JP2009010061A5 - - Google Patents

Claims (20)

A first circuit forming body having a plurality of first electrodes;
A second circuit forming body having a plurality of second electrodes disposed to face the plurality of first electrodes, respectively.
An insulating adhesive resin that is disposed in an opposing region of the first circuit forming body and the second circuit forming body and bonds the two;
Located between the second electrodes adjacent to each other, at the interface between the second circuit forming body and the insulating adhesive resin, along the interface from one second electrode to the other second electrode A reverse path forming portion that forms a path having a component in the reverse direction from the other second electrode toward the one second electrode in a part of the path;
An electrode joint structure comprising:   The electrode junction structure according to claim 1, wherein the reverse path forming unit forms two paths having components in the reverse direction.   The electrode junction structure according to claim 1, wherein the reverse path forming portion is configured by a protrusion formed on the second circuit forming body.   The electrode bonding structure according to claim 3, wherein the protrusion extends in parallel to the second electrode. The electrode bonding structure according to claim 3 , wherein the protrusion forms a path having a component in the reverse direction by a surface located on the one second electrode side.   The electrode bonding structure according to claim 3, wherein the protrusion has a tapered cross-sectional shape that widens toward the first circuit forming body. The protrusion has a first protrusion forming part formed on the second circuit forming body, and a second protrusion forming part formed on the first protrusion forming member,
The surface of the second protrusion forming portion adjacent to the first protrusion forming portion is larger than the surface of the first protrusion forming portion adjacent to the second protrusion forming portion. 3. The electrode joint structure according to 3.   The electrode junction structure according to claim 3, wherein a height of the protrusion is lower than a total height of a height of the first electrode and a height of the second electrode.   The electrode bonding structure according to claim 3, wherein the protrusion is made of the same material as the second circuit forming body.   The electrode bonding structure according to claim 3, wherein the protrusion is made of a material that can be covalently bonded to the second circuit forming body.   The electrode projection structure according to claim 3, wherein the protrusion is made of an inorganic / organic composite material. The second circuit forming body is composed of a first material mainly composed of glass,
The electrode bonding structure according to claim 3, wherein the protrusion is made of a second material containing glass as a main component and having a melting point lower than that of the first material.   The electrode bonding structure according to claim 3, wherein the protrusion includes a photosensitive resin.   The electrode junction structure according to claim 1, wherein the reverse path forming portion is configured by a recess formed in the second circuit forming body.   The electrode junction structure according to claim 14, wherein the concave portion extends in parallel to the second electrode.   The electrode junction structure according to claim 15, wherein the recess forms a path having a component in the reverse direction by a surface located on the one second electrode side.   The electrode junction structure according to claim 14, wherein the recess has a tapered cross-sectional shape that widens in a direction away from the first circuit formation body.   The electrode bonding structure according to claim 1, wherein each of the second electrodes is made of silver.   The electrode bonding structure according to claim 1, wherein the insulating adhesive resin is a thermosetting resin.   Furthermore, the electrode joining structure according to any one of claims 1 to 19, further comprising an insulating sealing resin that covers the insulating adhesive resin so that the insulating adhesive resin is not exposed to the outside.