JP2009009967A - Board-mounted component and mounting method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board-mounted component and a mounting method therefor which is applied, for example, to a wireless LAN module, design and manage easier than the conventional types and simplify testing facility. <P>SOLUTION: In the board-mounted component 3 made by mounting an integrated circuit 12 on a wiring board 11, specification setting terminals CON0 to CON5 disposed on the integrated circuit 12 are connected to mounting terminals CO0 to CO5 of the wiring board 11 for carrying the integrated circuit 12 mounted thereon, so that the specifications of the board mounting component 3 can be set on a mounting board 2 on which the board mounting component 3 is mounted. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a board mounting component and a board mounting component mounting method, and can be applied to, for example, a wireless LAN (Local Area Network) module. The present invention relates to a board mounting component in which an integrated circuit is mounted on a wiring board, and a specification setting terminal provided on the integrated circuit is connected to a mounting terminal of the wiring board on which the integrated circuit is mounted. By making it possible to set the specifications of the board-mounted component on the mounting board on which the board is mounted, the design and management are easier and the inspection equipment can be simplified as compared with the prior art.

  In recent years, various electronic devices such as a mobile phone, a portable game machine, a digital still camera, a local cordless phone, a handy terminal, and an AV device are equipped with a wireless LAN module for convenience of users.

  Heretofore, this type of wireless LAN module is conventionally produced by mounting an integrated circuit for a wireless LAN module together with peripheral components on a module substrate which is a wiring substrate, and this module substrate is a mounting substrate for a mobile phone, portable game machine or the like. It is mounted on these devices. Therefore, this type of wireless LAN module has different specifications such as interface, boot method, clock frequency and the like depending on the device to be mounted. Therefore, an integrated circuit for the wireless LAN module is created by a system-on-chip, and is a module board. Various settings can be supported by the above settings.

  Specifically, there are two types of specifications of this type, one set by software and one set by hardware. The former software-specific specifications are channel switching, communication rate, transmission power, etc. After the wireless LAN module boots and starts operation, the system-on-chip register value is set via software or firmware. Is set.

  On the other hand, the latter specifications set in hardware are specifications necessary for booting, such as an interface, a boot method, and a clock frequency, and are set by a peripheral circuit of the system on chip. Therefore, this type of wireless LAN module has a different peripheral circuit configuration for each specification.

  Regarding such a wireless LAN module, Japanese Patent Laid-Open No. 2006-236236 proposes a device for shortening the connection time.

By the way, the conventional wireless LAN module has different peripheral circuit configurations for each specification, so it is necessary to design for each specification, and to inspect the product with different inspection equipment for each specification. There was a problem that required a large number of inspection facilities according to the number.
JP 2006-236236 A

  The present invention has been made in consideration of the above points, and it is easier to design and manage than conventional ones, and it is possible to simplify the inspection equipment and board mounting parts such as wireless LAN modules and board mounting parts. It is intended to propose an implementation method.

  In order to solve the above problems, the invention of claim 1 is applied to a board mounting component having an integrated circuit for setting specifications by setting a specification setting terminal and a wiring board for mounting the integrated circuit together with peripheral components. The specification setting terminal can be set by connecting the specification setting terminal to the mounting terminal of the wiring board for mounting the board mounting component on the mounting board, and setting the mounting terminal on the mounting board. And

  The invention of claim 3 is applied to a mounting method of a board mounting component having an integrated circuit for setting specifications by setting a specification setting terminal and a wiring board for mounting the integrated circuit together with peripheral components. The specification setting terminal is connected to the mounting terminal of the wiring board for mounting the mounting component on the mounting board, and the specification of the board mounting component is set by setting the mounting terminal on the mounting board.

  According to the configuration of the first or third aspect, the setting of the specification setting terminal provided in the integrated circuit can be executed on the mounting substrate. Therefore, even when various specifications are supported by setting the specification setting terminals, one type of mounting component can be supported, which makes design and management easier and simplifies the inspection equipment than before. Can be

  According to the present invention, design and management can be facilitated and inspection equipment can be simplified as compared with the conventional case.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

(1) Configuration of Embodiment FIG. 1 is a block diagram showing a mobile phone according to Embodiment 1 of the present invention. The mobile phone 1 is created by mounting a wireless LAN module 3 or the like on a mother board 2. The cellular phone 1 has a controller 4 that controls the overall operation. The controller 4 controls a call circuit (not shown) in response to a user operation, thereby making a call with a desired call target. In addition, the controller 4 via the interface (I / F) 5 controls the wireless LAN module 3 to connect to a network such as the Internet and upload and download various data. In the mobile phone 1, data related to the upload and download is recorded in the memory card 6 as necessary.

  The wireless LAN module 3 is created by mounting an integrated circuit 12 for a wireless LAN module, a crystal resonator 13, a read-only memory (ROM) 14 and the like on a module substrate 11, and the specifications required for the cellular phone 1 are as follows. Commonly used in various different devices.

  Here, the integrated circuit 12 for the wireless LAN module is a system-on-chip integrated circuit, in accordance with the specifications set in hardware by the start of power supply under the control of the controller 4 or by the reset instruction from the controller 4. The operation is started and each part is set so as to correspond to the specifications of the mobile phone 1 in terms of software. In the integrated circuit 12, this hardware specification is set by setting a specification setting terminal by a peripheral circuit.

  That is, in the integrated circuit 12 for the wireless LAN module, the clock setting circuit 16 is a circuit for setting the clock frequency of the wireless LAN module 3 which is one of the specifications set in hardware. The clock setting circuit 16 is provided with two specification setting terminals CON5 and CON4 that are pulled up by resistors in the integrated circuit. When these specification setting terminals CON5 and CON4 are open ends, these two specification setting terminals are provided. When CON5 and CON4 are set to logic 1, and the specification setting terminals CON5 and CON4 are grounded by resistors, these two specification setting terminals CON5 and CON4 are set to logic 0. The clock setting circuit 16 sets the frequency division ratio of the oscillation circuit (OSC) 17 according to the setting of the logic values of the specification setting terminals CON5 and CON4, and thereby sets the clock frequency according to the setting of the specification setting terminals CON5 and CON4. Set. In response to this, the oscillation circuit (OSC) 17 generates a reference signal having a predetermined frequency using the crystal resonator 13, and divides the reference signal by the division ratio set by the clock setting circuit 16. A clock for operating the integrated circuit 12 is generated. In this embodiment, the oscillation circuit 17 outputs an operation clock at a clock frequency of 20, 30, 40, or 50 [MHz] according to the setting by the clock setting circuit 16.

  The interface setting circuit 18 is a circuit for setting an interface of the memory card 6 that is one of specifications set in hardware. The interface setting circuit 18 is provided with two specification setting terminals CON1 and CON0. Similarly to the clock setting circuit 16, the logical values of these two specification setting terminals CON1 and CON0 are set. The interface setting circuit 18 switches the setting of the interface 19 according to the logical values set in the specification setting terminals CON1 and CON0. The interface 19 switches specifications according to the setting by the interface setting circuit 18 and inputs / outputs various data to / from the controller 4 and the memory card 6 through the interface 5 under the control of the controller 20.

  The boot setting circuit 21 is a circuit for setting a boot method which is one of specifications set in hardware. Similarly to the clock setting circuit 16, the boot setting circuit 21 is provided with two specification setting terminals CON3 and CON2, and these two specification setting terminals CON3 and CON2 are both set to open ends, When both CON3 and CON2 are set to logic “1”, the operation of the controller 20 is set so as to be booted by a program provided by the controller 4 which is the host controller. On the other hand, when only the specification setting terminal CON3 of these two specification setting terminals CON3 and CON2 is grounded by a resistor and the specification setting terminals CON3 and CON2 are set to logic “0, 1”, The operation of the controller 20 is set so as to boot according to the program recorded in the read-only memory 14.

  The controller 20 is arithmetic processing means for controlling the operation of the wireless LAN module 3 and executes boot processing according to a program provided by the host controller or a program recorded in the read-only memory 14 according to the setting of the boot setting circuit 21. And get up and running. In this processing, the controller 20 sets the value of the built-in register in accordance with the register value setting information provided from the host controller or the register value setting information recorded in the read-only memory 14, and this wireless LAN Software specifications such as channel switching, communication rate, and transmission power in module 3 are set.

  The read-only memory 14 records and stores the boot processing of the controller 20 and register value setting information. In this embodiment, the read-only memory 14 holds the same type of record even when it is mounted on various devices different from the specifications required for the mobile phone 1.

  In the wireless LAN module 3, the module substrate 11 is provided with a solder joint surface by Land Grid Array on the side surface of the mother substrate 2. Here, FIG. 2 is a plan view showing a solder joint surface of the module substrate 11. In FIG. 2, the position of each mounting terminal is indicated by alphanumeric characters A to F and numerals 1 to 6. The module substrate 11 is provided with 6 × 6 mounting terminals on the solder joint surface, specification setting terminals CO0 to CO5, input / output terminals DAT0 to DAT3 of the interface 19, CLK, CMD, reset terminal RESET, status information The input / output terminals I / O1 to I / O4, the power source, the antenna terminal RFIN / OUT, the ground GND, and the like are assigned to these mounting terminals. Of these mounting terminals, the input / output terminals DAT0 to DAT3, CLK, CMD, reset terminal RESET, input / output terminals I / O1 to I / O4, power supply, antenna terminal RFIN / OUT, and ground GND of the interface 19 are The terminals of the integrated circuit 12 and the corresponding wiring pattern of the wireless LAN module 3 are connected to each other. On the other hand, the specification setting terminals CO0 to CO5 are connected to the specification setting terminals CON0 to CON5 of the integrated circuit via pull-down resistors R0 to R5, respectively.

  Here, these pull-down resistors R0 to R5 are resistors for grounding the specification setting terminals CON0 to CON5 when the specification setting terminals CON0 to CON5 of the integrated circuit 12 are set to logic 0. As a result, as shown in FIG. 3, the wireless LAN module 3 can set the specification setting terminals CON0 to CON5 of the integrated circuit 12 to logic 1 with the specification setting terminals CO0 to CO5 as open ends. As shown in FIG. 4, the specification setting terminals CO0 to CO5 are grounded, and the specification setting terminals CON0 to CON5 of the integrated circuit 12 can be set to logic 0.

  The wireless LAN module 3 can set the specifications of the integrated circuit 12 by setting on the mother board 2. In this embodiment, in the wireless LAN module 3, the mother board 2 is wired so that the specification setting terminals CO1, CO3, and CON4 among these specification setting terminals CO0 to CO5 are grounded.

(2) Operation of Embodiment In the above configuration, the wireless LAN module 3 according to this embodiment (FIG. 1) is an integrated circuit 12 for a wireless LAN module whose specifications are set by setting the specification setting terminals CON0 to CON5. Is mounted on the module substrate 11 together with peripheral components.

  Here, as in the prior art, if the setting of hardware specifications of the wireless LAN module 3 is set by the peripheral components of the integrated circuit 12 mounted on the module substrate 11, the wireless LAN module 3 is portable. The specification will be set only for the telephone 1, and when it is installed in a device with a different specification, the wireless LAN module will be redesigned according to the specification of the device and an inspection facility will be created. Is required. In this case, management and design become complicated due to an increase in the number of products, and the types of inspection equipment increase.

  Therefore, in this embodiment, the wireless LAN module 3 is provided with the specification setting terminals CO0 to CO5 on the module substrate 11, and the specification setting terminals CON0 to CON5 of the integrated circuit 12 are the specification setting terminals CO0 to CO0 of the module substrate 11. Connected to CO5. As a result, the wireless LAN module 3 can set the specifications previously set on the module board 11 on the mother board 2 and can be equipped with a common configuration for various devices having different specifications. As a result, in the wireless LAN module 3, the design and management can be simplified, and furthermore, all wireless LAN modules can be inspected with one type of inspection facility. Management is easy and inspection equipment can be simplified.

  In the wireless LAN module 3, the connection between the specification setting terminals CON0 to CON5 of the integrated circuit 12 and the specification setting terminals CO0 to CO5 of the module substrate 11 is connected to the specification setting terminals CON0 to CON5 of the integrated circuit 12. This is executed via the pull-down resistors R0 to R5, so that the mother board 2 sets the specifications of the wireless LAN module 3 by simply setting the specification setting terminals CO0 to CO5 to ground or open. be able to. Accordingly, when viewed from the mother board 2 side, the wireless LAN module 3 is mounted and the specification is set as if the wireless LAN module designed for the cellular phone 1 is mounted according to the mounting layout. be able to. Accordingly, the wireless LAN module 3 that can support a plurality of specifications can be used as if it is a dedicated wireless LAN module, and thus the wireless LAN module 3 can be mounted by a mounting method similar to the conventional one.

(3) Advantages of the embodiment According to the above configuration, the specification setting terminal provided in the integrated circuit is connected to the mounting terminal of the wiring board on which the integrated circuit is mounted, and the mounting on the board is mounted. By making it possible to set the specifications of this board-mounted component on the board, it is easier to design and manage than in the past, and the inspection equipment can be simplified.

  In the above-described embodiment, the case where the solder joint surface of the module substrate is configured by the Land Grid Array has been described. However, the present invention is not limited to this, and may be configured by the Ball Grid Array. As shown in FIG. 5, terminals may be arranged around the module substrate.

  In the above-described embodiments, the specification setting terminal is pulled up by a resistor in the integrated circuit and the logic value is set as a pull-down or open end outside the integrated circuit. However, the present invention is not limited to this. On the contrary, as shown in FIG. 6, the specification setting terminal may be pulled down by a resistor in the integrated circuit, and the logic value may be set as a pull-up or open end outside the integrated circuit.

  In the above-described embodiments, the case where the present invention is applied to a wireless LAN module has been described. However, the present invention is not limited to this, and a television tuner module, WiMAX (Worldwide Interoperability for Microwave Access) (IEEE802.16e standard). The present invention can be widely applied to board-mounted components having various independent functions such as modules.

  The present invention can be applied to, for example, a wireless LAN module.

It is a block diagram which shows the mobile telephone of Example 1 of this invention. It is a top view which shows the solder joint surface of the wireless LAN module applied to the mobile telephone of FIG. FIG. 3 is a connection diagram for explaining setting of logic 1 of the wireless LAN module of FIG. 2. FIG. 3 is a connection diagram for explaining setting of logic 0 of the wireless LAN module of FIG. 2. It is a top view which shows the wireless LAN module by another example. It is a connection diagram with which it uses for description of the setting of the logical value of the wireless LAN module by another example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mobile phone, 2 ... Mother board, 3 ... Wireless LAN module, 4, 20 ... Controller, 11 ... Module board, 12 ... Integrated circuit, 16 ... Clock setting circuit, 18 ... Interface setting Circuit, 21 ... Boot setting circuit

Claims (3)

An integrated circuit that sets the specification by setting the specification setting terminal;
In a board mounting component having a wiring board for mounting the integrated circuit together with peripheral components,
The specification setting terminal is connected to a mounting terminal of the wiring board for mounting the board mounting component on the mounting board, and the specification of the board mounting component can be set by setting the mounting terminal on the mounting board. A board-mounted component characterized by that. The board mounting component is
Wireless communication module,
The board-mounted component according to claim 1, wherein the specification setting by setting the specification setting terminal is at least a boot method, a clock frequency, or an input / output interface setting. An integrated circuit that sets the specification by setting the specification setting terminal;
In a mounting method of a board mounting component having a wiring board for mounting the integrated circuit together with peripheral components,
The specification setting terminal is connected to the mounting terminal of the wiring board for mounting the board mounting component on the mounting board, and the specification of the board mounting component is set by setting the mounting terminal on the mounting board. A method of mounting a board-mounted component characterized by the above.

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