JP2009009958A - Enclosure noise-reducing structure - Google Patents

Enclosure noise-reducing structure Download PDF

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JP2009009958A
JP2009009958A JP2007167071A JP2007167071A JP2009009958A JP 2009009958 A JP2009009958 A JP 2009009958A JP 2007167071 A JP2007167071 A JP 2007167071A JP 2007167071 A JP2007167071 A JP 2007167071A JP 2009009958 A JP2009009958 A JP 2009009958A
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housing
silencing
holes
sound
predetermined
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JP4852483B2 (en
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Kazuo Osawa
一夫 大澤
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NEC Embedded Products Ltd
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NEC Embedded Products Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently reduce noises generated as a result of forced air cooling in an enclosure. <P>SOLUTION: The forced air cooling enclosure is made up of a structure that is constructed by combining first members (23, 42, 43, 47, 49 and 54) each having a given hardness and thickness and a plurality of through-holes with second members (25, 41, 44, 48, 50, 53 and 55) each having a given thickness and containing gaps or air bubbles formed continuously from the surface to the inside. The structure is so set on the opposed inner wall surfaces of the enclosure that the first members are opposite to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、強制空冷を必要とする電子機器の静音化構造に関する。   The present invention relates to a noise reduction structure for an electronic device that requires forced air cooling.

従来この種の電子機器の静音化構造は、例えば第5図および第6図に示すように、架枠72に搭載される電子回路を有するユニット71を冷却すべく配置されたファン73による送風により、筐体外部へ吐き出すための排気ダクト70を備えており、さらに排気ダクト70の側壁に吸音材を設置して低騒音化をはかる構造であった。   Conventionally, this type of electronic device has a noise-reduction structure, for example, by blowing air from a fan 73 arranged to cool a unit 71 having an electronic circuit mounted on a frame 72, as shown in FIGS. The exhaust duct 70 for discharging to the outside of the housing is provided, and a sound absorbing material is further installed on the side wall of the exhaust duct 70 to reduce noise.

実開平2−42494号公報Japanese Utility Model Publication No. 2-42494

しかしながら、上述した従来の電子機器の静音化構造は、架枠72に搭載される電子回路を有するユニット71を冷却すべく用意された送風機73の風の吐き出し側に吸音部材を貼り付けた排気ダクトを設置する構造であり、排気ダクト70から排気口61にかけて設けられたL字型排気路81にしか静音化対策がなされておらず、機器内部で発生する騒音が十分減衰されずに機器外部へ出易いという欠点があった。   However, the above-described conventional noise reduction structure of the electronic device is an exhaust duct in which a sound absorbing member is attached to the wind discharge side of the blower 73 prepared to cool the unit 71 having the electronic circuit mounted on the frame 72. The noise reduction measures are taken only in the L-shaped exhaust path 81 provided from the exhaust duct 70 to the exhaust port 61, and the noise generated inside the device is not sufficiently attenuated and is external to the device. There was a fault that it was easy to come out.

特に最近は、電子回路の素子の高集積化及び高速化に伴ない、電子回路パッケージの発熱量も上がり、このため筐体内に実装された送風機の回転量を増大させる方向にあり、従来技術において騒音の低下を図ることは難しい状態にあった。   Particularly recently, along with the higher integration and speeding up of electronic circuit elements, the amount of heat generated in the electronic circuit package has also increased, and this is in the direction of increasing the amount of rotation of the blower mounted in the housing. It was difficult to reduce noise.

そこで、本発明の電子機器の静音化構造は、架内に実装された電子回路を有するユニットを冷却するために機器内部で発生する騒音を、筐体内部にて効率的に低減させることを目的とするものである。   Therefore, the noise reduction structure for an electronic device according to the present invention aims to efficiently reduce noise generated inside the device to cool a unit having an electronic circuit mounted in a rack. It is what.

本発明の第1の静音化構造は、所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、を組み合わせて形成された構造体を、所定の空間を隔て前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The first noise reduction structure of the present invention has a predetermined hardness and thickness, a first member having a plurality of through holes, and a gap having a predetermined thickness and continuing from the surface to the inside. A structure formed by combining a second member containing bubbles is placed so that the first member faces each other with a predetermined space therebetween, and noise generated from a sound source in the housing is silenced. It is characterized by that.

本発明の第2の静音化構造は、複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、を組み合わせて形成された構造体を、所定の空間を隔て前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The second noise reduction structure of the present invention has a plurality of through holes, a first member having at least a characteristic of reflecting sound incident on a portion other than the through holes, and a predetermined high frequency of the incident sound. A structure formed by combining a second member having at least a property of absorbing a part of the component, and a sound source in the housing, wherein the first member is disposed so as to face each other with a predetermined space therebetween It is characterized in that the noise generated from the noise is reduced.

本発明の第3の静音化構造は、所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、を組み合わせて形成された構造体を、筐体内の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The third noise reduction structure of the present invention has a predetermined hardness and thickness, a first member having a plurality of through holes, a predetermined thickness, and a gap or a continuous gap from the surface to the inside. A structure formed by combining a second member containing air bubbles is placed on opposing inner wall surfaces in the housing so that the first members face each other, and noise generated from a sound source in the housing It is characterized by quieting.

本発明の第4の静音化構造は、複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、を組み合わせて形成された構造体を、筐体内の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The fourth noise reduction structure of the present invention has a plurality of through holes, a first member having at least a property of reflecting sound incident on a portion other than the through holes, and a predetermined high frequency of the incident sound. A structure formed by combining a second member having at least a property of absorbing a part of the component, and the first member is installed on opposite inner wall surfaces in the housing so as to face each other; The noise generated from the sound source in the housing is silenced.

本発明の第5の静音化構造は、所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、を組み合わせて形成された構造体を、筐体背面の内壁面以外の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、さらに、筐体前面の内壁面部に、前記構造体を複数段に設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The fifth noise reduction structure of the present invention has a predetermined hardness and thickness, a first member having a plurality of through-holes, a gap having a predetermined thickness and continuous from the surface to the inside, or A structure formed by combining the second member containing bubbles is placed on the opposing inner wall surface portion other than the inner wall surface of the rear surface of the housing such that the first member faces each other. The structure is provided in a plurality of stages on the inner wall surface of the front surface of the body, and noise generated from a sound source in the housing is silenced.

本発明の第6の静音化構造は、所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、を組み合わせて形成された第1の構造体と、複数のファンを一体的に構成可能なフレーム構造を有し、さらに前記第1の部材と前記第2の部材を含め形成される第2の構造体と、を所定の空間を隔て、それぞれに形成された第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The sixth noise reduction structure of the present invention has a predetermined hardness and thickness, a first member having a plurality of through holes, a predetermined thickness, and a gap or a continuous gap from the surface to the inside. A first structure formed by combining a second member containing air bubbles, and a frame structure capable of integrally configuring a plurality of fans; and further, the first member and the second member And a second structure formed including the first structure and the first member formed on each other with a predetermined space therebetween, so that noise generated from a sound source in the housing is silenced. It is characterized by.

本発明の第7の静音化構造は、所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、を第2の部材を第1の部材で挟むように形成された構造体を、所定の空間を隔てどちらかの前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The seventh noise reduction structure of the present invention has a predetermined hardness and thickness, a first member having a plurality of through holes, a predetermined thickness, and a gap or a continuous gap from the surface to the inside. A second member containing air bubbles and a structure formed so that the second member is sandwiched between the first members are disposed so that one of the first members faces each other with a predetermined space therebetween The noise generated from the sound source in the housing is silenced.

本発明の第8の静音化構造は、複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、を第2の部材を第1の部材で挟むように形成された構造体を、所定の空間を隔てどちらかの前記第1の部材が互いに相対するように設置され、筐体内の音源から発生する騒音を静音化することを特徴とする。   The eighth noise reduction structure of the present invention has a plurality of through holes, a first member having at least a property of reflecting sound incident on a portion other than the through holes, and a predetermined high frequency of the incident sound. A second member having at least a property of absorbing a part of the component, and a structure formed so as to sandwich the second member between the first member, and the first member is separated from the first member by a predetermined space. The members are installed so as to face each other, and noise generated from a sound source in the housing is silenced.

本発明によれば、筐体内にて生ずる騒音を筐体内で効率的に低減することができる。 According to the present invention, noise generated in the housing can be efficiently reduced in the housing.

次に本発明の電子機器筐体の第1の実施の形態について図1から5までを参照して説明する。
図1は電子機器筐体の外観斜視図、図2は図1の電子機器筐体に機能ごとの電子基板が実装されておりユニット単位で換装可能な機能ユニットの内部構成例、図3は電子機器筐体の内部に設置されるファンの構成例、図4はファンにより電子機器筐体に生じる空気の流れと騒音の関係を説明する図、図5はファンユニットと筐体底面に設置された吸音部材による空気の流れと音の関係の説明図、また図6は相対する位置に設置された吸音材により音が吸収される様子を説明する図である。
Next, a first embodiment of the electronic device casing of the present invention will be described with reference to FIGS.
FIG. 1 is an external perspective view of an electronic device casing, FIG. 2 is an internal configuration example of a functional unit in which an electronic board for each function is mounted on the electronic device casing of FIG. 1, and FIG. FIG. 4 is a diagram for explaining the relationship between the air flow generated in the electronic device casing by the fan and the noise, and FIG. 5 is installed on the fan unit and the bottom of the casing. FIG. 6 is a diagram for explaining a state in which sound is absorbed by a sound absorbing material installed at an opposite position.

まず、図1、及び図2により電子機器筐体1に実装される機器の構成について説明する。   First, the configuration of a device mounted on the electronic device casing 1 will be described with reference to FIGS. 1 and 2.

図1において、電子機器筐体1には記憶デバイスであるオプティカルデバイス3やHDD4が筐体上部に実装されている。電子機器筐体1の上部周囲には吸気口2が設けられている。筐体中央部には、所定の機能ごとに設計された電子回路を有する機能ユニットを実装可能である。電子機器筐体1に求められる機能に応じた機能ユニット5を実装することにより、電子機器筐体1に求められる機能を実現することが可能である。電子機器筐体1の下部には、複数のファン7から構成されるファンユニット6が実装される。   In FIG. 1, an optical device 3 and an HDD 4 that are storage devices are mounted on an upper portion of an electronic device housing 1. An intake port 2 is provided around the upper part of the electronic device casing 1. A functional unit having an electronic circuit designed for each predetermined function can be mounted in the central portion of the housing. By mounting the functional unit 5 corresponding to the function required for the electronic device casing 1, it is possible to realize the function required for the electronic device casing 1. A fan unit 6 including a plurality of fans 7 is mounted on the lower part of the electronic device casing 1.

つぎに図2により機能ユニット5の内部構成例を説明する。機能ユニット5は電子機器筐体1に実装することにより、所定の機能を実現することができる。機能ユニット5の上部にはファン7が実装されており、その配下に各種機能を有する電子回路ボード8がメインボード9に接続されて実装される。   Next, an example of the internal configuration of the functional unit 5 will be described with reference to FIG. The functional unit 5 can be implemented in the electronic device casing 1 to realize a predetermined function. A fan 7 is mounted on the top of the functional unit 5, and an electronic circuit board 8 having various functions is connected to and mounted on the main board 9.

次に、図3によりファンユニット6と電子機器筐体1の下部に取り付けられた吸音部材を含む静音化部材の構成を説明する。   Next, the configuration of the noise reduction member including the sound absorption member attached to the lower part of the fan unit 6 and the electronic device casing 1 will be described with reference to FIG.

まず、ファンユニット6は複数のファン7とフレーム20と22、及び吸音部材21と、から構成される静音化部材である。フレーム20と22は金属製の頑丈な構造になっており、ファン7が一体的に取り付けられる。具体的には、ファン7をフレーム20および22に取り付ける際にはファンとフレームとの間にゴムなどの柔軟性を有する部材を挟み、ネジ等によりファンをケースに一体的に取り付けてもよい。また、取り付けられるファン7の開口部以外の位置には所定の間隔に間通孔が設けられている。吸音部材21はフレーム20と22に取り付けられたファン7相互とファン7とフレーム20、21の間隙を充填するように形成される。   First, the fan unit 6 is a noise reduction member including a plurality of fans 7, frames 20 and 22, and a sound absorbing member 21. The frames 20 and 22 have a sturdy structure made of metal, and the fan 7 is attached integrally. Specifically, when the fan 7 is attached to the frames 20 and 22, a member having flexibility such as rubber may be sandwiched between the fan and the frame, and the fan may be attached to the case integrally with screws or the like. Further, through holes are provided at predetermined intervals at positions other than the opening of the fan 7 to be attached. The sound absorbing member 21 is formed so as to fill the gaps between the fans 7 attached to the frames 20 and 22 and between the fans 7 and the frames 20 and 21.

次に吸音部材25を含む静音化部材は、パンチングメタル23と吸音部材21より構成される。パンチングメタル23は金属等の硬度及び比重の大きい材質で構成され、所定の間隔および大きさの貫通孔があけられている。これには振動を抑える効果があり制振部材と呼ぶことにする。吸音部材21はグラスウール等の繊維質材料や連続する気泡を含む発泡樹脂等の多孔質材料から構成される。なお、筐体1の底面部にはパンチングメタルの筐体カバー23が取り付けられている。   Next, the noise reducing member including the sound absorbing member 25 includes the punching metal 23 and the sound absorbing member 21. The punching metal 23 is made of a material having high hardness and specific gravity, such as metal, and has through holes with predetermined intervals and sizes. This has the effect of suppressing vibrations and will be referred to as a damping member. The sound absorbing member 21 is made of a fibrous material such as glass wool or a porous material such as a foamed resin containing continuous bubbles. A casing cover 23 made of punching metal is attached to the bottom surface of the casing 1.

次に図4および図5を参照してファンにより電子機器筐体1に生ずる空気の流れと騒音の静音化について説明する。   Next, with reference to FIG. 4 and FIG. 5, the air flow generated in the electronic device casing 1 by the fan and the noise reduction will be described.

まず、図4を参照して、電子機器筐体1に設置されたファンの吸気による電子機器筐体1の空気の流れを説明する。電子機器筐体1において、機能ユニット5の内部における上側に取り付けられたファン7や電子機器筐体1の下部に設置されたファンユニット6に取り付けられたファン7により、吸気口2より吸気された空気は、機能ユニットの内部の電子回路等から発生する熱を奪って下方に流れ、さらに電子機器筐体1の底部のファンユニット6のファン7により引き込まれる。ファンユニット6に取り付けられたフレーム20と22の貫通孔を有する部分および吸音部材21はファン7の開口部には設けられておらず、空気の流れはほとんど損なわれない。ファンユニット6により引き込まれた空気は、ファンユニット6と電子機器筐体1の底部に取り付けられたパンチングメタル23と吸音部材25から構成される静音化部材との間に設けられた所定の空間を通って排気口8から排気される。   First, with reference to FIG. 4, the flow of air in the electronic device casing 1 due to the intake of a fan installed in the electronic device casing 1 will be described. In the electronic device casing 1, the air was sucked in from the air inlet 2 by the fan 7 attached to the upper side inside the functional unit 5 or the fan 7 attached to the lower part of the electronic device casing 1. The air takes down heat generated from an electronic circuit or the like inside the functional unit and flows downward, and is further drawn by the fan 7 of the fan unit 6 at the bottom of the electronic device casing 1. The portion having the through holes of the frames 20 and 22 attached to the fan unit 6 and the sound absorbing member 21 are not provided in the opening of the fan 7, and the air flow is hardly impaired. The air drawn in by the fan unit 6 passes through a predetermined space provided between the fan unit 6, a punching metal 23 attached to the bottom of the electronic device casing 1, and a sound absorbing member 25. Exhaust from the exhaust port 8 through.

次に電子機器筐体1の内部に生ずる騒音の静音化について説明する。ファンユニット6に設けられた吸音部材21と貫通孔を有するフレーム20および22から成る静音化部材は、ファン7の近くに形成されており、ファンユニットに構成されたファン7から発生する騒音を間近で吸収する。さらにファン7とフレーム20、22との間に取り付けられたゴムなどの弾性体により振動され、騒音の発生も抑制される。さらに、ファンユニット6との間で所定の空間を隔てて設けられた、パンチングメタル23と吸音部材25から構成される静音化部材との空間に、筐体内を流れる空気が集められる。騒音を含む空気の流れが排気口8に達するまでの経路の、相対する静音化部材の間で騒音が乱反射することにより吸音部材21および25により騒音の一部が吸収される。なお、電子機器筐体1の底面の筐体カバーがパンチングメタル24にて構成された場合は、一部の騒音は電子機器筐体1のパンチングメタルで形成された筐体底面カバー24からからも排出される。これは電子機器筐体1の内部に生ずる騒音を排気口8からだけでなく、筐体底面カバー24の貫通孔からも排気することで、こもり音を低減する。   Next, the silencing of noise generated inside the electronic device casing 1 will be described. The noise reduction member 21 including the sound absorbing member 21 and the frames 20 and 22 having through holes provided in the fan unit 6 is formed in the vicinity of the fan 7, and noise generated from the fan 7 configured in the fan unit is approached. Absorb with. Furthermore, it is vibrated by an elastic body such as rubber attached between the fan 7 and the frames 20 and 22, and the generation of noise is also suppressed. Further, air flowing in the housing is collected in a space between the punching metal 23 and the sound absorbing member 25 that is provided with a predetermined space between the fan unit 6 and the sound absorbing member 25. A part of the noise is absorbed by the sound absorbing members 21 and 25 due to the diffuse reflection of noise between the opposing silencer members in the path until the air flow including the noise reaches the exhaust port 8. In addition, when the housing cover on the bottom surface of the electronic device housing 1 is configured by the punching metal 24, some noise is also generated from the housing bottom surface cover 24 formed of the punching metal of the electronic device housing 1. Discharged. This exhausts noise generated inside the electronic device casing 1 not only from the exhaust port 8 but also from the through-hole of the casing bottom cover 24, thereby reducing the muffled noise.

次に騒音が静音化する具体的な様子を図5を参照して説明する。パンチングメタル等で構成される制振部材23と吸音部材21とで形成される静音化部材30と、所定の空間を隔てて相対する位置に、同様の静音化部材30が設置されている。所定の空間に相対する他方のパンチングメタルの貫通孔以外の部分に入射した音は反射し、一部は相対するパンチングメタルの貫通孔の部分に入射して吸音部材21に入射する。さらに一部は相対するパンチングメタルの貫通孔以外の部分に入射して反射する。以上の動作がランダムに反復されることにより、吸音部材21に入射する音の頻度が増し音の吸収効率が高まる。   Next, a specific state in which noise is reduced will be described with reference to FIG. A similar noise reduction member 30 is installed at a position facing the noise reduction member 30 formed of the vibration damping member 23 and the sound absorption member 21 made of punching metal or the like with a predetermined space therebetween. The sound that has entered the portion other than the through hole of the other punching metal facing the predetermined space is reflected, and a part of the sound enters the portion of the through hole of the opposing punching metal and enters the sound absorbing member 21. Further, a part of the light is incident on and reflected from a portion other than the opposing punching metal through hole. By repeating the above operation at random, the frequency of sound incident on the sound absorbing member 21 is increased and the sound absorption efficiency is increased.

さらに図示されていないが、静音化部材30を形成するパンチングメタル23と吸音部材21において、パンチングメタル23が組み合わされていない他の面にもパンチングメタル23が取り付けられた場合は、新たに取り付けられた面においても吸音材21への音の反射が起こるので、さらに吸音部材21に入射する音の頻度が増し音の吸収効率が高まる。   Further, although not shown in the drawings, in the punching metal 23 and the sound absorbing member 21 forming the noise reduction member 30, when the punching metal 23 is attached to another surface where the punching metal 23 is not combined, it is newly attached. Since the reflection of the sound to the sound absorbing material 21 also occurs on the surface, the frequency of the sound incident on the sound absorbing member 21 is further increased and the sound absorption efficiency is increased.

次に、騒音の周波数成分による吸音部材への音の吸収の相違を説明する。パンチングメタル等で構成される制振部材23に音が入射すると、貫通孔以外の部分に達した音は反射するが、貫通孔から、グラスウール等の繊維質材料や連続した気泡を有する発泡樹脂等の多孔質材料から構成される部材21へ入射した音は、多孔質材料の繊維や気泡の面での空気の粘性摩擦を生じ、音のエネルギーの一部が熱エネルギーに変換されることで音が減衰する。この音の減衰効果は一般的に高周波数の音に対して顕著である。これらの減衰動作が複合的に繰り返されることで全体の騒音レベルが低下する。高周波数成分の音は、低周波数成分の音より空気を伝播しやすいので、低減させた場合の静音化効果が高い。   Next, the difference in sound absorption to the sound absorbing member due to noise frequency components will be described. When sound is incident on the damping member 23 made of punching metal or the like, the sound reaching the portion other than the through hole is reflected, but from the through hole, a fibrous material such as glass wool or a foamed resin having continuous air bubbles, etc. The sound incident on the member 21 made of the porous material causes viscous friction of the air on the surface of the porous material fibers and bubbles, and a part of the sound energy is converted into thermal energy. Is attenuated. This sound attenuation effect is generally remarkable for high-frequency sounds. These attenuation operations are combined and repeated to reduce the overall noise level. Since the high frequency component sound is more likely to propagate air than the low frequency component sound, the noise reduction effect is high when reduced.

次に本発明の第2の実施の形態の静音化構造について説明する。   Next, the noise reduction structure of the second embodiment of the present invention will be described.

図6を参照すると、電子機器筐体1の全ての内壁面部にはパンチングメタル等の制振部材と、多孔質材料からなる吸音部材とが組み合わされた静音化部材が、それぞれ相対する筐体の内壁面部に取り付けられる。制振部材と吸音部材とからなる静音化部材は、筐体内のすべての相対する内壁面部に取り付けられる。制振部材42と吸音部材41とからなる静音化部材と、制振部材43と吸音部材44とからなる静音化部材と、が筐体前面の相対する壁面部にそれぞれ取り付けられる。制振部材47と吸音部材48からなる静音化部材と、制振部材49と吸音部材50とからなる静音化部材と、が筐体側面の相対する壁面部にそれぞれ取り付けられる。制振部材23と吸音部材25とからなる静音化部材と、制振部材54と吸音部材53とからなる静音化部材と、が筐体上下面の相対する壁面部にそれぞれ取り付けられる。ここで、静音化部材は、筐体内壁の隣り合う境界において、できるだけ隙間を生じさせないように取り付けられることが望ましい。   Referring to FIG. 6, all inner wall surfaces of the electronic device casing 1 are provided with a noise reduction member in which a vibration damping member such as punching metal and a sound absorbing member made of a porous material are combined. It is attached to the inner wall surface. Silencing members made up of a damping member and a sound absorbing member are attached to all opposing inner wall surfaces in the housing. A silencing member comprising the damping member 42 and the sound absorbing member 41 and a silencing member comprising the damping member 43 and the sound absorbing member 44 are respectively attached to the opposing wall surfaces of the housing. A noise reducing member consisting of the vibration damping member 47 and the sound absorbing member 48 and a noise reducing member consisting of the vibration suppressing member 49 and the sound absorbing member 50 are respectively attached to the opposite wall surfaces of the casing. A silencing member comprising the damping member 23 and the sound absorbing member 25 and a silencing member comprising the damping member 54 and the sound absorbing member 53 are respectively attached to the opposing wall surfaces of the casing. Here, it is desirable that the noise reduction member is attached so as not to cause a gap as much as possible at the adjacent boundary of the inner wall of the housing.

動作としては、相対する壁面部に取り付けられた静音化部材の間で、騒音が乱反射しながら吸音部材にて吸収されると共に、他の壁面部に取り付けられた静音化部材の間でも同様に騒音が乱反射しながら吸収される。尚、具体的な騒音が吸収される動作については図5と同様なので説明を省略する。   In terms of operation, noise is absorbed by the sound absorbing member while being diffusely reflected between the noise reducing members attached to the opposite wall surface portions, and the noise is similarly obtained between the noise reducing members attached to other wall surface portions. Is absorbed while being irregularly reflected. The specific noise absorbing operation is the same as that shown in FIG.

次に本発明の第3の実施の形態の静音化構造について説明する。上述した第2の実施形態では、筐体の全ての相対する内壁面部に、静音化部材を取り付ける場合について説明したが、本第3の実施形態では、装置筐体の一部の内壁面部には、静音化部材を取り付けない場合について説明する。筐体の背面側においては、制振部材25と吸音部材26からなる静音化部材は、設置されない。その理由は、電子機器筐体1におけるネットワークインターフェース等のケーブル類の接続または取り外しの作業を容易にするためである。このため、筐体1の背面には本発明の静音化部材は取り付けず、相対する内壁面部である前面壁部に、本発明の静音化部材を二重に取り付ける構成としている。   Next, a noise reduction structure according to a third embodiment of the present invention will be described. In the second embodiment described above, the case where the noise reduction member is attached to all opposing inner wall surfaces of the housing has been described. However, in the third embodiment, a part of the inner wall surface of the device housing has The case where the noise reduction member is not attached will be described. On the rear side of the housing, the noise reduction member composed of the vibration damping member 25 and the sound absorbing member 26 is not installed. The reason is to facilitate the operation of connecting or disconnecting cables such as a network interface in the electronic device casing 1. For this reason, the noise reduction member of the present invention is not attached to the back surface of the housing 1, and the noise reduction member of the present invention is double-attached to the front wall portion which is the opposite inner wall surface portion.

実施例3では装置の筐体背面にては本発明の静音化部材が設置されない為、それを補うために相対する位置関係を有する装置の筐体前面にて本発明の静音化部材を重複して設置されることにより音は重複して設置された静音化部材間で減衰される。
本発明の静音化部材が設置されていない装置の筐体背面の壁面部から音を排出することにより、装置前面方向に位置するユーザにとっては前面に音が漏れるより、後方に音を排出した方が好適である。
In Example 3, since the noise reduction member of the present invention is not installed on the rear surface of the casing of the device, the noise reduction member of the present invention is overlapped on the front surface of the device casing having a relative positional relationship to compensate for it. The sound is attenuated between the silencer members that are installed in duplicate.
By discharging sound from the wall on the rear surface of the housing of the device in which the noise reduction member of the present invention is not installed, the sound is discharged to the rear rather than the sound leaking to the front for the user located in the front of the device Is preferred.

尚、本実施例では筐体の上方から吸気して下方へ排気する例を説明したが、筐体の下方から吸気して上方へ排気することも可能である。また、左右方向にて同様に吸気または排気の関係をあてはめることも可能である。   In this embodiment, the example in which the air is sucked in from the upper side of the casing and is exhausted downward has been described. However, the air can be sucked in from the lower side of the casing and exhausted upward. Similarly, the relationship between intake and exhaust can be applied in the left-right direction.

第1の実施の形態の筐体の外部からの空気の流れを示す図である。It is a figure which shows the flow of the air from the exterior of the housing | casing of 1st Embodiment. 第1の実施の形態の筐体に実装する機能ユニットの内部構成を説明するための図である。It is a figure for demonstrating the internal structure of the functional unit mounted in the housing | casing of 1st Embodiment. 第1の実施の形態の筐体内部のファンユニットと静音化部材の構成を示す図である。It is a figure which shows the structure of the fan unit and the noise reduction member inside the housing | casing of 1st Embodiment. 第1の実施の形態の筐体内部の空気の流れと騒音の流れを説明する図である。It is a figure explaining the flow of the air inside the housing | casing of 1st Embodiment, and the flow of noise. 第1、第2、第3の実施の形態における相対する静音化部材間での騒音の減衰または吸収の様子を説明するための図である。It is a figure for demonstrating the mode of attenuation | damping or absorption of the noise between the opposing silencing members in 1st, 2nd, 3rd embodiment. 第2、第3の実施の形態の筐体内部の構成を説明するための図である。It is a figure for demonstrating the structure inside the housing | casing of 2nd, 3rd Embodiment. 従来の強制空冷用筐体の外観斜視図および全体断面図である。It is the external appearance perspective view and whole sectional view of the conventional case for forced air cooling. 従来の強制空冷用筐体の排気ダクト部の詳細断面図である。It is detailed sectional drawing of the exhaust duct part of the conventional housing | casing for forced air cooling.

符号の説明Explanation of symbols

1、60 電子機器筐体
2、74 吸気口
3、4 記録装置
5 電子回路を有する機能ユニット
6 ファンユニット
7、73 ファン
8、61 排気口
10 電子回路基板
11 マザーボード
40、46、51、52、45 筐体カバー
21、25、41、44、48、50、53、55、82、83 吸音部材
23、24、42、43、47、49、54 パンチングメタル
30 静音化部材
31 騒音
33 貫通孔
70 排気ダクト
71 ユニット
72 架枠
80 空洞共鳴室
81 排気路
DESCRIPTION OF SYMBOLS 1,60 Electronic device housing | casing 2,74 Intake port 3, 4 Recording device 5 Functional unit 6 which has an electronic circuit Fan unit 7, 73 Fan 8, 61 Exhaust port 10 Electronic circuit board 11 Motherboard 40, 46, 51, 52, 45 Housing cover 21, 25, 41, 44, 48, 50, 53, 55, 82, 83 Sound absorbing member 23, 24, 42, 43, 47, 49, 54 Punching metal 30 Silent member 31 Noise 33 Through hole 70 Exhaust duct 71 Unit 72 Frame 80 Cavity resonance chamber 81 Exhaust passage

Claims (13)

所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、
所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、
を組み合わせて形成された構造体を、
所定の空間を隔て前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a predetermined hardness and thickness and having a plurality of through holes;
A second member having a predetermined thickness and including gaps or bubbles continuous from the surface to the inside;
A structure formed by combining
The first members are installed so as to face each other with a predetermined space therebetween,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、
入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、
を組み合わせて形成された構造体を、
所定の空間を隔て前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a plurality of through holes and having at least a property of reflecting sound incident on a portion other than the through holes;
A second member having at least a characteristic of absorbing a part of a predetermined high-frequency component of the incident sound;
A structure formed by combining
The first members are installed so as to face each other with a predetermined space therebetween,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、
所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、
を組み合わせて形成された構造体を、
筐体内の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a predetermined hardness and thickness and having a plurality of through holes;
A second member having a predetermined thickness and including gaps or bubbles continuous from the surface to the inside;
A structure formed by combining
The first members are installed on opposite inner wall surfaces in the housing so as to face each other,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、
入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、
を組み合わせて形成された構造体を、
筐体内の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a plurality of through holes and having at least a property of reflecting sound incident on a portion other than the through holes;
A second member having at least a characteristic of absorbing a part of a predetermined high-frequency component of the incident sound;
A structure formed by combining
The first members are installed on opposite inner wall surfaces in the housing so as to face each other,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
前記構造体を筐体内の相対するすべての内壁面部に設置されることを特徴とする、請求項3に記載の静音化構造。 The silence structure according to claim 3, wherein the structure is installed on all inner wall surfaces facing each other in the housing. 前記構造体を筐体内の相対するすべての内壁面部に設置されることを特徴とする、請求項4に記載の静音化構造。 The noise-reducing structure according to claim 4, wherein the structure is installed on all inner wall surfaces facing each other in the housing. 前記構造体を筐体内の一部の面を除いて相対するすべての内壁面部に設置され、前記一部の面と相対する内壁面部には、前記構造体を重複して設置されることを特徴とする、請求項3に記載の静音化構造。 The structure is installed on all inner wall surfaces facing each other except for a part of the surface in the housing, and the structure is overlapped on the inner wall facing the part of the surface. The silencing structure according to claim 3. 前記構造体を筐体内の一部の面を除いて互いに相対するすべての内壁面部に設置され、前記一部の面と相対する内壁面部には、前記構造体を重複して設置されることを特徴とする、請求項4に記載の静音化構造。 The structure is installed on all inner wall surfaces facing each other except for a part of the surface in the housing, and the structure is overlapped on the inner wall surface facing the part of the surface. The silencing structure according to claim 4, characterized in that it is characterized. 所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、
所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、
を組み合わせて形成された構造体を、
筐体背面の内壁面以外の相対する内壁面部に、前記第1の部材が互いに相対するように設置され、さらに、筐体前面の内壁面部に、前記構造体を複数段に設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a predetermined hardness and thickness and having a plurality of through holes;
A second member having a predetermined thickness and including gaps or bubbles continuous from the surface to the inside;
A structure formed by combining
The first members are installed on opposing inner wall surfaces other than the inner wall surface of the rear surface of the housing so as to face each other, and further, the structure is installed in a plurality of stages on the inner wall surface of the front surface of the housing,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、
所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、
を組み合わせて形成された第1の構造体と、
複数のファンを一体的に構成可能なフレーム構造を有し、
さらに前記第1の部材と前記第2の部材を含め形成される第2の構造体と、
を所定の空間を隔て、それぞれに形成された第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a predetermined hardness and thickness and having a plurality of through holes;
A second member having a predetermined thickness and including gaps or bubbles continuous from the surface to the inside;
A first structure formed by combining
It has a frame structure that can be configured integrally with multiple fans,
A second structure formed including the first member and the second member;
The first member formed on each of the first member and the second member is opposed to each other with a predetermined space therebetween.
Silencing structure characterized by silencing noise generated from a sound source in a housing.
前記第1の構造体と前記第2の構造体とを、前記筐体の排気口の近くに設置することを特徴とする請求項10に記載の静音化構造。 The silence structure according to claim 10, wherein the first structure and the second structure are installed near an exhaust port of the housing. 所定の硬度及び厚さを有し、複数の貫通孔を備えた第1の部材と、
所定の厚さを有し、表面から内部へ連続する隙間または気泡を含む第2の部材と、
を第2の部材を第1の部材で挟むように形成された構造体を、
所定の空間を隔てどちらかの前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a predetermined hardness and thickness and having a plurality of through holes;
A second member having a predetermined thickness and including gaps or bubbles continuous from the surface to the inside;
A structure formed so that the second member is sandwiched between the first members,
One of the first members is placed opposite to each other with a predetermined space therebetween,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
複数の貫通孔を有し、前記貫通孔以外の部分に入射した音を反射する特性を少なくとも有する第1の部材と、
入射した音の所定の高周波数成分の一部を吸収する特性を少なくとも有する第2の部材と、
を第2の部材を第1の部材で挟むように形成された構造体を、
所定の空間を隔てどちらかの前記第1の部材が互いに相対するように設置され、
筐体内の音源から発生する騒音を静音化することを特徴とする静音化構造。
A first member having a plurality of through holes and having at least a property of reflecting sound incident on a portion other than the through holes;
A second member having at least a characteristic of absorbing a part of a predetermined high-frequency component of the incident sound;
A structure formed so that the second member is sandwiched between the first members,
One of the first members is placed opposite to each other with a predetermined space therebetween,
Silencing structure characterized by silencing noise generated from a sound source in a housing.
JP2007167071A 2007-06-26 2007-06-26 Housing silencer structure Active JP4852483B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145998A (en) * 1984-12-19 1986-07-03 Pioneer Electronic Corp Remote control transmitter
JPS62131599A (en) * 1985-12-03 1987-06-13 富士通株式会社 Heat radiation and soundproof structure of electronic apparatus
JP2001068882A (en) * 1999-08-27 2001-03-16 Nec Viewtechnology Ltd Projector device
JP2006228924A (en) * 2005-02-17 2006-08-31 Nlm Ecal Co Ltd Electronic apparatus storing box

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61145998A (en) * 1984-12-19 1986-07-03 Pioneer Electronic Corp Remote control transmitter
JPS62131599A (en) * 1985-12-03 1987-06-13 富士通株式会社 Heat radiation and soundproof structure of electronic apparatus
JP2001068882A (en) * 1999-08-27 2001-03-16 Nec Viewtechnology Ltd Projector device
JP2006228924A (en) * 2005-02-17 2006-08-31 Nlm Ecal Co Ltd Electronic apparatus storing box

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