formed using the conductive layer 17 as a seed film so as to cover the liquid chamber and the through-hole by plating. Examples of the plating include single metal plating such as Cu, Ni, Cr, Zn, Sn, Ag, and Au, alloy plating, and composite plating that deposits PTFE. Ni is preferably used from the viewpoint of chemical resistance, strength, and cost.
When the plating layer 24 is formed by the electrolytic plating method, the plating layer 24 is formed on the wall surface of the first pattern 22 until the plating layer 24 reaches the second conductive layer 19 formed on the upper surface of the first pattern 22. Is formed.
When the plating layer 24 reaches the second conductive layer 19 formed on the upper surface of the first pattern 22, the plating layer is formed on the second conductive layer 19 and on the plating layer 24 formed on the outer periphery thereof. 24 is formed. Therefore, after reaching before the plating layer 24 reaches the second conductive layer 19, the plating area increases by the area of the second conductive layer 19.

In the present invention, the second conductive layer 19 is configured to be continuous between the liquid chambers of the liquid chamber row. In FIG. 2 (k), a common liquid chamber is provided in the flow path layer 22a, and the common liquid chamber communicates with each liquid chamber. A second conductive layer 19 is also formed on the common liquid chamber, and the second conductive layer 19 on each liquid chamber is conducted through the second conductive layer 19 on the common liquid chamber.
As a result, even if the growth rate of the plating layer for forming the partition between the liquid chambers varies depending on the location, when the plating layer reaches the second conductive layer 19 in a certain part, all the liquids The conductive film on the chamber and the common liquid chamber are energized, and the plating layer 24 serving as the top plate on the liquid chamber starts to grow simultaneously. Thereby, the top plate on all the liquid chambers is obtained with the same thickness.
When the discharge port is tapered as described above, the discharge port diameter varies depending on the thickness of the top plate. The discharge port diameter has a great influence on the liquid discharge speed and the droplet size.
Therefore, a uniform discharge port can be obtained by conducting a conductive film (conductive layer) between the liquid chamber arrays as in the present invention. In addition, since the common liquid chamber is provided in the flow path layer 22a, the second conductive layer 19 can be continuously formed between the liquid chambers without providing a special pattern or configuration.

FIG. 2 (l) shows a completed product of the liquid discharge head 1 which is the same as FIG. 1 (b). In addition to the flow path, a pattern 25 (22b) that does not communicate with the liquid chamber is formed. Since the partition wall 9 (FIG. 1) around the flow path has substantially the same width as the partition wall 9b (25 (22b)) between the liquid chambers, the difference in electric field due to the difference in plating area is reduced. The plating layer growth rate becomes uniform in the plane. Therefore, in-plane unevenness is small in the surface property, crystal structure, etc. depending on the current density.
If unevenness occurs in the surface properties, crystal structure, etc., the contact resistance with the liquid and the liquid resistance against the liquid may become uneven or uncontrollable, which may cause variations and defects in the liquid discharge head. However, such variations and defects can be prevented.
Further, when the plating layer on the first conductive layer 17 is changed to the plating layer on the second conductive layer 19 in the above-described process, the plating layer on the first conductive layer 17 and the second conductive layer 19 are changed. It is possible to change the current value when changing from plating on the first conductive layer 17 to plating on the second conductive layer 19 in order to correct the surface properties, crystal structure, plating layer growth rate, etc. It is.
Also in this case, there is a problem that the timing for switching the current value cannot be set if the plating layer on the first conductive layer 17 has uneven thickness in the surface. However, in the present invention, since the in-plane variation of the plating layer thickness is small, the plating layer on the second conductive layer 19 starts almost simultaneously in the surface, and the current value can be switched at that time.

FIG. 3 is a diagram showing a manufacturing process of a conventional configuration shown for comparison. 3A is a plan perspective view, and FIG. 3B is a cross-sectional view taken along ABC in FIG. 3A.
Another effect of forming the pattern 22b which is created in the manufacturing process of the liquid discharge head according to the present invention and does not communicate with the liquid chamber will be described. FIG. 3 shows a configuration corresponding to the process of FIG. 2 (i) showing the manufacturing process of the present invention.
Unlike the present invention, the width of the partition wall around the liquid chamber, the fluid resistance portion and the common liquid chamber (the groove width of the first pattern 409 in the process shown in the figure) is different from the present invention. The width of the groove 420b in the portion that becomes the partition wall around the liquid chamber and the common liquid chamber is different. FIG. 3 further shows a first conductive layer 404, a second conductive layer 406, a second pattern 408 for forming an ejection port, and a mask 410.

FIG. 4 is a diagram showing a manufacturing process of a conventional configuration shown for comparison. FIG. 4 shows a process of forming a liquid chamber, a common liquid chamber, and a discharge port by performing electroplating as described above with the configuration of FIG.
4A is a cross-sectional view showing the initial stage of electroplating, FIG. 4B is a cross-sectional view showing a state in which electroplating has reached the conductive layer, and FIG. 4C is a cross-sectional view showing the final stage of the plating process. It is.
In the initial stage of electroplating in FIG. 4 (a), the electric field concentrates on a thin pattern. Therefore, in the initial stage of electroplating, the electric field strength is increased at the narrow pattern portion (A), and the plating layer Grows fast, and the pattern portion (B) with a thick groove has a small electric field strength, and the growth of the plating layer is slow.
In FIG. 4B, when the electroplating reaches the conductive layer 406 and starts to be formed on the conductive layer 406, the electric field concentration on the narrow pattern is alleviated. However, the plating thickness varies due to the difference in the growth rate of the plating layer depending on the pattern width in the initial stage.
In the final stage of the plating process shown in FIG. 4C, the plating is finished before the upper surface of the second pattern 408 is exceeded. However, as described above, 420b, which is a portion (B) having a large pattern width, has a low growth rate of the plating layer, and becomes thin. In the worst case, the liquid chamber cannot be closed. FIG. 4 further shows conductive layers 404 and 406 and a mask 410.

In the configuration of the present invention, since the partition wall around the flow channel is formed with substantially the same width as the partition wall between the liquid chambers, the height of the partition wall around the liquid chamber varies, and the height of the discharge port surface is reduced. It is possible to prevent problems such as variations and the liquid chamber not being closed.
Moreover, since the area to be plated is reduced, the growth rate of the plating layer is increased and the manufacturing throughput is improved. Furthermore, since the plating area is reduced, the consumption of the pellet material, which is a material, is reduced, and the manufacturing cost can be reduced.
Since the in-plane variation of the thickness of the flow path layer is small, the plating layer thickness on the second conductive layer 406 (19) is also uniform. Therefore, the thickness of the discharge port 2 (FIG. 1) is also uniform among the discharge ports, and liquid discharge performance without variation is obtained.

As described in FIG. 2 (h), when the shape of the discharge port 2 (second pattern 21) is a forward taper, the variation in the thickness of the discharge port becomes the variation in the size of the discharge port 2. It has a big influence on discharge variation. In the present invention, since the thickness of the discharge port portion is uniform within the surface, the size of the discharge port is also uniform, and a liquid discharge head with small discharge variation can be manufactured.
In addition, if the liquid wets and spreads around the through-hole, the liquid discharge direction is disturbed, so the surface of the plating layer 24 is preferably water-repellent. Therefore, at least the uppermost surface of the metal film (plating layer 24) is preferably subjected to composite plating for depositing PTFE or the like to improve liquid repellency. Further, the hardness and surface roughness can be controlled by adding an additive to perform the plating treatment.

It is preferable that the metal film formed by plating does not exceed the upper surface of the second pattern 21. When the metal film by plating exceeds the upper surface of the second pattern 21, the corner of the through-hole cross-sectional shape is rounded, and the landing accuracy is lowered. In order to prevent this, a process such as polishing must be performed.
Here, the height of the upper surface of the second pattern 21 is the minimum value of the distance from the region where the surface left after patterning to the substrate when the dissolvable resin for forming the second pattern 21 is applied and dried. Point to.
For example, in the case of performing Ni electroplating, as a pretreatment for plating, it is immersed in 5% dilute sulfuric acid and placed in a sulfamic acid Ni electroforming bath having a desired concentration and temperature, and electroplating is performed. The electroplating process is stopped when the maximum thickness of the metal film is 30 μm.
Thereafter, sulfamic acid Ni, Ni chloride, boric acid, PTFE fine particles (particle size: 0.3 μm) and the like are mixed in a desired composition, placed in an electroforming bath having a desired concentration and temperature, and subjected to electroplating. When the Ni-PTFE layer is 2 μm, the electroplating is stopped, washed with water and dried.

In FIG. 2 (k), the substrate 10 is removed by etching using anisotropic etching with an alkali-based etchant or deep RIE (ICP) method through the opening of the protective film 16 formed on the back surface of the substrate. . The insulating film 15 formed on the substrate surface serves as this etching etching stop layer, and stops when it reaches the insulating film 15.
Thereafter, the insulating film 15 is removed using a dry etching method or a wet etching method, thereby forming the opening 5 in which the resin film 18 that can be dissolved by the solvent is exposed. In the case of a liquid discharge head using thermal energy, the opening 5 serves as a liquid supply port to the liquid chamber.
In order to protect the substrate surface from anisotropic etching with an alkaline etching solution or etching by DeepRIE (ICP) method, a resin that can be removed later is applied to the substrate surface, or the substrate is placed on a jig that can be processed only on the back side. (Not shown).

In FIG. 2L, finally, as shown in FIG. 2F, the first pattern 22 and the second pattern 21 made of the resin films 18 and 20 that can be dissolved by the solvent are dissolved and removed by the solvent. .
Thereafter, the second conductive layer 19 exposed on the bottom surface of the opening after the second pattern 21 serving as the liquid discharge port is removed is removed by dry etching or wet etching, and the discharge port 2 and the liquid chamber. 3 and the common liquid chamber 4 are formed, and the liquid discharge head 1 similar to FIG. 1 is completed.
Here, 22b, which is a groove between the plating partitions in the first pattern 22, cannot be removed with a solvent, but there is no particular problem in terms of function, and it is not necessary to remove it. By not removing the hollow portion, the rigidity can be improved.
The flow path layer is provided with a pattern 22b that does not communicate with the liquid chamber, and the distance between the partition walls is substantially the same as the width of the partition wall between the liquid chambers. This can prevent problems such as variations in the height of the discharge port surface and inability to close the liquid chamber.
Moreover, since the area to be plated is reduced, the growth rate of the plating layer is increased and the manufacturing throughput is improved. Furthermore, since the plating area is reduced, the consumption of the pellet material, which is a material, is reduced, and the manufacturing cost can be reduced.
As will be described later, a liquid discharge head having a piezoelectric element having a flow path structure with a liquid chamber and a through-hole as an actuator also differs in that the piezoelectric element is formed instead of the heater. It goes without saying that the method of manufacturing the flow channel structure having the mouth can be manufactured in the same manner as described above.

FIG. 5 is a plan perspective view showing a second embodiment of the liquid discharge head of the present invention. In the second embodiment, two discharge port arrays 110a and 110b are arranged in a staggered manner from one common liquid chamber 4. When the pitch of one ejection port array is arranged at 600 dpi (about 42.3 μm), 1200 dpi printing can be performed in one pass with two rows of staggered patterns.
A conductive layer (not shown) on the liquid chamber wall surface of the top plate is continuous between the liquid chambers 3 and between the two liquid chamber rows via the conductive layer on the inner wall surface of the common liquid chamber 4. Therefore, the thickness of the top plate on each liquid chamber 3 and the common liquid chamber 4 is uniform.
Further, in the present embodiment, the pattern 25 is formed in addition to the flow paths such as the liquid chamber 3 and the common liquid chamber 4, and the peripheral partition walls 9 are substantially the same width as the partition walls 9 b between the liquid chambers 3, Is formed. FIG. 5 further shows the discharge port 2 and the heater 14.
With such a configuration, the width of the partition wall on which the plating layer is grown by electroplating is substantially the same throughout the liquid discharge head, and the electric field during electroplating is uniform throughout the liquid discharge head.
Therefore, the growth rate of the plating layer by electroplating becomes uniform, and the discharge port surface of the completed liquid discharge head can be obtained with little height variation. Therefore, the wiping characteristics for wiping off excess liquid on the discharge port surface are improved, and a liquid discharge head with less discharge variation can be obtained.

FIG. 6 is a plan perspective view showing a third embodiment of the liquid ejection head of the present invention. In the liquid chamber arrangement of the third embodiment, the pattern 25 other than the flow path is different from that of the second embodiment. In the third embodiment shown in FIG. 6, pseudo patterns 25 with the liquid chamber 3 are arranged. Two discharge port arrays 110a and 110b are arranged in a staggered pattern from one common liquid chamber 4.
The partition wall width between the patterns 25 is substantially the same as the width of the partition wall 9 b between the liquid chambers 3. In the pattern of the present embodiment, the pattern of the liquid chamber 3 portion and the pattern of the peripheral portion of the liquid chamber 3 are the same, so the difference in the growth rate of the plating layer due to the pattern can be further reduced.
FIG. 7 is a plan perspective view showing a modification of the third embodiment of the liquid ejection head of the present invention. In this modification, pseudo patterns 25 of the liquid chamber 3 and the fluid resistance portion and the common liquid chamber 4 are arranged.
In the pattern of this modification, since the pseudo pattern including the common liquid chamber 4 is provided, the difference in the growth rate of the plating layer due to the pattern around the liquid chamber can be eliminated. Also in this modified example, two discharge port arrays 110a and 110b are arranged in a staggered manner from one common liquid chamber 4.

FIG. 8 is a schematic cross-sectional view showing a liquid discharge head having a piezoelectric actuator. In the liquid discharge head of FIG. 8, the diaphragm 50 bonded to the frame 50, the piezoelectric element 51, the opening 52 formed in the frame 50 for accommodating the piezoelectric element 51, the liquid supply port 53 serving as a liquid supply port, and the frame 50. 54.
The liquid supplied from the liquid supply port to the liquid chamber 55 by the pressure generated by the deformation of the vibration plate 54 by the force of the piezoelectric element 51 is discharged from the discharge port 56. FIG. 8 shows a top plate 57, a conductive layer 58, and a conductive layer (metal film) 59.
FIG. 9 is a schematic cross-sectional view showing a second embodiment of the liquid discharge head of the present invention using a piezoelectric element. It has a frame 50, a piezoelectric element 51, an opening 52 for accommodating the piezoelectric element 51 formed in the frame 50, a liquid supply port 53 serving as a liquid supply port, and a diaphragm 60 joined on the frame 50.
The liquid supplied from the liquid supply port 53 to the liquid chamber 55 by the pressure generated by the deformation of the diaphragm 60 by the force of the piezoelectric element 51 is discharged from the discharge port 56. In the present embodiment, the diaphragm 60 and the partition wall 61 of the liquid chamber 55 are produced by electroforming. The discharge port plate 62 provided with the discharge ports 56 is made of a separate member and is adhesively bonded to the partition wall 61 including the top plate 57.

FIG. 10 is a schematic process cross-sectional view showing a method for producing a diaphragm and a liquid chamber partition wall. Next, the respective production steps (a) to (h) of the diaphragm 60 and the liquid chamber partition 61 of the liquid ejection head according to the second embodiment shown in FIG. 9 will be described with reference to the drawings.
10A, similarly to FIG. 2 showing the manufacturing method of the embodiment of FIG. 1, a conductive layer (first conductive layer) 17 serving as a seed film for plating is formed on the substrate 10 and the shape of the liquid chamber. A resin film 18 that can be dissolved by a solvent for forming the first pattern that constitutes the conductive film, a conductive layer (second conductive layer) 19, and a second pattern that later becomes a liquid supply port to the liquid chamber by removing it. The dissolvable resin 20 to be formed is sequentially laminated.
In FIG. 10B, in order to pattern the conductive layer 19 on the first pattern, the dissolvable resin 20 forming the second pattern 21 is used with a mask so as to leave a portion that becomes the upper surface of the liquid chamber. To expose and develop. Using this resin pattern as a mask, the conductive layer 19 is removed.

Next, in FIG. 10C, the resin film 20 remaining on the conductive layer 19 is exposed using a mask in order to form the second pattern 21 serving as a liquid supply port. Thereafter, the resin film 18 is exposed and then developed to form a liquid supply port 21 and a first pattern 22 formed of a laminated film of the resin film 18 and the conductive layer 19 forming the liquid chamber. A flow path pattern integrally formed with the discharge ports is formed. Also in the present embodiment, the conductive layer 19 is configured to be continuous between the liquid chambers of the liquid chamber row.
In FIG. 10D, a plating layer 24 serving as a wall surface of the liquid chamber is formed around the first pattern 22 by using the conductive layer 17 as a seed film so as to cover the liquid chamber by plating. Also in the configuration of the present embodiment, since the partition wall around the flow channel is formed with substantially the same width as the partition wall between the liquid chambers, the height of the partition wall around the liquid chamber varies, and the liquid supply port surface It is possible to prevent problems such as variations in the height of the liquid and the liquid chamber not being closed.
In FIG. 10E, a dissolvable resin is applied above the first pattern 22, and the third resin pattern 63 is formed by photolithography. In FIG. 10F, a plating layer 64 having a vibrating plate convex shape is formed on the plating layer 24 by plating using the conductive layer 17 as a seed film.

In FIG. 10G, the first pattern 22 and the plating layer 24 are peeled from the substrate 10 (FIG. 10A). Finally, in FIG. 10 (h), the first pattern 22, the second pattern 20, and the third pattern 63 (FIGS. 10 (a) and (e)) made of a resin film that can be dissolved by a solvent are removed by using a solvent. Dissolve and remove.
Thereafter, as shown in FIG. 9, the product of FIG. 10H is assembled by bonding the discharge port plate 62, the piezoelectric element 51, and the frame 50 to the partition wall 61 by turning the product upside down. A second embodiment of the liquid discharge head of the present invention using the above is completed.
9 and 10 also, the conductive layer 19 is configured to be continuous between the liquid chambers 55 in the liquid chamber row. As a result, even if the growth rate of the plating layer for forming the partition wall 61 between the liquid chambers 55 varies slightly depending on the location, when the plating layer reaches the conductive layer 19 in a certain part, The conductive layers on the liquid chamber 55 and the common liquid chamber are energized, and the plating layer of the vibration plate 60 on the liquid chamber 55 starts to grow at the same time in FIG.
Accordingly, the diaphragm 60 on all the liquid chambers 55 can be obtained with the same thickness. Since the thickness of the diaphragm 60 greatly affects the discharge performance, the thickness of the diaphragm 60 corresponding to each liquid chamber 55 needs to be uniform with high accuracy. In the conventional configuration, it has been impossible to obtain such high-precision uniformity.
According to the present embodiment, since the growth of the plating layer of the vibration plate 60 corresponding to each liquid chamber 55 is started simultaneously, the thickness can be controlled with high accuracy. Therefore, it can also be applied to the formation of a diaphragm that requires high precision uniformity.
In the present embodiment, the flow path layer is formed with a pattern other than the liquid chamber, and the in-plane variation in the thickness of the flow path layer is small. Therefore, the plating layer thickness on the conductive layer 19 is also uniform. Become. Therefore, the thickness of the diaphragm 60 is also uniform in the surface, and liquid discharge performance without variation is obtained.

FIG. 11 is a schematic cross-sectional view showing a third embodiment of the liquid discharge head of the present invention using a piezoelectric element. FIG. 12 is a schematic process cross-sectional view illustrating a manufacturing method for forming the discharge port plate, the flow path, and the vibration plate by plating.
11 and 12 show a configuration and a manufacturing method for forming the discharge port plate 62, the flow path, and the vibration plate 60 of the second embodiment of the liquid discharge head of the present invention using piezoelectric elements by plating. .
11 includes a frame 50, a piezoelectric element 51, a liquid supply port 53 serving as a liquid supply port, a liquid chamber 55, a discharge port 56, a top plate 57, a metal layer 58, and a vibration bonded to the frame 50. A plate 60 and a discharge port plate 62 are provided.
In FIG. 12A, a conductive layer (first conductive layer) 65 serving as a plating seed film on the substrate 10 and a solvent for forming the first pattern constituting the shape of the liquid chamber can be dissolved. A resin film 66 is formed.

Next, in FIG. 12B, the resin film 66 remaining on the conductive layer 65 is exposed and developed using a mask in order to form a second pattern 67 serving as a discharge port.
In FIG. 12C, a plating layer to be the discharge port plate 62 is formed by plating using the conductive layer 65 as a seed film. After the plated layer 62 becomes thicker than the pattern 67, the plated layer 62 also grows on the pattern 67. The size of the pattern 67 is designed in consideration of the size of the opening serving as the discharge port 56 and the growth of the plating layer 62 on the pattern 67.
In FIG. 12D, the resin film 18 that can be dissolved by the solvent for forming the first pattern 20 constituting the shape of the liquid chamber on the plating layer that becomes the discharge port plate 62, the conductive layer (second layer). 19), a dissolvable resin 20 that forms the second pattern 21 to be a liquid supply port to the liquid chamber by being removed later is sequentially laminated.
Thereafter, the discharge port plate 62, the flow path, and the vibration plate 54 as shown in FIG. 12 (e) were integrally formed by plating through the same steps as (b) to (h) of the second embodiment. Things are obtained. As shown in FIG. 1, the liquid discharge head is completed by assembling the piezoelectric element 51 and the frame 50 by bonding them to the vibration plate 54.

The liquid discharge head that can be used in the present invention may be a so-called piezo method in which ink is discharged by applying a voltage to the electrostrictive element and deforming the electrostrictive element, or a current is applied to the electrothermal conversion element. A so-called thermal ink jet method may be used in which heat is generated by flowing, and ink is ejected by bubbling ink by heat generation.
When using the piezo method, ink droplets of various sizes can be ejected by adjusting their drive waveforms by expanding or contracting the piezo element or adjusting the deformation amount of the piezo element. be able to. Therefore, it is advantageous for forming an image with good gradation.
On the other hand, the thermal ink jet method is suitable for manufacturing a multi-nozzle head because it is easy to highly integrate discharge ports. Therefore, it is advantageous for printing an image with high resolution at high speed.
The inkjet head that can be used in the present invention may be an edge shooter system in which the shape from the ink flow path to the ejection port is linear, or a side shooter system in which the direction of the ink flow path and the direction of the ejection port are different. It may be.

FIG. 13 is a schematic view showing an example of an edge shooter type liquid discharge head. This liquid discharge head has a structure in which a side wall of the liquid chamber 3 and a wall material 68 forming the discharge port 2 and a top plate 11 forming a cover of the liquid chamber 3 are laminated on a substrate having a discharge energy generator 4 such as a heater. Have An electrode for applying a discharge signal to the discharge energy generator 4 and a protective layer provided on the discharge energy generator 4 as necessary are omitted.
In this liquid discharge head, a recording signal is supplied via an electrode (not shown) in a state where ink is filled in the liquid chamber 3 in the ink flow direction 68b from a common liquid chamber (not shown) in which ink is stored. Is applied to the discharge energy generator 4.
At this time, the discharge energy generated from the discharge energy generator 4 acts on the ink in the liquid chamber 3 above the discharge energy generator 4 (discharge energy operation part), and as a result, the ink is discharged as droplets from the discharge port 2. Is done. The ejected ink droplets are attached to a recording material such as paper fed to the front of the ejection port 2.

In the edge shooter type liquid discharge head as shown in FIG. 13, it is extremely easy to accurately miniaturize each part, to make the discharge ports multi-sized or downsized, and to have high mass productivity. . On the other hand, there is a limit to the response frequency and ink droplet flight speed when ejecting ink droplets.
In addition, bubbles are generated in the ink when the electrothermal conversion element generates heat. The bubbles contract due to a decrease in temperature, and the discharge energy generator 4 is gradually destroyed by an impact when the bubbles disappear in the vicinity of the discharge energy generator 4. Is done. This phenomenon is called a cavitation phenomenon and is remarkable in the edge shooter system. Therefore, the life of the edge shooter type recording head is relatively short.

FIG. 14 is a schematic view showing an example of a side shooter type liquid discharge head. In FIG. 14, this liquid discharge head is provided with the discharge port 2 in the top plate 11, and the flow direction of the ink to the discharge energy acting part in the liquid chamber 3 and the center of the opening of the discharge port 2 as shown by the broken line 68c. It has a configuration in which the axis is perpendicular.
With such a configuration, the energy from the ejection energy generator 4 can be more efficiently converted into the kinetic energy of ink droplet formation and flight. Further, it has a structural advantage that the meniscus can be quickly restored by supplying ink, and is particularly effective when a heating element is used for the ejection energy generator 4.
Further, the so-called cavitation phenomenon in which the ejection energy generator 4 is gradually destroyed by the impact when the bubbles that are problematic in the edge shooter type liquid ejection head shown in FIG. be able to. That is, if bubbles grow in the side shooter and the bubbles reach the discharge port 2, the bubbles communicate with the atmosphere, and the bubbles do not contract due to a decrease in temperature. Therefore, there is an advantage that the life of the liquid discharge head is long.

FIG. 15 is a schematic perspective view showing an example of an ink jet recording apparatus equipped with the liquid discharge head according to the present invention. FIG. 16 is a side view for explaining the mechanism of the ink jet recording apparatus of FIG.
Referring to FIGS. 15 and 16, the ink jet recording apparatus A includes a carriage 93 movable in the main scanning direction inside a recording apparatus main body 81, and a liquid comprising an ink jet head mounted on the carriage 93 and embodying the present invention. A printing mechanism 82 including an ink cartridge for supplying ink to the discharge head and the liquid discharge head is stored.
A paper feed cassette (or a paper feed tray) 84 on which a large number of recording media (paper sheets) 83 can be loaded from the front side can be detachably attached to the lower portion of the apparatus main body 81. Further, the manual feed tray 85 for manually feeding the recording medium 83 can be opened.
The recording medium 83 fed from the paper feed cassette 84 or the manual feed tray 85 is taken in, a required image is recorded by the printing mechanism unit 82, and then the recording medium 83 is discharged to a discharge tray 86 mounted on the rear side. .

The printing mechanism 82 holds the carriage 93 slidably in the main scanning direction (the direction perpendicular to the paper in FIG. 16) with a main guide rod 91 and a sub guide rod 92 which are guide members horizontally mounted on left and right side plates (not shown). is doing.
The carriage 93 has a plurality of ink discharge ports (nozzles) including a head 94 formed of an inkjet head according to the present invention that discharges ink droplets of each color of yellow (Y), cyan (C), magenta (M), and black (Bk). ) Are arranged in a direction crossing the main scanning direction, and the ink droplet ejection direction is directed downward. In addition, each ink cartridge 95 for supplying ink of each color to the head 94 is replaceably mounted on the carriage 93.
The ink cartridge 95 has an air port that communicates with the atmosphere upward, a supply port that supplies ink to the inkjet head below, and a porous body filled with ink inside.
The ink supplied to the inkjet head is maintained at a slight negative pressure by the capillary force of the porous body. Further, although the heads 94 of the respective colors are used here as the recording heads, a single head having an ejection port for ejecting ink droplets of the respective colors may be used.

Here, the carriage 93 is slidably fitted to the main guide rod 91 on the rear side (downstream side in the paper conveyance direction), and is slidably mounted on the sub guide rod 92 on the front side (upstream side in the paper conveyance direction). is doing.
In order to move and scan the carriage 93 in the main scanning direction, a timing belt 100 is stretched between a driving pulley 98 and a driven pulley 99 that are rotationally driven by a main scanning motor 97. The timing belt 100 is fixed to the carriage 93, and the carriage 93 is reciprocated by forward / reverse rotation of the main scanning motor 97.
On the other hand, in order to transport the recording medium 83 set in the paper feeding cassette 84 to the lower side of the head 94, the paper feeding roller 101 and the friction pad 102 for separating and feeding the recording medium 83 from the paper feeding cassette 84, and the recording medium 83. The guide member 103 for guiding the recording medium, the conveying roller 134 for reversing and conveying the fed recording medium 83, the conveying roller 105 pressed against the peripheral surface of the conveying roller 134, and the feeding of the recording medium 83 from the conveying roller 134 A tip roller 106 that defines an angle is provided. In this case, the transport roller 134 is rotationally driven by the sub-scanning motor 107 via the gear train.
A printing receiving member 109 is provided as a paper guide member that guides the recording medium 83 fed from the conveying roller 134 below the recording head 94 in accordance with the movement range of the carriage 93 in the main scanning direction.

A conveyance roller 111 and a spur 112 that are rotationally driven to send the recording medium 83 in the paper discharge direction are provided on the downstream side of the printing receiving member 109 in the paper conveyance direction, and the recording medium 83 is placed on the paper discharge tray 86. A paper discharge roller 113 and a spur 114 to be sent out, and guide members 115 and 116 forming a paper discharge path are disposed.
During recording, the recording head 94 is driven according to the image signal while moving the carriage 93, thereby ejecting ink onto the stopped recording medium 83 to record one line, and conveying the recording medium 83 by a predetermined amount. After that, the next line is recorded. Upon receiving a recording end signal or a signal that the rear end of the recording medium 83 reaches the recording area, the recording operation is terminated and the recording medium 83 is discharged.

Further, a recovery device 117 for recovering defective ejection of the head 94 is disposed at a position outside the recording area on the right end side in the movement direction of the carriage 93. The recovery device 117 includes a capping unit, a suction unit, and a cleaning unit.
The carriage 93 is moved to the recovery device 117 side during printing standby and the head 94 is capped by the capping means, and the ejection port portion is kept in a wet state to prevent ejection failure due to ink drying. Further, by ejecting ink that is not related to recording during recording or the like, the ink viscosity of all the ejection ports is made constant and stable ejection performance is maintained.
When a discharge failure occurs, the discharge port (nozzle) of the head 94 is sealed with a capping unit, and bubbles and the like are sucked out from the discharge port with the suction unit through the tube. Is removed by the cleaning means, and the ejection failure is recovered. The sucked ink is discharged to a waste ink reservoir (not shown) installed at the lower part of the main body and absorbed and held by an ink absorber inside the waste ink reservoir.

It is a figure which shows the liquid discharge head of the thermal inkjet system using the thermal energy which is the 1st Embodiment of this invention. It is process sectional drawing which shows typically the manufacturing process of the liquid discharge head using a thermal energy. It is a figure which shows the manufacturing process of the conventional structure shown for a comparison. It is a figure which shows the manufacturing process of the conventional structure shown for a comparison. FIG. 6 is a plan perspective view showing a second embodiment of the liquid ejection head of the present invention. FIG. 6 is a plan perspective view showing a third embodiment of the liquid ejection head of the present invention. FIG. 10 is a plan perspective view showing a modification of the third embodiment of the liquid ejection head of the present invention. It is a typical sectional view showing a liquid discharge head which has a piezoelectric actuator. It is a typical sectional view showing a 2nd embodiment of a liquid discharge head of the present invention using a piezoelectric element. It is typical process sectional drawing which shows the preparation methods of a diaphragm and a liquid chamber partition. It is a typical sectional view showing a 3rd embodiment of a liquid discharge head of the present invention using a piezoelectric element. It is typical process sectional drawing which shows the preparation methods which form a discharge port plate, a flow path, and a diaphragm by plating. It is the schematic which shows the example of the liquid discharge head of an edge shooter system. It is the schematic which shows the example of the liquid ejection head of a side shooter system. 1 is a schematic perspective view showing an example of an ink jet recording apparatus equipped with a liquid discharge head according to the present invention. It is a side view explaining the mechanism part of the inkjet recording device of FIG.

Explanation of symbols

A image forming apparatus, 1 liquid discharge head, 2 flow path layer (discharge port), 3 flow path layer (liquid chamber), 4 flow path layer (common liquid chamber), 6 plating layer, 7 conductive layer (first conductive layer) Layer), 8 conductive layer (second conductive layer), 9 partition, 10 substrate, 11 top plate, 12 fluid resistance portion, 14 heater, 17 conductive layer (first conductive layer), 18 resin film (first Pattern 22), 19 Conductive layer (second conductive layer), 20 Resin film (second pattern 21), 24 Plating layer, 51 Piezoelectric element, 54 Diaphragm, 81 Recording device main body, 82 Printing unit (printing mechanism unit) ), 84 Paper feeder (paper cassette)

Claims (9)

  A flow path layer having a liquid chamber formed by a plating layer on the conductive layer, and a top plate layer formed by plating on the flow path layer and serving as a top plate of the liquid chamber. A liquid discharge head, wherein a conductive layer different from the plating layer is formed on a wall surface of the liquid chamber, and the conductive layer is continuously formed between the plurality of liquid chambers.   The liquid ejection head according to claim 1, wherein a deformable diaphragm is formed on the top plate layer.   The liquid ejection head according to claim 1, wherein an ejection port for ejecting liquid is formed in the top plate layer.   4. The liquid according to claim 1, wherein a plurality of liquid chamber rows in which a plurality of liquid chambers are arranged are provided, and the conductive layer is continuous between the plurality of liquid chamber rows. Discharge head.   The liquid discharge head according to claim 1, wherein a common liquid chamber in which a plurality of liquid chambers communicate in common via a fluid resistance portion is provided in the flow path layer.   6. The flow path layer is provided with a pattern that does not communicate with the liquid chamber, and the interval between the partition walls is substantially the same as the width of the partition wall between the liquid chambers. The liquid discharge head according to any one of the above.   7. The liquid discharge head according to claim 6, wherein the pattern is a pattern similar in shape and interval to the liquid chamber.   8. An image forming apparatus for printing an image on a recording medium sent from a paper supply unit, wherein the liquid discharge head according to claim 1 is mounted as a liquid discharge head of the print unit. Image forming apparatus. At least one of the plating layers is a flow path layer in which a liquid chamber is formed, and the other plating layer is a top plate layer serving as a top plate of the liquid chamber. In the manufacturing method of the liquid discharge head in which a conductive layer different from the plating layer is formed on the liquid chamber wall surface of the plate,
Forming a mold material in the shape of a liquid chamber on the substrate, forming a conductive layer between the plurality of mold materials on the mold material, and forming a flow path layer by plating around the mold material; Performing a plating process after the conductive layer is electrically connected to the flow path layer, forming the top plate layer, and stopping the plating process on the top plate layer at a predetermined thickness; And a step of forming the liquid chamber by removing the mold material.

Images